JP4595899B2 - Single-sided metal foil-clad laminate - Google Patents
Single-sided metal foil-clad laminate Download PDFInfo
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Description
本発明は、多層プリント配線板の材料等となる片面金属箔張り積層板に関する。 The present invention relates to a single-sided metal foil-clad laminate made of a material such as a multilayer printed wiring board.
従来より、片面金属箔張り積層板(以下、片面板とも称する)およびそれを用いた多層プリント配線板はたとえば次のようにして製造されている。まず、プリント配線板の製造に用いられるプリプレグが、エポキシ樹脂を主成分とする樹脂組成物を樹脂ワニスとして調製し、この樹脂ワニスをガラス織布よりなる基材に含浸させた後、乾燥させて半硬化状態(Bステージ)とすることにより製造される。次に、このプリプレグの一方の面に金属箔を重ねるとともに、他方の面に離型フィルムを重ねて積層体とし、この積層体を金型プレート(鏡面板)間に挟んで加熱加圧成型することにより片面板を得る。 Conventionally, single-sided metal foil-clad laminates (hereinafter also referred to as single-sided plates) and multilayer printed wiring boards using the same have been manufactured, for example, as follows. First, a prepreg used in the production of a printed wiring board is prepared by preparing a resin composition mainly composed of an epoxy resin as a resin varnish, impregnating the resin varnish into a substrate made of a glass woven fabric, and then drying it. Manufactured in a semi-cured state (B stage). Next, a metal foil is overlaid on one surface of the prepreg, and a release film is overlaid on the other surface to form a laminate, and this laminate is sandwiched between mold plates (mirror plates) and subjected to heat and pressure molding. Thus, a single-sided plate is obtained.
多層プリント配線板を製造する場合、上記のようにして得た片面板の離型フィルムを剥がした剥離面を、両面に回路を配した両面プリント配線板に、あるいは、両面プリント配線板をプリプレグにより複数層重ねたものに、プリプレグを介して重ねて加熱加圧成型することにより表層が片面板よりなる多層プリント配線板を得ることができる。 When manufacturing a multilayer printed wiring board, the peeled surface from which the release film of the single-sided board obtained as described above is peeled off is applied to a double-sided printed wiring board in which circuits are arranged on both sides, or the double-sided printed wiring board is formed by prepreg. A multilayer printed wiring board whose surface layer is a single-sided board can be obtained by stacking a plurality of layers on top of each other via a prepreg and performing heat-pressure molding.
この片面板の離型フィルムとしては従来、ポリフッ化ビニル樹脂等のフッ素系の材料に少量の無機フィラーが混練されたフィルムが主に使用されている。フッ素系の材料はエポキシ樹脂との剥離性が良く、また無機フィラーにより片面板の樹脂面に適当な凹凸ができることにより、2次成型時のプリプレグとの密着性を高めることができる。 Conventionally, a film obtained by kneading a small amount of an inorganic filler in a fluorine-based material such as a polyvinyl fluoride resin has been mainly used as the release film for the single-sided plate. The fluorine-based material has good releasability from the epoxy resin, and the inorganic filler can provide appropriate unevenness on the resin surface of the single-sided plate, thereby improving the adhesion to the prepreg during secondary molding.
しかしながら、近年、フッ素系離型フィルムは比較的コストが高く、またその用途拡大等の問題により入手が困難となってきている。 However, in recent years, fluorine-based release films are relatively expensive and have become difficult to obtain due to problems such as expanded applications.
一方、安価な離型フィルムとして、ポリプロピレン離型フィルムが一部で使用されている(たとえば特許文献1)が、融点が約170℃前後と低く、またエポキシ樹脂との剥離性と、片面板の樹脂面(フィルム剥離面)とプリプレグとの2次成型時の密着性をバランス良く確保するのが難しいとされていた。
本発明は、以上の通りの事情に鑑みてなされたものであり、安価で入手しやすい材料よりなるポリプロピレン離型フィルムを用い、そのポリプロピレン離型フィルムの剥離性と、2次成型時のプリプレグとの密着性をバランスよく確保することができる片面金属箔張り積層板を提供することを課題としている。 The present invention has been made in view of the circumstances as described above, and uses a polypropylene release film made of an inexpensive and easily obtainable material. The peelability of the polypropylene release film, the prepreg at the time of secondary molding, It has an object to provide a single-sided metal-foil-clad laminate can be ensured good balance of adhesion.
本発明の片面金属箔張り積層板は、上記の課題を解決するために、以下のことを特徴としている。 In order to solve the above problems, the single-sided metal foil-clad laminate of the present invention is characterized by the following.
第1に、ガラス織布にエポキシ樹脂ワニスを含浸し、乾燥して得られたプリプレグの一方の面に金属箔を重ねるとともに、他方の面に離型フィルムを重ねた積層体を、加熱加圧成型して得られた片面金属箔張り積層板において、離型フィルムが、表面粗度5μm以上10μm以下、厚さ25μm以上50μm以下のポリプロピレン離型フィルムであり、且つ、積層板のガラス転移温度Tgが、完全硬化状態における積層板のガラス転移温度Tgより5℃〜25℃低く設定されており、前記片面金属箔張り積層板は、加熱加圧成型後の冷却時に、5kg/cm 2 以上10kg/cm 2 以下の成型圧力で成型がなされているものであることを特徴とする。 First, a glass woven fabric is impregnated with an epoxy resin varnish and dried, and a metal foil is stacked on one side of a prepreg obtained by drying, and a laminate in which a release film is stacked on the other side is heated and pressurized. In the single-sided metal foil-clad laminate obtained by molding, the release film is a polypropylene release film having a surface roughness of 5 μm to 10 μm and a thickness of 25 μm to 50 μm , and the glass transition temperature Tg of the laminate However, the single-sided metal foil-clad laminate is not less than 5 kg / cm 2 and not more than 10 kg / at the time of cooling after heat-pressure molding. characterized in der Rukoto those molded in cm 2 or less molding pressure it has been made.
第2に、上記第1の発明において、加熱加圧成型時に、ポリプロピレン離型フィルムの融点より20℃低い温度から融点までの範囲の製品最高温度で成型がなされているものであることを特徴とする。 Second , in the first invention, the molding is performed at the highest product temperature in the range from a temperature 20 ° C. lower than the melting point of the polypropylene release film to the melting point in the heat and pressure molding. To do.
上記第1の発明によれば、離型フィルムとしてポリプロピレン離型フィルムを用い、且つ、積層板のガラス転移温度Tgを、完全硬化状態における積層板のガラス転移温度Tgより5℃〜25℃低く設定したため、ポリプロピレン離型フィルムはフッ素系樹脂を用いた離型フィルムより比較的安価で入手しやすいという利点を維持しつつ、離型フィルムの剥離性と、2次成型時のプリプレグとの密着性をバランス良く確保することが可能となる。ポリプロピレン離型フィルムの表面粗度を5μm以上10μm以下としたため、離型フィルムの剥離性と、2次成型時のプリプレグとの密着性をより一層良好とすることができる。また、ポリプロピレン離型フィルムの厚さを25μm以上50μm以下としたため、製品加工時のフィルム粕の発生を抑えることができる。さらにまた、加熱加圧成型後の冷却時に、5kg/cm 2 以上10kg/cm 2 以下の成型圧力で成型がなされているものとしたため、エポキシ樹脂とポリプロピレン離型フィルムの残存応力を小さくして、ポリプロピレン離型フィルムの熱収縮によるフィルム剥離性の向上効果をより高めることができる。 According to the first invention, a polypropylene release film is used as the release film, and the glass transition temperature Tg of the laminate is set to be 5 ° C. to 25 ° C. lower than the glass transition temperature Tg of the laminate in the fully cured state. Therefore, while maintaining the advantage that a polypropylene release film is relatively inexpensive and easy to obtain than a release film using a fluororesin, the release property of the release film and the adhesion to the prepreg during secondary molding are improved. It becomes possible to ensure a good balance. Since the surface roughness of the polypropylene release film is 5 μm or more and 10 μm or less, the peelability of the release film and the adhesion between the prepreg during secondary molding can be further improved. Moreover, since the thickness of the polypropylene release film is 25 μm or more and 50 μm or less, the generation of film wrinkles during product processing can be suppressed. Furthermore, at the time of cooling after heat and pressure molding, since the molding is performed at a molding pressure of 5 kg / cm 2 or more and 10 kg / cm 2 or less, the residual stress of the epoxy resin and the polypropylene release film is reduced, The effect of improving the film peelability due to the heat shrinkage of the polypropylene release film can be further enhanced.
上記第2の発明によれば、加熱加圧成型時に、ポリプロピレン離型フィルムの融点より20℃低い温度から融点までの範囲の製品最高温度で成型がなされているものとしたため、上記効果に加え、ポリプロピレン離型フィルムが融着して剥離が困難となることを防ぐことができ、また製造の際の成型時間を短縮して効率を向上させることができる。 According to the second invention, at the time of heat and pressure molding, since the molding is performed at the highest product temperature in the range from the temperature 20 ° C. lower than the melting point of the polypropylene release film to the melting point, in addition to the above effects, The polypropylene release film can be prevented from fusing and becoming difficult to peel off, and the molding time during production can be shortened to improve efficiency.
本発明の実施の形態について説明する。 Embodiments of the present invention will be described.
本発明の片面金属箔張り積層板は、ガラス織布にエポキシ樹脂ワニスを含浸し、乾燥して得られたプリプレグの一方の面に金属箔を重ねるとともに、他方の面に離型フィルムを重ねた積層体を、加熱加圧成型して得られるものである。そして、離型フィルムとして、安価で入手が容易なポリプロピレン離型フィルムを使用する。本発明の片面金属箔張り積層板は、ガラス転移温度Tgを、完全硬化状態における積層板のガラス転移温度Tgより5℃〜25℃低く設定されているものとする(5℃低い場合および25℃低い場合を含む)。ここで、ガラス転移温度Tgは、JIS C6481 5. 17.1 TMA法により測定した値とする。ガラス転移温度Tgの調整は、加熱温度、成型圧力、加熱加圧時間等の加熱加圧条件を調整することにより行うことができる。プリプレグは十分に加熱加圧成型してガラス転移温度Tgがピークに達した完全硬化状態となると、2次成型時のプリプレグとの密着性の低下が生じる。また、加熱加圧条件が不十分でガラス転移温度Tgより25℃を超えて低くなると離型フィルムと樹脂との密着性が強くなりすぎ剥離性が悪くなる。したがって、本発明の片面金属箔張り積層板のガラス転移温度Tgを上記範囲に設定することにより、離型フィルムの剥離性と、2次成型時のプリプレグとの密着性をバランス良く確保することが可能となる。 The single-sided metal foil-clad laminate of the present invention was obtained by impregnating a glass woven fabric with an epoxy resin varnish and overlaying a metal foil on one side of a prepreg obtained by drying and a mold release film on the other side. The laminate is obtained by heating and pressing. As the release film, a polypropylene release film that is inexpensive and easily available is used. In the single-sided metal foil-clad laminate of the present invention, the glass transition temperature Tg is set to be 5 ° C to 25 ° C lower than the glass transition temperature Tg of the laminate in the fully cured state (when 5 ° C is lower and 25 ° C). Including low cases). Here, the glass transition temperature Tg is JIS C6481 5. 17.1 Value measured by TMA method. The glass transition temperature Tg can be adjusted by adjusting heating and pressing conditions such as heating temperature, molding pressure, and heating and pressing time. When the prepreg is sufficiently heated and pressed to be in a fully cured state where the glass transition temperature Tg has reached its peak, the adhesion with the prepreg during secondary molding is reduced. On the other hand, if the heating and pressing conditions are insufficient and the glass transition temperature Tg is lower than 25 ° C., the adhesiveness between the release film and the resin becomes too strong, and the peelability is deteriorated. Therefore, by setting the glass transition temperature Tg of the single-sided metal foil-clad laminate of the present invention within the above range, it is possible to ensure a good balance between the peelability of the release film and the adhesion between the prepreg during secondary molding. It becomes possible.
上記プリプレグは、次のようにして得ることができる。基材として、ガラス織布を用いる。また、エポキシ樹脂をマトリックス樹脂とし、必要に応じて硬化剤、硬化促進剤等を配合したものを溶剤に溶解させて樹脂ワニスとする。そしてたとえば、ガラス織布をロール状に巻回させて連続的に供給できるようにし、エポキシ樹脂の樹脂ワニスをディップ槽に入れておく。ガラス織布を順次送り出し、ディップ槽を通すことでガラス織布に樹脂ワニスを含浸させ、更に乾燥機内を通すことで溶剤を除去するとともに、エポキシ樹脂を半硬化状態すなわちBステージ化することでプリプレグを得る。 The prepreg can be obtained as follows. A glass woven fabric is used as the substrate. In addition, an epoxy resin is used as a matrix resin, and a resin varnish is prepared by dissolving a curing agent, a curing accelerator, or the like, if necessary, in a solvent. For example, a glass woven fabric is wound in a roll shape so that it can be continuously supplied, and an epoxy resin varnish is placed in a dip tank. The glass woven fabric is sent out sequentially, the glass woven fabric is impregnated with the resin varnish by passing through the dip tank, and the solvent is removed by passing through the dryer, and the prepreg is made semi-cured, that is, B-staged. Get.
このプリプレグの一方の面に重ねる金属箔としては、その材料は特に限定されないが、たとえば銅箔、アルミ箔等を用いることができる。その寸法、厚さも用途に応じて適宜設定することができる。 The material of the metal foil stacked on one surface of the prepreg is not particularly limited, and for example, copper foil, aluminum foil, or the like can be used. The dimensions and thickness can also be set as appropriate according to the application.
また、プリプレグの他方の面に重ねるポリプロピレン離型フィルムは、通常、融点が170℃程度である。このポリプロピレン離型フィルムは、表面粗度が5μm以上10μm以下であることが好ましい。ここで表面粗度は輪郭曲線の算術平均高さRa(JIS B0601 4. 2.1)による値である。表面粗度が上記範囲であると、離型フィルム剥離性と、2次成型時の密着性をより良好に確保することができる。表面粗度が小さくなりすぎると、剥離性は良くなるが2次成型時のプリプレグとの密着性の低下し、大きくなりすぎると離型フィルムとの密着性が強くなりすぎ剥離性が悪くなる傾向がある。ポリエチレン離型フィルムの表面粗度は、無機フィラーを混練する方法や、サンドマッド等の加工処理方法を用いて調整することができるが、特に限定されない。 Moreover, the polypropylene release film to be overlaid on the other surface of the prepreg usually has a melting point of about 170 ° C. The polypropylene release film preferably has a surface roughness of 5 μm or more and 10 μm or less. Here, the surface roughness is a value according to the arithmetic average height Ra (JIS B0601 4.2.1) of the contour curve. When the surface roughness is within the above range, the release film peelability and the adhesiveness during secondary molding can be ensured better. If the surface roughness is too small, the releasability is improved, but the adhesion to the prepreg at the time of secondary molding is lowered, and if it is too large, the adhesion to the release film becomes too strong and the peelability tends to be poor. There is. The surface roughness of the polyethylene release film can be adjusted using a method of kneading an inorganic filler or a processing method such as sand mud, but is not particularly limited.
また、ポリプロピレン離型フィルムの厚さは、25μm以上50μm以下であることが好ましい。片面金属箔張り積層板は、離型フィルムを介して両側にそれぞれプリプレグと金属箔を重ねて2枚の片面板を1セットとして製造することが主流であり、この張り合わせた状態で任意のサイズに加工され、流通されることが一般的である。その理由は、離型フィルムを剥離してしまうと金属箔とエポキシ樹脂層の成型時の残存応力により、積層板に反りが生じて扱い難いためである。また、ポリプロピレンの融点は約170℃であり、積層板加工時の熱で離型フィルムが融解して端部に粕となって残ってしまうことがある。これを防ぐためには、離型フィルムはできる限り薄いほうが好ましい。また、離型フィルムの製造性と取り扱い性の上では、あまり薄いと困難が生じることがある。したがって、ポリプロピレン離型フィルムの厚さは上記範囲であることが好ましい。 The thickness of the polypropylene release film is preferably 25 μm or more and 50 μm or less. Single-sided metal foil-clad laminates are mainly produced by stacking prepreg and metal foil on both sides via a release film to produce two single-sided plates as a set, and in this state they are bonded to any size. It is common to be processed and distributed. The reason is that if the release film is peeled off, the laminate is warped due to residual stress at the time of molding the metal foil and the epoxy resin layer, and is difficult to handle. In addition, the melting point of polypropylene is about 170 ° C., and the release film may be melted by heat at the time of processing the laminated plate and may remain as wrinkles at the ends. In order to prevent this, the release film is preferably as thin as possible. On the other hand, if the release film is too thin, it may be difficult to manufacture and handle the release film. Therefore, the thickness of the polypropylene release film is preferably in the above range.
また、本発明の片面金属箔張り積層板は、加熱加圧成型時に、ポリプロピレン離型フィルムの融点より20℃低い温度から融点までの範囲の製品最高温度で成型がなされているものであることが好ましい。成型温度がポリプロピレン離型フィルムの融点を完全に超えてしまうと、ポリプロピレン離型フィルムが融解して剥離が困難になり、また、融点より20℃を超えて下回ると、樹脂の硬化を進める上で成型時間が非常に長くなり効率が悪くなることがある。 In addition, the single-sided metal foil-clad laminate of the present invention is molded at the highest product temperature in the range from a temperature 20 ° C. lower than the melting point of the polypropylene release film to the melting point during heat and pressure molding. preferable. When the molding temperature completely exceeds the melting point of the polypropylene release film, the polypropylene release film melts and becomes difficult to peel off. When the molding temperature exceeds 20 ° C. below the melting point, the curing of the resin proceeds. Molding time can be very long and efficiency can be compromised.
また、本発明の片面金属箔張り積層板は、加熱加圧成型後の冷却時に、5kg/cm2以上10kg/cm2以下の成型圧力で成型がなされているものとすることが好ましい。このようにすると、エポキシ樹脂とポリプロピレン離型フィルムの残存応力を小さくして、ポリプロピレン離型フィルムの熱収縮によるフィルム剥離性の向上効果をより高めることができる。 Moreover, it is preferable that the single-sided metal foil-clad laminate of the present invention is molded at a molding pressure of 5 kg / cm 2 or more and 10 kg / cm 2 or less during cooling after heat and pressure molding. If it does in this way, the residual stress of an epoxy resin and a polypropylene release film can be made small, and the improvement effect of the film peelability by the heat shrink of a polypropylene release film can be heightened more.
さらに、本発明によれば、上記の構成の片面金属箔張り積層板を用いて、2次成型時のプリプレグとの密着性の高いプリント配線板を得ることができる。 Furthermore, according to this invention, a printed wiring board with high adhesiveness with the prepreg at the time of secondary shaping | molding can be obtained using the single-sided metal foil clad laminated board of said structure.
次に、本発明の実施例、参考例および比較例を示す。なお、実施例、参考例および比較例の「%」は特にことわらない限り重量基準である。
(参考例1)
樹脂ワニスとしてエポキシ樹脂をマトリックス樹脂とし、下記の樹脂組成物を調製した。
Next, Examples , Reference Examples and Comparative Examples of the present invention will be shown. In the examples , reference examples and comparative examples, “%” is based on weight unless otherwise specified.
( Reference Example 1)
As a resin varnish, an epoxy resin was used as a matrix resin, and the following resin composition was prepared.
エポキシ樹脂
東都化成(株)製:YDB−500EK80 72.5%
東都化成(株)製:YDCN−220EK75 6.27%
硬化剤
ジシアンジアミド 1.41%
溶剤
ジメチルホルムアミド 9.88%
プロピレングリコールモノメチルエーテル 9.91%
硬化促進剤
イミダゾール 0.03%
基材として、厚み約100μmのガラス織布(日東紡績(株)製:WEA116)を用い、上記で調製した樹脂組成物を樹脂ワニスとしてディップ槽に入れ、ロール状基材としたガラス織布を樹脂ワニスのディップ槽を通して樹脂ワニスを含浸させた後、乾燥機を通して溶剤を除去して、半硬化状態(Bステージ)のプリプレグを得た(樹脂量45%)。
Epoxy resin
Toto Kasei Co., Ltd .: YDB-500EK80 72.5%
Toto Kasei Co., Ltd. product: YDCN-220EK75 6.27%
Hardener
Dicyandiamide 1.41%
solvent
Dimethylformamide 9.88%
Propylene glycol monomethyl ether 9.91%
Curing accelerator
Imidazole 0.03%
As a base material, a glass woven cloth having a thickness of about 100 μm (manufactured by Nitto Boseki Co., Ltd .: WEA116) is used. After impregnating the resin varnish through a resin varnish dip tank, the solvent was removed through a dryer to obtain a semi-cured (B stage) prepreg (resin amount 45%).
次に、このプリプレグの一方の面に、厚さ18μmの銅箔(古川サーキットフォイル(株)製:GT−18μ)を重ねるとともに、他方の面に、厚さ40μm、表面粗度7μm、融点170℃(DSC法による値)のポリプロピレン離型フィルム(ソマール(株)製:ソマブラスト)を重ねて積層体とした。 Next, a copper foil having a thickness of 18 μm (Furukawa Circuit Foil Co., Ltd .: GT-18 μ) is overlaid on one surface of the prepreg, and the other surface has a thickness of 40 μm, a surface roughness of 7 μm, and a melting point of 170. A polypropylene release film (manufactured by Somar Co., Ltd .: Soma Blast) at a temperature of 0 ° C. (value by DSC method) was laminated to obtain a laminate.
次に、上記で作製した積層体を金型プレート(鏡面板)で挟んで加熱加圧成型を行った。加熱加圧成型時の成型条件は170℃60分、30kg/cm2とした。積層体の加熱加圧成型後の冷却時成型圧力は30kg/cm2とした。以上のようにして片面板を作製した。 Next, the laminated body produced above was sandwiched between mold plates (mirror plates) and subjected to heat and pressure molding. The molding conditions at the time of heat and pressure molding were set at 170 ° C. for 60 minutes and 30 kg / cm 2 . The molding pressure during cooling after heat-press molding of the laminate was 30 kg / cm 2 . To prepare a single face plate as described above.
上記で作製した片面板のガラス転移温度Tgを前記した方法で測定した。この片面金属張り積層板を完全硬化させたもののガラス転移温度Tgは140℃であった。 The glass transition temperature Tg of the single-sided plate produced above was measured by the method described above. This single-sided metal-clad laminate was completely cured, and the glass transition temperature Tg was 140 ° C.
また、上記のポリプロピレン離型フィルムの表面粗度は、(株)東京精密社製:SURFCOM E−RM−S01A E−MD−S39Aで測定した。 Moreover, the surface roughness of said polypropylene release film was measured by Tokyo Seimitsu Co., Ltd. product: SURFCOM E-RM-S01A E-MD-S39A.
また、片面板のフィルム剥離性は、製品100枚の剥離作業を実施して、剥離強度が強いことによる製品の折れ不良率の発生頻度を測定した。 Moreover, the film peelability of the single-sided plate was measured by measuring the frequency of occurrence of the product failure rate due to the strong peel strength after carrying out the peeling operation of 100 products.
また、2次成型時の密着性は、片面板と、厚さ0.1mm、樹脂量52%のプリプレグ(松下電工(株)製:R−1661)との2次成型を実施し、プリプレグと片面板の界面の剥離強度をオートグラフ((株)島津製作所社製:AGS−500B)にて測定した。 The adhesion at the time of secondary molding, a single face plate, a thickness of 0.1 mm, the resin amount 52% of the prepreg (Matsushita Electric Works Co., Ltd.: R-1661) conducted a secondary molding with a prepreg The peel strength at the interface of the single-sided plate was measured with an autograph (manufactured by Shimadzu Corporation: AGS-500B).
さらに、フィルム粕の発生は、片面板を20枚重ねてオートカットソーにて切断し、端部における粕の発生の有無を調べた。 Further, the occurrence of film wrinkles was made by stacking 20 single- sided plates and cutting them with an auto cut saw, and examining whether or not wrinkles occurred at the end portions.
以上の評価結果を表1に示す。
(参考例2)
参考例1において、加熱加圧成型時の製品最高温度を160℃としたこと以外は同様にして片面板を製造し、参考例1と同様な評価を行った。その評価結果を表1に示す。
(実施例1)
参考例1において、冷却時成型圧力を10kg/cm2としたこと以外は同様にして本発明製品である片面板を製造し、参考例1と同様な評価を行った。その評価結果を表1に示す。
(参考例3)
参考例1において、ポリプロピレン離型フィルムの表面粗度が4μmのものを使用したこと以外は同様にして片面板を製造し、参考例1と同様な評価を行った。この場合、参考例1に比べ2次成型時の密着性が若干小さくなる傾向があったが実用可能な範囲であった。
(参考例4)
参考例1において、ポリプロピレン離型フィルムの表面粗度が12μmのものを使用したこと以外は同様にして片面板を製造し、参考例1と同様な評価を行った。この場合、参考例1に比べフィルム剥離性の値が若干高くなる傾向があったが実用可能な範囲であった。
(参考例5)
参考例1において、ポリプロピレン離型フィルムの厚さが20μmのものを使用したこと以外は同様にして片面板を製造し、参考例1と同様な評価を行った。この場合、取り扱い性が難しくなる傾向にあったが実用可能な範囲であった。
(参考例6)
参考例1において、ポリプロピレン離型フィルムの厚さが60μmのものを使用したこと以外は同様にして片面板を製造し、参考例1と同様な評価を行った。この場合、参考例1に比べ加工時のフィルム粕の発生がはじまる傾向があったが実用可能な範囲であった。
(比較例1)
参考例1において、加熱加圧成型時の製品最高温度を175℃としたこと以外は同様にして比較例製品である片面板を製造し、参考例1と同様な評価を行った。その評価結果を表1に示す。比較例製品のガラス転移温度は140℃で、完全硬化状態の値と同じであった。
(比較例2)
参考例1において、冷却時に成型圧力を加えないこと以外は同様にして比較例製品である片面板を製造し、参考例1と同様な評価を行った。その評価結果を表1に示す。比較例製品のガラス転移温度は110℃で、完全硬化状態の値より30℃低い値であった。
表1より、本発明製品は、比較例製品に比べ、ポリプロピレン離型フィルムの剥離性と、2次成型時のプリプレグとの密着性をバランス良く確保することができることがわかる。
The above evaluation results are shown in Table 1.
( Reference Example 2)
Reference Example 1, except that the product maximum temperature during hot pressing mold and 160 ° C. to produce a to-sided plate in the same manner, was evaluated in the same manner as in Reference Example 1. The evaluation results are shown in Table 1.
( Example 1 )
In Reference Example 1, a single-sided plate as a product of the present invention was produced in the same manner except that the molding pressure during cooling was 10 kg / cm 2, and the same evaluation as in Reference Example 1 was performed. The evaluation results are shown in Table 1.
( Reference Example 3 )
Reference Example 1, except that the surface roughness of the polypropylene release film were from 4μm manufactures to-sided plate in the same manner, was evaluated in the same manner as in Reference Example 1. In this case, the adhesiveness during the secondary molding tended to be slightly smaller than that in Reference Example 1, but it was in a practical range.
( Reference Example 4 )
Reference Example 1, except that the surface roughness of the polypropylene release film were from 12μm manufactures to-sided plate in the same manner, was evaluated in the same manner as in Reference Example 1. In this case, the film peelability tended to be slightly higher than that of Reference Example 1, but was in a practical range.
( Reference Example 5 )
Reference Example 1, except that the thickness of the polypropylene release film were from 20μm manufactures to-sided plate in the same manner, was evaluated in the same manner as in Reference Example 1. In this case, the handleability tended to be difficult, but was in a practical range.
( Reference Example 6 )
Reference Example 1, except that the thickness of the polypropylene release film were from 60μm manufactures to-sided plate in the same manner, was evaluated in the same manner as in Reference Example 1. In this case, compared with Reference Example 1, the generation of film wrinkles during processing tended to start, but this was within a practical range.
(Comparative Example 1)
In Reference Example 1, a single-sided plate as a comparative example product was produced in the same manner except that the maximum product temperature at the time of heat and pressure molding was set to 175 ° C., and the same evaluation as in Reference Example 1 was performed. The evaluation results are shown in Table 1. The glass transition temperature of the comparative product was 140 ° C., which was the same as the fully cured state value.
(Comparative Example 2)
In Reference Example 1, a single-sided plate as a comparative product was produced in the same manner except that no molding pressure was applied during cooling, and the same evaluation as in Reference Example 1 was performed. The evaluation results are shown in Table 1. The glass transition temperature of the comparative product was 110 ° C., which was 30 ° C. lower than the value of the fully cured state.
From Table 1, it can be seen that the product of the present invention can ensure a good balance between the peelability of the polypropylene release film and the adhesion to the prepreg during secondary molding, as compared with the comparative product.
Claims (2)
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| JPH0715103A (en) * | 1993-06-25 | 1995-01-17 | Matsushita Electric Works Ltd | Manufacture of one-side copper-clad laminate |
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