JP4599265B2 - Interposer - Google Patents

Description

  The present invention relates to an interposer that electrically connects, for example, a semiconductor element and an electronic substrate that are arranged to face each other, and more particularly to an interposer that can be configured simply and with a small number of components.

  As a prior art related to the interposer of the present invention, for example, there is an electronic connector described in Patent Document 1.

  In the electronic connector 1 shown in Patent Document 1, a plurality of through holes 3 are formed in a substrate 2, and a pair of spiral contacts 7 and 7 are provided as signal system terminals on both edges of each through hole 3. ing.

  When the electronic connector 1 is positioned and disposed in the opposing surface of the substrate 10 and the substrate 11, one end of the spiral contacts 7 and 7 is connected to the signal line connecting portion 13a1 of the substrate 10, and the other end is connected to the substrate. 11 signal line connection portion 13a1.

Therefore, the connection part 13a1 of one substrate 10 and the connection part 13a1 of the other substrate 11 can be electrically connected by the spiral contacts 7 and 7.
Japanese Patent Laying-Open No. 2004-241304 (FIG. 7)

  However, in the electronic connector 1 described in Patent Document 1, the conductive portion 5 for connecting the spiral contact 7 provided on one surface and the spiral contact 7 provided on the other surface is provided with the conductive portion 5 described above. It is necessary to form on the inner wall of the through hole 3. For this reason, there exists a problem that the manufacturing process of an electronic connector tends to become complicated.

  The electronic connector 1 has a configuration in which a pair of spiral contacts 7 and 7 must be disposed at both ends of the through-hole 3. For this reason, when the number of terminals of both the boards 10 and 11 is increased, the number of spiral contacts 7 and 7 is required to be twice that number, and there is a problem that the number of parts cannot be reduced due to the structure.

  The present invention has been made to solve the above-described conventional problems, and an object thereof is to provide an interposer that can be configured simply and with a small number of parts.

The interposer of the present invention has a base material in which a through-hole is formed, and an elastic contact attached to the base material,
The resilient contact comprises a base portion fixed on the substrate, and extending buildings elastically deformable elastic arms in a direction away from the one side one of said substrate, toward the through-hole from said resilient arm and possess a convex portion facing the through hole to protrude in a direction,
When the elastic arm is elastically deformed in a direction approaching the one surface, the convex portion protrudes from the other surface of the base material through the inside of the through hole, and a part of the elastic arm and the convex portion The tip part is located on both sides of the base material, and each of the part and the tip part is a contact part with the electrode .

  In the present invention, it is not necessary to form a conductive portion on the inner wall of the through hole (through hole). Therefore, the configuration of the interposer can be simplified. In addition, it is only necessary to provide elastic contacts on one surface of the base sheet, and it is not necessary to provide them on both surfaces of the through-holes. Therefore, the number of parts can be reduced compared to the conventional case, and the manufacturing cost can be reduced. Can be suppressed.

  In the above, it is preferable that the convex portion is formed by a bump in which plating is three-dimensionally grown on the elastic arm.

In the above means, the elastic arm and the convex portion can be integrally formed, and the strength of the convex portion can be increased.
It is preferable that a plurality of the convex portions are formed on the elastic arm.

  In the above means, electrical conduction between the electrodes can be ensured, so that reliability as an interposer can be improved.

  It is preferable that the convex portion is formed by bending a part of an elastic arm made of a leaf spring.

With the above means, the configuration of the interposer can be simplified.
Moreover, it is preferable that many said through-holes are formed on the said base material sheet, and the said elastic contactor is provided corresponding to each through-hole.

With the above means, it is possible to ensure electrical continuity between each electrode of a semiconductor element having a large number of pins and a large number of electrodes arranged corresponding to the electrodes.
It is preferable that the elastic contact is a spiral contact.

  Spiral contacts have extremely low contact pressure per piece. Therefore, in the above means, it is not necessary to apply a large pressure between the semiconductor element and the substrate, and the conduction between each electrode of the semiconductor element having many pins and each electrode on the substrate side is ensured with a small pressure. Is possible.

  In the present invention, since it is not necessary to form a conductive portion on the inner wall of the through hole (through hole), the configuration of the interposer can be simplified.

  In addition, it is only necessary to provide elastic contacts on one surface of the base sheet, and it is not necessary to provide them on both surfaces of the through-holes. Therefore, the number of parts can be reduced compared to the conventional case, and the manufacturing cost can be reduced. Can be suppressed.

  FIG. 1A is a cross-sectional view showing an interposer as a first embodiment of the present invention, FIG. 1B is a cross-sectional view showing a use state of the interposer shown in the first embodiment, and FIG. 2 is an example of an elastic contactor It is a top view which shows a spiral contactor.

  As shown in FIG. 1A, the interposer 10A of the present invention is formed on a base material sheet 11 having insulating properties such as polyimide. A plurality of through holes (through holes) 11a are formed in the base sheet 11 in a matrix shape, for example, and elastic contacts 20 are provided in the respective through holes 11a.

  As the elastic contact 20, for example, a spiral contact 20 </ b> A having a small contact pressure per piece as shown in FIG. 2 is used. The spiral contact 20 </ b> A includes a base portion 21 provided on the outer peripheral side and an elastic arm 22 that continuously extends from the base portion 21. One end (end portion of the base portion 21) of the elastic arm 22 is a base end 22a that forms a boundary with the base portion 21, and the other end forms a tip end 22b. The elastic arm 22 has a base end 22 a provided on the outer peripheral side of the base portion 21, and the tip 22 b is formed in a spiral shape whose radius gradually decreases from the base end 22 a toward the center on the inner peripheral side. . Further, the spiral contact 20A is formed in a three-dimensional shape in which the tip 22b protrudes in a mountain shape (also referred to as a convex shape) in the Z1 direction (first direction) shown in the figure (see FIG. 1A) rather than the base end 22a. A convex portion 24a is formed on the lower surface of the tip 22b so as to project in the Z2 direction (second direction). The convex portion 24a faces the through hole 11a in a state where it can enter. When a force in the vertical (Z direction) direction is applied to the tip 22b of each spiral contact 20A, the elastic arm 22 is elastically deformable in the Z direction shown in the figure.

  As shown in FIG. 1B, the interposer 10 is disposed between A, for example, the substrate 30 and the semiconductor element 40. At this time, the plurality of electrodes 31 formed on the surface of the substrate 30 and the plurality of electrodes 41 formed on the lower surface of the semiconductor element 40 are opposed to each other, and the plurality of spiral contacts 20A are opposed to each other. Be placed.

When the semiconductor element 40 is pressed against the surface of the interposer 10, each electrode 41 of the semiconductor element 40 comes into contact with each spiral contact 20A . Further, when the facing distance between the substrate 30 and the semiconductor element 40 is shortened and the interposer 10A is pressed in the Z2 direction in the drawing, the elastic arms 22 constituting the spiral contact 20A contract (directions of the base ends) The distance between the tip 22b and the tip 22b is elastically deformed in a direction in which the distance from the natural length is reduced. At this time, the convex portion 24a enters the inside of the elastic arm 22 formed in a spiral shape and the through hole 11a formed in the base sheet 11, and further passes through these in the Z2 direction in the drawing to form the substrate. It abuts on the surface of 30 electrodes 31.

Therefore, each electrode 31 of the substrate 30 and each electrode 41 of the semiconductor element 40 can be electrically connected to each other via the tip 22b provided on each elastic arm 22 and the convex portion 24a .

  FIG. 3A is an enlarged cross-sectional view showing an interposer as a second embodiment of the present invention, and FIG. 3B is a cross-sectional view showing a use state of the interposer shown in the second embodiment.

  The interposer 10B shown in the second embodiment has substantially the same configuration as the interposer 10A shown in the first embodiment using a spiral elastic contactor.

  However, as shown in FIG. 3A, in the interposer 10B shown in the second embodiment, the convex portion 24b is not provided on the lower surface of the distal end 22b, but in the middle between the proximal end 22a and the distal end 22b of the elastic arm 22. It differs in that it is formed. The convex portion 24b is formed so as to protrude in the Z2 direction from the lower surface of the elastic arm 22. 3A and 3B show the case where the number of the convex portions 24b is one, the number of the convex portions 24b may be at least one, and preferably has a plurality. In this way, if a plurality of convex portions 24b are formed on one elastic arm 22, even if one of them has a problem, conduction between both electrodes is ensured through the other convex portion 24b. It is possible to increase the reliability of the interposer 10B. In addition, such a convex part 24b is also arrange | positioned facing the said through-hole 11a.

  As shown in FIG. 3B, similarly to the above, the interposer 10B is disposed between the substrate 30 and the semiconductor element 40, and the opposing distance between them is made close so that the tip 22b of the spiral contact 20B is connected to the electrode 41 of the semiconductor element 40. When elastically pressed, the elastic arm 22 is elastically deformed in a contracting direction. At this time, since the convex portion 24b passes through the through hole 11a in the Z2 direction and contacts the electrode 31 provided on the substrate 30, each of the electrodes 41 and the substrate 30 of the semiconductor element 40 are in contact with each other. The electrode 31 can be conductively connected using the interposer 10B.

  In the second embodiment, between each electrode 41 of the semiconductor element 40 and each electrode 31 on the substrate 30 via a tip 22b, an elastic arm 22 and a convex portion 24b forming a spiral contact 20B. Can be connected.

  In the first and second embodiments, since the spiral contacts 20A and 20B having a small contact pressure per unit are used, the applied pressure between the semiconductor element 40 and the substrate 30 is reduced. Is possible.

  The spiral contacts 20A and 20B shown in the first and second embodiments can be formed by combining, for example, a resist and a plating technique. At this time, the protrusions 24a and 24b are integrally formed with the spiral contacts 20A and 20B by three-dimensionally growing plating applied to the lower surface of the tip 22b and the elastic arm 22 to form bumps. Can do. Therefore, the strength of the convex portions 24a and 24b can be increased.

Next, a third embodiment of the present invention will be described.
4A is an enlarged cross-sectional view showing an interposer as a third embodiment of the present invention, and FIG. 4B is a cross-sectional view showing a use state of the interposer shown in the third embodiment.

  The interposer 10C shown in the third embodiment is different from the first and second embodiments in that an elastic contact 20C made of a leaf spring is used instead of the spiral contact.

  As shown in FIG. 4A, in the interposer 10 </ b> C shown in the third embodiment, a substantially V-shaped elastic contact 20 </ b> C is provided in the vicinity of each through hole 11 a of the base sheet 11.

  The elastic contact 20C is formed of a leaf spring having a base portion 21c and an elastic arm (elastic deformation portion) 22c. The elastic contact 20C is fixed by adhering the base portion 21c to the vicinity of the through hole 11a of the base sheet 11. The elastic arm 22c has a portion close to the base portion 21c bent in a valley fold in the Z1 direction (first direction) shown in the figure, and a tip thereof bent in a mountain fold in the Z2 direction (second direction) shown in the figure. Therefore, it is formed in a substantially V shape. The portion bent into the mountain fold is the apex 23, and the tipmost portion ahead is equivalent to the convex portion 24c. That is, the substantially V-shaped elastic arm 22 having the vertex 23 and the convex portion 24b is supported in a cantilevered state on the base sheet 11 at the base portion 21c.

  As shown in FIG. 4A, the convex portion 24c is arranged in a state of entering the through hole 11a. Alternatively, at least the convex portion 24c is arranged in a state where it can enter the through hole 11a.

  As shown in FIG. 4B, when the interposer 10C is disposed between the substrate 30 and the semiconductor element 40 in the same manner as described above and the interposer 10 is brought close to the substrate 30, the electrode 41 of the semiconductor element 40 is connected to the elastic contact 20C. Can be brought into contact.

  Further, when the interposer 10C is brought close to the substrate 30 to increase the pressure on the apex 23, the elastic arm 22c is elastically deformed. At this time, the convex portion 24c passes through the through hole 11a in the Z2 direction and comes into contact with the surface of the electrode 31 on the substrate 30 provided on the lower side of the interposer 10C. Each electrode 41 and each electrode 31 are electrically connected to the substrate 30 using an interposer 10C.

  In the third embodiment, each electrode 41 of the semiconductor element 40 and each electrode 31 are connected to the substrate 30 via the apex 23 forming the elastic contact 20C and the convex portion 24c. Is possible.

  As described above, in any of the interposers 10A, 10B, and 10C shown in the first, second, and third embodiments, the inner wall of the through hole (through hole) 11a formed in the base sheet 11 is electrically conductive. There is no need to form a part. Therefore, the configuration of the interposer 10 can be simplified.

  In addition, the elastic contactor 20 only needs to be provided on one surface of the base sheet 11, and it is not necessary to provide the elastic contactor 20 on both the upper and lower surfaces of the through hole 11a. Manufacturing costs can be kept low.

  In any of the above embodiments, the elastic contact 20 has been described using the configuration provided on one side of the base sheet 11 on the Z1 side (semiconductor element side), but the present invention is not limited to this, The elastic contact 20 may be configured to be provided on one side (substrate side) of the base sheet 11 on the Z2 side. In this case, each convex portion 24 passes through the through hole 11a in the Z1 direction in the figure, and comes into contact with the surface (lower surface) of the electrode 41 of the semiconductor element 40.

Sectional drawing which shows the interposer as the 1st Embodiment of this invention, Sectional drawing which shows the use condition of the interposer shown in 1st Embodiment, A plan view showing a spiral contact as an example of an elastic contact; The expanded sectional view which shows the interposer as the 2nd Embodiment of this invention, Sectional drawing which shows the use condition of the interposer shown in 2nd Embodiment, The expanded sectional view which shows the interposer as the 3rd Embodiment of this invention, Sectional drawing which shows the use condition of the interposer shown in 3rd Embodiment,

Explanation of symbols

10A, 10B, 10C Interposer 11 Base material sheet 11a Through hole (through hole)
20, 20C Elastic contactor 20A, 20B Spiral contactor 21, 21c Base part 22 Elastic arm 22a Base end 22b Tip 23 Vertex 24a, 24b, 24c Convex part 30 Substrate 31 Electrode 40 Semiconductor element 41 Electrode

Claims (6)

It has a base material in which a through hole is formed, and an elastic contact attached to the base material,
The resilient contact comprises a base portion fixed on the substrate, and extending buildings elastically deformable elastic arms in a direction away from the one side one of said substrate, toward the through-hole from said resilient arm and possess a convex portion facing the through hole to protrude in a direction,
When the elastic arm is elastically deformed in a direction approaching the one surface, the convex portion protrudes from the other surface of the base material through the inside of the through hole, and a part of the elastic arm and the convex portion The interposer is characterized in that the tip portion is located on both sides of the base material, and each of the portion and the tip portion is a contact portion with the electrode . The interposer according to claim 1, wherein the convex portion is provided at one point of the tip of the elastic arm away from the base portion . The convex portion is, the elastic arm of the interposer according to claim 1, wherein are provided at a plurality of positions. The interposer according to any one of claims 1 to 3 , wherein the elastic arm has a spiral shape . The interposer according to any one of claims 1 to 4, wherein the convex portion is formed of a bump in which plating is three-dimensionally grown on the elastic arm. The elastic arm is at a leaf spring, the interposer according to claim 1, wherein the convex portion partially bent of the plate spring is formed.

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