JP4601130B2 - Teaching apparatus and method for wafer handling robot - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a teaching apparatus and method for a wafer handling robot for transferring a wafer in a semiconductor manufacturing apparatus, and in particular, to move an end effector, an arm, a rotating shaft, and a wafer handling robot constituting the wafer handling robot. The present invention relates to a teaching method and apparatus for a slide shaft.
[0002]
[Prior art]
A perspective view of a typical vacuum load-lock type semiconductor manufacturing apparatus 1 is shown in FIG. The semiconductor manufacturing apparatus 1 has two chambers 2 and 2 'on the left and right sides, and each chamber is provided with a substrate support plate 3 and 3' on which a semiconductor wafer is placed.
[0003]
The semiconductor manufacturing apparatus 1 further includes a wafer handling robot 4 that operates in the atmosphere, and a wafer handling robot 5 that is disposed in a chamber to be evacuated (indicated by a two-dot chain line in the figure) and operates under vacuum. And are installed.
[0004]
The wafer handling robot 4 is arranged at the cassette port 6 and takes out the wafer from the cassette 6 ′ containing a plurality of wafers, and transfers the wafer to the wafer holding plate 3 through the opening of the chamber 2 or vice versa. To do. On the other hand, the wafer handling robot 5 takes out the wafer held on the wafer holding plate 3 ′ in the evacuated chamber 2 under vacuum and transfers the wafer to, for example, the reactor or vice versa.
[0005]
Wafer handling robot 4, along the slide shaft (not shown) can be moved closer to the other chambers 2 ', where it is possible to perform the same operation as described above.
[0006]
As shown in FIG. 2, the wafer handling robot 4 (the wafer handling robot 5 has the same structure) is usually connected to the rotary shaft 12 and the rotary shaft 12 rotatable relative to the main body portion 11 as shown in FIG. is, two arms 13, 14 pivotally attached to one another, mounted for further turned to the arm 14, the wafer becomes a end effector 17 to be placed in position.
[0007]
When end effector 17 is guided to move in the axial direction, when the rotary shaft 12 is rotated via the two arms, the end effector 17 can reciprocate its axis line. Further, when the main body 11 is rotated as a whole by a rotating means (not shown), the two arms and the end effector are rotated while maintaining the form (for example, when the wafer is taken out from the cassette and transferred to the chamber, The main body rotates as a whole, and the end effector can be turned to the chamber while the wafer is placed.
[0008]
The wafer handling robot has means (not shown) for raising and lowering the whole in the vertical direction (that is, the axial direction of the rotating shaft 12) so that the surface of the end effector 17 is in exact contact with the lower surface of the wafer in the cassette, for example. .
[0009]
As described above, the wafer handling robot can transfer the wafer to a predetermined position of the cassette, the chamber, and the reactor, that is, a position where the wafer is to be transferred. Since such transfer is automatically performed, the wafer handling is performed. The rotation of the entire robot, the position of the rotation start point of the rotation axis, the position of the stop point, the position in the axis direction of the robot, etc. must be set accurately. For this purpose, the end effector and arm of this robot must be taught, that is, positioned. Similarly, when the robot moves along the slide axis, the slide axis must be taught.
[0010]
Conventionally, such teaching has been performed by visually placing a wafer on an end effector and visually checking a cassette, a wafer holding plate in a chamber, and the like.
[Problems to be solved by the invention]
[0011]
Such visual teaching could not be performed quickly and accurately by a highly skilled worker. Still, for example, when teaching is performed in the axial direction of the rotation axis by bringing the upper surface of the end effector into contact with the lower surface of the wafer disposed in the cassette, the wafer floats when the end effector contacts the wafer. Therefore, it is difficult to find the contact point accurately. Furthermore, since the parallelism between the wafer housed in the cassette or the wafer placed on the holding plate and the end effector does not always come out exactly, it cannot be said that the point has been found accurately by contact between the two. In some cases.
[0012]
SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems. An object of the present invention is to provide an apparatus capable of teaching a wafer handling robot used in a semiconductor manufacturing apparatus easily and accurately without using a wafer, and Is to provide a method.
[0013]
Another object of the present invention is to provide the above apparatus and method capable of teaching a wafer handling robot without changing existing equipment in a semiconductor manufacturing apparatus.
[0014]
[Means for Solving the Problems]
An apparatus of the present invention that achieves the above object is a semiconductor manufacturing apparatus comprising an end effector on which a wafer is placed at a predetermined position, an arm, and a rotating shaft, and a wafer handling robot for transferring the wafer. It is a teaching device. This apparatus is composed of a substrate provided with a fitting portion for fitting with an end effector. This substrate is arranged at the teaching position, and when the end effector is fitted into the fitting portion, teaching of the end effector, arm and rotating shaft of the wafer handling robot is executed. Here, the end effector has a concave portion, and the fitting portion is preferably a convex portion that fits into the concave portion of the end effector, the convex portion is a cylindrical portion, and the concave portion has a shape corresponding to the cylindrical portion. It is desirable to have
[0015]
In this apparatus, when the concave and convex portions are fitted and the rotation axis is moved in the axial direction, the bottom surface of the end effector and the top surface of the substrate come into contact with each other in the axial direction of the rotation axis of the wafer handling robot. Teaching is executed.
[0016]
Another teaching device of the present invention includes a fitting portion attached to the end effector and a substrate fitted to the fitting portion. Here, the fitting portion has a convex portion facing downward, and the substrate has a concave portion that fits the convex portion. The substrate is placed at the teaching position, and when the convex portion of the fitting portion attached to the end effector is fitted into the concave portion of the substrate, teaching of the end effector, arm, and rotating shaft of the wafer handling robot is executed.
[0017]
Also in this apparatus, when the concave portion and the convex portion are fitted and the rotation shaft is moved in the axial direction, when the lower surface of the fitting portion is in contact with the upper surface of the substrate, the axial direction of the rotation shaft of the wafer handling robot. Teaching is executed.
[0018]
In the above apparatus, the end effector is moved in the axial direction of the rotary shaft provided in the semiconductor manufacturing apparatus by moving the front rotary shaft in the axial direction before or after the fitting between the concave portion and the convex portion. Teaching is performed in the axial direction of the rotation axis of the wafer handling robot when it is aligned with the mark for determining the position of the wafer handling robot.
[0019]
Another teaching apparatus of the present invention is an apparatus for teaching a slide shaft for moving a wafer handling robot between two or more positions where a wafer should be transferred in a semiconductor manufacturing apparatus. This apparatus comprises a substrate removably disposed at a plurality of teaching positions and a bar attached to the substrate. Here, a straight line is attached to the bar along its axis. When the substrate is placed in the teaching position, the bar has a length exceeding the slide axis. The axis of the bar intersects with the axis passing through the center of the wafer when the wafer is transferred to the position to be transferred. The wafer handling robot has a mark for alignment with the straight line of the bar. The slide shaft is adjusted by aligning the straight line of the arranged substrate and the mark, thereby executing the slide shaft teaching method. Preferably, the substrate is placed at each of the two teaching positions, and the straight line attached to each of the bars of the placed substrate is aligned with the mark attached to the wafer handling robot, so that the slide shaft is aligned. Teaching is executed. Adjustment of the slide axis can be performed by adjusting and driving means for moving the wafer handling robot, but it may be performed manually or by using a dedicated device.
[0020]
DETAILED DESCRIPTION OF THE INVENTION
The teaching apparatus and method of the present invention will be described with reference to the drawings.
[0021]
FIG. 2 shows a schematic oblique view of the teaching device 20 of the present invention. The teaching device 20 is disposed on the wafer cassette port 6. This wafer cassette port 6 is provided with a cassette 6 ′ in which a plurality of wafers are detachably stored in a semiconductor manufacturing apparatus (see FIG. 1). Therefore, the substrate 21 constituting the teaching apparatus 20 is detachably disposed thereon (this position is referred to as a teaching position since teaching described below is executed at this position).
[0022]
On this substrate 21, when the cassette 6 'is disposed in the wafer cassette port 6, a convex portion 22 serving as a cylindrical fitting portion having an axis that coincides with the axis passing through the center of the wafer in the cassette. Is arranged.
[0023]
A U-shaped concave portion 18 in which the convex portion 22 can be accommodated and fitted is provided at the tip of the end effector 17 of the wafer handling robot 4. When the concave portion 18 and the convex portion 22 are fitted as shown in FIG. 2, the axis passing through the center of the wafer to be disposed on the end effector 17 coincides with the axis of the convex portion 22. Thus, it is desirable that the recess 18 be formed.
[0024]
The end effector 17 can reciprocate in the axial direction by means of an axial guide (not shown) through the two arms 13 and 14 connected to the rotating shaft 12. As the rotary shaft rotates, it gradually overhangs and advances along the axial direction on the substrate 21, and the concave portion 18 is completely fitted with the convex portion 22 on the substrate 21. At this time, since the end effector 17 is in a position for taking out or storing the wafer in the cassette, the wafer handling robot at this time is in the state of taking out or storing the wafer in the cassette. Therefore, teaching, that is, positioning is executed by setting the wafer handling robot to this state (at this time, the wafer is taken out from the cassette, the rotation starting point of the rotation axis of the storage, the stop point, the arm position). Are stored as rotation axis data, arm axis data, etc. for teaching execution).
[0025]
Teaching related to the rotation of the rotating shaft has been performed by the above fitting, but teaching related to the axial direction of the rotating shaft is also necessary for transferring the wafer. This teaching is performed as follows.
[0026]
By the above fitting, the substrate 21 is placed on the wafer cassette port 6 so that the position of the upper surface of the end effector 17 in contact with the substrate 21 coincides with the lower surface of the wafer in the cassette 6 ′ to be placed after teaching. To do. Then, together with the fitting operation or independently, the rotary shaft 12 is raised and lowered in the axial direction so as to contact the lower surface of the end effector and the upper surface of the substrate 21. As a result, the position of the rotating shaft in the axial direction is determined, that is, teaching is performed.
[0027]
In addition to such teaching, in order to determine the position of the rotary shaft provided in the apparatus in the axial direction by raising and lowering the rotary shaft by means of raising and lowering the rotary shaft before or after the fitting. Teaching in the axial direction of the rotating shaft can be executed by aligning the end effector with a mark or a step portion or line for storing and supporting the wafer in the cassette. Such teaching can be performed by providing an appropriate mark even in the chamber.
[0028]
In the embodiment of FIG. 2, the fitting portion on the substrate is a cylindrical convex portion, and the concave portion of the end effector is fitted to the convex portion, but it is not necessary to be limited to these shapes. For example, a convex portion such as a triangle or an ellipse and a concave portion fitted to the convex portion may be used.
[0029]
FIG. 3 shows an apparatus 30 for teaching the wafer handling robot 4 on the wafer holding plate in the chamber 2 of the semiconductor manufacturing apparatus. The wafer holding plate 3 has a pair of support portions 3 ′ and 3 ″ that face each other and store and support the wafer therebetween.
[0030]
Similarly to the embodiment of FIG. 2, the apparatus of the embodiment of FIG. 3 includes a substrate and a fitting portion on which the end effector is fitted. In this embodiment, in the wafer holding plate, In order to perform teaching, the substrate 31 has the same shape as the wafer.
On the substrate 31, a convex portion 32 as a fitting portion is provided so as to coincide with an axis passing through the center of the wafer to be disposed on the wafer holding plate. A cylindrical shape is desirable for the convex portion 32 as in the embodiment of FIG.
[0031]
The configuration of the wafer handling robot 4 of this embodiment is the same as that shown in FIG. 2, that is, an end effector 17 having a U-shaped concave portion at the tip, which has a shape that can be fitted with a cylindrical convex portion 32, It consists of arms 13 and 14 and a rotating shaft 12. The teaching operation is the same as in the embodiment of FIG. 2, and the end effector 17 is extended in the axial direction via the arms 13 and 14 according to the rotation of the rotating shaft, and the concave portion 18 of the end effector 17 is fitted to the convex portion 32. This is done by combining.
[0032]
FIG. 4 shows another embodiment in which teaching is performed in a cassette. The teaching device 40 of this embodiment also includes a substrate 41 and a fitting portion 42. In this apparatus 40, the end effector 17 ′ of the wafer handling robot can place a wafer at a predetermined position, like the end effector 17 in FIG. 2, but this end effector 17 ′ has a substantially rectangular shape. A semi-circular cutout 17 ″ for positioning is formed at the tip.
[0033]
The fitting portion 42 accommodates the tip of the end effector 17 ′ , but has a protrusion 42 ′ that engages with the notch 17 ″ of the end effector 17 ′ . Further, the fitting portion 42 is provided on the lower surface thereof on the end effector 17 ′. A downward convex portion 43 that coincides with an axis passing through the center of the wafer placed at a predetermined position.
[0034]
The substrate 41 is detachably disposed on the wafer cassette port 6. The substrate 41 is formed with a concave portion 41 ′ at an axis passing through the center of the wafer in the cassette when placed on the wafer cassette port 6.
[0035]
In the teaching in this embodiment, the fitting portion 42 is attached to the tip of the end effector 17 ′, and the end effector 17 ′ is gradually projected in the axial direction as in the case of FIG. When the respective axes coincide with each other, the end effector 17 'is lowered by means for moving the wafer handling robot up and down along the direction of the axis, and the convex and concave portions are fitted. By this fitting, the wafer handling robot is taught, that is, positioned.
[0036]
By fitting the convex portion 43 and the concave portion 41 ′ , the substrate 41 is placed on the wafer so that the position of the upper surface of the end effector 17 ′ in contact with the substrate 41 coincides with the lower surface of the wafer in the cassette to be disposed after teaching. When it is arranged on the cassette port, the position of the rotating shaft in the axial direction is determined by the fitting operation, that is, teaching is performed.
[0037]
When there are two or more positions where wafers should be transferred, such as cassettes and processing chambers, it is necessary to move the wafer handling robot to approach these positions. FIG. 5 shows a schematic oblique view of a teaching device in a semiconductor manufacturing apparatus in which a wafer handling robot is moved along a slide axis and wafers are transferred there.
[0038]
FIG. 5 shows a teaching device 50 disposed in the cassette port 6 and a teaching device 60 disposed in the chamber 2. The apparatus 50 arranged in the cassette port 6 is arranged along an axis 52 ′ perpendicular to an axis passing through the substrate 51 arranged on the cassette port 6 and the center of the wafer in the cassette arranged in the cassette port 6. It consists of an extending bar 52. The bar 52 has a length exceeding a slide axis (not shown) through which the wafer handling robot moves, and further has a straight line 53 attached along the axis 52 '.
[0039]
The other teaching device 60 includes a substrate 61 and a bar 62 in the same manner as the one teaching device 50. The substrate 61 has substantially the same cross-sectional shape as the size of the opening 2 ′ of the chamber 2. Therefore, the substrate 61 is held in that state when inserted into the opening 2 ′ of the chamber. The bar 62, like the bar 52, has an axis extending along an axis perpendicular to the axis passing through the center of the wafer transferred into the chamber, and has a straight line 63 attached along the axis. The bar 62 also has a length exceeding the slide shaft (not shown).
[0040]
Teaching of the slide shaft using these devices is performed as follows. First, the substrate 51 of the teaching device 50 is placed in the cassette port 6, and the substrate 61 of the teaching device 60 is inserted into the opening of the chamber. By such arrangement and insertion, the bars 52 and 62 extend beyond the slide shaft. The mark 12 'provided on the rotation axis of the wafer handling robot 4 is aligned with the straight lines 53 and 63 of the respective bars, and the slide axis is positioned, that is, teaching is performed. Incidentally, for this teaching, movement of the wafer handling robot is performed using means other than means for raising and lowering the robot in the vertical direction. This movement may be performed manually or using a teaching pendant which is a dedicated device.
[0041]
In this example, teaching is performed at a position where the wafer should be transferred, ie, cassette port and chamber. However, if there are two cassette ports, if there are two chambers as shown in FIG. Teaching can be performed at these chamber positions. At this time, in addition to arranging two teaching devices in each cassette port, placing a teaching device in one cassette port, aligning the straight line and the mark, and then teaching the other cassette port By arranging the device and aligning the straight line with the mark, you can also teach the slide axis.
[0042]
【effect】
According to the present invention, teaching of a wafer handling robot can be performed with a very simple device without using a wafer. The teaching includes teaching in the direction along the rotation axis of the robot. Therefore, three-dimensional teaching can be performed.
[0043]
Furthermore, this teaching can also be achieved by performing normal operations of a normal wafer handling robot. Therefore, anyone can achieve teaching in a short time.
[0044]
Further, the apparatus of the present invention can be used without making any changes to the existing semiconductor manufacturing apparatus.
[Brief description of the drawings]
FIG. 1 is a schematic oblique view of a semiconductor manufacturing apparatus using a conventional wafer handling robot.
FIG. 2 is a perspective view showing a relationship between a teaching apparatus of the present invention and a wafer handling robot at a wafer port.
FIG. 3 is a perspective view showing the relationship between the teaching apparatus of the present invention and a wafer handling robot in a chamber.
FIG. 4 is a schematic oblique view of another teaching apparatus of the present invention.
FIG. 5 shows teaching by a teaching device for a slide axis of a wafer handling robot.
[Explanation of symbols]
4 Wafer handling robot
6 Cassette port
11 Body
12 Rotating axis
13, 14 arms
17 End effector
18 recess
20 Teaching device
21 Board
22 Convex

Claims (16)

An apparatus for teaching a wafer handling robot for transferring a wafer, comprising an end effector on which a wafer is placed at a predetermined position, an arm, and a rotating shaft in a semiconductor manufacturing apparatus, the substrate and the substrate The substrate is disposed at the teaching position so that the upper surface position of the end effector in contact with the substrate coincides with the lower surface of the wafer, and the end effector Is fitted into the fitting portion, teaching of the end effector, arm and rotating shaft of the wafer handling robot is executed.
A device characterized by that. The end effector has a concave portion, and the fitting portion is a convex portion that fits with the concave portion of the end effector.
The apparatus according to claim 1. The convex portion is a cylindrical portion, and the concave portion has a shape corresponding to the cylindrical portion.
The apparatus according to claim 2. The teaching position is a position where a cassette for storing wafers is disposed.
Claim 1 Symbol placement device, characterized in that. The teaching position is a wafer holding position in a wafer holding means in a chamber to be evacuated, and the substrate is disposed at a position where the wafer is held by the wafer holding means.
Claim 1 Symbol placement device, characterized in that. The axis of the convex part of the fitting part on the substrate arranged at the teaching position and the central axis of the wafer when placed at the predetermined position of the end effector are the concave part and the convex part. Match when the part is mated,
The apparatus according to claim 1. In semiconductor manufacturing equipment, a wafer handling robot is a device that teaches slide shafts to move between two or more positions where wafers should be transferred, and can be removed at multiple teaching positions. Each of the bars is provided with a straight line along its axis, and when the substrate is placed at the teaching position, the bars Has a length exceeding the slide axis, and the axis of the bar intersects with an axis passing through the center of the wafer when the wafer is transferred to a position to be transferred, and the straight line of the bar A mark for alignment is attached to the wafer handling robot, and by aligning the mark with the straight line of the bar of the placed substrate, Teaching of the serial sliding shaft is executed, and wherein the. A method for teaching a wafer handling robot for transferring a wafer using the teaching device according to claim 1, wherein the substrate is positioned at a teaching position so that the upper surface position of the end effector in contact with the substrate coincides with the lower surface of the wafer. And the step of fitting the end effector into a fitting portion, and by this fitting, teaching of the end effector, arm and rotating shaft of the wafer handling robot is performed.
A method characterized by that. The fitting step is to fit a convex portion provided in the fitting portion into a concave portion provided in the end effector.
9. The method of claim 8 , wherein: The step of arranging at the teaching position is to arrange the substrate at a position where a cassette for storing wafers is arranged.
8 Symbol mounting method according to claim, characterized in that. The step of arranging at the teaching position is to arrange the substrate on a wafer holding means in a chamber to be evacuated.
8 Symbol mounting method according to claim, characterized in that. When the lower surface of the end effector and the upper surface of the substrate are in contact with each other by fitting the concave portion and the convex portion and moving the rotational shaft in the axial direction of the rotational shaft of the wafer handling robot. Axis teaching is performed.
9. Symbol mounting method is characterized in that. Before or after the fitting between the concave portion and the convex portion, the end effector is moved in the axial direction by moving the rotary shaft in the axial direction of the rotary shaft provided in the semiconductor manufacturing apparatus. Teaching in the axial direction of the rotational axis of the wafer handling robot is performed when aligned with the mark for determining the position of
9. Symbol mounting method is characterized in that. A method for teaching the slide shaft using the apparatus for teaching the slide shaft according to claim 7 , wherein the step of placing the substrate at the teaching position and the mark attached to the wafer handling robot include: Adjusting the slide shaft in alignment with a straight line attached to the bar of the arranged substrate, wherein the adjusting step is a step of adjusting and driving means for moving the wafer handling robot. is there,
A method characterized by that. The step of disposing at the teaching position is disposing the substrate at each of the two teaching positions, and the adjusting step includes indicating the marks attached to the wafer handling robot at the two teaching positions. Adjusting the slide shaft in alignment with a straight line attached to each of the bars of the substrate placed in
14. Symbol mounting method is characterized in that. Instead of the adjustment driving step, the adjustment step is performed by a dedicated adjustment device or manually.
16. A method according to claim 14 or 15 , characterized in that

Images