JP4602013B2 - Ultrasonic probe - Google Patents

Description

  The present invention relates to an ultrasonic probe used in an ultrasonic diagnostic apparatus.

  2. Description of the Related Art An ultrasonic diagnostic apparatus that transmits an ultrasonic wave into a subject and receives a reflected echo to inspect the subject is widely used in the medical field. An ultrasonic probe that transmits and receives ultrasonic waves is used in contact with a subject. A transducer unit (also referred to as a transducer unit), a circuit board unit that is connected to the transducer unit and performs electrical signal processing, and The circuit board unit is composed of a cable bundled with signal lines for electrically connecting the circuit board unit to the ultrasonic diagnostic apparatus body, and the cable is detachably connected to the ultrasonic diagnostic apparatus body by a connector.

  The transducer unit includes an ultrasonic transmitter / receiver such as a piezoelectric transducer, an acoustic lens for converging the ultrasonic wave, a backing material for absorbing unnecessary vibrations, and the like when the acoustic lens is used. It touches directly. In addition, the circuit board part is located between the transceiver and the ultrasonic diagnostic apparatus main body, and its function varies depending on the system configuration. Generally, it does not have a circuit, but has a circuit board. In many cases, a first-stage amplifier, an impedance matching circuit, a switch circuit, and the like are used. The vibrator part and the circuit board part are covered with an electromagnetic shield, and they are housed in an outer case (probe case).

  In the operating state of the ultrasonic diagnostic apparatus, the ultrasonic probe is also energized, and the ultrasonic waves generated by the vibrator unit are transmitted. However, not all of the ultrasonic waves are transmitted into the subject, and a part of the ultrasonic waves is absorbed in the transducer part and changed to heat. Also, the circuit board unit described above consumes electric power and becomes a heat source.

  By the way, as one of the methods for improving the S / N of the image of the ultrasonic diagnostic apparatus, a method of increasing the radiation ultrasonic power is known. The upper limit of the radiation ultrasonic power is restricted for safety, but there is a demand for obtaining an image with better S / N by increasing the power as much as possible within the range of safety. However, when the radiation ultrasonic power is increased, the heat generated in the ultrasonic probe is increased, and the surface temperature is increased. As described above, it is necessary to suppress the temperature rise of the ultrasonic probe so that the surface temperature does not exceed the safety regulation range.

  Therefore, by guiding the heat generated from the transducer part or circuit board part of the ultrasonic probe to the cable, the temperature rise on the surface in contact with the subject is suppressed and the transmission (radiation) ultrasonic power is increased. Some have been proposed (see, for example, Patent Document 1).

However, what is disclosed in Patent Document 1 assumes that the amount of heat generated in the circuit board unit is equal to or less than that of the vibrator unit, and the amount of heat generated in the circuit board unit is smaller than that of the vibrator unit. If it is large, it is difficult to obtain a sufficient effect. For example, assuming that the heat generation of the vibrator unit is about 0.5 W and the heat generation of the circuit board unit is about 3 W, if the thermal resistance between the vibrator unit and the circuit board unit is small, the heat of the circuit board unit Even if it is possible to dissipate heat by transmitting to the cable, the heat of the vibrator part is not dissipated from the cable, and conversely, the heat of the circuit board part is transmitted to the vibrator part, It will increase the temperature.
Japanese Patent Laid-Open No. 10-94540 (page 3-4, FIGS. 1 to 6)

  2. Description of the Related Art In recent years, two-dimensional array probes have been developed that arrange ultrasonic transmitters and receivers two-dimensionally and perform ultrasonic scanning three-dimensionally. In such a two-dimensional array probe, the number of ultrasonic transmitters / receivers is increased as compared with the conventional probe, and the number of channels is increased. Therefore, the scale of a built-in circuit board is increasing. If the scale of the built-in circuit increases, the power consumption increases and the heat generation increases, and the amount of heat generated by the entire probe increases. As described above, the surface temperature of the ultrasonic probe reaches a predetermined level. It becomes more difficult to avoid exceeding.

  Based on the above situation, the present invention has a structure in which each heat source is thermally separated when there are a plurality of heat sources such as a transducer part and a circuit board part in the ultrasonic probe. It is an object to provide an ultrasonic probe that can efficiently dissipate the heat of the laser and thereby ensure the necessary ultrasonic radiation power while preventing the surface temperature of the ultrasonic probe from exceeding a predetermined level. It was made as.

In order to solve the above-described problem, the ultrasonic diagnostic apparatus according to the first aspect of the present invention is a vibration that transmits and receives an ultrasonic signal to and from a subject in an ultrasonic probe connected to the main body of the ultrasonic diagnostic apparatus. Including a child part, a circuit board part connected to the vibrator part for performing electrical signal processing, a heat transfer member formed around the circuit board part and made of a material having a high heat transfer coefficient, and the heat transfer member An electromagnetic shielding member that covers the circuit board part and the vibrator part, and a signal line for bundling signal lines for exchanging electrical signals between the circuit board part and the ultrasonic diagnostic apparatus body. And a cable for connecting and dispersing the heat transfer member to the shield metal member of the cable or the electromagnetic shield member in the vicinity of the cable, and to transmit and dissipate heat generated in the circuit board portion. Provided spreader for each of the circuit board unit, characterized in that connected to the heat spreader to the heat transfer member.

According to a third aspect of the present invention, in the ultrasonic probe connected to the ultrasonic diagnostic apparatus main body, a transducer unit that transmits and receives an ultrasonic signal to and from the subject, and the transducer unit is connected to the transducer unit. A circuit board part for performing electrical signal processing; and a connection member for electrically connecting the circuit board part and the vibrator part, wherein the vibration is more effective than the connection part of the connection member to the circuit board part. Means for increasing the thermal resistance is provided on the side of the connecting portion with the child portion.

  The invention according to claim 3 is the ultrasonic probe according to claim 2, wherein the heat insulating member holds the circuit board part or a connection part between the circuit board part and the vibrator part. It comprises at least one part.

  According to a fourth aspect of the present invention, in the ultrasonic probe connected to the ultrasonic diagnostic apparatus main body, a transducer unit that transmits and receives an ultrasonic signal to and from a subject, and the transducer unit is connected to the transducer unit. A circuit board part for performing electrical signal processing; and an electromagnetic shield member for covering the circuit board part and the vibrator part; a part for covering the vibrator part and a part for covering the circuit board part of the electromagnetic shield member The boundary part which raises thermal resistance is provided between these.

  According to a fifth aspect of the present invention, in the ultrasonic probe connected to the ultrasonic diagnostic apparatus main body, a transducer unit that transmits and receives an ultrasonic signal to and from a subject, and the transducer unit is connected to the transducer unit. A circuit board portion for performing electrical signal processing; a heat transfer member formed of a material having a high heat transfer rate disposed around the circuit board portion; and the circuit board portion and the vibrator portion including the heat transfer member, An electromagnetic shield member that covers the circuit board, and a cable for bundling signal wires and covering the periphery thereof with a shielding material for transmitting and receiving electrical signals between the circuit board unit and the ultrasonic diagnostic apparatus main body, and the heat The transmission member is connected to the shield metal member of the cable or the electromagnetic shield member in the vicinity of the cable.

  According to a sixth aspect of the present invention, in the ultrasonic probe according to the fifth aspect, the heat transfer member has a structure for holding the circuit board portion.

  According to a seventh aspect of the present invention, in the ultrasonic probe according to any one of the fifth or sixth aspect, a heat spreader for transmitting and dispersing heat generated in the circuit board portion is provided in the circuit board portion. The heat spreader is provided every time and is connected to the heat transfer member.

  According to an eighth aspect of the present invention, in the ultrasonic probe connected to the ultrasonic diagnostic apparatus main body, a transducer unit that transmits and receives an ultrasonic signal to and from a subject, and the transducer unit is connected to the transducer unit. A circuit board unit that performs electrical signal processing, an electromagnetic shield member that covers the circuit board unit and the vibrator unit, and an electrical signal between the circuit board unit and the ultrasonic diagnostic apparatus main body, A cable in which signal wires are bundled and covered with a shielding metal member, and a signal wire of the cable, which is formed of a material having a high heat transfer coefficient, and whose one end is connected to the circuit board unit rather than a heat source in the circuit board unit And a heat conducting member having the other end connected to the shield metal member of the cable or the electromagnetic shield member in the vicinity of the cable.

  According to a ninth aspect of the present invention, in the ultrasonic probe connected to the ultrasonic diagnostic apparatus main body, a transducer unit that transmits and receives an ultrasonic signal to and from a subject, and the transducer unit is connected to the transducer unit. A circuit board part for performing electrical signal processing; and a connection member for electrically connecting the circuit board part and the vibrator part, wherein the vibration is more effective than the connection part of the connection member to the circuit board part. Means for increasing the thermal resistance is provided on the side of the connecting portion with the child portion.

  According to a tenth aspect of the present invention, in the ultrasonic probe according to the ninth aspect, the means for increasing the thermal resistance provided on the connecting member is provided on the back surface of the printed surface of the signal line of the connecting member. The formed ground electrode is made not to reach the circuit board part, or the connection of the appropriate intermediate part between the vibrator part side and the circuit board part side of the ground electrode is made sparse. It is characterized by being.

  As shown in the section of the means for solving the above problems, according to the invention of each claim described in the claims of the present invention, the following effects can be obtained.

  According to the first to third aspects of the present invention, the circuit board has a structure in which the thermal resistance toward the vibrator side is higher than the thermal resistance toward the cable side when viewed from the circuit board part. Heat is transferred more to the cable and the probe case near the cable than to the transducer side, and heat transfer from the circuit board to the transducer case and the probe case near the transducer can be made relatively small. Can be efficiently radiated from the surface of the probe case in the vicinity of the acoustic lens and the vibrator portion, and the temperature rise of the ultrasonic radiation surface can be suppressed. In addition, heat is diffused throughout the probe case, and temperature rise on the entire probe surface is suppressed. Accordingly, it is possible to ensure the necessary ultrasonic radiation power while preventing the surface temperature of the ultrasonic probe from exceeding a predetermined level.

  According to the fourth aspect of the present invention, it is possible to increase the thermal resistance of the path that transmits the shield case that occupies a large portion of the heat transfer path between the vibrator unit and the circuit board unit. Since the thermal resistance between the circuit board part and the circuit board part can be increased, a state in which the vibrator part and the circuit board part are thermally separated can be realized. Therefore, it becomes difficult for the heat of the circuit board part to be transmitted to the vibrator part, and the heat generated in the vibrator part is more efficiently radiated from the probe case around the surface of the acoustic lens and the electromagnetic shield member covering the vibrator part. I can do it.

  According to the invention described in claim 5, while increasing the thermal resistance between the vibrator part and the circuit board part, the circuit board part is directed toward the electromagnetic shielding member near the cable and the metal member for shielding the cable. Since the heat transfer plate is installed to reduce the thermal resistance, this reduces the thermal resistance between the circuit board and the cable or the shield case near the cable, and relatively increases the thermal resistance between the circuit board and the vibrator section. I can do it. Therefore, heat transfer from the circuit board part to the vibrator part side is difficult, and heat generated in the vibrator part is more efficiently radiated from the surface of the acoustic lens and the probe case around the electromagnetic shield member covering the vibrator part. The necessary ultrasonic radiation power can be ensured while the surface temperature of the ultrasonic probe does not exceed a predetermined level.

  According to the invention described in claim 6, since the heat transfer plate from the circuit board part to the cable or the vicinity of the cable and the support part of the circuit board are used, the number of probe components can be reduced. The contact of the heat transfer plate can be increased, and it becomes possible to further reduce the thermal resistance from the circuit board part to the electromagnetic shield member near the cable and the metal member for shielding the cable. Since the thermal resistance between them can be further reduced, the heat radiation of the vibrator unit can be efficiently performed.

  According to the seventh aspect of the present invention, the heat spreader facilitates the transfer of the heat of the heat source of the circuit board part to the heat transfer plate, and the thermal resistance from the circuit board part to the cable side is further reduced. The thermal resistance between the part and the circuit board part becomes high, and the temperature rise of the acoustic lens surface can be suppressed.

  According to the eighth aspect of the present invention, the heat transfer plate is provided for each circuit board part to further reduce the thermal resistance from the circuit board part to the cable side. The thermal resistance between the substrate parts becomes relatively high, heat transfer from the circuit board part to the vibrator part is reduced, and the heat radiation efficiency of each part can be increased.

  According to the ninth and tenth aspects of the present invention, it is possible to prevent the thermal resistance between the vibrator portion and the circuit board portion from being lowered while maintaining the noise removal effect.

  Hereinafter, various embodiments of the ultrasonic probe according to the present invention will be described in detail with reference to FIGS.

  1A and 1B are diagrams showing a schematic configuration of an ultrasonic probe according to a first embodiment of the present invention, where FIG. 1A is a horizontal cross-sectional view, and FIG. The cross-sectional view in the vertical direction, (c) schematically shows the cross-sectional view along the line CC-B in FIG.

  An ultrasonic probe is generally composed of a vibrator portion 1, a circuit board portion 2, a shield case 3, a probe case 4, a cable 5, and the like. The tip of the cable 5 is connected to a connector (not shown), and this connector is passed through this connector. And connected to an ultrasonic diagnostic apparatus main body (not shown).

  The transducer unit 1 includes a transmitter / receiver 1a such as a piezoelectric transducer for transmitting / receiving ultrasonic waves, an acoustic matching layer 1b for matching the acoustic impedance of the transmitter / receiver 1a with the acoustic impedance of a living body, and for focusing an ultrasonic beam. The acoustic lens 1c, a backing material 1d for absorbing unnecessary vibrations, and the like. The acoustic lens 1c, the backing material 1d, and the like that absorb part of the ultrasonic waves generated when transmitting the ultrasonic waves are the main heat sources.

  Circuit elements such as a reception amplifier 2a for amplifying a reception signal and a switch circuit 2b for switching transmission / reception are mounted on the circuit board unit 2, and these are generally integrated into an IC. The signal lines of these circuit board parts 2 are connected to the ultrasonic diagnostic apparatus main body via a cable 5. The cable 5 is formed by bundling a large number of signal lines 5a in order to exchange electrical signals between the circuit board unit 2 and the ultrasonic diagnostic apparatus main body, and the area around the bundled signal lines 5a is for electromagnetic shielding. The metal member 5b is covered with the insulator 5c.

  Further, heat transfer is performed so as to surround circuit elements such as the receiving amplifier 2a and the switch circuit 2b mounted on the circuit board unit 2 and the vicinity of the base of the cable 5 of the signal line 5a connected to the circuit board unit 2. A heat transfer plate 6 made of a material having a high rate is arranged. The heat transfer plate 6 is connected to a metal member 5b for electromagnetic shielding of the cable 5. Further, the vibrator unit 1 and the circuit board unit 2 are electrically connected by an FPC (flexible printed circuit board) 7 for signal transmission. This FPC7 is effective because it is very thin and has high thermal resistance. Instead, it uses a relay board (printed board such as ceramic or glass epoxy) as disclosed in JP-A-2001-292496. You may do it. However, when adopting the relay board structure, it is necessary to increase the thermal resistance by using thin pins.

  The vibrator unit 1 and the circuit board unit 2 are covered with a shield case 3 for electromagnetic shielding such as a metal case. That is, the shield case 3 is divided into a head shield part 3a covering the vibrator part 1 and a board shield part 3b covering the circuit board part 2 for the convenience of manufacturing. In addition, the board shield part 3 b is connected to the heat transfer plate 6 in the vicinity of the base of the cable 5. In addition, in the gap formed between the circuit board part 2 and the shield case 3, a highly heat-insulating holding member 9 such as a resin having a low heat transfer coefficient (that is, a high thermal resistance) is placed, and the circuit board part 2 And the shield case 3 are not directly connected. Further, the holding member 9 covers the periphery of the FPC 7 that connects the circuit board unit 2 and the vibrator unit 1 to reduce heat transfer from the circuit board unit 2 to the vibrator unit 1. As the holding member 9, air, polyurethane foam or the like is effective.

  Then, the acoustic lens 1c protrudes from one end, and the ultrasonic probe is formed by covering the whole with the probe case 4 so that the cable 5 is pulled out from the other end.

  Such an ultrasonic probe according to the first embodiment of the present invention has a higher thermal resistance between the transducer unit 1 and the circuit board unit 2. Furthermore, the heat transfer plate 6 is installed so as to reduce the thermal resistance from the circuit board part 2 toward the shield case 3 and the metal member 5b for electromagnetic shielding of the cable 5. As a result, the transfer of heat from the circuit board portion 2 as a heat source to the vibrator portion 1 can be reduced. Therefore, the heat generated from the circuit board portion 2 can be efficiently transmitted to the cable 5 side and can be radiated from the surface of the cable 5 or the probe case 4. In addition, heat transfer from the circuit board unit 2 to the transducer unit 1 side becomes difficult, and the heat generated in the transducer unit 1 is radiated from the surface of the acoustic lens 1c, thereby suppressing the temperature rise of the entire ultrasonic probe. can do. Accordingly, it is possible to ensure the necessary ultrasonic radiation power while preventing the surface temperature of the ultrasonic probe from exceeding a predetermined level.

  In addition, if the circuit board part 2 and the shield case 3 are filled with a resin having a high heat transfer coefficient (that is, a low thermal resistance), or the circuit board part 2 is surrounded so as to be surrounded by the shield case 3 In this case, even if the thermal resistance of the FPC 7 that directly connects the vibrator unit 1 and the circuit board unit 2 is high, the heat of the circuit board unit 2 is transmitted to the shield case 3 and this heat vibrates through the shield case 3. Since it becomes easy to be transmitted to the child part 1, the heat of the vibrator part 1 is not easily dissipated, and as a result, the surface temperature is increased. Therefore, the heat transfer coefficient of the holding member 9 should be as small as possible. .

  Various types of ultrasonic probes are prepared so that they can be used as appropriate according to the purpose of diagnosis such as the examination site, and the contents of the circuit board unit 2 vary depending on the type of the ultrasonic probe and are mounted. There are also various circuits. Further, in the two-dimensional array probe that has been developed in recent years, since the number of channels is increased, the scale is such that a plurality of layers of the circuit board unit 2 are provided as shown in the figure, and the heat generation of the circuit board unit 2 is caused by ultrasonic waves. The proportion that affects the surface temperature of the probe is increasing. And in the calorific value of the whole ultrasonic probe, the ratio of the circuit board part 2 with respect to the vibrator part 1 becomes high, and this ratio is expected to become higher and higher. With respect to such an ultrasonic probe, the present invention can exert a great effect in suppressing a temperature rise and ensuring a necessary ultrasonic radiation power.

  Next, a second embodiment of the ultrasonic probe according to the present invention will be described with reference to FIG. 2A and 2B show a schematic configuration of the second embodiment, where FIG. 2A is a horizontal sectional view, FIG. 2B is a vertical sectional view taken along line B-B of FIG. 2A, and FIG. ) Is a schematic cross-sectional view taken along the line CC- 註. 2 that are the same as those in FIG. 1 are denoted by the same reference numerals, and description thereof is omitted.

  In the second embodiment, most of the holding member 9 described as the first embodiment is air, and at least a part of the periphery of the connection portion between the circuit board portion 2 and the FPC 7 is covered with a holding member 9a made of a highly heat-insulating material. It is a thing. That is, as the holding member 9a, for example, Teflon (registered trademark) resin, plastic, or the like is used. The holding member 9a covers only a part of the circuit board unit 2 and holds the circuit board unit 2. 2 and the shield case 3 are not directly connected. Therefore, except for the portion covered with the holding member 9a, the space formed between the vibrator portion 1 and the head shield portion 3a and between the circuit board portion 2 and the substrate shield portion 3b is covered with air. It becomes the composition. In the second embodiment, similarly to the first embodiment, a heat transfer plate 6 for transferring heat from the circuit board portion 2 to the metal member 5b for electromagnetic shielding of the cable 5 and the shield case 3 is provided.

  Thus, in Example 2, as a holding structure of the circuit board part 2, a part of the circuit board part 2 or a connection part between the vibrator part 1 and the circuit board part 2 is held by the holding member 9a having high heat insulation. The space formed between the vibrator part 1 and the circuit board part 2 and the shield case 3 except for the part covered with the holding member 9a is covered with air. The thermal resistance between the circuit board unit 2 can be further increased.

  Therefore, the ultrasonic probe according to the second embodiment can also reduce the heat transfer from the circuit board unit 2 as the heat generation source to the vibrator unit 1, and the heat generated from the circuit board unit 2 can be reduced to the cable 5 side. Can be efficiently transmitted and heat can be dissipated from the surface of the cable 5 or the probe case 4. In addition, heat transfer from the circuit board unit 2 to the transducer unit 1 side becomes difficult, and the heat generated in the transducer unit 1 is radiated from the surface of the acoustic lens 1c, thereby suppressing the temperature rise of the entire ultrasonic probe. can do. Accordingly, it is possible to ensure the necessary ultrasonic radiation power while preventing the surface temperature of the ultrasonic probe from exceeding a predetermined level. Therefore,

  Next, an ultrasonic probe according to a second embodiment of the present invention will be described with reference to FIG. FIG. 3: has shown schematic structure of Example 3, (a) is horizontal direction sectional drawing, (b) is vertical direction sectional drawing in alignment with BB | (C) And (d) is explanatory drawing to which the D section in (a) and (b) was expanded. In FIG. 3, the same parts as those in FIGS. 1 and 2 are denoted by the same reference numerals, and the description thereof is omitted.

  In the third embodiment, a shield case 3 that radiates heat from the vibrator unit 1 (that is, the head shield portion 3a), and a shield case 3 that radiates heat from the circuit board portion 2 (that is, the substrate shield portion 3b) Is structured to be thermally separated.

  That is, the head shield part 3a covering the vibrator part 1 also serves as a heat transfer plate for transferring the heat generated in the vibrator part 1 to the probe case 4 and dispersing it. Conventionally, the head shield portion 3a and the substrate shield portion 3b are firmly connected both electrically and mechanically. In this embodiment, the connection between the head shield portion 3a and the substrate shield portion 3b is established. For example, a connection structure as shown in FIGS. 3C and 3D is employed so that the electrical connection is as strong as before and the thermal resistance is increased mechanically.

  Here, FIG. 3C shows the head shield portion 3a and the substrate shield portion 3b connected by a thin wire 3c having a good electrical conductivity such as copper, and FIG. A thin mesh-like material 3d having good electrical conductivity is connected. The pitch and gaps of the thin wires 3c and the mesh-like material 3d must be sufficiently smaller than the wavelength in the operating frequency region so that they sufficiently function as an electromagnetic shield. For example, the mesh pitch is 1 mm, The line width is set to 0.1 mm. The vibrator unit 1 and the circuit board unit 2 are connected to each other by a low heat transfer material as in the first embodiment, or the surroundings are covered with a heat insulating material 10 so as to be thermally separated from each other. ing. Further, the space between the shield case 3 b around the circuit board portion 2 is constituted by a holding member 9 made of a material having a high thermal conductivity with respect to the heat insulating material 10.

  As described above, according to the third embodiment, the degree of thermal separation between the vibrator unit 1 and the circuit board unit 2 as a heat source can be further increased. The heat generated in the vibrator unit 1 is dissipated from the surface of the acoustic lens 1c and the probe case 4 around the head shield part 3a, and the heat of the circuit board unit 2 is difficult to be transmitted to the vibrator unit 1. The heat generated from the portion 2 is efficiently transmitted to the cable 5 side, and can be efficiently radiated from the surface of the cable 5 or the probe case 4. Accordingly, it is possible to ensure the necessary ultrasonic radiation power while preventing the surface temperature of the ultrasonic probe from exceeding a predetermined level.

  Next, a fourth embodiment of the ultrasonic probe according to the present invention will be described with reference to FIG. 4A and 4B show a schematic configuration of the fourth embodiment, where FIG. 4A is a horizontal sectional view, FIG. 4B is a vertical sectional view taken along the line BB 註 of FIG. 4A, and FIG. ) Is a schematic cross-sectional view taken along the line CC- 註. In FIG. 4, the same reference numerals are given to the same parts as those in FIGS. 1 to 3, and the description thereof is omitted.

  The fourth embodiment aims to relatively increase the thermal resistance between the vibrator part 1 and the circuit board part 2 by increasing the heat radiation efficiency from the circuit board part 2.

That is, in the fourth embodiment, circuit elements such as the reception amplifier 2a and the switch circuit 2b mounted on the circuit board unit 2 and the vicinity of the base of the cable 5 of the signal line 5a connected to the circuit board unit 2 are surrounded. As shown in FIG. 4 (c), for example, a copper plate is used as the heat transfer plate 6 disposed in the shape of the heat transfer plate 6 so that the side surface of the heat transfer plate 6 is bent into a bellows shape. The circuit board portions 2 are held at regular intervals by fitting and fixing the both ends of the substrate portion 2. However, it is preferable that the vicinity of the side surface of the circuit board portion 2 is electrically insulated from the electric circuit. Other configurations are the same as in the first embodiment. The board shield part 3b covering the circuit board part 2 is connected to the heat transfer plate 6 near the base of the cable 5, and the heat transfer board 6 is a metal member for electromagnetic shielding of the cable 5. 5b is connected. Further, the periphery of the FPC 7 that connects between the circuit board unit 2 and the vibrator unit 1 is covered with a heat insulating material 10 to reduce heat transfer from the circuit board 2 to the vibrator unit 1.

  According to the fourth embodiment configured as described above, the heat transfer plate 6 made of copper plate is in contact with the circuit board portion 2 with its side face sandwiched, so that heat is easily transferred, and the heat generated in the circuit board portion 2 is transferred to the heat transfer plate 6. It is possible to efficiently transmit through the plate 6 to the vicinity of the base of the cable 5 of the board shield part 3b. That is, the thermal resistance between the vibrator part 1 and the circuit board part 2 is increased, and the thermal resistance from the circuit board part 2 toward the shield member 3 and the metal member 5b for electromagnetic shielding of the cable 5 is further increased. Accordingly, the thermal resistance between the vibrator unit 1 and the circuit board unit 2 can be relatively further reduced. Therefore, the heat radiation of the vibrator unit 1 is performed from the surface of the acoustic lens 1c and the surrounding probe case 4 via the head shield part 3a, and the heat radiation of the circuit board part 2 is performed from the surrounding probe case 4 via the board shield part 3b. And it will mainly be performed from the surface of the cable 5, and the heat radiation of the vibrator part 1 can be efficiently performed.

  The connection between the head shield part 3a covering the vibrator part 1 and the board shield part 3b covering the circuit board part 2 is electrically connected by the thin wire 3c and the mesh material 3d as in the third embodiment. Is firmly connected and mechanically connected so as to increase the thermal resistance, the degree of thermal separation between the vibrator part 1 and the circuit board part 2 as a heat source can be further increased. . Accordingly, it is possible to ensure the necessary ultrasonic radiation power while preventing the surface temperature of the ultrasonic probe from exceeding a predetermined level.

  Next, an ultrasonic probe according to a fifth embodiment of the present invention will be described with reference to FIG. FIG. 5: has shown schematic structure of Example 5, (a) is horizontal direction sectional drawing, (b) is vertical direction sectional drawing which follows BB 註 -no of (a), (c) is (b) ) Is a schematic cross-sectional view taken along the line CC- 註. In FIG. 5, the same reference numerals are given to the same parts as those in FIGS. 1 to 4, and the description thereof is omitted.

  The fifth embodiment also aims to relatively increase the thermal resistance between the vibrator unit 1 and the circuit board unit 2 by increasing the heat dissipation efficiency from the circuit board unit 2.

  The heat source in the circuit board unit 2 is mainly an IC such as a reception amplifier 2a and a switch circuit 2b mounted on the circuit board unit 2, and the heat generated in the IC propagates through the board and is transmitted to the surroundings. The heat transfer coefficient in the substrate is almost constant in any direction. Therefore, in Example 5, the heat spreader 20 is added so as to sandwich both surfaces of the circuit board unit 2 as well shown in FIGS. 5 (b) and 5 (c). This heat spreader 20 is made of a material having good thermal conductivity such as a copper plate, and in the same manner as in the fourth embodiment, the heat spreader 20 is connected to the side surface of the heat transfer plate 6 in which both ends of each circuit board portion 2 are bent in a bellows shape. Both end surfaces of the heat transfer plate 6 are also connected to the side surfaces of the heat transfer plate 6.

  Accordingly, the heat of the IC is largely transmitted to the signal line 5a side in the substrate, and the thermal resistance from the circuit board portion 2 to the signal line 5a or the shield case 8 near the cable 5 can be extremely reduced. The heat generated by the IC propagates through the substrate and is transmitted from the circuit board unit 2 to the vibrator unit 1 via the FPC 7, but the circuit board unit has a lower thermal resistance from the circuit board unit 2 to the cable 5 side. The heat generated in 2 is mainly radiated from the surrounding probe case 4 through the substrate shield part 3b, heat transfer to the vibrator part 1 is reduced, and the heat radiation of the vibrator part 1 is reduced to the acoustic lens 1c. Or it can carry out efficiently from the probe case 4 of the circumference | surroundings through the head shield part 3a. Accordingly, it is possible to ensure the necessary ultrasonic radiation power while preventing the surface temperature of the ultrasonic probe from exceeding a predetermined level.

  The connection between the head shield part 3a covering the vibrator part 1 and the board shield part 3b covering the circuit board part 2 is electrically connected by the thin wire 3c and the mesh material 3d as in the third embodiment. Needless to say, may be firmly connected and mechanically connected to increase the thermal resistance.

  Next, a sixth embodiment of the ultrasonic probe according to the present invention will be described with reference to FIGS. 6A is a horizontal cross-sectional view, and FIG. 6B is a vertical cross-sectional view taken along the line B-B of FIG. 6A. FIG. Is a cross-sectional view in the vertical direction, and (b) schematically shows a cross-sectional view taken along the line CC-B in (a). 6 and 7, the same reference numerals are given to the same parts as those in FIGS. 1 to 5, and the description thereof is omitted.

  Also in Example 6, the heat dissipation efficiency from the circuit board part 2 is increased to relatively increase the thermal resistance between the vibrator part 1 and the circuit board part 2 as a heat source. Each of the circuit board portions 2 is provided with a heat transfer plate 61 individually.

  That is, the heat transfer plate 61 is formed of a plate having a good heat transfer coefficient such as copper like the heat transfer plate 6, and the one shown in FIG. 6 is provided individually for each of the plurality of circuit board portions 2. One of the heat transfer plates 61 is connected to the connection portion of the signal line 5 a of the circuit board portion 2, and the other is connected to the electromagnetic shielding metal member 5 b of the cable 5. In the case shown in FIG. 7, one end of the heat transfer plate 61 is connected to the connection portion of the signal line 5 a of the circuit board portion 2, and the other end is connected to the shield case 3 near the base of the cable 5. Is.

  The connection between the head shield part 3a covering the vibrator part 1 and the board shield part 3b covering the circuit board part 2 is electrically connected by the thin wire 3c and the mesh material 3d as in the second embodiment. Needless to say, may be firmly connected and mechanically connected to increase the thermal resistance.

  Even in this case, the thermal resistance from the circuit board portion 2 to the cable 5 can be reduced. Therefore, heat generated from the circuit board portion 2 can be efficiently transmitted to the cable 5 side and can be radiated from the surface of the cable 5 or the probe case 4 so that the surface temperature of the ultrasonic probe does not exceed a predetermined level. In addition, it is possible to secure the necessary ultrasonic radiation power.

  Next, a seventh embodiment of the ultrasonic probe according to the present invention will be described with reference to FIGS. In FIGS. 8 and 9, (a) schematically shows a plan view and (b) schematically shows a side view, respectively. Also in these drawings, the same reference numerals are given to the same portions as those in FIGS.

  In the first embodiment already described, the vibrator unit 1 and the circuit board unit 2 are electrically connected by the FPC 7 for signal transmission. This FPC 7 is very thin and has high thermal resistance, so that it is effective. Explained. However, the FPC 7 generally has a ground electrode attached to one side behind the printed side of the signal line. This is for noise removal, but from the viewpoint of the present invention, it becomes a factor for reducing the thermal resistance between the vibrator portion 1 and the circuit board portion 2. Therefore, in the seventh embodiment, the ground electrode formed on the back side of the printed surface of the signal line of the FPC 7 is not attached to the entire surface, but is halfway, or a sparse portion is formed in the intermediate portion. This prevents the thermal resistance from decreasing.

  That is, the one shown in FIG. 8 is formed on the back surface of the FPC 7 in which the signal line 7a for transmitting the signal between the vibrator portion 1 and the circuit board portion 2 is printed on one surface. The ground electrode 7b (shown in mesh form in FIG. 8A) is cut before the connection pad 7c connecting the signal line 7a so as not to reach the circuit board 2 It is. With this configuration, it is possible to prevent the thermal resistance between the vibrator unit 1 and the circuit board unit 2 from being lowered while maintaining the noise removal effect.

  On the other hand, what is shown in FIG. 9 is that the FPC 7 has the vibrator portion 1 on the ground electrode 7b (shown in mesh form in FIG. 9A) formed in a planar shape on the back surface thereof. A portion 7bo is provided in an appropriate intermediate portion between the circuit board portion 2 side and the circuit board portion 2 side so as to make the connection therebetween sparse. As a result, the thermal resistance between the vibrator part 1 and the circuit board part 2 is reduced while avoiding an extra potential gradient between the circuit board part 2 side and the vibrator part 1 side. Can be prevented.

  As described above in detail, according to the present invention, the thermal resistance between the vibrator part 1 and the circuit board part 2 is increased, and the vibrator part 1 and the circuit board part 2 as heat sources are made as much as possible. By separating, it is possible to more efficiently dissipate heat on the vibrator unit 1 side, and to keep the surface temperature of the vibrator unit 1 lower. Further, by increasing the thermal resistance between the head shield part 3a on the vibrator part 1 side and the board shield part 3b on the circuit board part 2 side, the thermal resistance between the vibrator part 1 and the circuit board part 2 can be further increased. Since the heat radiation on the vibrator unit 1 side can be performed more efficiently, the temperature of the surface of the vibrator unit 1 can be further suppressed. Further, the heat transfer plate 6 as a heat dissipation structure on the circuit board part 2 side is used as a board support material and a heat dissipation material, or the heat spreader 20 is provided so as to sandwich the circuit board part 2, the circuit board part 2 and the cable. 5, the heat transfer structure of the metal member 5b for electromagnetic shielding allows the heat to be dissipated further to the cable 5 side, so that heat can be radiated more efficiently on the vibrator unit 1 side, and the temperature of the surface of the vibrator unit 1 can be increased. Can be kept lower. Therefore, an ultrasonic probe capable of ensuring the necessary ultrasonic radiation power while preventing the surface temperature of the ultrasonic probe from exceeding a predetermined level is provided.

It is the figure which showed schematic structure of Example 1 of the ultrasonic probe which concerns on this invention. Example 1 It is the figure which showed schematic structure of Example 2 of the ultrasonic probe which concerns on this invention. (Example 2) It is the figure which showed schematic structure of Example 3 of the ultrasonic probe which concerns on this invention. (Example 3) It is the figure which showed schematic structure of Example 4 of the ultrasonic probe which concerns on this invention. Example 4 It is the figure which showed schematic structure of Example 5 of the ultrasonic probe which concerns on this invention. (Example 5) It is the figure which showed schematic structure of Example 5 of the ultrasonic probe which concerns on this invention. (Example 6) It is the figure which showed schematic structure of the other embodiment of Example 6 of the ultrasonic probe which concerns on this invention. (Example 6) It is the figure which showed schematic structure of Example 7 of the ultrasonic probe which concerns on this invention. (Example 7) It is the figure which showed schematic structure of the other embodiment of Example 7 of the ultrasonic probe which concerns on this invention. (Example 7)

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Vibrator part 1c Acoustic lens 2 Circuit board part 2a Reception amplifier 2b Switch circuit 3 Shield case
3a head shield part 3b board shield part 4 probe case 5 cable 5a signal line 5b metal member for electromagnetic shield 6 heat transfer plate 7 FPC
9 holding member 9a holding member 10 heat insulating material

Claims (4)

In the ultrasonic probe connected to the ultrasonic diagnostic apparatus body,
A transducer unit that transmits and receives an ultrasonic signal to and from a subject;
A circuit board unit connected to the vibrator unit for electrical signal processing;
A heat transfer member disposed around the circuit board portion and formed of a material having a high heat transfer rate;
An electromagnetic shielding member that covers the circuit board part and the vibrator part including the heat transfer member;
A cable for bundling signal wires and covering the periphery thereof with a shielding material for transmitting and receiving electrical signals between the circuit board unit and the ultrasonic diagnostic apparatus body;
While connecting the heat transfer member to the shield metal member of the cable or the electromagnetic shield member in the vicinity of the cable,
An ultrasonic probe characterized in that a heat spreader for transmitting and dispersing heat generated in the circuit board portion is provided for each circuit board portion, and the heat spreader is connected to the heat transfer member. The ultrasonic probe according to claim 1, wherein the heat transfer member has a structure for holding the circuit board portion. In the ultrasonic probe connected to the ultrasonic diagnostic apparatus body,
A transducer unit that transmits and receives an ultrasonic signal to and from a subject;
A circuit board unit connected to the vibrator unit for electrical signal processing;
A connecting member for electrically connecting the circuit board part and the vibrator part, and a heat-fed member is connected to the vibrator part from the connecting part of the connecting member to the circuit board part. An ultrasonic probe comprising means for increasing resistance. The means for increasing the thermal resistance provided in the connecting member prevents the ground electrode formed on the back surface of the signal line printed on the connecting member from reaching the circuit board part, or The ultrasonic probe according to claim 3, wherein an appropriate intermediate portion of the ground electrode on the vibrator portion side and the circuit board portion side is loosely connected.

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