JP4607294B2 - Non-contact IC card and manufacturing method thereof - Google Patents

Description

【００６８】
なお、上記の式において、εo は真空の誘電率、εは比誘電率、μo は真空の透磁率、μは比透磁率である。
【００６９】
また、導体抵抗（ＣｕＲ）は、
【００７０】
直径０．０４＝１４．１４０〜１５．６７０／ｍ
【００７１】
直径０．０６＝６．２８７〜６．９６６／ｍ
【００７２】
直径０．０８＝３．５００〜３．７８８／ｍ
【００７３】
直径０．１０＝２．２４０〜２．３８１／ｍ
【００７４】
かかる式でも、判ることは、Ｃpc、すなわち、アンテナコイルの線間容量（磁気コイルの各巻回部の間隔）の変動量が、ｆ_MO、すなわち、アンテナコイルの共振周波数の変動量に影響することであり、Ｃpcが一定の方がｆ_MOを安定化する点で良好である。
【００７５】
なお、非接触ＩＣカードを製造するに当たっては、次のようにしても良い。
【００７６】
すなわち、図５は、大きい１枚のフィルムから多数枚のフィルムを打ち抜いたり、切り抜いたり等して得て、多数枚（３０枚）の各フィルムから夫々巻線コイルと回路基板とを含んで構成された非接触ＩＣカードを製造したものである。
【００７７】
なお、この図５において、各横列におけるＳは巻線コイルの巻始、Ｅはその巻終である。
【００７８】
また、図６に示すように、２枚のフィルム１２Ａ、１２Ｂを、両方共アンテナコイル１１部分を覆う粘着剤を塗布したテープ１８で構成するか、若しくは２枚のフィルム１２Ａ、１２Ｂの内、何れか一方をアンテナコイル１１部分を覆う粘着剤を塗布したテープ１８で構成するようにしても良い。
【００７９】
かかる構成によれば、従来は、ＩＣチップモジュール取り付け用の孔をフィルムに形成していたが、孔あけの必要なくなり工数と材料費の削減が図られる。
【００８０】
また、粘着剤を塗布したテープ１８により、一方のフィルムに他方のフィルムを熱融着により貼り付ける工程が簡略され工数低減が図られる。
【発明の効果】
以上説明したように、請求項１に係る発明の非接触ＩＣカード及び請求項５に係る発明の非接触ＩＣカードの製造方法によれば、一方のフィルムに差し込まれて、金属細線を位置決めするべく該金属細線が順次掛けられる針部材であって、巻線コイルと回路基板とを２枚のフィルム間に封止した後に、前記一方のフィルムから退去される構成である多数の針部材は、一方のフィルムの各角部において、夫々内側が開いた略Ｖ字形をなすように夫々所定の間隔で並び、かつ、隣り合う略Ｖ字形の対応する各針部材同士に掛けられる金属細線同士が、互いに所定の間隔を有するように各略Ｖ字形の配置を定めてあるため、巻線コイルの各巻回部における金属細線の間隔が製品毎に一定となり、変動する虞がなく、この結果、製品毎の巻線コイルの共振周波数の変動が抑えられ、製品を安定化することができ、しかも、巻線コイルが正確に形成でき、ひいては、非接触ＩＣカードの製造性を向上することができる。
【００８１】
請求項２に係る発明によれば、巻線コイルを、略四角形に簡単、かつ、正確に形成できる。
【００８２】
請求項３及び４に係る発明によれば、２枚のフィルム又はその何れか一方を、アンテナコイル部分を覆う粘着剤を塗布したテープで構成したので、従来は、ＩＣチップモジュール取り付け用の孔をフィルムに形成していた、孔あけが必要なくなり工数と材料費の削減が図られる。
【００８３】
また、粘着剤を塗布したテープにより、従来の一方のフィルムに他方のフィルムを熱融着により貼り付ける工程が簡略され工数低減が図られる。
【００８７】
請求項６に係る発明によれば、大きいフィルムから簡単な工程で多数の非接触ＩＣカードを製造することができる。
【図面の簡単な説明】
【図１】 本発明に係る非接触ＩＣカードの一実施形態を示す平面図
【図２】 同上の実施形態の針部材の配置例を示す平面図
【図３】 同上の実施形態の非接触ＩＣカードの等価回路図
【図４】 同上の実施形態の非接触ＩＣカードの製造方法を実施する装置の概略図
【図５】 同上の実施形態の非接触ＩＣカードの製造方法の他の例を示す平面図
【図６】 同上の実施形態の非接触ＩＣカードの製造方法の他の一実施形態を示す平面図
【図７】 従来の非接触ＩＣカードの斜視図 [0001]
BACKGROUND OF THE INVENTION
The present invention relates to a non-contact IC card used for various cards, product tags, labels, and the like and a method for manufacturing the same, and more particularly to a metal fine wire positioning structure for forming an antenna coil and a method therefor.
[0002]
[Prior art]
As this type of non-contact IC card, as shown in FIG. 7 , a circuit board 1 on which electronic components are mounted, and connected to the circuit board 1 to transmit and receive information via a predetermined medium such as electromagnetic coupling and radio waves An antenna coil 2 that is sealed with a coating resin 3 is known (see Japanese Patent Application Laid-Open Nos. 9-1969 and 9-1970).
[0003]
In the case of using a winding coil in which a thin metal wire such as a copper wire having a circular or rectangular cross section is used as the antenna coil 2 among the components of such a non-contact IC card, conventionally, A wire coil is formed on one of the two coated resin films, and the wound coil and the circuit board are attached to the one coated resin film by attaching the other coated resin film to the wound coil. The circuit board is sealed with a coating resin.
[0004]
However, such a non-contact IC card has a structure in which a winding coil is formed by winding a thin metal wire such as a copper wire in a spiral shape on a coated resin film. It is difficult and it is difficult to maintain the shape of the wound winding coil, and it is difficult to accurately form the winding coil into a regular shape such as a square shape. It was extremely difficult to form a wound coil.
[0005]
In order to solve such a problem, the coating resin is composed of two films made of heat-sealing resin that are heat-sealed to each other, while the antenna coil is positioned on one film by positioning the fine metal wires with positioning means. There has been proposed a non-contact IC card comprising a winding coil wound in a predetermined shape and sealed between the winding coil, the circuit board, and two films (Japanese Patent Laid-Open No. 11). -115360).
[0006]
[Problems to be solved by the invention]
However, in a conventional non-contact IC card, a plurality of needle members as positioning means are inserted into one of two films, and a thin metal wire is sequentially hung on each needle member on one film to form a predetermined spiral shape. Winding needle coil is formed, and the needle member is merely located at the direction changing portion of the winding coil, i.e., at the corner portion, so in each winding portion of the winding coil The interval between the fine metal wires is not constant depending on the product, and may vary.
[0007]
As will be described later, the fluctuation of the distance between the thin metal wires in each winding portion of the winding coil causes the line capacitance Cpc (pF) of the winding coil to fluctuate and affects the fluctuation amount of the resonance frequency _fMO as a module.
[0008]
For example, when the fine metal wires are in close contact with each other, the line capacity of the winding coil increases, and this line capacity varies greatly depending on the insulation film thickness, wire diameter, and winding state. The width of the resonance frequency is widened.
[0009]
The present invention has been made in order to solve the above-described problems. In particular, the antenna coil is formed from a winding coil in which a thin metal wire is positioned by a needle member in one film and wound in a predetermined shape. It is an object of the present invention to provide a non-contact IC card and a method for manufacturing the same, in which the resonance frequency as a module is stabilized by the arrangement structure of the needle members.
[0010]
[Means for Solving the Problems]
For this reason, the non-contact IC card of the invention according to claim 1 is configured such that a circuit board on which electronic components are mounted and an antenna coil connected to the circuit board and transmitting and receiving information via a predetermined medium are mutually heated. a configuration which is adapted to seal the two films as the coating resin composed of fused by heat fusion resin, the antenna coil, the polygon is positioned by the needle member metal wires in one film Alternatively, in a non-contact IC card constituted by a winding coil spirally wound in a similar form, and the winding coil and the circuit board are sealed between the two films, the needle member is: one inserted into the film thin metal wires are sequentially multiplied et al in and after sealing and winding coils and the circuit board between the two films, in the configuration of the be retired from one film Write, needle member, at each corner of said one film, each parallel a number predetermined intervals such that the inner forms the substantially V-shaped open beauty and substantially adjacent V-shaped each corresponding needle thin metal wires each other applied to each other, characterized in that it is a configuration that defines one another arrangement of the generally V-shaped so as to have a predetermined interval.
[0011]
The invention according to claim 2 is characterized in that the winding coil is substantially rectangular.
[0012]
The invention according to claim 3 is characterized in that the two films are made of a tape coated with an adhesive covering the antenna coil portion.
[0013]
The invention according to claim 4 is characterized in that either one of the two films is composed of a tape coated with an adhesive covering the antenna coil portion.
[0015]
Method of manufacturing a non-contact IC card of the invention according to claim 5, a circuit board having electronic components mounted, is connected to the circuit board, and an antenna coil for transmitting and receiving information through a predetermined medium, the heat from each other A non-contact IC card manufacturing method in which sealing is performed by two films as a coating resin composed of a heat-sealing resin to be fused , and a drive unit that is reciprocally driven to slide in the vertical and horizontal directions, respectively. A plurality of needle members that are arranged and attached in a predetermined shape on the upper surface of each of the two members and extend upward, respectively, the lower side of the upper and lower two films disposed above the driving unit. in the positions corresponding to corner portions of the film, each parallel with each predetermined interval so as inside a substantially V-shaped open beauty, and the line between connecting corresponding ones between the substantially adjacent V-shaped, Have a certain distance from each other To a large number of needle member which defines the arrangement of Kakuryaku V-Te, said moved upward by the vertical slide drive unit, and the step of inserting the film of the lower, the lower side of the film on the odor, metal forming sequentially over the polygon or the winding coil wound spirally in a shape similar thereto by Rukoto a fine line to each needle member protruding from the film of the lower side, the drive and the lower side of the film And moving the portion of the lower film where the winding coil is formed by a predetermined length while holding the winding coil on each needle member, and the lower side at a mobile position of the part winding coil is formed of a film, the upper film to the film of the lower side adhered by thermal fusion, between the said circuit board and said winding coil the two films a step of sealing the said winding co After the sealing of the cable and the circuit board is completed, each needle member is moved down by sliding in the longitudinal direction of the drive unit, and is retracted from the lower film, and each needle member is moved to the drive unit. And moving back to the position where it is inserted into the lower film by sliding in the horizontal direction .
[0017]
The invention according to claim 6 obtains a large number of films from a single large film, and manufactures a non-contact IC card including a winding coil and a circuit board from each of the large number of films. It is characterized by.
[0018]
Next, the operation of the invention will be described. According to the non-contact IC card of the invention according to claim 1 and the non-contact IC card manufacturing method of the invention according to claim 5, the metal is inserted into one of the films. A needle member on which the thin metal wires are sequentially hung to position the thin wire, and the winding coil and the circuit board are sealed between the two films, and then are removed from the one film. Metals that are arranged at predetermined intervals so as to form a substantially V shape with the inner side opened at each corner of one film, and that are hung between adjacent needle members that are substantially V-shaped adjacent to each other. thin lines with each other, it is so arranged define one another arrangement of the generally V-shaped so as to have a predetermined interval, the interval of metal thin wires in each winding of the winding coil is constant for each product, there is no possibility to vary, Result of variations in the resonant frequency of winding coils for each product is suppressed et al is the product is stabilized, moreover, the winding coil can be accurately formed, it is possible to turn, improving the productivity of the non-contact IC card .
[0019]
In the invention according to claim 2, the winding coil is formed in a substantially square shape easily and accurately.
[0020]
In the inventions according to claims 3 and 4, since the two films or any one of them is composed of a tape coated with an adhesive covering the antenna coil portion, conventionally, a hole for mounting an IC chip module is a film. However, it is not necessary to drill holes, and man-hours and material costs can be reduced.
[0023]
In the invention according to claim 6 , a large number of non-contact IC cards are manufactured from a large film by a simple process.
[0024]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
[0025]
FIG. 1 shows an embodiment of an antenna coil in a non-contact IC card according to the present invention.
[0026]
This non-contact IC card includes a circuit board (not shown) on which electronic components are mounted and an antenna coil 11 connected to the circuit board and transmitting and receiving information via a predetermined medium such as electromagnetic coupling and radio waves. 12 is configured to be sealed.
[0027]
Here, the coating resin 12 is composed of two films made of a heat-sealing resin, for example, polyester, which are heat-sealed to each other.
[0028]
In one film, the antenna coil 11 is formed by positioning a copper wire 14A as a thin metal wire with a large number of needle members 13 into a polygonal shape or a similar shape, in this embodiment, a substantially rectangular spiral (parallel). The winding coil 14 and the circuit board are sealed between two films.
[0029]
In FIG. 1, S is the winding start of the winding coil 14, and E is the winding end.
[0030]
Next, FIG. 4 shows an example of a manufacturing apparatus that executes the method of manufacturing a non-contact IC card according to the present invention. That is, the lower film 12A of the two lower and upper films 12A and 12B is wound around the winding portion 15, and is pulled out from the winding portion 15 in the lateral direction indicated by the arrow in FIG. The film slides and is slid rightward in the figure by a film slide means (not shown). The upper film 12B is wound around a winding portion 16 disposed at a position offset from the winding portion 15 by a predetermined distance in the lateral direction above the winding portion 15. 4 is pulled out in the lateral direction indicated by the arrow in FIG. 4 which is the same as the direction in which the lower film 12A extends from the winding unit 16, and is slid rightward in the drawing by a film slide means (not shown).
[0031]
At the lower position in the vicinity of the winding portion 15 of the lower film 12A, there is disposed a driving portion 17 that reciprocally slides in the vertical direction and the horizontal direction as indicated by arrows in FIG. A large number of needle members 13 extending in the upward direction are attached to the upper surface of the drive unit 17. In this case, as shown in FIGS. 1 and 2, the multiple needle members 13 are substantially V-shaped with their inner sides opened at positions corresponding to the corners of the lower film 12A (see FIG. 4). As described above, the substantially V-shaped arrangement is determined such that the copper wires 14A that are arranged at predetermined intervals and are hung between the corresponding substantially V-shaped adjacent needle members 13 have predetermined intervals. Yes.
[0032]
For example, the substantially V-shaped angle θ is 70 degrees.
[0034]
Based on the operation of the manufacturing apparatus having such a configuration, a method for manufacturing a non-contact IC card according to the present invention will be described. First, each needle member 13 is moved upward by an upward slide drive as indicated by an arrow on the upper side of the drive unit 17 at the original position indicated by A in FIG. 4 and inserted into the lower film 12A. (Step of inserting a needle member in the method of manufacturing a non-contact IC card of the present invention).
[0035]
Next, on the lower film 12A, a copper wire 14A is sequentially hung on each needle member 13 protruding from the lower film 12A to be wound into a spiral shape of a predetermined shape (in this embodiment, a substantially rectangular shape). The winding coil 14 is formed (the step of forming the winding coil in the method of manufacturing a non-contact IC card of the present invention).
[0036]
Thereafter, the lower film 12A and the drive unit 17 are each slid rightward in FIG. 4, and the winding coil of the lower film 12A is formed while holding the winding coil 14 on each needle member 13. 4 is moved to a position indicated by B in FIG. 4 (in the method for manufacturing a non-contact IC card according to the present invention, the step in which the portion where the winding coil is formed is moved by a predetermined length. ).
[0037]
Next, the upper film 12B is bonded to the lower film 12A by heat-sealing at the movement position (position indicated by B in FIG. 4) of the portion of the lower film 12A where the winding coil 14 is formed. Then, the winding coil 14 and the circuit board are sealed between the two films 12A and 12B (the winding coil and the circuit board in the non-contact IC card manufacturing method of the present invention are two films). Sealing in between).
[0038]
After the sealing of the winding coil 14 and the circuit board is completed in this way, each needle member 13 is moved downward by the downward sliding drive as shown by the arrow on the lower side of FIG. Then, the film is moved away from the lower film 12A (the step of moving the needle member in the method of manufacturing a non-contact IC card of the present invention).
[0039]
Thereafter, each needle member 13 is moved to the original position indicated by A from the position indicated by B in FIG. 4 by the leftward sliding drive of the drive unit 17 in FIG. 4, that is, the position where each needle member 13 is inserted into the lower film 12A. (The step of moving and returning the needle member in the non-contact IC card manufacturing method of the present invention).
[0040]
As the needle members 13 move and return as described above, the upper film 12B is slid in the right direction in FIG. 4 to prepare for the next winding coil formation and winding coil and circuit board sealing.
[0041]
This process is repeated to form a winding coil, and the winding coil and the circuit board sealed are sequentially sent to the right in FIG.
[0054]
According to the non-contact IC card having such a configuration and the manufacturing method thereof, the copper wire 14A (metal thin wire) can be easily wound and the shape of the wound winding coil 14 can be easily maintained. regular shape winding coil 14, for example, makes it easier to accurately formed in a square shape, formation of the winding coils of complex polygonal shapes Ri ease der, therefore, the productivity of the non-contact IC card Can be improved.
[0055]
Note that the winding coil 14 can be easily formed in a complicated polygonal shape or a spirally wound shape, and does not have to be substantially rectangular as in the present embodiment.
[0057]
The advantages of the non-contact IC card and the method for manufacturing the same are as follows.
[0058]
That is, the needle member 13 is inserted into the lower film 12A, and the copper wire 14A is sequentially hooked to position the copper wire 14A, and the winding coil 14 and the circuit board are connected to the two films 12A and 12B. A large number of needle members 13 that are configured to be retracted from the lower film 12A after being sealed in between are formed in a substantially V shape in which each inner corner is open at each corner of the lower film 12A. parallel beauty at a predetermined interval, and, because the corresponding copper 14A mutually applied to each needle member 13 to each other substantially V-shaped adjacent, are set to each other arrangement of the generally V-shaped so as to have a predetermined gap , spacing of copper wire 14A (thin metal wire) in each winding of the winding coil is constant for each product, a possibility to change rather name a result, variations in the resonance frequency of winding coils for each product can be suppressed, Stabilize the product It is possible.
[0059]
Here, the advantage to be brought out of this non-contact IC card will be described with an equivalent circuit and a mathematical expression.
[0060]
FIG. 3 is an equivalent circuit of a non-contact IC card.
[0061]
In this figure, the antenna coil (ANT), C _PC is the coil wire capacitance (pF), L _PC is a coil inductance (μH), R _PC is _{2π * fres * L PC / Qcoil} . In the equation, fres is 13.56 MHz. On the other hand, in the circuit board 10 (IC), Cchip is 23.5-1.2 pF to 23.5 + 1.2 pF, and Rchip is about 24 kΩ.
[0062]
In the non-contact IC card, Cp is 2.5 pF.
[0063]
The general conditions are as follows:
[0064]
(1) The wire is Cu, and the wire diameter is 40, 60, 80, 100 μm.
[0065]
(2) The thickness of the insulating layer (polyurethane) + fusion layer (polyester) is 5 + 3 μm, 10 + 5 μm.
[0066]
(3) The number of turns is 4T, 5T.
[0067]
(Reference DCR in case of diameter 0.1 is 4T = 2Ω, 5T = 2.5Ω)
[Outside 1]

[0068]
In the above equation, εo is a vacuum dielectric constant, ε is a relative dielectric constant, μo is a vacuum magnetic permeability, and μ is a relative magnetic permeability.
[0069]
Also, the conductor resistance (CuR) is
[0070]
Diameter 0.04 = 14.140-15.670 / m
[0071]
Diameter 0.06 = 6.287-6.966 / m
[0072]
Diameter 0.08 = 3.500-3.788 / m
[0073]
Diameter 0.10 = 2.240-2.381 / m
[0074]
Even in this formula, it can be understood that the fluctuation amount of Cpc, that is, the line capacitance of the antenna coil (interval between the winding portions of the magnetic coil) influences f _MO , that is, the fluctuation amount of the resonance frequency of the antenna coil. and is a good in that Cpc better constant stabilizes f _MO.
[0075]
In manufacturing the non-contact IC card, the following may be performed.
[0076]
That is, FIG. 5 is obtained by punching or cutting a large number of films from one large film, and includes a winding coil and a circuit board from each of a large number (30 sheets) of films. Manufactured non-contact IC card.
[0077]
In FIG. 5, S in each row is the start of winding of the winding coil, and E is the end of winding.
[0078]
In addition, as shown in FIG. 6, the two films 12A and 12B are both composed of a tape 18 coated with an adhesive covering the antenna coil 11 portion, or of the two films 12A and 12B. One of them may be constituted by a tape 18 coated with an adhesive covering the antenna coil 11 portion.
[0079]
According to such a configuration, the holes for attaching the IC chip module are conventionally formed in the film. However, it is not necessary to make holes, and man-hours and material costs can be reduced.
[0080]
Moreover, the process of sticking the other film to one film by heat fusion is simplified by the tape 18 coated with the adhesive, and the number of steps can be reduced.
【The invention's effect】
As described above, according to the non-contact IC card of the invention according to claim 1 and the non-contact IC card manufacturing method of the invention according to claim 5, the thin metal wire is positioned by being inserted into one film. The needle member to which the fine metal wires are sequentially hung, and after the winding coil and the circuit board are sealed between two films, a large number of needle members are configured to be removed from the one film. of each corner of the film, parallel with each predetermined interval to form a substantially V-shaped respectively inside open beauty, and the corresponding fine metal wires with each other applied to the needle between a substantially V-shaped adjacent, because each other are set the arrangement of substantially V-shaped so as to have a predetermined interval, the interval of metal thin wires in each winding of the winding coil is constant for each product, there is no possibility to vary, as a result, each product Winding coil Variation in vibration frequency is suppressed, it is possible to stabilize the product, moreover, the winding coil can be accurately formed, it is possible to turn, improving the productivity of the non-contact IC card.
[0081]
According to the invention which concerns on Claim 2, a winding coil can be formed in a substantially square shape simply and correctly.
[0082]
According to the inventions according to claims 3 and 4, since the two films or any one of them is composed of a tape coated with an adhesive covering the antenna coil portion, conventionally, a hole for mounting an IC chip module has been provided. Holes that have been formed in the film are no longer needed, and man-hours and material costs can be reduced.
[0083]
Moreover, the process which affixes the other film to one conventional film by heat sealing | fusion with the tape which apply | coated the adhesive is simplified, and a man-hour reduction is achieved.
[0087]
According to the invention which concerns on Claim 6 , many non-contact IC cards can be manufactured with a simple process from a big film.
[Brief description of the drawings]
FIG. 1 is a plan view showing an embodiment of a contactless IC card according to the present invention. FIG. 2 is a plan view showing an arrangement example of needle members according to the embodiment. FIG. 3 is a contactless IC according to the embodiment. FIG. 4 is a schematic diagram of an apparatus for carrying out the method for manufacturing a non-contact IC card according to the embodiment. FIG. 5 shows another example of the method for manufacturing a non-contact IC card according to the embodiment. FIG. 6 is a plan view showing another embodiment of the method for manufacturing a non-contact IC card according to the embodiment. FIG . 7 is a perspective view of a conventional non-contact IC card.

Claims (6)

Two sheets of coating resin made of a heat-sealing resin that is heat-sealed to a circuit board on which electronic components are mounted and an antenna coil that is connected to the circuit board and transmits and receives information via a predetermined medium The antenna coil is composed of a coil wound in a spiral shape in a polygonal shape or the like by positioning a thin metal wire with a needle member in one film. In the non-contact IC card in which the winding coil and the circuit board are sealed between the two films,
The needle member is configured plugged into one of the film thin metal wires sequentially multiplied et been, and, after sealing the winding coil and the circuit board between the two films, said be retired from one film On the other hand, the needle members are arranged at a predetermined interval so as to form a substantially V shape with the inner sides open at each corner of the one film , and the corresponding substantially V-shaped corresponding needles adjacent to each other. A non-contact IC card having a configuration in which arrangement of each substantially V-shape is determined so that thin metal wires hung between members have a predetermined distance from each other.   The non-contact IC card according to claim 1, wherein the winding coil is substantially rectangular.   3. The non-contact IC card according to claim 1, wherein the two films are made of a tape coated with an adhesive that covers the antenna coil portion.   3. The non-contact IC card according to claim 1, wherein one of the two films is made of a tape coated with an adhesive that covers the antenna coil portion. Two sheets of coating resin made of a heat-sealing resin that is heat-sealed to a circuit board on which electronic components are mounted and an antenna coil that is connected to the circuit board and transmits and receives information via a predetermined medium A non-contact IC card manufacturing method that is sealed with a film of
A plurality of needle members arranged in a predetermined shape and attached to the upper surface of a drive unit that is reciprocally driven to slide back and forth in the vertical direction and the horizontal direction, respectively, and extend upward. Each needle member is disposed above the drive unit. At the positions corresponding to the corners of the lower film of the two lower and upper films, each of them is arranged at a predetermined interval so as to form a substantially V shape with the inner sides opened , and adjacent to each other. A number of needle members, each of which has a substantially V-shaped arrangement so that the lines connecting the corresponding ones of the V-shapes have a predetermined distance from each other, are moved upward by sliding in the vertical direction of the drive unit, Inserting into the lower film ;
On the film of the lower, forming a successively subjected polygonal or the winding coil wound spirally in a shape similar thereto by Rukoto each needle member protruding metal wires from the film of the lower side When,
Slide the lower film and the drive part laterally, and move the part of the lower film where the winding coil is formed by a predetermined length while holding the winding coil on each needle member. And a process of
In moving position of the part winding coil is formed of the lower film, the upper film to the film of the lower side adhered by thermal fusion, two said and said circuit board with said winding coils a step of sealing between the film,
After the sealing of the winding coil and the circuit board is finished, each needle member is moved downward by sliding in the longitudinal direction of the drive unit, and retreated from the lower film,
Moving each needle member back to a position where it is inserted into the lower film by sliding in the lateral direction of the drive unit; and
A method for manufacturing a non-contact IC card, comprising: To obtain a large number of films from one film large, according to claim 5, characterized in that to produce the non-contact IC card that is configured to include a respective winding coils and the circuit board from the film of a large number of sheets Manufacturing method of non-contact IC card.

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