JP4615496B2 - Manufacturing method of electronic component mounting board - Google Patents

Description

  The present invention relates to a manufacturing method for mounting an electronic component on the metal substrate, for example, by soldering the electronic component on the metal substrate.

  Conventionally, as a method of soldering electronic components, for example, as shown in FIG. 7, paste solders 14 and 14 are respectively applied to wiring patterns 12a and 12a where the electronic components 11 on the metal substrate 12 are soldered. The metal substrate 12 is placed on a heating plate 15 such as a metal plate with a heater or a hot plate, and the metal substrate 12 and the paste solders 14 and 14 are heated by the heating plate 15. Then, the electronic component 11 is placed on the paste solders 14 and 14, and the back surfaces of the electrode portions 11 a and 11 a provided on the two opposite sides of the electronic component 11 are soldered to the wiring patterns 12 a and 12 a on the metal substrate 12. There is a soldering method of the first conventional example.

The wiring patterns 12a places the electronic components 11 on the metal substrate 12 is soldered, 12a paste solder 14 and 14 is applied respectively to, be soldered when the metal substrate 12 passes through the reflow oven There is a second conventional soldering method.

  As another soldering method, as shown in FIG. 8, for example, the electronic component 11 is fixed between the electronic component 11 and the metal substrate 12 by a fixing device (not shown) above the position where the electronic component 11 is soldered onto the metal substrate 12. The wire solder 17 in which the electrode portions 11a and 11a provided on the two opposite sides of the electronic component 11 and the wiring patterns 12a and 12a on the metal substrate 12 are melted by the soldering iron 16 are temporarily fixed in a state where there is a gap between them. There is a soldering method of a third conventional example (a method similar to FIG.

JP-A-10-190161

  However, since the soldering method of the first conventional example directly heats the metal substrate 12 and the paste solder 14 on the heating plate 15, temperature control is severe and difficult.

  The soldering method of the second conventional example requires a large facility such as a reflow furnace.

  In the soldering method of the third conventional example, it is difficult to confirm whether or not the melted thread solder 17 has entered the back surfaces of the electrode portions 11a and 11a of the electronic component 11, and high reliability cannot be obtained. Further, since the thread solder 17 is soldered to the entire length of the two sides of the electronic component 11 using the soldering iron 16, it takes time and labor for the soldering operation.

  In view of the above problems, the present invention can manufacture an electronic component mounting board that can easily and easily solder an electronic component to a metal substrate, and that can improve the efficiency and reliability of the soldering operation. The purpose is to provide a method.

According to a first aspect of the present invention, there is provided a method of manufacturing an electronic component mounting board, wherein an electronic component having an electrode part that is allowed to be soldered on at least a part of a bottom surface and a side surface thereof An electronic component mounting substrate manufacturing method for mounting the electronic component on the metal substrate by soldering, wherein the metal substrate is disposed on an upper surface of a soaking plate, and a wiring pattern formed on the metal substrate said electron electrode portions of the components a solder paste is applied to the portions to be soldered, the lower surface pair with pressurized hot plate of the soaking plate by pressing from below, through the soaking plate by the heating plate After heating the metal substrate and the paste solder, the paste solder applied on the wiring pattern of the metal substrate and the electrode part of the electronic component are opposed to each other, and the electronic component is placed on the paste solder, With metal substrate The electronic component is relatively moved in the direction in which the paste solder melted by the heating is stretched, and the paste solder is wetted and spread along the facing surface where the wiring pattern and the electrode portion are soldered. It is characterized by soldering.

According to the present invention, the metal substrate is disposed on the upper surface of the soaking plate , and the paste solder is applied to the place where the electrode part of the electronic component of the wiring pattern formed on the metal substrate is soldered. Paste solder applied to the wiring pattern of the metal substrate by pressing the heating plate against the lower surface of the heat equalizing plate from below and indirectly heating the metal substrate and paste solder via the heat equalizing plate with the heating plate Then, the electronic part is placed on the paste solder with the electrode part of the electronic part facing each other. Thereafter, the metal substrate and the electronic component are moved relative to each other in the direction in which the paste solder melted by heating is stretched, and the paste solder is moved along the opposing surface where the wiring pattern and the electrode portion are soldered. By wetting and spreading, the electrode part of the electronic component is soldered to the wiring pattern of the metal substrate.

The electronic component can be composed of components such as an integrated circuit, a semiconductor, and a capacitor. The electrode part includes a terminal, and may be provided so as to straddle the bottom and side surfaces of the electronic component, or may be provided on either the bottom surface or the side surface. The soaking plate can be made of, for example, an aluminum or copper plate having a function of making the temperature distribution uniform. Further, the paste solder can be composed of, for example, paste-like solder having excellent bonding strength.

  According to a second aspect of the present invention, there is provided a method for manufacturing an electronic component mounting substrate, wherein the electronic component is once mounted on the paste solder heated by the heating plate in combination with the configuration according to the first aspect. It is characterized in that the parts are finely moved up and down and soldered.

  According to this invention, once the electronic component is placed on the paste solder heated by the heating plate, the electronic component is finely moved up and down, and the molten paste solder is wetted and spread on the back surface of the electronic component. There is no need to check whether molten solder has entered the back surface of the electronic component as in the third conventional example, and the electronic component is securely soldered to the metal substrate, so the reliability of soldering is improved. To do.

  According to a third aspect of the present invention, there is provided a method for manufacturing an electronic component mounting substrate, wherein the paste solder is lead-free solder, in addition to the configuration according to the first or second aspect.

  According to the present invention, lead-free solder does not contain lead (Pb) and does not adversely affect the environment and the human body. Further, it is superior to lead-containing solder, for example, in terms of bonding strength, and the electronic component can be reliably soldered to the metal substrate.

  The lead-free solder is, for example, tin (Sn) -silver (Ag) -copper (Cu), tin (Sn) -copper (Cu) -nickel (Ni), tin (Sn) -zinc (Zn) -copper (Cu ), Tin (Sn) -zinc (Zn) -bismuth (Bi), tin (Sn) -copper (Cu), tin (Sn) -zinc (Zn), tin (Sn) -bismuth (Bi) It can be configured by a component that adds a component other than the above components. Moreover, you may change the combination of the component which comprises the said lead-free solder according to a use and the objective.

  According to this invention, the paste solder applied on the metal substrate through the heat equalizing plate is uniformly heated by the heating plate, and the electronic component disposed on the paste solder is soldered to the metal substrate. The operation of soldering the electronic component to the metal substrate can be performed easily and easily, and the efficiency of the soldering operation can be improved and the reliability can be improved. In addition, a large facility such as a reflow furnace is not required.

  An object of the present invention is to perform a soldering operation of an electronic component on a metal substrate in a simple and easy manner, and to improve the efficiency and reliability of the soldering operation. This is achieved by uniformly heating the paste solder on the metal substrate through the soldering and soldering the electronic component to the metal substrate.

  An embodiment of the present invention will be described in detail with reference to the drawings.

  The drawings show a method of mounting the electronic component on the metal substrate by soldering the electronic component on the metal substrate.

  The manufacturing method of the electronic component mounting substrate shown in FIGS. 1 to 5 is to solder the electronic component 1 provided with the electrode portion 1 a so as to straddle the bottom surface and the side surface onto the metal substrate 2.

  When the electronic component 1 having a rectangular shape in plan view is soldered onto the metal substrate 2 by the method of manufacturing the electronic component mounting substrate, the function of making the metal substrate 2 uniform in temperature distribution as shown in FIGS. Is disposed on an aluminum soaking plate 3 provided with a metal plate 2 placed on the soaking plate 3, and provided on the electronic component 1 on the metal part 2. The paste solder 4 made of lead-free solder is applied on the wiring pattern 2a of the metal substrate 2.

  The heater-equipped heating plate 5 that heats the soaking plate 3 to a temperature at which the paste solder 4 melts is raised by a lifting device (not shown) and pressed against the lower surface of the soaking plate 3 from below. At the time of the pressing, the heating plate 5 indirectly heats the metal substrate 2 and the paste solder 4 via the heat equalizing plate 3 and uniformly heats the paste solder 4 applied on the wiring pattern 2a of the metal substrate 2. And melt. At this time, the soldering temperature is adjusted and managed by, for example, shortening or lengthening the pressing time of the heating plate 5 against the soaking plate 3.

  As shown in FIG. 3, the electrode part 1 a provided on the electronic component 1 and the loop-shaped paste solder 4 applied on the wiring pattern 2 a of the metal substrate 2 are opposed to each other, and the electronic component 1 is temporarily placed on the paste solder 4. After the placement, the electronic component 1 is finely moved once (see an imaginary line in FIG. 3) once by a lifting device (not shown) at a distance of 1 mm or less.

  After finely moving upward, the electronic component 1 is detached from the lifting device and lowered by its own weight, or the electronic component 1 is lowered by the lifting device and soldered. Note that the operation of finely moving the electronic component 1 up and down by the lifting device may be performed a plurality of times.

  That is, the electronic component 1 placed on the paste solder 4 is first finely moved upward so that the lower portion of the electronic component 1 is in a reduced pressure state, and the molten paste solder 4 is stretched. By finely moving in the downward direction, the molten paste solder 4 is stretched toward the outside of the electronic component 1, and the molten paste solder 4 is sufficiently wetted and spread with respect to the back surface of the electrode portion 1 a of the electronic component 1. As shown in FIG. 5, the electrode portion 1 a provided on the electronic component 1 can be reliably soldered to the wiring pattern 2 a of the metal substrate 2. If the melted solder paste 4 has low fluidity and is difficult to wet and spread, the electrode part 1a is surely attached to the wiring pattern 2a of the metal substrate 2 by performing the operation of finely moving the electronic component 1 up and down several times. Can be soldered to.

  In the embodiment, the preheated heating plate 5 is pressed against the soaking plate 3, but the heating plate 5 may be pressed against the soaking plate 3 and then heated. Alternatively, after the electronic component 1 is placed on the paste solder 4 coated on the metal substrate 2, the heated plate 5 that has been heated in advance is pressed against the heat equalizing plate 3, or the heated plate 5 is pressed against the temperature equalizing plate 3. It may be heated after that.

  Furthermore, the heating plate 5 is not limited to the method of pressing from below the soaking plate 3, and may be pressed from the circumferential direction of the soaking plate 3, for example.

As described above, the paste solder 4 applied on the metal substrate 2 is uniformly heated by the heating plate 5 via the soaking plate 3, and the electronic component 1 disposed on the paste solder 4 is attached to the metal substrate 2. Since the soldering is performed, the operation of soldering the electronic component 1 to the metal substrate 2 can be performed easily and easily. In addition, a large facility such as a reflow furnace is not required.

In addition, if the pressing time of the heating plate 5 against the soaking plate 3 is shortened, the temperature of the soaking plate 3 decreases, and if the pressing time of the heating plate 5 is increased, the temperature of the soaking plate 3 increases. By adjusting the pressing time of the heating plate 5, the soldering temperature can be adjusted and managed more easily than when the metal substrate 2 and the paste solder 4 are directly heated by the heating plate 5.

  Further, when the electronic component 1 placed on the paste solder 4 is finely moved upward, the molten paste solder 4 is sufficiently wetted and spreads to the back surface of the electrode portion 1a of the electronic component 1, so that the back surface of the electronic component 1 It is not necessary to check whether or not the paste solder 4 that has been melted into the metal layer 2 has entered, and the electronic component 1 is reliably soldered to the metal substrate 2, so that the reliability of soldering is improved. Further, since a complicated operation using the soldering iron 16 is not required, the time required for soldering is shortened, and the efficiency of the soldering operation can be improved.

  Further, the paste solder 4 made of lead-free solder does not contain lead and does not adversely affect the environment and the human body. Compared to solder containing lead, for example, it is superior in terms of bonding strength and the like, and the electronic component 1 can be reliably soldered to the metal substrate 2.

  FIG. 6 shows another example of a method of manufacturing an electronic component mounting board, and paste solders 4 and 4 are respectively applied to two wiring patterns 2a and 2a provided at locations where the electronic component 1 on the metal substrate 2 is soldered. The electrode provided on the two opposing sides of the electronic component 1 is applied by indirectly heating the metal substrate 2 and the paste solder 4 through the heat equalizing plate 3 by pressing the heating plate 5 against the lower surface of the heat equalizing plate 3. The parts 1a, 1a and the paste solder 4, 4 applied on the wiring patterns 2a, 2a of the metal substrate 2 are opposed to each other. After the electronic component 1 is once placed on the paste solder 4, 4, the electronic component 1 is moved up and down. The electrode parts 1a, 1a provided on the two sides of the electronic component 1 and the wiring patterns 2a, 2a provided on the metal substrate 2 are soldered to each other. Can play.

  Note that the present invention is not limited to the configuration of the above-described embodiments, but can be applied based on the technical idea shown in the claims, and many embodiments can be obtained.

  The method for manufacturing an electronic component mounting board of the present invention can also be applied when, for example, a planar antenna is soldered to a metal board.

The perspective view which shows the manufacturing method which mounts an electronic component on a metal substrate. Sectional drawing which shows the state which mounted the paste solder on the wiring pattern of a metal substrate. Sectional drawing which shows the operation | movement which finely moves an electronic component up and down. The perspective view which shows the state which soldered the electronic component on the metal substrate. The expanded sectional view which shows the soldering state of an electronic component and a metal substrate. The perspective view which shows the other example of the manufacturing method which mounts an electronic component on a metal substrate. The perspective view which shows the soldering method of a 1st prior art example. The perspective view which shows the soldering method of a 3rd prior art example.

DESCRIPTION OF SYMBOLS 1 ... Electronic component 1a ... Electrode part 2 ... Metal substrate 2a ... Wiring pattern 3 ... Soaking plate 4 ... Paste solder 5 ... Heating plate

Claims (3)

An electronic device that mounts the electronic component on the metal substrate by soldering an electronic component having an electrode portion that is allowed to be soldered to at least a part of the bottom surface and the side surface to a wiring pattern formed on the metal substrate. A method of manufacturing a component mounting board,
The metal substrate is disposed on the upper surface of the heat equalizing plate, and paste solder is applied to a place where the electrode part of the electronic component of the wiring pattern formed on the metal substrate is soldered,
Pressing a lower face in pairs and pressurized hot plate of the soaking plate from below, the soaking plate is heated and solder metal substrate and paste through by the heating plate,
After placing the electronic component on the paste solder with the paste solder applied on the wiring pattern of the metal substrate facing the electrode part of the electronic component,
The metal substrate and the electronic component are moved relative to each other in a direction in which the paste solder melted by the heating is stretched, and the paste solder is moved along an opposing surface where the wiring pattern and the electrode portion are soldered. A method of manufacturing an electronic component mounting substrate, wherein the substrate is wetted and soldered. 2. The method of manufacturing an electronic component mounting board according to claim 1, wherein the electronic component is temporarily mounted on the paste solder heated by the heating plate, and then the electronic component is finely moved up and down to be soldered. The method of manufacturing an electronic component mounting board according to claim 1, wherein the paste solder is lead-free solder.

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