JP4617567B2 - Manufacturing method of semiconductor device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method of manufacturing a semiconductor device, a method of manufacturing a semiconductor device having an identification code to the particular itself.
[0002]
[Prior art]
A conventional semiconductor device does not have information for identifying the chip itself. If the identification information is not written on the chip, there is a possibility that mutual identification cannot be performed when it is mixed with other devices, and the device cannot be used.
In order to prevent this, conventionally, information such as a type name is imprinted on the back of the package, and a person visually interprets the imprint to determine the information. However, this method cannot be automated, and has problems such as costly stamping work and identification.
In addition, there is a problem that dust generated at the time of marking on the back of the package increases the defective rate of the product.
[0003]
[Problems to be solved by the invention]
As described above, in the conventional semiconductor device, since information for identifying it is not written in the chip itself, there is a problem that it cannot be distinguished when mixed with chips of other devices. In order to prevent this, a method of stamping information such as the type name on the back of the package has been adopted, but there is a problem that identification must be performed by the operator's visual inspection, and the entire work cannot be automated. There were drawbacks. Also, dust generated at the time of stamping has been a problem. The present invention solves this problem in a relatively simple manner, by mark the identification sign chip itself, to allow mechanical identification, the method of manufacturing a semiconductor device which enables automation of the subsequent process Realization is the issue.
[0004]
[Means for Solving the Problems]
In order to achieve the above object, according to the present invention, in a method for manufacturing a semiconductor device , an identification code-dedicated reticle connected to a stage on which a wafer for forming a semiconductor chip is placed is connected between a condenser lens and the wafer. A reticle pattern is formed on the semiconductor chip and a predetermined position of the semiconductor chip using an exposure apparatus provided with a reticle on which the semiconductor chip pattern is formed between the condenser lens and the light source for exposure. And an identification code forming step for forming an identification code for an identification code dedicated reticle. The identification code provided in the identification code forming step is read and reflected in the subsequent steps .
[0005]
By these, the chip itself shows information about identification mark can allow the mechanical identification, it is possible to realize a method of manufacturing a semiconductor device capable of allowing the automation of the subsequent steps.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a semiconductor device and a manufacturing method thereof according to the present invention will be described in detail with reference to the accompanying drawings.
[0007]
FIG. 1 shows an external view of a solid-state imaging device which is an embodiment of a semiconductor device of the present invention. In FIG. 1, reference numeral 1 is a chip (corresponding to the imaging surface), reference numeral 2 is a package, reference numeral 3 is a bonding wire, and reference numeral 4 is an identification code.
In the present invention, when a processing pattern such as etching is exposed on a resist of a semiconductor substrate by a step projection exposure apparatus (hereinafter abbreviated as a stepper) in a wafer processing process, an identification code 4 is simultaneously applied to the outer periphery of the chip 1. Try to write. Then, in the subsequent package assembly process and inspection process, the chip 1 can be identified by recognizing the identification code 4, and the subsequent processing can be automated. As the identification code 4, for example, a barcode can be used, but it is not necessarily limited thereto.
[0008]
By writing the identification code 4 in the wafer processing step by exposure processing in this way, it is possible to eliminate the conventional work such as marking on the back of the package by the operator, and to identify each individual from the earlier chip stage. Therefore, even when it is mixed with a chip of another device by mistake, it can be easily and quickly identified and classified without human intervention.
[0009]
Next, a method for embedding the identification code 4 using a stepper will be described.
FIG. 2 is a schematic configuration diagram of a conventional stepper. In FIG. 2, reference numeral 11 is a light source, reference numeral 12 is a reticle, reference numeral 13 is a condenser lens, reference numeral 14 is a wafer, and reference numeral 15 is a stage.
The reticle 12 is formed with an enlarged pattern several times the pattern of the semiconductor element. The light from the light source 11 is projected onto the reticle 12, and the pattern is projected onto the wafer 14 with the condenser lens 13 for exposure. . The stepper repeatedly exposes the pattern of the same reticle 12 onto the wafer 14 to form a large number of chip patterns on the wafer 14.
The projection position of the reticle 12 is moved and positioned on the wafer 14 by the movement of the stage 15 on which the wafer 14 is placed, and the wafer 14 is also moved up and down by the stage 15, thereby determining the exposure focus. It is done.
[0010]
In FIG. 3, the schematic block diagram of the stepper used for this invention is shown. In FIG. 3, reference numeral 11 is a light source, reference numeral 12 is a reticle, reference numeral 13 is a condenser lens, reference numeral 14 is a wafer, reference numeral 15 is a stage, reference numeral 16 is a reticle dedicated to an identification code, and reference numeral 17 is a connecting bracket. For convenience, the same reference numerals are used in FIG. 3 for the same functions as in FIG.
The present invention is different from the conventional one shown in FIG. 2 in that an identification code-dedicated reticle 16 connected to a stage 15 by a connecting bracket 17 is provided between the condenser lens 13 and the wafer 14.
[0011]
The operation of embedding the identification code 4 in the chip 1 by this stepper will be described.
First, light projected from the light source 11 passes through the reticle 12 and is collected by the condenser lens 13. Then, the light condensed by the condenser lens 13 is irradiated onto the wafer 14 through the reticle 16 dedicated to the identification code, the resist on the wafer 14 is exposed, and a pattern is formed on the wafer 14.
The identification code dedicated reticle 16 has an identification code corresponding to each chip 1. Therefore, the identification code pattern of the identification code dedicated reticle 16 is simultaneously formed on the wafer 14 together with the pattern of the reticle 12.
[0012]
Moving to the next shot, the stage 15 is moved in order to form the pattern of the reticle 12 at another location on the wafer 14. At this time, since the identification code dedicated reticle 16 is connected to the stage 15, it moves in the same direction as the stage 15, and the next identification code pattern is formed simultaneously with the pattern of the reticle 12.
As a result, the identification code 4 corresponding to each chip 1 is written, and the information on the chip can be read by reading this identification code. When the surface identification code 4 can be read, the work after chip dicing, die bonding, wire bonding, packaging, marking, inspection process and the like can be automated based on this information.
[0013]
The above description has been given for the solid-state imaging device. However, in a semiconductor device other than the solid-state imaging device, an identification code is written on the semiconductor chip, and the semiconductor chip is enclosed in a package so that the identification code can be read from the outside. In the semiconductor device, the processing can be similarly automated.
[0014]
【The invention's effect】
As described above, according to the first aspect of the present invention, in the method of manufacturing a semiconductor device, an identification code forming step for forming an identification code at a predetermined position of the semiconductor chip is provided, and the identification code provided here is read. This is reflected in the subsequent processes.
[0016]
This ensures that the chip information is mechanically recognized can identify chip or semiconductor device, it is possible to realize a method for manufacturing a subsequent step the semiconductor device capable of the automated.
[0017]
In the second aspect of the present invention, a bar code is used as the identification code. As a result, an existing identification method and identification software can be used, and a semiconductor device manufacturing method capable of easily and inexpensively identifying a semiconductor device can be realized.
[Brief description of the drawings]
FIG. 1 is an external view of a solid-state imaging device which is an embodiment of a semiconductor device of the present invention.
FIG. 2 is a schematic block diagram of a conventional step projection exposure apparatus.
FIG. 3 is a schematic block diagram of a stepped projection exposure apparatus according to the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Chip, 2 ... Package, 3 ... Bonding wire, 4 ... Identification code, 11 ... Light source, 12 ... Reticle, 13 ... Condensing lens, 14 ... Wafer, 15 ... Stage, 16 ... Reticle for identification code, 17 ... Connection Hardware.

Claims (2)

An identification code-dedicated reticle connected to a stage on which a wafer forming a semiconductor chip is mounted is connected between a condenser lens and the wafer, and the semiconductor is provided between the condenser lens and a light source for exposure. Using an exposure apparatus provided with a reticle on which a chip pattern is formed, and having an identification code forming step of forming a reticle pattern on a semiconductor chip and forming an identification code for an identification code dedicated reticle at a predetermined position on the semiconductor chip A method of manufacturing a semiconductor device, wherein the identification code provided in the identification code forming step is read and reflected in the subsequent steps. The method of manufacturing a semiconductor device according to claim 1 , wherein the identification code is a bar code.

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