JP4618458B2 - Thin substrate detector - Google Patents

Description

  The present invention relates to a thin substrate detection apparatus for detecting a storage state of a thin substrate in a carrier storing a thin substrate such as a wafer in a slot.

The inside of the carrier in which a thin substrate such as a wafer is stored in the slot is imaged by an imaging means such as a CCD camera to acquire an image in the carrier, and the image is processed by an image processing apparatus to store the wafer in the carrier. A method for detecting a state has been conventionally disclosed.
For example, in Patent Document 1, a camera is disposed obliquely above a carrier, and an image acquired by the camera is processed to detect a wafer storage state. Further, in Patent Document 2, a camera is attached to a door of a device called a load port that opens and closes a carrier lid, and an image is acquired and processed for each slot to detect the stored state of the wafer.
JP 2000-174103 A JP 11-354609 A

First, an outline of the wafer detection technique will be described using Patent Document 1 as an example of the first conventional technique.
FIG. 28 is a diagram for explaining the principle of the thin substrate detection method disclosed in Patent Document 1. In FIG. In FIG. 28A, 1 is a carrier, 2 is a wafer, and wafer 2 (2-1 to 2-n) is stored in each slot in the carrier 1. 4 is arranged obliquely above the carrier 1 so as to acquire an image inside the carrier 1 with a camera. When the camera 4 images the inside of the carrier 1, the acquired image is as shown in (b).

  Since the camera 4 is arranged by calibrating the positional relationship with the carrier 1 in advance, the image of (b) represented by the uv coordinate system installed in the camera 4 is shown in (a). Geometric correction can be made to the θ-z coordinate system. (C) is an image after geometric correction, and the edge of the wafer 2 is represented as a parallel straight line group. In Patent Document 1, the stored state of the wafer is detected using the geometrically corrected image of (c), that is, the θ-z image.

  FIG. 29 is a diagram illustrating an example of processing results obtained when determining the presence or absence of a wafer. FIG. 29A shows a luminance distribution obtained by integrating the luminance of each pixel of the θ-z image of FIG. 28C in the z direction. Zi (i = 1 to n) indicates the z-coordinate position of the i-th wafer 2. In this example, since the wafer 2-3 is not inserted in the third slot, the luminance distribution corresponding to that position is There is no peak. FIG. 29B shows the result of binarizing the luminance distribution of FIG. 29A with an appropriate threshold th. The binarization result of the z coordinate position where the wafer 2 exists is “1”, and the binarization result which does not exist is “0”. In this example, since the binarization result corresponding to the third slot having no peak in the luminance distribution of (a) is “0”, it is determined that there is no wafer 2 in the third slot. Since the binarization result is “1” for the other slots, it is determined that the wafer 2 is inserted.

  FIG. 30 is a diagram illustrating an example of a processing result obtained when determining the jumping out of the wafer. As described above with reference to FIG. 29, FIG. 30A shows a luminance distribution obtained by integrating the luminance of each pixel of the θ-z image in the z direction, and FIG. 30B shows this luminance distribution by an appropriate threshold th. This is the result of binarization. In this example, since the wafer 2-3 protrudes and is inserted into the third slot, the peak of the luminance distribution corresponding to that position appears with a deviation from the coordinate position Z3. In this case, since the z coordinate position of the binarization result “1” is deviated, it is determined that the wafer 2 has been popped out and inserted into the third slot. Since the coordinate position is “1”, it is determined that it has been inserted normally.

  FIG. 31 is a diagram illustrating an example of processing results obtained when determining a plurality of wafers. As described with reference to FIG. 29 above, FIG. 31A shows a luminance distribution obtained by integrating the luminance of each pixel of the θ-z image in the z direction, and FIG. 31B shows this luminance distribution by an appropriate threshold th. This is the result of binarization. In this example, since a plurality of wafers 2-3 are inserted in the third slot, the peak width of the luminance distribution corresponding to that position appears widely. In this case, since the width of the binarization result “1” corresponds to two or more, it is determined that a plurality of wafers 2 are inserted in the third slot, and “1” for the other slots. Is equivalent to one sheet, it is determined that one sheet is inserted.

By the way, in the thin substrate detection method of Patent Document 1 described so far, it is not possible to determine whether the wafer 2 is inserted obliquely. Therefore, Patent Document 1 also discloses a wafer detection technique using a straight line extraction method based on Hough transform as a method for determining oblique insertion.
FIG. 32 is a diagram illustrating an example of a processing result of the thin substrate detection method using the Hough transform disclosed in Patent Document 1. 32 (a) and 32 (b) are an image of the inside of the carrier 1 and a geometrically corrected θ-z image, respectively, as described with reference to FIG. (C), (d), (e), (f), and (g) in FIG. 32 are Hough transforms of the θ-z image of (b). In the Hough transform, the straight line on the θ-z image in (b) is represented by the length ρ of the perpendicular from the origin of the θ-z image orthogonal to the straight line and the angle ψ formed by the perpendicular and the θ axis. -Converts to a point in ρ space. That is, a line in the θ-z space is expressed as a bright spot in the ψ-ρ space by the Hough transform.
As shown in FIG. 32C, when the Hough transform results in ψ = 90 ° and all bright spots exist at the Zi position of the ρ coordinate position, the wafer 2 is normally inserted into all slots in the carrier 1 It is expressed that. As shown in (d), when there is no bright spot at the Z3 position of the ρ coordinate position, this indicates that there is no wafer 2 in the third slot. As shown in (e), when the bright spot at the Z3 position of the ρ coordinate position is shifted in the ψ direction, this indicates that the wafer 2-3 is inserted obliquely into the third slot. As shown in (f), when the bright spot at the Z3 position of the ρ coordinate position is shifted in the ρ direction, it indicates that the wafer 2-3 is popped out and inserted into the third slot. As shown in (g), when the bright spot at the Z3 position of the ρ coordinate position is longer by the number of wafers 2 in the ρ direction, it indicates that a plurality of wafers 2-3 are inserted in the third slot. ing.
As described above, in the thin substrate detection method using the Hough transform, the presence / absence of a wafer, the pop-out insertion, the plurality of inserts, and the oblique insertion are determined from the Hough transform result.

Next, the outline of the wafer detection technique will be described using Patent Document 2 as an example of the second conventional technique. FIG. 33 is a configuration diagram of an apparatus for detecting a thin substrate disclosed in Patent Document 2. The device shown in FIG. 33 is a device that opens and closes the lid of the carrier 1 and is widely called a load port. In the following description, the same reference numerals are given to the components described with reference to the previous drawings, and the description thereof is omitted.
Reference numeral 12 denotes a table. The carrier 1 in which the wafers 2 (2-1 to 2-n) are stored is placed on the table 12. Reference numeral 72 denotes a cover of the carrier 1, and reference numeral 13 denotes a load port door. The door 13 holds the cover 72, moves to the right in the a direction, and descends downward in the b direction to open the opening of the carrier 1. Reference numeral 29 denotes an illumination. When the light is lowered, the illumination 29 is turned on, and the camera 4 images each slot in the carrier 1. The camera 4 and the illumination 29 are mounted on the upper portion of the door 13. Reference numeral 23 denotes an image processing apparatus that processes the image of each slot picked up by the camera 4 and detects the stored state of the wafer 2 (2-1 to 2-n).
In the image processing device 23, after performing necessary preprocessing such as binarization processing, the image for each slot is compared with reference data serving as a reference for determining whether the storage state is normal or abnormal. The normal or abnormal storage state of the wafer 2 (2-1 to 2-n) is determined.

  However, in the thin substrate detection method of the first prior art (Patent Document 1), when the camera 4 is disposed obliquely above the carrier 1, geometric correction can be realized so that the edges of the wafer 2 become parallel straight lines. Thus, there is a problem that it is necessary to perform calibration with high accuracy, which is troublesome and difficult. If the accuracy is poor, even if geometric correction is performed, the edge of the wafer 2 does not become a straight line, which hinders subsequent integration processing and the like, and the stored state of the wafer 2 cannot be detected correctly. In addition, the method of binarizing and determining the integrated luminance distribution from FIG. 29 to FIG. 31 has a problem that it is not possible to determine oblique insertion. Although the method using the Hough transform makes it possible to determine the diagonal insertion, there is a problem that it is difficult to stably perform the Hough transform with a small amount of calculation. There is also a problem that the cost of the system becomes too large for high-speed processing even with an enormous amount of computation. In addition, in the case where the determination of oblique insertion is also performed using the method of determining the integrated luminance distribution by binarizing, it is necessary to use the method using the Hough transform, which increases the parameters required for adjustment and the like, and is handled by the user. Has the problem of becoming cumbersome.

  Further, in the thin substrate detection method of the second prior art (Patent Document 2), a notch or orientation flat may be located in a portion where the illumination 29 of the wafer 2 reflects, and it is necessary to prepare reference data according to the state. Therefore, a lot of reference data is required. The carrier 1 also has a two-point support type that supports the wafer 2 from the guides on both sides, but also has a four-point support type that supports the two inner guides on the opposite side of the opening. The state of oblique insertion varies widely. Therefore, it is necessary to prepare reference data according to the state of the oblique insertion, and a lot of reference data is required. The surface of the wafer 2 has various types from low reflectance to high reflectance, and it is necessary to prepare reference data according to the surface state, and a large amount of reference data is required. As described above, since it is necessary to prepare a large number of reference data, there is a problem that a large amount of memory resources are consumed. In addition, since the comparison process is performed using a lot of reference data, there is a problem that the amount of calculation becomes enormous. In order to increase the memory capacity or to perform high-speed processing even with a large amount of calculation, there is a problem that the cost of the system becomes too high.

  The present invention has been made in view of such various problems. (1) No geometric correction is required and labor is required, and (2) the detection of a wafer storage state including oblique insertion is unified. Provided is a thin substrate detection method that can be realized by the method and is easy for the user to handle, (3) can perform high-speed processing without requiring Hough transform or reference data, requires less memory resources, and can reduce system cost. For the purpose.

In order to solve the above problem, the invention according to claim 1 is a thin substrate detection device for detecting a storage state of the thin substrate in a carrier in which a plurality of slots for horizontally storing the thin substrate are arranged in parallel in the vertical direction. In addition, an imaging unit that acquires an image related to the slot, and a plurality of rectangular processing windows whose longitudinal directions are orthogonal to the slot are arranged side by side on the two-dimensional coordinates of the image acquired by the imaging unit. The normal insertion determination area and the diagonal insertion determination area for determining the position of the thin substrate of the specific target slot to be detected are set in each processing window, and the vertical luminance of the image in each processing window is set in the vertical direction. An integral distribution is obtained, and a peak of the integral distribution is detected in the normal insertion determination area and the oblique insertion determination area, and the integral insertion determination area is detected. A storage state detecting unit that determines an insertion state of each processing window based on a certain peak and the presence or absence of the peak in the oblique insertion determination area, and the storage state detection unit includes the normal insertion When the peak does not exist in all of the determination area and the oblique insertion determination area, it is determined that the thin board is not present in the target slot, and the plurality of peak positions existing in the normal insertion determination area are approximated to a straight line. Then, an angle is calculated from the straight line, and when the angle is larger than the angle threshold by comparing the angle with a preset angle threshold, the thin substrate is inserted obliquely into the target slot. determined, wherein the thin substrate to the target slot if the processing window the peak normal insertion determining area there are a plurality there is at least 1 more It is characterized in that determined to be ON.

  The invention according to claim 3 is a thin substrate detection apparatus for detecting a storage state of the thin substrate in a carrier in which a plurality of slots for horizontally storing the thin substrate are arranged in parallel in the vertical direction, and relates to the slot. An imaging unit that acquires an image, and a plurality of rectangular processing windows whose longitudinal directions are orthogonal to the slots on the two-dimensional coordinates of the image acquired by the imaging unit. Setting a normal insertion determination area and a diagonal insertion determination area for determining the position of the thin substrate in a specific target slot to be detected, and obtaining the vertical integral distribution of the luminance of the image in each processing window, The integral distribution is secondarily differentiated in the vertical direction to obtain a second derivative distribution, and the second derivative is determined in the normal insertion determination area and the oblique insertion determination area. A portion where the cloth is larger than the threshold value compared with a preset threshold value is detected as a thin substrate portion, and the thin substrate portion in the normal insertion determination area, the width of the thin substrate portion, and the oblique insertion determination Storage state detection means for determining the insertion state of each processing window based on the presence or absence of the thin substrate portion in the area, wherein the storage state detection means includes the normal insertion determination area and the oblique insertion determination area. When the thin substrate portion does not exist in all of the target slots, it is determined that the thin substrate does not exist in the target slot, and when there is even one processing window in which the thin substrate portion exists in the oblique insertion determination area Determines that the thin substrate is inserted obliquely into the target slot, and the width of the thin substrate portion and a preset thin substrate portion width threshold within the normal insertion determination area are determined. DOO if the width is greater than the thin substrate portion width threshold value of the thin substrate portion compared is characterized in that the said target slot determines that the thin substrate has a plurality inserted.

As described above, according to the present invention, it is not necessary to perform geometric transformation of the image such as geometric correction on the image acquired with respect to the slot to be detected, and therefore, high-precision calibration is not required. It does not take time. Further, since only the peak of the integral distribution within the processing window is detected to determine the insertion state of the thin substrate, a huge amount of calculation like the Hough transform is not required, and the system cost can be suppressed. In addition, since the thin substrate can be detected by a unified method of detecting the integration distribution peak in the processing window and determining the insertion state of the thin substrate, it is not necessary to switch the processing according to the insertion state, and the user can easily handle it. . In addition, even if notches and orientation flats enter the processing window, multiple processing windows are placed in close contact with each other, so that peaks can always be detected in some processing window. No special treatment is required. In addition, since the peak is detected after the integral distribution is normalized, the parameters for detecting the peak are strong against ambient brightness fluctuations. Further, since reference data for comparison is not required in accordance with the insertion state and surface state of the thin substrate, processing can be performed at high speed, memory resources can be reduced, and system cost can be reduced.
In addition, even when a peak appears in the normal insertion determination area, it is possible to determine diagonal insertion, so it can be used for various diagonal insertions, and the storage status of thin substrates can be detected for many carriers without limiting the type of carrier. can do.
Further, since the image acquired for the slot to be detected does not require geometric transformation such as geometric correction, high-precision calibration is not required and labor is not required. Moreover, since the thin substrate portion of the second-order differential distribution in the processing window is only detected to determine the insertion state of the thin substrate, an enormous amount of computation like Hough transform is not required, and the system cost can be reduced. it can. In addition, since the thin substrate can be detected by a unified method of detecting the thin substrate portion of the second-order differential distribution in the processing window and determining the insertion state of the thin substrate, there is no need to switch processing according to the insertion state, Easy for users to handle. Even if notches or orientation flats enter the processing window, multiple processing windows are placed in close contact with each other. Therefore, no special processing is required. Further, since reference data for comparison is not required in accordance with the insertion state and surface state of the thin substrate, processing can be performed at high speed, memory resources can be reduced, and system cost can be reduced.

Hereinafter, specific examples of the method of the present invention will be described with reference to the drawings. In addition, since the same code | symbol was attached | subjected to the component which is common in the example of a prior art, the description is abbreviate | omitted.
The apparatus used for carrying out the present invention is basically the same as the second prior art apparatus (FIG. 33). As in the apparatus of FIG. 33, the apparatus used to implement the present invention is arranged to arrange the camera 4 and the illumination 29 from the direction of viewing the end face of the wafer 2 to acquire and process an image on the wafer 2 and detect the stored state of the wafer. To do. As shown in FIG. 33, the camera 4 and the illumination 29 may be attached to the upper portion of the door 13 of the load port, or may be attached to a robot that takes out the wafer 2 from the opening of the carrier 1 and inserts it. . What is necessary is that the camera 4 and the illumination 29 are arranged in the direction of viewing the end face of the wafer 2, but strict calibration as in the first prior art is not necessary, and the camera 4 and the illumination 29 are placed on the end face of the wafer 2. All you have to do is place it where you can see.
When the camera 4 and the illumination 29 are mounted on the upper portion of the door 13 of the load port, it is sufficient that an image for the wafer 2 can be acquired. Therefore, the wafer 2 can be detected regardless of whether the door 13 is lowered or raised.
The illumination 29 is necessary when an image on the wafer 2 cannot be clearly obtained. However, if the image is clear even without the illumination 29, the illumination 29 is not necessarily required.

(1) 1st Embodiment (equivalent to the content of Claim 1)
FIG. 1 is a flowchart of a thin substrate detection method according to the first embodiment, and steps 101 to 109 are steps of this flowchart.
In FIG. 1, in step 101, a plurality of processing windows are set in an image acquired for a slot to be detected. FIG. 14 shows a setting example of the processing window. E01 is an acquired image, which is an image acquired for the wafer 2 (i) in the i-th slot. Reference numeral E02 denotes an illumination reflection portion, which is a portion where the illumination 29 irradiated to the wafer 2 is reflected by the end face of the wafer 2, and is indicated by hatching in the drawing. Reference numeral E03 denotes a processing window, which is disposed in close contact with the vicinity of the illumination reflecting portion E02. In FIG. 14, six processing windows E03 are set on the left and right.
In step 102, the acquired image E01 surrounded by the processing window E03 is integrated in a direction orthogonal to the wafer 2 to obtain an integrated distribution. In step 103, the integral distribution is normalized. FIG. 15 is an example of the integral distribution. FIG. 14A shows the setting example of the processing window of FIG. 14 rotated 90 degrees to the left in order to make the state of integration easy to understand. (B) is an integral distribution obtained by integrating one processing window (the innermost lower processing window E03 in FIG. 15) in the vertical direction (V direction) of the wafer 2 in the processing window E03. F01 is a peak, and as a result of integration, the luminance of the illumination reflecting portion E02 of the wafer 2 appears as a peak. (C) is obtained by normalizing the integral distribution in 256 steps from 0 to 255. F02 is a normalized peak and has a peak value from 0 to 255.
In step 104, a normal insertion determination area and an oblique insertion determination area for determining the position of the wafer 2 are set. FIG. 16 shows a setting example of the determination area. G01 is a normal insertion determination area, and G02 is an oblique insertion determination area, which is an area for determining the position of the normalized peak F02 set for the i-th slot to be detected. These determination areas are used to determine the insertion state of the processing window E03 in step 106 described later.
In step 105, in the area surrounded by the normal insertion determination area G01 and the oblique insertion determination area G02, the normalized peak F02 is extracted in the integral distribution (normalization), and the peak position and width are detected. In the setting example of the determination area in FIG. 16, one normalized peak (i) F02 is detected in the normal insertion determination area G01.
In step 106, the number of normalized peaks F02 is counted in the normal insertion determination area G01, and the presence / absence of the normalized peak F02 is checked in the oblique insertion determination area G02 to determine the insertion state of the processing window E03. FIG. 17 shows an example of determining the insertion state of the processing window. (A) shows that there is one normalized peak (i) F02 in the normal insertion determination area G01, and (b) shows that there is no normalized peak (i) F02 in the normal insertion determination area G01 and the diagonal insertion determination area G02. (C) shows a case where there are two normalized peaks (i) F02 in the normal insertion determination area G01, and (d) shows a case where there is a normalized peak (i) F02 in the diagonal insertion determination area G02. Yes. In this step 106, for all the processing windows E03, the number of normalized peaks F02 is counted in the normal insertion determination area G01, and the presence / absence of the normalized peak F02 is checked in the oblique insertion determination area G02. The processing window E03 is classified as shown in FIG.
In step 107, the normalization peak F02 does not exist in the normal insertion determination area G01 and the diagonal insertion determination area G02 of all the processing windows E03 using the insertion state determination result of all the processing windows E03 in step 106 (FIG. 17 ( In the state (b), it is determined that there is no wafer 2 in the i-th slot to be detected, and the processing for that slot is terminated. If not, go to the next step.
In Step 108, when there is at least one processing window E03 in which the normalized peak F02 exists in the oblique insertion determination area G02 using the insertion state determination result of all the processing windows E03 in Step 106 (as shown in FIG. 17D). In this state, it is determined that the wafer 2 is inserted obliquely into the i-th slot to be detected, and the processing for that slot is terminated. If not, go to the next step.
In Step 109, when there is at least one processing window E03 in which a plurality of normalized peaks F02 exist in the normal insertion determination area G01 using the insertion state determination result of all processing windows E03 in Step 106 (FIG. 17C). In such a state, it is determined that two or more wafers 2 are inserted in the i-th slot to be detected, and the processing for the slot is terminated. Otherwise, it is determined that one wafer 2 is normally inserted in the target slot, and the processing for that slot is terminated.
If the above steps are performed for all slots in the carrier 1, the stored state of the wafer 2 in the carrier 1 can be detected.

  As described above, the first embodiment of the present invention does not require geometric transformation of an image such as geometric correction with respect to the image E01 acquired with respect to the slot to be detected. Is not necessary and takes time. Further, since only the peak of the integral distribution in the processing window E03 is detected and the insertion state of the wafer 2 is determined, a huge amount of calculation such as the Hough transform is not required, and the cost of the system can be suppressed. Further, since the wafer 2 can be detected by a unified method of detecting the integration distribution peak in the processing window E03 and determining the insertion state of the wafer 2, there is no need to switch the processing according to the insertion state, and the user handles it. easy. Even if notches and orientation flats enter the processing window E03, since a plurality of processing windows E03 are arranged in close contact with each other in step 101, peaks can always be detected in some processing window E03. No special processing is required to deal with In addition, since the integral distribution is normalized in step 103 and then the peak is detected in step 105, the parameters for performing peak detection and the like are strong against ambient brightness fluctuations. Further, since reference data for comparison is not required according to the insertion state and surface state of the wafer 2, processing can be performed at high speed, memory resources can be reduced, and system cost can be reduced.

(2) Second embodiment (corresponding to the content of claim 2)
FIG. 2 is a flowchart of the thin substrate detection method according to the second embodiment, and 201 and 202 are the steps of this flowchart. The difference from the first embodiment described with reference to FIG. 1 is that step 201 and step 202 are added.
In step 201, the position of the normalized peak (i) F02 existing in the normal insertion determination area G01 is approximated to a straight line, and the angle is obtained from the straight line. FIG. 18 is a diagram illustrating peak angle calculation. This figure shows the integral distribution normalized for all the processing windows E03 set in the acquired image E01 when the wafer 2 is inserted obliquely into the i-th slot to be detected, and the vertical axis indicates the processing window. This represents the number E03. By the way, as described in the section of the problem to be solved by the invention, the carrier 1 has a two-point support type in which the wafer 2 is supported from the guides on both sides inside the carrier 1 and the side opposite to the opening of the carrier 1. There are four-point support types that support even two guides inside. In the case of the two-point support type carrier 1, when the wafer 2 is inserted obliquely, as shown in FIG. 17D, a normalized peak (i) F02 appears in the oblique insertion determination area G02. However, in the case of the four-point support type, depending on the position of the guide on which the wafer 2 is mounted, as shown in FIG. 18, the normalization peak (i ) F02 may appear. In this case, it is necessary to determine the diagonal insertion from the normalized peak (i) F02 appearing in the normal insertion determination area G01. In this embodiment, a method for realizing this is shown by adding Step 201 and Step 202. ing. First, the position of the normalized peak (i) F02 is obtained within the normal insertion determination area G01 of each processing window E03. As for this position, the position of the U coordinate is obtained together with the position of the V coordinate obtained in step 105. The U coordinate may be, for example, the center position of the processing window E03. Next, using the obtained normalized peak (i) F02 position, these are approximated to a straight line. For approximation to a straight line, for example, a widely used method for obtaining a linear regression line may be used. Then, the angle of the straight line is calculated from the obtained slope of the straight line. In FIG. 18, a straight line from the upper right to the lower left is obtained, and the angle of the straight line is calculated.
In step 202, the angle calculated in step 201 is compared with this angle threshold value using a preset threshold value (angle threshold value) related to the angle for determining that the wafer 2 is inserted obliquely. If the angle calculated in step 201 is larger than the angle threshold, it is determined that the wafer 2 is inserted obliquely into the i-th slot to be detected, and the processing for that slot is terminated. Otherwise, it is determined that one wafer 2 is normally inserted in the target slot, and the processing for that slot is terminated.

  As described above, according to the second embodiment of the present invention, in accordance with the effect in the first embodiment, even when the normalized peak (i) F02 appears in the normal insertion determination area G01, the determination of the diagonal insertion is made. Therefore, it is possible to cope with various oblique insertions, and it is possible to detect the stored state of the wafer 2 with respect to a large number of carriers 1 without limiting the types of the carriers 1.

(3) Third Embodiment FIG. 3 is a flowchart of a thin substrate detection method according to the third embodiment, and 301 is a step in this flowchart. The difference from the second embodiment described with reference to FIG. 2 is that step 301 is added.
In step 301, when the height of the normalized peak (i) F02 existing in the normal insertion determination area G01 increases toward the outside of the processing window E03, the wafer 2 is placed in the i-th slot to be detected. It is determined that the card is popped out and inserted, and the processing for the slot is terminated. Otherwise, it is determined that one wafer 2 is normally inserted in the target slot, and the processing for that slot is terminated. FIG. 19 shows an example of pop-out insertion. J01 represents a pop-out wafer in which the wafer 2 is popped out and inserted into the i-th slot to be detected. When the wafer 2 protrudes and is inserted, as shown in FIG. 19, the illumination reflection part E02 moves outward (see FIG. 14 for comparison). FIG. 20 is a diagram for explaining determination of pop-out insertion according to the present embodiment. This figure shows the integral distribution normalized for all the processing windows E03 when the wafer 2 is in the insertion state shown in FIG. As shown in FIG. 20, as the illumination reflection part E02 moves outward, the height of the normalized peak (i) F02 increases toward the outside of the processing window E03. In FIG. 20, the height of the normalized peak (i) F02 increases in the order of processing window # 3 → # 2 → # 1, # 10 → # 11 → # 12. The present embodiment uses this property, and when the height of the normalized peak (i) F02 increases toward the outside of the processing window E03, the wafer 2 pops out to the slot to be detected. Is determined to be inserted.

  As described above, the third embodiment of the present invention is based on the height of the normalized peak (i) F02 existing in the normal insertion determination area G01 in accordance with the effects of the first and second embodiments. Since it is possible to determine whether the wafer 2 is popping out, it is possible to detect the storage state of all the wafers 2 such as no wafer, normal insertion, oblique insertion, two or more insertions, and popping insertion.

(4) Fourth Embodiment FIG. 4 is a flowchart of a thin substrate detection method according to a fourth embodiment, and 401 and 402 are steps of this flowchart. The difference from the second embodiment described with reference to FIG. 2 is that step 401 and step 402 are added.
In step 401, a normalized peak F02 (i + 1 and i-1) related to the slot adjacent to the i-th slot to be detected is detected, and a normalized peak F02 related to the adjacent slot is detected from the center position of the target slot on the integral distribution. The distance to (i + 1 and i-1) is measured. In step 402, a preset threshold value (distance threshold value) relating to the distance from the center position of the target slot to the normalized peak F02 (i + 1 and i-1) for determining that the wafer 2 in the adjacent slot has been popped out and inserted. ) To compare the distance calculated in step 401 with this distance threshold, and if the distance calculated in step 401 is larger than the distance threshold, the wafer is placed in the adjacent i + 1 or i−1th slot. 2 is popped out and inserted, and it is determined that one wafer 2 is normally inserted into the target slot, and the processing for that slot is finished. Otherwise, it is determined that one wafer 2 is normally inserted in the target slot, and the processing for that slot is terminated.
FIG. 21 is an example of pop-out insertion of adjacent slots. This figure shows a case where the wafer 2 protrudes and is inserted into the (i + 1) th slot which is an adjacent slot. When the wafer 2 is popped out and inserted, as shown in FIG. 21, in the acquired image E01, the image relating to the popped wafer J01 moves outward (see FIG. 14 for comparison). FIG. 22 is a diagram for explaining determination of pop-out insertion according to the present embodiment. This figure shows the integral distribution normalized for all the processing windows E03 when the wafer 2 is in the insertion state shown in FIG. As shown in FIG. 22, the position of the normalized peak (i + 1) F02 moves to the outside of the processing window E03 as the image related to the pop-out wafer J01 moves to the outside. Compared to FIG. 20, the position of the normalized peak (i + 1) F02 has moved to the left. In this embodiment, this property is utilized, and when the position of the normalized peak (i + 1) F02 is moved to the outside of the processing window E03, the wafer 2 jumps out and is inserted into the slot adjacent to the target slot. Judge that it has been. M01 is the slot center position, and is the position of the i-th slot to be detected in the acquired image E01. The slot center position M01 can be easily known if the positional relationship between the position of the camera 4 and the slot in the carrier 1 is obtained in advance by calibration. M02 is the peak position, which is the position of the normalized peak F02 related to the adjacent slot. M03 is a peak distance, which is a distance between the slot center position M01 and the peak position M02. These distances are compared with a distance threshold value for determining that the wafer 2 is popped out and inserted, and the i-th peak distance (i) M03 or the i-1st peak distance (i-1) M03 is the distance. If it is larger than the threshold value, it is determined that the wafer 2 is popped out and inserted into the adjacent i + 1 or i-1 th slot. In FIG. 22, since the i-th peak distance (i) M03 is larger than the distance threshold, it is determined that the wafer 2 is popped out and inserted into the i + 1-th slot.

  As described above, according to the fourth embodiment of the present invention, the distance M03 between the slot center position M01 and the position M02 of the normalized peak F02 related to the adjacent slot is adjusted in accordance with the effects of the first and second embodiments. Therefore, it is possible to determine whether or not the wafer 2 is popping out, so that it is possible to detect the stored state of all the wafers 2 including no wafer, normal insertion, oblique insertion, two or more insertions, and popping insertion.

(5) Fifth Embodiment FIG. 5 is a flowchart of a thin substrate detection method according to the fifth embodiment, and 501 is a step of this flowchart. The difference from the second embodiment described with reference to FIG. 2 is that step 501 is added.
In step 501, according to the position of the normalized peak F02 in the diagonal insertion determination area G02, it is checked whether the slot adjacent to the i-th slot to be detected is a diagonal insertion of a pair, and the adjacent slot is a diagonal of the pair. In the case of insertion, it is determined that the wafer 2 is inserted obliquely into the target slot and the adjacent slot, and the processing for the slot is finished. Otherwise, it is determined that the wafer 2 is inserted obliquely into the target slot, and the processing for that slot is terminated. FIG. 23 is an example of oblique insertion. N01 is a slot, and one wafer 2 is normally inserted into the (i + 1) th slot (i + 1) N01. N02 is an oblique wafer, which is inserted obliquely across the i-th slot (i) N01 and the i-1th slot (i-1) N01. As shown in this figure, the oblique wafer N02 is inserted across two slots N01. That is, diagonal insertion appears as a pair in two slots. For example, as shown in FIG. 17D, when the normalized peak F02 exists in the oblique insertion determination area G02 and it is determined that the insertion is oblique, the normalized peak F02 exists in which oblique insertion determination area G02. Depending on whether or not, the adjacent slot (in this case, the i-1th slot) also needs to be determined to be diagonally inserted. In consideration of the case where the adjacent slot is not determined to be diagonally inserted for some reason, this embodiment checks whether the adjacent slot is a diagonally inserted pair when the target slot is determined to be diagonally inserted. When the slot is a pair of diagonally inserted, it is determined that the wafer 2 is inserted diagonally into the target slot and the adjacent slot.

As described above, according to the fifth embodiment of the present invention, when the target slot is determined to be obliquely inserted in accordance with the effects of the first to fourth embodiments, the adjacent slot is a pair of diagonally. Check whether it is an insertion, and if the adjacent slot is a diagonal insertion of a pair, it is determined that the wafer 2 is inserted diagonally into the target slot and the adjacent slot, so the diagonal insertion is more reliably determined. Can do.
(6) Sixth Embodiment FIG. 6 is a flowchart of a thin substrate detection method according to the sixth embodiment, and 601 is a step of this flowchart. The difference from the second embodiment described with reference to FIG. 2 is that step 202 is replaced with step 601.
In step 601, in the process of step 202, when the angle calculated in step 201 is larger than the angle threshold, the wafer 2 is inserted obliquely into the i-th slot to be detected, and the slot adjacent to the target slot is The insertion state is determined to be indefinite, and the processing for the slot is terminated. Otherwise, it is determined that one wafer 2 is normally inserted in the target slot, and the processing for that slot is terminated. As described in the fifth embodiment, the oblique insertion of the wafer 2 appears as a pair in two slots. However, as described in the second embodiment, depending on the structure of the carrier 1, the normalization peak (i) F02 may appear in the normal insertion determination area G01 even if it is inserted obliquely. In this case, it is impossible to know which side of the adjacent slot is an oblique insertion pair. Therefore, in the present embodiment, in order to prevent the robot 2 taking out the wafer 2 from accidentally going to pick up the wafer 2 and damaging the wafer 2, etc. The insertion state of the adjacent slot is determined to be indefinite.

  As described above, in the sixth embodiment of the present invention, it is difficult to determine the insertion state when the target slot is determined to be obliquely inserted in accordance with the effects of the first to fifth embodiments. In some cases, it is determined that the adjacent slot is indefinite, and therefore, when the wafer 2 is taken out, it can be performed more safely.

(7) Seventh Embodiment FIG. 7 is a flowchart of a thin substrate detection method according to a seventh embodiment, and steps 701 to 704 are steps of this flowchart. Step 105 in the first embodiment described with reference to FIG. 1 includes steps 701 to 704.
Step 701 measures the positions and widths of all normalized peaks F02 within the normal insertion determination area G01 and the diagonal insertion determination area G02, and sets them as peak candidates. FIG. 24 is an example of peak detection. As a result of the processing in step 701, one normalized peak F02 is detected in the normal insertion determination area G01 in (a), one in (b), and two in (c).
In step 702, a value smaller than the width of the wafer 2 on the acquired image E01 is preset as a peak width threshold (small), and the detected width of the normalized peak F02 is compared with this peak width threshold (small). Then, when the width of the detected normalized peak F02 is smaller than the peak width threshold (small), the detected normalized peak F02 is not a peak. Otherwise, go to the next step 703. In FIG. 24, (a) normalized peak (i) F02 is not a peak.
In step 703, a value larger than the width of the wafer 2 on the acquired image E01 is preset as a peak width threshold (large), and the detected width of the normalized peak F02 is compared with this peak width threshold (large). Then, when the width of the detected normalized peak F02 is larger than the peak width threshold (large), the detected normalized peak F02 is not a peak. Otherwise, go to the next step 704. In FIG. 24, the normalized peak (i) F02 in (b) is not a peak.
In step 704, first, when there are a plurality of normalized peaks F02 detected in the normal insertion determination area G01, the distance between the normalized peaks F02 is measured from the position of the detected normalized peak F02. Next, the distance between the normalized peaks F02 measured using a preset threshold (distance between peaks) regarding the distance between the normalized peaks F02 when two wafers 2 are inserted, and this peak. When the distance between the measured normalization peaks F02 is smaller than the distance threshold between the peaks compared with the distance between thresholds, one of the detected normalization peaks F02 is not a peak. Otherwise, go to the next step 106. In FIG. 24, the normalized peak in (c) (i) the peak on the right side of F02 is not a peak.

  As described above, the seventh embodiment of the present invention is normalized by the width of the normalized peak F02 and the distance between the normalized peaks F02 in accordance with the effects of the first to sixth embodiments. Since the candidates for the peak F02 can be narrowed down, the normalized peak F02 can be detected more accurately, and as a result, the stored state of the wafer 2 can be detected more correctly.

(8) Eighth Embodiment FIG. 8 is a flowchart of a thin substrate detection method according to the eighth embodiment, and steps 801 to 803 are steps of this flowchart. The difference from the first embodiment described with reference to FIG. 1 is that steps 801 to 803 are added.
In step 801, the maximum value of the integral distribution is acquired in the normal insertion determination area G01 and the diagonal insertion determination area G02 for all the processing windows E03. This maximum value is the maximum value of the integral distribution shown in FIG. 15B and is not the maximum value of the integral distribution (normalized) in FIG. In the case of FIG. 15B, the peak (i) F01 is the maximum value obtained.
In step 803, it is checked whether or not the detection of the storage state of the wafer 2 is completed for all slots in the carrier 1. If not completed, the process proceeds to the next slot. The process proceeds to step 802. Therefore, the maximum value of the integral distribution acquired in step 801 is the maximum value for all slots.
In step 802, a threshold value (maximum value threshold value) relating to the maximum value of the integral distribution for determining that no wafer 2 is inserted is compared with the maximum value of the integral distribution acquired in step 801. If the maximum value of the integral distribution acquired in step 801 is smaller than the maximum value threshold, it is determined that the wafers 2 are not inserted in all slots of the carrier 1, and the process ends. Otherwise, the process ends with the insertion state determined in each slot.

  The reason for confirming that the wafers 2 are not inserted into all the slots after the processing for all the slots is completed will be described next. Even if the wafers 2 are not inserted in all slots, the integral distribution is normalized by a value from 0 to 255 in step 103. By the way, even when the wafers 2 are not inserted into all slots, the integral distribution does not become zero due to disturbance light, the influence of the illumination 29 reflected by the inner surface on the side opposite to the opening of the carrier 1, or the like. If the state is normalized, there is a possibility that the normalized peak F02 is detected in step 105. If the normalized peak F02 is detected, there is a possibility that it is erroneously determined that the wafer 2 is inserted. In the present embodiment, in order to prevent this erroneous determination, a threshold (maximum value threshold) regarding the maximum value of the integral distribution for determining that no wafer 2 is inserted and the maximum of the acquired integral distribution. After the processing for all slots is completed using the value, processing for determining whether or not the wafer 2 is inserted into all slots is added.

  As described above, according to the eighth embodiment of the present invention, the maximum value threshold value and the integral distribution acquired after the processing for all slots is completed in accordance with the effects of the first to seventh embodiments. Is compared with the maximum value of each of the slots, and it is determined whether or not the wafer 2 is inserted in all the slots. Therefore, it is possible to determine the state in which the wafer 2 is not inserted more reliably. As a result, the wafer 2 is stored. The state can be detected more correctly.

(9) Ninth Embodiment FIG. 9 is a flowchart of a thin substrate detection method according to a ninth embodiment, and 901 is a step in this flowchart. The difference from the first embodiment described with reference to FIG. 1 is that step 901 is added.
In step 901, spike-like noise or sawtooth noise in the integral distribution obtained in step 102 is removed or reduced. The integral distribution may not have a smooth peak shape as shown in FIG. 15B due to ambient light or the shape of the end face of the wafer 2. FIG. 25 is an example of noise. (A) represents spike noise and (b) represents sawtooth noise. When such noise appears on the peak F01, the normalized peak F02 may be erroneously detected in step 105. If it is erroneously detected, the insertion state of the wafer 2 cannot be correctly determined. Therefore, in this embodiment, after the integration in step 102, the noise in the integrated distribution is removed or reduced. For example, in the case of the spike-like noise in FIG. 25A, in the integral distribution, the attention point is compared with the surrounding height, and if the attention point is larger than a certain value from the periphery, the attention point may be lowered. . In the case of the sawtooth noise of (b), the average of the attention point and its periphery may be calculated in the integral distribution, and the average may be used as the value of the attention point.

As described above, the ninth embodiment of the present invention removes or reduces the noise of the integral distribution in accordance with the effects of the first to eighth embodiments, so that the normalized peak F02 is more accurately detected. As a result, the stored state of the wafer 2 can be detected more correctly.

(10) Tenth Embodiment FIG. 10 is a flowchart of a thin substrate detection method according to the tenth embodiment, and A01 is a step in this flowchart. The difference from the first embodiment described with reference to FIG. 1 is that step A01 is added.
In step A01, the change in the integral distribution on the uppermost or lowermost side of the oblique determination area G02 and the oblique determination area G02 is processed to zero for the uppermost or lowermost slot of the carrier 1. For example, the carrier 1 has slots from the first to the 25th slot, the first slot is the bottom end, and the 25th slot is the top end. In the case of the first slot, referring to FIG. 16, when the detection target slot is the first slot, the normalized peak (i) F02 is the peak corresponding to the first slot, so There is no chemical peak (i-1) F02. The right diagonal insertion determination area G02, that is, the diagonal insertion determination area G02 on the lowermost side of the slot 1, also has a normalization peak (i) F02 because there is no diagonal insertion between the zeroth slot and the first slot. There is no. However, the edge of the carrier 1 may appear in the acquired image E01 under the slot 1 which is the lowermost end. In this case, although not related to the wafer 2, a peak shape appears. In the present embodiment, in order to prevent the peak corresponding to the edge of the carrier 1 from appearing, the uppermost end of the oblique determination area G02 and the uppermost end of the oblique determination area G02 or Change the change in the integral distribution at the bottom end to zero.

  As described above, according to the tenth embodiment of the present invention, the upper end side or the lowermost end slot of the carrier 1 is compared with the upper end side or the lower end slot according to the effects of the first to ninth embodiments. In order to prevent the bottom peak from appearing, the normalized peak F02 can be detected more accurately without being affected by the edge of the carrier 1, and as a result, the stored state of the wafer 2 can be detected more correctly.

(11) Eleventh Embodiment FIG. 11 is a flowchart of a thin substrate detection method according to the eleventh embodiment, and B01 to B03 are steps of this flowchart. The difference from the second embodiment described with reference to FIG. 2 is that steps B01 to B03 are added.
In step B01, the integral distribution obtained in step 102 is second-order differentiated in a direction orthogonal to the wafer 2 to obtain a second-order derivative distribution. In step B02, the secondary differential distribution is normalized. In step B03, the peak position is recalculated using the secondary differential distribution.
FIG. 26 is an example of recalculation of peak positions. (A) represents the integral distribution obtained in step 102. In this case, spike noise is present at the peak (i) F01 of the i-th slot to be detected. If the peak position (i) M02 is detected without removing or reducing the spike noise, the peak position (i) M02 is influenced by the spike noise and the peak position (i) M02 is the center of the original peak as shown in FIG. It will not be in position. If the peak position (i) M02 is deviated, the peak angle is increased in step 201, and even if the wafer 2 is not inserted obliquely in step 202, it may be determined that the wafer 2 is inserted obliquely. is there. In the present embodiment, this peak position is corrected using the second-order differential distribution of the integral distribution. FIG. 26B shows a distribution obtained by normalizing the integral distribution of FIG. (C) represents a state in which the peak position of the i-th slot to be detected is recalculated using an appropriate threshold th for the second-order differential distribution (normalization). Q01 is a recalculation peak position, and represents the center position of the location where the secondary differential distribution (normalization) for the i-th slot to be detected is below the threshold th. Thus, the peak position (i) M02 detected and shifted using the integral distribution is corrected as the recalculated peak position (i) Q01 using the second-order differential distribution.

  As described above, in the eleventh embodiment of the present invention, the peak position is corrected by using the second-order differential distribution obtained by second-ordering the integral distribution in accordance with the effects of the first to tenth embodiments. Therefore, the peak position can be obtained more accurately, and the angle of the wafer 2 can be calculated more correctly. As a result, the stored state of the wafer 2 can be detected more correctly.

(12) Twelfth embodiment (corresponding to the content of claim 3)
FIG. 12 is a flowchart of the thin substrate detection method according to the twelfth embodiment, and C01 to C04 are steps of this flowchart. The difference from the first embodiment described with reference to FIG. 1 is that Step 103 is Step B01, Step 105 is Step C01, Step 107 is Step C02, Step 108 is Step C03, and Step 109 is Step C04. In addition, each is replaced.
In step C01, using the preset threshold th for the secondary differential distribution for determining that the wafer 2 exists, the calculation is performed in step B01 in the normal insertion determination area G01 and the diagonal insertion determination area G02. The second-order differential distribution is compared with the threshold value th, and a portion where the second-order differential distribution calculated in step B01 is larger than the threshold value th is detected as a wafer portion. In step 106, the presence / absence of the wafer portion is checked in the normal insertion determination area G01, the width of the wafer portion is measured, the presence / absence of the wafer portion is checked in the oblique insertion determination area G02, and the insertion state of the processing window E03 is determined. judge. FIG. 27 is a determination example of the insertion state of the processing window using the second order differentiation. R01 is a wafer portion, and represents a portion where the secondary differential distribution is larger than the threshold th in the normal insertion determination area G01 and the oblique insertion determination area G02. In step C01, this wafer portion R01 is detected for all processing windows E03. Then, in step 106, when there is a wafer portion R01 in FIG. 27 (a) normal insertion determination area G01, and the width that cuts the threshold th in the wafer portion R01 is one wafer, (b) normal insertion determination When there is no wafer portion R01 in the area G01 and the oblique insertion determination area G02, (c) when there is the wafer portion R01 in the normal insertion determination area G01, the width that cuts the threshold th in the wafer portion R01 is equal to or more than two wafers In the case of (d), the wafer portion R01 is classified in the oblique insertion determination area G02.
In Step C02, using the insertion state determination result of all processing windows E03 in Step 106, when there is no wafer portion R01 in the normal insertion determination area G01 and the diagonal insertion determination area G02 of all the processing windows E03 (FIG. 27 (b) )), It is determined that there is no wafer 2 in the i-th slot to be detected, and the processing for that slot is terminated. If not, go to the next step.
In step C03, using the insertion state determination result of all processing windows E03 in step 106, when there is at least one processing window E03 in which the wafer portion R01 exists in the oblique insertion determination area G02 (as shown in FIG. 27D). In the state), it is determined that the wafer 2 is inserted obliquely into the i-th slot to be detected, and the processing for that slot is terminated. If not, go to the next step.
In step C04, using the insertion state determination result of all processing windows E03 in step 106, when there is at least one processing window E03 in which the width of the wafer portion R01 corresponds to a plurality of wafers in the normal insertion determination area G01 (FIG. 27 ( In the state (c), it is determined that two or more wafers 2 are inserted in the i-th slot to be detected, and the processing for the slot is terminated. Otherwise, it is determined that one wafer 2 is normally inserted in the target slot, and the processing for that slot is terminated.
If the above steps are performed for all slots in the carrier 1, the stored state of the wafer 2 in the carrier 1 can be detected.

  As described above, the twelfth embodiment of the present invention does not require geometric transformation of the image such as geometric correction for the image E01 acquired with respect to the slot to be detected. Is not necessary and takes time. Further, since only the wafer portion of the second-order differential distribution in the processing window E03 is detected and the insertion state of the wafer 2 is determined, an enormous amount of calculation like the Hough transform is not required, and the cost of the system can be suppressed. it can. In addition, since the wafer 2 can be detected by a unified method of detecting the wafer portion of the second order differential distribution in the processing window E03 and determining the insertion state of the wafer 2, there is no need to switch the processing according to the insertion state. Easy for users to handle. Even if notches and orientation flats enter the processing window E03, since a plurality of processing windows E03 are arranged in close contact with each other in step 101, the wafer portion can always be detected in some processing window E03. No special treatment is required to deal with orientation flats. Further, since reference data for comparison is not required according to the insertion state and surface state of the wafer 2, processing can be performed at high speed, memory resources can be reduced, and system cost can be reduced.

(13) Thirteenth Embodiment FIG. 13 is a flowchart of a thin substrate detection method according to a thirteenth embodiment. The difference from the twelfth embodiment described with reference to FIG. 12 is that step B02 is added.
In step B02, the secondary differential distribution obtained in step B01 is normalized. In this case, in step C01, a predetermined threshold th relating to the normalized second-order differential distribution for determining that the wafer 2 exists is used in the normal insertion determination area G01 and the diagonal insertion determination area G02. Then, the normalized secondary differential distribution calculated in step B02 is compared with the threshold th, and a portion where the normalized secondary differential distribution calculated in step B02 is larger than the threshold th is detected as a wafer portion.

As described above, according to the thirteenth embodiment of the present invention, the second-order differential distribution is normalized in step B02 and the wafer portion is detected in step C01 in accordance with the effect in the twelfth embodiment. Parameters such as the threshold th are strong against ambient brightness fluctuations, and as a result, the stored state of the wafer 2 can be detected more robustly.
In the embodiment described above, the processing window E03 is disposed in close contact in step 101. However, the present invention is not limited to this, and the notch or orientation flat is not located at the opening of the carrier 1, that is, When it is possible to assume that the notch or orientation flat does not enter the field of view of the camera 4 or when the peak F01 corresponding to the notch or orientation flat portion can be detected even if the processing window E03 is not in close contact, the processing window E03. You may arrange | position, without sticking. Conversely, in order to further improve the detection performance of the peak F01, the processing window E03 may be arranged so as to have overlapping portions.
In addition, an image is acquired for the i-th slot that is a detection target and the insertion state is determined. However, the present invention is not limited to this, and a plurality of detection target slots are provided for one image. You may make it judge those insertion states.
In step B01, the integral distribution is second-order differentiated to obtain a second-order derivative distribution. Based on the second-order derivative distribution, the peak position is recalculated in step B03, or the wafer portion R01 is detected in step C01. However, the present invention is not limited to this, and as long as the portion corresponding to the wafer can be detected from the integral distribution, it is not always necessary to use the second derivative. For example, the first derivative may be used for detection.
Further, for example, in the first embodiment, the processing from step 101 to step 109 is sequentially executed. However, the present invention is not limited to this. For example, the determination area setting in step 104 is performed before step 101. However, as can be done, the order of steps may be changed depending on the contents of processing.

The flowchart of the thin substrate detection method which concerns on the 1st Embodiment of this invention. Flowchart of thin substrate detection method according to second embodiment of the present invention Flowchart of thin substrate detection method according to third embodiment of the present invention Flowchart of a thin substrate detection method according to the fourth embodiment of the present invention. Flowchart of thin substrate detection method according to fifth embodiment of the present invention Flowchart of thin substrate detection method according to sixth embodiment of the present invention Flowchart of thin substrate detection method according to seventh embodiment of the present invention Flowchart of thin substrate detection method according to eighth embodiment of present invention Flowchart of thin substrate detection method according to ninth embodiment of the present invention Flowchart of a thin substrate detection method according to the tenth embodiment of the present invention. Flowchart of thin substrate detection method according to eleventh embodiment of the present invention Flowchart of thin substrate detection method according to twelfth embodiment of the present invention Flowchart of thin substrate detection method according to thirteenth embodiment of the present invention The figure showing the example of a setting of the processing window concerning the embodiment of the present invention The figure showing the example of the integral distribution which concerns on embodiment of this invention The figure showing the example of a setting of the determination area which concerns on embodiment of this invention The figure showing the example of determination of the insertion state of the processing window concerning the embodiment of the present invention The figure explaining the angle calculation of the peak which concerns on embodiment of this invention The figure showing the pop-out insertion example which concerns on embodiment of this invention The figure explaining the judgment of popping out insertion with the peak height concerning an embodiment of the present invention The figure showing the example of pop-out insertion of the adjacent slot which concerns on embodiment of this invention The figure explaining the judgment of pop-out insertion with the peak distance concerning an embodiment of the present invention The figure showing the example of the diagonal insertion which concerns on embodiment of this invention The figure showing the example of peak detection which concerns on embodiment of this invention The figure showing the noise example which concerns on embodiment of this invention The figure showing the recalculation example of the peak position which concerns on embodiment of this invention The figure showing the example of determination of the insertion state of the processing window using the secondary differentiation which concerns on embodiment of this invention The figure explaining the principle of the thin board | substrate detection method based on 1st prior art The figure showing the example of a processing result calculated | required when judging the presence or absence of the wafer which concerns on 1st prior art The figure showing the example of a processing result calculated | required when judging the pop-out of the wafer which concerns on 1st prior art The figure showing the example of a processing result calculated | required when judging the several wafer of the 1st prior art The figure showing the example of a processing result of the thin board | substrate detection method using the Hough transformation based on 1st prior art Configuration diagram of apparatus for detecting thin substrate according to second prior art

Explanation of symbols

1 Carrier 2 (2-1 to 2-n) Wafer 4 Camera 12 Table 13 Door 23 Image processing device 29 Illumination 72 Lid E01 Acquired image E02 Illumination reflector E03 Processing window F01 Peak F02 Normalization peak G01 Normal insertion determination area G02 Oblique Insertion determination area J01 Pop-out wafer M01 Slot center position M02 Peak position M03 Peak distance N01 Slot N02 Oblique wafer Q01 Recalculation peak position R01 Wafer part

Claims (2)

A thin substrate detection device for detecting a storage state of the thin substrate in a carrier in which a plurality of slots for horizontally storing the thin substrate are arranged in a vertical direction,
Imaging means for acquiring an image relating to the slot;
A plurality of rectangular processing windows whose longitudinal directions are orthogonal to the plurality of slots on the two-dimensional coordinates of the image acquired by the imaging means are arranged side by side in a horizontal direction, and specific targets to be detected in the processing windows A normal insertion determination area and a diagonal insertion determination area for determining the position of the thin substrate in the slot are set, and the integral distribution in the vertical direction of the luminance of the image in each processing window is obtained, and the normal insertion determination area and the diagonal insertion determination area are obtained. In the insertion determination area, the peak of the integral distribution is detected, and the insertion state of each processing window is determined based on the presence of the peak in the normal insertion determination area and the peak in the oblique insertion determination area. Storage state detection means for determining,
The storage state detecting means includes
When the peak does not exist in all of the normal insertion determination area and the oblique insertion determination area, it is determined that the thin board is not in the target slot,
When a plurality of the peak positions existing in the normal insertion determination area are approximated to a straight line, an angle is calculated from the straight line, and the angle is compared with a preset angle threshold, and the angle is larger than the angle threshold Determines that the thin substrate is inserted obliquely into the target slot,
A thin substrate detection apparatus, wherein when there is even one processing window having a plurality of peaks in the normal insertion determination area, it is determined that a plurality of the thin substrates are inserted into the target slot. . A thin substrate detection device for detecting a storage state of the thin substrate in a carrier in which a plurality of slots for horizontally storing the thin substrate are arranged in a vertical direction,
Imaging means for acquiring an image relating to the slot;
A plurality of rectangular processing windows whose longitudinal directions are orthogonal to the plurality of slots on the two-dimensional coordinates of the image acquired by the imaging means are arranged side by side in a horizontal direction, and specific targets to be detected in the processing windows A normal insertion determination area and an oblique insertion determination area for determining the position of the thin substrate in the slot are set, the vertical integral distribution of the luminance of the image in each processing window is obtained, and the integral distribution is set in the vertical direction. A second-order differential distribution is obtained by second-order differentiation, and a portion in which the second-order differential distribution is larger than the preset threshold in the normal insertion determination area and the oblique insertion determination area is defined as a thin substrate portion. Detected based on the thin substrate portion in the normal insertion determination area, the width of the thin substrate portion, and the presence or absence of the thin substrate portion in the oblique insertion determination area. Anda storage state detecting means for determining the insertion state of the respective processing windows Te,
The storage state detecting means includes
If the thin substrate portion does not exist in all of the normal insertion determination area and the oblique insertion determination area, it is determined that the target substrate does not have the thin substrate,
When there is even one processing window where the thin substrate portion exists in the oblique insertion determination area, it is determined that the thin substrate is inserted obliquely into the target slot;
If the width of the thin substrate portion is larger than the thin substrate portion width threshold by comparing the width of the thin substrate portion with a preset thin substrate portion width threshold within the normal insertion determination area, Determines that a plurality of the thin substrates are inserted.

Images