JP4626150B2 - Color filter substrate and method for manufacturing the same, liquid crystal device, and projection display device - Google Patents

Description

  The present invention relates to a color filter substrate provided with an optical interference type color filter, a manufacturing method thereof, a liquid crystal device provided with the color filter substrate, and a projection display device.

Conventionally, as a color filter used in a liquid crystal device or the like, an absorptive filter that transmits only light of a predetermined color and absorbs light of another color, and transmits only light of a predetermined color and reflects other light. A reflection type filter is known. One of the reflection filters is an optical interference filter using a dielectric multilayer film (see, for example, Patent Document 1 and Patent Document 2).
In this interference filter, the wavelength of transmitted light can be changed by appropriately configuring the layer structure of the dielectric multilayer film. Therefore, a light interference type color filter array can be formed by juxtaposing a plurality of three types of filters having transmission wavelengths of, for example, R (red), G (green), and B (blue). That is, a color filter substrate can be formed by forming such a color filter array on the substrate.

Such an optical interference type color filter has the following characteristics.
(1) Color purity is extremely high.
(2) Since it is composed of an inorganic material, there is almost no deterioration due to light or heat.
(3) Since unnecessary light is reflected, the reflected light can be reused by devising the optical system.

  By the way, in order to form a color filter substrate provided with such a light interference type color filter, a known method called a lift-off method is usually employed. That is, a red filter layer, a green filter layer, and a blue filter layer are respectively formed on the substrate by a lift-off method to obtain a color filter substrate.

For example, when the color filter substrate is used in a liquid crystal device, a transparent electrode and further a light shielding layer are usually formed on the formed color filter.
That is, as shown in FIG. 9A, a red color filter 2R, a green color filter 2G, and a blue color filter 2B are respectively formed on a substrate 1 by a lift-off method, and then TEOS (tetraethoxysilane) is formed. The overcoat layer 3 is formed by a CVD method using

Subsequently, as shown in FIG. 9B, the formed overcoat layer 3 is ground and polished by a CMP method (chemical mechanical polishing method) or the like, and is flattened.
Next, as shown in FIG. 9C, a light shielding layer 4 is formed between the color filters, and then, as shown in FIG. 9D, a transparent electrode 5 made of ITO is formed so as to cover the light shielding layer 4. .
In addition, the overcoat layer 3 is ground and polished to be flattened. If there are irregularities, the position (height) of the transparent electrode 5 formed on the overcoat layer 3 varies depending on the location. As a result, the cell gap also varies. That is, the color filter substrate thus formed is bonded to a TFT substrate through, for example, a liquid crystal to form a liquid crystal device. At this time, the position (height) of the transparent electrode 5 on the color filter substrate If there is variation, the gap (cell gap) between the transparent electrode 5 and the electrode on the TFT substrate side varies, and stable display cannot be performed.
JP 07-287115 A JP 11-295517 A

However, the above-described method for manufacturing a color filter substrate has the following problems to be solved.
The optical interference type color filter 2 using the dielectric multilayer film is usually formed on the substrate 1 by a vapor deposition method. The color filter 2 formed in this way has a relatively close adhesion to the substrate 1. It tends to be weak. Therefore, when the overcoat layer 3 is formed on the optical interference type color filter and then the overcoat layer 3 is ground and polished by the CMP method, the color filter 2 is peeled off from the substrate 1 due to mechanical stress. There is a fear.

The transparent electrode 5 is usually formed by sputtering or vapor deposition. At this time, the color filter 2 or the like may be adversely affected by thermal stress or the like, so that the film is formed at a sufficiently high temperature. Therefore, there is a problem that the transparent electrode 5 cannot be formed with sufficiently high quality.
The present invention has been made in view of the above circumstances, and an object of the present invention is a color filter substrate in which peeling of the optical interference color filter from the substrate is prevented and the quality of the transparent electrode can be improved. An object of the present invention is to provide a manufacturing method thereof, a liquid crystal device including the color filter substrate, and a projection display device.

In order to achieve the above object, a color filter substrate of the present invention comprises a filter side substrate on which an optical interference color filter is formed and a base body having an electrode side substrate on which a transparent electrode is formed. The surface on which the optical interference type color filter is formed and the surface opposite to the surface on which the transparent electrode is formed on the substrate are joined through an adhesive layer made of an adhesive.
According to this color filter substrate, since the base is bonded onto the optical interference type color filter via the adhesive layer, the transparent electrode in the base is formed on the electrode side substrate. However, there is almost no variation in height depending on the formation location. That is, if a glass substrate is used as the electrode-side substrate, for example, the surface usually has good flatness, so that the height of the transparent electrode does not vary depending on the place of formation. Therefore, for example, when this color filter substrate is applied to a liquid crystal device, variations in the cell gap are prevented, thereby ensuring display stability.

Further, since the optical interference type color filter is covered with an adhesive layer made of an adhesive, this color filter substrate can be produced by bonding the base body without performing flattening by grinding and polishing as in the prior art. . Therefore, there is no possibility that the color filter peels off due to the planarization.
In addition, since the transparent electrode is formed on the electrode side substrate, even if the transparent electrode is formed at a high temperature, thermal effects such as thermal stress at that time are directly transmitted to the color filter or the adhesive layer, for example. Not alleviated by the electrode side substrate. Therefore, the transparent electrode can be formed at a high temperature, and the quality of the transparent electrode can be improved.

Moreover, in the said color filter substrate, it is preferable that the transparent electrode formation surface of the said electrode side board | substrate in which the transparent electrode was formed is planarized.
In this way, the variation in height depending on the location where the transparent electrode is formed can be more reliably eliminated, and therefore the variation in the cell gap can be more reliably prevented.

In the color filter substrate, it is preferable that the adhesive layer contains an ultraviolet absorber.
In this way, for example, when this color filter substrate is applied to a liquid crystal device, the ultraviolet light from the light source is prevented from entering the liquid crystal or the alignment film by being absorbed by the ultraviolet absorber in the adhesive layer. . Therefore, the deterioration of the liquid crystal and the alignment film due to the ultraviolet rays and the deterioration of the adhesive layer due to the ultraviolet rays are prevented, thereby improving the light resistance reliability.

In the color filter substrate, it is preferable that an ultraviolet reflective film is provided on the surface of the base on the adhesive layer side.
In this way, for example, when this color filter substrate is applied to a liquid crystal device, the ultraviolet light from the light source is prevented from being incident on the liquid crystal or the alignment film by being reflected by the ultraviolet reflecting film. Therefore, the deterioration of the liquid crystal and the alignment film due to the ultraviolet rays is prevented, thereby improving the light resistance reliability.

In the color filter substrate, the base includes a microlens formed on a lens side substrate, the electrode side substrate is provided on the microlens, and the transparent electrode is formed on the electrode side substrate. Preferably it is.
In this way, since both the color filter and the microlens are provided, the color filter substrate with higher functionality can be obtained. Moreover, since not only the electrode side substrate but also the lens side substrate is interposed between the transparent electrode, the adhesive layer, and the color filter, the thermal influence when the transparent electrode is formed at a high temperature is alleviated better. .

In the color filter substrate, the light interference color filter includes a red filter layer that transmits red light, a green filter layer that transmits green light, and a blue filter layer that transmits blue light. Preferably it is.
If it does in this way, a light interference type color filter will be a color filter array which makes full color.

The method for producing a color filter substrate of the present invention includes the step of adhering the electrode side substrate to the surface of the filter side substrate on which the optical interference type color filter is formed, on the side on which the optical interference type color filter is formed, It comprises a step of polishing and flattening the outer surface of the electrode side substrate, and a step of forming a transparent electrode on the outer surface of the electrode side substrate after the flattening.
According to this method for manufacturing a color filter substrate, the electrode side substrate is adhered to the optical interference type color filter with an adhesive, so that even if the outer surface of the electrode side substrate is polished and flattened thereafter, the electrode side substrate The adhesive layer made of an adhesive is interposed between the optical interference color filter and the optical interference color filter, so that the mechanical stress at the time of flattening is dispersed in the adhesive layer, thus preventing the color filter from peeling off. .
In addition, since the transparent electrode is formed on the outer surface of the electrode side substrate, even if the transparent electrode is formed at a high temperature, the thermal effects such as thermal stress at that time are not directly transmitted to the color filter or the adhesive layer, for example. It is relaxed by the electrode side substrate. Therefore, the transparent electrode can be formed at a high temperature, and the quality of the transparent electrode can be improved.

Another method of manufacturing a color filter substrate according to the present invention includes a filter side substrate on which an optical interference color filter is formed, a transparent electrode, and at least one of the surface on which the transparent electrode is formed and the opposite side in advance. A flattened electrode side substrate is prepared, and then the surface of the filter side substrate on which the optical interference color filter is formed and the surface of the electrode side substrate opposite to the side on which the transparent electrode is formed, It is characterized by joining through an adhesive.
According to this method for manufacturing a color filter substrate, an electrode-side substrate is prepared in which at least one of the transparent electrode forming surface and the opposite surface is previously flattened. Since the formed filter-side substrate is bonded, mechanical stress when the electrode-side substrate is flattened does not reach the interference type color filter, and therefore the color filter can be reliably prevented from peeling off.
Further, since the transparent electrode is also formed in advance on the electrode side substrate, the adhesive layer made of the color filter or the adhesive is not affected at all by the thermal effect during the film formation of the transparent electrode. Can be formed at a high temperature, and the quality of the transparent electrode can be improved.

According to still another color filter substrate manufacturing method of the present invention, a microlens is formed on a lens side substrate, an electrode side substrate is provided on the microlens, and the transparent electrode is formed on the electrode side substrate. And a filter side substrate on which a light interference type color filter is formed, and then a surface of the filter side substrate on which the light interference type color filter is formed, and a microlens on the lens side substrate in the base member. It is characterized in that the formed side and the opposite side surface are joined via an adhesive.
According to this method for manufacturing a color filter substrate, the substrate and the filter-side substrate on which the optical interference color filter is formed are joined. For example, even if the substrate is flattened, the mechanical properties at that time The stress does not reach the interference type color filter, and therefore the color filter can be reliably prevented from peeling off.
Further, since the transparent electrode is also formed on the substrate in advance, the adhesive layer made of a color filter or an adhesive is not affected at all by the thermal effect during the film formation of the transparent electrode, and therefore the transparent electrode is heated to a high temperature. Thus, it is possible to form a film, and it is possible to improve the quality of the transparent electrode.
Further, since the obtained color filter substrate is provided with both the color filter and the microlens, the color filter substrate has a higher function.

The liquid crystal device of the present invention includes a color filter substrate, a TFT substrate, and a liquid crystal layer provided between the color filter substrate and the TFT substrate, and the color filter substrate is composed of the color filter substrate. It is characterized by that.
According to this liquid crystal device, as described above, since the color filter substrate is provided that does not peel off the color filter and can improve the quality of the transparent electrode, the liquid crystal device itself is also highly reliable and of high quality. It becomes.

The projection display device of the present invention includes a light source, a light modulation device that modulates light emitted from the light source, a projection unit that projects light modulated by the light modulation device, the light source, and the light modulation device. Or a color filter substrate disposed between the light modulation device and the projection unit, and the color filter substrate is composed of the color filter substrate.
According to this projection type display device, as described above, the projection type display device itself has high reliability because it has a color filter substrate that does not peel off the color filter and can improve the quality of the transparent electrode. High quality.

The present invention will be described in detail below.
First, a projection display device will be described as an embodiment of the present invention. FIG. 1 is a diagram showing a projection display device as one embodiment of the present invention, and reference numeral 10 in FIG. 1 denotes a projection display device. The projection display device 10 includes a light source 11 that emits white light, a rod integrator 12 that uniformizes the luminance distribution of the white light emitted from the light source 11, and white light that has the uniform luminance distribution into parallel light. A condenser lens system 13 for conversion, a liquid crystal device 16 that splits white light converted into parallel light into RGB color light, and modulates each color light that has been split, and a projection lens that projects the modulated color light onto the screen S 17 is a schematic configuration. The projection display device 10 is a single-plate projection color liquid crystal display device having a color filter substrate in a liquid crystal device 16 as a light valve.

The light source 11 includes a lamp 21 such as a metal halide that emits white light, and a reflector 22 that reflects the emitted white light.
As the rod integrator 12, a translucent rod-shaped light guide (for example, a glass rod), a tubular light guide whose inner surface is a reflection surface, or the like is used.
The condenser lens system 13 includes a condenser lens 25a and a condenser lens 25b so that light incident from the rod integrator 12 enters the liquid crystal device 16 as parallel light.

  The liquid crystal device 16 is an embodiment of the liquid crystal device of the present invention, and functions as a light valve as described above. As shown in FIG. 2, the TFT substrate 40, the color filter substrate 30, and these And a liquid crystal layer 43 serving as a light modulation layer held between the substrates 30 and 40.

  As shown in FIG. 3 which is an enlarged view of the main part of FIG. 2, the TFT substrate 40 has a transparent pixel electrode 41 made of ITO or the like in a matrix on a substrate body 40A made of glass or quartz. A plurality of arrays are formed. On the inner surface side of the substrate 40A, a blue pixel electrode 41b, a red pixel electrode 41r, and a green pixel electrode 41g for performing red display, blue display, and green display are arranged in parallel. These three pixel electrodes are arranged in parallel. One pixel is composed of 41b, 41r, and 41g. An alignment film 42 made of polyimide or the like is provided so as to cover these pixel electrodes 41 (41b, 41r, 41g). 2 and 3, illustration of switching elements, scanning lines, signal lines, etc. for controlling energization of the pixel electrodes is omitted.

  The color filter substrate 30 is an embodiment of the color filter substrate of the present invention. Color filters 32R, 32G, and 32B are formed on the filter-side substrate 31, and an adhesive layer 33 is further provided on the color-filter substrate 30 on the electrode side. A substrate 34 is formed, a light shielding layer 35 and a transparent electrode (common electrode) 36 are formed on the electrode side substrate 34, and an alignment film 37 made of polyimide or the like is provided to cover the transparent electrode 36.

The filter side substrate 31 is made of a translucent substrate such as glass or plastic.
The filter layers 32R, 32G, and 32B are optical interference types made of a dielectric multilayer film, and the filter layer 32R is a red filter layer that transmits red light (R) and reflects other color light. The filter layer 32G is a green filter layer that transmits green light (G) and reflects other color light, and the filter layer 32B is a blue filter that transmits blue light (B) and reflects other color light. It is a layer.

In this way, the dielectric multilayer film that reflects light in a specific wavelength region has an optical thickness determined by the refractive index and the layer thickness of a dielectric material having a high refractive index and a dielectric material having a low refractive index. The layer thickness is adjusted so that the center wavelength of the wavelength region becomes ¼ wavelength, and several to several tens of layers are alternately laminated by a method such as vapor deposition. A known method such as providing an antireflection layer, a spacer layer such as a half-wavelength layer, an adjustment layer, or the like in the middle of the layer to suppress ripples in reflection / transmission characteristics may be used in combination. As the dielectric material, Ta ₂ O ₅ , ZnS, TiO ₂ or the like is used as a material having a high refractive index, and MgF ₂ , SiO ₂ , Na ₃ AlF ₆ or the like is used as a material having a low refractive index. ing. Further, in order to change the target wavelength, the thickness of the dielectric layer may be adjusted, and it is not always necessary to change the dielectric material.

  The filter layers 32R, 32G, and 32B are provided corresponding to the red pixel electrode 43r, the green pixel electrode 43g, and the blue pixel electrode 43b of the TFT substrate 40, respectively, and are adjacent to each other in a matrix when viewed in plan. The islands are patterned so that they are arranged.

  An adhesive layer 33 is provided on the filter-side substrate 31 so as to cover the filter layers 32R, 32G, and 32B. The adhesive layer 33 is made of a translucent adhesive and is made of, for example, epoxy acrylate. Here, in the present embodiment, an ultraviolet absorber is added to the adhesive, and therefore the adhesive layer 33 contains the ultraviolet absorber. As the UV absorber, organic UV absorbers such as conventionally known benzophenone compounds and benzotriazole compounds can be used, and fine powders of inorganic UV absorbers such as titanium oxide and cerium oxide are also used. Is possible. As will be described later, such an adhesive is applied on the filter side substrate 31 so as to cover the filter layers 32R, 32G, and 32B, and then the electrode side substrate 34 is placed thereon and pressurized with an appropriate pressure. Further, the adhesive layer 33 is cured by being heated as necessary.

The electrode side substrate 34 is made of glass having high heat resistance and translucency, and is disposed on the filter side substrate 31 via the adhesive layer 33 and the filter layers 32R, 32G, 32B as described above. It is. A light shielding layer 35 is formed on the electrode side substrate 34 on the side opposite to the adhesive layer 33, and a transparent electrode 36 is formed to cover the light shielding layer 35.
The light shielding layer 35 is made of Al, Cr, or the like, and is formed and arranged in a lattice shape corresponding to positions that do not correspond to the filter layers 32R, 32G, and 32B in a plan view, that is, positions that become adjacent filter layers. It is a thing.
The transparent electrode 36 is made of a light-transmitting conductive material such as ITO, and is formed on the entire surface of the electrode side substrate 34 so as to cover the light shielding layer 35. An alignment film 37 made of polyimide or the like is provided so as to cover the transparent electrode 36.
In the present embodiment, the electrode-side substrate 34, the light shielding layer 35 formed on the electrode-side substrate 34, the transparent electrode 36, and the alignment film 37 constitute a substrate in the present invention.

Next, based on the manufacturing method of the color filter substrate 30 having such a configuration, a first embodiment of the manufacturing method of the color filter substrate of the present invention will be described.
In the first embodiment, first, as shown in FIG. 4A, a plurality of dielectric layers having different refractive indexes are laminated on a light-transmitting filter-side substrate 31 made of glass or the like. Then, filter layers 32R, 32G, and 32B having a thickness of about 3 μm are formed sequentially so that the transmitted colors are red, green, and blue, respectively. For the formation of the filter layers 32R, 32G, and 32B, a known method such as a lift-off method is employed as in the conventional case. The filter layers 32R, 32G, and 32B are formed so as to be opposed to the red pixel electrode 41r, the green pixel electrode 41g, and the blue pixel electrode 41b of the TFT substrate 40, respectively, The size is approximately the same as the corresponding pixel electrode 41.

  Next, an adhesive is applied to the surface of the filter side substrate 31 on which the filter layers 32R, 32G, and 32B are formed, on the side on which the filter layers 32R, 32G, and 32B are formed, and then the filter side is passed through the adhesive. The electrode side substrate 34 a is placed on the substrate 31 and the adhesive is cured as shown in FIG. 4B to join the electrode side substrate 34 a to the filter side substrate 31. Of course, an adhesive may be applied to the electrode side substrate 34a side. Here, the thickness of the adhesive layer 33 made of an adhesive is not particularly limited, but is formed so that the distance between the filter side substrate 31 and the electrode side substrate 34a is, for example, about 10 μm. In the present embodiment, the ultraviolet absorbent is added to the adhesive as described above.

  Next, the outer surface of the electrode side substrate 34a is ground and polished by a CMP method or the like, and the thickness thereof is reduced to, for example, about several hundred μm to several mm as shown in FIG. The electrode side substrate 34 having a predetermined thickness is obtained. At this time, although the electrode-side substrate 34a is ground and polished in order to make the electrode-side substrate 34a thin and flat, the adhesive layer 33 is interposed between the electrode-side substrate 34a and the filter layers 32R, 32G, and 32B. The mechanical stress at the time of flattening and flattening is dispersed by the adhesive layer 33, thereby preventing the filter layers 32R, 32G, and 32B from being peeled off.

Next, a light shielding layer 35 is formed on the planarized electrode side substrate 34 by sputtering or the like as shown in FIG.
Next, as shown in FIG. 4E, a transparent electrode 36 made of a transparent conductive film such as ITO is formed by sputtering or vapor deposition so as to cover the light shielding layer 35. At this time, even if the transparent conductive film is formed at a high temperature, since the transparent conductive film is formed on the outer surface of the electrode side substrate 34, the thermal effects such as thermal stress at that time may cause the filter layers 32R, 32G, Without being directly transmitted to 32B or the adhesive layer 33, the electrode-side substrate 34 is dispersed and relaxed, and cracks of the filter layer due to thermal stress can be prevented. Therefore, the transparent electrode 36 can be formed at a relatively high temperature, and the quality of the transparent electrode 36 can be improved.

Thereafter, an alignment film 37 is formed so as to cover the transparent electrode 36, thereby obtaining the color filter substrate 31 shown in FIGS.
In addition, the color filter substrate 31 thus obtained and the TFT substrate are opposed to each other and bonded together by a conventional method, and a liquid crystal is sealed between them to form a liquid crystal layer 43. The device 16 can be made.

In the color filter substrate 31 thus obtained, the transparent electrode 36 is formed on the flattened electrode-side substrate 34, so that the film thickness distribution among the filter layers 32R, 32G, and 32B. Even if there is, there will be no variation in the height of the transparent electrode 36 depending on the formation location. Therefore, for example, in the liquid crystal device 16 using the color filter substrate 31, the cell gap is prevented from being varied, thereby ensuring the display stability.
Further, as described above, the separation of the filter layers 32R, 32G, and 32B is prevented, and the quality of the transparent electrode 36 can be improved, so that the high reliability is obtained.

Further, since the adhesive layer 33 contains an ultraviolet absorber, in the liquid crystal device 16 using the color filter substrate 31, for example, in the projection display device 10, the ultraviolet light from the light source 11 is applied to the adhesive layer. By absorbing with the ultraviolet absorber in 33, it is possible to prevent the ultraviolet rays from entering the liquid crystal layer 43 and the alignment film 37. Therefore, deterioration of the liquid crystal layer 43 and the alignment film 37 due to ultraviolet rays and further deterioration of the adhesive layer 33 due to ultraviolet rays can be prevented, and light resistance reliability can be improved.
In addition, the projection display device 10 includes the liquid crystal device 16 including the color filter substrate 31 having the light interference type color filters (filter layers 32R, 32G, and 32B). (1) The color purity is extremely high.
(2) Since it is mainly composed of an inorganic material, there is almost no deterioration due to light or heat.
(3) Since unnecessary light is reflected, the reflected light can be reused by devising the optical system.
It has excellent effects such as.

Next, based on the manufacturing method of the color filter substrate 30, a second embodiment of the manufacturing method of the color filter substrate of the present invention will be described.
In the second embodiment, the filter layers 32R, 32G, and 32B are sequentially formed on the filter-side substrate 31 as shown in FIG. 4A, as in the first embodiment.

  Separately, an electrode side substrate 34a is prepared, and a light shielding layer 35 is formed thereon as shown in FIG. 5 (a). For the electrode-side substrate 34a, it is preferable to polish and flatten the surface on which the light shielding layer 35 is formed in advance in order to more reliably eliminate cell gap variations. Subsequently, as shown in FIG. 5B, a transparent electrode 36 made of a transparent conductive film such as ITO is formed so as to cover the light shielding layer 35, and an alignment film 37 is further formed so as to cover the transparent electrode 36. At this time, even if the transparent conductive film is formed at a high temperature, since the transparent conductive film (transparent electrode 36) is formed on the electrode side substrate 34a, the filter layers 32R and 32G on the filter side substrate 31 are naturally formed. , 32B and the adhesive layer 33 not formed are not affected at all by the thermal effect during the formation of the transparent conductive film. In the present embodiment, the alignment film 37 is formed in this step, but it is needless to say that the alignment film 37 may be formed as the final step of the color filter substrate.

Next, the back side of the electrode side substrate 34a, that is, the side opposite to the side where the light shielding layer 35 and the transparent electrode 36 are formed is ground and polished by CMP or the like, and the thickness thereof is as shown in FIG. Is thinned and flattened to obtain an electrode side substrate 34 having a predetermined thickness.
When the filter side substrate 31 and the electrode side substrate 34 are prepared in this way, an adhesive is applied to the surface of the filter side substrate 31 on which the filter layers 32R, 32G, and 32B are formed, and then this adhesive is applied. Then, the electrode side substrate 34 is placed on the filter side substrate 31 so that the alignment film 37 faces outside, and the adhesive is cured as shown in FIG. To join. In this embodiment as well, an adhesive to which an ultraviolet absorber is added is used.

In the color filter substrate 31 thus obtained, the electrode side substrate 34 is made of a relatively flat substrate such as glass, or is a previously flattened substrate. This electrode side substrate Since the transparent electrode 36 is formed on the surface 34, the transparent electrode 36 does not vary in height depending on the formation location. Therefore, for example, in the liquid crystal device 16 using the color filter substrate 31, the cell gap is prevented from being varied, thereby ensuring the display stability.
Further, after the electrode side substrate 34a is flattened, the flattened electrode side substrate 34 and the filter side substrate 31 are joined, so that the mechanical stress at the time of flattening does not reach the filter side substrate 31, Therefore, peeling of the filter layers 32R, 32G, and 32B can be reliably prevented.
Furthermore, since the transparent electrode 36 is also formed in advance on the electrode side substrate 34a, the filter layers 32R, 32G, 32B and the adhesive layer 33 are not affected at all by the thermal effect during the formation of the transparent electrode 36. Therefore, the transparent electrode 36 can be formed at a high temperature, and the quality of the transparent electrode 36 can be improved.

Further, since the adhesive layer 33 contains an ultraviolet absorber, in the liquid crystal device 16 using the color filter substrate 31, the ultraviolet light from the light source 11 is applied to the adhesive layer as in the first embodiment. By absorbing with the ultraviolet absorber in 33, it is possible to prevent the ultraviolet rays from entering the liquid crystal layer 43 and the alignment film 37. Therefore, deterioration of the liquid crystal layer 43 and the alignment film 37 due to ultraviolet rays and further deterioration of the adhesive layer 33 due to ultraviolet rays can be prevented, and light resistance reliability can be improved.
Further, even in the projection type display device 10, the excellent effects shown in the above (1) to (3) are exhibited as in the first embodiment.

The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the present invention. For example, in the embodiment, the number of filter layers is three, but the number can be four or more depending on the number of primary colors used for display. In that case, one pixel is constituted by four or more pixel electrodes accordingly.
Further, for example, in the color filter substrate 31 shown in FIG. 3, instead of adding an ultraviolet absorber to the adhesive (adhesive layer 33), the inner surface (adhesive layer 33 side) of the electrode side substrate 34 as shown in FIG. The ultraviolet reflective film 38 may be provided on this surface. The ultraviolet reflection film 38 can be formed of a dielectric multilayer film, similarly to the filter layers 32R, 32G, and 32B. That is, the optical thickness determined by the refractive index and the layer thickness of the dielectric material having a high refractive index and the dielectric material having a low refractive index is ¼ wavelength at the center wavelength in the target wavelength region. It can be formed by adjusting the layer thickness and alternately laminating several layers to several tens of layers by a method such as vapor deposition.

  By providing the ultraviolet reflection film 38 in this manner, in the liquid crystal device 16 using the color filter substrate 31, for example, in the projection display device 10, the ultraviolet light from the light source 11 is reflected by the ultraviolet reflection film 38. By doing so, it is possible to prevent the ultraviolet rays from entering the liquid crystal layer 43. Therefore, deterioration of the liquid crystal layer 43 and the alignment film 37 due to ultraviolet rays can be prevented, and light resistance reliability can be improved.

In the color filter substrate of the present invention, not only the color filters (filter layers 32R, 32G, 32B) but also microlenses may be provided. FIG. 7 is a view showing an embodiment of a color filter substrate in which microlenses are formed in addition to the filter layers 32R, 32G, and 32B. Reference numeral 50 in FIG. 7 denotes a color filter substrate.
In this color filter substrate 50, color filters 32 R, 32 G, and 32 B are formed on a filter-side substrate 31, and a base body 51 is provided thereon with an adhesive layer 33 interposed therebetween. In the base 51, a microlens 53 is formed on a lens-side substrate 52 made of a light-transmitting substrate such as glass, and an electrode-side substrate 34, a light shielding layer 35, a transparent electrode 36, and an alignment film 37 are formed thereon. It is a thing.

In order to manufacture the color filter substrate 50 having such a configuration, first, as in the first embodiment, as shown in FIG. 4A, filter layers 32R, 32G, 32B is formed sequentially.
Separately, a lens side substrate 52 is prepared, and a microlens array (microlens 53) is formed on the upper surface side of the lens side substrate 52 by a conventional method. That is, first, as shown in FIG. 8A, concave portions 54 for forming a microlens array are formed on the upper surface side of the lens side substrate 52 so as to correspond to the filter layers 32R, 32G, and 32B, respectively. Form. As a method of forming the concave portion 54, for example, a mask having through holes formed at positions corresponding to the concave portions 54 is provided on the upper surface side of the lens side substrate 52. Then, wet etching is performed on the lens-side substrate 52 using this mask. Then, by this wet etching, the lens side substrate 52 is etched isotropically with respect to the through hole, thereby forming a concave portion 54 whose inner surface is substantially hemispherical as shown in FIG. It is formed.

When the recesses 54 are formed in this way, an adhesive, for example, epoxy acrylate, which becomes a lens material, is applied in a state in which these recesses 54 are embedded, as shown in FIG. The electrode side substrate 34 a is bonded through the layer 55. Subsequently, the adhesive layer 55 is cured, and the adhesive (adhesive layer 55) in the recess 54 is used as the microlens 53.
Next, the outer surface of the electrode side substrate 34a is ground and polished by a CMP method or the like, thereby thinning the outer surface as shown in FIG. 8C, and flattening the outer surface to make the electrode side substrate 34 having a predetermined thickness. And Thus, by setting the electrode side substrate 34 to a predetermined thickness, the focal length of the microlens 53 can be adjusted.

  Next, in the same manner as the steps shown in FIGS. 5A and 5B in the second embodiment, a light shielding layer 35 is formed on the electrode side substrate 34 as shown in FIG. 8D. Subsequently, the transparent electrode 36 is formed so as to cover it, and the alignment film 37 is formed so as to cover the transparent electrode 36, thereby forming the substrate 51. In addition, the process of forming this base | substrate 51 is a process conventionally made | formed as a microlens formation process. Note that the alignment film 37 may be formed as a final process of the color filter substrate.

  After preparing the filter side substrate 31 and the base body 51 in this way, an adhesive is applied to the surface of the filter side substrate 31 on which the filter layers 32R, 32G, and 32B are formed, and then the adhesive is applied via this adhesive. The base 51 is placed on the filter-side substrate 31 so that the alignment film 37 is on the outside, the adhesive is cured, and the base 51 is joined to the filter-side substrate 31, thereby the color filter substrate 50 shown in FIG. Get.

In this method of manufacturing the color filter substrate 50, since the base 51 and the filter side substrate 31 are bonded, the electrode side substrate 34a is flattened when the base 51 is manufactured. The mechanical stress does not reach the filter layers 32R, 32G, and 32B on the filter-side substrate 31, so that the separation of the filter layers 32R, 32G, and 32B can be surely prevented.
Further, since the transparent electrode 36 is also formed in advance on the base 51, the filter layers 32R, 32G, 32B and the adhesive layer made of an adhesive can be completely affected by the thermal effect when the transparent electrode 36 is formed. Therefore, the transparent electrode 36 can be formed at a high temperature, and the quality of the transparent electrode 36 can be improved.
In addition, the color filter substrate 50 obtained in this way is provided with both the filter layers 32R, 32G, and 32B and the microlens 53, so that it has higher functionality.

Even in the color filter substrate 50 including the microlens 53, the adhesive layer 33 contains an ultraviolet absorber, or the inner surface of the base 51 (the lens side substrate 52 on the side opposite to the lens formation surface). An ultraviolet reflecting film may be provided on the surface.
Moreover, in the manufacturing method of the color filter substrate in the first embodiment and the second embodiment, the filter layers 32R, 32G, and 32B and the adhesive layer 33 thereon, the electrode side substrate 34, the light shielding layer 35, Since the formation process of the transparent electrode 36 is performed in substantially the same manner as the formation process of the microlens 53 in the base 51 described above, the equipment used in the formation process of the microlens 53 can be used as it is, and accordingly. The cost increase due to the addition of new equipment can be suppressed, and the process can be stabilized.

Further, in the above-described embodiment, the projection type display device 10 using the transmissive liquid crystal device 16 as the light modulation device is shown. However, for example, a reflection type projection display device such as LCOS, or based on the MEMS technology. It is also possible to apply the color filter substrate of the present invention to the projection display device 10 using a mirror type spatial light modulator.
Further, in the above embodiment, the color filter substrate of the present invention is applied to the light valve (liquid crystal device) of the projection display device 10, but the color filter substrate is not only a projection type but also a direct view type liquid crystal display device. It is applicable to.

It is a schematic block diagram of the projection type display apparatus as one Embodiment of this invention. It is a schematic block diagram of the liquid crystal device in the projection type display apparatus shown in FIG. 2 is an enlarged cross-sectional view of the liquid crystal device. FIG. (A)-(e) is process drawing explaining the manufacturing method of a color filter substrate. (A)-(d) is process drawing explaining the manufacturing method of a color filter substrate. It is an expanded sectional view showing a modification of a color filter substrate. It is a schematic block diagram of the color filter board | substrate which also formed the micro lens. (A)-(d) is manufacturing process explanatory drawing of the color filter substrate of FIG. (A)-(d) is explanatory drawing of the manufacturing process of the conventional color filter substrate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Projection type display apparatus, 11 ... Light source, 16 ... Liquid crystal device,
30, 50 ... Color filter substrate, 31 ... Filter side substrate,
32R ... Filter layer for red (light interference color filter),
32G ... Green filter layer (light interference color filter),
32B ... Blue filter layer (light interference color filter), 33 ... Adhesive layer,
34a, 34 ... electrode side substrate, 36 ... transparent electrode, 38 ... ultraviolet reflective film,
51 ... Substrate, 52 ... Lens side substrate, 53 ... Microlens

Claims (5)

A filter-side substrate on which an optical interference type color filter is formed; a substrate formed by forming a microlens on the lens-side substrate, providing an electrode-side substrate on the microlens, and forming a transparent electrode on the electrode-side substrate; With
The substrate has a transparent electrode forming surface of the electrode side substrate on which the transparent electrode is formed, and a surface of the lens side substrate opposite to the side on which the microlens is formed. An ultraviolet reflective film comprising a dielectric multilayer film in which a plurality of dielectric materials and low refractive index dielectric materials are alternately laminated,
A color formed by bonding the surface of the filter side substrate on which the optical interference color filter is formed and the ultraviolet reflecting film of the lens side substrate in the base through an adhesive layer made of an adhesive. Filter substrate. The optical interference color filter according to claim 1, wherein the red filter layer that transmits red light, a green filter layer that transmits green light, that consists of a blue filter layer that transmits blue light The color filter substrate as described. Lens is a microlens is formed on a substrate, the electrode-side substrate is provided on the microlens, with transparency electrode is formed on the electrode side substrate of the electrode side substrate formed with the transparent electrode The transparent electrode forming surface is flattened, and a plurality of high-refractive index dielectric materials and low-refractive index dielectric materials are alternately arranged on the surface of the lens side substrate opposite to the side where the microlenses are formed. Preparing a substrate provided with an ultraviolet reflecting film composed of a multilayered dielectric multilayer film, and a filter-side substrate on which an optical interference color filter is formed;
Thereafter, the surface of the filter side substrate on which the optical interference color filter is formed and the ultraviolet reflective film of the lens side substrate in the base are bonded together with an adhesive. Manufacturing method. A color filter substrate, a TFT substrate, and a liquid crystal layer provided between the color filter substrate and the TFT substrate;
The liquid crystal device according to claim 1, wherein the color filter substrate comprises the color filter substrate according to claim 1 . A light source, a light modulation device that modulates light emitted from the light source, a projection unit that projects light modulated by the light modulation device, and between or between the light source and the light modulation device. A color filter substrate disposed between the means and
The projection display device, wherein the color filter substrate comprises the color filter substrate according to claim 1 .

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