JP4629296B2 - Manufacturing method of multilayer ceramic electronic component - Google Patents

Description

【００３１】
表１から明らかなように、隙間Ｔが設けられていない場合には、吸着ヘッドの下面から打ち抜かれたセラミックグリーンシートの垂れ下がりが認められた。
これに対して隙間Ｔが２００μｍ以下の範囲では、吸着ヘッド４の下面４ａにおいて打ち抜かれ吸着・保持されているセラミックグリーンシート２Ａの垂れ下がりは認められなかった。
【００３２】
また、隙間Ｔが２００μｍを超えている場合には、セラミックグリーンシートの垂れ下がりだけでなく、吸着・保持されているセラミックグリーンシートにおいてシワの発生が認められた。
【００３３】
従って、表１から明らかなように、隙間Ｔを２００μｍ以下の範囲とすることにより、吸着ヘッド４の下面４ａに吸着されたセラミックグリーンシートの状態を良好とすることがわかる。
【００３４】
なお、セラミックグリーンシートとキャリアフィルムとの密着性の高まりを抑制するには、上記のように隙間Ｔが設けられれば良いため、隙間Ｔの下限は特に限定されない。しかしながら、実際には、吸着ヘッド４の下面及びセラミックグリーンシートの上面の粗さにより隙間Ｔが小さ過ぎる場合には、セラミックグリーンシート２の上面と吸着ヘッド４の下面４ａとが部分的に接触する恐れがある。従って、好ましくは、隙間Ｔは、吸着ヘッド４の下面とセラミックグリーンシート２の上面とは、どの部分においても接触しないように２０μｍ以上に設定されることが望ましい。
【００３５】
【発明の効果】
本発明に係る積層セラミック電子部品の製造方法では、テーブル上にキャリアフィルムにより支持された少なくとも１枚のセラミックグリーンシートがキャリアフィルム側から載置され、吸着ヘッドの下面が最上部のセラミックグリーンシートの上面と隙間を隔てられた状態で、吸着ヘッドによりセラミックグリーンシートが吸着される。従って、吸着に際しセラミックグリーンシートが吸着ヘッドにより下方に押し付けられないため、セラミックグリーンシートとキャリアフィルムとの密着力の上昇を防止することができる。よって切断工程によりセラミックグリーンシートを切断した後に、キャリアフィルムからセラミックグリーンシートを無理なく剥離することができ、かつ打ち抜かれたセラミックグリーンシートが吸着ヘッドの下面において、部分的に垂れ下がったりすることがない。すなわち、正確な形状のセラミックグリーンシートを吸着ヘッドの下面において安定に保持することができる。
【００３６】
よって、上記のようにして切断されたセラミックグリーンシートを用いてセラミック積層体を得、該セラミック積層体を焼成し、セラミック焼結体を得、該セラミック焼結体の外表面に複数の外部電極を形成することにより、信頼性に優れた積層セラミック電子部品を安定に製造することが可能となる。
【図面の簡単な説明】
【図１】本発明の一実施形態に係る積層セラミック電子部品の製造方法において、セラミックグリーンシートを吸着ヘッドに吸着する工程を説明するための部分切欠支正面断面図。
【図２】本発明の一実施形態において、吸着ヘッドの下面にセラミックグリーンシートを吸着した状態を示す部分切欠正面図。
【図３】本発明の一実施形態において、打ち抜かれかつキャリアフィルムから剥離されたセラミックグリーンシートが吸着ヘッドの下面に吸着・保持されている状態を示す部分切欠正面断面図。
【図４】本発明の一実施形態の変形例において、キャリアフィルム上に複数枚のセラミックグリーンシートが積層されている状態を示す部分切欠正面断面図。
【図５】本発明の一実施形態において、積層テーブル上において複数枚のセラミックグリーンシートが積層されている状態を示す正面断面図。
【図６】本発明の一実施形態により得られたマザーの積層体を示す正面断面図。
【図７】（ａ）及び（ｂ）は、本発明の一実施形態の製造方法で得られた個々の積層セラミックコンデンサ単位のセラミック積層体を示す正面断面図及び本発明の一実施形態で得られた積層セラミックコンデンサの正面断面図。
【図８】従来の積層セラミック電子部品の製造方法において、吸着ヘッドにより打ち抜かれたセラミックグリーンシートを吸着・保持している状態を示す部分切欠正面断面図。
【図９】従来の積層セラミック電子部品の製造方法の問題点を説明するための部分切欠斜視図。
【符号の説明】
１…キャリアフィルム
２…セラミックグリーンシート
３…カットテーブル
４…吸着ヘッド
４ａ…下面
４ｂ…吸引孔
５…切断刃
５ａ…刃先
６…積層体
７…積層テーブル
８，９…積層体
１０…セラミック焼結体
１１，１２…外部電極
１３…積層セラミック電子部品[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method of manufacturing a multilayer ceramic electronic component such as a multilayer capacitor, and more particularly, a multilayer ceramic having an improved process of cutting and laminating at least one ceramic green sheet supported by a carrier film. The present invention relates to a method for manufacturing an electronic component.
[0002]
[Prior art]
Conventionally, when a multilayer ceramic electronic component such as a multilayer ceramic capacitor is manufactured, a ceramic green sheet supported by a carrier film and having internal electrodes printed on the surface is prepared. Next, the ceramic green sheet is punched out to have a predetermined dimension, peeled off from the carrier film, and laminated.
[0003]
An example of such a method of punching and laminating ceramic green sheets is disclosed in Japanese Patent Application Laid-Open No. 2000-271919. As shown in FIG. 8, in the method described in this prior art, a ceramic green sheet 103 supported by a carrier film 102 is prepared on a cut table 101. FIG. 8 shows a state after the ceramic green sheet 103 is punched out.
[0004]
A suction head 104 is disposed above the cut table 101. The suction head 104 has a plurality of suction holes 104a opened on the lower surface. By sucking through the suction hole 104 a, the punched ceramic green sheet 103 a is sucked and held on the lower surface of the suction head 104. The punching is performed by a cutting blade 105 provided so as to surround the periphery of the suction head 104.
[0005]
At the time of punching, the lower surface of the suction head 104 is brought into contact with the ceramic green sheet 103 disposed on the cut table 101, and the cutting with the cutting blade 105 is performed while the movement of the ceramic green sheet 103 is prohibited. Thereafter, the punched ceramic green sheet 103a is sucked and held on the lower surface of the suction head 104 by suction from a plurality of suction holes 104a. Next, the ceramic green sheet 103a is peeled from the carrier film 102 by moving the suction head 104 upward.
[0006]
The ceramic green sheet 103a sucked and held on the lower surface of the suction head 104 is used for the next stacking process. In this case, the ceramic green sheet 103a is reliably adsorbed and held by suction from the plurality of suction holes 104a. In the method described in the above prior art, in order to solve the problem that the ceramic green sheet 103a is damaged by the edge of the portion of the suction hole 104a that is open on the lower surface of the suction head 104, a plurality of suction holes are formed after peeling. Of 104a, the negative pressure applied from the plurality of suction holes located in the center is weaker than the negative pressure applied from the other suction holes.
[0007]
[Problems to be solved by the invention]
In the method described in the above prior art, as described above, the ceramic green sheet 103 is punched and peeled from the carrier film 102, and then the ceramic green sheet 103a is sucked and held on the lower surface of the suction head 104. Is prevented from being damaged.
[0008]
However, when the ceramic green sheet 103 a punched on the lower surface of the suction head 104 is sucked and peeled from the carrier film 102, the lower surface of the suction head 104 is pressed against the upper surface of the ceramic green sheet 103. For this reason, the adhesion between the ceramic green sheet 103 and the carrier film 102 has to be increased. Accordingly, when the ceramic green sheet 103a is peeled from the carrier film 102, particularly when a thin ceramic green sheet having a thickness of 20 μm or less is peeled from the carrier film 102, the entire surface of the ceramic green sheet 103a is not reliably attracted to the lower surface of the suction head 104. There was a thing.
[0009]
That is, as shown in a schematic perspective view in FIG. 9, a part of the ceramic green sheet 103 a may hang down from the lower surface 104 a of the suction head 104.
The object of the present invention is to eliminate the above-mentioned disadvantages of the prior art, and when the ceramic green sheet is peeled off from the carrier film, the ceramic green sheet is reliably sucked and held on the entire lower surface of the suction head on the lower surface of the suction head. Accordingly, an object of the present invention is to provide a method for producing a multilayer ceramic electronic component in which ceramic green sheets having a desired shape are laminated with high precision and a stable multilayer ceramic electronic component having excellent reliability can be obtained.
[0010]
[Means for Solving the Problems]
According to a wide aspect of the present invention, a step of placing at least one ceramic green sheet supported by a carrier film on a table from the carrier film side, and adsorbing the at least one ceramic green sheet on the lower surface At least one sheet supported by the carrier film, with the step of adsorbing the ceramic green sheet by the adsorption head, with the lower surface of the adsorption head separated from the upper surface of the uppermost ceramic green sheet Cutting the ceramic green sheet with a cutting blade provided in a ring around the suction head, and at least one of the cut ceramic green sheets being sucked by the suction head, By moving upwards, the cut at least A step of peeling one ceramic green sheet from the carrier film, a step of peeling at least one ceramic green sheet peeled from the carrier film from the suction head, and at least one piece peeled from the suction head Laminating ceramic green sheets to obtain a ceramic laminate, firing the ceramic laminate to obtain a ceramic sintered body, and forming a plurality of external electrodes on the outer surface of the ceramic sintered body A method for manufacturing a multilayer ceramic electronic component is provided.
[0011]
In the present invention, the ceramic green sheet cutting step may be performed prior to the step of adsorbing the ceramic green sheet by the adsorption head, or may be performed after the adsorption step.
[0012]
In a specific aspect of the manufacturing method according to the present invention, when the annular cutting blade cuts the at least one ceramic green sheet, cutting is performed so as to half-cut the carrier film. In this case, the ceramic green sheet held by the suction head can be reliably peeled from the carrier film while leaving the carrier film on the cut table.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in more detail by describing specific embodiments.
In one embodiment of the present invention, as shown in FIG. 1, a structure in which a ceramic green sheet 2 is laminated on a carrier film 1 is prepared. Although not shown in FIG. 1, an internal electrode pattern is appropriately formed on the upper surface of the ceramic green sheet 2 by screen printing, gravure printing, transfer, thin film, or the like.
[0015]
On the cut table 3, the ceramic green sheet 2 supported by the carrier film 1 is placed from the carrier film 1 side.
As said carrier film 1, what consists of appropriate synthetic resins, such as a polyethylene terephthalate, a polypropylene, a polyethylene naphthalate, can be used. The ceramic green sheet 2 is made of a material mainly composed of appropriate ceramics such as barium titanate ceramics.
[0016]
The suction head 4 is disposed above the cut table 3. A cutting blade 5 is disposed around the suction head 4. The cutting blade 5 has an annular blade edge 5a at the tip.
[0017]
A plurality of suction holes 4 b are opened on the lower surface 4 a of the suction head 4.
The plurality of suction holes 4b are connected to a vacuum suction source (not shown).
In the present embodiment, the suction and cutting of the ceramic green sheet 2 is performed in a state where the suction head 4 is disposed with a gap of T between the upper surface of the ceramic green sheet 2.
[0018]
In the initial state, the suction head 4 is positioned above the state shown in FIG. 1, and is lowered to perform suction. Then, as shown in FIG. 1, the lowering of the suction head 4 is stopped in a state where the lower surface 4 a of the suction head 4 is positioned above the ceramic green sheet 2 with a gap T therebetween.
[0019]
The gap T is 50 μm in this embodiment. However, the gap T may be in the range of 200 μm or less, and is not necessarily 50 μm.
Next, in the state shown in FIG. 1, suction is started from the suction hole 4 b of the suction head 4. Thereby, as shown in FIG. 2, the upper surface of the ceramic green sheet 2 is adsorbed to the lower surface 4 a of the adsorption head 4. In this state, as shown by the arrow in FIG. 2, the cutting blade 5 is further moved downward, and the ceramic green sheet 2 is cut. The cutting blade 5 is lowered to a height at which the ceramic green sheet 2 is cut and the carrier film 1 is half-cut. That is, the carrier film 1 is not punched by the cutting blade 5.
[0020]
In the present embodiment, the ceramic green sheet 2 is sucked by suction from the lower surface 4a side of the suction head 4 with the gap T as described above. Therefore, the ceramic green sheet 2 is not pressed against the cut table 3 by the lower surface 4a of the suction head 4 during suction and holding. Therefore, an increase in adhesion between the lower surface of the ceramic green sheet 2 and the upper surface of the carrier film 1 can be suppressed.
[0021]
After the cutting step, the suction head 4 is moved upward. In this case, since the adhesion between the ceramic green sheet 2 and the support film 1 is not increased, the punched ceramic green sheet 2A is easily and evenly peeled off from the carrier film 1 as shown in FIG. .
[0022]
In the above embodiment, one ceramic green sheet 2 is laminated on the carrier film 1, but a plurality of ceramic green sheets 2 and 2 are laminated on the carrier film 1, as shown in FIG. The plurality of ceramic green sheets 2, 2 may be punched out and sucked and held on the lower surface 4 a of the suction head 4.
[0023]
In the above embodiment, a plurality of ceramic green sheets 2A adsorbed and held on the lower surface 4a of the adsorption head 4 are laminated as shown in FIG. In FIG. 5, the stacked body 6 is stacked on the stacking table 7. Further, an internal electrode pattern 8 (not shown in FIG. 1) is embedded in the laminate 6.
[0024]
By laminating a ceramic green sheet on which an internal electrode pattern is further printed on the laminate 6, a mother laminate 6A shown in FIG. 6 is obtained. The mother laminate 6A is cut into individual laminate ceramic capacitor unit laminates to obtain a laminate 9 shown in FIG. By firing the laminate 9 thus obtained, a sintered body 10 shown in FIG. 7B is obtained. The multilayer ceramic capacitor 13 is obtained by applying the external electrodes 11 and 12 to both end faces of the sintered body 10.
[0025]
In the above embodiment, the example applied to the method for manufacturing the multilayer ceramic capacitor 13 has been described. However, the present invention is applied to other methods for manufacturing multilayer ceramic electronic components such as multilayer LC filters, multilayer noise filters, ceramic multilayer substrates, and multilayer inductors. The present invention can also be applied.
[0028]
Next, specific experimental examples will be described.
The ceramic green sheet 2 is adsorbed with the gap T separated as described above. However, the gap T is variously changed, and the ceramic green sheet 2A adsorbed and held on the lower surface 4a of the adsorption head 4 is changed. The condition was observed. The results are shown in Table 1 below.
[0029]
In addition, as the used ceramic green sheet, a ceramic green sheet mainly composed of barium titanate-based ceramics having a thickness of 3 μm was used. The size of the ceramic green sheet before punching was a long sheet having a width of 220 mm, and the size of the ceramic green sheet 2A punched by the cutting blade 5 was 200 × 200 mm. The area of the lower surface 4a of the suction head 4 is 199 × 199 mm. As the carrier film 1, a carrier film made of polyethylene terephthalate was used.
[0030]
[Table 1]

[0031]
As is apparent from Table 1, when the gap T was not provided, the ceramic green sheet punched out from the lower surface of the suction head was found to hang down.
On the other hand, when the gap T is in the range of 200 μm or less, no sagging of the ceramic green sheet 2A punched out and sucked / held on the lower surface 4a of the suction head 4 was observed.
[0032]
In addition, when the gap T exceeded 200 μm, not only the ceramic green sheet drooped but also wrinkles were observed in the adsorbed and held ceramic green sheet.
[0033]
Therefore, as can be seen from Table 1, it can be seen that when the gap T is in the range of 200 μm or less, the state of the ceramic green sheet adsorbed on the lower surface 4a of the adsorption head 4 is improved.
[0034]
In addition, in order to suppress an increase in adhesion between the ceramic green sheet and the carrier film, it is only necessary to provide the gap T as described above, and therefore the lower limit of the gap T is not particularly limited. However, in reality, when the gap T is too small due to the roughness of the lower surface of the suction head 4 and the upper surface of the ceramic green sheet, the upper surface of the ceramic green sheet 2 and the lower surface 4a of the suction head 4 are in partial contact. There is a fear. Therefore, preferably, the gap T is set to 20 μm or more so that the lower surface of the suction head 4 and the upper surface of the ceramic green sheet 2 do not come into contact with each other.
[0035]
【The invention's effect】
In the method for manufacturing a multilayer ceramic electronic component according to the present invention, at least one ceramic green sheet supported by a carrier film is placed on a table from the carrier film side, and the lower surface of the suction head is the uppermost ceramic green sheet. The ceramic green sheet is adsorbed by the adsorbing head while being separated from the upper surface by a gap. Accordingly, since the ceramic green sheet is not pressed downward by the suction head at the time of suction, it is possible to prevent an increase in the adhesion between the ceramic green sheet and the carrier film. Therefore, after cutting the ceramic green sheet by the cutting process, the ceramic green sheet can be peeled off from the carrier film without difficulty, and the punched ceramic green sheet does not hang down partially on the lower surface of the suction head. . In other words, the accurately shaped ceramic green sheet can be stably held on the lower surface of the suction head.
[0036]
Therefore, a ceramic laminate is obtained using the ceramic green sheet cut as described above, the ceramic laminate is fired to obtain a ceramic sintered body, and a plurality of external electrodes are provided on the outer surface of the ceramic sintered body. By forming the above, it becomes possible to stably manufacture a multilayer ceramic electronic component having excellent reliability.
[Brief description of the drawings]
FIG. 1 is a partially cutaway front cross-sectional view for explaining a step of adsorbing a ceramic green sheet to an adsorption head in a method for manufacturing a multilayer ceramic electronic component according to an embodiment of the present invention.
FIG. 2 is a partially cutaway front view showing a state in which a ceramic green sheet is sucked to the lower surface of the suction head in one embodiment of the present invention.
FIG. 3 is a partially cutaway front sectional view showing a state in which a ceramic green sheet that has been punched and peeled off from a carrier film is sucked and held on the lower surface of the suction head in an embodiment of the present invention.
FIG. 4 is a partially cutaway front sectional view showing a state in which a plurality of ceramic green sheets are laminated on a carrier film in a modification of one embodiment of the present invention.
FIG. 5 is a front sectional view showing a state in which a plurality of ceramic green sheets are laminated on a lamination table in the embodiment of the present invention.
FIG. 6 is a front sectional view showing a mother laminate obtained according to an embodiment of the present invention.
FIGS. 7A and 7B are a front cross-sectional view showing a ceramic multilayer body of individual multilayer ceramic capacitor units obtained by the manufacturing method of an embodiment of the present invention, and obtained by an embodiment of the present invention. FIG. 3 is a front sectional view of the obtained multilayer ceramic capacitor.
FIG. 8 is a partially cutaway front sectional view showing a state in which a ceramic green sheet punched out by a suction head is sucked and held in a conventional method of manufacturing a multilayer ceramic electronic component.
FIG. 9 is a partially cutaway perspective view for explaining problems of a conventional method of manufacturing a multilayer ceramic electronic component.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Carrier film 2 ... Ceramic green sheet 3 ... Cut table 4 ... Adsorption head 4a ... Lower surface 4b ... Suction hole 5 ... Cutting blade 5a ... Cutting edge 6 ... Laminated body 8 ... Laminated table 8, 9 ... Laminated body 10 ... Ceramic sintered Body 11, 12 ... External electrode 13 ... Multilayer ceramic electronic component

Claims (3)

Placing at least one ceramic green sheet supported by a carrier film on a table from the carrier film side;
The suction head for adsorbing the at least one ceramic green sheet to the lower surface is set so that the lower surface of the adsorption head is spaced from the upper surface of the uppermost ceramic green sheet, and the ceramic green sheet is Adsorbing process;
Cutting at least one ceramic green sheet supported by the carrier film with a cutting blade provided annularly around the suction head ;
The at least one cut ceramic green sheet is peeled from the carrier film by moving the suction head upward while the at least one cut ceramic green sheet is sucked to the suction head. And a process of
Peeling at least one ceramic green sheet peeled from the carrier film from the suction head;
Laminating at least one ceramic green sheet peeled from the suction head to obtain a ceramic laminate;
Firing the ceramic laminate to obtain a ceramic sintered body;
And a step of forming a plurality of external electrodes on the outer surface of the ceramic sintered body.   The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the ceramic green sheet cutting step by the annular cutting blade is performed prior to the step of sucking the ceramic green sheet by the suction head.   The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the step of cutting the ceramic green sheet by the annular cutting blade is performed after the step of sucking the ceramic green sheet by the suction head.

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