JP4629764B2 - Wiring board non-contact transfer device and method, and resin wiring board manufacturing method - Google Patents

Description

  The present invention relates to a non-contact transfer apparatus and method for a wiring board that transfers a wiring board that is an object to be transferred using the action of an air current, and a method for manufacturing a resin wiring board using the non-contact transfer apparatus. .

  Conventionally, a wiring board is manufactured through a plurality of manufacturing processes, and is shipped after undergoing an inspection process for conducting a continuity test. The wiring board is transported to a line for performing the next process every time the manufacturing process is completed. As a conventional transport method, a method has been proposed in which the surface of the wiring board is sucked with a negative pressure on the lower surface of the suction head having an air suction hole and the wiring board is transported together with the suction head in this state. Yes. However, when the wiring board is transported by the suction head, there is a problem that foreign matter (dust) generated by dirt or wear of the suction head adheres to the wiring board.

In view of this, there has been proposed a transfer device that reduces the adhesion of foreign matter to the wiring board by transferring the object to be transferred such as the wiring board while sucking in a non-contact state (see, for example, Patent Document 1). Such a transport apparatus includes a transport head, a gas supply hole that opens at the front end surface (suction surface) of the transport head, and a nozzle that is attached to the transport head and has a disk portion. Then, when the suction surface of the transport head is brought close to the wiring board and the air supplied from the gas supply hole is led out to the outside through a slit formed between the suction surface and the disk portion, the air is transferred to the transport head. Radiated outwards. As a result, the space between the nozzle and the wiring board becomes negative pressure, and the wiring board is sucked and held by the transport head. In this state, if the transfer head is transferred using a robot arm or the like, the wiring board can be transferred in a non-contact state.
Japanese Patent Laying-Open No. 2005-219922 (FIGS. 1 to 5 etc.)

  However, since a part of the released air collides with the wiring board, static electricity is generated due to friction between the air and the wiring board, and the wiring board is charged. At this time, foreign matters floating around the surface of the wiring board are likely to adhere to the surface of the wiring board. Once attached, it is difficult to remove the foreign matters. Further, in the above-described inspection process performed after the wiring board is transported, the wiring board is inspected for continuity by bringing an inspection jig such as a probe into contact with the solder bump on the surface of the wiring board. Therefore, if a continuity test is performed with foreign matter adhering to the surface of the solder bumps, foreign matter that does not conduct will be caught between the probe and the solder bumps. There is a possibility that it is determined to be a non-defective product.

  The present invention has been made in view of the above problems, and a first object of the present invention is to improve the yield of the wiring board by preventing the adhesion of foreign matters to the wiring board as a transported object. An object of the present invention is to provide a non-contact transfer apparatus and method for a wiring board. A second object is to provide a suitable method for manufacturing a resin wiring board using the non-contact transfer device.

And as a means (means 1) for solving the above-mentioned subject, it comprises a suction part provided with a first air blowing hole which is provided with a concave part on the suction surface and is opened on the inner peripheral surface of the concave part, Non-contact transport that transports the substrate main surface of the circuit board that is the object to be transported while being sucked and held by the negative pressure generated by the air blown from the first air blowing hole along the inner peripheral surface of the recess. in the device, the at the center of the concave portion is protruded nozzle for dust removal, a second air blowing port for blowing air to the substrate main surface, the center of the recess than the first air blowing port in the recess there are Rubeku, non-contact transport apparatus of the wiring substrate on which the second air-blowing holes is characterized in that it is arranged to open at the end of the nozzle for the dust provided in close proximity to the position.

  Therefore, according to the non-contact conveyance device of the means 1, the foreign matter on the main surface of the substrate can be removed by blowing off the air by blowing air from the second air blowing hole toward the main surface of the wiring board. . Therefore, for example, in the continuity inspection after the conveyance, it is difficult to determine that the wiring board is defective due to the adhesion of foreign matter, so that the yield of the wiring board can be improved.

  The “wiring board” includes not only a single product wiring board but also a multi-cavity wiring board in which a plurality of substrate forming regions to be wiring boards are arranged along the plane direction. Examples of the material for forming the wiring board include inorganic materials such as ceramics, metals, and semiconductors, and organic materials such as resins. These materials are considered in consideration of cost, workability, insulation, mechanical strength, and the like. It can be suitably selected from the inside. Preferable examples of the ceramic material include low-temperature fired materials such as alumina, glass ceramic, and crystallized glass, aluminum nitride, silicon carbide, and silicon nitride. Suitable examples of the metal material include copper, a copper alloy, and an iron nickel alloy. A preferred example of the semiconductor material is silicon. Preferred examples of the resin material include polyimide resin, epoxy resin, bismaleimide-triazine resin, polyphenylene ether resin, and the like. In addition, composite materials of these resins and glass fibers (glass woven fabric or glass nonwoven fabric) or organic fibers such as polyamide fibers may be used. Alternatively, a resin-resin composite material obtained by impregnating a thermosetting resin such as an epoxy resin with a three-dimensional network fluorine-based resin base material such as continuous porous PTFE may be used. In particular, from the viewpoint of cost reduction, it is preferable to select an organic material such as a resin material as a wiring board forming material. With such a wiring board, a fine conductor layer can be formed relatively easily and accurately.

  The wiring board forming material is preferably an organic material such as a resin material. In particular, the wiring board has a resin wiring having an electrode forming area in which a plurality of protruding electrodes are arranged on the main surface of the board. A substrate is preferred. The reason for this is that when the wiring board is to be transported in a contact state, there is a problem that the protruding electrode formed on the main surface of the wiring board is crushed by the suction portion and deformed. This is because the significance of adopting the non-contact conveyance device of the above means occurs. Further, since the resin wiring board has a problem that static electricity is likely to be accumulated and foreign matters are likely to adhere to it, it is significant to adopt the above means for solving this problem.

  Here, the suction portion is a recess provided in the suction surface, a first air blowing hole opening in the inner peripheral surface of the recess, or a first position provided in a position different from the first air blowing hole in the recess. 2 Has an air outlet hole. Although the number of 1st air blowing holes is not specifically limited, For example, it is preferable that it is two. If the suction part has many first air blowing holes, there is a problem that the processing cost of the suction part becomes high. On the other hand, when the suction part has only one first air blowing hole, even if the air is blown out along the inner peripheral surface of the recess from the first air blowing hole, the blown air may flow straight. Since it is high, for example, it becomes difficult to form a swirl flow. Further, the number of the second air blowing holes is not particularly limited, but is preferably one, for example. If the suction part has a plurality of second air blowing holes, the force of the air ejected from the second air blowing holes becomes too strong to cancel the force for sucking the wiring board. The wiring board cannot be sucked and held by the negative pressure generated by the air ejected from the blowout hole. Moreover, when there are a plurality of second air blowing holes, there is also a problem that the processing cost of the suction part increases.

Incidentally, the second air-blowing holes than said first air blowing port that are located in proximity to the center of the recess. In this case , the air ejected from the second air blowing hole is less likely to collide with the air ejected from the first air blowing hole. As a result, the flow of air ejected from the first air blowing hole is less likely to be disturbed, so that, for example, a swirl flow can be reliably formed, and the wiring board is reliably sucked by the negative pressure generated by the swirl flow, etc. can do. In addition, since the flow of air ejected from the second air blowing hole is not easily disturbed, foreign matter on the main surface of the substrate can be reliably removed by the air ejected from the second air blowing hole.

Moreover, it said the central recess projecting nozzle for dust removal, the second air-blowing holes that are arranged so as to open at the end of the nozzle for the dust removal. In this case , since the flow of air ejected from the second air blowing hole is adjusted, the foreign matter on the main surface of the substrate can be reliably removed by blowing air from the second air blowing hole. In addition, since the distance between the second air blowing hole and the wiring board is shortened, the foreign matter on the main surface of the board can be reliably removed by the air blown from the second air blowing hole. Further, since the second air blowing hole is opened at the tip of the dust removal nozzle, the air blown out from the second air blowing hole is immediately discharged outside the recess. Therefore, the air ejected from the second air blowing hole and the air ejected from the first air blowing hole are less likely to be mixed inside the recess.

  The shape of the second air blowing hole is not particularly limited. For example, the central axis of the second air blowing hole is preferably arranged perpendicular to the main surface of the wiring board. In this way, air can be blown vertically from the second air blowing hole toward the main surface of the substrate. As a result, since the momentum of air colliding with the substrate main surface is stronger than when air is blown obliquely toward the substrate main surface, the foreign matter on the substrate main surface can be more reliably removed.

  The structure of the suction part is not particularly limited. For example, it is preferable that a resin pad is attached to a suction part body made of a metal material, and the front surface of the resin pad is the suction surface. . In this way, even if the board main surface of the wiring board comes into contact with the suction surface of the suction part, the wiring board does not need to be damaged.

  Moreover, it is preferable that the said suction part has a common flow path which supplies each air to the said 1st air blowing hole and the said 2nd air blowing hole in the inside. In this way, the suction part can be made smaller and lighter than when the flow path for supplying air to the first air blowing hole and the flow path for supplying air to the second air blowing hole are formed separately. Therefore, the configuration can be simplified.

Further, as another means (means 2) for solving the above-described problem, a first air blowing hole is provided that opens at an inner peripheral surface of a recess provided in the suction surface of the suction portion, and the first air blowing is performed. In the method of transporting the substrate main surface of the wiring board, which is an object to be transported, sucked and held by the suction surface by the negative pressure generated by the air ejected from the hole along the inner peripheral surface of the recess. Rubeku provided at a position close to the center of the recess than the first air blowing port, the second air blowing holes arranged so as to open at the tip of the dust nozzle projecting from the center of the recess by blowing air toward the substrate main surface of the wiring board, there is a non-contact transfer method of the wiring board, characterized in that so as to remove foreign substances on the substrate main surface.

  Therefore, according to the non-contact conveyance method of the above means 2, the foreign matter on the main surface of the substrate is blown away by air by blowing air from the second air blowing hole toward the main surface of the wiring board. Therefore, for example, in the continuity inspection after the conveyance, it is difficult to determine that the wiring board is defective due to the adhesion of foreign matter, so that the yield of the wiring board can be improved.

  Further, as another means (means 3) for solving the above-described problems, the non-contact transfer device described in the above means 1 is used, and an electrode forming region in which a plurality of protruding electrodes are arranged on the main surface of the substrate. A method of manufacturing the resin wiring substrate by performing a transporting process of transporting the resin wiring substrate having the substrate, wherein the substrate is formed by blowing air from the second air blowing hole toward the main surface of the substrate. There is a method of manufacturing a resin wiring board, wherein a dust removing process for removing foreign matter on a main surface is performed simultaneously with the transporting process.

  Therefore, according to the manufacturing method of the means 3, it is possible to manufacture a resin wiring board that easily removes foreign matters using the non-contact transfer device of the means 1. Therefore, for example, in the continuity inspection after the transport process and after the dust removal process, it is difficult to determine that the resin wiring board is defective due to the adhesion of foreign matter, so that the yield of the resin wiring board can be improved. . Moreover, since the dust removal step is performed simultaneously with the transport step, the resin wiring board can be efficiently manufactured.

  Hereinafter, an embodiment embodying the present invention will be described in detail with reference to the drawings.

  As shown in FIG. 1, the non-contact transfer device 1 includes a transfer multi-joint robot 2 and a transfer head 11, and transfers a wiring board 110 that is a transfer object using the action of an air current.

  As shown in FIG. 2, the wiring board 110 of this embodiment is an organic package (resin wiring board) for mounting an IC chip, and shows a state after a plurality of manufacturing steps and before an inspection step. Yes. The wiring substrate 110 includes a substantially rectangular plate-shaped core substrate 111, a first buildup layer 114 formed on a core main surface 112 (upper surface in FIG. 2) of the core substrate 111, and a core back surface 113 ( The second buildup layer 115 is formed on the lower surface in FIG. The build-up layers 114 and 115 have a structure in which a resin insulating layer made of a thermosetting resin (epoxy resin) and a conductor layer made of copper are alternately laminated. In addition, terminal pads 116 (projection electrodes) are formed in an array at a plurality of locations on the substrate main surface 120 (on the upper surface of the first buildup layer 114) of the wiring substrate 110, and on the substrate back surface 121 of the wiring substrate 110. BGA pads 117 are formed in an array at a plurality of locations (on the lower surface of the second buildup layer 115). Further, a plurality of solder bumps 118 (protruding electrodes) are disposed on the surface of the terminal pad 116. Each solder bump 118 is connected to a terminal of an IC chip having a rectangular flat plate shape. Note that an area formed by each terminal pad 116 and each solder bump 118 is an electrode forming area 119 on which an IC chip can be mounted.

  As shown in FIGS. 1, 3, and 4, the transfer head 11 is attached to the tip of the arm 3 of the transfer articulated robot 2. The transport head 11 is a connection plate 12 connected to the tip of the arm 3, a support plate 14 connected to the connection plate 12 via four connection rods 13, and a fluid pressure actuator supported by the support plate 14. There is provided an air cylinder 15 and a pair of arm portions 16 which are connected to the support plate 14 at the upper end portion and extend downward while being separated from each other. The air cylinder 15 has a box-shaped cylinder body 17, a piston (not shown) accommodated in the cylinder body 17 so as to be movable up and down, and a rod (not shown) that is a movable part connected to the piston. is doing. The rod protrudes from the lower end of the cylinder body 17 when air is supplied into the cylinder body 17 and the piston moves downward. When the air is discharged from the cylinder body 17 and the piston moves upward, the cylinder body. 17 is configured to retreat inside. A suction part 20 for sucking the wiring board 110 is attached to the tip of the rod. The suction unit 20 is supported by a rod, and approaches and separates from the wiring board 110 with the suction surface 21 facing the wiring board 110.

  As shown in FIGS. 1, 3, and 4, the transport head 11 includes a substrate holding member 181 that holds and fixes the wiring substrate 110 so as not to be misaligned. The substrate holding member 181 includes a member main body 183 that is fixed to each arm portion 16 via two screws 182 and four contact portions that are connected to the member main body 183 at the upper end portion and extend downward while being separated from each other. 184. Each contact portion 184 is arranged so as to surround the suction surface 21 of the suction portion 20 from the outside of the four sides constituting the suction surface 21. Each contact portion 184 is formed of a resin (polyethylene resin in this embodiment) having a hardness lower than that of the wiring board 110. Each contact portion 184 has a chamfered portion 185 inside the lower end portion. Each chamfered portion 185 contacts the outer peripheral edge of the wiring board 110 when the board of the wiring board 110 is moved close to the board holding member 181 by moving the rod of the air cylinder 15 backward (see FIG. 24). ).

  As shown in FIGS. 5 to 8, the suction part 20 includes an upper lid part 31, a suction part body 22, a nozzle support 51, a nozzle body 61, and a resin pad 40. As shown in FIG. 9, the upper lid portion 31 is made of a metal material (in this embodiment, an aluminum alloy containing platinum) and has a substantially rectangular plate shape of 35 mm long × 35 mm wide × 6 mm high. . Screw insertion holes 32 are provided at three corners of the four corners of the upper lid portion 31, and first port mounting holes 33 are provided at the remaining one corner. In addition, a first nozzle insertion hole 34 having a diameter of 7 mm is provided at the center of the upper lid portion 31. A shaft mounting hole 35 is provided between two of the three screw insertion holes 32 and the first nozzle insertion hole 34, and the remaining one screw insertion hole 32 and the first nozzle insertion hole 34. A third port mounting hole 36 is provided between the first and second ports.

  As shown in FIGS. 5, 6, and 8, the first port 91 is attached to the first port attachment hole 33, and the third port 93 is attached to the third port attachment hole 36. A shaft 94 made of a metal material (SUJ2 in the present embodiment) is attached to the central portion of the upper lid portion 31. The shaft 94 includes a rod-shaped circular pipe portion 95 and a substantially rectangular plate-shaped support plate 96 integrally formed at the lower end portion of the circular pipe portion 95. The circular pipe part 95 is provided with a through hole 97 that communicates with the first nozzle insertion hole 34, and a second port attachment hole 98 that communicates with the through hole 97 is provided at the upper end part of the circular pipe part 95. . Further, the second port 92 is attached to the second port attachment hole 98. Each port 91 to 93 is made of a conductive metal, and an antistatic tube 99 is connected to each port 91 to 93. In addition, a pair of screw holes (not shown) are provided at both ends of the support plate 96. Therefore, the shaft 94 is fixed to the upper lid portion 31 by inserting the screw 100 into both screw holes and screwing the inserted screw 100 into the shaft mounting hole 35.

  As shown in FIGS. 10 to 12, the suction part main body 22 is formed of a metal material (aluminum in the present embodiment) and has a substantially rectangular parallelepiped shape with a length of 35 mm × width of 35 mm × height of 18.5 mm. . The suction part main body 22 is provided with an accommodation recess 25 that opens at the lower surface 24 of the suction part main body 22. The housing recess 25 of this embodiment is set to have an inner diameter of 18 mm and a depth of 12.5 mm. In addition, a second nozzle insertion hole 26 having a diameter of 7 mm is provided in the central portion of the suction unit body 22. The second nozzle insertion hole 26 communicates with the first nozzle insertion hole 34 of the upper lid part 31 and penetrates the upper surface 23 of the suction part main body 22 and the bottom surface of the housing recess 25. Further, on the both sides of the second nozzle insertion hole 26 in the suction part main body 22, support body mounting holes 27 penetrating the upper surface 23 and the bottom surface of the accommodating recess 25 are provided.

  The suction body 22 is provided with twelve dust collecting channels 191 that penetrate the upper surface 23 and the lower surface 24. The dust collecting channels 191 are arranged in an outer region of the housing recess 25 in the suction unit main body 22 and are arranged at equiangular (30 °) intervals with reference to the central axis of the second nozzle insertion hole 26. Furthermore, a common dust collection channel 192 through which air can flow is formed in a circular shape on the upper surface 23 of the suction unit body 22. The individual dust collection channels 191 join the common dust collection channel 192 inside the suction unit main body 22. The common dust collecting flow path 192 communicates with the third port mounting hole 36 of the upper lid portion 31 and is connected to a dust collecting unit 151 (see FIG. 22) that is a vacuum evacuation means.

  As shown in FIG. 10, lid mounting holes 28 are provided in three of the four corners of the suction unit body 22. Therefore, by inserting the screw 29 (see FIG. 8) through the screw insertion hole 32 and screwing the inserted screw 29 into the lid mounting hole 28, the upper lid portion 31 is fixed to the suction portion main body 22. In addition, an adsorption channel 195 that communicates with the first port mounting hole 33 and penetrates the upper surface 23 and the lower surface 24 is provided in the remaining one of the four corners. As shown in FIGS. 11 and 12, a common adsorption channel 196 through which air can flow is formed in a substantially square shape on the lower surface 24 of the suction portion main body 22. The common adsorption flow path 196 communicates with the first port mounting hole 33 of the upper lid portion 31 and is connected to an adsorption unit 161 (see FIG. 22) that is a vacuum evacuation means.

  As shown in FIGS. 13 and 14, the nozzle support 51 is housed in the housing recess 25 of the suction body 22. The nozzle support 51 is made of a metal material (aluminum in this embodiment) and has a substantially cylindrical shape with a diameter of 18 mm and a height of 14 mm. The nozzle support 51 is provided with an accommodating portion 54 that opens at the lower surface 53 of the nozzle support 51. The accommodating part 54 of this embodiment is set to an inner diameter of 16 mm and a depth of 7.5 mm. Further, a third nozzle insertion hole 55 having a diameter of 7 mm is provided at the center of the nozzle support 51. The third nozzle insertion hole 55 communicates with the second nozzle insertion hole 26 of the suction portion main body 22 and penetrates the upper surface 52 of the nozzle support 51 and the bottom surface of the accommodating portion 54. Furthermore, nozzle attachment holes 57 penetrating the upper surface 52 and the bottom surface of the accommodating portion 54 are provided on both sides of the third nozzle insertion hole 55 in the nozzle support 51. In addition, screw attachment holes 56 that open on the upper surface 52 are provided on both sides of the third nozzle insertion hole 55 in the nozzle support 51. Therefore, the nozzle support 51 is fixed to the suction portion main body 22 by inserting the screw 30 (see FIG. 8) through the support attachment hole 27 and screwing the inserted screw 30 into the screw attachment hole 56.

  As shown in FIGS. 15 to 18, the nozzle body 61 is made of a metal material (aluminum in this embodiment) and has a lower end surface 62 that constitutes a part of the suction surface 21. The nozzle body 61 includes a rod-shaped shaft portion 63 and a body portion 64 formed at the lower end portion of the shaft portion 63. The shaft portion 63 has a substantially cylindrical shape with a diameter of 7 mm and a height of 15.2 mm, and is inserted into the third nozzle insertion hole 55, the second nozzle insertion hole 26, and the first nozzle insertion hole 34. Note that an O-ring 60 (see FIG. 8) that closes the gap between the first nozzle insertion hole 34 and the shaft portion 63 is attached to the first nozzle insertion hole 34 in contact with the upper end surface of the shaft portion 63. .

  On the other hand, the main body 64 has a substantially cylindrical shape with a diameter of 15 mm and a height of 8.6 mm, and is accommodated in the accommodating portion 54 of the nozzle support 51. On the both sides of the shaft portion 63 in the main body portion 64, screw mounting holes 65 that open on the upper surface of the main body portion 64 are provided. Therefore, the nozzle body 61 is fixed to the nozzle support 51 by inserting the screw 58 (see FIG. 8) through the nozzle mounting hole 57 and screwing the inserted screw 58 into the screw mounting hole 65. Further, an upper projecting portion 66 having a height of 0.5 mm is projected from the outer peripheral surface of the upper end portion of the main body portion 64. Thereby, since the diameter of the upper end part of the main-body part 64 will be 16 mm, the upper-end part of the main-body part 64 comes to contact the inner surface of the accommodating part 54 (refer FIG. 8). On the other hand, a lower projecting portion 67 having a height of 1.5 mm protrudes from the outer peripheral surface of the lower end portion of the main body portion 64. Thereby, the diameter of the lower end part of the main-body part 64 becomes 18 mm, and the lower side overhang | projection part 67 comes to contact the said lower surface 53 of the nozzle support body 51 (refer FIG. 8). As a result, a space S (see FIG. 8) is generated between the outer peripheral surface of the main body portion 64 and the inner side surface of the accommodating portion 54.

  As shown in FIGS. 15, 16, and 18, an air flow path 71 that supplies ion air is provided inside the nozzle body 61. The nozzle body 61 is provided with a bypass flow path 72 that penetrates the inner wall surface of the air flow path 71 and the outer peripheral surface of the nozzle body 61. The ion air that has passed through the bypass flow path 72 is guided to the space S described above.

  As shown in FIGS. 15, 17, and 18, the lower end surface 62 of the nozzle body 61 is provided with a concave portion 73 having a circular shape when viewed from below. A chamfered portion 74 for efficiently discharging the swirl flow F <b> 1 (see FIGS. 23 and 24) generated in the concave portion 73 is provided at the opening portion of the concave portion 73. Further, a dust removal nozzle 75 having a substantially trapezoidal cross section and a circular shape when viewed from below is projected from the center of the recess 73. Here, the inclination angle of the outer peripheral surface of the dust removing nozzle 75 with respect to the bottom surface of the recess 73 is set to 60 °, and the inclination angle of the inner wall surface 76 of the recess 73 with respect to the bottom surface of the recess 73 is set to 60 °. That is, the angle of the outer peripheral surface of the dust removal nozzle 75 is equal to the angle of the inner wall surface 76 of the recess 73. Further, the projection amount of the dust removal nozzle 75 from the bottom surface of the recess 73 is set to 2.5 mm, and the tip end surface of the dust removal nozzle 75 is positioned 0.5 mm above the lower end surface 62 of the nozzle body 61. Yes. If the protrusion amount of the dust removal nozzle 75 is too small, ion air ejected from the first air blowing hole 81 may reach the tip of the dust removal nozzle 75. In this case, the ion air that has reached the tip of the dust removal nozzle 75 collides with the ion air ejected from the second air blowing hole 82 that opens at the tip of the dust removal nozzle 75 and disturbs the flow. On the other hand, if the protruding amount of the dust removal nozzle 75 is too large, the tip of the dust removal nozzle 75 comes into contact with the wiring board 110 when the suction surface 21 of the suction part 20 is brought close to the board main surface 120 of the wiring board 110. As a result, the wiring board 110 may be damaged.

  As shown in FIGS. 15, 17, and 18, the nozzle body 61 has a first air blowing hole 81 that opens at the inner wall surface 76 (inner circumferential surface) of the recess 73 and the outer circumferential surface of the body portion 64. It is provided in two places. The first air blowing holes 81 are arranged so as to be point-symmetrical with respect to the central axis of the dust removal nozzle 75 and open along the circumferential direction of the recess 73 on the inner wall surface 76. Each first air blowing hole 81 is configured to jet ion air guided to the space S into the recess 73. And the ion air ejected from each 1st air blowing hole 81 is guide | induced along the circumferential direction of the recessed part 73, and forms the swirl | vortex flow F1. In other words, the suction unit 20 of the present embodiment is a Bernoulli chuck that holds the wiring board 110 by using the Bernoulli effect generated by the air flow generated between the suction part main body 22 and the wiring board 110.

  As shown in FIGS. 15 to 18, a second air blowing hole 82 communicating with the air flow path 71 is provided in a position different from the first air blowing hole 81 in the recess 73. That is, the air flow path 71 is a common flow path for supplying ion air to each of the first air blowing hole 81 and the second air blowing hole 82. Further, the second air blowing hole 82 is arranged closer to the center of the recess 73 than the first air blowing hole 81. Specifically, the second air blowing hole 82 is disposed so as to open at the tip of the dust removal nozzle 75. The second air blowing hole 82 has a central axis perpendicular to the substrate main surface 120 of the wiring substrate 110, and blows ion air flowing through the air flow path 71 toward the substrate main surface 120 vertically. It is like that. In addition, it is preferable that the inner diameter of the second air blowing hole 82 is set to such a size that foreign matter on the substrate main surface 120 can be removed by the blown ion air and the force for lifting the wiring substrate 110 is not offset. If the inner diameter of the second air blowing hole 82 is too small, the momentum of the ion air ejected from the second air blowing hole 82 becomes too small, so that the ion air is difficult to reach the substrate main surface 120 of the wiring board 110. On the other hand, if the inner diameter of the second air blowing hole 82 is too large, the momentum of the ion air ejected from the second air blowing hole 82 becomes too large to cancel the force for lifting the wiring board 110, so that the wiring board 110 is lifted. Disappear.

  As shown in FIGS. 19 to 21, the resin pad 40 is attached to the suction unit body 22, and the front surface (lower surface) is the suction surface 21. The resin pad 40 is made of a resin material (ether urethane in this embodiment) and has a substantially rectangular plate shape of 35 mm long × 35 mm wide × 2.5 mm high. Further, a through hole 41 having a diameter of 18.3 mm is provided at the center of the resin pad 40. The through hole 41 exposes the recess 73 and the like of the main body 64 (see FIG. 7). Further, the resin pad 40 is provided with twelve dust collecting holes 42 communicating with the dust collecting channel 191. Each dust collection hole 42 is disposed so as to open in the outer region of the through hole 41 and the recess 73, and is disposed at a plurality of locations along the outer periphery of the recess so as to surround the recess 73 (FIG. 7). reference). More specifically, the dust collecting holes 42 are arranged at equiangular (30 °) intervals with the central axis of the through hole 41 as a reference. In addition, a dust collection barrier 43 that surrounds each dust collection hole 42 protrudes from an outer region of each dust collection hole 42 on the suction surface 21. The dust collecting barrier 43 has an annular shape with an inner diameter of 26 mm and an outer diameter of 29 mm, and the height is set to 1.2 mm.

  As shown in FIGS. 19 and 21, the outermost peripheral portion of the suction surface 21, that is, the four corners of the resin pad 40, are formed with convex portions 44 that protrude by 1.5 mm from the suction surface 21. Yes. Further, four vacuum suction holes 45 are arranged in the resin pad 40 so as to open at the respective convex portions 44. That is, each vacuum suction hole 45 is disposed so as to open in the outer region of the through hole 41 and the recess 73. Each vacuum suction hole 45 communicates with a suction flow path 46 that penetrates the resin pad 40, and each suction flow path 46 joins the common suction flow path 196 of the suction unit body 22. (See FIG. 8).

  An electrostatic potential sensor 105 (see FIGS. 22 and 23) is installed on the contact portion 184 of the substrate holding member 181. The electrostatic potential sensor 105 is embedded in the contact portion 184 and is disposed so as to be exposed from the chamfered portion 185 of the contact portion 184. That is, the electrostatic potential sensor 105 is provided at a position in contact with the outer peripheral edge of the wiring board 110. The electrostatic potential sensor 105 measures static electricity charged on the wiring board 110 and outputs a static electricity measurement signal.

  Next, the system configuration of the non-contact conveyance device 1 will be described.

  As shown in FIG. 22, the non-contact conveyance device 1 includes an air supply source 131 that sends out pressurized air. Further, the non-contact conveyance device 1 includes an air supply flow path 130 that constitutes an air supply path capable of communicating between the air supply source 131 and the suction unit 20. On the downstream side, the air supply flow path 130 includes a first air flow path 140 that forms a swirl flow forming path, a second air flow path 150 that forms a dust collection path, and a third air flow that forms a vacuum suction path. Branches to the road 160. The first air flow path 140 communicates with the air flow path 71 of the suction unit 20 via the antistatic tube 99 (see FIG. 6) and the second port 92 (see b in FIGS. 5 and 22). The second air flow path 150 communicates with the dust collection flow path 191 of the suction unit 20 via the antistatic tube 99 and the third port 93 (see c in FIGS. 5 and 22). The third air flow path 160 communicates with the suction flow path 195 of the suction unit 20 via the antistatic tube 99 and the first port 91 (see a in FIGS. 5 and 22).

  As shown in FIG. 22, an air supply valve 132 is installed on the air supply channel 130. The air supply valve 132 is disposed on the downstream side of the air supply source 131, and switches the air supply flow path 130 between an open state and a closed state. The air supply valve 132 is configured to be able to supply air to the downstream side when switched to the open state. Note that the air supply valve 132 of the present embodiment is an electromagnetic valve that is operated by a solenoid (not shown).

  An air pressure adjusting unit 133 that adjusts the air pressure in the air supply channel 130 to a constant value is installed on the air supply channel 130. That is, the air pressure adjustment unit 133 is connected to the air supply valve 132 and the air supply source 131 through the air supply flow path 130 in a flow path. The air pressure adjustment unit 133 includes an air filter 134, a pressure gauge 135, and a pressure reducing valve 136. The air filter 134 is disposed on the downstream side of the air supply valve 132, and removes foreign matters contained in the air passing through the air supply flow path 130. The pressure gauge 135 is disposed downstream of the air filter 134 and measures the pressure of air passing through the air supply flow path 130. Further, the pressure reducing valve 136 is disposed on the downstream side of the pressure gauge 135, performs pressure reduction of the air passing through the air supply flow path 130, and supplies the reduced air to the downstream side.

  As shown in FIG. 22, a DC ionizer 141 is installed on the first air flow path 140. The ionizer 141 is disposed on the downstream side of the air pressure adjustment unit 133, and has an ionizer body 142 that communicates with the first air flow path 140, and two discharge needles that protrude into the ionizer body 142 (on the positive electrode side and the negative electrode side). Discharge needle) and a high-voltage power source for applying a DC voltage to each discharge needle. Each discharge needle generates ions around the tip by performing corona discharge when a DC voltage is applied. More specifically, the positive electrode discharge needle generates positive ions when the polarity of the applied DC voltage is positive (+), and the negative electrode discharge needle has a negative (-) polarity of the applied DC voltage. In this case, anions are generated. The ionizer 141 generates ion air by mixing the generated ions with the air guided into the ionizer body 142. Further, the ionizer 141 discharges the generated ion air to the downstream side of the first air flow path 140.

  As shown in FIG. 22, an electromagnetic valve 143 and an air filter 144 are installed on the first air flow path 140. The electromagnetic valve 143 is disposed on the downstream side of the ionizer 141, and switches the first air flow path 140 to an open state or a closed state. When the solenoid valve 143 is switched to the open state, the ion air can be supplied to the downstream side, and the ion pressure is appropriately discharged to adjust the air pressure to a reduced pressure. The electromagnetic valve 143 of the present embodiment is a two-position, direct-acting normally closed electromagnetic valve that is operated by a single-action solenoid, and is switched to an open state based on a control signal output from the control device 101 described later. The air filter 144 is disposed on the downstream side of the electromagnetic valve 143, and removes foreign matters contained in ion air passing through the first air flow path 140.

  The ion air that has passed through the air filter 144 is guided to the air flow path 71 of the suction unit 20 through the antistatic tube 99 and the second port 92. Here, the equipment from the ionizer 141 to the suction unit 20 is configured using an antistatic material imparted with conductivity. Specifically, the electromagnetic valve 143 and the air filter 144 are made of a conductive metal. In addition, the flow path connecting the ionizer 141 and the electromagnetic valve 143, the flow path connecting the electromagnetic valve 143 and the air filter 144, and the flow path connecting the air filter 144 and the suction unit 20 are mixed with carbon black in polyurethane. It is formed using an antistatic tube 99 made of the same material.

  As shown in FIG. 22, a dust collection unit 151 is installed on the second air flow path 150. The dust collection unit 151 includes an electromagnetic valve 152, ejectors 153 and 154, a silencer 155, a check valve 156, and an air filter 157. The electromagnetic valve 152 is disposed on the downstream side of the air pressure adjustment unit 133, and switches the second air flow path 150 between an open state and a closed state. When the solenoid valve 152 is switched to the open state, the air can be supplied to the ejector 153 and the air pressure is appropriately discharged to adjust the air pressure to a reduced pressure. The electromagnetic valve 152 of this embodiment is a two-position, direct-acting normally closed electromagnetic valve that is operated by a single-action solenoid, and is switched to an open state based on a control signal output from the control device 101. The ejector 153 is disposed on the downstream side of the electromagnetic valve 152 and the air filter 157. The ejector 153 sucks air in the vicinity of the dust collection hole 42 of the suction unit 20 through the dust collection channel 191, the third port 93, the air filter 157, and the like. The air sucked into the ejector 153 flows into the ejector 154. The ejector 154 is disposed on the downstream side of the ejector 153, the air filter 157, and the check valve 156. The ejector 154 sucks air in the vicinity of the dust collection hole 42 through the dust collection flow path 191, the third port 93, the air filter 157, the check valve 156, and the like. A silencer 155 is disposed on the downstream side of the ejector 154, and the silencer 155 exhausts air flowing from the ejector 154 and reduces the exhaust sound of the air. The check valve 156 is disposed between the ejector 154 and the air filter 157 so that air flows from the air filter 157 to the ejector 154, while the air flows from the ejector 154 to the air filter 157. It comes to prevent.

  As shown in FIG. 22, an adsorption unit 161 is installed on the third air flow path 160. The third air flow path 160 branches into a substrate adsorption flow path 158 and a vacuum break flow path 159.

  On the substrate adsorption flow path 158, a first electromagnetic valve 162, ejectors 163 and 164, a silencer 165, a check valve 166, and an air filter 167 are installed. The first electromagnetic valve 162 is arranged on the downstream side of the air pressure adjustment unit 133, and switches the substrate adsorption flow path 158 to an open state or a closed state. When the first solenoid valve 162 is switched to the open state, the air can be supplied to the ejector 163, and the air pressure is appropriately discharged to adjust the air pressure to a reduced pressure. The first electromagnetic valve 162 of the present embodiment is a two-position, direct-acting normally closed electromagnetic valve that is operated by a single-action solenoid, and is switched to an open state based on a control signal output from the control device 101. The ejector 163 is disposed on the downstream side of the first electromagnetic valve 162 and the air filter 167. The ejector 163 evacuates the air in the vicinity of the vacuum suction hole 45 of the suction unit 20 through the suction flow path 195, the first port 91, the air filter 167, and the like. The air sucked into the ejector 163 flows into the ejector 164. Further, the ejector 164 is disposed on the downstream side of the ejector 163, the air filter 167, and the check valve 166. The ejector 164 evacuates air in the vicinity of the vacuum suction hole 45 through the suction flow path 195, the first port 91, the air filter 167, the check valve 166, and the like. A silencer 165 is disposed on the downstream side of the ejector 164. The silencer 165 exhausts air flowing from the ejector 164 and reduces the exhaust sound of the air. The check valve 166 is disposed between the ejector 164 and the air filter 167 so that air flows from the air filter 167 to the ejector 164, while the air flows from the ejector 164 to the air filter 167. It comes to prevent.

  As shown in FIG. 22, a second electromagnetic valve 168, a flow rate adjustment valve 169, and a pressure switch 170 are installed on the vacuum breaking channel 159. The second electromagnetic valve 168 is disposed on the downstream side of the air pressure adjustment unit 133, and switches the vacuum break channel 159 to an open state or a closed state. When the second electromagnetic valve 168 is switched to the open state, the second electromagnetic valve 168 supplies air to the connection flow path connecting the air filter 167 and the suction unit 20 to weaken the degree of vacuum of the connection flow path. . At the same time, when the second electromagnetic valve 168 is switched to the open state, the air flowing through the vacuum breaking flow path 159 is appropriately discharged to adjust the pressure reduction. Note that the second electromagnetic valve 168 of the present embodiment is a two-position, direct-acting normally closed electromagnetic valve that is operated by a single-action solenoid, and is switched to an open state based on a control signal output from the control device 101. The flow rate adjusting valve 169 is disposed in the middle of the flow path connecting the second electromagnetic valve 168 and the pressure switch 170, and the air flowing through the vacuum breaking flow path 159 is quantitatively exhausted to reduce the pressure of the air. This is a throttle valve that adjusts the pressure to a constant value. The pressure switch 170 is disposed on the downstream side of the flow rate adjustment valve 169 and the air filter 167. The pressure switch 170 is turned on when the pressure in the vacuum break channel 159 exceeds a predetermined value (that is, vacuum break), and outputs a vacuum break signal to the CPU 102 of the control device 101. It is supposed to be.

  Next, the electrical configuration of the non-contact transport apparatus 1 will be described.

  As shown in FIG. 22, the non-contact conveyance device 1 includes a control device 101 that controls the entire device. The control device 101 includes a CPU 102, a ROM 103, a RAM 104, an input / output circuit, and the like. The CPU 102 is electrically connected to the air supply valve 132, the ionizer 141, the electromagnetic valves 143 and 152, the first electromagnetic valve 162, and the second electromagnetic valve 168, and controls them by various driving signals.

  Further, the CPU 102 is inputted with an electrostatic measurement signal outputted from the electrostatic potential sensor 105. Then, the CPU 102 determines whether the wiring board 110 sucked by the suction unit 20 is positively (+) or negatively (−) based on the polarity of the electrostatic charge indicated by the electrostatic measurement signal. It comes to judge. When it is determined that the wiring board 110 is positively charged, the CPU 102 outputs a drive signal to the ionizer 141 and applies a DC voltage to perform control to generate negative ions on the discharge needle on the negative electrode side. It has become. On the other hand, when it is determined that the wiring board 110 is negatively charged, the CPU 102 outputs a drive signal to the ionizer 141 and applies a DC voltage to generate positive ions on the discharge needle on the positive electrode side. It is like that. According to such control, static electricity charged on the wiring board 110 can be reliably neutralized.

  In this embodiment, although the DC ionizer 141 is used, an AC ionizer may be used instead. The AC type ionizer includes an ionizer body, one discharge needle protruding into the ionizer body, and a high-voltage power source that applies an AC voltage to the discharge needle. When an alternating voltage is applied, the discharge needle generates a cation or an anion according to the polarity of the applied alternating voltage. In this case, when the electrostatic measurement signal output from the electrostatic potential sensor 105 is input, the CPU 102 determines whether or not the wiring board 110 is charged based on the electrostatic charge amount indicated by the electrostatic measurement signal. When it is determined that the wiring board 110 is charged, the CPU 102 outputs a drive signal to the ionizer 141 and performs control to increase the output of the ionizer 141. On the other hand, when it is determined that the wiring board 110 is not charged, the CPU 102 outputs a drive signal to the ionizer 141 and performs control to weaken the output of the ionizer 141. Such control can reliably prevent the wiring board 110 from being charged. Further, it is possible to prevent the ionizer 141 from operating more than necessary.

  Next, a non-contact conveyance method for the wiring board 110 will be described.

  The wiring board 110 of the present embodiment is manufactured through a plurality of manufacturing processes, and is shipped after undergoing an inspection process for conducting a continuity test. The wiring board 110 is arranged on the board support 171 every time the manufacturing process is completed (see FIG. 23). In this state, the conveyance process which conveys the wiring board 110 using the non-contact conveyance apparatus 1 is performed. More specifically, the arm 3 of the transfer articulated robot 2 is driven to lower the transfer head 11. Further, the air cylinder 15 is driven to project the rod, and the suction surface 21 of the suction unit 20 is brought close to the substrate main surface 120 of the wiring substrate 110.

  In this state, the CPU 102 outputs drive signals to the air supply valve 132, the ionizer 141, and the electromagnetic valves 143 and 152. As a result, the air supply valve 132 and the electromagnetic valves 143 and 152 are switched to the open state, and the ionizer 141 is activated. As a result, the pressurized air sent out from the air supply source 131 passes through the air supply passage 130 and flows into the ionizer 141 on the first air passage 140. The ionizer 141 generates ion air by mixing ions with the air introduced into the ionizer body 142. The ionizer 141 releases the generated ion air to the downstream side of the ionizer 141. Further, the ion air discharged from the ionizer 141 flows into the suction unit 20 via the first air flow path 140 and the second port 92 (see b in FIGS. 5 and 22), and the air flow path of the nozzle body 61. 71.

  The ion air guided to the air flow path 71 sequentially passes through the bypass flow path 72, the space S, and the first air blowing hole 81, and is ejected from the first air blowing hole 81 along the inner peripheral surface of the recess 73. To do. Further, the ion air ejected from the first air blowing hole 81 flows along the circumferential direction of the recess 73 to form a swirling flow F1. Thereafter, the flow velocity of the swirl flow F1 is increased by centrifugal force, so that the swirl flow F1 becomes a high-speed flow. Further, a part of the ion air that forms the swirl flow F1 flows out of the recess 73 and passes through the gap between the suction surface 21 and the substrate main surface 120. At this time, a high-speed flow is generated outside the suction unit 20. Released (see arrow F2 in FIG. 23). As a result, the space generated between the suction surface 21 and the substrate main surface 120 becomes negative pressure, and the substrate main surface 120 of the wiring substrate 110 is sucked and held by the suction surface 21.

  Further, in the transporting process of the present embodiment, a dust removing process for removing foreign matter on the substrate main surface 120 by blowing ion air from the second air blowing hole 82 toward the substrate main surface 120 is simultaneously performed. More specifically, ion air guided to the air flow path 71 is caused to flow into the second air blowing hole 82 and blown vertically from the second air blowing hole 82 toward the board main surface 120 of the wiring board 110. As a result, the foreign matter on the substrate main surface 120 is blown off and removed.

  Further, the pressurized air sent from the air supply source 131 passes through the air supply flow path 130 and flows into the ejectors 153 and 154 on the second air flow path 150. The ejectors 153 and 154 send ion air (that is, most of the ion air that forms the swirl flow F1) in the vicinity of the dust collection hole 42 of the suction unit 20 to the dust collection passage 191 and the third port 93 (FIG. 5). (See FIG. 22c). Thereby, the foreign material adhering on the board | substrate main surface 120 of the wiring board 110 is collect | recovered with ion air. Note that the total flow rate of ion air sucked from the dust collection holes 42 is set to be larger than the total flow rate of ion air ejected from the first air blowing holes 81.

  Next, the air cylinder 15 is driven to retract the rod, and the suction unit 20 is raised together with the wiring board 110. In the stage before raising the suction part 20, the rod projects downward, so that the tip surface of the contact part 184 of the substrate holding member 181 is located above the suction surface 21 of the suction part 20. At this time, since the contact portion 184 does not contact the wiring board 110, there is no fear of damaging the wiring board 110. Then, the wiring substrate 110 is separated from the substrate support 171 and brought close to the contact portion 184 of the substrate holding member 181. As a result, the chamfered portion 185 of each contact portion 184 comes into contact with the outer peripheral edge (four sides) of the wiring board 110, and the wiring board 110 is held and fixed so that it cannot be displaced (see FIG. 24). In FIG. 24, for convenience of explanation, the gap between the suction surface 21 and the substrate main surface 120 is enlarged, but the actual gap is narrower (for example, 1 mm or less).

  In this state, the CPU 102 outputs a drive signal to the first electromagnetic valve 162. As a result, the first electromagnetic valve 162 is switched to the open state, and the pressurized air sent from the air supply source 131 passes through the air supply channel 130 and the third air channel 160 on the substrate adsorption channel 158. It flows into the ejectors 163 and 164. The ejectors 163 and 164 evacuate the ion air in the vicinity of the vacuum suction hole 45 of the suction unit 20 through the suction flow path 195 and the first port 91 (see a in FIGS. 5 and 22). As a result, the substrate main surface 120 of the wiring substrate 110 is stably held by the suction surface 21 by the suction force by the Bernoulli effect and the suction force by vacuuming. In the present embodiment, the force for attracting the wiring board 110 by vacuuming is greater than the force for attracting the wiring board 110 using the Bernoulli effect.

  Next, the arm 3 of the transfer articulated robot 2 is driven to transfer the wiring board 110 to the inspection process line. Then, the wiring substrate 110 is released in the inspection process line, and the wiring substrate 110 is placed on the substrate support of the inspection process line. Specifically, the CPU 102 outputs a drive signal to the second electromagnetic valve 168. As a result, the second electromagnetic valve 168 is switched to the open state, and the pressurized air sent from the air supply source 131 passes through the air supply flow path 130 and the third air flow path 160 and is guided to the vacuum break flow path 159. Then, the air is supplied to the connection flow path connecting the air filter 167 and the suction unit 20. As a result, the vacuum of the connection channel is performed, the degree of vacuum of the connection channel is weakened, and the force for sucking the wiring board 110 is weakened.

  Next, the suction portion 20 is lowered by driving the air cylinder 15 to project the rod. As a result, the suction surface 21 of the suction portion 20 approaches the substrate main surface 120 of the wiring substrate 110, and the wiring substrate 110 is moved away from the substrate holding member 181 and is not in contact with each contact portion 184. And CPU102 performs control which switches the solenoid valve 143 to a closed state, and interrupts | blocks the 1st air flow path 140. FIG. At the same time, the CPU 102 performs control for switching the electromagnetic valve 152 to the closed state to shut off the second air flow path 150 and performs control to switch the first electromagnetic valve 162 and the second electromagnetic valve 168 to the closed state. 3 Shut off the air flow path 160. Thereby, the supply of ion air to the suction unit 20 is stopped, and the ejection of ion air from the first air blowing hole 81 and the second air blowing hole 82 is completed. Further, the suction of ion air from the dust collection hole 42 is completed, and the evacuation of ion air from the vacuum suction hole 45 is completed. As a result, the transfer process is completed, and the wiring board 110 is placed on the board support base of the inspection process line.

  Therefore, according to the present embodiment, the following effects can be obtained.

  (1) In the non-contact conveyance device 1 of the present embodiment, by blowing ion air from the second air blowing hole 82 toward the substrate main surface 120 of the wiring substrate 110, foreign matter on the substrate main surface 120 is blown away with air. Can be removed. Therefore, in the continuity inspection after conveyance, when a probe (not shown) is brought into contact with the solder bump 118 on the substrate main surface 120, foreign matter that does not conduct is caught between the probe and the solder bump 118. Is prevented. As a result, it is difficult to determine that the wiring board 110 is a defective product due to the presence of foreign matter, so that the yield of the wiring board 110 can be improved.

  (2) For example, it is conceivable to remove foreign substances on the substrate main surface 120 by blowing a part of ion air ejected from the first air blowing holes 81 toward the substrate main surface 120 of the wiring substrate 110. However, since the ionic air ejected from the first air blowing hole 81 flows along the inner peripheral surface of the recess 73, a part of the ionic air is blown obliquely with respect to the substrate main surface 120. As a result, the momentum of the ion air colliding with the substrate main surface 120 is weakened, so that there is a possibility that foreign matter on the substrate main surface 120 cannot be completely removed. In addition, if a part of the ion air ejected from the first air blowing hole 81 is used for removing foreign substances, the amount of ion air used to form the swirl flow F1 is reduced accordingly. As a result, it becomes difficult to form a large swirling flow F1, and it becomes difficult to generate a negative pressure necessary for sucking the wiring board 110 by the swirling flow F1, and thus the wiring board 110 may not be sucked. .

  Therefore, in the present embodiment, a second air blowing hole 82 for ejecting ion air for removing foreign matter is provided separately from the first air blowing hole 81 for ejecting ion air for forming a swirling flow. In addition, in the present embodiment, ion air is blown vertically from the second air blowing hole 82 toward the substrate main surface 120. As a result, since the moment of collision of ion air against the substrate main surface 120 is stronger than when ion air is blown obliquely toward the substrate main surface 120, foreign matter on the substrate main surface 120 can be more reliably removed. . In addition, since all of the ion air ejected from the first air blowing holes 81 is ion air for forming the swirl flow, a large swirl flow F1 can be formed, and the wiring board 110 is reliably secured by the negative pressure generated by the swirl flow F1. Can be aspirated.

  (3) In the present embodiment, since the air that is ejected from the first air blowing hole 81 to form the swirl flow F1 is ionized air, the air blowing hole for ejecting ionized air is provided separately from the first air blowing hole 81. There is no need. Moreover, not only the air ejected from the first air blowing hole 81 but also the air ejected from the second air blowing hole 82 is ion air. For this reason, the air ejected from the second air blowing hole 82 can have a function of neutralizing static electricity as well as a function of removing foreign matter on the substrate main surface 120. Therefore, static electricity charged on the wiring board 110 can be neutralized efficiently. Moreover, in the suction unit 20 of the present embodiment, the air that forms the swirling flow F1 and the air that removes the foreign matter are supplied through a common flow path, and the first air blowing hole 81 and the second air in the nozzle body 61 are supplied. The air is distributed to the air blowing holes 82. For this reason, compared with the case where the swirl flow forming flow path through which the air for forming the swirl flow flows and the foreign substance removal flow path through which the air for removing the foreign substances are separately formed, the suction unit 20 is reduced in size, weight, and configuration. Can be simplified.

  (4) In the present embodiment, a first air blowing hole 81 that opens on the inner peripheral surface of the recess 73 is provided, and a dust removal nozzle 75 is provided in the center of the recess 73. For this reason, the ion air ejected from the first air blowing hole 81 flows in the space (guide flow path) between the inner wall surface 76 of the recess 73 and the outer peripheral surface of the dust removal nozzle 75. Since the guide channel has a circular shape (see FIGS. 7 and 17), the ion air ejected from the first air blowing hole 81 surely becomes the swirl flow F1 by flowing in the guide channel. Therefore, the ion air ejected from the first air blowing hole 81 can be prevented from flowing toward the center of the inner peripheral surface of the recess 73 or being discharged outside the recess 73 without being the swirl flow F1. Can eliminate waste.

  (5) As a conventional transfer method, the main surface 120 of the wiring board 110 is sucked with a negative pressure on the lower surface of the suction head having an air suction hole, and the wiring board 110 is transported together with the suction head in this state. Has been proposed. However, when the wiring substrate 110 is transported by the suction head, the protruding electrodes (terminal pads 116 and solder bumps 118) arranged on the substrate main surface 120 may be crushed by the suction head and deformed.

  Therefore, in the present embodiment, the chamfered portion 185 provided on the contact portion 184 of the substrate holding member 181 is brought into contact with the outer peripheral edge of the wiring substrate 110 when the substrate is held and fixed. As a result, contact of the substrate main surface 120 with the suction surface 21 can be avoided, so that the protruding electrodes on the substrate main surface 120 need not be damaged. Further, since the contact area between the wiring substrate 110 and the contact portion 184 is reduced by the chamfered portion 185 coming into contact with the outer peripheral edge of the wiring substrate 110, the wiring substrate 110 can be reliably prevented from being damaged.

  In addition, you may change this embodiment as follows.

  -The 2nd air blowing hole 82 of the said embodiment was arrange | positioned so that it might open in the center of the recessed part 73 (specifically front-end | tip of the dust removal nozzle 75). However, the second air blowing hole 82 may be disposed so as to be opened at the outer peripheral surface of the dust removal nozzle 75 or may be disposed so as to be opened at the outer peripheral portion of the inner peripheral surface of the recess 73. It may be. That is, the second air blowing hole 82 may be disposed in any portion as long as it opens in the recess 73. However, the second air blowing hole 82 is preferably arranged so as to open at the center of the recess 73. If the second air blowing hole 82 is not opened at the center of the recess 73, ion air ejected from the second air blowing hole 82 may collide with the swirling flow F1 and disturb the flow.

  In the above embodiment, the dust removal nozzle 75 protruding from the center of the recess 73 may be omitted, and the second air blowing hole 82 may be opened on the inner peripheral surface of the recess 73.

  In the above-described embodiment, ion air discharged from the ionizer 141 is used as the air discharged from the first air blowing hole 81 and the second air blowing hole 82. However, the air ejected from the air blowing holes 81 and 82 is not limited to ion air, and may be normal air in which ions are not mixed.

  In the above embodiment, at least one of the dust collection unit 151 and the adsorption unit 161 may be omitted. Further, when the adsorption unit 161 is not omitted, the devices (second electromagnetic valve 168, flow rate adjustment valve 169, and pressure switch 170) installed on the vacuum breaking channel 159 of the adsorption unit 161 may be omitted.

  In the above embodiment, the electrostatic potential sensor 105 is installed at the contact portion 184 of the substrate holding member 181, but the electrostatic potential sensor 105 may be installed at another location such as the substrate support 171. .

  In the above embodiment, the control of the air supply valve 132, the ionizer 141, the electromagnetic valve 143, the electromagnetic valve 152, the first electromagnetic valve 162, and the second electromagnetic valve 168 is controlled by one CPU 102. You may comprise so that it may be performed by a separate CPU.

  In the above embodiment, the substrate main surface 120 of the wiring substrate 110 is sucked and held by the suction surface 21, and then the rod is moved backward to raise the suction portion 20 together with the wiring substrate 110, whereby the contact portion 184 of the substrate holding member 181. Is brought into contact with the outer peripheral edge of the wiring board 110, and the wiring board 110 is held and fixed so that it cannot be displaced. However, the transport head 11 with the rod retracted is lowered to bring the suction part 20 closer to the wiring board 110, and at the same time, the contact part 184 is brought into contact with the outer peripheral edge of the wiring board 110. 110 may be sucked and held.

  -Although the non-contact conveyance apparatus 1 of the said embodiment was designed to convey the wiring board 110 of a single product, for example, a plurality of board formation regions which should become the wiring board 110 were arranged along the plane direction. A multi-piece wiring board may be transported.

  In the above embodiment, the wiring board 110 is transported using the transporting articulated robot 2 equipped with the suction unit 20, but the wiring board 110 is transported using transporting means such as a conveyor equipped with the suction unit 20. May be.

  Next, the technical ideas grasped by the embodiment described above are listed below.

  (1) The suction surface is provided with a concave portion, and has a suction portion provided with a first air blowing hole that opens at the inner peripheral surface of the concave portion, from the first air blowing hole to the inner peripheral surface of the concave portion. In a non-contact transfer device that transports the substrate main surface of the wiring board that is the object to be transferred by sucking and holding the substrate main surface to the suction surface by the negative pressure generated by the air jetted along, for blowing air to the substrate main surface A second air blowing hole is provided in the recess at a position different from the first air blowing hole, an ionizer is provided separately from the suction portion, and ion air discharged from the ionizer is jetted from the air blowing hole. A non-contact transfer device for a wiring board, which is used as air.

  (2) The suction surface is provided with a recess, and has a suction portion provided with a first air blowing hole that opens at the inner peripheral surface of the recess, and the first air blowing hole extends from the first air blowing hole to the inner peripheral surface of the recess. In a non-contact transfer device that transports the substrate main surface of the wiring board that is the object to be transferred by sucking and holding the substrate main surface to the suction surface by the negative pressure generated by the air jetted along, for blowing air to the substrate main surface A second air blowing hole is provided in the recess at a position different from the first air blowing hole, and a dust collecting hole for collecting foreign matter on the main surface of the substrate is opened in an outer region of the recess on the suction surface. A non-contact transfer device for a wiring board, which is arranged as described above.

  (3) The suction surface is provided with a recess, and has a suction portion provided with a first air blowing hole that opens at the inner circumferential surface of the recess, and the first air blowing hole extends from the first air blowing hole to the inner circumferential surface of the recess. In a non-contact transfer device that transports the substrate main surface of the wiring board that is the object to be transferred by sucking and holding the substrate main surface to the suction surface by the negative pressure generated by the air jetted along, for blowing air to the substrate main surface A second air blowing hole is provided in the recess at a position different from the first air blowing hole, and the wiring board is brought into contact with the outer peripheral edge of the wiring board when the board main surface is sucked and held by the suction face. A non-contact transfer device for a wiring board, comprising a board holding member for holding and fixing the board so that the board cannot be displaced.

  (4) The suction surface is provided with a recess, and is provided with a suction portion provided with a first air blowing hole that opens at the inner circumferential surface of the recess, and the first air blowing hole is provided on the inner circumferential surface of the recess. In a non-contact transfer device that transports the substrate main surface of the wiring board that is the object to be transferred by sucking and holding the substrate main surface to the suction surface by the negative pressure generated by the air jetted along, for blowing air to the substrate main surface A second air blowing hole is provided in a position different from the first air blowing hole in the recess, and a vacuum suction hole for evacuating is disposed so as to open in an outer region of the recess. Wiring board non-contact transfer device.

  (5) The suction surface is provided with a recess, and is provided with a suction portion provided with a first air blowing hole that opens at the inner peripheral surface of the recess, and is provided from the first air blowing hole to the inner peripheral surface of the recess. In the non-contact transfer device that holds the substrate main surface of the wiring board, which is a transfer object, by sucking and holding the suction surface by the negative pressure generated by the air jetted along, the suction portion is a suction made of a metal material A main body, a cylindrical nozzle body housed in a housing recess opened at the lower surface of the suction body, and a resin pad attached to the opening end surface of the housing recess, and a part of the suction surface A concave portion is provided in the lower end surface of the nozzle body to be configured, a dust removal nozzle is projected from the center of the concave portion, and a second air blowing hole for blowing air to the substrate main surface is formed at the tip of the dust removal nozzle. Provided to open, said nose A common air flow path for supplying air to both the first air blowing hole and the second air blowing hole is provided inside the main body, and is opened at the inner wall surface of the air flow path and the outer peripheral surface of the nozzle main body. Air that is passed through the bypass flow path and is generated between the outer peripheral surface of the nozzle body and the inner peripheral surface side of the housing recess is provided on the outer peripheral surface of the nozzle body. The dust collecting holes for collecting foreign matter on the main surface of the substrate are arranged at a plurality of locations along the outer peripheral edge of the recess so as to surround the recess on the suction surface. A plurality of vacuum suction holes are provided so as to be opened, and a plurality of vacuum suction holes for evacuation are provided so as to open in an outer region of the recess, and individual suction flow paths communicating with the plurality of vacuum suction holes are provided. Combined with the common adsorption flow path inside the suction unit body, a plurality of front The individual dust collecting channels communicating with the dust collecting holes are joined to the common dust collecting channel inside the suction unit main body, and the common adsorption channel and the common dust collecting channel are connected to the vacuum drawing means. A non-contact transfer device for a wiring board.

Schematic which shows the non-contact conveying apparatus of one Embodiment which actualized this invention. Sectional drawing which shows schematic structure of a wiring board. Sectional drawing which shows schematic structure of a conveyance head. The side view which shows schematic structure of a conveyance head. The front view which shows a suction part. The top view which shows a suction part. The bottom view which shows a suction part. AA line sectional view of Drawing 6. The top view which shows an upper cover part. The top view which shows a suction part main body. BB sectional drawing of FIG. The bottom view which shows a suction part main body. The top view which shows a nozzle support body. CC sectional view taken on the line of FIG. The front view which shows a nozzle main body. The top view which shows a nozzle main body. The bottom view which shows a nozzle main body. The DD sectional view taken on the line of FIG. The top view which shows resin-made pads. EE sectional view taken on the line of FIG. FF sectional view taken on the line of FIG. The circuit diagram which shows a non-contact conveying apparatus. Explanatory drawing which shows the non-contact conveyance method of a wiring board. Explanatory drawing which shows the non-contact conveyance method of a wiring board.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Non-contact conveying apparatus 20 ... Suction part 21 ... Suction surface 71 ... Air flow path 73 as a common flow path ... Recess 75 ... Dust removal nozzle 81 ... 1st air blowing hole 82 ... 2nd air blowing hole 110 ... Covered Wiring substrate 116 as a transported object ... Terminal pad 118 as a protruding electrode ... Solder bump 119 as a protruding electrode ... Electrode forming region 120 ... Main surface of substrate

Claims (6)

The suction surface is provided with a recess, and is provided with a suction portion provided with a first air outlet hole that opens at the inner peripheral surface of the recess, and is ejected from the first air outlet hole along the inner peripheral surface of the recess. In the non-contact transport device that transports the substrate main surface of the wiring substrate that is the object to be transported by sucking and holding the suction surface by the negative pressure generated by the air,
A dust removal nozzle projects from the center of the recess,
The second air blowing port for blowing air to the substrate main surface, Rubeku provided at a position close to the center of the recess than the first air blowing port in the recess, said second air blowing port the A non-contact transfer device for a wiring board, wherein the non-contact transfer device is arranged to open at a tip of a dust removal nozzle . It said second central axis of the air blowing holes, non-contact transport apparatus of the wiring substrate according to claim 1, characterized in that it is arranged perpendicular to the substrate main surface of the wiring board. 3. The wiring board according to claim 1, wherein the suction portion includes a common flow path for supplying air to the first air blowing hole and the second air blowing hole. Non-contact transfer device. The wiring board, the wiring board according to the plurality of projecting electrodes are electrodes formed areas arranged in any one of claims 1 to 3, characterized in that a resin wiring board having on the substrate main surface Non-contact transfer device. Using the non-contact transfer device according to any one of claims 1 to 4 , a transfer step of transferring a resin wiring board having an electrode forming region on which the plurality of protruding electrodes are arranged on the substrate main surface. A method of manufacturing the resin wiring board by performing:
Manufacturing a resin wiring board, wherein a dust removing step of removing foreign matter on the main surface of the substrate by blowing air from the second air blowing hole toward the main surface of the substrate is performed simultaneously with the transporting step. Method. A negative pressure generated by air ejected from the first air blowing hole along the inner peripheral surface of the recess is provided with a first air blowing hole that opens at the inner peripheral surface of the concave portion provided on the suction surface of the suction portion. By the method of transporting the substrate main surface of the wiring board that is the object to be transported by suction holding the suction surface,
Rubeku provided at a position close to the center of the recess than the first air blowing port in the recess, the second arranged to open at the tip of the dust nozzle projecting from the center of the recess A non-contact conveyance method of a wiring board, wherein foreign matter on the main surface of the substrate is removed by blowing air toward the main surface of the wiring substrate from an air blowing hole.

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