JP4631497B2 - Proximity exposure equipment - Google Patents

Description

  The present invention relates to a proximity exposure apparatus suitable for proximity exposure transfer of a mask pattern onto a substrate such as a large flat panel display such as a liquid crystal display or a plasma display.

  In proximity exposure, a translucent substrate (material to be exposed) coated with a photosensitive agent on the surface is held on the substrate stage of the proximity exposure apparatus, and the substrate is brought close to the mask held on the mask holding frame of the mask stage. Then, the gap between the two is set to several tens μm to several hundreds μm, for example, and then the exposure light is irradiated toward the mask by the irradiation device from the side away from the substrate of the mask. The pattern is exposed and transferred.

For example, when manufacturing a color filter for a liquid crystal display, a black matrix pattern is first formed on the base slope as a first layer, and then a pattern of each color (red, green, blue) is sequentially formed one by one. .
Here, in the process of exposing the pattern of each color, it is necessary to precisely align the pattern already formed and the pattern to be exposed.

  Therefore, when the pattern of the first layer (black matrix) is formed, the pattern of the alignment mark is formed at the same time as the pattern of the black matrix itself, and this is necessary for precise alignment (alignment) between the mask and the substrate during the subsequent exposure. An alignment mark and an alignment mark provided on the mask so as to correspond to this are used.

  That is, these two alignment marks are optically detected, and the mask and the substrate are aligned based on the image data. For example, when alignment is performed so that the centers of the alignment marks coincide with each other, the exposure is set to the correct position. The same applies to the case where overlay exposure is performed, for example, by forming a circuit pattern or the like.

  By the way, the substrate must be brought into the substrate stage of the proximity exposure apparatus and in a state where the alignment can be adjusted while being held. For example, if alignment is not performed so that the alignment mark of the substrate enters the field of view of the alignment camera at the time of alignment detection, alignment is impossible. For this reason, prior to loading the substrate by the transport device, the pre-alignment device may perform positioning (pre-alignment) that enables alignment performed later.

Prealignment device, For example, in order to know the position and orientation in the horizontal plane of the substrate, a sensor detecting the position of one location of the other side orthogonal two places of one side of the substrate and with this, the detection result of the sensor the basis is the also the pre-alignment of the substrate ing an actuator performing.
A transport apparatus that transports a substrate from a pre-alignment apparatus onto a substrate stage of an exposure apparatus includes, for example, an arm that attracts and holds the substrate, and the arm is positioned in three axial directions of X, Y, and Z and a vertical axis (Z axis). ) It can perform positioning around the turn.

Then, when the substrate pre-aligned by the pre-alignment apparatus is carried onto the substrate stage by the transport apparatus and held, the substrate alignment is within the visual field of the alignment camera when the substrate stage is moved to the exposure position where alignment adjustment is performed. The mark is set to be positioned.
In the proximity exposure apparatus, the substrate that has been pre-aligned on the pre-alignment apparatus side is transported onto the substrate stage and held at the exposure position, and then the control apparatus uses an apparatus that moves the substrate stage up and down and a gap sensor, So-called gap control is performed in which the substrate stage is moved up and down so that the amount of clearance between the lower surface of the mask and the upper surface of the substrate, which are opposed to each other above the substrate, becomes a predetermined target value.

Next, the alignment of the mask and the substrate as described above is performed in a state where the gap amount has reached the target value, and thereafter, exposure light is irradiated from the irradiation means toward the mask. The pattern is exposed and transferred to the substrate.
In addition, after exposure, in the case of a step type exposure apparatus, the substrate stage is slightly moved downward to increase the gap amount between the lower surface of the mask and the upper surface of the substrate by a certain amount. A so-called step feed is performed by feeding one step amount, and gap adjustment, alignment adjustment, and exposure transfer are performed. In the case of multi-step exposure, the same process is repeated thereafter.

  In the above-described conventional proximity exposure apparatus, as shown in FIG. 5, the substrate stage is subjected to the pre-alignment accuracy on the pre-alignment apparatus side or the positioning error when the pre-aligned substrate is transferred by the transfer apparatus. In some cases, the alignment mark (printed on the substrate by the first exposure) 40 of the substrate transported upward deviates from the center of the visual field of the alignment camera.

In this case, in order to align the position of the alignment mark 40 on the substrate side (cross shape in this example) and the alignment mark 41 on the mask side (square shape in this example), the position of the mask is adjusted via the mask holding frame. As a result, alignment is performed at a position shifted from the center of the camera field of view, resulting in a decrease in alignment accuracy, and in some cases, it may not fit in the camera field of view or alignment may become impossible. There is.
The present invention has been made to solve such inconveniences, and provides a proximity exposure apparatus capable of improving the alignment accuracy between a substrate and a mask using alignment marks provided on each of them. Objective.

In order to achieve the above object, an invention according to claim 1 is directed to a substrate stage for holding a substrate as an exposed material conveyed from a pre-alignment apparatus, and a mask having a pattern to be exposed through a mask holding frame. The mask stage to be held, the imaging means for imaging the alignment mark printed on the substrate by the first exposure and the alignment mark on the mask side, and the alignment mark on the substrate side and the alignment mark on the mask side are aligned. A mask position adjusting means for adjusting the position of the mask via the mask holding frame, and an irradiating means for irradiating light for exposure toward the mask to transfer the mask pattern onto the substrate. in proximity exposure apparatus having, in the pre-alignment apparatus, group in order to know the position and orientation in the horizontal plane of the substrate A sensor for detecting the position of two locations on one side and one location on the other side orthogonal thereto, and an actuator for pre-aligning the substrate based on the detection results of these sensors. The amount of deviation of the alignment mark on the substrate side held on the substrate stage from the center of the field of view of the imaging means is acquired , and the position of the next substrate on the pre-alignment apparatus side is determined based on the amount of deviation . The alignment mark is corrected so as to be positioned at the center of the field of view of the imaging means on the substrate stage, and the acquisition of the shift amount and the correction of the position of the substrate on the pre-alignment apparatus side thereby are performed in the exposure process of each substrate It is characterized by being performed regularly or every time .

According to the present invention, with respect to a substrate transported from the pre-alignment apparatus to the substrate stage and held on the substrate stage, the amount of displacement of the alignment mark of the substrate from the center of the field of view of the imaging means is obtained, and based on the amount of displacement Since the position of the next substrate is corrected on the pre-alignment apparatus side, when the next substrate is transferred onto the substrate stage, the alignment mark of the substrate can be positioned at the approximate center of the field of view of the imaging means. Thus, the alignment mark on the substrate side and the alignment mark on the mask side can be aligned at the approximate center position of the imaging means, and the alignment accuracy between the substrate and the mask in the second and subsequent layers can be improved. .
In addition, when the next substrate is transported onto the substrate stage, the alignment mark of the substrate can be positioned at the approximate center of the field of view of the imaging means, so that an alignable range can be obtained evenly vertically and horizontally within the field plane. be able to.

Hereinafter, an example of an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a partially broken explanatory view for explaining a proximity exposure apparatus as an example of an embodiment of the present invention, FIG. 2 is a plan view of a proximity exposure apparatus and a pre-alignment apparatus, and FIG. FIG. 4 is a diagram viewed from the direction of arrow A, and FIG. 4 is a diagram showing an alignment mark on the substrate side and an alignment mark on the mask side in the camera field of view.

  As shown in FIG. 1, a proximity exposure apparatus as an example of an embodiment of the present invention uses a mask M smaller than a substrate W as a material to be exposed, and holds the mask M by a mask holding frame 25 of a mask stage 1. At the same time, the substrate W is held by the substrate stage 2, and in this state, the substrate stage 2 is moved stepwise with respect to the mask M in the two axial directions of the X-axis direction and the Y-axis direction. The pattern of the mask M is exposed and transferred onto the substrate W by irradiating light for pattern exposure from the irradiating means 3 toward the mask M in a state of being opposed to each other. In particular, it is a proximity exposure apparatus for exposing another pattern to the substrate W on which at least the first layer pattern has already been formed.

  In FIG. 1, reference numeral 4 denotes an apparatus base 4. An X-axis stage feed mechanism 5 for moving the substrate stage 2 stepwise in the X-axis direction is installed on the apparatus base 4. A Y-axis stage feed mechanism 6 for moving the substrate stage 2 stepwise in the Y-axis direction is installed on the axis feed table 5a, and the substrate stage 2 is installed on the Y-axis feed table 6a of the Y-axis stage feed mechanism 6. Has been. Referring to FIG. 2, the substrate W that has been pre-aligned by the pre-alignment apparatus 50 is transported by the transport device 51 on the substrate stage 2, and the substrate W transported on the substrate stage 2 is a work chuck. It is held in a vacuum-sucked state.

For example, in order to know the position and posture of the substrate W in the horizontal plane, the pre-alignment apparatus 50 includes a sensor that detects the position of two locations on one side of the substrate W and one location on the other side orthogonal thereto, and a sensor. An actuator for pre-aligning the substrate based on the detection result is provided.
The transport device 51 includes, for example, an arm that sucks and holds the substrate W, and can position the arm in the three-axis direction of X, Y, and Z and the rotation around the vertical axis (Z-axis).

Then, when the substrate W that has been pre-aligned by the pre-alignment apparatus 50 is carried onto the substrate stage 2 by the transport device_51 and held, the alignment will be described later when the substrate stage 2 is moved to an exposure position where alignment adjustment is performed. The alignment mark of the substrate W is set in the field of view of the camera 30.
Between the Y-axis stage feed mechanism 6 and the substrate stage 2, a vertical movement device 7 that performs simple vertical movement of the substrate stage 2 and a fine adjustment function for tilting the substrate stage 2 are also provided. An up-and-down fine movement device (advancing / retreating means) 8 for finely adjusting the gap between the opposing surfaces of M and the substrate W to a predetermined amount is installed. The vertical coarse movement device 7 moves the substrate stage 2 up and down with respect to a fine movement stage 6b described later.

  The vertical fine movement device 8 includes a fixed base 9 fixed to the Y-axis feed base 6a, and a linear guide guide rail 10 attached to the fixed base 9 with its inner end inclined obliquely downward. A ball screw nut (not shown) is connected to a slide body 12 that reciprocates along the guide rail 10 via a slider 11 straddling the guide rail 10. Is in contact with the flange 12a fixed to the fine movement stage 6b so as to be slidable in the horizontal direction.

Further, the flange 12a and the fixing base 9 are connected by a leaf spring 15 as shown in FIG. The leaf spring 15 has three tongue pieces 16 a, 16 b and 16 c, a central tongue piece 16 b is fixed to the flange 12 a, and both tongue pieces 16 a and 16 c are fixed to the fixing base 9.
Then, when the screw shaft of the ball screw is rotationally driven by the motor 17 attached to the fixed base 9, the nut, the slider 11 and the slide body 12 are integrally moved along the guide rail 10 in an oblique direction. The flange 12a is finely moved up and down. Such vertical fine movement is Rimoto volume by the elastic deformation of the leaf spring 15. On the other hand, at this time, the displacement of the flange 12 a in the horizontal direction is regulated by the leaf spring 15.

  The vertical fine movement device 8 is installed on one end side (left end side in FIG. 1) in the X-axis direction of the Z-axis feed base 6a and two on the other end side. It is like that. As a result, the vertical fine movement device 8 causes the lower surface of the mask M and the upper surface of the substrate W obtained by a control device (not shown) based on the measurement results of the positions of the lower surface of the mask M and the upper surface of the substrate W by the gap sensor 31 described later. The height of the substrate stage 2 is finely adjusted and the inclination with respect to the horizontal plane is finely adjusted by being controlled by the control device so that the amount of the gap is a predetermined target value.

Further, on the Y-axis feed base 6a, the bar mirror 19 of the Y-axis laser interferometer 18 serving as a feed error detecting means for detecting the position of the substrate stage 2 in the Y-axis direction and the position of the substrate stage 2 in the X-axis direction are detected. A bar mirror (both not shown) of an X-axis laser interferometer as a feed error detecting means is installed.
Two Y-axis laser interferometers 18 are provided apart from each other in the X-axis direction, and a yawing error is obtained based on data from the two Y-axis laser interferometers 18.
The bar mirror 19 of the Y-axis laser interferometer 18 extends along the X-axis direction on one side of the Y-axis feed base 6a, and the bar mirror of the X-axis laser interferometer extends in the Y-axis direction on one end side of the Y-axis feed base 6a. Extending along. The Y-axis laser interferometer and the X-axis laser interferometer are supported by the apparatus base 4 so as to be opposed to the bar mirror.

  Two Y-axis laser interferometers 18 detect the Y-axis feed base 6a and then the detection signal of the position data of the substrate stage 2 in the two Y-axis directions, and the detection of the position data of the substrate stage 2 in the X-axis direction by the X-axis laser interferometer. A signal is output to a control device (not shown), and the control device calculates a step feed error and a correction amount for eliminating the error based on these detection signals, and the calculation result is a mask position adjusting means (and By outputting to the drive circuit of the vertical fine movement device 8) as necessary, the mask position adjusting means or the like is controlled according to the correction amount, and the positional deviation and yawing error in the X-axis direction and Y-axis direction are corrected, The step position in the X-axis direction or the Y-axis direction is positioned.

In the present embodiment, when the step feed error is not so large, the above-described measurement using a laser interferometer is not essential, and a laser length measuring device, a bar mirror, or the like may be omitted.
The mask stage 1 can be moved in the X, Y, and θ directions (in the X, Y plane) by being inserted into a mask frame 24 formed of a substantially rectangular frame and a central opening of the mask frame 24 through a gap. The mask frame 24 is held in a fixed position above the substrate stage 2 by a support column 4 a protruding from the apparatus base 4.

An inwardly extending flange 26 is provided on the lower surface of the central opening of the mask holding frame 25 along the entire circumference of the opening. A mask M on which a pattern to be exposed is drawn on the lower surface of the flange 26 is detachably held via a vacuum suction device (not shown) or the like.
Further, above the flange 26, a gap sensor 31 as means for measuring a gap amount between the opposing surfaces of the lower surface of the mask M and the upper surface of the substrate W, and a square alignment provided in an exposure region of the mask M. An alignment camera 30 as a means for imaging the mark 41 (see FIG. 4) and the cross-shaped alignment mark 40 printed on the substrate W side by the first exposure is movably supported by the mask stage 1. .

The gap sensor 31 applies laser light from the light projecting unit to the lower surface of the mask M and the upper surface of the substrate W, receives the reflected light on each surface by the light receiving unit (for example, a line sensor), and receives the lower surface of the mask M and the upper surface of the substrate W. And at least three places are arranged appropriately spaced apart from each other on the inner side of the two sides along the Y-axis direction of the flange 26.
By performing arithmetic processing with a control device (not shown) based on the measurement results of these at least three gap sensors 31, the amount of clearance between the lower surface of the mask M and the upper surface of the substrate W can be obtained for each location. In accordance with this result, the vertical fine movement function that also functions as the tilt adjustment function by the three vertical fine movement devices 8 described above is controlled, the parallelism between the opposing surfaces of the mask M and the substrate W is ensured, and the gap amount is reduced. A predetermined value is set.

  The alignment cameras 30 are arranged at two locations, one in each of the upper portions of the two sides of the flange 26 along the Y-axis direction, in the substantially central portion in the Y-axis direction. A quadrangular alignment mark 41 provided in the exposure area and a cross-shaped alignment mark 40 printed by the first exposure on the substrate W are imaged and calculated by a control device (not shown) based on the image data. By performing the processing, it is possible to detect the amount of plane deviation between the mask M and the substrate W (or substrate stage 2), and the mask position adjusting means moves the mask holding frame 25 to X, Y according to this detected plane deviation amount. , Θ direction to adjust the orientation of the mask M held by the mask holding frame 25 with respect to the substrate W.

  Here, in this embodiment, the cross of the substrate W is transferred from the pre-alignment apparatus 50 to the substrate stage 2 and held on the substrate stage 2 at the second and subsequent exposures. The alignment mark 40 is picked up by the alignment camera 30 and the control device obtains the amount of deviation of the alignment mark 40 from the center of the camera field based on the image data, and the driving device on the pre-alignment device 50 side based on the amount of deviation. Is controlled so that the position of the next substrate W is corrected, that is, the alignment mark 40 of the next substrate W is corrected to be positioned at the center of the camera field of view on the substrate stage 2.

The mask position adjusting means is spaced apart from each other in the Y-axis direction on one side along the Y-axis direction of the mask holding frame 25 and a Y-axis direction driving device (not shown) attached to one side along the X-axis direction of the mask frame 24. And two X-axis direction drive devices (not shown) mounted in the X-axis direction, and the Y-axis direction drive device adjusts the mask holding frame 25 in the Y-axis direction. Thus, the X-axis direction and the θ-axis direction (swinging around the Z-axis) of the mask holding frame 25 are adjusted.
In FIG. 1, reference numeral 28 denotes a masking aperture mechanism having a light shielding blade that limits the exposure range by shielding exposure light in an arbitrary range on the mask M held by the mask holding frame 25 as necessary. .

In order to perform step exposure, for example, in the Y-axis direction using the proximity exposure apparatus having the above-described configuration, first, at least the first-layer pattern formation is completed, and the necessary preprocessing such as resist coating for pattern formation to be performed from now on is performed. The broken substrate W is transported onto the substrate stage 2 by the pre-alignment apparatus 50 and transported by the transport apparatus 51, and held at the exposure position.
Next, in this state, the control device causes the substrate W to approach the mask M by the vertical coarse motion device 7, and the clearance between the lower surface of the mask M and the upper surface of the substrate W is set to the target value by the vertical fine motion device 8 and the gap sensor 31. Gap control for finely moving the substrate stage 2 up and down is performed by controlling so that

Then, with the amount of the gap reaches a target value, the control based on the image data of the captured Teso a quadrangular alignment mark 41 of the cross-shaped alignment marks 40 and the mask-side of the substrate W side by the alignment camera 30 By performing arithmetic processing in the apparatus, the amount of plane deviation between the mask M and the substrate W is detected, and the mask position adjusting means moves the mask holding frame 25 in the X, Y, θ direction (θ direction) according to the detected plane deviation amount. Is moved in the turning direction around the Z axis), and the orientation of the mask M held by the mask holding frame 25 with respect to the substrate W is adjusted so that the positions of the substrate W and the mask M are aligned. The pattern M is exposed and transferred onto the substrate W by irradiating the mask M with light for use.

  Here, in the present embodiment, immediately after the first gap adjustment, that is, based on the image data when the alignment camera 30 images the cross-shaped alignment mark 40 of the substrate W before the alignment adjustment, the control device uses the alignment mark. The amount of deviation from the center of the camera field of view is obtained and stored. The stored deviation amount is used for the next pre-alignment correction of the substrate W by the pre-alignment apparatus 50.

After the exposure, the control device lowers the substrate stage 2 by the vertical fine movement device 8 to increase the gap amount between the lower surface of the mask M and the upper surface of the substrate W by a certain amount. In this state, the substrate stage 2 is moved with respect to the mask M. Only one step amount is sent, and the next step exposure is performed in the same manner as described above.
After the exposure of the first substrate W is thus completed, the second substrate W is transported onto the substrate stage 2 and held at the exposure position, and the second substrate W is formed on the second substrate W in the same process as described above. On the other hand, step exposure is performed.

At this time, as described above, when the first substrate W is held on the substrate stage 2, the cross-shaped alignment mark 40 of the substrate 2 is imaged by the alignment camera 30. The next (second) substrate W position is corrected by controlling the drive device on the pre-alignment apparatus 50 side based on the amount of deviation from the camera field of view center.
That is, with respect to the adjustment movement amounts in the X direction, Y direction, and θ direction determined based on the detection values of the three sensors by the pre-alignment device 50, the X direction component, the Y direction component, and θ corresponding to the deviation amount. Since the deviation is eliminated by taking the direction component as a correction value, the alignment mark of the substrate W is transferred when the next substrate W is transferred from the pre-alignment device 50 onto the substrate stage 2 by the transfer device 51. 40 can be positioned at the approximate center of the camera field of the alignment camera 30.

  As described above, in this embodiment, when the next substrate W is transported from the pre-alignment device 50 to the substrate stage 2 by the transport device 51, the alignment mark 40 of the substrate W is approximately centered in the camera field of the alignment camera 30. Therefore, the alignment mark 40 on the substrate W side and the alignment mark 41 on the mask M side can be aligned at a substantially central position in the camera field of the alignment camera 30, and thereby the substrate W and the mask M can be aligned. The alignment accuracy can be improved.

Further, when the next substrate W is transported onto the substrate stage 2, the alignment mark 40 of the substrate W can be positioned substantially at the center of the camera field of the alignment camera 30. An alignment possible range can be obtained.
Further, the substrate stage 2 is moved stepwise with respect to the mask M in the two directions of the X-axis direction and the Y-axis direction and irradiated with light for pattern exposure at each step, whereby a plurality of patterns of the mask M are formed on the substrate Since exposure transfer is performed on W, exposure to a large substrate W can be performed with a smaller mask M to reduce cost and increase pattern accuracy. A variety of patterns can be created.

In addition, this invention is not limited to the said embodiment, In the range which does not deviate from the summary of this invention, it can change suitably.
For example, in the above-described embodiment, the shift amount (correction value) is acquired when the first substrate is exposed, and the correction value is used during pre-alignment for the second and subsequent substrates. The correction value may be acquired every time.
In the above embodiment, a combination of a linear guide and a ball screw is used as the feeding means of each stage feeding mechanism. However, the present invention is not necessarily limited to this. For example, a linear motor or the like is used as the feeding means. May be used.

  Further, when the first substrate W is held on the substrate stage 2, the alignment mark 40 on the substrate 2 is imaged by the alignment camera 30, so that the alignment mark 40 can be viewed from approximately the center of the camera field of view. When the substrate W is held on the substrate stage 2 in addition to correcting the position of the next (second) substrate W by controlling the driving device on the pre-alignment device 50 side based on the deviation amount of The cross-shaped alignment mark 40 on the substrate 2 is imaged by the alignment camera 30, and the Y-axis stage feed mechanism 5 and the X-axis stage feed mechanism 6 are based on the amount of deviation of the alignment mark 40 from the approximate center of the camera field at this time. The alignment mark 40 of the substrate W may be positioned at the center of the camera field of the alignment camera 30 by controlling the feed amount.

In this way, the alignment mark 40 can be positioned at the approximate center of the camera field of the alignment camera 30 from the first substrate W, and the alignment mark 40 and the alignment camera 30 can be positioned on the second and subsequent substrates W. The positioning accuracy with respect to the center of the camera field of view can be improved.
Further, in the above embodiment, the substrate stage 2 is configured to be stepped in the X-axis and Y-axis directions. Instead, the mask stage 1 can be stepped in the X-axis and Y-axis directions together with the irradiation unit. It is good also as a simple structure.

  Furthermore, in the above-described embodiment, the case where the substrate stage 2 is stepped in the biaxial direction with respect to the mask M and the pattern exposure light is irradiated for each step is taken as an example, but the present invention is not limited to this. When the present invention is applied to the case where the substrate stage 2 is moved stepwise in the uniaxial direction with respect to the mask M and light for pattern exposure is irradiated for each step, or in the case of a batch exposure method that does not involve a step operation, It is particularly useful.

It is explanatory drawing which fractured | ruptured one part for demonstrating the proximity exposure apparatus which is an example of embodiment of this invention. It is a plane arrangement view of a proximity exposure apparatus and a pre-alignment apparatus. It is the figure seen from the arrow A direction of FIG. It is a figure which shows the alignment mark by the side of the board | substrate in a camera visual field, and the alignment mark by the side of a mask. It is a figure which shows the alignment mark by the side of the board | substrate in the conventional camera visual field, and the alignment mark by the side of a mask.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Mask stage 2 Substrate stage 3 Irradiation means W Substrate M Mask 25 Mask holding frame 30 Alignment camera (imaging means)
40 substrate side alignment mark 41 mask side alignment mark 50 pre-alignment apparatus

Claims (1)

A substrate stage that holds a substrate as an exposed material conveyed from the pre-alignment apparatus, a mask stage that holds a mask having a pattern to be exposed through a mask holding frame, and is printed on the substrate by the first exposure. An image pickup means for picking up the alignment mark and the mask-side alignment mark, and the position of the mask is adjusted via the mask holding frame so that the substrate-side alignment mark and the mask-side alignment mark are aligned. A proximity exposure apparatus comprising: a mask position adjusting means for irradiating and an irradiating means for irradiating light for exposure toward the mask in order to expose and transfer the pattern of the mask onto the substrate;
In the pre-alignment apparatus, in order to know the position and orientation of the substrate in the horizontal plane, the sensor detects the position of two locations on one side of the substrate and one location on the other side orthogonal thereto, and the detection results by these sensors And an actuator for performing pre-alignment of the substrate, and acquiring a shift amount of the alignment mark on the substrate side conveyed from the pre-alignment apparatus and held on the substrate stage from the center of the field of view of the imaging unit. Based on the amount, the position of the next substrate is corrected on the pre-alignment apparatus side so that the alignment mark of the substrate is positioned at the center of the field of view of the imaging unit on the substrate stage, and the acquisition of the shift amount and the periodically or to perform every time the correction of the position of the substrate in the pre-alignment apparatus side in each substrate as the exposure step Proximity exposure apparatus according to claim.

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