JP4634175B2 - Logic plate for high pressure fluid - Google Patents

Description

According to the present invention, a plurality of logic plates each having a logic plate for high-pressure fluid, particularly a groove plate member having a groove and a cover plate member covering the groove to form a closing fluid passage, are formed. The present invention relates to a logic plate unit forming a so-called three-dimensional circuit formed in two planes instead of a plane .

In an apparatus for controlling the flow of fluid, a complicated control circuit is generally configured by combining valves and pipes that operate in response to signals such as electricity and fluid pressure. In that case, careful work has been required in order to surely join pipes and attach valves and prevent fluid leakage at the joints. Conventionally, in order to facilitate these operations and to reduce the size of the pipeline and facilitate maintenance, the fluid control device is integrated by attaching valves to the circuit member incorporating the fluid passage. Tended to be. However, even if a circuit member containing a complicated fluid passage is carefully cast with advanced casting technology, a cast hole, a crack, a bubble, etc. are formed, the passages communicate with each other, and sand removal in the passage is completely performed. This makes it difficult to cause trouble in valves and fluid equipment.

As means for solving these problems, a groove serving as a fluid passage is provided in the plate member, a fluid passage is formed by screwing the lid plate member to the plate member to cover the groove, and the fluid is formed in the plate member and the lid plate member. There has been disclosed a configuration in which holes communicating with the passages at required locations are provided, and various valves and pipe joints for fluid outflow are provided (see, for example, Patent Document 1). Further, the three-dimensional stacked one which formed fluid passageway by covering the groove by bonding a cover plate member with an adhesive complex groove plate member having a groove shape and groove plate member Techniques such as forming a fluid circuit are also disclosed (for example, see Patent Document 2).

Further, while the junction between the groove plate member and the cover plate member having a groove and made firm, to ensure sealing of the fluid passage formed by grooves of the grooved plate member and the cover plate member Therefore, the above discloses a method of bonding the cover plate member along the groove, the method of using a friction stir welding method effectively is disclosed as a bonding method (e.g., Patent Document 3).
Furthermore, it has been proposed that the logic plate is made of a non-metallic material to prevent the corrosion of the flow path and the electric corrosion due to the corrosive fluid. In this case, in order to compensate for the lack of strength of the non-metallic material, screwing technology on the back of the groove plate member of non-metallic material made of a support plate to hold the material or stiffness provided the cover plate member, or a groove is also disclosed (e.g., Patent Document 4).

Japanese Patent Publication No.49-13651 JP 2002-305010 A Japanese Patent No. 3564430 JP 2004-316663 A

  Such logic plates include, for example, air brake devices for railway vehicles, devices having many pipes, solenoid valve units, cooling or hot plates, pneumatic / hydraulic / steam piping, thin pressure vessels, automotive / stationary fuels Used or about to be used in a wide range of devices such as batteries.

However, if is to be used for control of the high pressure fluid can reach a pressure 20 to 30 MPa, one disclosed in Patent Document 1, While it is possible to configure to withstand such high pressure, the groove plate since the parts material and the cover plate member screwing, it is not easy to be configured to completely prevent the leakage of high pressure fluid over the entire length of the fluid passage to be complex, long flow paths. Further, the one disclosed in Patent Document 2, a groove plate member and the cover plate member is joined with an adhesive can not withstand the high pressure and high temperature.

As described in Patent Document 3, when the friction stir welding along the cover plate member into the groove of the grooved plate member, preventing leakage of fluid through the fluid passage against considerable pressure and hot fluid it is possible to, the thickness of the cover plate member that can friction stir welding is limited to the front and rear 4 mm, when the groove width is large becomes large force due to fluid pressure applied to the cover plate member lid strength of the joint and the cover plate member itself of the plate member is to be insufficient. Although it is possible to reduce the force due to the fluid pressure by reducing the groove width, it is necessary to increase the depth of the groove in order to ensure the necessary passage area in such a case the fluid passage, Then groove plate member As a result, the logic plate becomes thicker and the weight increases. Those disclosed in Patent Document 4, the groove plate member and the cover plate member to improve the corrosion resistance which was composed of a non-metallic material, but the present invention is configured to be capable of withstanding high pressure, such as the .

Accordingly, an object of the present invention is to provide a logic plate capable of completely preventing fluid leakage while sufficiently securing the cross-sectional area of the fluid passage when used for controlling a high-pressure fluid whose pressure reaches 20 to 30 MPa. In particular , a plurality of logic plates each having a groove plate member having a groove and a cover plate member covering the groove to form a closing fluid passage are superposed to form the closing fluid passage in two planes instead of one plane. The object is to provide a logic plate unit for high-pressure fluid that forms a so-called three-dimensional circuit .

To achieve the above object, according to the present invention, a plurality of logic plates each including a groove plate member having a groove and a cover plate member covering the groove to form a closing fluid passage are superposed so that the closing fluid passage is 1 In a logic plate unit that forms a so-called three-dimensional circuit formed in two planes instead of a plane, the first logic is configured by friction stir welding the first lid plate member along the groove of the first groove plate member. A plate and a second logic plate configured by friction stir welding the second lid plate member along the groove of the second groove plate member, and the first and second lid plate members The two logic plates are connected to each other by connecting means including bolts and nuts in a state where they are overlapped to form a mating surface.
The joining of the lid plate member along the groove of the groove plate member is preferably performed by friction stir welding.
Friction stir welding is used for joining aluminum-based materials. With this configuration, a relatively thin lid plate member can be easily and inexpensively joined by friction stir welding to cover the groove of the groove plate member and cover it. The leakage of the fluid passing through the fluid passage formed by the plate member can be completely prevented, and the insufficient strength of the lid member of the aluminum material that is relatively thin and cannot sufficiently secure the strength can be compensated by the reinforcing member. Therefore, the groove width of the groove plate member can be made sufficiently large and the groove depth can be suppressed moderately, and the increase in the thickness of the groove plate member accompanying the increase of the groove depth to ensure the flow path cross-sectional area Can be suppressed. In general, a shallow groove is easier to process than a deep groove, and the processing cost can be reduced.

  The reinforcing member may cover the entire surface of the lid plate member. As a result, the logic plate can be formed into a simple synthetic plate, has a simple appearance, and is convenient for transportation, storage, and handling.

The present invention also includes two logic plates, each of which is formed by friction stir welding a lid plate member along the groove so as to form a closed fluid passage over the groove plate member having the groove. A two-layer logic plate unit is proposed in which the surfaces of the plate members are aligned with each other and connected by connecting means.
With this configuration, since the two cover plate members overlap each other, the strength of the cover plate member portion in the flow path is doubled, and the logic plate unit configured to withstand the high pressure of the fluid without requiring the reinforcing member. Obtainable. In this case, the flow path has a so-called three-dimensional configuration.

As described above, a closed fluid passage is formed by covering the groove plate member of the two-layer logic plate unit formed by combining the lid plate members of the two logic plates with the groove plate member further having the groove. The cover plate member of the logic plate formed by friction stir welding of the cover plate member along the groove is combined and connected by connecting means to form three or four logic plates. The logic plate unit can be configured to withstand the high pressure of the fluid without providing a reinforcing member. Further, the lid plate member of the logic plate formed by friction stir welding the lid plate member along the groove so as to form a closed fluid passage over the groove plate member having the groove, By stacking according to the above, it is possible to configure a stacked logic plate unit without providing a reinforcing member.

  Control of high-pressure fluid reaching a pressure of 20 to 30 MPa while ensuring a sufficient width of the fluid passage by providing a lid plate member that reliably seals the groove plate member and the internal passage and a reinforcing member that supports the lid plate member A logic plate that can be used for the purpose can be provided. Further, when logic plates are stacked, a logic plate unit that can withstand the high pressure of fluid can be configured without providing a reinforcing member.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, exemplary embodiments of the invention will be described with reference to the drawings. However, the dimensions, materials, shapes, relative arrangements, and the like of the components described in this embodiment are not intended to limit the scope of the present invention unless otherwise specified, but are merely illustrative examples. Not too much.

FIG. 1 shows a partial cross-section in a state in which devices 51 and 53 are attached to a high-pressure fluid logic plate 10 used in the present invention. In the figure, 1 is a groove plate member, 2 is a lid plate member, and 3 is a reinforcing plate member. The groove plate member 1 is provided with grooves 1a and 1b serving as fluid passages. These grooves are covered with a cover plate member 2, and the cover plate member 2 is joined to the groove plate member 1 as shown by reference numeral 4 by joining, particularly friction stir welding. 1c is a communication hole provided in the groove plate member 1 communicating with the groove 1a, and 2a and 3a are communication holes provided in the lid plate member 2 and the reinforcing plate member 3 respectively communicating with the groove 1b. The reinforcing plate member 3 is fastened to the groove plate member by bolts 5 and 5 on the lid plate member 2. The device 51 is attached to the groove plate member 1 and the device 53 is attached to the reinforcing plate member by being sealed with O-rings 12 and 14 with respect to the communication hole 1c and the communication holes 2a and 3a, respectively. Of course, these may be packed instead of the O-ring. When the device 53 is attached to the reinforcing plate member 3, the lid plate member 2 and the reinforcing plate member 3 are arranged so that no fluid leaks at the joint between the lid plate member 2 and the reinforcing plate member 3 in the communication holes 2 a and 3 a. It is desirable to apply an adhesive or a packing agent or lay a packing between them.

  In FIG. 1, the reinforcing plate member 3 is fastened to the groove plate member 1 with a push bolt on the upper surface of the lid plate member, but may be coupled with a through bolt and a nut. An upward force acts on the portion facing the groove 1a by the pressure of the high-pressure fluid passing through the groove 1a, and the portion tries to deform upward, but is pressed by the reinforcing plate member 3. Therefore, the force tries to deform the reinforcing plate member 3 together with the cover plate member 2. The same applies to the groove 1b, and the magnitude of the force acting on the cover plate member 2 from the groove is the product of the sum of the products of the groove width and the groove length and the fluid pressure. A part of this force is carried by the cover plate member that is friction stir welded along the groove, and the rest acts on the reinforcing plate member. The reinforcing member is coupled to the groove plate member with the lid plate member sandwiched so as to be able to counter this force with a bolt.

  In the figure, reference numerals 51 and 53 are devices or valves attached with bolts (not shown), or pressure fluid inlet / outlet connectors. 52 and 54 are O-rings for sealing between the communication furnaces 1c and 3a and the devices 51 and 53, respectively, but these may be packing. In a complicated circuit configuration, a large number of the devices, valves, and entrance / exit connectors are provided. In addition, the joining surface of the cover plate member 2 and the reinforcing plate member 3 is joined, particularly friction stir welding, and the fluid passing through the grooves 1a and 1b is completely sealed. Thus, the sealing function of the flow path is achieved at the joint portion of the lid plate member, and the lid plate member is reinforced by the reinforcing member, so that the lid is not required to increase the groove depth of the groove plate member forming the flow path. Since the strength on the plate member side can be ensured, the thickness of the logic plate unit can be reduced and the weight can be reduced compared to the case where the groove depth is increased to reduce the load on the cover plate member. can do.

FIG. 2 shows a logic plate 20 constructed by friction stir welding along the grooves 21a and 21b of the groove plate member 21 and a logic plate constructed by friction stirring and joining along the grooves 31a and 31b of the groove plate member 31. 30 shows a partial cross-section of a logic plate unit 100 according to an embodiment of the present invention in which 30 are connected to each other with cover plate members 21 and 31 and are connected by through bolts and nuts 25a and 25b. Such a configuration forms a so-called three-dimensional circuit in which the fluid circuit is formed in two planes instead of one plane. This configuration is effective when the flow paths are intricately crossed and cannot be configured in one plane. In this configuration, the cover plate member 22 of the logic plate 20 is reinforced by the logic plate 30 laminated thereon, so that each logic plate 20, 30 can be flowed without any reinforcement member as shown in FIG. It can withstand the high pressure of fluid passing through the channels (grooves 21a, 31a, 21b, 31b). In the figure, the grooves 21a and 31a of the cover plate members 22 and 32 are connected by the communication holes 22a and 32a, and the fluid is divided into the grooves 21a and 31a when the channel cross-sectional area is insufficient only by the grooves 21a or 31a. A large flow path cross-sectional area can be secured by flowing. Particularly in such a case, the pressure of the fluid flowing through the grooves 21a and 31a is balanced with each other, so that this portion of the cover plate members 22 and 32 is not deformed by the high-pressure fluid. The grooves 21b and 31b are configured as separate flow paths without being communicated with each other. When the grooves 21b and 31b overlap with each other across the lid plate member, the force applied to that portion of the lid plate members 22 and 32 by the fluid pressure is reduced, and when they do not overlap, the lid plate member of the logical plate facing each other and It is supported by the groove plate member and can withstand high pressure. In FIG. 2 as well, the groove plate member 21 and / or the groove plate member 31 of the logic plate unit 100 are provided with devices (not shown) or valves, or flow path inlet and outlet connectors.

FIG. 3 shows a partial cross section of a logic plate unit 200 in which three logic plates according to an embodiment of the present invention are stacked. In this case, the uppermost logic plate 40 composed of the groove plate member 41 and the cover plate member 42 is connected to the groove plate member 31 of the lower logic plate 30 by the cover plate member 42 by through bolts and nuts 35a and 35b. ing. Although not shown, a four-layer stacked logic plate unit can be configured by connecting and connecting the lid plate members of other logic plates to the lower side of the logic plate 20. In this way, a multilayer logic plate can be formed by stacking one after another. When a stacked logic plate unit having two or more layers is configured as described above, it is possible to configure a logic plate that can withstand the high pressure of fluid without providing a reinforcing member as shown in FIG.

  A logic plate that can be used for controlling a high-pressure fluid reaching a pressure of 20 to 30 MPa can be configured, and a high-pressure fluid control device can be configured in a small size, at low cost, and easily assembled. In addition, since the high-pressure fluid is sealed at the joint, a reliable sealing function is exhibited even at high temperatures.

It is a fragmentary sectional view which shows the state by which the structure of the logic plate for high pressure fluids used for this invention and equipment was mounted | worn with this logic plate. It is a partial sectional view showing a configuration of a logic plate unit of the two-layer laminate according to actual施例of the present invention. It is a fragmentary sectional view which shows the structure of the logic plate unit of the 3 layer lamination concerning the other Example of this invention.

1, 21, 31, 41 Groove plate member Groove plate member 1a, 1b Groove 1c Communication hole 2 Lid plate member 2a Communication hole 3 Reinforcement plate member 3a Communication hole 4 Friction stir joint 5 Bolt 10 Logic plate 20, 30, 40 Logic Plate 22, 32, 42 Lid plate member 21a, 21b, 31a, 31b Groove 22a, 32a Communication hole 25a, 35a Through bolt 25b, 35b Nut 51, 53 Equipment 52, 54 O-ring 100, 200 Logic plate unit

Claims (3)

A plurality of logic plates each having a groove plate member having a groove and a lid plate member covering the groove to form a closing fluid passage are superposed so that the closing fluid passage is formed in two planes instead of one plane. In the logic plate unit that forms a dimensional circuit,
A first logic plate configured by friction stir welding of the first lid plate member along the groove of the first groove plate member, and a second lid plate member along the groove of the second groove plate member And a second logic plate configured by friction stir welding,
A logic plate unit for high-pressure fluid, wherein the first and second cover plate members are overlapped with each other so as to form a mating surface, and both logic plates are connected to each other by connecting means including bolts and nuts. . At least on the surface of the first or second groove plate member, a cover plate member is friction stir welded along the groove so as to cover the groove and form a closed fluid passage on the groove plate member having the groove. the plurality of logic plate, at least a first in first cover plate member and the second state the cover plate member is overlaid so as to be a mating surface of the second logic plates logic plates, they said coupling means 2. The logic plate unit for three-layer or four-layer high-pressure fluid according to claim 1 , wherein the logic plate unit is configured to be connected with each other. At least on the surface of the first or second groove plate member, a cover plate member is friction stir welded along the groove so as to cover the groove and form a closed fluid passage on the groove plate member having the groove. In a state where five or more logic plates of the logic plate are overlapped so that at least the first lid plate member of the first logic plate and the second lid plate member of the second logic plate become a mating surface. The multi-layer logic plate unit for high-pressure fluid according to claim 1 , characterized in that they are stacked and connected by said connecting means.

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