JP4635849B2 - Substrate bonding method - Google Patents

Description

  In the present invention, the first connector mounted on the first board is assembled to the second connector mounted on the second board, and the first board is fixed to the second board. The present invention relates to a method of joining the first substrate to the second substrate by placing the first substrate on the spacer.

  For example, in an in-vehicle electronic device such as an in-vehicle navigation device, as a method of joining two substrates, a first connector mounted on a first substrate is assembled to a second connector mounted on a second substrate. And a method in which the first substrate is placed on a spacer fixed to the second substrate and the first substrate is bonded to the second substrate. By the way, when the first connector is assembled to the second connector, the initial stress remains in the connector due to the influence of the displacement of the mounting position, the accuracy of the assembly jig, the pushing method, and the like.

  Therefore, in recent years, for example, when the first connector is attached to the second connector by applying a pressing force from above to the first substrate, the pressing force from above is applied to the first substrate. After the first connector is assembled to the second connector, the pressing force from above on the first board is released to be free, and at least one of the first connector and the second connector is A method of relaxing the initial stress remaining in the connector by utilizing a self-alignment effect due to the spring force of the connector itself is employed.

  However, in this method, if the weight of the first substrate is large and the frictional force between the surface of the first substrate (the surface in contact with the spacer) and the upper surface of the spacer (the surface in contact with the first substrate) is large, the connector itself It becomes impossible to use the self-alignment effect due to the spring force of this, and it becomes impossible to sufficiently relieve the initial stress remaining in the connector. As a result, a certain amount of initial stress remains, which causes the solder creep phenomenon due to the remaining initial stress, resulting in a decrease in reliability as a product. In particular, in-vehicle electronic devices mounted on a vehicle are used in an environment where vibration is constantly present, such as when the vehicle is running, and the influence is great.

On the other hand, as a method for preventing the displacement of the substrate applied to the in-vehicle electronic device, for example, there are methods shown in Patent Documents 1 and 2 below.
JP 1999-274766 Japanese Patent Laying-Open No. 2005-217075

  However, those described in Patent Documents 1 and 2 described above are intended to prevent the displacement of the substrate after the substrates are joined, and can sufficiently relieve the initial stress remaining in the connector. Not something.

  The present invention has been made in view of the above-described circumstances, and an object of the present invention is to appropriately relieve the initial stress remaining in the connector and to secure a high reliability. Is to provide.

  According to the method for bonding substrates described in claim 1, the first connector is disposed to face the second connector, and a vertical pressing force is applied to the first substrate to connect the first connector to the first connector. The first board is placed on the spacer, and the second board and the spacer are integrated together at least in a state where the vertical pressing force to the first board is released. The first substrate is fixed to the spacer by vibrating in the vertical direction.

  As a result, even when the frictional force between the surface of the first substrate (the surface in contact with the spacer) and the upper surface of the spacer (the surface in contact with the first substrate) is large, the vertical pressing on the first substrate is performed. When the pressure is released, the second substrate and the spacer are vibrated integrally at least in the vertical direction, whereby the first substrate can be temporarily floated (separated) from the spacer, and the frictional force is eliminated. can do. Therefore, the self-alignment effect due to the spring force of the connector itself of at least one of the first connector and the second connector can be used, and the initial stress remaining in the connector can be moderated appropriately. .

  According to the method for bonding substrates described in claim 2, after the anti-rotation member having a static friction force with the first substrate is disposed on the second substrate, the vertical pressing force is applied to the first substrate. And the first connector is fitted to the second connector and assembled, and the first substrate is placed on the spacer fixed to the second substrate. Accordingly, even when the first substrate is fixed to the spacer by, for example, screwing, the first substrate is screwed by arranging the rotation preventing member having a static frictional force with the first substrate. Rotation due to tightening torque can be avoided in advance, and stress due to torsion can be avoided in advance.

  According to the method for bonding substrates according to claim 3, the second substrate and the spacer are vibrated integrally in the vertical direction while releasing the vertical pressing force to the first substrate, and at the same time in the horizontal direction. Also vibrate. As a result, by causing the second substrate and the spacer to vibrate in the vertical direction as well as in the horizontal direction, initial stress that cannot be mitigated by vibration in the vertical direction is applied to the horizontal direction. It can be relaxed by vibration. In this case, the work period can be shortened by vibrating in the vertical direction and the horizontal direction simultaneously as compared with the case of vibrating in the vertical direction and the horizontal direction in separate steps.

  According to the substrate bonding method of the fourth aspect, the second substrate and the spacer are vibrated in the vertical direction in a state where the vertical pressing force to the first substrate is released, and then the first substrate The two substrates and the spacer are also vibrated integrally in the horizontal direction. As a result, the second substrate and the spacer are also vibrated integrally in the horizontal direction, and thus cannot be relaxed by vibration in the vertical direction in the same manner as described in the third aspect. The initial stress can be relaxed by vibration in the horizontal direction.

  Hereinafter, as an embodiment of the present invention, a method of applying an upward (vertical) pressing force to an upper substrate and bonding the upper substrate and the lower substrate will be described with reference to the drawings. FIG. 2 shows one component of the in-vehicle navigation apparatus, and shows a state where the upper substrate 1 (first substrate in the present invention) is bonded to the lower substrate 2 (second substrate in the present invention). Show. The upper substrate 1 has a plug connector 3 (first connector in the present invention) mounted on the front surface (lower surface in FIG. 1) 1a side, and some (this embodiment) on the rear surface (upper surface in FIG. 1) 1b side. In the embodiment, three electronic components 4a to 4c are mounted and configured.

  In the plug connector 3, an inner housing 6 is disposed inside the outer housing 5, a connection terminal (not shown) is disposed in the inner housing 6, and the connection terminal is formed on the upper substrate 1 via the connector lead 7. It is configured to be electrically connected to the conductor pattern. In this case, the plug connector 3 has a spring force of the connector itself by forming a slight gap between the outer housing 5 and the inner housing 6.

  The lower substrate 2 is configured by mounting a socket connector 8 (second connector in the present invention) on the surface (upper surface in FIG. 1) 2a side. The socket connector 8 is configured such that a connection terminal (not shown) is disposed in a housing 9 and the connection terminal is electrically connected to a conductor pattern of the lower substrate 2 via a connector lead 10.

  In a state where the plug connector 3 of the upper substrate 1 is fitted to the socket connector 8 of the lower substrate 2, the connection terminal of the plug connector 3 and the connection terminal of the socket connector 8 are electrically connected to each other. The substrate 1 and the lower substrate 2 are electrically connected. Further, between the upper substrate 1 and the lower substrate 2, as shown in FIGS. 3 and 4, a plurality (four in this embodiment) of spacers 11 and rotation prevention guards 12 (referred to in the present invention). An anti-rotation member) is interposed.

  The spacer 11 functions as a support member for keeping the upper substrate 1 and the lower substrate 2 at a predetermined interval. The anti-rotation guard 12 is made of a material that has a high static frictional force and is not easily deformed between the surface 1a of the upper substrate 1 such as rubber or a highly viscous resin (elastomer), and is similar to the spacer 11 described above. The upper substrate 1 and the lower substrate 2 function as a support member for keeping a predetermined distance, and when the upper substrate 1 is screwed to the spacer 11, the upper substrate 1 is rotated by the screwing torque. It also functions as a rotation prevention member for preventing the above. In FIG. 4, the electronic components 4a to 4c are omitted.

  Next, a method of assembling the plug connector 3 to the socket connector 8 and joining the upper substrate 1 to the lower substrate 2 will be described with reference to FIG. In addition, the plug connector 3 and the electronic components 4a to 4c are preliminarily mounted on the upper substrate 1, and the socket connector 8 is preliminarily mounted on the lower substrate 2, and the spacer 11 is fixed by, for example, screw tightening. Shall. The vibration table 22 includes a mounting table 22a on which the jig 21 is mounted, and a main body 22b in which a motor that generates vibration force in the vertical direction and a motor that generates vibration force in the horizontal direction are incorporated. Thus, the mounting table 22a is configured to vibrate in the vertical direction and the horizontal direction when the motors are driven.

  First, as shown in FIG. 1A, the side surface of the spacer 11 is gripped by the gripping portion 21a of the jig 21, and the lower substrate 2 and the spacer 11 are integrally supported by the jig 21. The substrate 2 is placed on the vibration table 22 together with the jig 21. Then, the anti-rotation guard 12 is disposed around the socket connector 8 on the lower substrate 2. The anti-rotation guard 12 has a frictional force of, for example, 1.5 times or more with the surface 1a of the upper substrate 1 with respect to the rotational torque in the process of screwing the upper substrate 1 to the spacer 11 described later. Is desirable.

  Next, the upper substrate 1 is disposed above the lower substrate 2 so that the plug connector 3 faces the socket connector 8, and a pressing force from above is applied to the upper substrate 1 as shown in FIG. Then, the inner housing 6 of the plug connector 3 is fitted and assembled to the housing 9 of the socket connector 8 from above, and the upper substrate 1 is placed on the spacer 11. The pressing force in this case may be determined based on the weight of the upper substrate 1 and the sizes of the plug connector 3 and the socket connector 8.

  Next, the pressing force from above on the upper substrate 1 is released. Here, in this embodiment, as shown in FIG. 1C, the mounting table 22a is vertically moved by driving the motor of the vibration table 22 in a state where the pressing force from above on the upper substrate 1 is released. The lower substrate 2 and the spacer 11 are vibrated integrally in the vertical direction and simultaneously in the horizontal direction. At this time, by causing the lower substrate 2 and the spacer 11 to vibrate in the vertical direction as well as in the horizontal direction, the upper substrate 1 can be temporarily floated (separated) from the spacer 11, The frictional force between the surface 1a of the upper substrate 1 and the upper surface 11a of the spacer 11 can be eliminated. The vibration in this case may be determined based on the weight of the upper substrate 1 and the sizes of the plug connector 3 and the socket connector 8, but in general, for example, 50 to 200 [Hz], 0.2 to It may be 5 to 30 [seconds] at 0.5 [G].

  Then, as shown in FIG. 1 (d), after finishing the vibration in the vertical direction and the horizontal direction, the upper substrate 1 is screwed to the spacer 11 while again applying the pressing force from above to the upper substrate 1. The upper substrate 1 is bonded to the lower substrate 2.

  As described above, according to the present embodiment, a pressing force from above is applied to the upper substrate 1 and the plug connector 3 is fitted and assembled to the socket connector 8 and the upper substrate 1 is mounted on the spacer 11. After that, since the lower substrate 2 and the spacer 11 are integrally vibrated in the vertical direction and the horizontal direction in a state in which the pressing force from above on the upper substrate 1 is released, the surface 1a of the upper substrate 1 Even when the frictional force between the spacer 11 and the upper surface 11 a is large, the frictional force can be eliminated by temporarily floating (separating) the upper substrate 1 from the spacer 11. Therefore, the self-alignment effect due to the spring force of the connector itself included in the plug connector 3 can be used, and the initial stress remaining in the plug connector 3 and the socket connector 8 can be moderated appropriately.

  Further, since the anti-rotation guard 12 having a static frictional force with the surface 1a of the upper substrate 1 is arranged on the lower substrate 2, when the upper substrate 1 is fixed to the spacer 11 by, for example, screwing, It is possible to avoid the upper substrate 1 from rotating due to the screw tightening torque, and it is possible to prevent the stress due to torsion from remaining.

The present invention is not limited to the above-described embodiment, and can be modified or expanded as follows.
The vertical relationship between the plug connector and the socket connector may be reversed, that is, the pressing force from above is applied to the upper board on which the socket connector is mounted, and the plug connector mounted on the lower board is socketed. The connector may be fitted and assembled.
The socket connector may have the spring force of the connector itself, or both the plug connector and the socket connector may have the spring force of the connector itself.
By adopting a spacer that also functions as an anti-rotation guard (having a static frictional force with the upper substrate), the anti-rotation guard may be omitted.
It is not always necessary to vibrate the lower substrate and the spacer integrally in the horizontal direction, and the lower substrate and the spacer may be vibrated integrally only in the vertical direction.

The one which shows one embodiment of the present invention, and shows the procedure until the upper substrate is joined to the lower substrate. The figure which shows the state by which the upper side board | substrate is joined to the lower side board | substrate The perspective view which shows the state by which the rotation prevention guard is arrange | positioned at the lower board | substrate. A perspective view showing an upper substrate, an anti-rotation guard, and a lower substrate

Explanation of symbols

  In the drawings, 1 is an upper substrate (first substrate), 2 is a lower substrate (second substrate), 3 is a plug connector (first connector), 8 is a socket connector (second connector), 11 is Spacers 12 are anti-rotation guards (anti-rotation members).

Claims (4)

The first connector mounted on the first substrate is assembled to the second connector mounted on the second substrate, and the first substrate is mounted on a spacer fixed to the second substrate. A method of placing and bonding the first substrate to the second substrate,
The first connector is disposed opposite to the second connector, a vertical pressing force is applied to the first substrate, and the first connector is fitted to the second connector to form a set. At the same time, the first substrate is placed on the spacer, and the second substrate and the spacer are integrally vibrated at least in the vertical direction in a state where the vertical pressing force on the first substrate is released. And bonding the first substrate to the second substrate by fixing the first substrate to the spacer. In the bonding method of the board | substrate of Claim 1,
After disposing an anti-rotation member having a static frictional force with the first substrate on the second substrate, a vertical pressing force is applied to the first substrate to attach the first connector to the first substrate. A method for joining substrates, comprising: fitting and assembling a second connector; and placing the first substrate on a spacer fixed to the second substrate. In the joining method of the board | substrate of Claim 1 or 2,
The substrate is characterized in that the second substrate and the spacer are vibrated integrally in the vertical direction and simultaneously in the horizontal direction in a state in which the vertical pressing force to the first substrate is released. Joining method. In the joining method of the board | substrate of Claim 1 or 2,
The second substrate and the spacer are vibrated in the vertical direction in a state where the vertical pressing force to the first substrate is released, and then the second substrate and the spacer are integrated. A method for bonding substrates, wherein the substrate is also vibrated horizontally.

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