JP4640214B2 - Electronic component connection structure - Google Patents

Description

  The present invention relates to an electronic component connection structure in which electronic components are connected to bridge a pair of spaced plate-like lead frames.

Conventionally, as a connection structure of this type of electronic component, both the first lead frame and the second lead frame that are both plate-like and are arranged apart from each other in the same direction, Proposed that includes electronic components that are connected on one side of both lead frames via a conductive bonding member such as solder or conductive adhesive and arranged in a bridge between the two lead frames. (For example, see Patent Document 1, Patent Document 2, and Patent Document 3).
JP 2003-86756 A JP 2003-124416 A JP 2004-140226 A

  However, in such an electronic component connection structure, for example, one of the two lead frames is pressed against the electronic component when the lead frame is molded or when the mold resin is sealed. Then, the force which leaves | separates from an electronic component is added, and there exists a possibility that the electronic component and lead frame which are connected via the electroconductive joining member may peel.

  For example, in such a connection structure, an electronic component and a lead frame are connected by a conductive bonding member and then sealed with a mold resin. At this time, in order to prevent resin burrs, a resin stopper block is usually provided in a molding die for sealing mold resin.

  Here, the resin stop block is mounted on the molding die to prevent resin burrs during molding, and the lead frame near the tie bar located outside the package is stepped down to improve the airtightness with the die. This is a mechanism for raising and preventing flash burr and is generally used.

  When the lead frame is crushed by this resin stop block, the lever principle works especially on the inner lead located far from the tie bar, and a force that lifts in the upper surface direction is applied. Due to this influence, stress is applied to the connection part of the electronic component, and the electronic component is easily removed from the lead frame.

  The present invention has been made in view of the above problems, and in an electronic component connection structure in which an electronic component is connected to bridge a pair of spaced plate-like lead frames, The object is to improve the connection reliability with the lead frame.

  The present inventor believes that if the lead frame is provided with a portion that relieves stress transmitted to a portion where the electronic component is connected in the lead frame, that is, a connecting portion with the electronic component, the reliability of the connecting portion is improved. It was.

  Here, as a part that performs stress relaxation, if a configuration in which the part other than the connection part with the electronic component in the lead frame is thinned is adopted, the stress can be relieved dynamically, but the connection part in the lead frame Even if it is a site | part other than, the problem will arise in the site | part which contact | connects the electroconductive joining member located in the said connection part.

  That is, the conductive bonding member is disposed on the connecting portion of the lead frame by coating, but when the thin stress relaxation portion and the conductive bonding member are in contact with each other, the conductive bonding member becomes the stress relaxation portion. There is a possibility that the stress relieving function may be hindered because the conductive bonding member that has penetrated and the thinned portion has penetrated becomes thick.

  Therefore, the present inventor, as described above, if the stress relaxation portion formed as a thin portion is provided in a portion of the lead frame other than the connection portion with the electronic component and away from the conductive bonding member. It was thought that the functional inhibition of the stress relaxation part by the penetration | invasion of a conductive conductive member could be prevented.

The invention according to claim 1 is created based on such examination results, and is at least one of the pair of lead frames (11, 12, 18) to which the electronic component (40) is connected. A stress relieving part (70) that relieves stress transmitted to the conductive joining member (80) at a part other than the connection part (20) to the electronic component (40) and away from the conductive joining member (80). ) configured as, the stress relaxation section (70), the stress relaxation section (70) is thinner than the portion other than the stress absorbing portions (70) in the lead frame is provided (11,12,18) The lead frame (11, 12, 18) provided with the stress relaxation part (70) is made of a plate material having a plate thickness of T, and a part of the lead frame (11, 12, 18) is formed. , Press working Be formed as a recess which is deeper recessed than the thickness T, the stress relieving portion (70), and the one configured as a sidewall portion is thin and extended portion by the pressing in the recess by a It is characterized by.

According to this, the stress transmitted to the connection part (20) with the electronic component (40) in each lead frame (11, 12, 18) is relieved by the thinned stress relieving part (70). Since the function of the stress relaxation part (70) is appropriately exhibited without being hindered by the conductive bonding member (80), the connection reliability between the electronic component (40) and the lead frame (11, 12, 18) is improved. be able to. Further, if a recess is formed by pressing a part of the lead frame (11, 12, 18), the sidewall portion of the recess is extended by pressing to become thin. ) Can be configured.

  According to the study of the present inventor, as shown in FIG. 3 described later, when the lead frame (11, 12, 18) is made of a plate material having a plate thickness T, the lead frame (11, 12) If the plate thickness of the stress relaxation portion (70) provided in the thin film is reduced to 0.55 T or less, the stress relaxation effect can be exhibited significantly.

In the above configuration, the lead frame (11,12,18) the stress relieving portion (70) is provided, the width by the said lead frame (11,12,18) a slit (21) A narrowed narrow portion (22) is formed, and an electronic component (40) is connected to the narrowed portion (22) via the conductive bonding member (80) and the narrowed portion (22). A stress relaxation part (70) may be provided (invention of claim 3). According to this, even when a wide lead frame corresponding to an increase in current or the like is used, a narrow portion (22) in which a slit (21) is inserted to narrow the width is formed. By providing the stress relaxation portion (70) in (22), it is possible to form the stress relaxation portion (70) that easily relaxes stress, which is preferable.

Moreover, in invention of Claim 4, except a connection part (20) with an electronic component (40) among at least one of a pair of lead frames (11, 12, 18) to which the electronic component (40) is connected. And a portion remote from the conductive bonding member (80) is configured as a stress relaxation portion (70) for relaxing the stress transmitted to the conductive bonding member (80), and the stress relaxation portion (70) is formed. The lead frame (11, 12, 18) provided with the stress relaxation portion (70) is thinner than the portion other than the stress relaxation portion (70), and further, the stress relaxation portion (70) is provided. In the lead frame (11, 12, 18), the slit (21) is formed in the lead frame (11, 12, 18) to form a narrow portion (22) having a narrow width, and this narrow portion ( 22) In the electronic component (40), as well as connected through a conductive bonding member (80), characterized by providing stress relief portion (70) in the narrow portion (22).

Accordingly, as in the first aspect of the invention, the connection reliability between the electronic component (40) and the lead frame (11, 12, 18) can be improved. Similarly to the third aspect of the invention, even when a wide lead frame corresponding to an increase in current is used, a narrow portion (22) with a slit (21) is formed to form a narrow portion (22). In addition, it is preferable to provide the stress relaxation portion (70) in the narrow portion (22), whereby the stress relaxation portion (70) that easily relaxes the stress can be formed.

In the electronic component connecting structure according to claim 4, the lead frame (11, 12, 18) provided with the stress relaxation portion (70) is made of a plate material having a plate thickness of T, and the stress relaxation portion. Or a part of the lead frame (11, 12, 18) is deeper than the plate thickness T by pressing the portion of the lead frame (11, 12, 18). The concave portion is formed as a concave portion, and the stress relieving portion (70) can be configured as a side wall portion that is a portion extending thinly by the press working in the concave portion (invention of claim 6). In the above configuration, if a plurality of stress relaxation portions (70) are provided for one of the lead frames (11, 12, 18) in which the stress relaxation portions (70) are provided, the stress is reduced. The relaxation function can be exhibited more effectively.

  In addition, the code | symbol in the bracket | parenthesis of each means described in the claim and this column is an example which shows a corresponding relationship with the specific means as described in embodiment mentioned later.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, parts that are the same or equivalent to each other are given the same reference numerals in the drawings in order to simplify the description.

(First embodiment)
FIG. 1 is a diagram showing a schematic plan configuration of an electronic device according to the first embodiment of the present invention. Here, in FIG. 1, the outline of the mold resin 50 is indicated by a broken line, and each portion located inside the mold resin 50 is shown in a transparent manner, and the surface of the stress relaxation portion 70 is hatched for convenience. Has been given.

  This electronic device includes a plurality of lead frames 11 to 18. These lead frames 11 to 18 are in the form of an elongated plate having the thickness direction in the direction perpendicular to the paper surface in FIG. 1 and, like ordinary lead frames such as copper and 42 alloy, are press-worked and etched. It is formed by.

  As shown in FIG. 1, in each lead frame 11 to 18, various components 30 and 40 to be described later are mounted on the inner lead portion located in the mold resin 50, and the inner lead portion includes these inner lead portions. The components 30 and 40 are sealed together with a mold resin 50.

  Here, the mold resin 50 is an epoxy resin or the like normally used as a mold material in the electronic field. In addition, the outer lead portions protruding from the mold resin 50 in each of the lead frames 11 to 18 can be electrically connected to the outside.

  Further, the various components 30 and 40 are mounted in the mold resin 50 on the upper surfaces of the lead frames 11 to 18, that is, the surfaces facing upward in the drawing in FIG. 1.

  In this example, of the lead frames 11 to 18, the lead frame 15 has a large area island 19 on which the IC chip 30 can be mounted, and the IC chip 30 attaches solder or the like (not shown) to the upper surface of the island 19. Mounted and fixed through.

  In the mold resin 50, chip capacitors 40 as electronic components referred to in the present invention are arranged on the upper surfaces of the lead frames 11 to 18 in a state of being bridged between the adjacent lead frames 11 to 18. ing.

  In the mold resin 50, the IC chip 30 and the lead frames 11 to 18 on which the chip capacitor 40 is mounted are electrically connected by bonding wires 60 made of gold, aluminum, or the like.

  In such an electronic device, in this embodiment, as shown in FIG. 1, the pair of lead frames 11 and 12 on which the chip capacitor 40 is mounted and the pair of lead frames 11 and 18 on which the chip capacitor 40 is mounted. The stress relaxation part 70 is provided.

  The stress relaxation portion 70 will be described with reference to FIG. 2 is a diagram showing an enlarged configuration of a connection structure between a circled portion A in FIG. 1, that is, a pair of lead frames 11 and 12 and a chip capacitor 40 as an electronic component, and FIG. FIG. 4B is a partial enlarged view of the stress relaxation portion 70 in FIG. 4A, and FIG. 3C is a top view of FIG. In FIG. 2, the mold resin 50 is omitted, and the stress relaxation portion 70 is hatched for convenience in (c).

  In addition, about the connection structure of a pair of lead frames 11 and 18 which have the another stress relaxation part 70 in FIG. 1, and the chip capacitor 40, although formed in the part which gave the slit 21, about these, This can be substantially similar to that shown in FIG. The configuration relating to the slit 21 will be described in detail in a third embodiment described later.

  The connection structure shown in FIG. 2 will be described again. The pair of lead frames 11 and 12 are arranged so that one surface of each other, that is, the upper surface side in the figure is arranged away from each other in the same direction. The lead frame 11 and the second lead frame 12 are included.

  As shown in FIG. 2, the chip capacitor 40 mounted on the upper surfaces of the pair of lead frames 11 and 12 is electrically connected to the connection portion 20 in the lead frames 11 and 12 via the conductive bonding member 80. Connected mechanically and mechanically. The chip capacitor 40 is arranged in a state of being bridged between the two lead frames 11 and 12.

  In the present embodiment, the conductive bonding member 80 may be any member that can electrically and mechanically connect the chip capacitor 40 and the lead frames 11 and 12, such as an Ag paste. A general conductive bonding member such as a conductive adhesive or solder can be employed.

  Here, as shown in FIG. 2, the stress relaxation portion 70 is a portion of the lead frames 11 and 12 other than the connection portion 20 to the chip capacitor 40 and away from the conductive bonding member 80. Is provided.

  When the stress relaxation portion 70 is made by press working as will be described later, as shown in FIG. 2, the stress relaxation portion 70 becomes a concave portion having a taper from the upper surface of the lead frames 11 and 12. In this case, the stress relieving portion 70 also includes an opening portion that opens on the upper surfaces of the lead frames 11 and 12 in the concave portion. That is, in the present embodiment, the stress relaxation portion 70 and the conductive bonding member 80 are separated from each other when the distance W between the conductive bonding member 80 and the opening shown in FIG. That's what it means.

  In this example, as shown in FIG. 2, the stress relaxation portion 70 is provided at a position facing the electronic component, that is, the side surface of the chip capacitor 40. The stress relaxation part 70 is thinner than the parts other than the stress relaxation part 70 in the lead frames 11 and 12.

  Specifically, as shown in FIG. 2B, both the lead frames 11 and 12 provided with the stress relaxation portion 70 are made of a plate material having a plate thickness T. The relaxing portion 70 has a thickness H reduced to 0.55 times or less of the thickness T of the lead frames 11 and 12, that is, 0.55 T or less. The basis for this will be described with reference to FIG.

  The width L of the thinned portion of the stress relaxation portion 70 is not particularly limited, but is 0.1 times or more the plate thickness T of the lead frames 11 and 12, that is, 0.1 T or more. Such a thin stress relaxation portion 70 is formed by subjecting the lead frames 11 and 12 to press working, etching, or the like.

  Thus, as shown in FIG. 2, the connection structure of the present embodiment has the plate-like first lead frame 11 and the second lead frame 11 that are arranged apart from each other with their one surface sides facing the same direction. The lead frames 12, 18 are connected to one surface of both lead frames 11, 12, 18 via a conductive bonding member 80, and are arranged in a state of being bridged between the lead frames 11, 12, 18. The electronic component 40 is provided. In such a connection structure, the stress relaxation portions 70 are provided on the lead frames 11 and 12.

  According to this, even if a force that causes the chip capacitor 40 to peel off is applied to the connecting portion 20 of both the lead frames 11 and 12 due to the stress caused by the resin stopper block at the time of molding or the stress at the time of handling, etc. The stress relaxation part 70 warps and the stress acting on the connection part 20 is relaxed.

  Further, the stress relaxation part 70 is provided in a part of the lead frames 11 and 12 away from the conductive bonding member 70, and the conductive bonding member 80 enters the stress relaxation part 80 when the conductive bonding member 80 is applied. As a result, it does not adhere to the stress relieving portion 70, so that the function of the stress relieving portion 70 is appropriately exhibited.

  Further, in the present embodiment, the stress H is set to 0.55 times or less the plate thickness T of the lead frames 11 and 12 in which the stress relaxation part 70 is provided. Appropriate mitigation function.

  The inventor investigated the relationship between the thickness of the stress relaxation portion 70 and the stress applied to the connection portion 20 of the lead frames 11 and 12 by FEM (finite element method) analysis. FIG. 3 is a diagram showing the investigation results. Here, in FIG. 3, the plate thickness of the stress relaxation portion 70 is a relative thickness with respect to the plate thickness T of the lead frames 11 and 12, while the stress is the maximum principal stress and is an arbitrary unit.

  As shown in FIG. 3, the maximum principal stress decreases as the plate thickness of the stress relaxation portion 70 decreases. In particular, the inflection point is obtained when the plate thickness of the stress relaxation portion 70 is 0.55T. In addition, when the plate thickness is 0.55 T or less, the reduction of the maximum principal stress is significant as compared with the case where it is larger than 0.55 T.

  This tendency is common in the case where the lead frames 11 and 12 are made of a plate material having a plate thickness T and the stress relaxation portion 70 is made thinner than the plate thickness T. That is, it was found that if the plate thickness of the stress relaxation portion 70 is 0.55 T or less, the stress relaxation portion 70 can sufficiently exhibit its stress relaxation function.

  This is the basis for setting the thickness of the stress relaxation portion 70 to 0.55 T or less. Note that, if the plate thickness of the stress relaxation portion 70 is too thin, it is difficult to ensure the mechanical strength. Therefore, according to the study by the present inventor, the stress relaxation portion 70 is required to ensure a practical level of mechanical strength. The thickness of 70 is preferably 0.1T or more.

  As described above, according to the present embodiment, in the electronic component connection structure in which the electronic component 40 is connected so as to bridge the paired plate-like lead frames 11 and 12 that are spaced apart, The connection reliability between the component 40 and the lead frames 11 and 12 can be improved.

  The electronic device as shown in FIG. 1 is configured as a power custom package using a power IC chip as the IC chip 30 and mounting a chip capacitor 40 for absorbing external noise and protecting the IC chip 30. Yes.

  In such a case, since the lead frames 11 to 18 used correspond to a large current, the lead frame has a thickness 1.2 to 2 times that of a monolithic package such as SOP and QFP. As the plate thickness increases, the elastic modulus of the lead frame decreases, and the connection portion is likely to peel off due to the stress described above.

  Further, since molding of the mold resin 50 is performed at a high temperature (for example, 170 ° C. to 180 ° C.), the adhesion of the conductive bonding member 80 under the chip capacitor 40 is likely to deteriorate. Prone to occur. It is particularly effective to employ the stress relaxation portion 70 as in the present embodiment for such a power custom package in which peeling of the connection portion is likely to occur.

  Further, in the present embodiment, as shown in FIG. 1 described above, for the lead frames 11 and 18 provided with the stress relaxation portions 70, two stress relaxations are performed for one of the lead frames 11 and 18. A portion 70 is provided. Thus, if a plurality of stress relaxation portions 70 are provided for one lead frame, a synergistic effect can be expected from the plurality of stress relaxation portions 70, and more effective stress relaxation can be realized. It becomes.

  In the example shown in FIG. 1, a stress relaxation portion 70 is provided in a part of a pair of lead frames to which the chip capacitor 40 is connected in a bridging state among the plurality of lead frames 11 to 18. However, you may provide the stress relaxation part 70 in all the lead frames 11-18.

  In the electronic device shown in FIG. 1, in the lead frames 11 to 18, the portion pressed by the resin stopper block of the mold when the mold resin 50 is molded is the outer lead portion, and is located far from the outer lead. The force applied to the lead frame by the lever principle is large. Therefore, in the example shown in FIG. 1, the stress relaxation portion 70 is provided for the set of lead frames connecting the chip capacitors 40 at positions far from the outer leads.

(Second Embodiment)
FIG. 4 is a schematic cross-sectional view showing the connection structure of the electronic component 40 according to the second embodiment of the present invention. Here, as in the above embodiment, the chip capacitor 40 is used as the electronic component 40.

  In the example shown in the first embodiment, the stress relaxation portion 70 is formed by pressing from the upper surface of the lead frames 11 and 12, that is, the surface to which the chip capacitor 40 is connected. As described above, the stress relaxation portion 70 may be formed by pressing from the lower surfaces of the lead frames 11 and 12. Also in this case, the same effect as the connection structure of the first embodiment can be obtained.

(Third embodiment)
FIG. 5 is a schematic plan view showing the connection structure of the electronic component 40 according to the third embodiment of the present invention. The lead frames 11 and 18 having the slits 21 in FIG. 1 and the chip capacitor 40 as the electronic component are shown. It is an enlarged view of the connection structure. In FIG. 5 and FIG. 6 described later, the stress relaxation portion 70 is hatched for convenience.

  In the present embodiment, as shown in FIG. 5, in the lead frames 11, 18 provided with the stress relaxation portions 70, the narrow portions 22 are reduced in width by inserting slits 21 in the lead frames 11, 18. Is formed.

  Here, two slits 21 are inserted into one lead frame 11, 18, and a portion between the two slits 21 is a narrow portion 22.

  The chip capacitor 40 is connected to the narrow portion 22 via the conductive bonding member 80. Further, by providing the stress relaxation portion 70 in the narrow portion 22, the connection reliability between the electronic component 40 and the lead frames 11 and 18 can be improved as in the above embodiment.

  In addition, the present embodiment is preferably applied to a case where both the lead frames 11 and 18 are wide lead frames corresponding to an increase in current. In order to exhibit the function, the stress relaxation part 70 is preferably thinner while increasing the plate thickness.

  From such a viewpoint, it is effective to form a narrow portion 22 having a narrow width by inserting a slit 21 in a wide portion of the lead frames 11 and 18, and stress is applied to the narrow portion 22 having a narrow width. By providing the relaxation part 70, the stress relaxation part 70 which is easy to relieve stress can be formed, and it is preferable.

  FIG. 6 is a schematic plan view showing an example in which the slit 21 is modified. By changing the straight slit 21 shown in FIG. 5 into an L-shaped slit 21, the narrow portion 22 can be narrower on the root side than the connection portion with the chip capacitor 40. And it becomes possible to form the stress relaxation part 70 which was more excellent in the stress relaxation function by providing the stress relaxation part 70 in this thin part.

  In the example shown in FIGS. 5 and 6, the portion between the two slits 21 formed for one lead frame 11, 18 is the narrow portion 22. For example, one lead frame 11 and 18 may be provided with a single slit, and a portion on one side sandwiching the single slit may be a narrow portion. Furthermore, three or more slits may be provided for one lead frame.

  The configuration of the lead frame forming the narrow portion 22 by the slit 21 as described in this embodiment may be applied to the lead frames 11 and 12 in FIG.

(Fourth embodiment)
FIG. 7 is a schematic cross-sectional view showing a connection structure of a chip capacitor 40 as an electronic component according to the fourth embodiment of the present invention.

  In the present embodiment, as shown in FIG. 7, the stress relaxation portion 70 is configured as a side wall portion in a recess formed by pressing a part of the lead frames 11 and 12.

  As described above, if the recesses are formed by pressing a part of the lead frames 11 and 12, the sidewall portions of the recesses are extended and thinned by pressing, and thus the sidewall portions are configured as the stress relaxation portions 70. be able to. Further, as shown in FIG. 7, according to the press working, since two side wall portions can be formed with respect to one concave portion, the stress reduction effect is great and the cost performance is also excellent.

  In the example shown in FIG. 7, one recess is formed for one lead frame 11, 12, but a plurality of recesses are provided for one lead frame as shown in FIG. It may be formed.

  Thus, also when the stress relaxation part 70 is formed as a side wall part of a recessed part, the connection reliability of the electronic component 40 and the lead frames 11 and 12 can be improved similarly to the said embodiment.

  Also in this embodiment, a configuration in which the narrow portion 22 by the slit 21 described above is formed may be employed. In this case, the narrow portion 22 may be pressed to form a recess.

(Other embodiments)
FIG. 9 is a schematic cross-sectional view showing a connection structure of a chip capacitor 40 which is an electronic component as another embodiment of the present invention.

  As shown in FIG. 9, a fine uneven portion 71 may be added to the stress relaxation portion 70 that is a thin plate. This can be formed, for example, by forming irregularities on the mold during press working, and it is possible to increase the irregularities of the stress relaxation portion 70 and increase the finer thin portion to increase the elasticity. it can.

  In the connection structure of the electronic component shown in each of the above embodiments, the plate thickness of the stress relaxation portion 70 is preferably 0.55 T or less as described above. However, the stress relaxation function is sufficiently exhibited, and the electronic component 40 and the lead are connected. If the connection reliability with the frames 11 and 12 can be improved, the plate thickness of the stress relaxation portion 70 is not limited to this.

  Further, in the electronic component connection structure shown in each of the above embodiments, the stress relaxation portions 70 are provided in both of the pair of lead frames 11 and 12 to which the chip capacitor 40 as the electronic component is bridged. The stress relaxation part 70 may be provided in only one of the frames 11 and 12. For example, the stress relieving portion may be provided only on the one of the pair of lead frames that is structurally susceptible to large stress.

  In the connection structure shown in the above embodiment, for example, among the pair of lead frames 11, 12, 18, the lead frame 11 is the first lead frame, and the lead frames 12, 18 are the second lead frame. Is merely an indication that one of the two lead frames is the first and the other is the second, and may be opposite to the above.

  Further, the electronic device shown in FIG. 1 may not be sealed with the mold resin 50. In the connection structures shown in FIGS. 4 to 9, the lead frames 11 and 12 and the chip capacitor 40 may be sealed with a mold resin.

  The electronic component is not particularly limited as long as it is an electronic component that can be mounted on the lead frame. In addition to the above-described chip capacitor, a resistance element, an IC chip, or the like can be employed.

1 is a schematic plan view of an electronic device according to a first embodiment of the present invention. FIG. 2 is an enlarged view of a portion A surrounded by a circle in FIG. 1, (a) is a sectional view taken along line BB in FIG. 1, (b) is a partially enlarged view of a stress relaxation portion in (a), and (c). FIG. 3 is a top view of (a). It is a figure which shows the relationship between the board thickness of a stress relaxation part, and the stress added to the connection part of a lead frame. It is a schematic sectional drawing which shows the connection structure of the electronic component which concerns on 2nd Embodiment of this invention. It is a schematic plan view which shows the connection structure of the electronic component which concerns on 3rd Embodiment of this invention. It is a schematic plan view which shows the example which deform | transformed the slit in the said 3rd Embodiment. It is a schematic sectional drawing which shows the connection structure of the electronic component which concerns on 4th Embodiment of this invention. It is a schematic sectional drawing which shows the example which formed the several recessed part in the said 4th Embodiment. It is a schematic sectional drawing which shows the connection structure of the electronic component as other embodiment of this invention.

Explanation of symbols

11 ... 1st lead frame, 12, 18 ... 2nd lead frame,
20 ... Connection part with electronic component in lead frame, 21 ... Slit,
22 ... narrow portion, 40 ... chip capacitor as electronic component,
70: Stress relaxation part, 80: Conductive joining member.

Claims (7)

A plate-like first lead frame (11) and a second lead frame (12, 18) which are arranged apart from each other in the same direction,
The lead frames (11, 12, 18) are connected to one surface of the lead frames (11, 12, 18) via a conductive joining member (80), and are arranged in a state of being bridged between the lead frames (11, 12, 18). In the electronic component connection structure comprising the electronic component (40),
Of at least one of the two lead frames (11, 12, 18), a part other than the connection part (20) to the electronic component (40) and a part away from the conductive joining member (80) It is configured as a stress relaxation part (70) for relaxing the stress transmitted to the conductive joint member (80),
The stress absorbing portions (70) state, and are said stress relaxation section (70) thinner than the portion other than in the lead frame to which the stress absorbing portions (70) are provided (11,12,18),
The lead frame (11, 12, 18) provided with the stress relaxation portion (70) is made of a plate material having a plate thickness of T,
A part of the lead frame (11, 12, 18) is formed as a recess having a shape recessed deeper than the plate thickness T by pressing, and the stress relaxation portion (70) is formed in the recess in the recess. connection structure of an electronic component, characterized in der Rukoto one configured as a sidewall portion is thin and extended portion by press working. The lead frame (11 , 12 , 18) provided with the stress relaxation portion (70) is characterized in that the stress relaxation portion has a thickness reduced to 0.55 T or less. Item 2. The electronic component connection structure according to Item 1. The lead frame (11, 12, 18) provided with the stress relieving portion (70) has a narrow width by making a slit (21) in the lead frame (11, 12, 18). Part (22) is formed,
On the narrow portion (22), the electronic component (40) is connected via the conductive bonding member (80), and the stress relaxation portion (70) is provided on the narrow portion (22). The electronic component connection structure according to claim 1 , wherein the electronic component connection structure is provided. A plate-like first lead frame (11) and a second lead frame (12, 18) which are arranged apart from each other in the same direction,
The lead frames (11, 12, 18) are connected to one surface of the lead frames (11, 12, 18) via a conductive joining member (80), and are arranged in a state of being bridged between the lead frames (11, 12, 18). In the electronic component connection structure comprising the electronic component (40),
Of at least one of the two lead frames (11, 12, 18), a part other than the connection part (20) to the electronic component (40) and a part away from the conductive joining member (80) It is configured as a stress relaxation part (70) for relaxing the stress transmitted to the conductive joint member (80),
The stress relaxation portion (70) is thinner than the portion other than the stress relaxation portion (70) in the lead frame (11, 12, 18) provided with the stress relaxation portion (70).
The lead frame (11, 12, 18) provided with the stress relieving portion (70) has a narrow width by making a slit (21) in the lead frame (11, 12, 18). Part (22) is formed,
On the narrow portion (22), the electronic component (40) is connected via the conductive bonding member (80), and the stress relaxation portion (70) is provided on the narrow portion (22). connection structure that electronic parts be characterized by being. The lead frame (11, 12, 18) provided with the stress relieving portion (70) is made of a plate material having a plate thickness of T, and the stress relieving portion is thinned to 0.55 T or less. The electronic component connection structure according to claim 4 , wherein the electronic component connection structure is an electronic component connection structure. A part of the lead frame (11, 12, 18) is formed as a recess having a shape recessed deeper than the plate thickness T by pressing, and the stress relaxation portion (70) is formed in the recess in the recess. The electronic component connection structure according to claim 5, wherein the electronic component connection structure is configured as a side wall portion that is thinly formed by pressing. The said stress relaxation part (70) is provided with two or more with respect to one of the said lead frames (11,12,18) in which the said stress relaxation part (70) is provided. The connection structure for an electronic component according to any one of 1 to 6 .

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