JP4644766B2 - Non-contact type workpiece processing equipment - Google Patents

Description

  The present invention relates to an apparatus for forming a thin film on a surface of a thin plate-like object, particularly a substrate, rotating in a non-contact manner, or cleaning and drying the surface in the manufacture of a semiconductor or liquid crystal.

  In the manufacture of semiconductors and liquid crystals, there is an operation process in which a thin film is formed on the surface of a substrate such as a wafer or glass plate, or the surface is washed or dried. In this process, the substrate placed on the rotating head is used. A device that rotates at high speed is used.

  For example, in a thin film forming process, an apparatus called a spin coater that forms a thin film by expanding a coating liquid by centrifugal force by rotating a substrate on which a coating liquid is dropped at high speed is used.

  The structure of a conventional spin coater is shown in FIG. FIG. 9 is a cross-sectional view showing the structure of the spin coater.

The spin coater mainly includes a disc-shaped spin head 50 placed horizontally, a rotary shaft 52 extending downward from the center of the lower surface thereof, and a drive motor 51 connected to the spin head 50 by the rotary shaft 52. ing. A wafer 53 is placed on the upper surface of the spin head 50, and a scattering prevention cup 56 is provided around the wafer 53 so as to cover the entire spin head 50. An upper surface of the anti-scattering cup 56 is open, and a discharge nozzle 55 for dropping the coating liquid 54 is disposed above the upper surface.

The operation of this spin coater will be described below.
First, the wafer 53 transferred from the previous process is placed on the spin head 50 by vacuum chucking or the like. Next, the drive motor 51 rotates the wafer 53 together with the spin head 50 through the rotation shaft 52 at a high speed (for example, 4000 rpm).

  When the coating liquid 54 is dropped from the upper nozzle 55 onto the surface of the rotating wafer 53, the coating liquid 54 spreads on the surface of the wafer 53 by centrifugal force to form a thin film.

  The excess coating liquid 54 that has not contributed to the formation of the thin film is collected by colliding with the anti-scattering cup 55 and collected from below.

  Such a thin film formation process is performed in a sealed container in a clean environment in order to avoid contamination of impurities into the thin film. Accordingly, the spin coater is usually installed with the spin shaft 50 as the boundary and the upper part with the spin head 50 in the sealed container and the lower part with the drive motor 51 outside the container. Since the rotating shaft 52 penetrates the floor wall of the sealed container in this way, a seal material 57 for maintaining a clean environment in the sealed container is provided at the penetrating portion.

  However, in the conventional semiconductor substrate rotation processing apparatus, it is impossible to completely prevent the generation of fine particles from the sealing material and contaminate the clean environment in the sealed container. There was a problem that the quality of the substrate was lowered.

  Also, since the rotating head and the rotating shaft must be removed in order to perform maintenance and repair / replacement of the drive motor, etc., the thin film forming operation in the sealed container is interrupted for a long period of time, and the yield of substrate processing deteriorates. There was also a problem of letting it go.

  The present invention has been made in view of such problems, and provides a substrate rotation processing apparatus that can easily perform maintenance and repair replacement without contaminating the clean environment in the sealed container. It is intended.

  The invention according to claim 1 for achieving the above object includes a rotating head portion that rotates by placing a substrate in an airtight container, and a non-facing surface that faces the rotating head portion disposed below the airtight container. A non-contact-type workpiece rotation processing apparatus comprising a contact-type rotational power transmission body and a fixed portion that concentrically surrounds the non-contact-type rotational power transmission body, wherein the rotary head portion is a non-contact type A rotational force passive means; and a ring-shaped permanent magnet that concentrically surrounds the non-contact type rotational force passive means, and the fixing portion is concentrically arranged to face the ring-shaped permanent magnet. A pinned body made of a second-type superconductor and cooling means for cooling the pinned body, and the ring-shaped permanent magnet is cooled by the cooling means to a temperature lower than a critical temperature. Generate a magnetic pinning force between The head portion is magnetically levitated at a predetermined position, and the rotational force generated by the non-contact type rotational power transmission body is caused to follow the rotational head portion corresponding to the rotational head portion to rotate the rotational head portion. It is a non-contact-type to-be-processed object rotation processing apparatus comprised.

  According to the invention configured as described above, the rotary head unit installed in the sealed container can be rotated and operated in a non-contact state from the outside of the sealed container.

  The second type superconductor refers to a material in which superconducting and normal conducting parts begin to coexist in the material when the strength of the magnetic field exceeds a certain value. The magnetic pinning force refers to a restoring force that is generated when an external magnetic flux that passes through the second type superconductor is held in a normal conduction portion inside the material.

  According to a second aspect of the present invention, the non-contact type workpiece rotation processing apparatus according to the first aspect is characterized in that the rotary head portion is lifted or lowered by moving the pinning body up and down by a lifting means. It is.

  According to a third aspect of the present invention, there is provided a non-contact type object to be processed according to the first or second aspect, wherein a holding base for holding the rotary head portion is provided on the inner surface of the floor wall of the sealed container. It is a rotation processing device.

  The invention according to claim 4 is characterized in that a holding member for placing and exchanging the object to be processed is formed on the upper surface of the rotary head portion. This is a non-contact type workpiece rotation processing apparatus.

  According to a fifth aspect of the present invention, there is provided a step of inserting an arm on which the substrate is placed from above in a horizontal direction above the rotary head portion held on a holding table, and lowering the arm to move the arm on the rotary head. A step of delivering the workpiece to the holding member, a step of pulling out the arm after the delivery of the workpiece from the upper side of the rotary head portion in a horizontal direction, and the pinning body is raised by the elevating means. The step of floating the rotary head portion, the step of rotating the rotary head portion by following the non-contact type rotational power transmission body, and the rotation of the rotary head portion by the non-contact type rotational power transmission body And then lowering the pinned body by the elevating means and holding the rotating head part on the holding table, and carrying out the processing method of the object to be processed Is a non-contact processing object rotation processing apparatus according to any one of Motomeko 1-4.

  According to the non-contact type workpiece rotation processing apparatus according to the present invention, the rotating head portion is levitated by the magnetic pinning force generated between the rotating head portion and the second type superconductor, and the levitated rotating head portion is By rotating with a non-contact type rotational power transmission body, the rotating head placed in the sealed container is rotated from outside the container without affecting the atmosphere in the container. Thin film formation can be performed while maintaining the quality, and the quality of the object to be processed such as a thin plate, particularly a semiconductor substrate can be improved.

  In addition, since there is no drive part in the rotating head part in the sealed container, there is almost no need for maintenance and repair, and the part outside the sealed container for floating and rotating the rotating head part can be integrally configured, The processing object rotation processing device such as a semiconductor substrate can be downsized to facilitate installation on the production line, and maintenance and repair replacement of the processing object rotation processing device can be performed without interrupting the work in the sealed container for a long period of time. This can be easily performed, and the yield of various kinds of treatments such as a semiconductor substrate can be improved.

  Furthermore, the smooth delivery of the substrate via the robot arm or the like can improve the efficiency of processing of a thin plate-like workpiece such as a semiconductor substrate.

Embodiments of the present invention will be described with reference to the drawings.
Here, as an example, a spin coater that is one of rotation processing apparatuses that process a substrate such as a semiconductor wafer as an object to be processed will be described.

  A first embodiment of a spin coater according to the present invention is shown in FIG. FIG. 1 is a cross-sectional view from the side of the spin coater.

  The spin coater is mainly composed of a spin head 1 (corresponding to a rotating head portion) that rotates in a sealed container, and a fixed portion 2 that rotates the spin head 1 from below the sealed container with the floor wall 3 interposed therebetween. .

  The spin head 1 includes a disk-shaped table 4 made of a non-magnetic material on which a holding pin 48 for placing a substrate (not shown) is erected, a ring-shaped permanent magnet 5 installed on the bottom surface thereof, and a non-contact type. It is comprised from the rotational force passive body 6 which is a rotational force passive means. Below the spin head 1, a plurality of holding bases 7 are provided on the floor wall 3 to hold the spin head 1 when not rotating. The outer peripheral portion 4a of the table 4 and the end portion 7a of the holding table 7 in contact with the outer peripheral portion are provided with an inclination so that the central axis of the spin head 1 on the holding table 7 is always maintained at a fixed position. It has become. Further, a cylindrical scattering prevention cup 8 having an upper surface opened so as to cover the spin head 1 is disposed around the spin head 1 and the holding base 7, and the coating liquid 9 is dropped above the spin head 1. A discharge nozzle 10 is provided.

  A bottom view of the spin head 1 is shown in FIG. For permanent magnets, the magnet polarity is represented by “N” and “S”.

  The ring-shaped permanent magnet 5 and the rotational force passive body 6 are disposed concentrically on the bottom surface of the table 4.

  The ring-shaped permanent magnet 5 installed on the outer peripheral side is magnetized so that the polarity appearing on the surface is either “N” or “S”.

The rotational force passive body 6 installed on the inner peripheral side is composed of a plurality of permanent magnets arranged so that the polarities appearing on the surface are alternately changed in the circumferential direction.

  In addition, in FIG. 2, although the structure which consists of four permanent magnets is shown as an example, it is not necessarily limited to this.

  The fixed part 2 is mainly composed of a second type superconductor 11, a heat insulating container 12, and a rotation drive part 13.

  The second type superconductor 11 as a pinned body is accommodated in a ring-shaped hollow heat insulating container 12 as a cooling means in a state immersed in a coolant 14, for example, liquid nitrogen or liquid helium. The heat insulating container 12 has a double structure, and exhibits a heat insulating effect by making the space between the two partition walls substantially vacuum. In addition, a heat transfer plate 15 made of a material having excellent heat conduction, for example, copper, is laid between the bottom surface of the second type superconductor 11 and the heat insulating container 12. It is cooled by a cooler 16 provided in the lower part.

  The rotational drive unit 13 includes a disk-shaped metal plate 17 and a rotational force transmission body 18 which is a non-contact type rotational power transmission body installed on the upper surface thereof, and is connected to a drive motor 19 installed below. Yes. In addition, it is desirable to use a motor with a brake for the drive motor 19 in view of the function of a spin coater that repeats rotation and stop frequently.

  The heat insulating container 12 and the drive motor 19 are fixed to the upper surface portion 21 of the support base 20, and the upper surface portion 21 can be raised or lowered by an elevating device 22, for example, an air cylinder or a servo motor.

  A top view of the fixing portion 2 is shown in FIG. In addition, about the display of the polarity of a permanent magnet, it is the same as that of the case of FIG.

  The second type superconductor 11 is a short cylindrical bulk body, and a plurality of the second type superconductors 11 are concentrically installed in the heat insulating container 12 so as to face the ring-shaped permanent magnet 5 installed in the spin head 1. The inner and outer diameters of the concentric circles formed by the plurality of second type superconductors 11 are preferably larger than the inner and outer diameters of the opposing ring-shaped permanent magnets 5 from the viewpoint of stably flying the spin head 1. .

The material of the second type superconductor 11 is yttrium (Y-Ba-Cu-O), gadolinium (Ga-Ba-Cu-O), neodymium (Nd-Ba-Cu-O) or europium ( It is desirable to be made of an oxide of (Eu-Ba-Cu-O).

  The shape and arrangement of the second type superconductor 11 are not limited to the configuration shown in FIG. 3 as long as it faces the ring-shaped permanent magnet 5.

  The rotational drive unit 13 is installed so as to be positioned inside the heat insulating container 12, and the rotational force transmitting body 18 is disposed on the metal plate 17 so as to face the rotational force passive body 6 of the spin head 1.

  This rotational force transmitting body 18 is composed of permanent magnets arranged so that the polarities are alternately changed in the circumferential direction like the rotational force passive body 6. It is preferable from the viewpoint of increasing the magnetic attractive force and rationalizing the manufacturing cost.

  As described above, the second type superconductor 11, the heat insulating container 12, and the rotation drive unit 13 have a simple structure and are integrally configured.

  Before describing the operation of the spin coater configured as described above, the principle of the spin head flying and rotating will be described.

  First, the principle that the spin head floats from the operation unit will be described in detail with reference to FIG. FIG. 4 is a schematic diagram showing the relationship between the ring-shaped permanent magnet of the spin head and the second type superconductor of the fixed part.

  First, as shown in FIG. 4A, a permanent magnet 30 having a symmetrical shape in the horizontal direction (corresponding to the ring-shaped permanent magnet 5 of the spin head 1) is replaced with a second-type superconductor 31 (which is also symmetrical in the horizontal direction). It is held by the restraining means 32 at a predetermined distance d upward from the second-type superconductor 11 of the fixing portion 2. The permanent magnet 30 is magnetized so that the N pole faces the type II superconductor 31.

  In this state, the magnetic flux 33 generated from the permanent magnet 30 simply passes through the inside of the second type superconductor 31.

  Next, as shown in FIG. 4B, the second type superconductor 31 is cooled to a critical temperature or lower by immersing it in liquid nitrogen 34 or the like. In the second type superconductor 31 in the superconducting state, the magnetic flux 33 from the permanent magnet 30 is quantized, and the pinning effect 36 is captured and held as if it were pinned to the normal conducting portion existing inside. Occurs. At this time, the potential energy of the system composed of the permanent magnet 30 and the second type superconductor 31 is in a stable state.

  If the restraining means 32 of the permanent magnet 30 is released from such a state as shown in FIG. 4C, the permanent magnet 30 falls by gravity toward the second type superconductor 31, so the distance between the two is greater than d. However, this means that the magnetic flux 33 is shifted from the pinned position 36 and the potential energy of the system becomes unstable. Therefore, the pinning force 37 is generated in the permanent magnet 30 in the axial direction opposite to the gravity so as to return to the direction in which the potential energy is stabilized, that is, in the state shown in FIG. In this position, the permanent magnet 30 is levitated.

  This phenomenon is the same even when the permanent magnet 30 moves in the horizontal direction as shown in FIG. 4D, and the pinning force 38 is generated in the radial direction where the potential energy of the system is stabilized.

  The predetermined distance d is uniquely determined from the shape of the permanent magnet 30 and the second type superconductor 36, the strength of the magnetic force of the permanent magnet 30, and the like.

  Next, a method for rotating the permanent magnet levitated on the second type superconductor will be described in detail with reference to FIG. FIG. 5 is a schematic diagram showing the positional relationship between the permanent magnet of the spin head, the second type superconductor of the operation unit, and the permanent magnet. The same parts as those in FIG.

The spin head 1 floats above the fixed portion 2 by the magnetic flux 40 from the ring-shaped permanent magnet 5 being pinned in the second type superconductor 11 according to the principle described above. At this time, the rotational force passive body 6 and the rotational force transmitting body 18 that are opposed to each other are composed of permanent magnets that are arranged so that the polarities are alternately changed in the circumferential direction. By properly rotating the metal plate 17 so that the different poles face each other, a magnetic attractive force 41 can be generated between them. When the rotation drive unit 13 is rotated by the drive motor 19 in this state, the flying spin head 1 can be rotated in conjunction with the suction force 41. Here, since the rotational force passive body 6 and the rotational force transmission body 18 are composed of permanent magnets arranged so that the polarities are alternately changed in the circumferential direction, they are more permanent than in the case where they have a single polarity. The magnetic attractive force of the magnet can be effectively used for rotation.

  At this time, the magnetic flux 40 from the ring-shaped permanent magnet 5 captured by the second type superconductor 11 also moves in the circumferential direction. However, the ring-shaped permanent magnet 5 and the second type superconductor 11 are Since the shape is symmetrical in the horizontal direction, the potential energy of the system does not change and does not affect the rotation of the spin head 1.

  If the spin head 1 is displaced in the axial direction or the radial direction due to some cause, it returns to its original position even when a pinning force is generated as shown in FIG. be able to.

  With reference to the above, the operation of the spin coater according to the present invention will be described below in detail with reference to FIG. FIG. 6 is a cross-sectional view showing the flow of operation of the spin coater, and the same parts as those in FIG.

  First, in a standby state, the spin head 1 is held on the holding table 7, and the fixing portion 2 is disposed below the spin head 1 by a predetermined distance. Here, “predetermined distance” corresponds to “distance d” in FIG. Then, the second type superconductor 11 in the heat insulating container 12 is cooled to a critical temperature or lower by the refrigerator 16.

  Next, the scattering prevention cup 8 is moved upward, and the substrate 45 placed on the fork portion 47 of the robot arm 46 is moved upward from the spin head 1 from the horizontal direction (see FIG. 6A). .

After the substrate 45 is moved to a predetermined position above the spin head 1, the robot arm 46 is lowered, and the substrate 45 is transferred to the holding pin 48 that is a protrusion erected on the spin head 1 ( (Refer FIG.6 (b).). The holding pin 48 has a conical silicon rubber attached to the tip, and holds the substrate on the spin head 1 so as to be sandwiched from the outer periphery by the slope of the silicon rubber.
The holding pins 48 are effective for surface treatment while rotating the peripheral edge of a thin disk-like substrate 45 such as a silicon wafer by point contact and rotating at high speed. However, if it is possible to temporarily hold the periphery of the object to be processed even if it is not a point contact, for example, a holding part using a part of a conical surface of a thing like a dish, or the bottom surface of the object to be processed It is also possible to employ a means that can be engaged with and held in the concave portion or convex portion.

  After delivering the substrate 45, the robot arm 46 is pulled out in the horizontal direction, and the anti-scattering cup 8 is lowered to its original position (see FIG. 6C).

  After the substrate 45 is placed on the spin head 1 as described above, the spin head 1 is moved a predetermined distance from the holding base 7 by raising the upper surface portion 21 of the support base 20 using the lifting device 22. After floating to a distant height, the substrate 23 is rotated at a high speed together with the spin head 1 by the drive motor 19 via the rotation drive unit 13. When the coating liquid 9 is dropped from the upper discharge nozzle 10 onto the surface of the rotating substrate 23, the coating liquid 9 spreads on the surface of the substrate 23 by a centrifugal force to form a thin film. The excess coating liquid 9 that has not formed a thin film is collected by colliding with the anti-scattering cup 8 and collected from below (see FIG. 6D).

  After the thin film is formed on the surface of the substrate 45, the rotation of the spin head 1 is stopped by stopping the drive motor 19. Then, the spin head 1 is held on the holding table 7 by operating the elevating device 22 to lower the upper surface 21 of the support frame 20. Finally, the substrate 45 is picked up from the spin head 1 by the robot arm 46 and transferred to the next processing step in the reverse procedure.

  As described above, since the spin head 1 in the hermetic container has no driving portion, it is hardly necessary to perform maintenance or repair. In addition, the fixed portion 2 outside the hermetic container having the driving portion is integrally configured with a simple structure, so that it can be miniaturized and easy to maintain and repair.

  In addition, if the second type superconductor 11 is in a superconducting state, it is reasonable to maintain it while the rotating device is stopped, and there is no waste in operation.

  FIG. 7 shows a second embodiment of the spin coater according to the present invention. FIG. 7 is a cross-sectional view of a spin coater according to the second embodiment.

  In the present embodiment, the rotational force transmission body 18 that is a non-contact type rotational power transmission body in the first embodiment is configured by a plurality of electromagnets 23 arranged in the circumferential direction.

  A DC brushless synchronous motor can be formed between the rotational force passive body 6 and the electromagnet 23 by controlling the current so that the direction of the magnetic force by the electromagnets 23 is sequentially different in the circumferential direction.

  Accordingly, since a mechanical rotation mechanism such as the drive motor 19 is not required, the operation unit 2 can be further miniaturized, and maintenance and repair replacement can be facilitated.

  A third embodiment of the rotating device according to the present invention is shown in FIG. FIG. 8 is a cross-sectional view of a spin coater according to the third embodiment.

  In the present embodiment, the rotational force passive body 6, which is a non-contact type rotational force passive means in the second embodiment, is configured by a disk-shaped conductive metal plate 24.

  In the present embodiment, as in the case of the second embodiment, the eddy current is applied to the conductive metal plate 24 by the magnetic field of the electromagnet 23 by controlling the current so that the direction of the magnetic force by the electromagnet 23 sequentially changes in the circumferential direction. Thus, a rotational force can be generated in the spin head 1.

  Therefore, the structure of the spin head 1 can be further simplified according to this embodiment.

  The first to third embodiments described above are examples of the spin coater that forms a thin film on the substrate as described above, but other types of substrate processing related to cleaning or drying of the substrate surface. Needless to say, the present invention can also be applied to a rotating device.

  For example, in the first embodiment shown in FIG. 1, cleaning water may be used instead of the coating liquid 9 when the cleaning device is used, and the discharge nozzle 10 is removed when the drying device is used. That's fine.

The non-contact type processing object rotation processing apparatus according to the present invention is suitable for processing a thin plate-shaped processing object at a high speed in a processing process of a semiconductor substrate such as a silicon wafer, but the processing is limited to spin coating. It can be used for washing and drying processes.
For example, in the field of physics and chemistry and medical research as a processed material, and in the field of biotechnology, etc., the equipment used for applications that process the processed material with centrifugal force generated by high-speed rotation Can be used.
Since the apparatus according to the present invention is based on the premise that the object to be processed is rotated at a high speed, it is necessary to design it as an apparatus having means for holding the object to be processed in consideration of the balance in high speed rotation. is there. The holding means is designed in consideration of the shape, size, weight, generated centrifugal force, etc. of the object to be processed, such as a pin-like one that uses point contact or a part of a conical surface.
In addition, the object to be processed is not limited to a thin plate-like object, and for example, other forms such as a thin glass container containing blood can be centrifuged. Alternatively, it can be used effectively in fields such as biology.

1 is a cross-sectional view of a non-contact spin coater according to the present invention. It is a bottom view of the rotary head part of the non-contact type spin coater concerning the present invention. It is a top view of the operation part of the non-contact type spin coater concerning the present invention. It is a schematic diagram which shows the principle of magnetic levitation. It is a schematic diagram which shows the principle of rotation. It is sectional drawing explaining operation | movement of the non-contact-type spin coater which concerns on this invention. It is sectional drawing of 2nd Embodiment of the non-contact-type spin coater based on this invention. It is sectional drawing of 3rd Embodiment of the non-contact-type spin coater based on this invention. It is sectional drawing of the conventional spin coater.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Spin head 2 Operation part 3 Floor wall 4 Table 5 Ring-shaped permanent magnet 6 Rotational force passive body 7 Holding stand 8 Spattering prevention cup 9 Coating liquid 10 Discharge nozzle 11 Type 2 superconductor 12 Heat insulation container 13 Rotation drive part 14 Liquid Nitrogen 15 Heat transfer plate 16 Cooler 17 Metal plate 18 Rotational force transmission body 19 Drive motor 20 Support base 21 Upper surface portion 22 Lifting device 23 Electromagnet 24 Conductive metal plate 30 Permanent magnet 31 Type 2 superconductor 32 Constraint means 33 Magnetic flux 34 Liquid nitrogen 35 Insulated container 36 Pinned portion 37 Axial pinning force
38 Pinning force in radial direction 40 Magnetic attraction force 41 Magnetic flux of ring-shaped permanent magnet 45 Substrate 46 Robot arm 47 Fork part 48 Holding pin 50 Spin head 51 Drive motor 52 Rotating shaft 53 Wafer 54 Coating liquid 55 Discharge nozzle 56 Spattering Prevention cup 57 Seal material

Claims (5)

A rotary head unit that rotates by placing an object to be processed in a sealed container, a non-contact rotational power transmission body that is disposed below the sealed container and faces the rotary head unit, and the non-contact rotational power A non-contact type substrate rotation processing apparatus comprising a fixed portion that concentrically surrounds a transmission body,
The rotating head unit includes a non-contact type rotational force passive means and a ring-shaped permanent magnet that concentrically surrounds the non-contact type rotational force passive means,
The fixing portion includes a pinning body made of a second-type superconductor concentrically disposed so as to face the ring-shaped permanent magnet, and a cooling means for cooling the pinning body,
The pinning body is cooled to a critical temperature or lower by the cooling means to generate a magnetic pinning force between the ring-shaped permanent magnet and magnetically levitating the rotary head portion to a predetermined position. A non-contact-type workpiece rotation processing apparatus configured to rotate the rotating head portion by generating a rotating force corresponding to the rotating head portion side by the rotating force generated by the contact-type rotating power transmission body. .   The non-contact type object rotation processing apparatus according to claim 1, wherein the rotary head unit is lifted or lowered by raising and lowering the pinned body by an elevating unit.   The non-contact type workpiece rotation processing apparatus according to claim 1, wherein a holding base for holding the rotary head portion is provided on an inner surface of the floor wall of the sealed container.   The non-contact-type workpiece rotation processing apparatus according to claim 1, wherein holding means for placing and exchanging the substrate is provided on an upper surface of the rotary head unit. A step of inserting an arm carrying the object to be processed from above in a lateral direction above the rotary head unit held on a holding table; and a step of lowering the arm to the holding pin on the rotary head. A step of transferring the workpiece, a step of pulling out the arm from the upper side of the rotary head portion in the horizontal direction after the delivery of the object to be processed, and the pinning body is lifted by the lifting means to float the rotary head portion A step of rotating the rotary head portion by following the non-contact rotational power transmission body, and a step of following the rotation of the rotary head portion by the non-contact rotational power transmission body to stop the rotation. The method according to claim 1, further comprising: a step of lowering the pinned body by an elevating means and holding the rotary head portion on the holding table. Non-contact processing object rotation processing apparatus mounting.

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