JP4644941B2 - Electronic component mounting equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting apparatus for mounting an electronic component on a circuit board, and in particular, has improved the correspondence to the circuit board size of a board transport rail for transporting the circuit board to the component mounting position. It is.
[0002]
[Prior art]
FIG. 4 is a plan view showing the configuration of the main part of the electronic component mounting apparatus, and mainly describes the configuration and operation of the board transport rail. The board transport rails 30a and 30b transport the circuit boards 31a and 31b carried into the apparatus from the carry-in entrance 32 to the mounting position, and carry out the circuit boards 31a and 31b on which electronic components are mounted from the carry-out outlet 35 to the outside of the apparatus. To do. The electronic component mounting apparatus shown here is configured in a two-head type, and is configured so that electronic component mounting can be performed simultaneously on two standard-sized circuit boards 31a and 31b.
[0003]
As shown in FIG. 4A, when the circuit boards 31a and 31b are carried into the apparatus from the carry-in entrance 32, one circuit board 31a and one circuit board are respectively provided on the board conveyance rails 30a and 30b divided into two. 31b is arranged. Next, as shown in FIG. 4B, the board transport rail 30a supports the circuit board 31a and moves in the Ya axis direction in the figure to transport the circuit board 31a to the component mounting position. The circuit board 31b is transported to the component mounting position by supporting the board 31b and moving in the Yb axis direction in the figure. Electronic components supplied from the parts feeder 34 are mounted on the circuit boards 31a and 31b by a mounting head (not shown) at the component mounting position.
[0004]
When the mounting of the electronic components on the circuit boards 31a and 31b is completed, the board transport rails 30a and 30b are returned to the loading state in which the rails shown in FIG. 4A are continuous, and the circuit boards 31a and 31b are transported and transported. Unload from the outlet 35. During the loading and unloading of the circuit boards 31a and 31b, the mounting head waits for the board and the production efficiency is lowered. Therefore, the board transfer rails 30a and 30b such as loading the next circuit boards 31a and 31b simultaneously with the unloading. The operation of is optimized.
[0005]
[Problems to be solved by the invention]
The electronic component mounting apparatus is configured to be applied to standard size circuit boards 31a and 31b having an X-axis direction size smaller than the length in the loading / unloading direction (X-axis direction) of the board transport rails 30a and 30b. Therefore, as shown in FIG. 5, when a large circuit board 33 having a size in the X-axis direction larger than the length in the X-axis direction of the board transport rails 30a and 30b is carried in, the board transport rails 30a and 30b divided into two are divided. Therefore, the circuit board 33 cannot be transported in the direction of the component mounting position (Y-axis direction), and the large circuit board 33 cannot be handled as it is.
[0006]
In order to be able to cope with the large circuit board 33, the length of the substrate transport rails 30a and 30b in the X-axis direction may be expanded. However, this increases the overall size of the apparatus and is not practical.
[0007]
An object of the present invention is to provide an electronic component mounting apparatus having a structure of a board transport rail that improves the correspondence to the size of a circuit board.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, according to the present invention, a circuit board carried into the apparatus from the carry-in port is provided by a board carrying rail provided as a parallel rail whose parallel interval is variable in the X-axis direction from the carry-in port to the carry-out port. The circuit board is supported and transported on both sides, moved in the Y-axis direction orthogonal to the X-axis direction at a predetermined transport position, and transported to the component mounting position. an electronic component mounting apparatus for carrying out the outside of the apparatus and conveyed to the outlet port from the predetermined conveying position, the substrate transfer rail is divided into a plurality of movable rails on the X-axis direction, the movable rail alone characterized in conjunction with performing the movement control of the Y-axis direction, that each movable rail the conveying rail control means for controlling so moved to the Y-axis direction in any combination are synchronized thus provided It is intended to.
[0009]
According to the said structure, the movable rail divided | segmented into plurality can be moved in the same direction by arbitrary combinations at the same time it can move independently in a Y-axis direction. When moved alone, it can accommodate circuit boards of a size smaller than the length of the movable rail. To accommodate large circuit boards, synchronize multiple movable rails as if it had a board transport rail that was long in the X-axis direction. It will be like a state. Therefore, by controlling the movement and synchronization of the movable rail according to the size of the circuit board, the size of the circuit board that can be mounted can be increased.
[0011]
In addition, mounting a large-sized circuit board that spans multiple component mounting ranges with a mounting head provided within each component mounting range enables electronic components to be mounted on the entire surface of a large-sized circuit board. The mounting efficiency can also be improved.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings for understanding of the present invention. The following embodiment is an example embodying the present invention, and does not limit the technical scope of the present invention.
[0013]
FIG. 1 is a plan view showing a configuration of a main part of an electronic component mounting apparatus according to the present embodiment, and circuit boards 2a and 2b carried into the apparatus from a carry-in entrance 3 are formed as parallel rails having a variable parallel interval. Each of the circuit boards 2a and 2b on which the electronic components are mounted at the component mounting positions are supported by the board transfer rails 1 that are transported by the board transfer rails 1 and moved to the component mounting positions indicated by the solid lines in the drawing. 2b is carried out of the apparatus from the carry-out port 5.
[0014]
As shown in the figure, the substrate transport rail 1 is composed of movable rails 1a, 1b, 1c, and 1d that are divided into four in the transport direction (X-axis direction) of the circuit boards 2a and 2b. Each of the movable rails 1a to 1d is independently controlled to move in a moving direction (Ya axis and Yb axis direction) orthogonal to the transport direction, and each of the movable rails 1a to 1d can be in any combination in the Ya axis or Yb axis direction. The movement to is controlled synchronously. In the illustrated embodiment, the movable rail 1a and the movable rail 1b that support the circuit board 2a are controlled to move synchronously, and are moved as if they were a pair of parallel rails. Similarly, the movable rail 1c and the movable rail 1d that support the circuit board 2b are controlled to move synchronously.
[0015]
The circuit boards 2a and 2b are of a standard size. When the circuit boards 2a and 2b are carried from the carry-in port 3, the movable rails 1a to 1d are connected in series as indicated by broken lines, and the carried circuit board 2a is moved to the movable rail 1a. The circuit board 2b which is conveyed by being supported on both sides by ˜1d and positioned on the movable rails 1a and 1b, and subsequently carried in is positioned on the movable rails 1c and 1d. Next, as shown by the solid lines, the movable rails 1a and 1b support the circuit board 2a and are moved and positioned to the first component mounting position in the illustrated Ya-axis direction, and the movable rails 1c and 1d move the circuit board 2b. It is supported and moved to the second component mounting position in the Yb axis direction shown in the figure.
[0016]
At the first component mounting position, a mounting head (not shown) moves freely within the first mounting range 10a (inside the thick line frame), holds the electronic component supplied from the parts feeder 4 and mounts it on the circuit board 2a. . Similarly, at the second component mounting position, a mounting head (not shown) moves freely within the second mounting range 10b (within the thick line frame) to hold the electronic component supplied from the parts feeder 4 on the circuit board 2b. Implement. When the mounting of the electronic components on each of the circuit boards 2a and 2b is completed, the movable rails 1a and 1b are moved synchronously in the Yb axis direction and returned to the original positions indicated by broken lines, and the movable rails 1c and 1d are synchronized in the Ya axis direction. Since it moves and returns to the original position indicated by a broken line, the movable rails 1a to 1d are connected in series, and the circuit boards 2a and 2b are transported thereon and carried out of the apparatus from the carry-out port 5.
[0017]
As described above, since the movable rails 1a and 1b and the movable rails 1c and 1d move synchronously, the electronic component mounting on the standard size circuit boards 2a and 2b is the same operation as the conventional configuration shown in FIG. It becomes. However, this electronic component mounting apparatus can also cope with a large-sized circuit board 6 that was impossible with the conventional configuration.
[0018]
As shown in FIG. 2 (a), the large circuit board 6 has a length in the X-axis direction that extends over the movable rails 1b, 1c, and 1d. 1c and 1d are controlled to move synchronously, and moved to the second component mounting position and positioned as shown in FIG. Electronic components are mounted on the circuit board 6 at the second component mounting position. In the case of the circuit board 6, the size is also large in the Y-axis direction, and a part of the electronic component is mounted in the second mounting range 10b. Will come off. Therefore, since the portion outside the second mounting range 10b becomes the first mounting range 10a, electronic component mounting is performed by the mounting head at the first component mounting position, and mounting on the entire surface is possible. In addition, efficient mounting by two mounting heads at the same time becomes possible.
[0019]
By individually moving and controlling the movable rails 1a to 1d divided into a plurality, the electronic components can be simultaneously mounted on the circuit boards 7a and 7b having different sizes as shown in FIG. . In the example shown in FIG. 3, the circuit board 7a is supported by the movable rail 1a and controlled to move from the loading / unloading position indicated by the broken line to the first component mounting position shown in the figure. Further, the circuit board 7b is supported by the synchronously controlled movable rails 1b, 1c, and 1d, and is synchronously controlled from a loading / unloading position indicated by a broken line to a second component mounting position shown in the figure. When the electronic component mounting on each of the circuit boards 7a and 7b is completed at the first and second component mounting positions, the movable rail 1a and the movable rails 1b, 1c, and 1d are controlled to move to the loading / unloading positions indicated by broken lines. The substrates 7a and 7b are carried out of the apparatus from the carry-out port 5.
[0020]
The above-described control of the board transport rail 1 is performed by a transport rail control means (not shown), and the movable rails 1a to 1d are moved to the respective component mounting positions in synchronization with the size of the circuit board on which the electronic components are mounted. By setting the combination, it is possible to increase the size of the circuit board that can be handled as shown in the embodiment of the above three examples.
[0021]
The mounting head in each of the above configurations has been described as being configured in an XY robot system that is mounted on an XY robot and moves freely in the XY axis direction in the first or second mounting range 10a, 10b. These suction nozzles may be arranged on a rotating drum at equal intervals and may be configured to be of a rotary head type that rotates intermittently. However, in the case of this rotary head system, the parts feeder 4 can be moved in the X-axis direction, and the circuit board can be freely moved in the X-Y axis directions by the movable rails 1a to 1d to mount electronic components on the circuit board. The position is configured to be positioned below a predetermined stop position of the rotary head.
[0022]
【The invention's effect】
As described above, according to the present invention, the substrate transport rail is divided into a plurality of movable rails, the movement of each movable rail is individually controlled, and any movable rail is synchronously moved. The size range of the circuit board that can be handled by the electronic component mounting apparatus can be expanded. In particular, it is possible to cope with a large circuit board without increasing the size of the electronic component mounting apparatus.
[Brief description of the drawings]
FIG. 1 is a plan view showing a configuration of a main part of an electronic component mounting apparatus according to an embodiment.
FIG. 2A is a plan view showing a board loading state and FIG. 2B is a component mounting state when a large circuit board is applied to the apparatus.
FIG. 3 is a plan view showing an example in which circuit boards having different sizes are applied in the apparatus.
4A is a plan view showing a component mounting state, and FIG. 4B is a circuit board mounting state in the electronic component mounting apparatus according to the related art.
FIG. 5 is a plan view showing a state where a large circuit board is carried in the apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Board | substrate conveyance rail 1a, 1b, 1c, 1d Movable rails 2a, 2b, 6, 7a, 7b Circuit board 3 Carry-in port 4 Parts feeder 5 Carry-out port

Claims (2)

The circuit board carried into the apparatus from the carry-in port is supported on both sides by a board carrying rail provided as a parallel rail whose parallel interval is variable in the X-axis direction from the carry-in port to the carry-out port. transporting the circuit board to the component mounting position by moving in the Y-axis direction orthogonal to the X-axis direction at the position, it conveys the circuit board having electronic components mounted in the component mounting position from the predetermined conveying position to the unloading opening An electronic component mounting apparatus that is carried out of the apparatus,
The substrate transport rail is divided into a plurality of movable rails in the X-axis direction, and the movable rails are individually controlled to move in the Y-axis direction, and each movable rail can be arbitrarily combined in the Y-axis direction. An electronic component mounting apparatus, characterized in that it is provided with a transport rail control means for controlling the movement to be synchronized with each other. 2. The electronic component mounting apparatus according to claim 1, wherein mounting is performed on a large-sized circuit board extending over a plurality of component mounting ranges by a mounting head provided in each component mounting range.

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