JP4645305B2 - Screen printing plate and method for producing the same, method for producing electronic component using screen printing plate - Google Patents

Description

  The present invention relates to a screen printing plate used for manufacturing electronic components such as a multilayer ceramic chip capacitor and a multilayer chip inductor, a method for manufacturing the same, and a method for manufacturing an electronic component using the screen printing plate.

  2. Description of the Related Art Conventionally, screen printing plates used for manufacturing electronic components such as multilayer ceramic chip capacitors and multilayer chip inductors are widely known (see, for example, Patent Document 1).

  In recent years, as one of the screen printing plates, the metal mesh can be formed with a thin wire diameter and thin-film printing can be performed by rolling the metal mesh in order to cope with higher characteristics and downsizing of electronic components. A screen printing version has been proposed.

Japanese Patent No. 3516882

  However, with such a conventional screen printing plate, although a certain amount of thin film printing is possible, printing defects may occur for a printing pattern with a small area. There was a limit.

  The present invention has been made in order to solve such a problem, and while it is possible to reduce the thickness of the print pattern, at the same time, it prevents the occurrence of printing defects and the like, and provides a high-definition print pattern. It is an object of the present invention to provide a screen printing plate capable of forming a film, a method for producing the same, and a method for producing an electronic component using the screen printing plate.

As a result of earnest research, the inventor of the present invention has found that the flat rolled flat portion formed by flattening the intersection of the metal mesh during rolling prevents the electrode paint from wrapping around the printing surface, and causes the lack of printing. I found out that

  That is, the above-described object can be achieved by the following present invention.

An intersection portion formed by crossing the two metal lines in (1) Metals mesh, by rolling, at least a portion of the flat rolled flat portion formed by flattening and crushing the metal wire is chamfered Tei Te, the surface roughness Ra of the metal mesh after chamfering, screen printing plate characterized that you have met 0.05μm ≦ Ra ≦ 0.2μm.

  (2) The screen printing plate according to (1), wherein at least a part of the rolled flat portion is chamfered by polishing.

(3) gold intersection portion formed by crossing the two metal lines in the genus mesh, by rolling, and forming a rolled flat portion of the flat and flattened by crushing the metal wire, the rolled flat portion A method for producing a screen printing plate, comprising a step of chamfering so that a surface roughness Ra of the metal mesh after chamfering at least a part of the surface satisfies 0.05 μm ≦ Ra ≦ 0.2 μm .

( 4 ) The method for producing a screen printing plate according to ( 3 ), wherein at least a part of the rolled flat portion is chamfered by polishing.

( 5 ) An electronic component manufacturing method, wherein an electronic component is manufactured using the screen printing plate according to (1) or (2) .

  According to the screen printing plate according to the present invention, it is possible to form a high-definition print pattern by preventing the occurrence of printing defects and the like at the same time while allowing the printing pattern to be thinned. Has an effect.

  Further, according to the method for producing a screen printing plate according to the present invention, it is possible to reduce the thickness of the printing pattern, and at the same time, prevent the occurrence of printing defects and the like and form a high-definition printing pattern. It has the outstanding effect that the plate for screen printing which can be manufactured easily.

  Furthermore, according to the method for manufacturing an electronic component using the screen printing plate according to the present invention, a printing pattern can be made thin, and at the same time, occurrence of printing defects and the like can be prevented and high-definition printing can be performed. A pattern can be formed, and an excellent effect that a small and highly characteristic electronic component can be provided is provided.

Screen printing plate according to the present invention, the intersection portion formed by crossing the two metal lines in metallic mesh, rolled by flattening and flat rolled flat portion formed by crushing the metal wire at least partially have been chamfered, surface roughness Ra of the metal mesh after chamfering, by Rukoto meet the 0.05 .mu.m ≦ Ra ≦ 0.2 [mu] m, it is obtained by solving the above problems.

  ADVANTAGE OF THE INVENTION According to this invention, the contact area of a printing surface and a metal mesh can be made small, and an electrode coating material can be made to go around easily on a printing surface. Therefore, while it is possible to reduce the thickness of the print pattern, at the same time, it is possible to prevent the occurrence of print defects and the like and form a high-definition print pattern.

  The “metal mesh” in the present invention includes, for example, a woven metal mesh obtained by weaving metal wires such as stainless steel, brass, phosphor bronze, and copper into a woven shape such as plain weave and twill weave. It is done.

  Further, the chamfering method of the rolled flat part is not particularly limited, but if at least a part of the rolled flat part is chamfered by polishing, the contact area between the printing surface and the metal mesh can be reduced and the rolled flat part. The smoothness of the electrode paint can be improved, and the electrode paint can be more easily wrapped around the printed surface. Examples of “polishing” in the present invention include viscous fluid polishing and chemical polishing (etching treatment).

  Furthermore, if the surface roughness Ra of the metal mesh after chamfering satisfies 0.05 μm ≦ Ra ≦ 0.2 μm, mask peeling can be prevented and squeegee wear during screen printing can be reduced. Variations in the thickness of subsequent printing patterns can be suppressed.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is an enlarged schematic plan view showing a part of a metal mesh of a screen printing plate according to the present embodiment. FIG. 1 (A) shows a state of the metal mesh subjected only to rolling. FIG. 4B is a schematic plan view showing a state of a metal mesh polished after rolling.

  In this example, a metal mesh for a screen printing plate was produced by the method described below.

  First, the metal wire 10 was woven into a woven fabric by plain weaving (weaving method in which the metal wires 10 are alternately crossed one by one) to obtain a metal mesh.

  Next, the metal wire 10 at the intersection of the metal mesh was crushed and flattened by rolling. By this rolling process, as shown in FIGS. 1A and 2A, a flat rolled flat portion 10A was formed at the intersection of the metal mesh. 2A is a diagram showing an outer edge of a cross section taken along line II (A) -II (A) in FIG.

  Further, by chamfering the rolled flat portion 10A of the metal mesh thus obtained by fluid polishing, a curved surface is formed on the surface of the rolled flat portion 10A as shown in FIGS. 1 (B) and 2 (B). Was held. 2B is a diagram showing an outer edge of a cross section taken along line II (B) -II (B) in FIG. 1B.

  Table 1 shows measured values of the thickness of the metal mesh and the wire diameter of the metal wire 10 after rolling and before polishing and after polishing.

  As apparent from Table 1, the thickness of the metal mesh after polishing is 3.3 μm thinner than the thickness of the metal mesh after rolling and before polishing, and according to the screen printing plate according to this example, It can be seen that the printing pattern can be made thinner than the conventional screen printing plate. It can also be seen that the wire diameter of the metal wire 10 after polishing is 0.6 μm thinner than the wire diameter of the metal wire 10 after polishing and before polishing.

  The inventors of the present invention prepared six types of metal meshes having different surface roughnesses (Ra), and conducted experiments on the relationship between surface roughness, mask peeling, and squeegee wear. For “mask peeling”, the squeegee was slid about 40,000 times on the mask (screen mask), and the case where the mask was peeled off was evaluated as “x”, and the case where the mask was not peeled off was evaluated as “◯”. In addition, “squeegee wear” was evaluated as ○ when the thickness variation of the printed pattern after printing was less than 4%, Δ when 4% or more and less than 6%, and × when 6% or more. In addition, the unit of the surface roughness (Ra) in Table 2 is μm, and the measured value is an average value obtained by measuring 10 different points on the surface of the metal mesh. The experimental results are shown in Table 2.

  As is clear from Table 2, when the surface roughness Ra of the metal mesh is 0.041 μm or less, the evaluation of the mask peeling is x, and when the surface roughness Ra of the metal mesh is 0.228 μm or more, squeegee wear is observed. Was evaluated as Δ and ×. That is, when the surface roughness Ra of the metal mesh satisfies 0.05 μm ≦ Ra ≦ 0.2 μm, mask peeling can be prevented and variation in the thickness of the printed pattern can be suppressed. It can be seen that good results are obtained for both mask peeling and squeegee wear.

  Furthermore, the inventor of the present invention produced (printed) an electrode pattern having the same shape using the screen printing plate according to the present example and the conventional screen printing plate subjected only to rolling. FIG. 3A is a schematic plan view of an end portion of an electrode pattern produced by using a conventional screen printing plate, and FIG. 3B is produced by using the screen printing plate according to this example. The schematic plan view of an electrode pattern edge part is shown.

  As a result of the experiment, as shown in FIG. 3 (A), a plurality of printing defects (edge irregularities) were seen in the electrode pattern produced using the conventional screen printing plate. In the conventional screen printing plate, when the rolled flat portion 10A of the metal mesh is located at the end of the electrode pattern, the flat rolled flat portion 10A prevents the electrode paint from sliding, and the electrode paint is printed. This is thought to be because it is difficult to go around the surface.

  On the other hand, in the screen printing plate according to the present embodiment, since the rolled flat portion 10A of the metal mesh is chamfered, the electrode paint easily goes around the printing surface, and as shown in FIG. It was confirmed that a high-definition electrode pattern without large printing defects can be formed as compared with a conventional screen printing plate.

  In the screen printing plate according to the present embodiment, the rolled flat portion is chamfered over substantially the entire area, but the present invention is not limited to this, and at least a part of the rolled flat portion is chamfered. I just need it. The shape of the chamfered portion is not limited to a curved surface. Further, the chamfering method is not limited to polishing.

  The screen printing plate according to the present invention is suitable for manufacturing electronic components such as a multilayer ceramic chip capacitor and a multilayer chip inductor.

(A) Schematic plan view showing a state of a metal mesh subjected only to rolling, (B) Schematic plan view showing a state of a metal mesh polished after rolling (A) The figure which showed the outer edge of the cross section which followed the II (A) -II (A) line in FIG. 1 (A), (B) It follows the II (B) -II (B) line in FIG. 1 (B). Figure showing the outer edge of the cross section (A) Schematic plan view of an electrode pattern end produced using a conventional screen printing plate, (B) Schematic plan view of an electrode pattern end produced using a screen printing plate according to this example

Explanation of symbols

10 ... Metal wire 10A ... Rolled flat part

Claims (5)

An intersection portion formed by crossing the two metal lines in metallic mesh, by rolling, at least a portion of the flat rolled flat portion formed by flattening and crushing the metal wires have been chamfered, surface roughness Ra of the metal mesh after chamfering, screen printing plate characterized that you have met 0.05μm ≦ Ra ≦ 0.2μm. In claim 1,
A screen printing plate, wherein at least a part of the rolled flat portion is chamfered by polishing. An intersection portion formed by crossing the two metal lines in metallic mesh, rolling by the steps of forming a rolled flat portion of the flat and flattened by crushing the metal wire, the at least one of the rolling flat portion A method for producing a screen printing plate, comprising a step of chamfering so that a surface roughness Ra of the metal mesh after chamfering a portion satisfies 0.05 μm ≦ Ra ≦ 0.2 μm . In claim 3 ,
A method for producing a screen printing plate, wherein at least a part of the rolled flat portion is chamfered by polishing. Electronic component manufacturing method, characterized by producing an electronic component using a screen printing plate according to claim 1 or 2.

Images