JP4649249B2 - Method for manufacturing conductive pattern substrate and conductive pattern substrate - Google Patents

Description

  The present invention relates to a method of manufacturing a conductive pattern substrate having a desired circuit pattern, and in particular, to manufacture a conductive pattern substrate as a multilayer substrate in which a plurality of conductive layers having a predetermined conductive pattern are laminated. The present invention relates to a method for manufacturing a conductive pattern substrate and a conductive pattern substrate suitable for the above.

  Conventionally, the following method (first method) is known as a method for manufacturing this type of conductive pattern substrate. That is, in this first method, first, a photosensitive resin that is sensitive to ultraviolet rays is applied onto a base substrate on which a conductive layer (lower conductive layer) having a predetermined conductive pattern is formed. To form an insulating layer. Next, a desired portion of this insulating layer is exposed by a photographic method to form a through hole, and then electroplating is performed on the upper surface of the insulating layer to form a plated layer (upper conductive layer) having a predetermined conductive pattern In addition, a plating layer is formed on the inner peripheral surface of the through hole. Thus, a conductive pattern substrate is manufactured in which the lower conductive layer and the upper conductive layer are connected via the plating layer in the through hole.

Moreover, the following 2nd method is also known (refer patent document 1). That is, in the second method, first, an insulating layer is formed by applying a resin dissolved by an excimer laser on a base substrate on which a conductive layer (lower conductive layer) having a predetermined conductive pattern is formed. At the same time, the copper foil in which small holes for through holes are formed is fixed by thermocompression bonding. Next, after excimer laser is irradiated from the upper surface of the copper foil toward the small hole to form a through hole in the insulating layer, the surface of the copper foil on the insulating layer and the surface of the through hole formed in the insulating layer are formed. Electroplating or the like is performed to form a plating layer (upper conductive layer) having a predetermined conductive pattern. Thus, a conductive pattern substrate in which the lower conductive layer and the upper conductive layer are connected via the plating layer in the through hole is manufactured.
JP-A-6-45760

  However, in the above-described conventional method for manufacturing a conductive pattern substrate, in the first method, the through hole is formed by a photographic method, so the inner diameter of the through hole is determined by the resolution of the photosensitive resin. There is a problem that high resolution cannot be obtained with respect to the size of the through hole, and the mounting density of the conductive pattern substrate cannot be increased.

  Moreover, in the second method, although problems caused by the photographic method as described above do not occur, operations such as preparation of copper foil in which small holes for through holes are formed and fixation of the copper foil to the insulating layer There is a problem that manufacturing time and manufacturing cost are increased.

  The present invention has been made in view of the above points, and is a conductive pattern substrate having a desired circuit pattern (conductivity as a multilayer substrate in which a plurality of conductive layers having a predetermined conductive pattern are laminated). It is an object of the present invention to provide a conductive pattern substrate manufacturing method and a conductive pattern substrate, which can manufacture a pattern substrate or the like) with high accuracy, simply and inexpensively.

  The present invention provides, as a first solution, an electrically conductive first layer having a predetermined conductive pattern and an electrically insulating second layer formed so as to cover the first layer. A pattern substrate original plate, wherein the first layer and the second layer are made of a material that can be melted by heat generated by laser light, and at least one of the first layer and the second layer is the laser light. A first step of preparing a conductive pattern substrate original plate having a light absorptivity that absorbs light of the oscillation wavelength and generates heat, and the first step of the conductive pattern substrate original plate prepared in the first step. By irradiating a desired portion of the first layer or a corresponding portion of the second layer corresponding to the desired portion of the first layer from at least one side of the one layer and the second layer, An electrically conductive melting part is formed at the corresponding part. A conductive pattern substrate, wherein the desired portion of the first layer is electrically connected to the outside through the melted portion formed in the corresponding portion of the second layer. And a second step of producing a conductive pattern substrate. A method for manufacturing a conductive pattern substrate is provided.

  In the first solving means described above, the material of the first layer and the material of the second layer are melted and mixed in the melting part formed at the corresponding portion of the second layer. It is preferably formed by.

  As a second solution, the present invention provides an electrically conductive first layer having a predetermined conductive pattern, an electrically insulating second layer formed so as to cover the first layer, and the second An electrically conductive pattern substrate original plate having a predetermined conductive pattern formed to cover the layer, and having the predetermined conductive pattern, the first layer, the second layer, and the third layer Is made of a material that can be melted by heat generated by laser light, and at least one of the first layer, the second layer, and the third layer absorbs light having the oscillation wavelength of the laser light and generates heat. A first step of preparing a conductive pattern substrate original plate having absorbency, and at least one of the first layer and the third layer of the conductive pattern substrate original plate prepared in the first step From one side to the desired part of the first layer or correspondingly before A conductive pattern substrate in which a corresponding portion of the second layer or a corresponding portion of the third layer is irradiated with laser light to form an electrically conductive melted portion in the corresponding portion of the second layer. Then, the conductive pattern substrate in which the desired portion of the first layer and the corresponding portion of the third layer are electrically connected via the melting portion formed at the corresponding portion of the second layer. The manufacturing method of a conductive pattern board | substrate characterized by including the 2nd process of producing this.

  In the second solving means described above, the melted portion formed at the corresponding portion of the second layer is composed of the material of the first layer, the material of the second layer, and the material of the third layer. It is preferably formed by melting and mixing.

  In the second solving means described above, the third step of forming an electrically insulating fourth layer so as to cover the third layer of the conductive pattern substrate manufactured in the second step is performed. Furthermore, it is preferable to include.

  In this case, as a first aspect, the fourth layer of the conductive pattern substrate manufactured in the third step is made of a material that can be melted by heat generated by the laser beam, and the third layer and At least one of the fourth layers has a light absorptivity that absorbs light having an oscillation wavelength of the laser light and generates heat, and the third layer is formed from the fourth layer side of the conductive pattern substrate. A conductive pattern substrate in which an electrically conductive melted portion is formed in the corresponding part of the fourth layer by irradiating a laser beam to a desired part or a corresponding part of the fourth layer corresponding thereto. And producing a conductive pattern substrate in which the desired portion of the third layer can be electrically connected to the outside through the melting portion formed in the corresponding portion of the fourth layer. It is preferable to further include the process. In addition, it is preferable that the said fusion | melting part formed in the said corresponding | compatible site | part of the said 4th layer is formed when the material of the said 3rd layer and the material of the said 4th layer are fuse | melted and mixed.

  As a second aspect, in the third step, the fourth layer is formed so as to cover the third layer of the conductive pattern substrate, and predetermined conductivity is provided so as to cover the fourth layer. An electrically conductive fifth layer having a pattern is formed, and the fourth layer and the fifth layer of the conductive pattern substrate manufactured in the third step are meltable by heat generated by the laser beam. And at least one of the third layer, the fourth layer, and the fifth layer has a light absorptivity to generate heat by absorbing light having an oscillation wavelength of the laser light, and the conductive property. By irradiating a desired part of the third layer or a corresponding part of the fourth layer or a corresponding part of the fifth layer corresponding to the desired part of the third layer from the fifth layer side of the pattern substrate, There is an electrically conductive melting part in the corresponding part of the four layers. In the conductive pattern substrate formed, the desired portion of the third layer and the corresponding portion of the fifth layer are electrically connected via the melted portion formed at the corresponding portion of the fourth layer. Preferably, the method further includes a fourth step of fabricating electrically connected conductive pattern substrates. The melting portion formed at the corresponding portion of the fourth layer is formed by melting and mixing the material of the third layer, the material of the fourth layer, and the material of the fifth layer. It is preferred that

  As a third solution, the present invention provides an electrically conductive first layer having a predetermined conductive pattern and an electrically insulating second layer formed so as to cover the first layer. An original substrate for a pattern substrate, wherein the first layer and the second layer are made of a material that can be melted by heat generated by laser light, and in at least one of the first layer and the second layer, While only the layer part located in the desired part of the first layer or the corresponding part of the second layer corresponding to the first layer has the light absorptivity that absorbs light of the oscillation wavelength of the laser light and generates heat, A first step of preparing a conductive pattern substrate original plate having a light transmitting property in which a layer portion transmits the laser light; and the first layer of the conductive pattern substrate original plate prepared in the first step And at least one side of the second layer Is a conductive pattern substrate in which an electrically conductive melted portion is formed at the corresponding portion of the second layer by irradiating laser light, and the melt formed at the corresponding portion of the second layer. A second step of producing a conductive pattern substrate in which the desired portion of the first layer and the outside can be electrically connected via a section. A manufacturing method is provided.

  In the third solving means described above, the material of the first layer and the material of the second layer are melted and mixed in the melting part formed at the corresponding portion of the second layer. It is preferably formed by.

  As a fourth solution, the present invention provides an electrically conductive first layer having a predetermined conductive pattern, an electrically insulating second layer formed so as to cover the first layer, and the second An electrically conductive pattern substrate original plate having a predetermined conductive pattern formed to cover the layer, and having the predetermined conductive pattern, the first layer, the second layer, and the third layer Is made of a material that can be melted by heat generated by laser light, and in at least one of the first layer, the second layer, and the third layer, the desired portion of the first layer or the corresponding portion Only the layer part located in the corresponding part of the second layer or the corresponding part of the third layer absorbs light of the oscillation wavelength of the laser light and generates light, while the other layer parts Substrate for conductive pattern substrate having optical transparency to transmit laser beam By irradiating a laser beam from at least one side of the first layer and the third layer of the conductive pattern substrate original plate prepared in the first step and the first step to be prepared, A conductive pattern substrate in which an electrically conductive melted part is formed at the corresponding part of the second layer, and the first layer passes through the melted part formed at the corresponding part of the second layer. And a second step of producing a conductive pattern substrate in which the desired portion and the corresponding portion of the third layer corresponding to the desired portion are electrically connected to each other. I will provide a.

  In the fourth solution described above, the melted portion formed at the corresponding portion of the second layer is composed of the material of the first layer, the material of the second layer, and the material of the third layer. It is preferably formed by melting and mixing.

  Moreover, in the 4th solution means mentioned above, as said 1st aspect, the said electroconductive pattern board | substrate original plate prepared at the said 1st process is the electrical insulation formed so that the said 3rd layer might be covered. The fourth layer is made of a material that can be melted by heat generated by the laser beam, and at least one of the third layer and the fourth layer includes the third layer. While only the layer part located in the desired part of the layer or the corresponding part of the fourth layer corresponding to the layer has the light absorptivity that absorbs the light of the oscillation wavelength of the laser light and generates heat, the other layer parts Is transmissive to transmit the laser beam, and in the second step, the laser beam is irradiated from at least one of the first layer and the fourth layer of the conductive pattern substrate original plate. The pair of the second layer A conductive pattern substrate in which an electrically conductive melted part is formed in the corresponding part of the part and the fourth layer, and the first part through the melted part formed in the corresponding part of the second layer. The desired portion of the layer and the corresponding portion of the third layer corresponding thereto are electrically connected, and the third layer of the third layer is connected to the corresponding portion of the fourth layer via the melting portion. It is preferable to produce a conductive pattern substrate in which the desired portion and the outside can be electrically connected. The melting portion formed at the corresponding portion of the second layer is formed by melting and mixing the material of the first layer, the material of the second layer, and the material of the third layer. In addition, it is preferable that the melting portion formed at the corresponding portion of the fourth layer is formed by melting and mixing the material of the third layer and the material of the fourth layer. Moreover, it is preferable that the light absorbing layer portions of the first layer to the fourth layer are arranged so as not to overlap each other when viewed from the laser light irradiation direction.

  Further, in the above-described fourth solving means, as a second aspect, the conductive pattern substrate original plate prepared in the first step is electrically insulated so as to cover the third layer. And an electrically conductive fifth layer having a predetermined conductive pattern formed so as to cover the fourth layer, wherein the fourth layer and the fifth layer are It is made of a material that can be melted by heat generated by laser light, and in at least one of the third layer, the fourth layer, and the fifth layer, a desired portion of the third layer or the corresponding portion of the third layer. Only the layer part located at the corresponding part of the four layers or the corresponding part of the fifth layer absorbs light of the oscillation wavelength of the laser light and generates heat, while the other layer part is the laser. It has a light transmissive property to transmit light, and the second step Then, by irradiating laser light from at least one side of the first layer and the fifth layer of the conductive pattern substrate original plate, the corresponding portion of the second layer and the fourth layer A conductive pattern substrate in which an electrically conductive melted part is formed in a corresponding part, and the desired part of the first layer and the desired part through the melted part formed in the corresponding part of the second layer The corresponding part of the third layer is electrically connected, and the desired part of the third layer corresponds to the corresponding part through the melting part formed in the corresponding part of the fourth layer. It is preferable to manufacture a conductive pattern substrate in which the corresponding portion of the fifth layer is electrically connected. The melting portion formed at the corresponding portion of the second layer is formed by melting and mixing the material of the first layer, the material of the second layer, and the material of the third layer. The melted portion formed at the corresponding portion of the fourth layer is formed by melting and mixing the material of the third layer, the material of the fourth layer, and the material of the fifth layer. It is preferred that Moreover, it is preferable that the layer part which has a light absorptivity among the said 1st layer thru | or said 5th layer is arrange | positioned so that it may not mutually overlap seeing from the irradiation direction of a laser beam.

  As a fifth solution, the present invention includes an electrically conductive first layer having a predetermined conductive pattern, and an electrically insulating second layer formed so as to cover the first layer, The second layer is formed with an electrically conductive melting portion for enabling electrical connection between a desired portion of the first layer and the outside, and the melting portion is heated by the laser beam to generate the first portion. A conductive pattern substrate is provided, wherein the layer material and the second layer material are melted and mixed.

  The fifth solution described above further includes an electrically conductive third layer having a predetermined conductive pattern formed so as to cover the second layer, and is formed on the second layer. The melted portion electrically connects the desired portion of the first layer and the corresponding portion of the third layer corresponding thereto, and the first layer material and the first layer are generated by heat generated by laser light. Preferably, the two-layer material and the third-layer material are formed by melting and mixing. In this case, an electric insulating fourth layer formed so as to cover the third layer is further provided, and a desired portion of the third layer and the outside can be electrically connected to the fourth layer. An electrically conductive melting part is formed, and this melting part is formed by melting and mixing the material of the third layer and the material of the fourth layer by heat generated by laser light. It is preferable. In addition, an electric conductive fifth layer having a predetermined conductive pattern is formed so as to cover the fourth layer, and the melted portion formed in the fourth layer includes the third layer. The desired portion and the corresponding portion of the fifth layer corresponding to the desired portion are electrically connected, and the third layer material, the fourth layer material, and the fifth layer are heated by laser light. It is preferably formed by melting and mixing the material.

  In the fifth solution described above, at least one of the first conductive layer, the third layer, and the fifth layer may be connected to an external electrode at an outer peripheral end thereof. It is preferable that the outer peripheral end portion is exposed from the outer peripheral end portions of the second and fourth layers that are electrically insulating so as to be able to do so.

  According to the first solution of the present invention, a conductive material having an electrically conductive first layer having a predetermined conductive pattern and an electrically insulating second layer formed so as to cover the first layer. The first layer and the second layer are made of a material that can be melted by heat generated by the laser beam, and at least one of the first layer and the second layer has an oscillation wavelength of the laser beam. A conductive pattern substrate master having a light absorption property that absorbs light and generates heat is prepared, and then the first layer and at least one of the first and second layers of the prepared conductive pattern substrate master Laser light is irradiated to a desired portion of one layer or a corresponding portion of the second layer corresponding thereto. As a result, the desired portion of the first layer irradiated with the laser light or the corresponding portion of the second layer corresponding to the first layer absorbs light of the oscillation wavelength of the laser light and generates heat, and the desired portion of the first layer and Corresponding portions of the second layer corresponding thereto are melted, and a melted portion having electrical conductivity is formed at the corresponding portions of the second layer. For this reason, a solidified and electrically conductive melted portion electrically connected to the first layer is formed at an arbitrary location on the surface of the second layer, and finally, it is easily formed on the external electrode. A conductive pattern substrate having a single circuit pattern that can be connected can be manufactured accurately, simply, and inexpensively.

  According to the second solution of the present invention, an electrically conductive first layer having a predetermined conductive pattern, an electrically insulating second layer formed so as to cover the first layer, An electrically conductive pattern substrate original plate having an electrically conductive third layer having a predetermined conductive pattern formed so as to cover two layers, wherein the first layer, the second layer, and the third layer are lasers It is made of a material that can be melted by heat generated by light, and at least one of the first layer, the second layer, and the third layer absorbs light having the oscillation wavelength of the laser beam and generates heat to generate heat. A pattern substrate original plate is prepared, and then a desired portion of the first layer or a corresponding portion from at least one side of the first layer and the third layer of the conductive pattern substrate original plate thus prepared. Laser light is applied to the corresponding part of the second layer or the corresponding part of the third layer. Cum to. As a result, the desired portion of the first layer irradiated with the laser light or the corresponding portion of the second layer or the corresponding portion of the third layer corresponding to the first layer absorbs the light having the oscillation wavelength of the laser light and generates heat. The desired part of one layer and the corresponding part of the second layer and the corresponding part of the third layer are melted, and a melted molten portion showing electrical conductivity is formed in the corresponding part of the second layer. For this reason, a solidified and electrically conductive melted portion that electrically connects the first layer and the third layer is formed at an arbitrary position of the second layer, and finally, in the external electrode. A conductive pattern substrate having a two-layer circuit pattern that can be easily connected can be manufactured accurately, simply, and inexpensively.

  According to the second solving means of the present invention, similarly, on the third layer, an electrically conductive layer and an electrically insulating layer having appropriate light characteristics (light absorption or light transmission). It is possible to form an electrically conductive melted part that connects adjacent conductive layers by irradiating laser light each time while further laminating layers, thereby having a multi-layer circuit pattern. A conductive pattern substrate (super multi-layer substrate) can be easily manufactured.

  According to the third solution of the present invention, a conductive material having an electrically conductive first layer having a predetermined conductive pattern and an electrically insulating second layer formed so as to cover the first layer. The first layer and the second layer are made of a material that can be melted by heat generated by laser light, and at least one of the first layer and the second layer is the first layer and the second layer. Only the layer portion located at the desired portion or the corresponding portion of the second layer corresponding to the desired portion absorbs light of the oscillation wavelength of the laser light and generates light, while the other layer portions are the laser. A conductive pattern substrate original plate having light transmittance that transmits light is prepared, and then laser light is irradiated from at least one of the first layer and the second layer of the prepared conductive pattern substrate original plate. To do. Thereby, the light-absorbing part located in the desired part or the corresponding part corresponding to the first layer or the second layer irradiated with the laser light absorbs the light having the oscillation wavelength of the laser light and generates heat, A desired portion of the first layer and a corresponding portion of the second layer corresponding to the first layer are melted, and a melted molten portion showing electrical conductivity is formed at the corresponding portion of the second layer. For this reason, a solidified and electrically conductive melted portion electrically connected to the first layer is formed at an arbitrary location on the surface of the second layer, and finally, it is easily formed on the external electrode. A conductive pattern substrate having a single circuit pattern that can be connected can be manufactured accurately, simply, and inexpensively.

  According to the fourth solving means of the present invention, an electrically conductive first layer having a predetermined conductive pattern, an electrically insulating second layer formed so as to cover the first layer, An electrically conductive pattern substrate original plate having an electrically conductive third layer having a predetermined conductive pattern formed so as to cover two layers, wherein the first layer, the second layer, and the third layer are lasers It is made of a material that can be melted by heat generated by light, and in at least one of the first layer, the second layer, and the third layer, a desired part of the first layer or a corresponding part of the second layer corresponding thereto, or Only the layer portion located at the corresponding portion of the third layer absorbs light of the oscillation wavelength of the laser light and has a light absorption property that generates heat, while the other layer portions have a light transmission property that transmits the laser light. Prepare a conductive pattern substrate blank, and then prepare the conductive pattern substrate Irradiating a laser beam from at least one side of one of the first and third layers of use original plate. As a result, the light-absorbing portion located at a desired site or a corresponding site corresponding to the first layer, the second layer, or the third layer irradiated with the laser beam absorbs light having the oscillation wavelength of the laser beam. The desired part of the first layer and the corresponding part of the second layer and the corresponding part of the third layer are melted, and the corresponding melted part showing electrical conductivity is present in the corresponding part of the second layer. It is formed. For this reason, a solidified and electrically conductive melted portion that electrically connects the first layer and the third layer is formed at an arbitrary position of the second layer, and finally, in the external electrode. A conductive pattern substrate having a two-layer circuit pattern that can be easily connected can be manufactured accurately, simply, and inexpensively.

  According to the fourth solving means of the present invention, an electrically conductive layer having an appropriate light characteristic (light absorption or light transmission) and an electric layer on the third layer as the conductive pattern substrate original plate. If a conductive pattern substrate original plate on which an insulating layer is further laminated is used, a conductive pattern substrate (super multi-layer substrate) having a multi-layer circuit pattern can be easily manufactured. In this case, even if the number of conductive layers and insulating layers is increased, the conductive pattern substrate can be manufactured by performing laser light irradiation only once after preparing the conductive pattern substrate original plate. The manufacturing process is very simple.

  According to the fifth solution of the present invention, a highly accurate conductive pattern substrate having a desired circuit pattern (a conductive pattern as a multilayer substrate formed by laminating a plurality of conductive layers having a predetermined conductive pattern) Substrate etc.) can be provided easily and inexpensively.

BEST MODE FOR CARRYING OUT THE INVENTION

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
First, a method for manufacturing a conductive pattern substrate according to the first embodiment of the present invention will be described with reference to FIGS.

  As shown in FIG. 1 (a), first, an electrically conductive paint is applied in a predetermined conductive pattern (circuit pattern) on a base substrate 20 made of a glass plate, and further electrically insulated thereon. A conductive pattern substrate original plate 10A ′ having a conductive layer 11 having a predetermined conductive pattern and an insulating layer 12 formed so as to cover the conductive layer 11 is prepared by applying a conductive paint on the entire surface. . Here, both of the conductive layer 11 and the insulating layer 12 are made of a material (paint) that can be melted by heat generated by a laser beam 25 described later. In addition, the conductive layer 11 has a light absorptivity that absorbs light having the oscillation wavelength of the laser light 25 and generates heat, while the insulating layer 12 has a light transmittance that transmits the laser light 25. In addition, it is preferable to use a conductive paste as the electrically conductive and light absorbing paint for forming the conductive layer 11. Moreover, as an electrically insulating and light-transmitting coating material for forming the insulating layer 12, it is preferable to use polyimide resin, epoxy resin, or the like.

  Next, as shown in FIG. 1 (b), a desired portion of the conductive layer 11 is irradiated with laser light 25 from the insulating layer 12 side of the conductive pattern substrate original plate 10A 'prepared as described above. . At this time, the insulating layer 12 transmits the laser beam 25, but the conductive layer 11 absorbs the laser beam 25, so that a desired portion of the conductive layer 11 irradiated with the laser beam 25 has an oscillation wavelength of the laser beam 25. It absorbs light and generates heat. As a result, a desired portion of the conductive layer 11 and a corresponding portion of the insulating layer 12 corresponding to the desired portion are melted, and a molten portion 21 a in a molten state is formed at the corresponding portion of the insulating layer 12. Here, the melting part 21a is formed by melting and mixing the material of the conductive layer 11 and the material of the insulating layer 12, and exhibits electrical conductivity. In this case, by appropriately adjusting the material of the conductive layer 11 and the material of the insulating layer 12, or using a material that evaporates due to heat generated by the laser light 25 as the material of the insulating layer 12, the melting portion 21a can be more reliably electrically connected. It is also possible to show conductivity.

  Here, as a laser welding apparatus suitable for irradiating a desired portion of the conductive layer 11 of the conductive pattern substrate original plate 10A ′ with the laser light 25, a laser oscillator that emits laser light and a laser oscillator are used. The emitted laser light is guided to a predetermined processing point on the plane of the conductive pattern substrate original plate 10A ′, and is used as a material for the conductive layer 11 and the insulating layer 12 of the conductive pattern substrate original plate 10A ′, which is a workpiece. It is possible to use a processing optical system that focuses light to an appropriate energy density and a moving mechanism that moves a processing point on the plane of the conductive pattern substrate original plate 10A ′ by moving the processing optical system. .

  Then, with such a laser welding apparatus, when irradiation of the laser beam 25 is continued until the melted portion 21a formed at the corresponding portion of the insulating layer 12 becomes sufficiently large, the melted portion 21a connected to the conductive layer 11 is obtained. Will be exposed to the surface of the insulating layer 12. Thereafter, when the melted portion 21a in the molten state is cooled, the solidified and electrically conductive melted portion 21 electrically connected to the conductive layer 11 is formed at any location on the surface of the insulating layer 12. .

  As a result, as shown in FIG. 1C, the conductive layer 11 having a single conductive pattern having a conductive layer 11 having a predetermined conductive pattern and an insulating layer 12 formed so as to cover the conductive layer 11 is formed. In the pattern substrate 10A, a desired portion of the conductive layer 11 and the outside can be electrically connected through a melted portion 21 that is solidified and formed in a corresponding portion of the insulating layer 12. A conductive pattern substrate 10A is produced.

  Thus, according to the first embodiment of the present invention, first, for a conductive pattern substrate having a conductive layer 11 having a predetermined conductive pattern and an insulating layer 12 formed so as to cover the conductive layer 11. The original plate 10A ′, in which the conductive layer 11 and the insulating layer 12 are made of a material that can be melted by heat generated by the laser light 25, and the conductive layer 11 has a light absorption property while the insulating layer 12 has a light transmission property. A conductive pattern substrate original plate 10A 'is prepared. Next, the laser beam 25 is irradiated to a desired portion of the conductive layer 11 from the insulating layer 12 side of the conductive pattern substrate original plate 10A ′ prepared in this manner. As a result, the desired portion of the conductive layer 11 irradiated with the laser light 25 absorbs the light having the oscillation wavelength of the laser light 25 and generates heat, and the desired portion of the conductive layer 11 and the corresponding insulating layer 12 correspond thereto. The part is melted, and a molten part 21 a in a molten state showing electrical conductivity is formed at a corresponding part of the insulating layer 12. Then, when the laser beam 25 is continuously irradiated until the melted portion 21a formed at the corresponding portion of the insulating layer 12 becomes sufficiently large and then cooled, the conductive layer 11 is formed at an arbitrary position on the surface of the insulating layer 12. The electrically connected solidified and electrically conductive melting portion 21 is formed. As described above, the conductive pattern substrate 10A having a single circuit pattern that can be easily connected to the external electrode can be manufactured with high accuracy, in a simple manner, and at a low cost.

  In the first embodiment described above, the case where the conductive layer 11 has a light absorption property and the insulating layer 12 has a light transmissive property has been described as an example. It suffices that at least one of them has light absorptivity. In addition to the case where both the conductive layer 11 and the insulating layer 12 have a light absorptivity, the conductive layer 11 has a light transmitting property while the insulating layer 12 has a light absorbing property. In the case of having an absorptivity, it can be similarly applied. In this latter case, when the corresponding portion of the insulating layer 12 corresponding to the desired portion of the conductive layer 11 is irradiated with the laser beam 25, the insulating layer 12 emits light having the oscillation wavelength of the laser beam 25. As a result, the desired portion of the conductive layer 11 and the corresponding portion of the insulating layer 12 corresponding thereto are melted. For this reason, if the thickness of the insulating layer 12 is adjusted as appropriate, a melted portion 21a that is electrically connected to the conductive layer 11 and exposed to the surface of the insulating layer 12 is formed at a corresponding portion of the insulating layer 12, and finally Accordingly, a solidified and electrically conductive melting portion 21 electrically connected to the conductive layer 11 is formed at an arbitrary position on the surface of the insulating layer 12.

  Further, in the first embodiment described above, the laser beam 25 is irradiated from the insulating layer 12 side of the conductive pattern substrate original plate 10A ′, but the base substrate 20 is made of a material that transmits the laser beam 25. If it is, as shown in FIG. 2, you may irradiate the laser beam 25 from the conductive layer 11 side (namely, base substrate 20 side). Furthermore, you may irradiate the laser beam 25 from both sides of the insulating layer 12 side and the conductive layer 11 side (base substrate 20 side) of the conductive pattern substrate original plate 10A ′.

  Furthermore, in the first embodiment described above, the base substrate 20 is not necessarily made of a glass plate, and a plate material or a film material made of glass epoxy resin or the like can be used. The base substrate 20 is generally preferably electrically insulative, but need not necessarily be electrically insulative depending on the application.

  Furthermore, in the first embodiment described above, the conductive layer 11 and the insulating layer 12 of the conductive pattern substrate original plate 10A ′ are both coated (printed) on the base substrate 20 or the conductive layer 11. Although formed, it is not restricted to this, You may form by laminating | stacking on the base base material 20 the resin board or resin film which has a desired external shape and electroconductive pattern. Furthermore, the insulating layer 12 may be formed as a metal layer (metal circuit) as long as the layer does not need to have light transmittance.

  Furthermore, in the first embodiment described above, the base substrate 20, the conductive layer 11, and the insulating layer 12 of the conductive pattern substrate original plate 10 </ b> A ′ are all formed in a planar shape. It may be formed in a curved surface shape.

  Furthermore, in the above-described first embodiment, the case where a plurality of layers (conductive layer 11 and insulating layer 12) are formed on one base substrate 20 has been described as an example. If the conductive layer 11 and the insulating layer 12 of the conductive pattern substrate 10 to be manufactured are configured to be bonded to each other, each layer (conductive layer and insulating layer) is separated into each of a plurality of base substrates. Layer) may be formed.

  Further, in the above-described first embodiment, the conductive pattern is formed in such a manner that the laser beam 25 is guided to a predetermined processing point on the plane of the conductive pattern substrate original plate 10A ′ by the laser welding apparatus having the above-described configuration. The laser beam 25 is selectively irradiated only on a desired portion of the conductive layer 11 of the substrate original plate 10A ′. However, the present invention is not limited to this, and the laser is directed toward the entire surface of the conductive pattern substrate original plate 10A ′. While the light 25 is guided, a desired object of the conductive layer 11 of the conductive pattern substrate original plate 10A ′ is arranged in such a manner that a shield (reflection mask or the like) that reflects or absorbs the laser light 25 is disposed on the optical path. Alternatively, the laser beam 25 may be selectively irradiated only on the part.

(Second Embodiment)
Next, a method for manufacturing a conductive pattern substrate according to the second embodiment of the present invention will be described with reference to FIGS. The basic configuration of the second embodiment of the present invention is as shown in FIG. 1 except that the finally manufactured conductive pattern substrate is a conductive pattern substrate having a two-layer circuit pattern. a) to (c) and substantially the same as the first embodiment shown in FIG. In the second embodiment shown in FIGS. 3 (a) to 3 (f), the same parts as those in the first embodiment shown in FIGS. 1 (a) to (c) and FIG. Description is omitted.

  As shown in FIG. 3 (a), first, an electrically conductive paint is applied in a predetermined conductive pattern (circuit pattern) on a base substrate 20 made of a glass plate, and further electrically insulated thereon. The conductive layer 11 having a predetermined conductive pattern and the conductive layer 11 are formed by applying a conductive paint on the entire surface, and further applying an electrically conductive paint in a predetermined conductive pattern (circuit pattern). A conductive pattern substrate original plate 10B ′ having an insulating layer 12 formed so as to cover the conductive layer and a conductive layer 13 formed so as to cover the insulating layer 12 and having a predetermined conductive pattern is prepared. Here, each of the conductive layers 11 and 13 and the insulating layer 12 is made of a material (paint) that can be melted by heat generated by the laser beam 25. In addition, the conductive layer 11 has a light absorptivity that absorbs light of the oscillation wavelength of the laser light 25 and generates heat, while the insulating layer 12 and the conductive layer 13 have a light transmittance that transmits the laser light. . In addition, it is preferable to use a conductive paste as the electrically conductive and light absorbing paint for forming the conductive layer 11. Moreover, as an electrically insulating and light-transmitting coating material for forming the insulating layer 12, it is preferable to use polyimide resin, epoxy resin, or the like. Furthermore, it is preferable to use a conductive paste as the electrically conductive and light transmissive coating material for forming the conductive layer 13.

  Next, as shown in FIG. 3B, a desired portion of the conductive layer 11 is irradiated with laser light 25 from the conductive layer 13 side of the conductive pattern substrate original plate 10B ′ prepared as described above. . At this time, the insulating layer 12 and the conductive layer 13 transmit the laser beam 25, but the conductive layer 11 absorbs the laser beam 25, so that a desired portion of the conductive layer 11 irradiated with the laser beam 25 is the laser beam 25. It absorbs light of the oscillation wavelength and generates heat. As a result, a desired portion of the conductive layer 11, a corresponding portion of the insulating layer 12 corresponding thereto, and a corresponding portion of the conductive layer 13 are melted, and a molten portion 21 a is formed in the corresponding portion of the insulating layer 12. Here, the melting part 21a is formed by melting and mixing the material of the conductive layers 11 and 13 and the material of the insulating layer 12, and exhibits electrical conductivity. In this case, the material of the conductive layers 11 and 13 and the material of the insulating layer 12 are appropriately adjusted, or the material of the insulating layer 12 is a material that evaporates due to heat generated by the laser beam 25, so that the melting portion 21a is more reliably secured. It is also possible to show electrical conductivity.

  Then, when irradiation with the laser beam 25 is continued until the melted portion 21a formed at the corresponding portion of the insulating layer 12 becomes sufficiently large, the melted portion 21a is connected so as to connect between the conductive layer 11 and the conductive layer 13. Will be formed. Thereafter, when the melted portion 21a in the molten state is cooled, a solidified and electrically conductive melted portion 21 that electrically connects the conductive layer 11 and the conductive layer 13 is formed at an arbitrary portion of the insulating layer 12. Is done.

  As a result, as shown in FIG. 3C, the conductive layer 11 having a predetermined conductive pattern, the insulating layer 12 formed so as to cover the conductive layer 11, and the insulating layer 12 were formed. A conductive pattern substrate 10B having a two-layer circuit pattern having a conductive layer 13 having a predetermined conductive pattern, and in a solidified state and electrically conductive melt formed at a corresponding portion of the insulating layer 12 A conductive pattern substrate 10B in which a desired portion of the conductive layer 11 and a desired portion of the conductive layer 13 are electrically connected via the portion 21 is manufactured.

  Thereafter, as shown in FIG. 3 (d), an electrically insulating paint is applied over the entire surface of the conductive layer 13 of the conductive pattern substrate 10B as necessary to insulate the conductive layer 13. The conductive pattern substrate 10C ′ on which the layer 14 is formed is produced. Here, the insulating layer 14 is made of a material (paint) that can be melted by heat generated by the laser beam 25. The insulating layer 14 has a light absorptivity that generates heat by absorbing light having the oscillation wavelength of the laser light 25. In addition, it is preferable to use a polyimide resin, an epoxy resin, or the like as an electrically insulating and light absorbing paint for forming the insulating layer 14.

  Then, as shown in FIG. 3 (e), a desired portion of the conductive layer 13 is irradiated again with laser light 25 from the insulating layer 14 side. At this time, since the insulating layer 14 absorbs the laser beam 25, when the laser beam 25 is irradiated to the corresponding portion of the insulating layer 14 corresponding to the desired portion of the conductive layer 13, the insulating layer 14 It absorbs light having an oscillation wavelength of 25 and generates heat. As a result, a desired portion of the conductive layer 13 and a corresponding portion of the insulating layer 14 corresponding thereto are melted, and a molten portion 21 a in a molten state is formed at the corresponding portion of the insulating layer 14. Here, the melting part 21a is formed by melting and mixing the material of the conductive layer 13 and the material of the insulating layer 14, and exhibits electrical conductivity. In this case, by appropriately adjusting the material of the conductive layer 13 and the material of the insulating layer 14 or using the material of the insulating layer 14 that evaporates due to the heat generated by the laser beam 25, the melting portion 21a can be more reliably electrically connected. It is also possible to show conductivity.

  When the irradiation of the laser beam 25 is continued until the melted portion 21a formed at the corresponding portion of the insulating layer 14 becomes sufficiently large, the melted portion 21a connected to the conductive layer 13 is exposed to the surface of the insulating layer 14. Will be. Thereafter, when the melted portion 21a in the molten state is cooled, the solidified and electrically conductive melted portion 21 electrically connected to the conductive layer 13 is formed at an arbitrary position on the surface of the insulating layer 14. .

  Thereby, as shown in FIG. 3 (f), the conductive layer 11 having a predetermined conductive pattern, the insulating layer 12 formed so as to cover the conductive layer 11, and the insulating layer 12 were formed. A conductive pattern substrate 10C having a two-layer circuit pattern having a conductive layer 13 having a predetermined conductive pattern and an insulating layer 14 formed so as to cover the conductive layer 13, The desired portion of the conductive layer 11 and the desired portion of the conductive layer 13 are electrically connected through the melted portion 21 that is solidified and formed at the corresponding portion, and the insulating layer 14 A conductive pattern substrate 10 </ b> C is formed in which the desired portion of the conductive layer 13 and the outside can be electrically connected through the melted portion 21 that is solidified and formed in the portion.

  As described above, according to the second embodiment of the present invention, first, the conductive layer 11 having a predetermined conductive pattern, the insulating layer 12 formed so as to cover the conductive layer 11, and the insulating layer 12 are covered. The conductive pattern substrate original plate 10B ′ having the conductive layer 13 having a predetermined conductive pattern formed on the conductive layer 11, 13 and the insulating layer 12 can be melted by heat generated by the laser beam 25. And a conductive pattern substrate base plate 10B ′ having the light absorption property while the conductive layer 11 is light-absorbing and the insulating layer 12 and the conductive layer 13 are light-transmissive. Next, the laser beam 25 is irradiated to a desired portion of the conductive layer 11 from the conductive layer 13 side of the conductive pattern substrate original plate 10B ′ prepared in this way. As a result, the desired portion of the conductive layer 11 irradiated with the laser light 25 absorbs the light having the oscillation wavelength of the laser light 25 and generates heat, and the desired portion of the conductive layer 11 and the corresponding insulating layer 12 correspond thereto. The part and the corresponding part of the conductive layer 13 are melted, and a molten part 21 a in a molten state showing electrical conductivity is formed in the corresponding part of the insulating layer 12. Then, when the laser beam 25 is continuously irradiated until the melted portion 21a formed in the corresponding portion of the insulating layer 12 becomes sufficiently large and then cooled, the conductive layer 11 and the conductive layer are formed at an arbitrary portion of the insulating layer 12. 13 is formed in a solidified and electrically conductive melted portion 21 that is electrically connected to 13. As described above, the conductive pattern substrate 10B having a two-layer circuit pattern that can be easily connected to the external electrode can be manufactured with high accuracy, simply, and inexpensively.

  In addition, according to the second embodiment of the present invention, as necessary, an electrically insulating paint is applied over the entire surface of the conductive layer 13 of the conductive pattern substrate 10B so as to cover the conductive layer 13. The conductive pattern substrate original plate 10C ′ having the insulating layer 14 formed thereon, the insulating layer 14 is made of a material that can be melted by heat generated by the laser beam 25, and the insulating layer 14 is light-conductive. A pattern substrate original plate 10C 'is prepared. Next, the laser beam 25 is irradiated again to a desired portion of the conductive layer 13 from the insulating layer 14 side of the conductive pattern substrate original plate 10C ′ thus prepared. As a result, the desired portion of the insulating layer 14 irradiated with the laser light 25 absorbs the light having the oscillation wavelength of the laser light 25 and generates heat, and the desired portion of the conductive layer 13 and the corresponding insulating layer 14 correspond to each other. The part is melted, and a molten part 21 a in a molten state showing electrical conductivity is formed at a corresponding part of the insulating layer 14. As described above, the conductive pattern substrate 10 </ b> C having a two-layer circuit pattern that can be easily connected to the external electrode can be manufactured accurately, simply, and inexpensively.

  In the second embodiment described above, the case where the conductive layer 11 has a light absorption property while the insulating layer 12 and the conductive layer 13 have a light transmission property has been described as an example. However, FIG. When the conductive pattern substrate 10B as shown in FIG. 4 is manufactured, it is sufficient that at least one of the conductive layer 11, the insulating layer 12, and the conductive layer 13 has a light absorption property. The same applies to any case where the layer 12 has a light absorption property while the conductive layer 13 has a light transmission property, and the conductive layer 11, the insulating layer 12, and the conductive layer 13 all have a light absorption property. Can be applied.

  In the second embodiment described above, the laser beam 25 is irradiated from the conductive layer 13 side of the conductive pattern substrate original plates 10B ′ and 10C ′. If it is made of a material that transmits the light 25, the laser light 25 may be irradiated from the conductive layer 11 side (that is, the base substrate 20 side). Further, the laser beam 25 may be irradiated from both sides of the conductive pattern substrate original plates 10B ′ and 10C ′ on the conductive layer 13 side and the conductive layer 11 side (base substrate 20 side).

  Furthermore, in the second embodiment described above, when the finally manufactured conductive pattern substrate is as shown in FIG. 3D, the surface of the conductive layer 13 is completely formed by the insulating layer 14. The external electrode (not shown) cannot be connected from the surface side of the conductive layer 13. Therefore, in this case, as shown in FIGS. 4A, 4B, and 4C, the conductive layer 11, the insulating layer 12, the conductive layer 13, and the insulating layer 14 of the conductive pattern substrate original plate 10D ′ are formed. A conductive pattern substrate 10D as shown in FIG. 4 (d) may be manufactured by forming the outer peripheral end portion in steps. In the conductive pattern substrate 10D thus manufactured, the outer peripheral ends of the conductive layers 11 and 13 are exposed from the outer peripheral ends of the insulating layers 12 and 14, and the outer peripheral ends of the conductive layers 11 and 13 are exposed. The external electrode 22 can be connected at.

  Furthermore, in the above-described second embodiment, the case where the conductive pattern substrates 10B, 10C, and 10D having the two-layer circuit pattern are manufactured has been described as an example. A conductive pattern substrate having a circuit pattern of the above layers can be manufactured in the same manner.

  Specifically, first, as shown in FIGS. 5A to 5C, the conductive layer 11 having a predetermined conductive pattern is formed by the same method as that shown in FIGS. 3A to 3C. A conductive layer having a two-layer circuit pattern, and an insulating layer 12 formed so as to cover the conductive layer 11 and a conductive layer 13 formed so as to cover the insulating layer 12 and having a predetermined conductive pattern. The pattern substrate 10B is produced.

  Next, an electrically insulating paint is applied to the entire surface of the conductive layer 13 of the conductive pattern substrate 10B thus manufactured, and an electrically conductive paint is further applied to the predetermined conductive pattern (circuit). The conductive pattern substrate in which the insulating layer 14 is formed so as to cover the conductive layer 13 and the conductive layer 15 having a predetermined conductive pattern is formed so as to cover the insulating layer 14. A master plate 10E ′ is produced. Here, both the insulating layer 14 and the conductive layers 13 and 15 are made of a material (paint) that can be melted by heat generated by the laser beam 25. The insulating layer 14 absorbs light having the oscillation wavelength of the laser beam 25 and generates heat. On the other hand, the conductive layers 13 and 15 have light transmittance that transmits the laser beam. In addition, as an electrically conductive and light-transmitting coating material for forming the conductive layer 15, it is preferable to use a conductive paste.

  Then, as shown in FIG. 5 (e), a desired portion of the conductive layer 13 is irradiated again with laser light 25 from the conductive layer 15 side. At this time, since the insulating layer 14 absorbs the laser beam 25, when the laser beam 25 is irradiated to the corresponding portion of the insulating layer 14 corresponding to the desired portion of the conductive layer 13, the insulating layer 14 It absorbs light having an oscillation wavelength of 25 and generates heat. As a result, a desired portion of the conductive layer 13, a corresponding portion of the insulating layer 14 corresponding thereto, and a corresponding portion of the conductive layer 15 are melted, and a molten portion 21 a in a molten state is formed at the corresponding portion of the insulating layer 14. Here, the melting part 21a is formed by melting and mixing the material of the conductive layers 13 and 15 and the material of the insulating layer 14, and exhibits electrical conductivity. In this case, the material of the conductive layers 13 and 15 and the material of the insulating layer 14 are appropriately adjusted, or by using a material that evaporates due to heat generated by the laser light 25 as the material of the insulating layer 14, the melting portion 21 a can be more reliably obtained. It is also possible to show electrical conductivity.

  Then, when irradiation with the laser beam 25 is continued until the melted portion 21a formed in the corresponding portion of the insulating layer 14 becomes sufficiently large, the melted portion 21a is connected so as to connect between the conductive layer 13 and the conductive layer 15. Will be formed. Thereafter, when the melted portion 21a in the molten state is cooled, a solidified and electrically conductive melted portion 21 that electrically connects the conductive layer 13 and the conductive layer 15 is formed at an arbitrary portion of the insulating layer 14. Is done.

  Thereby, as shown in FIG. 5 (f), the conductive layer 11 having a predetermined conductive pattern, the insulating layer 12 formed so as to cover the conductive layer 11, and the insulating layer 12 were formed. A conductive layer 13 having a predetermined conductive pattern, an insulating layer 14 formed so as to cover the conductive layer, and a conductive layer 15 having a predetermined conductive pattern formed so as to cover the insulating layer 14. A conductive pattern substrate 10E having a three-layer circuit pattern, which is formed in a corresponding portion of the insulating layer 12 in a solidified and electrically conductive melting portion 21 and has a desired portion; The desired portion of the conductive layer 13 is electrically connected to the desired portion of the conductive layer 13 and is electrically conductive with the desired portion of the conductive layer 13 through the electrically conductive melting portion 21 formed in the corresponding portion of the insulating layer 14. The desired part of the layer 15 is electrically connected Conductive pattern substrate 10E is formed.

  Thereafter, in the same manner, an electrically conductive melted portion connecting adjacent conductive layers is formed while a conductive layer and an insulating layer having appropriate light characteristics (light absorption or light transmission) are laminated. Thus, a conductive pattern substrate (super multi-layer substrate) having a multi-layer circuit pattern can be easily manufactured.

(Third embodiment)
Next, with reference to FIGS. 6A to 6C, a method for manufacturing a conductive pattern substrate according to the third embodiment of the present invention will be described. In the third embodiment of the present invention, the conductive layer of the conductive pattern substrate original plate has a light absorbing layer portion and a light transmissive layer portion, and the entire surface of the conductive pattern substrate original plate. The basic configuration is substantially the same as that of the first embodiment shown in FIGS. 1A to 1C and FIG. In the third embodiment shown in FIGS. 6 (a) to (c), the same parts as those in the first embodiment shown in FIGS. 1 (a) to (c) and FIG. Description is omitted.

  As shown in FIG. 6 (a), first, a conductive material having a predetermined conductive pattern is formed by alternately applying an electrically conductive paint and an electrically insulative paint on a base substrate 20 made of a glass plate. Conductive pattern substrate original plate 10F ′ having layers 11, 13, 15, 17 and insulating layers 12, 14, 16, 18 formed so as to cover each of these conductive layers 11, 13, 15, 17 Prepare. The conductive layers 11, 13, 15, and 17 are formed by applying an electrically conductive paint in a predetermined conductive pattern (circuit pattern), and the insulating layers 12, 14, 16, and 18 are electrically insulated. It is formed by applying a curable paint on the entire surface. Here, the insulating layers 12, 14, 16, and 18 are formed so as to have optical transparency. On the other hand, in the conductive layers 11, 13, 15, and 17, only the layer portions (light-absorbing portions 11b, 13b, 15b, and 17b) located at desired portions absorb the light having the oscillation wavelength of the laser light and generate heat. While having light absorptivity, other layer portions (light transmissive portions 11a, 13a, 15a, 17a) are formed to have light transmissive properties. Specifically, when applying paints for forming the conductive layers 11, 13, 15, and 17, two kinds of paints having different properties are applied according to the respective layer portions. In this case, the light absorbing portions 11 b, 13 b, 15 b, and 17 b of the conductive layers 11, 13, 15, and 17 are arranged so as not to overlap each other when viewed from the irradiation direction of the laser beam 25. Further, all of the conductive layers 11, 13, 15, 17 and the insulating layers 12, 14, 16, 18 are made of a material (paint) that can be melted by heat generated by the laser beam 25. Of the electrically conductive paints for forming the conductive layers 11, 13, 15, and 17, it is preferable to use a conductive paste as the light absorbing paint. Of the electrically conductive paints for forming the conductive layers 11, 13, 15, and 17, it is preferable to use a conductive paste as the light transmissive paint. Furthermore, it is preferable to use a polyimide resin, an epoxy resin, or the like as an electrically insulating and light-transmitting coating material for forming the insulating layers 12, 14, 16, and 18.

  Next, as shown in FIG. 6B, the entire surface is irradiated with laser light 25 from the insulating layer 18 side of the conductive pattern substrate original plate 10F ′ prepared as described above. At this time, the insulating layers 12, 14, 16, 18 and the light transmissive portions 11a, 13a, 15a, and 17a of the conductive layers 11, 13, 15, and 17 transmit the laser beam 25. Since the light-absorbing portions 11b, 13b, 15b, and 17b of the 15 and 17 absorb the laser light 25, the light absorption located at a desired portion of the conductive layers 11, 13, 15, and 17 irradiated with the laser light 25 is absorbed. The active portions 11b, 13b, 15b, and 17b absorb the light having the oscillation wavelength of the laser light 25 and generate heat. Thus, desired portions (light absorbing portions 11b, 13b, 15b, and 17b) of the conductive layers 11, 13, 15, and 17 and corresponding portions of the insulating layers 12, 14, 16, and 18 corresponding thereto and the conductive layers 11, Corresponding portions 13, 15, and 17 are melted, and molten portions 21 a in a molten state are formed at corresponding portions of the insulating layers 12, 14, 16, and 18. Here, the melting part 21a is formed by melting and mixing the material of the conductive layers 11, 13, 15, and 17 and the material of the insulating layers 12, 14, 16, and 18, and is electrically conductive. Showing gender. In this case, the material of the conductive layers 11, 13, 15, 17 and the material of the insulating layers 12, 14, 16, 18 are appropriately adjusted, or the heat generated by the laser beam 25 as the material of the insulating layers 12, 14, 16, 18. It is also possible to make the melted part 21a more reliably exhibit electrical conductivity by using the one that evaporates due to the above.

  When the irradiation with the laser beam 25 is continued until the melted portion 21a formed in the corresponding portion of the insulating layers 12, 14, 16, 18 becomes sufficiently large, the conductive layer 11 and the conductive layer 13 are electrically connected. The melted part 21 a is formed so as to connect between the layer 13 and the conductive layer 15 and between the conductive layer 15 and the conductive layer 17, and the melted part 21 a connected to the conductive layer 17 is formed of the insulating layer 18. It will be exposed to the surface. Thereafter, when the molten portion 21a in the molten state is cooled, the conductive layers 11, 13, 15, and 17 are electrically connected to arbitrary portions of the insulating layers 12, 14, and 16 in a solidified state and electrically conductive. The melted portion 21 is formed, and the electrically conductive melted portion 21 in a solidified state electrically connected to the conductive layer 17 is formed at an arbitrary position on the surface of the insulating layer 18.

  As a result, as shown in FIG. 6C, the insulating layers formed so as to cover the conductive layers 11, 13, 15, and 17 having a predetermined conductive pattern and the conductive layers 11, 13, 15, and 17, respectively. A conductive pattern substrate 10F having a four-layer circuit pattern having layers 12, 14, 16, and 18, and a solidified and electrically conductive melting portion 21 formed in a corresponding portion of the insulating layer 12 The desired portion of the conductive layer 11 and the desired portion of the conductive layer 13 are electrically connected to each other, and the solidified and electrically conductive melted portion 21 is formed in the corresponding portion of the insulating layer 14. The desired portion of the conductive layer 13 and the desired portion of the conductive layer 15 are electrically connected, and the solidified and electrically conductive melting portion 21 formed in the corresponding portion of the insulating layer 16 is used. Desired portion of the conductive layer 15 and desired portion of the conductive layer 17 Are electrically connected to each other, and a desired portion of the conductive layer 17 is electrically connected to the outside through a solidified and electrically conductive melting portion 21 formed at a corresponding portion of the insulating layer 18. The enabled conductive pattern substrate 10F is formed.

  Thus, according to the third embodiment of the present invention, first, the conductive layers 11, 13, 15, 17 having a predetermined conductive pattern and the conductive layers 11, 13, 15, 17 are respectively covered. The conductive pattern substrate original plate 10F ′ having the insulating layers 12, 14, 16, and 18 formed as described above, wherein the conductive layers 11, 13, 15, and 17 and the insulating layers 12, 14, 16, and 18 are lasers. Only a layer portion (light absorbing portion 11b, 13b, 15b, 17b) made of a material that can be melted by heat generated by the light 25 and located at a desired portion of the conductive layers 11, 13, 15, 17 is light absorbing. The other layer portions (light transmissive portions 11a, 13a, 15a, and 17a) and the insulating layers 12, 14, 16, and 18 are light transmissive, and the conductive layers 11, 13, 15, and 17 light absorbing parts 1 b, 13b, 15b, 17b to prepare the conductive pattern substrate plate precursor 10F which are arranged so as not to overlap each other when viewed from the irradiation direction of the laser beam 25 '. Next, the entire surface is irradiated with the laser beam 25 from the insulating layer 18 side of the conductive pattern substrate original plate 10F ′ thus prepared. As a result, the light-absorbing portions 11b, 13b, 15b, and 17b located at desired portions of the conductive layers 11, 13, 15, and 17 irradiated with the laser light 25 absorb light having the oscillation wavelength of the laser light 25. Then, heat is generated, and desired portions (light absorbing portions 11b, 13b, 15b, and 17b) of the conductive layers 11, 13, 15, and 17 and corresponding portions of the insulating layers 12, 14, 16, and 18 and the conductive layers corresponding thereto. The corresponding portions of 11, 13, 15, and 17 are melted, and a molten portion 21a in a molten state showing electrical conductivity is formed in the corresponding portions of the insulating layers 12, 14, 16, and 18. Then, when irradiation with the laser beam 25 is continued until the melted portion 21a formed at the corresponding portion of the insulating layers 12, 14, 16, 18 is sufficiently large and then cooled, any of the insulating layers 12, 14, 16 can be obtained. The conductive layer 11, 13, 15, 17 is electrically connected to each other in the solidified and electrically conductive melting portion 21, and the conductive layer is formed at any location on the surface of the insulating layer 18. In the solidified state electrically connected to 17, an electrically conductive melting part 21 is formed. As described above, the conductive pattern substrate 10F having a four-layer circuit pattern that can be easily connected to the external electrode can be manufactured with high accuracy, simply, and inexpensively. In particular, according to the third embodiment of the present invention, a conductive pattern substrate original plate 10F ′ in which all of the conductive layers 11, 13, 15, 17 and the insulating layers 12, 14, 16, 18 are formed is prepared. Since the conductive pattern substrate 10F can be manufactured by performing the irradiation of the laser beam 25 only once later, the manufacturing process becomes very simple.

  In the above-described third embodiment, the case where the conductive pattern substrate 10F having the four-layer circuit pattern is manufactured has been described as an example. However, the layer configuration of the conductive pattern substrate original plate 10F ′ is changed. By doing so, a conductive pattern having a circuit pattern of an arbitrary number of layers as shown in FIGS. 1 (c), 3 (c), 3 (f), 4 (d) and 5 (f). The substrate can be manufactured in a similar manner.

  In the third embodiment described above, the conductive layers 11, 13, 15, and 17 are provided with the light transmissive portions 11 a, 13 a. Although the case where it has 15a, 17a and the light absorptive part 11b, 13b, 15b, 17b was mentioned as an example and demonstrated, not only this but the insulating layers 12, 14, 16, and 18 are a light transmissive part and light absorptivity In the case of having a portion, it can be similarly applied.

  Further, in the third embodiment described above, the base substrate 20, the conductive layers 11, 13, 15, 17 and the insulating layers 12, 14, 16, 18 of the conductive pattern substrate original plate 10F ′ are all in the same shape. However, it is not necessary to have a size of the outer peripheral end portion, for example, by gradually reducing the size of the outer peripheral end portions thereof, as shown in FIG. The portion may have a linear outer shape) or a hemispherical conductive pattern substrate (a stepwise outer peripheral end portion may have a curved outer shape).

Process drawing for demonstrating the manufacturing method of the electroconductive pattern board | substrate which concerns on the 1st Embodiment of this invention. The figure for demonstrating the modification of the manufacturing method shown in FIG. Process drawing for demonstrating the manufacturing method of the electroconductive pattern board | substrate which concerns on the 2nd Embodiment of this invention. Process drawing for demonstrating one modification of the manufacturing method shown in FIG. Process drawing for demonstrating the other modification of the manufacturing method shown in FIG. Process drawing for demonstrating the manufacturing method of the electroconductive pattern board | substrate which concerns on the 3rd Embodiment of this invention. Sectional drawing which shows the modification of the electroconductive pattern board | substrate manufactured by the manufacturing method shown in FIG.

Explanation of symbols

10A Conductive pattern substrate 10A 'Conductive pattern substrate masters 10B, 10C, 10D, 10E Conductive pattern substrate 10B', 10C ', 10D', 10E 'Conductive pattern substrate masters 10F, 10G Conductive pattern substrate 10F' , 10G 'conductive pattern substrate original plate 11, 13, 15, 17 Conductive layers 11a, 13a, 15a, 17a Light transmissive portions 11b, 13b, 15b, 17b Light absorptive portions 12, 14, 16, 18 Insulating layer 20 Base substrate 21a Melting portion 21 in molten state Solid melting portion 22 External electrode 25 Laser light

Claims (5)

A conductive pattern substrate original plate in which a plurality of electrically conductive layers having a predetermined conductive pattern and a plurality of electrically insulating layers are alternately stacked, each of the electrically conductive layers and each of the aforementioned electrically conductive layers The electrically insulating layer is made of a material that can be melted by heat generated by laser light, and at least one of the plurality of electrically conductive layers and the plurality of electrically insulating layers is electrically conductive. Only the layer portion located at the desired portion of the layer or the corresponding portion of the electrically insulating layer corresponding thereto absorbs light of the oscillation wavelength of the laser light and generates heat, while other than that A first step of preparing a conductive pattern substrate original plate having a transparency through which the layer portion transmits the laser beam ;
Irradiating a laser beam to the corresponding region of the desired site or the electrically insulating layer corresponding to that of said first of each of the of the conductive patterned substrate plate precursor prepared in the step electrically conductive layer by, a said fused portion of the electrical conductivity is formed in the corresponding sites conductive pattern substrate of each of said electrically insulating layer, formed on the corresponding portion of each of said electrically insulating layer said melting part, seen contains a second step of producing the desired site electrically connected to electrically conductive pattern substrate of the electrically conductive layer corresponding to the layer of the electrically insulating,
Each of the electrically conductive layers and each of the electrically insulating layers having the light absorption property are arranged so as not to overlap each other when viewed from the direction of laser light irradiation. The manufacturing method of a conductive pattern board | substrate. The melted portion formed in the corresponding portion of the one electrically insulating layer, wherein one of the plurality of electrically insulating layers of the conductive pattern substrate is located in the outermost layer. through, characterized in that said desired site and outside of the electrically conductive layer corresponding to the layer of electrically insulating the one is electrically connectable conductive according to claim 1 Method for manufacturing a conductive pattern substrate. The molten portion formed on the corresponding portion of each of said electrically insulating layer, that the material of the electrically conductive layer and the corresponding material of the electrically insulating layers are mixed is melted The manufacturing method of the conductive pattern board | substrate of Claim 1 or 2 characterized by the above-mentioned. Among the plurality of electrically insulating layers, the melted portion formed at the corresponding portion of the electrically insulating layer in which the electrically conductive layer is disposed on both sides corresponds to the electrically insulating layer. 4. A method according to any one of claims 1 to 3, characterized in that a conductive pattern substrate is produced which is electrically connected to each of said electrically conductive layers . Laser light, wherein the electrically conductive layer from at least one side of one of the first of said electrically conductive layer of the conductive patterned substrate plate precursor prepared in the step and the electrically insulating layer the electric wherein said be irradiated to the corresponding sites of the insulating layer, the method according to any one of claims 1 to 4 corresponding to a desired site or.

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