JP4652671B2

JP4652671B2 - Substrate heat treatment equipment

Info

Publication number: JP4652671B2
Application number: JP2003132561A
Authority: JP
Inventors: 至康松田; 貴中林; 重樹飯島
Original assignee: IHI Corp
Current assignee: IHI Corp
Priority date: 2003-05-12
Filing date: 2003-05-12
Publication date: 2011-03-16
Anticipated expiration: 2023-05-12
Also published as: JP2004333075A

Description

【０００１】
【発明の属する技術分野】
本発明は、ガラス基板等の基板を熱処理する基板熱処理装置に係る。特に、基板の支持構造と基板を加熱するための構造に特徴のある基板熱処理装置に関する。
【０００２】
【従来の技術】
ガラス基板等の基板を熱処理する従来の基板熱処理装置は、炉と搬送装置とで構成される。
搬送装置は、ローラーにガラス基板を水平に乗せ、ローラーを回転して１枚づつガラス基板を炉内で搬送する。
炉は、ガラス基板の送り方向に長い空間をもっており、炉内温度が長手方向に所定の分布をもっている。ガラス基板が、炉内を搬送されると、所望の温度履歴を受ける。ガラス基板は、炉内を搬送される際に、加熱され、所定時間を所定温度に維持され、冷却されて、炉から取りだされる。一般に、炉長の中央部の温度が最高になる。
【０００３】
一般に、搬送装置のガラス基板を送るための送り速度は、炉の長手方向について、一定である。従って、高温の熱処理をするには炉の長さを長くする必要が生じる。
また、炉内には長手方向に温度勾配が生ずるので、炉内を搬送されるガラス基板の先端部と後端部とでは常に温度が異なっている。この温度差を小さくするには、炉の単位長さ当たりの温度勾配を小さく必要が有るので、炉の長さを長くする必要が生ずる。
また、ガラス基板を搬送用ローラーに平置して搬送するので、ガラス基板の表面に不純物が付着するおそれがあった。
また、ローラーハウスからは粉塵が発生するので、その粉塵が不純物としてガラス基板に付着しない様に注意が必要であった。
【０００４】
【特許文献１】
特開平１１−３７６６０号公報
【特許文献２】
特開平１１−２５８５４号広報
【０００５】
【発明が解決しようとする課題】
本発明は以上に述べた問題点に鑑み案出されたもので、全長が短く、基板の熱処理の精度が高く、生産性が高く、また基板の汚染の恐れの少ない基板熱処理装置を提供しようとする。
【０００６】
【課題を解決するための手段】
上記目的を達成するため、本発明に係る基板を熱処理する基板熱処理装置を、基板を内部に収納し該基板の縁の面に対面する開口断面を持った一対の開口である収納体入口と収納体出口とを持つ収納体を有する基板搬送架台と、一対の開口面であるダクト入口とダクト出口とを連通するダクトと気体をダクト入口からダクト出口へ送風する送風機と該気体を加熱または冷却する温調機とを有する熱処理炉と、前記基板搬送架台を前記熱処理炉に固有の特定位置へ固定しさらに該特定位置から移動させることのできる基板搬送架台送り機構と、を備え、前記基板搬送架台が前記特定位置に固定された際に、前記収納体入口が前記ダクト出口に連通し、前記収納体出口が前記ダクト入口に連通する、ものとした。
【０００７】
上記本発明の構成により、基板搬送架台の収納体が基板を内部に収納し該基板の縁の面に対面する開口断面を持った一対の開口である収納体入口と収納体出口とを持ち、熱処理炉のダクトが一対の開口面であるダクト入口とダクト出口とを連通し、熱処理炉の送風機が気体をダクト入口からダクト出口へ送風し、熱処理炉の温調機が該気体を加熱または冷却し、基板搬送架台送り機構が前記基板搬送架台を前記熱処理炉に固有の特定位置へ固定しさらに該特定位置から移動させることをでき、前記基板搬送架台が前記特定位置に固定された際に、前記収納体入口が前記ダクト出口に連通し、前記収納体出口が前記ダクト入口に連通するので、基板搬送架台を特定位置に固定して、送風機と温調機を作動させると、基板搬送架台に収納される基板を熱処理することができ、熱処理が終了した後で基板搬送架台を特定位置から移動させることができる。
【０００８】
さらに、本発明に係る基板熱処理装置は、前記ダクト出口と前記収納体入口との間に設けられ気体を濾過する気体フィルタを、備える、のが好ましい。
上記本発明の構成により、気体フィルタが前記ダクト出口と前記収納体入口との間に設けられ気体を濾過するので、不純物が基板に付着するのを抑制できる。
【０００９】
さらに、本発明に係る基板熱処理装置は、複数の前記熱処理炉を備え、前記基板搬送架台送り機構が、前記基板搬送架台を複数の前記熱処理炉に固有の各々の前記特定位置へ順次移動可能である、のが好ましい。
上記本発明の構成により、前記基板搬送架台送り機構が、前記基板搬送架台を複数の前記熱処理炉に固有の各々の前記特定位置へ順次移動可能であるので、基板搬送架台送り機構が基板搬送架台が複数の熱処理炉へ移動する間に、基板に一連の熱処理を施すことができる。
【００１０】
さらに、本発明に係る基板熱処理装置は、前記基板搬送架台送り機構が前記基板搬送架台を複数の前記熱処理炉に固有の各々の前記特定位置に順次移動させ、前記複数の熱処理炉の各々の温度調整器が個別の温度制御をされ、基板搬送架台に支持された基板に所望の温度履歴を与える、のが好ましい。
上記本発明の構成により、基板搬送架台送り機構が前記基板搬送架台を各々の前記特定位置に順次移動させ、前記複数の熱処理炉の各々の温度調整器が個別の温度制御をされ、基板搬送架台に支持された基板に所望の温度履歴を与える、ので、複数の熱処理炉がない場合に比べて、効率良く熱処理をすることができる。
【００１１】
さらに、本発明に係る基板熱処理装置は、前記基板搬送架台が複数の基板を表面を平行に揃えて支持する支持部材を持つ、が好ましい、
上記本発明の構成により、前記支持部材が複数の基板を表面を平行に揃えて支持するので、基板の熱処理のスループットが向上する。
【００１２】
さらに、本発明に係る基板熱処理装置は、前記基板搬送架台が複数の基板を表面を平行に揃えて縦向きに支持する支持部材を持つ、のが好ましい。
上記本発明の構成により、前記支持部材が複数の基板を表面を平行に揃えて縦向きに支持するので、基板の熱処理のスループットが向上し、不純物が基板の表面に付着しにくくなる。
【００１３】
さらに、本発明に係る基板熱処理装置は、前記支持部材が縦向きに収納された基板の上の辺に係合する上桟と基板の下の辺に係合する下桟とを持つ、のが好ましい。
上記本発明の構成により、前記上桟が縦向きに収納された基板の上の辺に係合し、前記上桟が基板の下の辺に係合するので、基板の基板搬送架台への収納、取り外しが容易になる。
【００１４】
さらに、本発明に係る基板熱処理装置は、前記収納体が、前記収納体入口と前記収納体出口とを残して複数の基板の群を気密に囲う壁構造を持つ、のが好ましい。
上記本発明の構成により、前記収納体の壁構造が、前記収納体入口と前記収納体出口とを残して複数の基板の群を気密に囲うので、基板の熱処理のばらつきが少なくなる。
【００１５】
さらに、本発明に係る基板熱処理装置は、前記壁構造が、断熱材製の断熱部材と該断熱部材を隙間なく覆う金属板でできた被覆部材とを持つ、のが好ましい。
上記本発明の構成により、前記壁構造が、断熱材製の断熱部材と該断熱部材を隙間なく覆う金属板でできた被覆部材とを持つので、基板の熱処理のばらつきが少なくなり、また断熱材のごみが基板に付着することを抑制できる。
【００１６】
【発明の実施の形態】
以下、本発明の好ましい実施形態に係る基板熱処理装置を、図面を参照して説明する。なお、各図において、共通する部分には同一の符号を付し、重複した説明を省略する。
【００１７】
図１は、実施形態にかかる基板熱処理装置の鳥瞰図である。図２は、実施形態にかかる基板熱処理装置の側面図である。図３は、実施形態にかかる基板熱処理装置のＡ−Ａ断面図である。図４は実施形態に係る基板熱処理装置のＢ−Ｂ断面図である。
基板熱処理装置１は、基板２を熱処理する装置であって、基板搬送架台１０とＮ個の熱処理炉２０と気体フィルタ３０と基板搬送架台送り機構４０とで構成される。
【００１８】
基板搬送架台１０は、基板を収納して搬送するものであって、収納体１１と支持部材１２と台車１３とで構成される。
収納体１１は、基板２を内部に収納し、基板２の縁の面に対面する開口断面を持った一対の開口である収納体入口Ｖｉと収納体出口Ｖｏとを持つ構造体である。
収納体１１が、収納体入口Ｖｉと前記収納体出口Ｖｏとを残して複数の基板２の群を気密に囲う壁構造を持つのが好ましい。
また、壁構造が、断熱材製の断熱部材と該断熱部材を隙間なく覆う金属板でできた被覆部材で構成されるのが好ましい。
【００１９】
図１乃至図４は、四辺形をした一対の側壁部材と床部材と天井部材とが辺を連ねた収納体１１を示している。収納体１１は、対面する一対の面が開口となった、立方体の箱形状をしている。この開口が、収納体入口Ｖｉと収納体出口Ｖｏとに相当する。また、一対の側壁部材と床部材と天井部材とは、夫々断熱部材と被覆部材で構成される。断熱部材は、断熱材製であり、例えば、アルミナブランケットである。被覆部材は、断熱部材を隙間なく覆う金属板であり、例えば、ステンレス板である。
【００２０】
支持部材１２は、基板２を支持する部材である。支持部材１２は、その縁の面が収納体入口Ｖｉと収納体出口Ｖｏとに面する姿勢になる様に基板を支持する。
支持部材１２は、複数の基板を表面を平行に揃えて支持するのが好ましい。
特に、支持部材１２は、複数の基板を表面を平行に揃えて縦向きに支持するのが好ましい。
特に、支持部材１２は、縦向きに収納された基板の上の辺に係合する上桟１２ｕと基板の下の辺に係合する下桟１２ｄとを持つのが好ましい。
図４は、上桟１２ｕが天井部材の下面に設けられ、下桟１２ｄが床部材の上面に設けられる。下向きの溝（図示せず）が上桟１２ｕに設けられ、上向きの溝（図示せず）が下桟１２ｄに設けられる。縦向きになった基板の上の辺が上桟１２ｕの溝に係合し、基板の下の辺が下桟１２ｄの溝に係合する。
【００２１】
台車１３は、収納体１１と支持部材１２とを乗せて移動する移動体である。台車１３は、後述する基板搬送架台送り機構４０のレール上を転動する車輪を持つ。台車１３は、基板搬送架台送り機構によりレール上を移動し、所定の場所で停止する。
【００２２】
熱処理炉２０は、基板搬送架台１０に支持される基板２を気体加熱により熱処理する装置であり、ダクト２１と送風機２２と温調機２３と整流板２４と出口邪魔板２５と入口邪魔板２６とで構成される。
ダクト２１は、一対の開口面であるダクト入口Ｄｉとダクト出口Ｄｏとを連通するものである。
図１乃至図４は、ダクト２１が、下部に基板搬送架台１０を配置可能な空間をもち、その空間にを挟んで設けられたダクト入口Ｄｉとダクト出口Ｄｏとを連通している、のを示す。
基板搬送架台１０が、収納体入口Ｖｉがダクト出口Ｄｏに連通し、収納体出口Ｖｏがダクト入口Ｄｉに連通する様に、ダクト入口Ｄｉとダクト出口Ｄｏとに挟まれた空間に配置された際、その基板搬送架台１０の位置を特定位置Ｘと呼称する。
図１は、ダクト入口Ｄｉとダクト出口Ｄｏが対向する矩形の開口である、のを示す。
ダクト２１は、ダクト入口Ｄｉから上方に回り込み、特定位置Ｘに配置された基板搬送架台１０の上方を水平に配置され、さらに下方に回り込んでダクト出口Ｄｏに繋がる。
基板搬送架台１０は、特定位置Ｘからダクト入口Ｄｉの中心とダクト出口Ｄｏの中心を結ぶ線に直交する方向へ移動可能である。
【００２３】
送風機２２は、気体３をダクト入口Ｄｉからダクト出口Ｄｏへ送風する機器である。送風機は２２は、ダクト２１の内部に設けられる。送風機２２は、ダクト２１のダクト入口Ｄｉの側から気体３を吸い込み、気体３を昇圧し、ダクト２２のダクト出口Ｄｏの側へ気体３を吐出する。
送風機２２を作動させると、気体３が、ダクト入口Ｄｉからダクト出口Ｄｏへ流れる。
【００２４】
温調機２３は、気体３を加熱または冷却する機器である。温調機２３は、ダクト２１の内部の送風機２２の下流側に設けられる。
気体３を加熱する場合は、例えば温調機２３は電気ヒーターを備える。気体３を冷却する場合は、例えは温調機２３は液体冷却ジャケットを備える。
温調機２３が作動すると、送風機２２から送られてきた気体３が加熱または冷却され、ダクト出口Ｄｏへ流れる。
【００２５】
整流板２４は、ダクト２１の内部の気体３の流れを整流する一群の板である。
整流板２４は、温調機２３の下流側のダクト２１の曲り部に設けられる。
【００２６】
出口邪魔板２５は、整流板２４から下方に吹きだしてダクト出口Ｄｏへ向かって流れる気体３の向きを変針させるための板部材である。出口邪魔板２５は、ダクト出口Ｄｏの上流側のダクト２１の角部に設けられる。
【００２７】
入口邪魔板２６は、ダクト入口Ｄｉから上方へ向かって送風機２２に吸い込まれる気体３の向きを変針させるための板部材である。入口邪魔板２６は、ダクト２１のダクト入口Ｄｉの下流のダクト２１の角部に設けられる。
【００２８】
基板熱処理装置１は、複数の熱処理炉２０が連なっているのが好ましい。
また、後述する基板搬送架台送り機構４０が、基板搬送架台１０を複数の熱処理炉２０に固有の各々の特定位置Ｘへ順次移動可能であるのが好ましい。
また、互いの気体の送風される向きが反対になる様に、隣り合った熱処理炉２０を配置するのが好ましい。
複数の熱処理炉２０が、所定の配置ピッチＨで配置され、特定位置Ｘが連なる。隣り合った熱処理炉２０は互いに接合され、互いの特定位置Ｘの隙間が気密になっている。
基板搬送架台１０が、連なった熱処理炉２０の各々の特定位置Ｘを移動する間に、各々の熱処理炉２０が基板搬送架台１０に収納された基板２に各々の熱処理を施す。複数の所定の機能を有する熱処理炉２０が、基板に施したい熱処理条件（例えば、温度履歴）の時系列の過程に従って、配置される。例えば、加熱処理の過程を担当する熱処理炉２０の温調機は電気ヒータを備える。また、冷却処理の過程を担当する熱処理炉２０の温調機は冷却ジャケットを持つ。
【００２９】
仕切り弁５０は、連なった熱処理炉の各々の特定位置Ｘを周囲環境から遮断するための弁であり、入口側仕切り弁５１と出口側仕切り弁５２と中間仕切り弁５３で構成される。
入口側仕切り弁５１が、最初の熱処理過程を施す熱処理炉２０の特定位置Ｘの外側に、設けられる。
出口側仕切り弁５２が、最後の熱処理過程を施す熱処理炉２０の特定位置Ｘの外側に、設けられる。
中間仕切り弁５３が、加熱の熱処理工程を施す熱処理炉２０と冷却の熱処理工程を施す熱処理炉２０との間に、設けられる
【００３０】
図１乃至図３は、複数の熱処理炉２０が、各々の特定位置Ｘが連なる様に、配置されるのを示す。複数の熱処理炉２０に固有の夫々の特定位置Ｘが、連続して連なっている。
後述する基板搬送架台送り機構４０が、基板搬送架台１０を熱処理炉２０の連なった方向に移動させると、複数の熱処理炉２０に固有の各々の特定位置Ｘへ順次移動させることができる。
説明の便宜の為に、基板搬送架台１０が移動する順に、熱処理炉に番号第１〜第１４を付ける。図２では、第１〜第５の熱処理炉が加熱処理を施し、第６の熱処理炉が均熱処理を施し、第７〜第１０の熱処理炉が加熱処理を施し、第１１の熱処理炉が均熱処理を施し、第１２〜第１４の熱処理炉が冷却処理を施す。
【００３１】
気体フィルタ３０は、気体３を濾過するフィルタであり、入口気体フィルタ３１と出口気体フィルタ３２とで構成される。入口気体フィルタ３１は、ダクト出口Ｄｏと収納体入口Ｖｉとの間に設けられるフィルタである。出口気体フィルタ３２は、ダクト入口Ｄｉと収納体出口Ｖｏとの間に設けられるフィルタである。
フィルタは、例えば、金属メッシュフィルタである。
入口気体フィルタ３１は、ダクト出口Ｄｏを塞いでダクト２１に固定されるか、または、収納体入口Ｖｉを塞いで基板搬送架台１０に固定される。
出口気体フィルタ３２は、ダクト入口Ｄｉを塞いでダクト２１に固定されるか、または、収納体出口Ｖｏを塞いで基板搬送架台１０に固定される。
【００３２】
基板搬送架台送り機構４０は、基板搬送架台１０を熱処理炉２０に固有の特定位置Ｘへ固定し、さらに特定位置Ｘから移動させることのできる装置であり、送りレール４１と入口側基板搬送架台プッシャー４２と出口側基板搬送架台プッシャー４３と横行レール４４とリターンレール４５とで構成される。
【００３３】
送りレール４１は、基板搬送架台１０を複数の熱処理炉２０に固有の各々の特定位置Ｘへ順次移動させるためのレールである。送りレール４１は、連なった特定位置Ｘの下部に設けられる。送りレール４１は、基板搬送架台１０をレールを敷設された方向に案内する。
【００３４】
入口側基板搬送架台プッシャー４２は、送りレール４１に案内された基板搬送架台１０を押す機器であり、例えば、水平に配置された電動シリンダである。電動シリンダは、ピストンを入口側仕切弁５１が開閉する特定位置Ｘに向けて配置される。入口側基板搬送架台プッシャー４２は、基板搬送架台１０を熱処理炉の配置ピッチＨに等しい距離だけ移動させることができる。
出口側基板搬送架台プッシャー４３は、送りレール４１に案内された基板搬送架台１０を押す機器であり、例えば、水平に配置された電動シリンダである。電動シリンダは、ピストンを出口側仕切弁５２が開閉する特定位置Ｘに向けて配置される。出口側基板搬送架台プッシャー４３は、基板搬送架台１０を熱処理炉の配置ピッチＨに等しい距離だけ移動させることができる。
入口側基板搬送架台プッシャー４２と出口側基板搬送架台プッシャー４３とが、居一連に連なった基板搬送架台１０を配置ピッチＨに等しい距離だけ順次移動させることにより、個々の基板搬送架台１０は一連に連なった特定位置Ｘを順次移動できる。
【００３５】
横行レール４４は、出口側仕切り弁５２から出てきた基板搬送架台１０を、送りレール４１の送り方向の直交方向に送るレールである。
リターンレール４５は、横行レール４４により横行された基板搬送架台１０を、連なった熱処理炉２０の外側を通って、入口側仕切弁５１のある側へ移動させるレールである。
【００３６】
次に、実施形態に係る基板熱処理装置の作用を説明する。
図５は、実施形態に係る基板熱処理装置の作用説明図である。
【００３７】
最初に温度履歴の一例を説明する。
第一昇温処理：基板を加熱し所定時間で室温から所定温度Ｔ１までに昇温する。
第一保持処理：基板を所定時間、所定温度Ｔ１に維持する。
第二昇温処理：基板を加熱し所定時間で所定温度Ｔ１から所定温度Ｔ２に昇温する。
第二保持処理：基板を所定時間、所定温度Ｔ２に維持する。
冷却処理：基板を所定時間で所定温度Ｔ２度から所定温度Ｔ１に冷却する。
【００３８】
一つの基板搬送架台１０に支持された基板２に着目して、基板熱処理装置の作用を説明する。
入口側仕切弁５１が、入口を開く。
入口側基板搬送架台プッシャー４２が、基板搬送架台１０を第１の熱処理炉２０の特定位置Ｘへ移動させる。第１の熱処理炉２０において、収納体入口Ｖｉがダクト出口Ｄｏに連通し、収納体出口Ｖｏがダクト入口Ｄｉに連通する。
入口側仕切弁５１が、入口を閉じる。
【００３９】
第１の熱処理炉２０の送風機２２と温調機２３とが作動する。気体３が送風機２２により昇圧され、ダクト２１のダクト入口Ｄｉの側からダクト出口Ｄｏの側へ送風される。気体３が、温調機２３により加熱され、昇温する。温調機２３をでた気体３は、整流板２４により整流され、向きを下向きに変える。整流された気体３は、下方に吹き出る。気体３は、出口邪魔板２５により向きを変針し、ダクト出口Ｄｏへ向かって流れる。気体３は、入口気体フィルタ３１により濾過されて、基板搬送架台１０の収納体入口Ｖｉに流れる。
気体３は、収納体入口Ｖｉから収納体出口Ｖｏへ流れる際に、複数の基板２の隙間を流れ、複数の基板２を加熱する。気体３は、出口気体フィルタ３２により濾過されて、ダクト入口Ｄｉへ入る。
気体３は、入口邪魔板２６により向きを変針し、ダクト入口Ｄｉから上方へ向かって送風機２２に吸い込まれる。
気体３は、再度、送風機２２によりダクト２１内に送風され、ダクト内を循環する。
ダクト内に設けられた温度センサ（図示せず）の出力により、送風機２２と温調機２３が制御され、基板搬送架台１０内の基板を所望の時間で所望の温度に昇温し、第１の熱処理炉２０での熱処理を行なう。
【００４０】
第１の熱処理炉２０での熱処理が完了すると、入口側仕切弁５１が、入口を開く。入口側基板搬送架台プッシャー４２が、次の基板搬送架台１０を第一の熱処理炉の特定位置Ｘへ移動させる。
基板搬送架台１０は、次の基板搬送架台１０に押されて、第二の熱処理炉２０の特定位置Ｘへ移動する。第二の熱処理炉２０において、収納体入口Ｖｉがダクト出口Ｄｏに連通し、収納体出口Ｖｏがダクト入口Ｄｉに連通する。
入口側仕切弁５１が、入口を閉じる。
【００４１】
以下、上述の作業を繰り返すと、基板搬送架台１０は、第１の熱処理炉２０から順に第２、第３・・・・第１１の熱処理炉２０へ移動する。第１の熱処理炉２０から順に第２、第３・・・・第１１の熱処理炉２０へ移動する際に、基板搬送架台１０に収納された基板２は、所望の温度履歴を受ける。
【００４２】
中間仕切弁５４が、第１１の熱処理炉２０と第１２の熱処理炉２０の境を開く。
基板搬送架台１０が、第１２の熱処理炉２０へ入り冷却処理を施される。基板搬送架台１０は、第１２の熱処理炉２０の特定位置Ｘから順に第１３、第１４の熱処理炉の特定位置Ｘへ移動する。第１２の熱処理炉２０の特定位置Ｘから順に第１３、第１４の熱処理炉２０の特定位置Ｘへ移動する際に、基板搬送架台１０に収納された基板２は、所定の冷却処理を施される。
出口側仕切り弁５２が、出口を開く。
基板搬送架台１０が出口から熱処理炉を出る。
基板搬送架台１０は、横行レール４４、リターンレール４５に沿って移動し、連なった熱処理炉２０の外側を通って、入口側仕切弁５１のある側へ移動する。
基板２が、基板搬送架台１０から取りだされて、後工程へ搬送される。
【００４３】
上述の実施形態の基板熱処理装置を用いれば、基板２を基板搬送架台１０に収納して、基板搬送架台１０を熱処理炉２０の特定位置Ｘに固定することで、気体３が基板２の表面に沿って流れ、基板２に所定の熱処理を施すことができる。
また、複数の熱処理炉２０を並べて、複数の熱処理炉２０の特定位置Ｘへ基板搬送架台１０を順に送り、各々の熱処理炉２０において熱処理を基板２に施すので、基板２に所望の履歴の熱処理を効率良く施すことができる。
また、複数の基板２を基板搬送架台１０に収納するので、複数の基板２に熱処理を同時に施すことができ、熱処理のスループットが向上する。
また、熱処理炉２０の気体３の通り道に気体フィルタを設けたので、不純物が基板２に付着するのを防止することができる。
また、基板２を縦にして基板搬送架台１０に収納するので、基板２に不純物が付着しにくくなる。
また、基板搬送架台１０の収納体１１を断熱材とその断熱材を覆う金属板で構成したので、熱処理を施す際に、基板２からの熱の外部への移動が少なくなり、基板搬送架台１０に収納された複数の基板２同士の熱処理のばらつきが少なくなり、さらに不純物が基板２に付着するのを防止できる。
また、縦にした基板２の上下の辺を係合して基板搬送架台に収納するので、基板２の基板搬送架台１０への搭載が容易になり、自動化に向いた収納形態となる。
【００４４】
本発明は以上に述べた実施形態に限られるものではなく、発明の要旨を逸脱しない範囲で各種の変更が可能である。
収納体入口、または収納体出口を矩形の開口であるとして説明したがこれに限定されず、他の形状の開口でもよい。
またダクト入口、またはダクト出口を矩形の開口であるとして説明したがこれに限定されず、他の形状でもよい。
また、収納体入口と収納体出口とが対面する一対の開口であるとしたがこれに限定されない。
【００４５】
【発明の効果】
以上説明したように本発明の基板を熱処理する基板熱処理装置は、その構成により、以下の効果を有する。
基板搬送架台送り機構で基板を収納した基板搬送架台を移動して、特定位置に固定された基板搬送架台の収納体入口と収納体出口とをダクトの中に送風機と温調機と設けた熱処理炉のダクト入口とダクト出口とに連通することができ、送風機と温調機を作動させると、基板搬送架台に収納される基板を熱処理することができ、熱処理が終了した後に基板搬送架台送り機構が基板搬送架台を特定位置から移動させることができる。
また、気体フィルタを前記ダクト出口と前記収納体入口との間に設けたので、濾過された気体が基板搬送架台に入り、不純物が基板に付着しにくくなる。
また、基板搬送架台送り機構により基板搬送架台を複数の熱処理炉の各々の特定位置へ順に移動させるので、基板搬送架台が複数の熱処理炉へ移動する間に、基板に一連の熱処理を施すことができる。
また、各々の温度調整器が個別の温度制御をされ、基板搬送架台に支持された基板に所望の温度履歴を与えるので、複数の熱処理炉がない場合に比べて、効率良く熱処理をすることができる。
また、前記基板搬送架台の支持部材が複数の基板を表面を平行に揃えて支持するので、基板の熱処理のスループットが向上する。
また、前記基板搬送架台の支持部材が複数の基板を表面を平行に揃えて縦向きに支持するので、基板の熱処理のスループットが向上し、不純物が基板に付着しにくくなる。
また、基板搬送架台に基板の上下の辺に係合する上桟と下桟とを設けたので、基板の基板搬送架台への収納、取り外しが容易になる。
また、前記収納体が、前記収納体入口と前記収納体出口とを残して複数の基板の群を気密に囲う壁構造を持つ、ので、基板の熱処理のばらつきが少なくなる。
また、前記壁構造が、断熱材製の断熱部材と該断熱部材を隙間なく覆う金属板でできた被覆部材とを持つので、断熱材のごみが基板に付着することを抑制できる。
従って、全長が短く、基板の熱処理の精度が高く、生産性が高く、また基板の汚染の恐れの少ない基板熱処理装置を提供できる。
【００４６】
【図面の簡単な説明】
【図１】実施形態にかかる基板熱処理装置の鳥瞰図である。
【図２】実施形態にかかる基板熱処理装置の側面断面図である。
【図３】実施形態にかかる基板熱処理装置のＡ−Ａ断面図である。
【図４】実施形態にかかる基板熱処理装置のＢ−Ｂ断面図である。
【図５】実施形態にかかる基板熱処理装置の作用説明図である。
【符号の説明】
Ｄｉダクト入口
Ｄｏダクト出口
Ｖｉ収納体入口
Ｖｏ収納体出口
Ｈ配置ピッチ
Ｘ特定位置
１基板熱処理装置
２基板（ガラス基板）
３気体
１０基板搬送架台
１１収納体
１２支持部材
１２ｕ上桟
１２ｄ下桟
１３台車
２０熱処理炉
２１ダクト
２２送風機
２３温調機
２４整流板
２５出口邪魔板
２６入口邪魔板
３０気体フィルタ
３１入口気体フィルタ
３２出口気体フィルタ
４０基板搬送架台送り機構
４１送りレール
４２入口側基板搬送架台プッシャー
４３出口側基板搬送架台プッシャー
４４横行レール
４５リターンレール
５０仕切り弁
５１入口側仕切り弁
５２出口側仕切り弁
５３中間仕切り弁[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate heat treatment apparatus for heat treating a substrate such as a glass substrate. In particular, the present invention relates to a substrate heat treatment apparatus characterized by a substrate support structure and a structure for heating the substrate.
[0002]
[Prior art]
A conventional substrate heat treatment apparatus for heat treating a substrate such as a glass substrate includes a furnace and a transfer device.
A conveyance apparatus places a glass substrate horizontally on a roller, rotates a roller, and conveys a glass substrate in a furnace one by one.
The furnace has a long space in the feeding direction of the glass substrate, and the furnace temperature has a predetermined distribution in the longitudinal direction. As the glass substrate is transported through the furnace, it receives a desired temperature history. When the glass substrate is transported in the furnace, it is heated, maintained at a predetermined temperature for a predetermined time, cooled, and taken out from the furnace. Generally, the temperature at the center of the furnace length is the highest.
[0003]
In general, the feed rate for feeding the glass substrate of the transport device is constant in the longitudinal direction of the furnace. Therefore, it is necessary to lengthen the length of the furnace in order to perform high-temperature heat treatment.
Moreover, since a temperature gradient is generated in the longitudinal direction in the furnace, the temperature is always different between the front end portion and the rear end portion of the glass substrate conveyed in the furnace. In order to reduce this temperature difference, it is necessary to reduce the temperature gradient per unit length of the furnace. Therefore, it is necessary to increase the length of the furnace.
In addition, since the glass substrate is transported by being placed flat on the transport roller, there is a possibility that impurities may adhere to the surface of the glass substrate.
Further, since dust is generated from the roller house, care must be taken so that the dust does not adhere to the glass substrate as impurities.
[0004]
[Patent Document 1]
Japanese Patent Laid-Open No. 11-37660
[Patent Document 2]
Japanese Laid-Open Patent Publication No. 11-25854
[0005]
[Problems to be solved by the invention]
The present invention has been devised in view of the above-described problems, and an object of the present invention is to provide a substrate heat treatment apparatus having a short overall length, high accuracy of heat treatment of the substrate, high productivity, and less risk of substrate contamination. To do.
[0006]
[Means for Solving the Problems]
In order to achieve the above object, a substrate heat treatment apparatus for heat-treating a substrate according to the present invention is provided with a storage body inlet and storage which are a pair of openings having an opening cross-section facing the edge surface of the substrate. A substrate transport frame having a storage body having a body outlet, a duct communicating with a duct inlet and a duct outlet, which are a pair of opening surfaces, a blower for blowing gas from the duct inlet to the duct outlet, and heating or cooling the gas A heat treatment furnace having a temperature controller; and a substrate transfer gantry feed mechanism capable of fixing the substrate transfer gantry to a specific position unique to the heat treatment furnace and moving the substrate transfer gantry from the specific position. Is fixed at the specific position, the storage body inlet communicates with the duct outlet, and the storage body outlet communicates with the duct inlet.
[0007]
With the configuration of the present invention, the storage body of the substrate transport frame has a storage body inlet and a storage body outlet which are a pair of openings having an opening cross section that stores the substrate inside and faces an edge surface of the substrate, The duct of the heat treatment furnace communicates with the duct inlet and duct outlet, which are a pair of opening surfaces, the blower of the heat treatment furnace blows gas from the duct inlet to the duct outlet, and the temperature controller of the heat treatment furnace heats or cools the gas The substrate transfer gantry feed mechanism can fix the substrate transfer gantry to a specific position unique to the heat treatment furnace and further move from the specific position.When the substrate transfer gantry is fixed at the specific position, Since the storage body inlet communicates with the duct outlet and the storage body outlet communicates with the duct inlet, when the substrate transport frame is fixed at a specific position and the blower and the temperature controller are operated, the substrate transport frame is Storing base Can be heat treated can be moved from the specific position of the substrate conveying platform after the heat treatment has been completed.
[0008]
Furthermore, the substrate heat treatment apparatus according to the present invention preferably includes a gas filter that is provided between the duct outlet and the storage body inlet and filters gas.
With the configuration of the present invention, a gas filter is provided between the duct outlet and the container inlet and filters the gas, so that impurities can be prevented from adhering to the substrate.
[0009]
Furthermore, the substrate heat treatment apparatus according to the present invention includes a plurality of the heat treatment furnaces, and the substrate transfer gantry feed mechanism is capable of sequentially moving the substrate transfer gantry to each of the specific positions unique to the plurality of heat treatment furnaces. It is preferable.
According to the configuration of the present invention, the substrate transport gantry feed mechanism can sequentially move the substrate transport gantry to each of the specific positions unique to the plurality of heat treatment furnaces. The substrate can be subjected to a series of heat treatments while moving to a plurality of heat treatment furnaces.
[0010]
Furthermore, in the substrate heat treatment apparatus according to the present invention, the substrate transport gantry feed mechanism sequentially moves the substrate transport cradle to each specific position unique to the plurality of heat treatment furnaces, and the temperature of each of the plurality of heat treatment furnaces. Preferably, the regulator is individually temperature controlled to provide the desired temperature history for the substrate supported on the substrate carrier.
According to the configuration of the present invention, the substrate transport pedestal feed mechanism sequentially moves the substrate transport cradle to each of the specific positions, and each temperature controller of each of the plurality of heat treatment furnaces is individually controlled in temperature. Since a desired temperature history is given to the substrate supported on the substrate, heat treatment can be performed more efficiently than when there are no plural heat treatment furnaces.
[0011]
Furthermore, in the substrate heat treatment apparatus according to the present invention, it is preferable that the substrate transport frame has a support member that supports a plurality of substrates with their surfaces aligned in parallel.
According to the configuration of the present invention, the support member supports a plurality of substrates with their surfaces aligned in parallel, so that the throughput of the heat treatment of the substrates is improved.
[0012]
Furthermore, in the substrate heat treatment apparatus according to the present invention, it is preferable that the substrate carrier has a support member that supports a plurality of substrates in a vertical direction with their surfaces aligned in parallel.
According to the configuration of the present invention, the support member supports a plurality of substrates in a vertical direction with the surfaces aligned in parallel, so that the throughput of the heat treatment of the substrates is improved and impurities are less likely to adhere to the surface of the substrate.
[0013]
Furthermore, the substrate heat treatment apparatus according to the present invention has an upper beam that engages with the upper side of the substrate in which the support member is stored vertically and a lower beam that engages with the lower side of the substrate. preferable.
According to the configuration of the present invention, the upper rail engages with the upper side of the substrate stored vertically, and the upper rail engages with the lower side of the substrate, so that the substrate is stored in the substrate transport frame. Easy to remove.
[0014]
In the substrate heat treatment apparatus according to the present invention, it is preferable that the storage body has a wall structure that hermetically surrounds a group of a plurality of substrates, leaving the storage body inlet and the storage body outlet.
According to the configuration of the present invention, the wall structure of the storage body hermetically surrounds a group of a plurality of substrates, leaving the storage body entrance and the storage body exit, so that variations in heat treatment of the substrate are reduced.
[0015]
Further, in the substrate heat treatment apparatus according to the present invention, it is preferable that the wall structure has a heat insulating member made of a heat insulating material and a covering member made of a metal plate that covers the heat insulating member without a gap.
According to the configuration of the present invention, the wall structure has a heat insulating member made of a heat insulating material and a covering member made of a metal plate that covers the heat insulating member without gaps, so that variations in heat treatment of the substrate are reduced, and the heat insulating material Can be prevented from adhering to the substrate.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a substrate heat treatment apparatus according to a preferred embodiment of the present invention will be described with reference to the drawings. In each figure, common portions are denoted by the same reference numerals, and redundant description is omitted.
[0017]
FIG. 1 is a bird's-eye view of a substrate heat treatment apparatus according to an embodiment. FIG. 2 is a side view of the substrate heat treatment apparatus according to the embodiment. FIG. 3 is a cross-sectional view taken along the line AA of the substrate heat treatment apparatus according to the embodiment. FIG. 4 is a BB cross-sectional view of the substrate heat treatment apparatus according to the embodiment.
The substrate heat treatment apparatus 1 is an apparatus for heat treating the substrate 2, and includes a substrate transport platform 10, N heat treatment furnaces 20, a gas filter 30, and a substrate transport platform feed mechanism 40.
[0018]
The substrate transport base 10 stores and transports a substrate, and includes a storage body 11, a support member 12, and a carriage 13.
The storage body 11 is a structure that stores the substrate 2 therein and has a storage body inlet Vi and a storage body outlet Vo that are a pair of openings having an opening cross section facing the edge surface of the substrate 2.
It is preferable that the storage body 11 has a wall structure that hermetically surrounds a group of the plurality of substrates 2 leaving the storage body inlet Vi and the storage body outlet Vo.
Moreover, it is preferable that the wall structure is composed of a heat insulating member made of a heat insulating material and a covering member made of a metal plate that covers the heat insulating member without a gap.
[0019]
1 to 4 show a storage body 11 in which a pair of side wall members having a quadrilateral shape, a floor member, and a ceiling member are connected to each other. The storage body 11 has a cubic box shape in which a pair of facing surfaces are openings. This opening corresponds to the storage body inlet Vi and the storage body outlet Vo. Moreover, a pair of side wall member, a floor member, and a ceiling member are respectively comprised with the heat insulation member and the coating | coated member. The heat insulating member is made of a heat insulating material, for example, an alumina blanket. The covering member is a metal plate that covers the heat insulating member without a gap, and is, for example, a stainless steel plate.
[0020]
The support member 12 is a member that supports the substrate 2. The support member 12 supports the substrate such that the edge surface faces the storage body inlet Vi and the storage body outlet Vo.
The support member 12 preferably supports a plurality of substrates with their surfaces aligned in parallel.
In particular, the support member 12 preferably supports a plurality of substrates in a vertical direction with their surfaces aligned in parallel.
In particular, the support member 12 preferably has an upper rail 12u that engages with the upper side of the substrate stored vertically, and a lower rail 12d that engages with the lower side of the substrate.
In FIG. 4, the upper rail 12u is provided on the lower surface of the ceiling member, and the lower rail 12d is provided on the upper surface of the floor member. A downward groove (not shown) is provided in the upper rail 12u, and an upward groove (not shown) is provided in the lower rail 12d. The upper side of the vertically oriented substrate engages with the groove of the upper rail 12u, and the lower side of the substrate engages with the groove of the lower rail 12d.
[0021]
The carriage 13 is a moving body that moves with the storage body 11 and the support member 12 mounted thereon. The carriage 13 has wheels that roll on rails of a substrate transfer gantry feed mechanism 40 described later. The carriage 13 is moved on the rail by the substrate transfer platform feed mechanism and stopped at a predetermined place.
[0022]
The heat treatment furnace 20 is a device that heat-treats the substrate 2 supported by the substrate carrier 10 by gas heating, and includes a duct 21, a blower 22, a temperature controller 23, a rectifying plate 24, an outlet baffle plate 25, and an inlet baffle plate 26. Consists of.
The duct 21 communicates a duct inlet Di and a duct outlet Do which are a pair of opening surfaces.
1 to 4 show that the duct 21 has a space where the substrate transport frame 10 can be arranged at the lower part, and the duct inlet Di and the duct outlet Do provided so as to sandwich the space communicate with each other. Show.
When the substrate transport frame 10 is arranged in a space between the duct inlet Di and the duct outlet Do such that the container inlet Vi communicates with the duct outlet Do and the container outlet Vo communicates with the duct inlet Di. The position of the substrate transport frame 10 is referred to as a specific position X.
FIG. 1 shows that the duct inlet Di and the duct outlet Do are rectangular openings facing each other.
The duct 21 circulates upward from the duct inlet Di, is disposed horizontally above the substrate transport frame 10 disposed at the specific position X, and further circulates downward to be connected to the duct outlet Do.
The board transport frame 10 is movable from a specific position X in a direction perpendicular to a line connecting the center of the duct inlet Di and the center of the duct outlet Do.
[0023]
The blower 22 is a device that blows the gas 3 from the duct inlet Di to the duct outlet Do. The blower 22 is provided inside the duct 21. The blower 22 sucks in the gas 3 from the duct inlet Di side of the duct 21, boosts the gas 3, and discharges the gas 3 to the duct outlet Do side of the duct 22.
When the blower 22 is operated, the gas 3 flows from the duct inlet Di to the duct outlet Do.
[0024]
The temperature controller 23 is a device that heats or cools the gas 3. The temperature controller 23 is provided on the downstream side of the blower 22 inside the duct 21.
When the gas 3 is heated, for example, the temperature controller 23 includes an electric heater. When the gas 3 is cooled, for example, the temperature controller 23 includes a liquid cooling jacket.
When the temperature controller 23 is activated, the gas 3 sent from the blower 22 is heated or cooled and flows to the duct outlet Do.
[0025]
The rectifying plate 24 is a group of plates that rectifies the flow of the gas 3 inside the duct 21.
The rectifying plate 24 is provided at a bent portion of the duct 21 on the downstream side of the temperature controller 23.
[0026]
The outlet baffle plate 25 is a plate member that changes the direction of the gas 3 that blows downward from the rectifying plate 24 and flows toward the duct outlet Do. The outlet baffle plate 25 is provided at the corner of the duct 21 on the upstream side of the duct outlet Do.
[0027]
The inlet baffle plate 26 is a plate member for changing the direction of the gas 3 sucked into the blower 22 upward from the duct inlet Di. The inlet baffle plate 26 is provided at the corner of the duct 21 downstream of the duct inlet Di of the duct 21.
[0028]
The substrate heat treatment apparatus 1 preferably has a plurality of heat treatment furnaces 20 connected in series.
Further, it is preferable that a substrate transport gantry feeding mechanism 40 described later can sequentially move the substrate transport gantry 10 to each specific position X unique to the plurality of heat treatment furnaces 20.
Moreover, it is preferable to arrange | position the adjacent heat processing furnace 20 so that the direction where each gas is sent may become reverse.
A plurality of heat treatment furnaces 20 are arranged at a predetermined arrangement pitch H, and the specific positions X are continuous. Adjacent heat treatment furnaces 20 are joined to each other, and the gaps at the specific positions X are airtight.
While the substrate transport frame 10 moves to each specific position X of the continuous heat treatment furnace 20, each heat treatment furnace 20 performs each heat treatment on the substrate 2 accommodated in the substrate transport frame 10. A plurality of heat treatment furnaces 20 having a predetermined function are arranged according to a time series process of heat treatment conditions (for example, temperature history) to be applied to the substrate. For example, the temperature controller of the heat treatment furnace 20 in charge of the heat treatment process includes an electric heater. Moreover, the temperature controller of the heat treatment furnace 20 in charge of the cooling process has a cooling jacket.
[0029]
The gate valve 50 is a valve for blocking each specific position X of the connected heat treatment furnaces from the surrounding environment, and includes an inlet side gate valve 51, an outlet side gate valve 52, and an intermediate gate valve 53.
The inlet side gate valve 51 is provided outside the specific position X of the heat treatment furnace 20 that performs the first heat treatment process.
The outlet side gate valve 52 is provided outside the specific position X of the heat treatment furnace 20 that performs the final heat treatment process.
An intermediate gate valve 53 is provided between the heat treatment furnace 20 that performs the heat treatment process of heating and the heat treatment furnace 20 that performs the heat treatment process of cooling.
[0030]
1 to 3 show that a plurality of heat treatment furnaces 20 are arranged such that the specific positions X are continuous. The specific positions X unique to the plurality of heat treatment furnaces 20 are continuously connected.
When the substrate transport gantry feed mechanism 40 described later moves the substrate transport gantry 10 in the direction in which the heat treatment furnaces 20 are connected, the substrate transport gantry feed mechanism 40 can be sequentially moved to each specific position X unique to the plurality of heat treatment furnaces 20.
For convenience of explanation, numbers 1 to 14 are assigned to the heat treatment furnaces in the order in which the substrate transport platform 10 moves. In FIG. 2, the first to fifth heat treatment furnaces perform heat treatment, the sixth heat treatment furnace performs heat treatment, the seventh to tenth heat treatment furnaces perform heat treatment, and the eleventh heat treatment furnace performs heat treatment. Heat treatment is performed, and the 12th to 14th heat treatment furnaces perform cooling treatment.
[0031]
The gas filter 30 is a filter that filters the gas 3, and includes an inlet gas filter 31 and an outlet gas filter 32. The inlet gas filter 31 is a filter provided between the duct outlet Do and the housing inlet Vi. The outlet gas filter 32 is a filter provided between the duct inlet Di and the container outlet Vo.
The filter is, for example, a metal mesh filter.
The inlet gas filter 31 is fixed to the duct 21 by closing the duct outlet Do, or is fixed to the substrate transport frame 10 by closing the container inlet Vi.
The outlet gas filter 32 is fixed to the duct 21 by closing the duct inlet Di, or is fixed to the substrate transport frame 10 by closing the container outlet Vo.
[0032]
The substrate transport gantry feed mechanism 40 is a device that can fix the substrate transport gantry 10 to a specific position X unique to the heat treatment furnace 20 and move the substrate transport gantry 10 from the specific position X. 42, an exit side substrate transfer gantry pusher 43, a traverse rail 44, and a return rail 45.
[0033]
The feed rail 41 is a rail for sequentially moving the substrate transport platform 10 to each specific position X unique to the plurality of heat treatment furnaces 20. The feed rail 41 is provided in the lower part of the continuous specific position X. The feed rail 41 guides the substrate transport frame 10 in the direction in which the rail is laid.
[0034]
The entrance-side substrate transport gantry pusher 42 is a device that pushes the substrate transport gantry 10 guided by the feed rail 41, and is, for example, an electric cylinder arranged horizontally. The electric cylinder is disposed so that the piston faces the specific position X where the inlet side gate valve 51 opens and closes. The entrance-side substrate transfer platform pusher 42 can move the substrate transfer platform 10 by a distance equal to the arrangement pitch H of the heat treatment furnace.
The exit-side substrate transport gantry pusher 43 is a device that pushes the substrate transport gantry 10 guided by the feed rail 41, and is, for example, an electric cylinder disposed horizontally. The electric cylinder is disposed so that the piston faces the specific position X where the outlet side gate valve 52 opens and closes. The exit-side substrate transport gantry pusher 43 can move the substrate transport gantry 10 by a distance equal to the arrangement pitch H of the heat treatment furnace.
The entrance-side substrate transport gantry pusher 42 and the outlet-side substrate transport gantry pusher 43 sequentially move the substrate transport gantry 10 connected in series to the arrangement pitch H, whereby the individual substrate transport gantry 10 The consecutive specific positions X can be moved sequentially.
[0035]
The traverse rail 44 is a rail that feeds the substrate transport frame 10 that has come out of the outlet-side gate valve 52 in a direction orthogonal to the feed direction of the feed rail 41.
The return rail 45 is a rail that moves the substrate transport platform 10 traversed by the traversing rail 44 to the side where the inlet side gate valve 51 is located through the outside of the continuous heat treatment furnace 20.
[0036]
Next, the operation of the substrate heat treatment apparatus according to the embodiment will be described.
FIG. 5 is an operation explanatory view of the substrate heat treatment apparatus according to the embodiment.
[0037]
First, an example of the temperature history will be described.
First temperature raising process: The substrate is heated and heated from room temperature to a predetermined temperature T1 in a predetermined time.
First holding process: The substrate is maintained at a predetermined temperature T1 for a predetermined time.
Second temperature raising process: The substrate is heated and heated from a predetermined temperature T1 to a predetermined temperature T2 in a predetermined time.
Second holding process: The substrate is maintained at a predetermined temperature T2 for a predetermined time.
Cooling process: The substrate is cooled from a predetermined temperature T2 degrees to a predetermined temperature T1 in a predetermined time.
[0038]
The operation of the substrate heat treatment apparatus will be described by paying attention to the substrate 2 supported on one substrate transport base 10.
The inlet side gate valve 51 opens the inlet.
The entrance-side substrate transport gantry pusher 42 moves the substrate transport gantry 10 to the specific position X of the first heat treatment furnace 20. In the first heat treatment furnace 20, the storage body inlet Vi communicates with the duct outlet Do, and the storage body outlet Vo communicates with the duct inlet Di.
An inlet side gate valve 51 closes the inlet.
[0039]
The blower 22 and the temperature controller 23 of the first heat treatment furnace 20 operate. The gas 3 is pressurized by the blower 22 and blown from the duct inlet Di side of the duct 21 to the duct outlet Do side. The gas 3 is heated by the temperature controller 23 to increase the temperature. The gas 3 discharged from the temperature controller 23 is rectified by the rectifying plate 24 and changes its direction downward. The rectified gas 3 blows downward. The direction of the gas 3 is changed by the outlet baffle plate 25 and flows toward the duct outlet Do. The gas 3 is filtered by the inlet gas filter 31 and flows to the storage body inlet Vi of the substrate transport frame 10.
When the gas 3 flows from the storage body inlet Vi to the storage body outlet Vo, it flows through the gaps between the plurality of substrates 2 and heats the plurality of substrates 2. The gas 3 is filtered by the outlet gas filter 32 and enters the duct inlet Di.
The direction of the gas 3 is changed by the inlet baffle plate 26 and is sucked into the blower 22 from the duct inlet Di upward.
The gas 3 is again blown into the duct 21 by the blower 22 and circulates in the duct.
The blower 22 and the temperature controller 23 are controlled by the output of a temperature sensor (not shown) provided in the duct, and the temperature of the substrate in the substrate transport frame 10 is raised to a desired temperature in a desired time. The heat treatment in the heat treatment furnace 20 is performed.
[0040]
When the heat treatment in the first heat treatment furnace 20 is completed, the inlet side gate valve 51 opens the inlet. The entrance-side substrate transfer stand pusher 42 moves the next substrate transfer stand 10 to the specific position X of the first heat treatment furnace.
The substrate transfer platform 10 is pushed by the next substrate transfer platform 10 and moves to the specific position X of the second heat treatment furnace 20. In the second heat treatment furnace 20, the storage body inlet Vi communicates with the duct outlet Do, and the storage body outlet Vo communicates with the duct inlet Di.
An inlet side gate valve 51 closes the inlet.
[0041]
Hereinafter, when the above-described operation is repeated, the substrate transport frame 10 moves from the first heat treatment furnace 20 to the second, third,. When moving from the first heat treatment furnace 20 to the second, third,..., Eleventh heat treatment furnaces 20 in order, the substrate 2 accommodated in the substrate transport frame 10 receives a desired temperature history.
[0042]
The intermediate gate valve 54 opens the boundary between the eleventh heat treatment furnace 20 and the twelfth heat treatment furnace 20.
The substrate carrier 10 enters the twelfth heat treatment furnace 20 and undergoes a cooling process. The substrate transport base 10 moves sequentially from the specific position X of the twelfth heat treatment furnace 20 to the specific position X of the thirteenth and fourteenth heat treatment furnaces. When moving sequentially from the specific position X of the twelfth heat treatment furnace 20 to the specific position X of the thirteenth and fourteenth heat treatment furnaces 20, the substrate 2 accommodated in the substrate transport frame 10 is subjected to a predetermined cooling process. The
The outlet side gate valve 52 opens the outlet.
The substrate carrier 10 exits the heat treatment furnace from the outlet.
The substrate transport frame 10 moves along the transverse rail 44 and the return rail 45, and moves to the side where the inlet side gate valve 51 is located through the outside of the continuous heat treatment furnace 20.
The board | substrate 2 is taken out from the board | substrate conveyance mount 10, and is conveyed to a post process.
[0043]
If the substrate heat treatment apparatus of the above-described embodiment is used, the substrate 2 is accommodated in the substrate transfer frame 10 and the substrate transfer frame 10 is fixed at a specific position X of the heat treatment furnace 20, so that the gas 3 is placed on the surface of the substrate 2. The substrate 2 can be subjected to a predetermined heat treatment.
In addition, since the plurality of heat treatment furnaces 20 are arranged and the substrate transport frame 10 is sequentially sent to the specific position X of the plurality of heat treatment furnaces 20, and the heat treatment is performed on the substrate 2 in each heat treatment furnace 20, the heat treatment with a desired history is performed on the substrate 2. Can be applied efficiently.
In addition, since the plurality of substrates 2 are stored in the substrate transport frame 10, the plurality of substrates 2 can be subjected to heat treatment at the same time, and the heat treatment throughput is improved.
Moreover, since the gas filter is provided in the passage of the gas 3 in the heat treatment furnace 20, it is possible to prevent impurities from adhering to the substrate 2.
Further, since the substrate 2 is stored vertically in the substrate transport frame 10, impurities are less likely to adhere to the substrate 2.
In addition, since the storage body 11 of the substrate transport gantry 10 is composed of a heat insulating material and a metal plate that covers the heat insulating material, the heat transfer from the substrate 2 is reduced when heat treatment is performed, and the substrate transport gantry 10 Variations in heat treatment between the plurality of substrates 2 housed in the substrate can be reduced, and impurities can be prevented from adhering to the substrate 2.
Further, since the upper and lower sides of the vertical substrate 2 are engaged and stored in the substrate transport frame, the substrate 2 can be easily mounted on the substrate transport frame 10 and the storage mode is suitable for automation.
[0044]
The present invention is not limited to the embodiments described above, and various modifications can be made without departing from the scope of the invention.
Although the storage body inlet or the storage body outlet has been described as a rectangular opening, the present invention is not limited to this, and an opening having another shape may be used.
Moreover, although the duct inlet or the duct outlet was demonstrated as a rectangular opening, it is not limited to this, Other shapes may be sufficient.
Moreover, although it was said that it was a pair of opening which a storage body entrance and a storage body exit face, it is not limited to this.
[0045]
【The invention's effect】
As described above, the substrate heat treatment apparatus for heat treating the substrate of the present invention has the following effects depending on its configuration.
Heat treatment by providing a blower and a temperature controller in the duct for the storage body entrance and storage body outlet of the substrate transport base fixed at a specific position by moving the substrate transport base that stores the substrate by the substrate transport base feed mechanism It is possible to communicate with the furnace duct inlet and duct outlet, and when the blower and temperature controller are operated, the substrate stored in the substrate carrier can be heat treated, and after the heat treatment is finished, the substrate carrier gantry feed mechanism Can move the substrate transport frame from a specific position.
In addition, since the gas filter is provided between the duct outlet and the container inlet, the filtered gas enters the substrate transport frame and impurities are less likely to adhere to the substrate.
In addition, since the substrate transfer platform is sequentially moved to a specific position of each of the plurality of heat treatment furnaces by the substrate transfer platform feed mechanism, a series of heat treatments can be performed on the substrate while the substrate transfer platform moves to the plurality of heat treatment furnaces. it can.
In addition, each temperature controller is individually controlled, and gives a desired temperature history to the substrate supported on the substrate transport frame, so that heat treatment can be performed more efficiently than when there are no multiple heat treatment furnaces. it can.
In addition, since the support member of the substrate transport frame supports a plurality of substrates with their surfaces aligned in parallel, the throughput of the heat treatment of the substrates is improved.
In addition, since the support member of the substrate transport gantry supports a plurality of substrates in a vertical direction with their surfaces aligned in parallel, the throughput of the heat treatment of the substrate is improved, and impurities are less likely to adhere to the substrate.
In addition, since the upper and lower rails that engage with the upper and lower sides of the substrate are provided on the substrate transport frame, it is easy to store and remove the substrate from the substrate transport frame.
In addition, since the storage body has a wall structure that hermetically surrounds a group of a plurality of substrates while leaving the storage body inlet and the storage body outlet, variations in heat treatment of the substrates are reduced.
Moreover, since the said wall structure has the heat insulation member made from a heat insulating material, and the coating | coated member made from the metal plate which covers this heat insulating member without gap, it can suppress that the dust of a heat insulating material adheres to a board | substrate.
Therefore, it is possible to provide a substrate heat treatment apparatus having a short overall length, high accuracy of heat treatment of the substrate, high productivity, and less risk of contamination of the substrate.
[0046]
[Brief description of the drawings]
FIG. 1 is a bird's eye view of a substrate heat treatment apparatus according to an embodiment.
FIG. 2 is a side sectional view of the substrate heat treatment apparatus according to the embodiment.
FIG. 3 is a cross-sectional view taken along line AA of the substrate heat treatment apparatus according to the embodiment.
FIG. 4 is a cross-sectional view of the substrate heat treatment apparatus according to the embodiment, taken along the line B-B.
FIG. 5 is an operation explanatory view of the substrate heat treatment apparatus according to the embodiment.
[Explanation of symbols]
Di duct entrance
Do duct outlet
Vi container entrance
Vo storage body outlet
H Arrangement pitch
X Specific position
1 Substrate heat treatment equipment
2 Substrate (glass substrate)
3 Gas
10 Board carrier
11 Storage body
12 Support members
12u
12d lower pier
13 trolleys
20 Heat treatment furnace
21 Duct
22 Blower
23 Temperature controller
24 Current plate
25 Exit baffle plate
26 Entrance baffle
30 Gas filter
31 Inlet gas filter
32 Outlet gas filter
40 Substrate transport frame feed mechanism
41 Feed rail
42 Inlet side substrate transfer stand pusher
43 Outlet side substrate transfer stand pusher
44 traverse rail
45 Return rail
50 Gate valve
51 Inlet gate valve
52 Exit side gate valve
53 Middle gate valve

Claims

A substrate heat treatment apparatus for heat treating a substrate,
A plurality of substrates to leave the container inlet and a container outlet a pair of openings having an opening cross-section facing the end faces of the plurality of substrates in parallel the front surface accommodated inside the edges of the substrate to each other A substrate transport pedestal having a storage body having a wall structure that hermetically surrounds the group and a moving body that moves by moving the storage body;
A heat treatment furnace having a duct communicating with a duct inlet and a duct outlet as a pair of opening surfaces, a blower for blowing gas from the duct inlet to the duct outlet, and a temperature controller for heating or cooling the gas;
A substrate transfer platform feed mechanism capable of fixing the substrate transfer platform to a specific position unique to the heat treatment furnace and moving the substrate transfer platform from the specific position;
With
When the substrate transport frame is fixed at the specific position, the container inlet communicates with the duct outlet, the container outlet communicates with the duct inlet, and the gas passes from the duct outlet to the container inlet. entering and circulating through the temperature controller and the blower to the duct outlet from the duct inlet enters into the duct inlet from said container outlet through the gap of the plurality of substrates surrounded in the wall structure to To
A substrate heat treatment apparatus.

A substrate heat treatment apparatus for heat treating a substrate,
A storage body having a wall structure that hermetically surrounds the substrate, leaving a storage body inlet and a storage body outlet, which are a pair of openings having an opening cross section facing the end face of the edge of the substrate ; A substrate transfer platform having a gas filter that filters the gas by closing at least one opening of the storage body entrance or the storage body outlet, and a moving body that moves by placing the storage body;
A heat treatment furnace having a duct communicating with a duct inlet and a duct outlet as a pair of opening surfaces, a blower for blowing gas from the duct inlet to the duct outlet, and a temperature controller for heating or cooling the gas;
A substrate transfer platform feed mechanism capable of fixing the substrate transfer platform to a specific position unique to the heat treatment furnace and moving the substrate transfer platform from the specific position;
With
When the substrate transport frame is fixed at the specific position, the storage body inlet communicates with the duct outlet, and the storage body outlet communicates with the duct inlet;
A substrate heat treatment apparatus.

A substrate heat treatment apparatus for heat treating a substrate,
A storage body having a wall structure that hermetically surrounds the substrate, leaving a storage body inlet and a storage body outlet, which are a pair of openings having an opening cross section facing the end face of the edge of the substrate ; A plurality of substrate transfer platforms having a moving body that moves by placing the storage body thereon;
A plurality of heat treatments connected in series with a duct that communicates between a duct inlet and a duct outlet, which are a pair of opening surfaces, a blower that blows gas from the duct inlet to the duct outlet, and a temperature controller that heats or cools the gas A furnace,
A plurality of the substrate transfer gantry, fixed to a specific position specific to the plurality of heat treatment furnaces, and further can be moved from the specific position;
With
The substrate transport gantry feed mechanism is provided on the side of the specific position of the heat treatment furnace where the first heat treatment process is performed, and the specification of the heat treatment furnace which performs the final heat treatment process and an inlet side pusher which is a device that pushes the substrate transport carriage The outlet side pusher, which is a device that is provided on the position side and pushes the substrate transport carriage,
A plurality of the substrate transfer platforms, in which the inlet side pusher and the outlet side pusher are connected in series, are pushed in the direction moved by the inlet side pusher and sequentially pushed in the direction opposite to the direction moved by the outlet side pusher. By moving, it is possible to sequentially move to the specific position unique to each heat treatment furnace connected to each substrate transport carriage,
When the substrate transport frame is fixed at the specific position, the storage body inlet communicates with the duct outlet, and the storage body outlet communicates with the duct inlet;
A substrate heat treatment apparatus.

A substrate heat treatment apparatus for heat treating a substrate,
A storage body having a wall structure that hermetically surrounds the substrate, leaving a storage body inlet and a storage body outlet, which are a pair of openings having an opening cross section facing the end face of the edge of the substrate ; A substrate carrier having a moving body that moves with the storage body mounted thereon;
A plurality of heat treatments connected in series with a duct that communicates between a duct inlet and a duct outlet, which are a pair of opening surfaces, a blower that blows gas from the duct inlet to the duct outlet, and a temperature controller that heats or cools the gas A furnace,
A substrate transfer platform feed mechanism capable of fixing the substrate transfer platform to a specific position unique to the heat treatment furnace and moving the substrate transfer platform from the specific position;
With
When the substrate transport frame is fixed at the specific position, the storage body inlet communicates with the duct outlet, the storage body outlet communicates with the duct inlet,
The substrate transport gantry feed mechanism is capable of sequentially moving the substrate transport cradle to each specific position unique to the plurality of heat treatment furnaces,
The gas blowing directions of the adjacent heat treatment furnaces are opposite to each other,
A substrate heat treatment apparatus.

A substrate heat treatment apparatus for heat treating a substrate,
A plurality of substrates with their surfaces parallel to each other are stored inside, and a plurality of substrates are left, leaving a storage body inlet and a storage body outlet, which are a pair of openings having an opening cross section facing an end surface of the edge of the substrate. A substrate transport frame having a storage body having a wall structure that hermetically surrounds the group and a moving body that moves by placing the storage body;
A heat treatment furnace having a duct communicating with a duct inlet and a duct outlet as a pair of opening surfaces, a blower for blowing gas from the duct inlet to the duct outlet, and a temperature controller for heating or cooling the gas;
A substrate transfer platform feed mechanism capable of fixing the substrate transfer platform to a specific position unique to the heat treatment furnace and moving the substrate transfer platform from the specific position;
With
When the substrate transport frame is fixed at the specific position, the storage body inlet communicates with the duct outlet, the storage body outlet communicates with the duct inlet,
The duct has a space in which the substrate transport frame can be disposed at a lower portion, the duct inlet and the duct outlet are provided across the space, and the blower and the temperature controller are more than the space in the duct. A plate member provided above and for changing the direction of the gas blown downward and flowing toward the duct outlet or a plate member for changing the flow of gas sucked into the blower upward from the duct inlet At least one plate member is provided in the duct;
The substrate transport frame supports a plurality of substrates in a vertical orientation with the surfaces aligned in parallel,
The plate member is inclined so that the surface faces the duct inlet or the duct outlet;
A substrate heat treatment apparatus.

A substrate heat treatment apparatus for heat treating a substrate,
A plurality of substrates to leave the container inlet and a container outlet a pair of openings having an opening cross-section facing the end faces of the plurality of substrates in parallel the front surface accommodated inside the edges of the substrate to each other A substrate transport pedestal having a storage body having a wall structure that hermetically surrounds the group and a moving body that moves by moving the storage body;
A heat treatment furnace having a duct communicating with a duct inlet and a duct outlet as a pair of opening surfaces, a blower for blowing gas from the duct inlet to the duct outlet, and a temperature controller for heating or cooling the gas;
A substrate transfer platform feed mechanism capable of fixing the substrate transfer platform to a specific position unique to the heat treatment furnace and moving the substrate transfer platform from the specific position;
With
When the substrate transport frame is fixed at the specific position, the storage body inlet communicates with the duct outlet, and the storage body outlet communicates with the duct inlet;
A pair of side wall members, a floor member, and a ceiling member, each of which has a quadrilateral shape, form a cubic box shape in which the sides are connected to each other, and a pair of opposed openings in the cubic box shape are formed as the container inlet port. It corresponds to the storage body outlet,
A substrate heat treatment apparatus.

A substrate heat treatment apparatus for heat treating a substrate,
A plurality of substrates to leave the container inlet and a container outlet a pair of openings having an opening cross-section facing the end faces of the plurality of substrates in parallel the front surface accommodated inside the edges of the substrate to each other A substrate transport pedestal having a storage body having a wall structure that hermetically surrounds the group and a moving body that moves by moving the storage body;
A heat treatment furnace having a duct communicating with a duct inlet and a duct outlet as a pair of opening surfaces, a blower for blowing gas from the duct inlet to the duct outlet, and a temperature controller for heating or cooling the gas;
A substrate transfer platform feed mechanism capable of fixing the substrate transfer platform to a specific position unique to the heat treatment furnace and moving the substrate transfer platform from the specific position;
With
The wall structure has a heat insulating member having a heat insulating property and a covering member made of a metal plate covering the heat insulating member without a gap,
When the substrate transport frame is fixed at the specific position, the container inlet communicates with the duct outlet, the container outlet communicates with the duct inlet, and the gas passes from the duct outlet to the container inlet. entering and circulating through the temperature controller and the blower to the duct outlet from the duct inlet enters into the duct inlet from said container outlet through the gap of the plurality of substrates surrounded in the wall structure to To
A substrate heat treatment apparatus.