JP4653358B2 - Integrated valve - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an integrated valve provided with a gas supply device used in a semiconductor manufacturing apparatus or the like.
[0002]
[Prior art]
Conventionally, semiconductor lasers, light emitting diodes, and the like are formed by, for example, metal organic chemical vapor deposition. In the metal organic chemical vapor deposition method, a substrate in a chamber is heated to about 1200 ° C., a gas containing an organic metal is supplied from a gas supply device to the chamber in a predetermined amount, and is deposited on the substrate. Since the gas supply apparatus used in the metal organic chemical vapor deposition method has low water solubility of the organic metal, the flow path is washed away with water during maintenance. If the gas supply device is used in a state where moisture remains in the flow path, the organic metal may combine with the water remaining in the flow path and oxidize, which may reduce product quality. Therefore, at the time of maintenance, the gas supply device is heated for about two days to completely remove moisture in the flow path. As a heating method of the gas supply device, there is one shown in FIG.
[0003]
The gas supply device 100 in FIG. 7 includes an input on-off valve 101, a purge valve 102, an electromagnetic valve 103 with a mass flow meter, an output on-off valve 105, and a purge output valve 104 from the left in the figure, an input block 106, a joint block 107, 108 and output block 109 are connected to form a flow path. The input block 106 and the output block 109 are equipped with rod heaters 110 and 111 that generate heat when a voltage is applied thereto. The output block 109 is equipped with a temperature sensor 112 for measuring the temperature of the gas supply device 100. The rod heaters 110 and 111 and the temperature sensor 112 are connected to the control device 113 of the gas supply device 100 to control the voltage applied to the rod heaters 110 and 111. Therefore, the gas supply device 100 is heated to a constant temperature by the rod heaters 110 and 111.
[0004]
However, when the gas supply device 100 of FIG. 7 is attached to an attachment plate (not shown) and integrated, it takes much labor for maintenance. That is, when removing the gas supply device 100 from a mounting plate (not shown) for maintenance, it is necessary to remove the rod heaters 110 and 111 and the temperature sensor 112 from the input block 106 and the output block 109. Further, when the gas supply device 100 is attached to a mounting plate (not shown) after the maintenance is completed, it is necessary to attach the rod heaters 110 and 111 and the temperature sensor 112 to the input block 106 and the output block 109. This operation needs to be performed on all of the gas supply devices 100 attached to the integrated valve, which is very troublesome.
[0005]
With respect to this problem, the integrated valve 115 shown in FIG. 8 enables the gas supply device 116 to be attached / detached without attaching / detaching the heater. That is, as shown in FIG. 9, the mounting plate 120 is provided with a base plate 118 for mounting the flow path block 117 and the like of the gas supply device 116. On both sides of the base plate 118, a pair of clips 121, 121 are attached so that an elastic biasing force acts inward. A heater block 122 is attached to each of the pair of clips 121 and 121. The heater blocks 122 and 122 are configured such that an inner block 123 that directly contacts the flow path block 117 and the like and an outer block 124 that incorporates a tape heater 125 are overlapped and fixed by screws 126 and 126.
[0006]
Therefore, the integrated valve 115 shown in FIGS. 9 and 8 pushes the heater blocks 122 and 122 outward against the urging force of the pair of clips 121 and 121 when the gas supply device 116 is attached to the attachment plate 120. . The gas supply device 116 is fitted between the heater blocks 122 and 122 that have been spread and placed on the base plate 118. The heater blocks 122 and 122 are separated from the heater blocks 122 and 122 and are brought into close contact with the side surface of the gas supply device 116 by the urging force of the pair of clips 121 and 121. Then, the gas supply device 116 is fixed to the base plate 118 with screws or the like. In this case, when the heater block 122 is heated by causing the tape heater 125 to generate heat, the heat of the heater block 122 is transmitted to the flow path block 117 and the like, and the gas supply device 116 is heated.
[0007]
On the other hand, when removing it a gas supply device 116 from the mounting plate 120 releases the fixation of the gas supply device 116 and the base plate 118. The heater blocks 122 and 122 are spread outward against the urging force of the pair of clips 121 and 121, and the gas supply device 116 is extracted. Therefore, in the integrated valve 115, the gas supply device 116 can be attached to and detached from the mounting plate 120 without removing the heater blocks 122 and 122.
[0008]
[Problems to be solved by the invention]
However, in the integrated valve 115 shown in FIG. 9, the heater blocks 122 and 122 are attached to the side surface of each gas supply device 116. Here, the gas supply devices 116 are individually heated because each gas supply device 116 is heated to a constant temperature, the vaporization temperature is high, and liquefaction silane that is liable to be liquefied unless external heat is applied at room temperature This is because the quality of products produced in a chamber or the like is improved by controlling the temperature with high accuracy. Therefore, when a plurality of gas supply devices 116 are gathered and integrated as shown in FIG. 8, it is necessary to provide a gap S for arranging the heater blocks 122 and 122 between the adjacent gas supply devices 116. It was. Therefore, in the conventional integrated valve 115, since the line pitch Q is large, the width dimension becomes long, and the compactness that is the greatest merit of the integrated valve is impaired.
[0009]
Particularly in the semiconductor manufacturing process, the accuracy of the gas flow rate has a great influence directly on the quality, and there is a problem in that it is strongly desired to make the integrated valve compact and to reduce the flow loss. Further, as described above, when the gas supply devices 116 are heated in order to completely remove moisture, it is not necessary to heat each gas supply device 116 to a constant temperature, and the integrated valves shown in FIGS. It cannot be said that 115 is heating the gas supply device 116 appropriately.
[0010]
Accordingly, an object of the present invention is to provide a compact integrated valve in which the installation interval of the gas supply device is shortened.
[0011]
[Means for Solving the Problems]
In order to solve this problem, the invention according to claim 1 is an integrated valve in which a plurality of gas supply devices for supplying working gas are collected and fixed to the mounting plate, and the gas supply device of the mounting plate is fixed. on the opposite side of the the surface, it has a mounting plate heating means for heating said mounting plate, said mounting plate heating means comprises a sheet-like heating element, heat the heating member to generate A heat insulating member that insulates, and a fixing member that fixes the heating member and the heat insulating member to the mounting plate, and the heating member is in close contact between the mounting plate and the heat insulating member. the fixing member is fixed to the mounting plate by, characterized in der Rukoto, which can exchange the heating member without removing the gas supply device.
[0012]
Therefore, according to the first aspect of the present invention, the mounting plate on which the plurality of gas supply devices are installed is heated by the mounting plate heating means. The heat generated by the mounting plate is transmitted to the bottom surface of the gas supply device to heat the gas supply device. Therefore, it is not necessary to attach a heater or the like for heating the gas supply device to the side surface or the like of the gas supply device. Therefore, the gas supply device can be attached to the mounting plate in close proximity.
[0014]
In the first aspect of the present invention, a heating member and a heat insulating member are stacked on a mounting plate and fixed by a fixing member, and a plurality of gas supply devices are attached. When the heating member is heated, the heat is transmitted to the mounting plate to heat the mounting plate. The heat generated by the mounting plate is transmitted to the bottom surface of the gas supply device and heats the gas supply device. Here, since the heat generated by the heating member is prevented from escape by the heat insulating member, it is efficiently transmitted to the mounting plate.
[0019]
The invention described in claim 2 is the invention described in claim 1, characterized in that the gas supply device supplies a gas containing an organic metal.
[0020]
Therefore, in the invention described in claim 2 , in addition to the operation of the invention described in claim 1 , the gas supply device controls the flow rate of the gas containing the organic metal. During maintenance, the gas supply device is washed with water or the like. And a mounting plate heating member is heated and a gas supply apparatus is heated. By this heating, the gas supply device completely removes moisture adhering to the inner wall of the flow path. Therefore, the gas containing an organic metal is not oxidized when flowing through the gas supply device.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
(First embodiment)
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. The integrated valve 1 shown in FIG. 1 has a plurality of gas supply devices 2 attached to a mounting plate 21. The gas supply device 2 includes a manual valve 3, a pressure regulating valve (regulator) 4, a pressure gauge 5, an input on / off valve 6, a purge valve 7, an electromagnetic valve 8 with a mass flow meter, and an output on / off valve 9 from the right side in the figure. Connected via the blocks 10, 11, 12, 13, 15, 18, 19 and the joint blocks 14, 16, 17, an integrated line through which the working gas flows is formed. In the present embodiment, a gas containing an organic metal is used as the working gas.
[0022]
The mounting plate 21 is provided with legs for forming a space between the mounting plate 21 and the installation surface on which the integrated valve 1 is installed. A mounting plate heating member 22 for heating the mounting plate 21 is disposed in the space. As shown in FIG. 2, the mounting plate heating member 22 is connected to a conducting wire 20 for applying a voltage, and generates heat when a voltage is applied. As shown in FIG. 3, the mounting plate heating member 22 has a substantially square shape, and has an area approximately equal to the installation area of the plurality of gas supply devices 2 mounted on the surface of the mounting plate 21.
[0023]
As shown in FIG. 4, the attachment plate heating member 22 is a member in which a sheet-like heater 23 and a sponge 24 are sandwiched between fixed plates 25. The mounting plate heating member 22 is fixed to the mounting plate 21 by fitting the through holes of the intermediate member 27 and the fixing plate 25 into the bolts 26 inserted through the mounting plate 21 and fastening the nuts 28. The reason why the intermediate member 27 is disposed between the mounting plate 21 and the fixing plate 25 is to fasten the nut 28 with a constant force at each fixing point and to bring the heater 23 into close contact with the mounting plate 21 with substantially equal pressure. It is. Therefore, the mounting plate heating member 22 is fixed to the mounting plate 21 so as to transmit the generated heat to the mounting plate 21 almost evenly.
[0024]
The mounting plate 21 is formed with screw holes for fixing the plurality of gas supply devices 2 with screws. This screw hole is formed so that the side surfaces of the adjacent gas supply devices 2 are close to each other. Therefore, the plurality of gas supply devices 2 are attached to the mounting plate 21 and integrated in a state of being close to the adjacent gas supply devices 2.
[0025]
When such an integrated valve 1 is maintained, cleaning water is supplied to each gas supply device 2 to wash away the gas containing organic metal adhering to the flow path. Then, a voltage is applied to the heater 23 to generate heat. The heat of the heater 23 is directly transmitted to the back surface of the mounting plate 21 to heat the mounting plate 21. The heat of the mounting plate 21 is transmitted to the bottom surface of each gas supply device 2 in contact with the surface. Therefore, the plurality of gas supply devices 2 are integrally heated by the heated mounting plate 21. Here, since the heater 23 is thermally insulated by the sponge 24, the generated heat is efficiently transmitted to the mounting plate 21. The gas supply device 2 is heated by the mounting plate 21 for about two days, and the water in the flow path is completely removed.
[0026]
Therefore, according to the integrated valve 1 of the first embodiment, the mounting plate 21 is heated by the mounting plate heating member 22 and the plurality of gas supply devices 2 are integrally heated. There is no need to attach a heating member such as a heater, and there is no need to provide a gap S between the gas supply devices 2 unlike the conventional integrated valve 115 shown in FIG. Therefore, for example, in the conventional integrated valve 115 shown in FIG. 8, the line pitch Q is about 50 mm, whereas in the integrated valve 1 of the first embodiment shown in FIG. As a result, the line pitch was reduced by about 10 mm. Therefore, in the integrated valve 1 of 1st Embodiment, the installation space | interval of the gas supply apparatus 2 could be made small, a width dimension could be shortened, and the integrated valve 1 whole was able to be made compact. It goes without saying that this effect becomes more prominent as the number of gas supply devices 2 attached to the attachment plate 21 increases. When the integrated valve 1 is used in a semiconductor manufacturing apparatus, it is possible to reduce the flow loss of the working gas, control the working gas with high accuracy, and improve product quality.
[0027]
Moreover, according to the integrated valve 1 of 1st Embodiment, since the attachment plate heating member 22 is detachably fixed to the attachment plate 21, even if the attachment plate heating member 22 breaks down, gas etc. The attachment plate warming member 22 can be replaced without removing the supply device 2, and maintenance is easy.
[0028]
Conventionally, the gas supply device is heated in a chamber or the like by controlling dichlorosilane, etc., which has a high vaporization temperature and is liable to be liquefied at normal temperature, which is liable to be liquefied without external heat. This was to improve the quality of the product. For this reason, it is assumed that each gas supply device 2 is heated to a constant temperature, and there is no technical idea for heating a plurality of gas supply devices 2 integrally. On the other hand, in the integrated valve 1 of the first embodiment, the gas supply device 2 is heated in order to completely remove moisture in the flow path of the gas supply device 2 and prevent oxidation of the gas containing the organic metal. is doing. Therefore, it is not necessary to heat each gas supply device 2 to a constant temperature, and there is no problem even if they are integrally heated. Rather, the adjacent gas supply devices 2 transmit heat to each other and are heated synergistically, which is preferable in terms of efficiency.
[0029]
( First reference example )
Next, the integrated valve of the first reference example according to the present invention will be described with reference to the drawings. The integrated valve of the first reference example shown in FIG. 5 is obtained by improving the mounting plate 21 of the integrated valve 1 of the first embodiment shown in FIG. Therefore, the outline of the integrated valve of the first reference example is the same as that of the integrated valve 1 of the first embodiment, and thus detailed description thereof is omitted. Further, the reference numerals used for the integrated valve 1 of the first embodiment are also used in the description of the integrated valve of the first reference example .
[0030]
In the integrated valve of the first reference example , the mounting plate 31 has a plurality of heater holes 31a. The heater hole 31a is formed almost directly under each integrated line. Therefore, the heater holes 31a are formed at equal intervals in parallel with the integrated line. A rod-shaped heater 32 is fitted in each heater hole 31a without a gap and fixed with a set screw (not shown).
[0031]
When the gas supply device 2 installed on the mounting plate 31 is heated, a voltage is applied to the rod heater 32 to generate heat. The heat generated by the bar heater 32 is directly transmitted to the inner wall of the heater hole 31a to heat the mounting plate 31. The heat of the mounting plate 31 is transmitted to the bottom surface of the gas supply device 2 to heat the gas supply device 2. Here, since each of the rod heaters 32 generates heat immediately below the gas supply device 2, the heat generated by the rod heater 32 is efficiently transmitted to the gas supply device 2.
[0032]
Therefore, according to the integrated valve of the first reference example , when the rod heater 32 breaks down, the broken rod heater 32 can be replaced without removing the gas supply device 2, so that maintenance is easy. In addition, since only the failed bar heater 32 can be replaced, the maintenance cost can be reduced as compared with the integrated valve 1 of the first embodiment.
[0033]
Further, according to the integrated valve of the first reference example , an arbitrary gas supply device 2 can be heated by individually applying a voltage to the rod heater 32 and locally heating the mounting plate 21. it can.
[0034]
( Second reference example )
Subsequently, an integrated valve of a second reference example according to the present invention will be described with reference to the drawings. The integrated valve of the second reference example shown in FIG. 6 is obtained by improving the mounting plate 21 of the integrated valve 1 of the first embodiment shown in FIG. Therefore, since the outline of the integrated valve of the second reference example shown in FIG. 6 is the same as that of the integrated valve 1 of the first embodiment shown in FIG. 1, detailed description thereof is omitted. Further, the reference numerals used for the integrated valve 1 of the first embodiment are also used in the description of the integrated valve of the second reference example .
[0035]
In the integrated valve of the second reference example , the mounting plate 41 is insert-molded. The mounting plate 41 is formed integrally with a rod-shaped heater 42 that generates heat when a voltage is applied. The heater 42 is bent so as to be arranged on the mounting plate 41 at equal intervals, and both ends are exposed to the outside so as to be connected to the electrodes.
[0036]
The integrated valve of the second reference example applies a voltage to the heater 42 when heating the gas supply device 2 attached to the attachment plate 41. Since the heater 42 is embedded in the mounting plate 41, the heat generated by the heater 42 is directly transmitted to the mounting plate 41. When the mounting plate 41 is heated, the heat is transmitted to the bottom surface of the gas supply device 2. Accordingly, the plurality of gas supply devices 2 are integrally heated by the mounting plate 41.
[0037]
Therefore, according to the integrated valve of the second reference example , it is not necessary to attach the attachment plate heating member 22 or the rod heater 32 to the attachment plate 41 as in the first and second embodiments, and the first embodiment Compared with the first embodiment and the first reference example , the structure can be simplified and further downsizing can be achieved.
[0038]
In addition, this invention is not limited to the said embodiment, A various change is possible in the range which does not deviate from the meaning.
[0039]
(1) For example, in the integrated valve 1 of the first embodiment, the gas supply device 2 is heated without measuring the temperature. On the other hand, a temperature sensor may be provided to heat the gas supply device 2 while measuring the temperature in the flow path.
[0040]
(2) For example, in the integrated valve 1 of the first embodiment, the mounting plate heating member 22 is formed in a substantially square shape and arranged to transmit heat to all of the plurality of gas supply devices 2. . On the other hand, the attachment plate heating member may be formed in a strip shape, and the attachment plate heating member may be fixed to the attachment plate 21 in parallel with the accumulation line. In this case, a temperature sensor is provided in the gas supply device 2, and the voltage applied to the mounting plate heating member is adjusted based on the measurement result of the temperature sensor so that each gas supply device 2 is heated to a constant temperature. Good. Further, the attachment plate heating member may be formed in a strip shape, and the attachment plate heating member may be fixed to the attachment plate 21 so as to be orthogonal to the accumulation line.
[0041]
(3) For example, in the integrated valve 1 of the first embodiment, the gas supply device 2 includes the input on-off valve 3 and the like. On the other hand, the type and arrangement of the members to be mounted may be changed. Moreover, you may change the kind, arrangement | positioning, etc., such as the flow path block 10 and the joint block 14 which connect each member.
[0042]
(4) For example, in the integrated valve of the first reference example , the rod heater 32 is mounted on the mounting plate 31 in parallel with the integrated line. On the other hand, a plurality of bar heaters may be arranged so as to be orthogonal to the integrated line. In this case, the rod-shaped heaters 32 may be arranged at equal intervals to heat the mounting plate 31 evenly, or the portion where the gas supply device 2 contacts the mounting plate 31 (for example, directly below the flow path block). You may make it arrange | position a rod-shaped heater and heat the mounting plate 31 locally.
[0043]
(5) For example, in the integrated valve of the second reference example , the bent heater 42 is formed integrally with the mounting plate 41. On the other hand, rod-shaped heaters that are shorter than the heater 42 may be arranged at equal intervals and formed integrally with the mounting plate 41.
[0044]
【The invention's effect】
As described above in detail, according to the integrated valve according to claim 1 of the present invention, the installation interval of the gas supply device can be reduced, the width dimension can be shortened, and the entire integrated valve can be made compact. be able to.
[0045]
In addition, according to the first aspect of the present invention, the mounting plate can be efficiently heated, and the heater, the heat insulating member, and the fixing member can be replaced without removing the gas supply device, and maintenance is easy. It is.
[0048]
According to the invention described in claim 2 , the yield rate can be improved.
[Brief description of the drawings]
FIG. 1 is a side view of an accumulation valve in a first embodiment according to the present invention.
FIG. 2 is also a schematic configuration diagram of an integrated valve.
FIG. 3 is also a plan view of the integrated valve conceptually showing the arrangement of the mounting plate heating member.
4 is an enlarged cross-sectional view of a portion A shown in FIG.
FIG. 5 is a view showing a structure of a mounting plate in the first reference example according to the present invention.
FIG. 6 is a view showing a structure of a mounting plate in a second reference example according to the present invention.
FIG. 7 is a diagram showing a heating structure of a conventional gas supply device.
FIG. 8 is a plan view of a conventional integrated valve.
9 is a view showing a heating structure of a gas supply device in the integrated valve shown in FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Accumulated valve 2 Gas supply apparatus 21 Mounting plate 22 Mounting plate heating member 31 Mounting plate 31a Heater hole 32 Rod heater 41 Mounting plate 42 Heater

Claims (2)

In an integrated valve in which a plurality of gas supply devices for supplying working gas are collected and fixed to a mounting plate,
On the opposite side of the gas supply device is fixed surface of said mounting plate, have a mounting plate heating means for heating said mounting plate,
The mounting plate heating means includes a sheet-shaped heating member, a heat insulating member for insulating heat generated by the heating member, and a fixing member for fixing the heating member and the heat insulating member to the mounting plate. Have
The heating member is fixed to the mounting plate by the fixing member in a state of being in close contact between the mounting plate and the heat insulating member,
Integrated valve, characterized in der Rukoto, which can exchange the heating member without removing the gas supply device. The integrated valve according to claim 1 ,
The integrated valve, wherein the gas supply device supplies a gas containing an organic metal.

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