JP4672840B2 - Liquid discharge head - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention provides a liquid discharge head for discharging liquid droplets from a discharge port.ToRelated.
[0002]
The “print” described in this specification is not only for forming significant information such as characters and figures, but also manifested so that it can be perceived visually by humans, regardless of significance. Regardless of whether or not it is, it includes a case where an image, a pattern, a pattern, or the like is widely formed on a print medium or a print medium is processed. The “print medium” includes not only paper used in a general printing apparatus but also those capable of receiving liquids such as fabric, resin film, metal plate, glass, ceramics, wood, and leather. Furthermore, “liquid” (sometimes described as “ink”) is to be interpreted widely as the definition of “print” above, and is given on a print medium so that images, patterns, patterns, etc. Refers to liquids that can be subjected to the formation of the printing medium, the processing of the printing medium, or the processing of the ink (for example, solidification or insolubilization of the coloring material in the ink applied to the printing medium), and includes any liquid used for printing.
[0003]
[Prior art]
The ink jet printer is a so-called non-impact image forming apparatus, has a feature that noise hardly occurs during printing, and can print on high-speed printing and various print media. For this reason, in addition to general printers, it is widely adopted as a device that bears a printing mechanism such as a word processor, a facsimile machine, and a copying machine.
[0004]
The liquid ejection head used in such an ink jet printer, that is, the print head, uses an electromechanical transducer such as a piezo element as a method for ejecting ink, irradiates an electromagnetic wave such as a laser, and heats the ink. There are known ones that discharge ink droplets by the action of heat generation, and those that heat ink by an electrothermal converter having a heating resistor and discharge ink drops by the action of film boiling.
[0005]
FIG. 17 shows a cross-sectional structure of the main part of the latter type of general print head (inkjet head). That is, the conventional print head has an upper plate member 102 on which an ejection port 101 for ejecting ink is formed, an electrothermal converter (not shown), and bump-like connection terminals 103 connected to the electrothermal converter. A substrate 104, a base plate 106 having an ink supply path 105 for holding and fixing the head substrate 104 and supplying ink to the head substrate 104 side, and an electric pulse for discharging ink to the electrothermal transducer An electric wiring board 108 having an external signal input terminal (not shown) that takes in the outside and a lead terminal 107 connected to the connection terminal 103 of the head board 104 and an electric wiring board joined to the base plate 106 so as to surround the head board 104 And a support plate 109 for holding and fixing 108.
[0006]
The connecting portion between the connection terminal 103 provided on the head substrate 104 and the lead terminal 107 protruding from the electric wiring substrate 108 is sealed with a sealant 110 to prevent connection failure such as corrosion due to ink or disconnection due to external force. Sealed. Conventionally, there is a method in which a sealing agent 110 is applied onto the lead terminal 107 from the 111 side where the discharge port 101 opens, and the sealing material 110 is filled from the gaps between a plurality of adjacent lead terminals 107 to the back side thereof. It was taken.
[0007]
[Problems to be solved by the invention]
In the conventional head structure shown in FIG. 17, a space defined by the thickness of the head substrate 104 and the length of the lead terminal 107 on the back surface side of the lead terminal 107, for example, a space having a size of about 0.7 × 0.7 mm. When the sealing agent 110 is filled from above the lead terminal 107, it is difficult to reliably fill the sealing agent 110 in the space on the back surface, and the sealing is performed with voids or bubbles. There was a possibility of causing a defect. Further, in order to sufficiently fill the sealant 110, a coating operation divided into several times was necessary.
[0008]
OBJECT OF THE INVENTION
  An object of the present invention is to provide a liquid discharge head capable of reliably sealing a connection portion between a connection terminal of a head substrate and a lead terminal of an electric wiring substrate.DoIt is to provide.
[0009]
[Means for Solving the Problems]
  The present inventionLiquid discharge head byThe first form of thebodyA discharge energy generating unit for generating discharge energy for discharging,A connection terminal connected to the discharge energy generating unit;,A head substrate having
  The head substrateButattachmentIsMountingFace and,
  AboveProtruding toward the connection terminalConnected to the connection terminalBeAn electrical wiring board having lead terminals;
  Surround the head substrateHas an opening,The electric wiring board is attached to the surfaceA support part;
  Lead terminalPlaced away fromHaving an upper end surface,Formed integrally with the openingSealant receiverPartWhen,
  Cover the connection portion between the connection terminal and the lead terminal.Between the lead terminal and the upper end surfaceWith sealant,
  TheThe distance between the lead terminal and the upper end surface becomes narrower in the direction away from the head substrate.It is characterized byThe
[0010]
  The present inventionLiquid discharge head byThe second form ofA head substrate having a discharge energy generating unit that generates discharge energy for discharging liquid from the discharge port, and a connection terminal connected to the discharge energy generating unit;
  A mounting surface to which the head substrate is mounted;
  An electrical wiring board having a lead terminal protruding toward the connection terminal and connected to the connection terminal;
  A support portion having an opening surrounding the head substrate, to which the electrical wiring substrate is attached on the surface;
  A sealant receiving portion having an upper end surface arranged at a position away from the lead terminal, and formed integrally with the opening;
  A groove formed on the upper end surface in a direction away from the head substrate;
  Covering the connecting portion between the connecting terminal and the lead terminal, and a sealant disposed between the lead terminal and the upper end surface;
  WithIt is characterized byThe
[0011]
  The present inventionLiquid discharge head byThe third form ofA head substrate having a discharge energy generating unit that generates discharge energy for discharging liquid from the discharge port, and a connection terminal connected to the discharge energy generating unit;
  A mounting surface to which the head substrate is mounted;
  An electrical wiring board having a lead terminal protruding toward the connection terminal and connected to the connection terminal;
  A support portion having an opening surrounding the head substrate, to which the electrical wiring substrate is attached on the surface;
  An upper end surface disposed at a position away from the lead terminal, disposed between the opening and the head substrate, and a sealant receiving portion separate from the support portion;
  Covering the connecting portion between the connecting terminal and the lead terminal, and a sealant disposed between the lead terminal and the upper end surface;
  And the distance between the lead terminal and the upper end surface becomes narrower in the direction away from the head substrate.It is characterized byThe
[0012]
  The present inventionLiquid discharge head byThe fourth form ofA head substrate having a discharge energy generating unit that generates discharge energy for discharging liquid from the discharge port, and a connection terminal connected to the discharge energy generating unit;
  A mounting surface to which the head substrate is mounted;
  An electrical wiring board having a lead terminal protruding toward the connection terminal and connected to the connection terminal;
  A support portion having an opening surrounding the head substrate, to which the electrical wiring substrate is attached on the surface;
  An upper end surface disposed at a position away from the lead terminal, disposed between the opening and the head substrate, and a sealant receiving portion separate from the support portion;
  A groove formed on the upper end surface in a direction away from the head substrate;
  Covering the connecting portion between the connecting terminal and the lead terminal, and a sealant disposed between the lead terminal and the upper end surface;
  WithIt is characterized byThe
[0013]
DETAILED DESCRIPTION OF THE INVENTION
  First of the present invention2In the liquid discharge head according to the form ofThe width of the groove can be set narrow with respect to the direction away from the head substrate, and the depth of the groove can be set shallow with respect to the direction away from the head substrate.
[0019]
  Third of the present inventionOr 4thDepending on the form ofLiquid discharge headInIt is possible to set the height from the mounting surface to the end on the head substrate side of the sealant receiving part lower than the height from the mounting surface to the connection terminal..
[0022]
【Example】
  According to the inventionLiquid discharge headEmbodiments in which the present invention is applied to a serial type ink jet printer will be described in detail with reference to FIGS. 1 to 16. However, the present invention is not limited to such embodiments, and these may be further combined. It can also be applied to other techniques that should be included in the claimed concept of the invention.
[0023]
[Printing mechanism]
1 and 2 show a schematic configuration of a serial type ink jet printer. That is, the printing operation mechanism in this embodiment stored and held in the printer main body M1000 includes an automatic feeding unit M3022 that automatically feeds the print medium P into the printer main body M1000, and the automatic feeding unit M3022. The print medium P to be sent one by one is guided to a desired print position, and a predetermined printing is performed on the print medium P transported to the print position, and a transport section M3029 that guides the print medium P from the print position to the discharge section M3030. And a recovery unit M5000 that performs a recovery process on the print unit and the like.
[0024]
The print unit includes a carriage M4001 that is movably supported by a carriage shaft M4021, and a head cartridge H1000 that is detachably mounted on the carriage M4001.
[0025]
(Head cartridge H1000)
A head cartridge H1000 that constitutes a part of the print unit will be described with reference to FIGS. That is, the head cartridge H1000 in the present embodiment prints the ink supplied from the ink tank H1900 via the tank holder H1500 on which the ink tank H1900 for storing ink is mounted as shown in FIG. And a print head H1001 that discharges from the discharge port H1101 in accordance with information. The head cartridge H1000 employs a so-called cartridge system that is detachably mounted on a carriage M4001 described later.
[0026]
For the head cartridge H1000 shown here, for example, black, light cyan, light magenta, cyan, magenta, and yellow independent ink tanks H1900 can be used to enable photographic high-quality color printing. By operating an elastically deformable detachable lever H1901 that is provided in each ink tank H1900 and can be locked with respect to the head cartridge H1000, each of them is attached to the tank holder H1500 of the print head H1001. Can be removed.
[0027]
As shown in the exploded perspective view of FIG. 4, the print head H1001 includes a head substrate H1100, a base plate H1200, an electric wiring substrate H1300, a support plate H1400, and the like. A tank holder H1500 includes a flow path forming member H1600 and a filter H1700. , Seal rubber H1800 and the like.
[0028]
In the head substrate H1100, a plurality of electrothermal transducers for discharging ink to one side of a silicon substrate and electrical wiring such as aluminum for supplying electric power to each electrothermal transducer are formed by a film forming technique. A plurality of ink paths corresponding to the electrothermal transducer and a plurality of ejection openings H1101 are formed by photolithography technology, and ink paths for supplying ink to the plurality of ink paths are formed to open on the back surface. ing. The head substrate H1100 is bonded and fixed to the base plate H1200, and an ink supply path H1201 for supplying ink to the head substrate H1100 is formed here. Further, a support plate H1400 having an opening H1401 is bonded and fixed to the base plate H1200, and an electric wiring board H1300 is electrically connected to the support board H1400 with respect to the head substrate H1100. The wiring board H1300 is bonded. The electrical wiring substrate H1300 is for applying an electrical signal for ejecting ink to the head substrate H1100. The electrical wiring substrate H1300 is located at the electrical wiring end corresponding to the head substrate H1100 and from the printer main body M1000. The external signal input terminal H1301 for receiving the electrical signal is positioned and fixed on the back side of a tank holder H1500 described later. A more detailed configuration of the print head H1001 will be described later.
[0029]
A flow path forming member H1600 is fixed to the tank holder H1500 that detachably holds the ink tank H1900, for example, by ultrasonic welding, and an ink flow path H1501 from the ink tank H1900 to the flow path forming member H1600 is formed. A filter H1700 is provided at the ink tank side end of the ink flow path H1501 that engages with the ink tank H1900, and can prevent dust from entering from the outside. A seal rubber H1800 is attached to the engaging portion with the ink tank H1900 so that ink can be prevented from evaporating from the engaging portion.
[0030]
A tank holder H1500 to which a flow path forming member H1600, a filter H1700, a seal rubber H1800, and the like are integrally assembled is bonded to a print head H1001 including a head substrate H1100, a base plate H1200, an electric wiring substrate H1300, a support plate H1400, and the like. The head cartridge H1000 is configured by coupling through an agent or the like.
[0031]
(Carriage M4001)
As shown in FIG. 2, the carriage M4001 on which the head cartridge H1000 is mounted is engaged with a carriage cover M4002 for guiding the head cartridge H1000 to a predetermined mounting position on the carriage M4001, and a tank holder H1500 of the head cartridge H1000. In addition, a head set lever M4007 that presses the head cartridge H1000 to be set at a predetermined mounting position is provided.
[0032]
That is, the head set lever M4007 is provided at the upper part of the carriage M4001 so as to be rotatable with respect to the head set lever shaft, and a spring-set head set plate (not shown) at the engaging portion with the head cartridge H1000. The head cartridge H1000 is attached to the carriage M4001 while pressing the head cartridge H1000 by this spring force. The head set lever M4007, the head set lever shaft, the head set plate, etc. function as the attaching / detaching means of the present invention. ing.
[0033]
Another engagement portion of the carriage M4001 with the head cartridge H1000 has a contact FPC (not shown)FlexiblePrintCable), and the contact portion on the contact FPC and the contact portion (external signal input terminal) H1301 provided on the head cartridge H1000 are in electrical contact with each other to send and receive various information for printing and to the head cartridge H1000. The power supply can be performed.
[0034]
An elastic member such as rubber (not shown) is provided between the contact portion of the contact FPC and the carriage M4001, and the contact portion H1301 and the carriage M4001 are formed by the elastic force of the elastic member and the pressing force by a headset lever spring (not shown). It is designed to enable reliable contact with the The contact FPC is connected to a carriage substrate (not shown) mounted on the back surface of the carriage M4001.
[0035]
[Print head H1001]
The print head H1001 of this embodiment that constitutes a part of the head cartridge H1000 will be described in more detail with reference to FIGS. The external appearance of the print head H1001 in this embodiment is shown in FIG. 5, the cross-sectional structure of the connecting portion between the head substrate H1100 and the electric wiring board is shown in FIG. 6, the cross-sectional structure taken along the line VII-VII is shown in FIG. A fracture structure of the head substrate is shown in FIG. In other words, the base plate H1200 in this embodiment is made of alumina (Al₂O_ThreeThe base plate H1200 has a linear expansion coefficient equivalent to that of the material of the head substrate H1100 and is equivalent to the thermal conductivity of the material of the head substrate H1100. Alternatively, any material having higher thermal conductivity may be used, for example, silicon (Si), aluminum nitride (AlN), zirconia (ZrO).₂), Silicon nitride (Si_ThreeN_Four), Silicon carbide (SiC), molybdenum (Mo), or tungsten (W). The base plate H1200 is formed with respective ink supply paths H1201 for supplying a plurality of inks to the head substrate H1100. The ink passages 12 of the head substrate H1100 correspond to the ink supply paths H1201 of the base plate H1200, respectively. In addition, the head substrate H1100 is bonded and fixed to the base plate H1200 at a predetermined position with high accuracy.
[0036]
The support plate H1400 is made of alumina having a thickness of, for example, 0.5 to 1 mm. Like the base plate H1200, the support plate H1400 has a linear expansion coefficient equivalent to that of the head substrate H1100, and its thermal conductivity. It is preferable that the material has the same or higher thermal conductivity. The support plate H1400 has an opening H1401 larger than the outer dimension of the head substrate H1100 bonded and fixed to the base plate H1200, so that the head substrate H1100 and the electrical wiring substrate H1300 can be electrically connected in substantially the same plane. The back surface of the electric wiring board H1300 is bonded and fixed to the support plate H1400. The electrical wiring substrate H1300 applies an electrical signal for ejecting ink to the head substrate H1100, and leads corresponding to the opening portions H1302 for incorporating the head substrate H1100 and the connection terminals 14 of the head substrate H1100. It has a terminal H1303 and an external signal input terminal H1301 for receiving an electrical signal from the printer main body M1000 located at the end of the wiring.
[0037]
The head substrate H1100 in this embodiment is obtained by forming a discharge energy generating portion, an ink chamber 15, a discharge port 16 and the like on a silicon substrate 11 having a thickness of 0.5 to 1 mm using a film forming technique.
[0038]
The silicon substrate 11 is formed with an elongated ink passage 12 penetrating therethrough. The ink passage 12 is formed by anisotropic etching using the crystal orientation of the silicon substrate 11. That is, when the crystal orientation of the surface of the silicon substrate 11 is <100> and the crystal orientation in the thickness direction is <111>, anisotropic etching is performed using an alkaline etching solution such as KOH, TMAH, hydrazine or the like. Thus, the ink passage 12 having an inclined surface with an angle of about 54.7 degrees is formed. On both sides of the ink passage 12, a plurality of (128 in this embodiment) electrothermal transducers 13 arranged in two rows at predetermined intervals along the longitudinal direction of the ink passage 12 are shifted from each other by a half pitch. The discharge energy generation part is formed.
[0039]
In addition to the electrothermal transducer 13 and the connection terminal 14, the silicon substrate 11 is provided with electrical wiring (not shown) that conducts the electrothermal transducer 13 and the connection terminal 14. A drive signal for the electrothermal transducer 13 is supplied together with drive power from a drive IC (not shown). On the silicon substrate 11, an upper plate member 17 having a plurality of discharge ports 16 respectively facing the electrothermal transducer 13 through an ink chamber 15 communicating with the ink passage 12 is formed. That is, an ink path 18 communicating with the ink passage 12 and the individual ink chambers 15 is formed between the upper plate member 17 and the silicon substrate 11, and these are formed on the upper plate by photolithography technology in the same manner as the ejection ports 16. It is formed together with the member 17. On the connection terminal 14 side of the upper plate member 17, a groove-like dam portion 21 extending in the arrangement direction of the connection terminals 14 is formed, and a sealing agent 20 described later is connected to the connection terminals 14 and the lead terminals. When applying to the connection portion with H1303, the sealant 20 is prevented from flowing into the dam portion 21 and flowing out to the discharge port 16 side.
[0040]
The liquid supplied into each ink chamber 16 from the ink passage 12 boils as the electrothermal transducer 13 generates heat, when a drive signal is given to the corresponding electrothermal transducer 13 in the ink chamber 16. The air is generated from the discharge port 17 by the pressure of the generated bubbles. In this case, the bubbles generated in the ink chamber 16 are brought into an air communication state from the discharge port 17 as they grow.
[0041]
A rectangular opening H1401 surrounding the head substrate H1100 is formed in the support plate H1400, and a sealant receiver 19 is integrally formed in the opening H1401 close to the connection terminal 14 of the head substrate H1100. . Support plate H1400 thickness t₁Is the height h from the surface of the base plate H1200 to the upper end of the connection terminal 14 of the head substrate H1100 so that the lead terminal H1303 of the electric wiring substrate H1300 does not contact the edge of the head substrate H1100.₂Is set to be thicker. Further, the height h from the surface of the base plate H1200 to the upper end surface of the sealant receptacle 19₁Is the thickness t of the silicon substrate 11₂By setting as follows, it is considered that the sealant receptacle 19 does not hinder the electrical connection between the connection terminal 14 and the lead terminal H1303.
[0042]
In this embodiment, t so that the sealant 20 can be held by the capillary force in the gap between the lead terminal H1303 and the seal receiver 15.₁-H₁For example, the height h from the surface of the base plate H1200 to the upper end surface of the sealant receptacle 19 is adjusted in accordance with the characteristics of the sealant 20 to be used.₁Need to be adjusted. The width dimension of the sealant receptacle 19 along the arrangement direction of the connection terminals 14 is set to be substantially the same as the width dimension of the head substrate H 1100 facing the same, that is, the silicon substrate 11. In the case of a print head H1001 having a plurality of head substrates H1100, the print head H1001 is set to have substantially the same size as the entire width of the plurality of head substrates H1100.
[0043]
As the sealant 20 described above, for example, a thermosetting sealant mainly composed of an epoxy resin (for example, chip coat 8304 manufactured by Hokuriku Paint Co., Ltd.) is used.
[0044]
As described above, the sealant receptacle 19 is interposed in the gap between the head substrate H1100 and the opening H1301 of the electrical wiring substrate H1300 interposed in the connection portion between the connection terminal 14 and the lead terminal H1303. As described above, since no voids or bubbles are generated on the back surface side of the lead terminal H1303, it is possible to prevent problems due to poor sealing, and thus it is possible to obtain a print head H1001 with high electrical reliability. Moreover, since it is not necessary to apply the sealing agent 20 in several times, this sealing process can be simplified.
[0045]
The print head manufacturing procedure described above will be briefly described with reference to FIGS. 9 to 11. First, the head substrate H1100 is integrally bonded to a predetermined position on the surface of the base plate H1200 using an adhesive, and then the base plate H1200. The ink supply path H1201 and the ink path 12 of the silicon substrate 11 are communicated with each other. The adhesive used here is preferably an ink-resistant one that can form a low-viscosity and thin adhesive layer (for example, 50 μm or less) and has a relatively high hardness after curing. A thermosetting adhesive as a component can be used. The ink is applied around the ink supply path H1201 formed on the base plate H1200 so that the ink does not leak to the outside from the ink supply path H1201. Similarly, a support plate H1400 is joined to the surface of the base plate H1200 using an adhesive so as to surround the head substrate H1100 (see FIG. 10).
[0046]
Thereafter, the electric wiring board H1300 is bonded and fixed to the support plate H1400. At this time, the lead terminal H1303 of the electric wiring board H1300 is positioned with respect to the connection terminal 14 of the head board H1100, and is mounted in the TAB mounting. Electrical connection is made by technology (see FIG. 11).
[0047]
Next, the sealant 20 is supplied to the connection portion between the connection terminal 14 of the head substrate H1100 and the lead terminal H1303 of the electric wiring substrate H1300, the viscosity of the sealant 20 is reduced by temporary curing, and the lead terminal is generated by capillary force. It wraps around the back surface of H1303, and is filled between the lead terminal H1303 and the sealant receptacle 19 and between the sealant receptacle 19 and the head substrate H1100. By this temporary curing, bubbles remaining in the sealing region can be deaerated. As for the condition of temporary curing, for example, heating for 10 minutes in a reflow furnace at 100 ° C. is appropriate. Since the sealing agent 20 applied on the lead terminal H1303 is filled in the above-described gap portion by temporary curing at 100 ° C. for 10 minutes, the sealing agent 20 is additionally applied on the lead terminal H1303, This cure is performed to complete the sealing operation. Since the sealing agent 20 applied first is temporarily cured after the viscosity is once reduced by temporary curing, the sealing agent 20 additionally applied afterwards does not wrap around the back side of the lead terminal H1303, but on the lead terminal H1303. The connection portion between the connection terminal 14 and the lead terminal H1303 can be reliably sealed. For this cure, for example, heating at 150 ° C. for 4 hours is appropriate.
[0048]
The sealing agent receiver 19 described above is formed integrally with the support plate H1400, but can also be formed independently of the support plate H1400. In this case, the inside of the opening H1401 of the support plate H1400. It is preferable to form in the shape of a rectangular frame that fits in the box. In the above-described embodiment, the upper end surface of the sealant receiver 19 is set in parallel with the surface of the base plate H1200. However, it may be an inclined surface that is inclined downward toward the head substrate H1100 side.
[0049]
FIG. 12 shows a cross-sectional structure of the main part of the print head H1001 according to the present invention. Elements having the same functions as those in the previous embodiment are designated by the same reference numerals, and redundant descriptions are omitted. To do. That is, the upper end surface of the sealant receiver 19 is an inclined surface that is lower on the head substrate H1100 side than the support plate H1400 side, and the upper edge of the sealant receiver 19 from the surface of the base plate H1200 on the head substrate H1100 side. Is set lower than the thickness of the silicon substrate 11.
[0050]
Thus, by making the upper end surface of the sealant receptacle 19 into an inclined surface, the space between the lead terminal H1303 is further narrowed, and the capillary force of the sealant 20 can be increased, and the back surface of the lead terminal H1303. The sealant 20 can be more reliably filled on the side. In addition, since the distance from the sealant receiver 19 becomes narrower toward the base end side of the lead terminal H1303, that is, the opening edge side of the opening H1302 of the electric wiring board H1300, the capillary force of the sealant 20 becomes stronger and the sealing is performed. The proximal end side of the lead terminal H1303 that is relatively difficult to be filled with the agent 20 can be easily sealed.
[0051]
Further, in this embodiment, the size or shape of the opening H1302 or the sealing agent is such that the opening edge of the opening H1302 of the electric wiring board H1300 covers a part of the upper end surface of the sealing agent receiver 19 and is positioned immediately above it. The start end of the receptacle 19 is set, and thereby the base end portion of the lead terminal H1303 can be more reliably sealed. The overhang amount C of the opening H1302 of the electric wiring board H1300 with respect to the opening H1401 of the support plate H1400 is sufficient to be 0.5 mm or less, but is appropriately adjusted according to the characteristics of the sealant 20 to be used. It is preferable.
[0052]
As the shape of the sealant receptacle 19, for example, a structure as shown in FIGS. 13 to 16 can be adopted in addition to the above-described embodiment.
[0053]
13 and 14 are formed with a plurality of groove portions 19a extending in substantially the same direction as the lead terminals H1303 protruding from the openings H1302 of the electric wiring board H1300 on the upper end surface of the sealant receptacle 18. It is. By forming such a groove part 19a, this brings about the effect which improves the capillary force of the sealing agent 20, can improve the permeability of the sealing agent 20 to the whole back surface of the lead terminal H1303, and seal It becomes possible to increase the holding power of the agent 20. In particular, the width of each groove portion 19a is gradually narrowed from the head substrate H1100 side to the support plate H1400 side, or the depth is gradually shallowed as in the present embodiment, so that the depth relative to the base end portion of the lead terminal H1303 is increased. Since the permeability of the sealing agent 20 can be further improved, the proximal end side of the lead terminal H1303 that is relatively difficult to be filled with the sealing agent 20 can be easily sealed.
[0054]
15 and 16 show that both ends of the head substrate H1100 are formed by forming extending portions 19b that are bent at right angles at both ends of the sealant receptacle 20 along the arrangement direction of the connection terminals 14 of the head substrate H1100. Thus, a wider region other than the connection portion between the connection terminal 14 and the lead terminal H1303 can be sealed with the sealant 20. Thus, the application amount of the sealing agent 20 can be increased by expanding the sealing region, and the rigidity of the sealing portion and the reliability of sealing can be increased. Moreover, when the application area | region of the sealing agent 20 expands, the precision with respect to the application quantity and application position of the sealing agent 20 is eased, and workability | operativity can be improved.
[0055]
  The present invention includes means (for example, an electrothermal converter or a laser beam) that generates thermal energy as energy used for discharging the liquid, and causes a change in the state of the liquid by the thermal energy. Inkjet liquid ejection headToIn this case, it has an excellent effect. This is because according to such a method, high density and high definition of the print can be achieved.
[0056]
As for the typical configuration and principle, for example, those performed using the basic principle disclosed in US Pat. No. 4,723,129 and US Pat. No. 4,740,796 are preferable. This method can be applied to both a so-called on-demand type and a continuous type. In particular, in the case of the on-demand type, an electric circuit arranged corresponding to a sheet or a channel holding a liquid is used. Applying at least one drive signal that gives a rapid temperature rise exceeding the nucleate boiling corresponding to the print information to the thermal converter to generate thermal energy, causing film boiling on the heat acting surface of the liquid discharge head, As a result, it is effective because bubbles in the liquid corresponding to the drive signals on a one-to-one basis can be formed. Due to the growth and contraction of the bubbles, the liquid is discharged through the discharge port to form at least one droplet. It is more preferable that the drive signal has a pulse shape, since the bubble growth and contraction is performed immediately and appropriately, and thus it is possible to achieve liquid discharge with particularly excellent responsiveness. As this pulse-shaped drive signal, those described in US Pat. No. 4,463,359 and US Pat. No. 4,345,262 are suitable.
[0057]
If the conditions described in US Pat. No. 4,313,124 of the invention relating to the temperature rise rate of the heat acting surface are employed, further excellent printing can be performed.
[0058]
As a configuration of the liquid ejection head, a combination configuration of an ejection port, a liquid path, and an electrothermal transducer as disclosed in each of the above specifications (a linear shape in which the electrothermal transducer is disposed along the liquid path) US Pat. No. 4,558,333 which discloses a configuration in which a liquid passage or an electrothermal transducer is disposed in a region where the heat acting portion bends in addition to a liquid passage or a right-angle liquid passage facing the discharge port across the liquid passage) A configuration using US Pat. No. 4,459,600 is also included in the present invention. In addition, for a plurality of electrothermal transducers, Japanese Patent Application Laid-Open No. Sho 59-123670 that discloses a configuration in which a common slit is used as a discharge portion of the electrothermal transducer, or an aperture that absorbs pressure waves of thermal energy The effect of the present invention is effective even if the configuration is based on Japanese Patent Application Laid-Open No. 59-138461 which discloses a configuration corresponding to the discharge section. That is, whatever the form of the liquid ejection head is, according to the present invention, printing can be performed reliably and efficiently.
[0059]
The present invention can also be effectively applied to a full-line type liquid discharge head having a length corresponding to the maximum width of a print medium that can be printed by the image forming apparatus. As such a liquid discharge head, either a configuration satisfying the length by a combination of a plurality of liquid discharge heads or a configuration as a single liquid discharge head formed integrally may be used.
[0060]
Even in the serial type as in the above-described embodiments, the liquid discharge head fixed integrally with the carriage that is moved by scanning, or the electrical connection with the carriage by being exchangeably attached to the carriage. This is also possible when using a replaceable chip-in type head cartridge that can supply liquid from the main body of the apparatus, or a head cartridge in which a liquid storage head itself has a tank that stores liquid in an integrated or replaceable manner. The invention is effective.
[0061]
  Mentioned aboveAs a configuration of the image forming apparatus, it is preferable to add a recovery means for making the liquid discharge state from the liquid discharge head appropriate, a preliminary auxiliary means, etc., since the effect of the present invention can be further stabilized. is there. Specifically, a capping unit, a cleaning unit, a pressurizing or sucking unit for the liquid discharge head, a preheating unit for heating using an electrothermal converter, a heating element different from this, or a combination thereof, A preliminary discharge unit that discharges separately from the printing operation can be given.
[0062]
As for the type and number of liquid discharge heads to be mounted, for example, only one corresponding to a single color ink is provided, and also corresponding to a plurality of types of inks having different print colors and densities (lightness). A plurality of them may be provided. That is, for example, the print mode of the image forming apparatus is not limited to a print mode of only a mainstream color such as black, but the liquid discharge head may be configured integrally or a plurality of combinations. The present invention is also very effective for an image forming apparatus having at least one of full-color print modes using color or mixed colors. In this case, it is also effective to discharge a processing liquid (printability improving liquid) for adjusting the printability of ink according to the type of print medium and the print mode from a dedicated or common liquid discharge head to the print medium.
[0063]
In the embodiment of the present invention described above, a material that solidifies at room temperature or lower and softens or liquefies at room temperature may be used. Alternatively, in the ink jet method, the temperature of the liquid itself is within a range of 30 ° C. or higher and 70 ° C. or lower. Since adjustment is generally performed to control the temperature of the liquid so that the viscosity of the liquid is within a stable discharge range, a liquid that forms a liquid when a use print signal is applied may be used. In addition, it is solidified in a standing state and liquefied by heating in order to actively prevent temperature rise due to heat energy by using it as energy for state change from solid state to liquid state, or to prevent liquid evaporation You may use what you do. In any case, it is liquefied by the application of thermal energy according to the print signal and liquefies only by the application of thermal energy, such as the liquid being discharged or the liquid that has already solidified when it reaches the print medium. The present invention can also be applied to the case where a material having a property is used. In such a case, the liquid is in a state of being held as a liquid or solid in a recess or a through-hole of the porous sheet as described in JP-A-54-56847 or JP-A-60-71260. And it is good also as a form which opposes with respect to an electrothermal converter. In the present invention, the most effective one for each liquid described above is to execute the above-described film boiling method.
[0064]
  Mentioned aboveAs the form of the image forming apparatus, in addition to those used as an image output terminal of information processing equipment such as a computer, a copying apparatus combined with a reader or the like, a facsimile apparatus having a transmission / reception function, a textile printing apparatus, or an etching apparatus may be used. The print medium may be a sheet or long paper or fabric, or a plate-like wood or leather, stone, resin, glass, metal, etc. And so on.
[0065]
【The invention's effect】
  Liquid discharge head of the present invention1st or 3rd formaccording to,ContactAs a result of the sealant receptacle narrowing the space interposed in the vicinity of the connection part between the connection terminal and the lead terminal, the connection part between the connection terminal and the lead terminal can be reliably secured with the sealant without reversing the setup. In addition to sealing, dust and the like can be reliably prevented from entering from the liquid supply port of the head substrate.Further, since the volume of the space interposed in the vicinity of the connection portion between the connection terminal and the lead terminal is reduced, the connection portion between the connection terminal and the lead terminal can be reliably sealed even with a small amount of sealant.
[0066]
  MountingThe height from the surface to the end of the sealant receptacle on the head substrate sideMountingWhen the height is set lower than the height from the surface to the connection terminal of the head substrate, it is possible to prevent a problem that the sealant receiver interferes with the connection portion between the connection terminal and the lead terminal.
[0067]
  MountingThe height from the surface to the end of the sealant receptacle on the head substrate sideMountingFrom the faceSealant receiversupportPartSet lower than the height to the end of the side, especiallyMountingSupport of sealant receiver from the surfacePartThe height to the end of the sideMounting surfaceSupport fromPartofElectric wiring board was installedSet to the same height as the surface,The top surface of the sealant receptacle is attachedTilt with respect to the surfaceSlopeIn this case, the volume of the space interposed in the vicinity of the connection portion between the connection terminal and the lead terminal is reduced, so that the connection portion between the connection terminal and the lead terminal can be reliably sealed even with a small amount of sealant. it can.
[0069]
  According to the second or fourth embodiment of the liquid discharge head of the present invention, the space interposed in the vicinity of the connection portion between the connection terminal and the lead terminal is narrowed by the sealant receptacle, so that no setup change such as inversion is performed. In both cases, the connection portion between the connection terminal and the lead terminal can be reliably sealed with a sealing agent, and dust and the like can be reliably prevented from entering from the liquid supply port of the head substrate. Also,Due to the capillary force of the sealant acting in the groove, the sealant can be reliably interposed between the surface of the sealant receptacle and the lead terminal.
[0071]
  According to the first or second form of the liquid ejection head of the present invention,Sealant receiverPartSupportedDepartment andSince they are integrally formed, positioning and fixing operations of the sealing material receiving portion with respect to the base plate are not required, and an increase in the manufacturing process can be avoided.
[Brief description of the drawings]
FIG. 1 is a perspective view illustrating an appearance of an ink jet printer according to an embodiment of the present invention.
FIG. 2 is a perspective view illustrating a state where an exterior member of the ink jet printer illustrated in FIG. 1 is removed.
FIG. 3 is a perspective view showing a state where an ink tank is incorporated in the head cartridge used in the embodiment shown in FIG.
4 is an exploded perspective view of the head cartridge shown in FIG. 3 as viewed obliquely from below.
FIG. 5 is an enlarged perspective view of a print head portion in the present embodiment.
6 is a cross-sectional view illustrating a schematic structure of the print head illustrated in FIG. 5;
7 is a cross-sectional view taken along arrow VII-VII in FIG. 6;
FIG. 8 is a cutaway perspective view showing the appearance of the head substrate in the present embodiment.
FIG. 9 is an exploded perspective view showing a state before connection between the support plate and the electric wiring board.
FIG. 10 is a cross-sectional view showing a base plate, a head substrate, and a support plate in a broken state before bonding an electric wiring board.
FIG. 11 is a cross-sectional view showing the schematic structure of the print head before application of a sealant in a broken state.
FIG. 12 is a sectional view showing a schematic structure of another embodiment of the print head according to the present invention.
FIG. 13 is a perspective view showing an external appearance of a main part in a state where an electric wiring board is removed in another embodiment of the print head according to the present invention.
14 is a cross-sectional view showing a schematic structure of a print head in the embodiment shown in FIG.
FIG. 15 shows the electricity in yet another embodiment of the printhead according to the invention.wiringIt is a perspective view showing the external appearance of the principal part before attaching a board | substrate.
16 is a perspective view showing an appearance of a print head in the embodiment shown in FIG.
FIG. 17 is a cross-sectional view illustrating a schematic structure of a conventional print head in a broken state.
[Explanation of symbols]
P Print media
t₁  Support plate thickness
t₂  Silicon substrate thickness
h₁  Height from the surface of the base plate to the top surface of the sealant receptacle
h₂  Height from the surface of the base plate to the top edge of the connection terminal on the head substrate
C Overhang amount of the opening of the electric wiring board with respect to the opening of the support plate
11 Silicon substrate
12 Ink passage
13 Electrothermal converter
14 Connection terminal
15 Ink chamber
16 Discharge port
17 Upper plate member
18 ink path
19 Sealant receptacle
19a Groove
19b Extension
20 Sealant
21 Weir
M1000 printer body
M1001 Lower case
M1002 Upper case
M1003 Access cover
M1004 discharge tray
M1004a, M1004b Auxiliary tray
M2003 Paper discharge roller
M3001 LF roller
M3019 chassis
M3022 Automatic feeding section
M3029 transport section
M3030 discharge section
M4000 print section
M4001 Carriage
M4002 Carriage cover
M4007 Headset lever
M4021 Carriage shaft
M5000 recovery unit
H1000 head cartridge
H1001 Print head
H1100 head substrate
H1200 base plate
H1201 ink supply path
H1300 Electric wiring board
H1301 Contact part (external signal input terminal)
H1302 opening
H1303 Lead terminal
H1400 support plate
H1401 opening
H1500 tank holder
H1501 ink flow path
H1600 flow path forming member
H1700 filter
H1800 seal rubber
H1900 ink tank
H1901 Removal lever

Claims (7)

And discharge energy generating unit for generating discharge energy for discharging the liquid material from the discharge port, and a head substrate having a connecting terminal connected to the energy generating unit exits said discharge, and
A mounting surface the head substrate that is attached,
An electrical wiring board having a lead terminal protruding toward the connection terminal and connected to the connection terminal;
A support portion having an opening surrounding the head substrate, to which the electrical wiring substrate is attached on the surface ;
Has an upper surface which is disposed at a position separated from the lead terminals, and sealant receiving portion that will be integrally formed on the opening,
A sealant disposed between the connecting terminal and the not covering the connection portion of the lead terminal, the lead terminal and the upper end surface,
And a distance between the lead terminal and the upper end surface becomes narrower in a direction away from the head substrate . A head substrate having a discharge energy generating unit that generates discharge energy for discharging liquid from the discharge port, and a connection terminal connected to the discharge energy generating unit;
A mounting surface to which the head substrate is mounted;
An electrical wiring board having a lead terminal protruding toward the connection terminal and connected to the connection terminal;
A support portion having an opening surrounding the head substrate, to which the electrical wiring substrate is attached on the surface;
A sealant receiving portion having an upper end surface arranged at a position away from the lead terminal, and formed integrally with the opening;
A groove formed on the upper end surface in a direction away from the head substrate ;
Covering the connecting portion between the connecting terminal and the lead terminal, and a sealant disposed between the lead terminal and the upper end surface;
Liquids head you characterized in that comprises a. Width of the groove, the liquid discharge head according to claim 2, wherein a narrow Rukoto with respect to the direction away from the head substrate. The depth of the groove, the liquid discharge head according to claim 2 or claim 3, wherein a shallow Rukoto with respect to the direction away from the head substrate. A head substrate having a discharge energy generating unit that generates discharge energy for discharging liquid from the discharge port, and a connection terminal connected to the discharge energy generating unit;
A mounting surface to which the head substrate is mounted;
An electrical wiring board having a lead terminal protruding toward the connection terminal and connected to the connection terminal;
A support portion having an opening surrounding the head substrate, to which the electrical wiring substrate is attached on the surface;
An upper end surface disposed at a position away from the lead terminal, disposed between the opening and the head substrate, and a sealant receiving portion separate from the support portion;
Covering the connecting portion between the connecting terminal and the lead terminal, and a sealant disposed between the lead terminal and the upper end surface;
The comprising the lead terminal and the liquid discharge head you wherein a narrow gap between the upper surface with respect to a direction away from the head substrate. A head substrate having a discharge energy generating unit that generates discharge energy for discharging liquid from the discharge port, and a connection terminal connected to the discharge energy generating unit;
A mounting surface to which the head substrate is mounted;
An electrical wiring board having a lead terminal protruding toward the connection terminal and connected to the connection terminal;
A support portion having an opening surrounding the head substrate, to which the electrical wiring substrate is attached on the surface;
An upper end surface disposed at a position away from the lead terminal, disposed between the opening and the head substrate, and a sealant receiving portion separate from the support portion;
A groove formed on the upper end surface in a direction away from the head substrate;
Covering the connecting portion between the connecting terminal and the lead terminal, and a sealant disposed between the lead terminal and the upper end surface;
Liquids head you characterized in that comprises a. Height from the mounting surface to an end portion of the head substrate side of the sealant receiving unit according to claim claim 1, wherein the lower than the height of up to the mounting surface or found before Symbol connecting terminal 7. The liquid discharge head according to any one of 6 .

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