JP4673231B2 - Insulating resin plate processing method and wiring board inspection jig provided with the insulating resin plate - Google Patents

Description

  The present invention relates to a processing method for forming a small through hole in an insulating resin plate such as a protective plate or a tip holding plate of a wiring board inspection jig.

  For example, as a wiring board inspection jig for inspecting a printed wiring board, one utilizing an elastic deflection of the probe itself has been proposed (for example, see Patent Document 1). This type of inspection jig is generally composed of a probe structure including a probe and a receiving pin structure including a receiving pin. The probe structure part includes a protection plate on the tip side, a tip holding plate, and a terminal holding plate on the end side, the tip side of the probe is held by the tip holding plate and the protection plate, and the rear end side is held by the end holding plate. The receiving pin structure portion includes a wiring plate, and one end portion of the receiving pin is attached to the wiring plate, and the rear end portion of the probe is electrically connected to one end portion of the receiving pin.

  In such a wiring board inspection jig, the outer diameter of the probe and the receiving pin is reduced with the increase in the density of the printed wiring board, and the outer diameter is, for example, about 0.08 mm. In particular, the inner diameter of the holding hole formed for inserting the probe and the receiving pin is formed to be approximately the same as the outer diameter of the probe and the receiving pin.

  For example, the holding hole of the protection plate (and the tip holding plate) is formed as shown in FIG. First, a spot facing portion 4 is formed on a predetermined portion of the protective plate 2 having a thickness of about 1 mm by drilling, for example, from the back surface (the lower surface in FIG. 7A). A thin thick portion 6 of about 3 to 0.5 mm is formed. Thereafter, the holding hole 10 is formed by drilling the thin-walled portion 6 of the protective plate 2 from the surface side using a drill blade 8 having an outer diameter of about 0.08 mm.

  When the holding hole 10 is formed as described above, the burr 12 is formed at the opening of the holding hole 10 when the drill blade 8 penetrates the counterbore part 4 as shown in FIGS. 7 (a) and 7 (b). When it is easy to occur and the burr 12 is generated, when it is assembled as a probe jig, the insertion of the probe is hindered and cannot be held as desired.

  Therefore, after forming the holding hole 10 by drilling, as shown in FIG. 7B, the inner peripheral surface of the holding hole 10 is cleaned from the front surface side and the back surface side of the protective plate 2 using the drill blade 8. Is performed once or a plurality of times, and burrs are removed by this cleaning process.

JP 2002-5980 A

  However, in the processing using only the drill blade 8 as described above, it is necessary to repeatedly perform the cleaning processing for removing burrs. Therefore, the processing of the holding hole 10 is very complicated and the processing time becomes long. There is a problem that the manufacturing cost becomes expensive. This tendency becomes larger as the inner diameter of the holding hole 10 to be processed becomes smaller. In a wiring board inspection jig for inspecting a printed wiring board having a high density in recent years, it takes much time to process the holding hole 10. And may reach about 30% of the total processing time of the inspection jig.

An object of the present invention is to provide a machining method capable of machining a through-hole having a small inner diameter without generation of burrs, thereby greatly reducing the machining time.
Another object of the present invention is to provide a wiring board inspection jig capable of reducing the processing time and thereby reducing the manufacturing time and the manufacturing cost.

According to a first aspect of the present invention, there is provided an insulating resin plate for processing a through hole in which a ratio of a hole diameter to a thickness is 1/3 or less in a thin thickness portion processed to a thickness of 0.5 mm or less. In the processing method of
The thin-walled portion is irradiated with laser light from one side thereof to form a spot facing portion that penetrates the thin-walled portion and tapers from the one surface toward the other surface, and then the top portion of the spot facing portion. And drilling from the other surface to form a through hole penetrating from the other surface to the one surface.

Further, in the processing method according to claim 2 of the present invention, before the laser light irradiation, the one surface of the insulating resin plate is drilled to form a large countersunk portion having a predetermined depth, and the large seat A stepped through-hole is formed by forming the groove portion as the thin-walled portion.

Furthermore, the wiring board inspection jig according to claim 3 of the present invention is characterized by including an insulating resin plate processed by the processing method of claim 1 or 2 .

According to the processing method of the first aspect of the present invention, the countersunk portion is formed by irradiating the thin-walled portion of the insulating resin plate with a laser beam from one side, and then the other side on the top of the spot facing. A through hole is formed by drilling. By using a laser beam for the processing of the spot facing portion, a spot facing portion that penetrates the thin-walled portion and inclines in a tapered manner from one surface to the other surface is formed. It will be a clean surface. After that, by drilling from the other surface side, a through hole with a predetermined inner diameter is formed at the top of the spot facing portion , and when this through hole is formed, burrs are generated at the opening on the spot facing portion side. And a precise and clean through-hole can be formed.

  In particular, various plates used in inspection devices for inspecting printed wiring boards use electrically insulating resin plates. When processing through holes with very small inner diameters on such resin plates, Burr that occurs sometimes becomes a big problem, and it takes a lot of time to deburr after that. By adopting the processing method of the present invention, burrs are not generated and the processing time is greatly reduced. The ratio of the hole diameter to the thickness is 1/3 or less (for example, 0) in the thin thickness portion of the insulating resin plate processed to have a thickness of 0.5 mm or less (for example, about 0.3 to 0.5 mm). .About 0.07 to 0.1 mm) is very useful when machining through-holes.

According to the processing method of claim 2 of the present invention, before the laser light irradiation, a large counterbore portion having a predetermined depth is formed by drilling one surface of the insulating resin plate. The corner portion becomes a thin-walled portion that forms a through hole. By forming the large spotted portion in this manner, a desired through hole can be formed in an insulating resin plate having a thickness of about 0.8 to 1.0 mm, and the through hole is a stepped through hole. Thus, it is convenient for processing various plates of the printed wiring board.

Furthermore, according to the wiring board inspection jig according to claim 3 of the present invention, since the insulating resin plate processed by the processing method according to claim 1 or 2 is used, the processing operation of the insulating resin plate is simplified. In addition, the processing time can be greatly shortened, and the manufacturing time and manufacturing cost of the wiring board inspection jig can be reduced.

Hereinafter, with reference to the attached drawings, an embodiment of a processing method according to the present invention and a wiring board inspection jig provided with an insulating resin plate processed by this processing method will be described.
Configuration of Wiring Board Inspection Jig First, an embodiment of the wiring board inspection jig will be described with reference to FIGS. FIG. 1 is a cross-sectional view illustrating a main part of a wiring board inspection jig according to an embodiment. FIG. 2 is a cross-sectional view illustrating the wiring board inspection jig of FIG. 1 in a state in which a printed wiring board is inspected. FIG. 3 is a partially enlarged cross-sectional view showing the tip end portion of the probe of the wiring board inspection jig of FIG.

  1 and 2, the illustrated wiring board inspection jig includes a probe structure portion 32 and a receiving pin structure portion 34. The probe structure 32 includes a protection plate 36, a tip holding plate 38, a first end holding plate 40, and a second end holding plate 42, and the protection plate 36 and the tip holding plate on the tip side (the upper side in FIGS. 1 and 2). 38, and a first end holding plate 40 and a second end holding plate 42 are provided on the end side (the lower side in FIGS. 1 and 2), and the end holding plates 38 are disposed on the inner side and face each other. And a first end holding plate 40 is provided with a bending space 46. These plates 36, 38, 40, and 42 can be formed from a resin plate having electrical insulation characteristics, such as a plate made of polyphenylene sulfide.

  The probe structure portion 32 further includes a probe 52 that is electrically connected to the terminal portion 50 of the wiring board 48 to be inspected. The probe 52 is composed of a metal wire 54, and other portions except for both ends thereof are covered with an electrically insulating layer 56 (for example, coating with acrylic resin). One end (tip) of the probe 52 is held by the protective plate 36 and the tip holding plate 38 so as to be movable in the axial direction (vertical direction in FIGS. 1 and 2), and the other ends are held by the first and second ends. The plates 40 and 42 are held movably.

In this embodiment, as shown in an enlarged view in FIG. 3, a spot facing portion 58 is provided at a predetermined portion of the protective plate 36, and a thin thickness portion 59 is provided by the spot facing portion 58, and this thin thickness portion 59. Is provided with a through hole 60, and this through hole 60 functions as a holding hole. The tip holding plate 38 is provided with a stepped through hole 62, and the stepped through hole 62 functions as a holding hole. One end of the metal wire 54 serving as the probe 52 (a portion exposed from the insulating layer 56) passes through the small inner diameter portion 64 of the stepped through hole 62 of the tip holding plate 38 and the counterbore portion 58 and the through hole 60 of the protective plate 36. Projecting outward (upward in FIG. 1), one end portion of the insulating layer 56 is located in the large inner diameter portion 66 of the stepped through hole 62 of the tip holding plate 38. Accordingly, the probe 52 can move downward along the through hole 60 and the stepped through hole 62, but the probe 52 is brought into contact with the stepped portion of the stepped through hole 62 by one end surface of the insulating layer 56 contacting the stepped through hole 62. Is prevented from moving upward, and the probe 52 is prevented from coming off.

  The receiving pin structure portion 34 includes a wiring plate 44, and one end portion of a receiving pin 68 is attached to the wiring plate 44. The receiving pin 68 is composed of a metal wire 70, and other portions except for both ends of the metal wire 70 are covered with an electrically insulating layer 72, and the other end portion (terminal portion) of the probe 52 and one end portion of the receiving pin 68. And are in electrical contact. The wiring plate 44 is also formed from a resin plate having electrical insulation characteristics.

In this wiring board inspection jig, the printed wiring board 48 to be inspected is positioned at a predetermined position on the upper surface of the protection plate 36 as shown in FIG. As a result, one end portion (tip portion) of the probe 52 is pressed by the wiring board 48 and the intermediate portion of the probe 52 is elastically deformed somewhat in the bending space 46, and the elastic restoring force of the probe 52 is used to One end elastically contacts a predetermined terminal portion 50 of the printed wiring board 48, the other end elastically contacts one end of the receiving pin 68 , and the printed wiring board 48, the probe 52, and the receiving pin 68 are electrically connected. Thus, the electrical resistance value of the printed wiring board 48 can be measured by applying a current through the receiving pin 68 and the probe 52.

  In such a wiring board inspection jig, the thickness T1 of the protective plate 36 is, for example, about 1.5 mm, the thickness of the thin-walled portion 59 is, for example, about 0.3 mm, and the depth of the spot facing portion 58. t2 is, for example, about 1.2 mm, and the inner diameter of the through hole 60 of the thin-walled portion 59 is, for example, about 0.06 mm. Further, the thickness of the tip holding plate 38 is about 0.5 mm, for example, and the thickness t3 of the small inner diameter portion 64 (which constitutes the thin thickness portion of the tip holding plate 38) of the stepped through hole 66 is 0.2 mm, for example. The thickness t4 of the large inner diameter portion 66 of the stepped through hole 66 is, for example, about 0.3 mm, and the inner diameter of the small inner diameter portion 64 of the stepped through hole 60 is, for example, 0.06 mm. The inner diameter of the inner diameter portion 66 is, for example, about 0.08 mm.

Processing method of the first embodiment For example, when the above-described through hole 60 is formed in the thin-walled portion 59 of the protection plate 36, the processing method shown in FIG. . FIG. 4A is a cross-sectional view schematically illustrating a state in which laser processing is performed on the protection plate, and FIG. 4B is a diagram schematically illustrating a state in which drilling is performed on the protection plate.

In order to form the through-hole 60 in the protection plate 36, for example, drilling is performed to form the spot facing 58, and the spot facing is thus performed, whereby the thin-thick portion 59 is formed at a predetermined portion of the protection plate 36. Form. Then, the laser beam 72 extends from one surface side (the lower surface side in FIG. 3, the upper surface side in FIG. 4A) to the other surface side (the upper surface side in FIG. 3 and the lower surface side in FIG. 4A). To perform laser processing (first step). When laser processing is performed in this manner, the region irradiated with the laser beam 72 is melted and processed, and a spot facing portion 74 that is tapered from one surface to the other surface is tapered. The processing with the laser beam 72 is performed until the laser beam 72 reaches the other surface side (in other words, penetrates the thin-walled portion 59), and by processing in this way, the inner peripheral surface of the spot facing portion 74 is obtained. There is almost no unevenness on the surface, and it can be processed neatly. For example, a YAG laser or a CO ₂ laser can be used as the laser.

  Thereafter, on the other surface side (in FIG. 3), a portion corresponding to the spot facing portion 74 formed in the thin-walled thick portion 59 (that is, the top portion of the spot facing portion 74 and the hole is formed by the laser beam). Drilling is performed using the drill blade 76 from the upper surface side, the upper surface side in FIG. 4B to the one surface side (the lower surface side in FIG. 3 and the lower surface side in FIG. 4B) (second step). When drilling is performed in this way, the drill blade 76 cuts the top portion of the counterbore portion 74 to perform processing, and a hole 78 having the same inner diameter is formed from the other surface to one surface. The outer diameter of the drill blade 76 used for drilling is larger than the inner diameter d1 on the top side of the spot facing 74 formed by laser processing, and smaller than the inner diameter d2 on the opening side, and such a drill blade 76 is used. As a result of this processing, no burrs or the like are generated at the boundary between the spot facing portion 74 and the hole 78, and the highly accurate clean through-hole 60 can be formed in the thin-walled portion 59.

  In the processing method described above, in particular, when a hole having a small ratio of the hole diameter to the wall thickness is formed in the thin wall portion of the electrically insulating resin plate, specifically, the wall thickness of the thin wall portion is 0.5 mm or less. There is a through hole having a ratio of the hole diameter to the thickness of 1/3 or less (for example, a through hole having an inner diameter of 0.16 mm or less in the thin wall portion having a thickness of 0.5 mm) in such a thin wall portion. It is a very useful processing method when forming. When processing a hole with an inner diameter of 0.16 mm or less using a drill blade, the hole diameter is very small, so a special drill blade with a small blade length is used for processing. In processing using a blade, there is a problem that burrs are likely to occur due to the viscosity of the insulating resin plate. On the other hand, in the above-described processing method, the spot facing is formed by laser processing before drilling, so that the inner peripheral surface of the spot facing is kept clean with no irregularities. Since the drilling is applied to the counterbore part from the top side, no burr is generated at the boundary between the hole formed by the drill blade and the counterbore part. Therefore, it is not necessary to perform a cleaning process for deburring, whereby the number of processing steps can be reduced, and the processing time can be shortened and the processing cost can be reduced.

Processing method of the second embodiment In the processing method of the first embodiment described above, laser processing is performed in the first step and then drill processing is performed in the second step, but laser processing is also performed in the second step. You may make it give. FIG. 5A is a cross-sectional view schematically showing the first process in the processing method of the second embodiment, and FIG. 5B is the second process in the processing method of the second embodiment. FIG.

  In this processing method, the thin-walled portion 59 of the protective plate 36 (formed by drilling in the same manner as described above) from the one surface side (the upper surface side in FIG. 5A) to the other surface side (FIG. 5A). In FIG. 2, laser processing is performed by irradiating the laser beam 72 to the lower surface side (first step). The laser processing in the first step can be performed in the same manner as in FIG.

  Thereafter, on the other surface side (FIG. 5 (FIG. 5 ()), the portion corresponding to the spot facing portion 74 formed in the thin-walled thick portion 59 (that is, the top portion of the spot facing portion 74 and the hole is formed by the laser beam). Laser processing is performed by irradiating laser light 80 from the upper surface side in b) to the one surface side (lower surface side in FIG. 5B) (second step). In this way, when laser processing is performed in the second step, laser processing is performed from the top side of the counterbore portion 74, and the surface from the other surface of the thin-thickness portion 59 is directed to one surface in substantially the same manner as when processing using a drill blade. Thus, a hole 82 having the same inner diameter is formed, and no burr or the like is generated at the boundary portion between the spot facing portion 74 and the hole 82, and the thin-walled portion 59 of the protective plate 36 has a high accuracy as in the above-described embodiment. The finely processed through hole 60a can be formed.

  In the above-described embodiment, the insulating resin plate is subjected to spot facing to form the thin wall portion 59, and the through hole 60 (60a) is formed in the thin wall portion 59 thus formed. In the case where it is thin, the spot facing process may be omitted, and the through hole 60 (60a) may be formed directly by performing the processes of the first step and the second step.

Processing Method of Third Embodiment Also, when the above-described stepped through hole 62 is formed in the tip holding plate 38, the processing method shown in FIG. 6 can be used to perform high-precision and clean processing. FIG. 6A is a cross-sectional view schematically showing a state where the tip holding plate is subjected to drilling in the first step, and FIG. 6B is a state where the tip holding plate is subjected to laser processing in the second step. FIG. 6B is a diagram simply showing a state where the tip holding plate is subjected to the drilling process in the third step.

  In order to form the stepped through hole 62 in the tip holding plate 38, as shown in FIG. 6A, a drill blade 84 is used to form one surface of the tip holding plate 38 (the lower surface in FIG. 3 and the upper surface in FIG. 6). The large counterbore part 86 is formed by drilling, and the large counterbore part 86 is formed, thereby forming a thin-walled part 88 at a predetermined portion of the tip holding plate 38 (first step). The depth h1 of the large counterbore portion 86 is, for example, about 0.3 mm when the thickness T2 of the tip holding plate 38 is 0.5 mm, for example, and the depth h1 of the large counterbore portion 86 is stepped. This corresponds to the wall thickness t4 of the large inner diameter portion 66 of the through hole 62 (see also FIG. 3).

  Next, as shown in FIG. 6 (b), the other side from the one surface side (the side on which the large counterbore portion 86 is formed and the upper surface side in FIG. 6 (a)) of the thin portion 88 of the tip holding plate Laser processing is performed by irradiating the laser beam 72 on the surface side (the lower surface side in FIG. 6A) (second step). This laser processing is performed in the same manner as in FIG. 4A, and by performing laser processing in this way, the bottom face of the large counterbore part 86, that is, from one side of the thin-walled part 88 to a taper shape tapering from the other side. An inclined spot facing 90 is formed. The processing with the laser beam 72 is performed until the laser beam 72 reaches the other surface side (in other words, penetrates the thin-walled portion 88), as described above. There is almost no unevenness on the inner peripheral surface of the corner portion 90, and it can be processed neatly. As shown in FIG. 6B, the spot facing 90 formed by laser processing is formed to extend following the large spot facing 86, and the opening of the spot facing 90 is the step of the stepped through hole 62. 92.

  Thereafter, on the other side (in FIG. 3), a portion corresponding to the spot facing 90 formed in the thin wall portion 88 (that is, the top of the spot facing 90 where a hole is formed by laser light). Drilling is performed from the upper surface side, the upper surface side in FIG. 6C, to one surface side (the lower surface side in FIG. 3 and the lower surface side in FIG. 6C) using the drill blade 94 (third step). When drilling is performed in this way, the drill blade 94 cuts the top of the counterbore 90, and a hole 96 having the same inner diameter is formed from the other surface to one surface. The inner diameter portion 64 is obtained. The outer diameter of the drill blade 94 used for drilling is larger than the inner diameter on the top side of the spot facing 90 formed by the laser processing in the second step, and smaller than the inner diameter on the opening side. By using this, no burr or the like is generated at the boundary between the spot facing portion 90 and the hole 96, and the stepped through-hole 62 processed with high precision can be formed in the tip holding plate 38. it can.

  In the processing method of the third embodiment, the drilling of the third step is performed after the laser processing of the second step. However, as in the second embodiment, the third processing is performed after the laser processing of the second step. You may make it give the laser beam of a process.

  In the above-described embodiments, the processing method according to the present invention has been described by applying to the processing of the protection plate 36 and the tip holding plate 38 of the wiring board inspection jig. However, the processing method is not limited to the processing of these plates 36 and 38, and the wiring board The present invention can be applied to the processing of other plates of the inspection jig, and can also be applied to the processing of general insulating resin plates other than the wiring board inspection jig.

Example In order to confirm the effect of the present invention, the following processing experiment was performed using the processing method of the first embodiment. As an insulating resin plate, Tektron PPS (polyphenylene sulfide) (manufactured by Nippon Polypenco Co., Ltd.) sliced to a thickness of 0.5 mm was used. In the first step, a spot facing portion was formed by irradiating laser light from the back surface of the insulating resin plate using a YAG laser (wavelength: 532 nm) for processing. The irradiated laser light had an average output of 8.0 W, a Q-switch repetition frequency of 10 KHz, and a pulse width of 100 ns. This laser beam is irradiated about 100 times and irradiated under such conditions. The inner diameter of the opening side (the back side where the laser beam is irradiated) is 0.09 mm, and the top side (the side where the laser beam is irradiated) A counterbore part inclined in a tapered shape having an inner diameter of 0.04 mm on the opposite surface side was formed.

  Thereafter, in the second processing, cutting was performed using a drill blade. The drill blade used has a cutting length of 0.8 mm and an outer diameter of 0.06 mm. Using this drill blade, cutting is performed from the front surface to the back surface of the insulating resin plate, thus penetrating the insulating resin plate. A hole was formed.

  After the drilling in the second step, the inner peripheral surface of the formed through-hole and the peripheral portion thereof were examined. As a result, no burrs were observed and the surface was clean. From this, it was confirmed that it is possible to form a clean through hole by the first and second processes without the need for a cleaning process after the second process.

It is sectional drawing which shows the principal part of the wiring board inspection jig | tool of one Embodiment. It is sectional drawing which shows the wiring board inspection jig of FIG. 1 in the state which test | inspects a printed wiring board. It is the elements on larger scale which expand and show the front-end | tip part of the probe of the wiring board inspection jig | tool of FIG. 1, and its vicinity. FIG. 4A is a cross-sectional view for explaining laser processing in the first step in the processing method of the first embodiment, and FIG. 4B is for explaining drill processing in the second step. FIG. FIG. 5A is a cross-sectional view for explaining the laser processing in the first step in the processing method of the second embodiment, and FIG. 5B shows the laser processing in the second step in the processing method. It is sectional drawing for doing. FIG. 6A is a cross-sectional view for explaining the drilling process in the first step in the machining method of the third embodiment, and FIG. 6B shows the laser machining in the second step in the machining method. FIG. 6C is a cross-sectional view for explaining the drilling process in the third step in the processing method. FIG. 7A is a cross-sectional view for explaining drilling in a conventional processing method, and FIG. 7B is a cross-sectional view for explaining cleaning processing performed after the drilling.

Explanation of symbols

32 Probe structure part 34 Receiving pin structure part 36 Protection plate 38 Tip holding plate 48 Printed wiring board 52 Probe 58, 74, 94 Spot facing part 59,88 Thin wall part 60, 60a Through hole 62 Stepped through hole 68 Receiving pin 72 , 80 Laser beam 76, 84, 94 Drill blade 78, 96 hole 86 Large counterbore part 92 Step part

Claims (3)

In the processing method of the insulating resin plate for processing the through hole in which the ratio of the hole diameter to the thickness is 1/3 or less in the thin thickness portion processed to the thickness of 0.5 mm or less,
The thin-walled thick portion is irradiated with laser light from one side thereof, and a counterbore portion that penetrates the thin-walled portion and tapers from the one surface toward the other surface is formed. And drilling from the other surface to form a through hole penetrating from the other surface to the one surface. Before the laser light irradiation, the one surface of the insulating resin plate is drilled to form a large countersunk portion having a predetermined depth, and the large countersunk portion is formed into the thin-walled portion. The method for processing an insulating resin plate according to claim 1 , wherein a through hole is formed. A wiring board inspection jig comprising an insulating resin plate processed by the processing method according to claim 1 .

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