JP4676802B2 - Non-contact IC tag packing method - Google Patents

Description

  The present invention relates to a packing method for non-contact IC tags and a buffer sheet for packing non-contact IC tags. More specifically, the present invention relates to a method for packing a non-contact IC tag including an IC chip that is easily damaged due to an impact during transportation at a low cost so as not to easily receive the impact, and a buffer sheet used in the packing method. Therefore, the field of use of the present invention is the field of manufacture, packaging, transportation, etc. of non-contact IC tags.

  Non-contact IC tags record and hold information, and can exchange information by communicating with external devices in a non-contact manner. Therefore, non-contact IC tags are frequently used as recognition media in transportation and logistics, or for various purposes such as product quality control and inventory management. It is becoming. However, when a non-contact IC tag is put into practical use, high reliability is required, and a few defective products greatly affect the reliability of the entire system. For this reason, manufacturing and inspection are performed with great care in the manufacturing process of the non-contact IC tag to prevent the generation and mixing of defective products.

  However, since the non-contact IC tag itself is an elaborate electronic device, the IC chip portion is particularly likely to be damaged during the packaging and transportation process after the manufacture is completed. Sheet-like non-contact IC tags are often packed and transported in a box such as corrugated cardboard, and are handled in the same manner as general goods and general cargo in handling. Conventionally, the non-contact IC tag sheet is transported carefully together with an air packing sheet, as will be described later, but the occurrence of defective products after arrival is still remarkable.

Here, for reference, an embodiment of an actual non-contact IC tag will be described.
FIG. 6 is a plan view of the sheet-like non-contact IC tag. In the non-contact IC tag 1, an antenna pattern 2 is formed on the surface of a base material (base film) 11, and an IC chip 3 is attached to both end portions 2 a and 2 b of the antenna pattern 2 having a winding coil shape. One end of the antenna pattern is connected to the conduction circuit 7 passing through the back surface of the base material using a caulking tool or the like so as to communicate with both end portions 2 a and 2 b of the antenna pattern connected to the IC chip 3. The pads of the IC chip 3 are connected to both end portions 2a and 2b by a conductive adhesive or the like. In some cases, the connection of the IC chip pad is strengthened by providing spike-like protrusions.
In FIG. 6, the antenna pattern 2 is formed by photo-etching a metal foil laminated on a transparent base material 11, and is a view seen from the side to be attached to an adherend. The antenna surface may be protected with paper or a transparent film, and the back surface side of the substrate 11 may be processed with an adhesive.

Such sheet-like non-contact IC tags may be delivered as single pieces cut one by one, but in many cases, several sheets of sheet-like non-contact IC tags are connected in a row in a flat plate shape. Often delivered as a connected body. FIG. 4 is a view showing such a non-contact IC tag sheet connecting body. When the IC tag connecting body 1R thus processed into a sheet is packaged in units of a plurality of sheets, the IC chip portion is thicker than the base sheet portion. The thickness increases and large irregularities are generated as a whole.
When pressure or impact is applied in this uneven state, local stress is generated and damage to the IC chip 3 is large, resulting in defective products such as chip breakage and poor connection. In particular, accidents frequently occur during transportation.

  To avoid trouble, methods such as reducing the number of packages, inserting cushioning materials such as air caps, and changing the orientation of the sheets alternately so that the IC chip parts do not overlap are conceivable. There is a problem that workability is poor and the packing form is limited. In the manufacturing process, the contact body of the non-contact IC tag is discharged from the manufacturing apparatus in a sheet state cut in the same plane and direction. Make it easier. The present application relates to a packing method for preventing a quality accident from occurring in a sheet-like non-contact IC tag which is such a connecting body, and a packing buffer sheet used for the packing method.

  High-priced electronic components such as integrated circuits are transported in dedicated containers, but for non-contact IC tags that compete with bar code labels and require the same low price, the price of the container itself is such a dedicated container. However, it becomes more expensive than the non-contact IC tag itself. Therefore, a method for safe transportation at low cost is required. It is also necessary to consider environmentally friendly materials from the viewpoint of waste disposal. Although prior art directly related to the present application is not detected, there is Patent Document 1 or the like regarding packaging materials such as semiconductor devices and electronic precision equipment. Although Patent Literature 1 describes an “air cushion” type packaging material, it is considered that special processing is required. Such a packaging material has a problem of high cost as described above.

JP-A-7-291358

  Accordingly, the present invention has been completed by studying a method and a packing material for safely packing a sheet-like non-contact IC tag at a low cost.

Abstract of the invention for solving the problems is the concatenation of the non-contact IC tag sheet to a method of packing packed in the box, the connecting body several sheets of non-contact IC tag sheet is arranged in a row A process of collecting several to several tens of sheets into one bundle with the surface and top and bottom sides aligned, and a buffer sheet inserted between the one bundle, each IC chip of the non-contact IC tag sheet connecting body A step of arranging one or several sheets of sheet material having an opening in each of the facing portions into one bundle by aligning the opening positions, one bundle of the non-contact IC tag sheet connecting body and a buffer sheet in a cardboard box A method of packing a non-contact IC tag, wherein the IC chips of the non-contact IC tag are alternately packed in a box so that each IC chip of the non-contact IC tag is positioned at each opening position of the buffer sheet. ,It is in.

Above, Oite packing how the non-contact IC tag, the buffer sheet may be a corrugated sheet or rigid foamed plastic material sheet, circular 5cm aperture diameter 2 cm, polygonal 5cm from the across 2 cm, or One side can be a square of 2 cm to 5 cm. When these materials and the size of the opening are used, it is possible to minimize the occurrence of defective products in packing and transportation of non-contact IC tags.

(1) According to the non-contact IC tag packing method of the present invention, the IC chip of the non-contact IC tag relaxes the stress received from the outside and the impact force between the IC chips during transportation, and The occurrence of defects can be minimized.
(2) packing how the non-contact IC tag of the present invention does not use a special material and expensive materials, it is possible to reduce the packaging cost.

Hereinafter, the packing method and buffer sheet of the present invention will be described with reference to the drawings.
FIG. 1 is a diagram showing a state in which a non-contact IC tag sheet connecting body is packed in a cardboard box, FIG. 2 is a diagram showing a cross-sectional state of the cardboard box when stacked, and FIG. 3 is a non-contact IC tag of the present invention. FIG. 4 is a view showing a cushioning sheet for packing, FIG. 4 is a view showing a non-contact IC tag sheet connecting body, and FIG. 5 is a view showing the structure and type of cardboard.

  FIG. 1 is an overhead view of a state in which the non-contact IC tag sheet connecting body 1R is packed in the cardboard box 5, and shows a state in which the first level is finished. The sheet-like non-contact IC tag sheet connecting body (hereinafter also simply referred to as “connecting body”) 1R is packed into a cardboard box 5 or the like having a size that can accommodate the length of the connecting body 1R as shown in FIG. At that time, a plurality of the connecting members 1R are bundled in the same plane and in the same direction, and the one bundle and several bundles of the buffer sheets 4 are alternately packed so that there is almost no space in the box. And fill. This is to prevent the connecting body 1R from falling down. When a space area is generated, it is natural to use an extra packing material or cushioning sheet for filling. The bundle of connecting members 1R is a bundle of several to several tens of sheets. There are one to several buffer sheets. It should be noted that the inner dimension (either vertical or horizontal other than the height) of at least one side of the cardboard box 5 is approximately the same as the length of the connecting body 1R. This is because the connecting body 1R moves in the corrugated cardboard box 5 and the relative position to the buffer sheet 4 becomes uncertain if they do not match. It is preferable that the approximate match coincides with an error within about 1 mm to 20 mm.

If the buffer sheet 4 has a sufficient thickness, one sheet may be used. However, when existing materials are used without special material, it is convenient to use a plurality of sheets using the same cardboard sheet as the cardboard box. It is. Alternatively, a double-sided cardboard or a double-sided cardboard as described later may be used. The buffer sheet 4 preferably has substantially the same width and length as the connecting body 1R.
The connecting body 1R is preferably transported in the form packed in one stage as described above, but can be transported in two or three stages as follows.

  When one stage is finished, lay one or two flat cardboard sheets on the top. This is to prevent the pressure of the connecting member 1R and the buffer sheet 4 packed on the IC tag from reaching the IC tag. Therefore, on the lower side of the corrugated cardboard sheet, the inserted cushion sheet 4 functions as a structure that supports the pressing force from the upper surface. The corrugated cardboard sheet is contained in the corrugated cardboard box 5 and a sheet having a size substantially equal to the inner dimension is used. A relatively rigid material other than the corrugated cardboard sheet may be used, but a material having a high density will increase the weight and compress the lower stage.

  FIG. 2 shows a cross-sectional state of the cardboard box, and shows a surface orthogonal to the connecting body 1 </ b> R and the cushioning sheet 4 after the packing is completed. From the lower side of the cardboard box 5, a bundle of the connecting bodies 1R and three cushion sheets 4 are packed, two cardboard sheets 6a are placed on the upper surface, and the connecting body 1R is placed on the cardboard sheet 6a. A state is shown in which three sheets of a bundle and a buffer sheet 4 are alternately packed, and further a cardboard sheet 6b is placed thereon, and the bundle of the connecting body 1R and the buffer sheet 4 are stacked. As shown in FIG. 2, the buffer sheets 4 and the connecting members 1R in each step are preferably packed in directions orthogonal to each other when the cardboard boxes 5 have the same vertical and horizontal dimensions as shown in FIG. After all of the connecting members 1R are packed, the lid 5f of the cardboard box is closed.

Next, the buffer sheet for packing a non-contact IC tag according to the present invention will be described.
FIG. 3 is a diagram illustrating a buffer sheet. As shown in the figure, the buffer sheet 4 is formed by forming openings 4k at a constant interval in a flat plate material. The length L of the buffer sheet 4 is set to be equal to the length of the connecting body 1 </ b> R, but also approximately matches the inner dimension of the cardboard box 5. The width W of the buffer sheet 4 is also set to be equal to the width of the connecting body 1R, but is preferably slightly wider than the connecting body 1R. This is because the buffer sheet 4 receives external pressure as a structural material so that force is not exerted on the connecting body 1R. “Slightly” means about 1 mm to 20 mm.

The opening 4k is provided at the position of the IC chip 3 of the sheet-like non-contact IC tag sheet connecting body 1R. Correctly, the center of the opening 4k is positioned at the position of each IC chip 3 when both ends of the connecting body 1R and the buffer sheet 4 having the designed dimensions are aligned and vertically erected.
The size and shape of the opening 4k is a circle having a diameter of 2 to 5 cm, a polygon having a width of 2 to 5 cm, or a square having a side of 2 to 5 cm. In the case of a single non-contact IC tag, such a large opening is not necessary, but if several tens of sheets are stacked, the IC chip position becomes a large bulging portion. Considering the positional displacement of the connecting body 1R and the buffer sheet 4 in the cardboard box, the size of the opening 4k of this level is required. In terms of shape, a circular shape having the same clearance width in any direction is most preferable.

  The material of the buffer sheet 4 has some cushioning properties, and a material having a certain degree of strength can be used as a structure. A foam material such as a soft sponge that is not hard is considered inappropriate. This is because the pressure during stacking and the external pressure during transportation cannot be structurally supported. Conversely, too hard materials such as metal plates, plastic plates and ceramic plates are not suitable. This is because an impact force is applied when the IC chip comes into contact, and the weight increases. In general, an inexpensive corrugated cardboard sheet or a foamed plastic material sheet such as hard foamed polystyrene is suitable. When not collected and used, corrugated cardboard that is not plastic is superior in terms of environmental friendliness.

FIG. 5 is a diagram showing the structure and type of cardboard.
Corrugated cardboard includes single-sided cardboard, double-sided cardboard, double-sided cardboard, and double-sided cardboard. Single-sided corrugated cardboard has a liner on one side and corrugated shin is bonded to one side. There are two-sided and central liners, with a two-layer structure with a corrugated shin between each liner, and double-sided cardboards with a three-layer structure as well.
Also, depending on the number of steps per 30 cm and the height of the steps, there are various types from A flute, B flute, C flute, E flute, F flute and G flute. The frequently used A flute has a step height of 4.5 to 4.8 mm and a step number of 34 ± 2 steps / 30 cm. Similarly, the B flute has a step height of 2.5 to 2.8 mm and the number of steps is 50 ± 2 steps / 30 cm, and the C flute has a step height of 3.5 to 3.8 mm and the number of steps. 40 ± 2 steps / 30 cm. These standards are defined in JISZ-1516.
A flute double-sided cardboard can be suitably used for the cardboard box 5, the buffer sheet 4, the cardboard sheet 6 and the like used in the present invention.

  As the hard foamed plastic material sheet, polystyrene foam, hard urethane foam, hard rubber sponge, polyethylene foam, polypropylene foam, and the like can be used.

(Non-contact IC tag sheet)
As the non-contact IC tag sheet connecting body 1R, a substrate obtained by laminating a transparent biaxially stretched polyester (PET) film having a thickness of 38 μm and a copper foil having a thickness of 110 μm is used, and this is photoetched to form a coiled antenna pattern. Then, a non-contact IC tag was used in which the IC chip was mounted with a conductive adhesive, and the antenna pattern and the surface of the IC chip were laminated with a 40 μm thick PET film as a protective coating. The mounted IC chip 3 has a planar size of 900 μm × 910 μm and a thickness of 150 μm.

  Each unit of the non-contact IC tag 1 has a length of 86 mm and a width of 54 mm, but a connection portion (dub) 1d having a width of 5 mm is provided in front of and behind each unit of the non-contact IC tag 1. Therefore, the width of the connecting portion (dove) 1d between the non-contact IC tags 1 is 10 mm (see FIG. 4). Since the non-contact IC tag sheet connecting body 1R is formed by connecting the five non-contact IC tags 1 in a line in the length direction, the entire length of the connecting body 1R is 480 mm. This connector 1R was used in the following Examples and Comparative Examples.

(Packing method)
The cardboard box 5 was made of double-sided A flute corrugated cardboard having a thickness of 5 mm, and the inner dimensions were 500 mm long × 270 mm wide × 100 mm high.
The buffer sheet 4 was made of double-sided A flute corrugated cardboard having a thickness of 5 mm and had a width of 70 mm and a length of 484 mm. Further, five openings with a diameter of 30 mm were punched around the position of the IC chip 3 when the buffer sheet 4 and the connecting body 1R were erected horizontally and correctly stacked. Therefore, the openings 4k are punched at a constant pitch of 96 mm between the centers.

  The cardboard box 5 was filled with the non-contact IC tag sheet connecting body 1R and the buffer sheet 4. By alternately packing 60 bundles of 5 bundles having the same direction and the same surface as the connecting body 1R and 4 bundles of buffer sheets 4 having the same orientation, the corrugated board 5 is packed as shown in FIG. It became the filling state like. In this state, the connecting body 1 </ b> R and the cushioning sheet 4 are packed in a state of standing sideways with respect to the bottom surface of the cardboard box 5. Since five cushion sheets 4 are used at the portion in contact with the inner surface of the cardboard box, 26 sheets are used in total. In this state, 300 sheets of the connecting body 1R, that is, 1500 sheets of the unit non-contact IC tag 1 are filled. Finally, the lid 5f of the cardboard box 5 was closed and the uppermost surface was bonded with an adhesive tape. In addition, it did not stack and it was set as the 1st packing.

  As the non-contact IC tag sheet connecting body 1R and the cardboard box 5, the same ones as in Example 1 were used. However, as the buffer sheet 4, a foamed polystyrene sheet having a thickness of 5 mm and having a width of 70 mm and a length of 484 mm was used. The opening 4k is also formed in the same manner as in the first embodiment. That is, five openings with a diameter of 30 mm were punched around the position of the IC chip 3 when the buffer sheet 4 and the connecting body 1R were erected horizontally and correctly stacked. Therefore, the openings 4k were punched at a constant pitch of 96 mm. Using this buffer sheet 4, the connecting body 1R was packed in the cardboard box 5 under the same conditions as in Example 1. In addition, it did not stack and it was set as the 1st packing.

(Comparative Example 1)
The non-contact IC tag sheet connecting body 1R and the corrugated cardboard box 5 are the same as those in the first embodiment, but the cushioning sheet is a three-layer polyethylene air packing sheet (for packing) Protective sheet) [Soken Corporation "Air Pot Sheet" (trademark)] cut to a width of 70 mm and a length of 484 mm was used. Note that the opening of the IC chip 3 portion is not provided. This was put in the same state as in FIG. 1, and 60 bundles of 5 bundles aligned with the same direction and surface as the connecting body 1R and 4 air packing sheets were packed. Since five air packing sheets are used for the portion in contact with the inner surface of the cardboard box, a total of 26 air packing sheets are used. That is, Example 1 is a filling state in which the buffer sheet is replaced with an air packing sheet. In addition, it did not stack and it was set as the 1st packing.

(Comparative Example 2)
As the non-contact IC tag sheet connecting body 1R and the cardboard box 5, the same ones as in Example 1 were used, but the connecting body 1R was filled in a squeezed state without using a buffer sheet.
The squeezed state refers to a state in which the connecting body 1R is stuffed into the nectar without using the buffer sheet in a state where the connecting body 1R stands sideways. In this state, 540 sheets of the connecting body 1R, that is, 2700 sheets as non-contact IC tags are filled. In addition, it did not stack and it was set as the 1st packing.

(contents of the test)
Prepare five each of the cardboard boxes after filling in Examples 1 and 2 and Comparative Examples 1 and 2 from the position where the bottom surface of each cardboard box is 1 meter high to the concrete floor. A test for natural dropping was performed (Test Nos. 1 to 5). The number of times of dropping was one, and the number of defective products after the non-contact IC tag 1 in each cardboard box was dropped was counted. The non-contact IC tag 1 has been confirmed to be a good product before the test.
For the determination of defective products, each non-contact IC tag 1 is subjected to a reading test using a 13.56 MHz IC tag reader / writer (“RCT-200-01” manufactured by Wellcat Co., Ltd.). .

(Test results)
The test results are shown in Table 1.

No. 1-No. The total number of defective products generated by the drop test of No. 5 is 9 in Example 1, 11 in Example 2, 17 in Comparative Example 1, and 568 in Comparative Example 2. In terms of the defect rate, in the case of Example 1, 9 sheets / (1500 sheets × 5) = 0.0012 (0.12%). Similarly, Example 2 is 0.15%, Comparative Example 1 is 0.23%, and Comparative Example 2 is 4.2%.
It was confirmed that a very large number of defective products were generated in the “squeezed state” in which the buffer sheet of Comparative Example 2 was not used, and it was verified that the packaging / transport conditions greatly affected the quality of the non-contact IC tag. Further, the packing method using the air packing as the buffer sheet (Comparative Example 1) is also a good result, but the buffer sheet (Example 1 and Example 2) 4 provided with the opening 4k is more used. It has also been found to give good results.

  As described above, the non-contact IC tag packing method of the present invention provides a method for packing and transporting a non-contact IC tag safely and at low cost. Further, the buffer sheet for packing a non-contact IC tag of the present invention exhibits a remarkable effect of reducing the generation of defective products of the non-contact IC tag when used in the packing method.

It is a figure of the state which packed the non-contact IC tag sheet | seat connection body in the cardboard box. It is a figure which shows the cross-sectional state of the cardboard box at the time of stacking. It is a figure which shows the buffer sheet for non-contact IC tag packing of this invention. It is a figure which shows the connection body of a sheet-like non-contact IC tag. It is a figure which shows the structure and kind of cardboard. It is a top view of a sheet-like non-contact IC tag.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Non-contact IC tag 1R Non-contact IC tag sheet connecting body 2 Antenna pattern 3 IC chip 4 Buffer sheet 5 Cardboard box 6, 6a, 6b, 6c Cardboard sheet

Claims (3)

  A method of packing a non-contact IC tag sheet in a box and packing it, and several or dozens of non-contact IC tag sheets arranged in a row are arranged on its surface and top and bottom. A step of aligning the left and right sides into one bundle, a buffer sheet inserted between the one bundle, and a sheet material in which an opening is formed in each portion facing each IC chip of the non-contact IC tag sheet connecting body A step of aligning one or several sheets into one bundle with the opening positions aligned, and one bundle of the non-contact IC tag sheet connecting body and one bundle of buffer sheets in the cardboard box. A method of packing a non-contact IC tag, comprising a step of alternately packing an IC chip in a box so that the IC chip is positioned at each opening position of the buffer sheet.   2. The non-contact IC tag packing method according to claim 1, wherein the buffer sheet is made of a corrugated cardboard sheet or a hard foamed plastic material sheet.   2. The non-contact IC tag packing method according to claim 1, wherein the opening is a circle having a diameter of 2 cm to 5 cm, a polygon having a width of 2 cm to 5 cm, or a square having a side of 2 cm to 5 cm.

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