JP4677151B2 - Exposure apparatus and device manufacturing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an exposure apparatus, and more particularly to an exposure apparatus that uses a semiconductor element (IC / CCD, etc.), a liquid crystal display element, a thin film magnetic head, and the like in a lithography process.
[0002]
[Prior art]
Conventionally, a reduction projection exposure apparatus is used in a manufacturing process of a semiconductor element formed from an ultrafine pattern such as an LSI or a VLSI. As the mounting density of semiconductor elements has increased, further miniaturization of patterns has been required, and at the same time as the development of resist processes, the miniaturization of exposure apparatuses has been addressed.
[0003]
As means for improving the resolution of the exposure apparatus, there are a method of changing the exposure wavelength to a shorter wavelength and a method of increasing the numerical aperture (NA) of the projection optical system. In general, it is known that the resolution is proportional to the exposure wavelength and inversely proportional to the NA. In addition, efforts have been made to ensure the depth of focus of the projection optical system while improving the resolution. In general, since the depth of focus is proportional to the exposure wavelength and inversely proportional to the square of NA, the improvement in resolution and the securing of the depth of focus are contradictory issues. As a method for solving such a problem, a phase shift reticle method, a FLEX (Focus Latitude enhancement Exposure) method, and the like have been proposed.
[0004]
With regard to the exposure wavelength, KrF excimer lasers having an oscillation wavelength of about 248 nm from i-line of 365 nm have recently become mainstream, and further, ArF excimer lasers and F ₂ lasers having an oscillation wavelength of about 193 nm as next-generation exposure light sources. (Oscillation wavelength: 157 nm) is being developed.
[0005]
Further, from the viewpoint of manufacturing cost of semiconductor elements, further improvement in throughput in the exposure apparatus has been attempted. For example, there are a method of shortening the exposure time per shot by increasing the output of the exposure light source, or a method of increasing the number of elements per shot by expanding the exposure area.
[0006]
Furthermore, in recent years, in order to cope with an increase in the chip size of a semiconductor element, scanning exposure is performed while synchronizing the mask and the wafer from a so-called step-and-repeat stepper that sequentially prints and moves the mask pattern. Therefore, a step-and-scan type exposure apparatus that sequentially moves the exposure apparatus is moving. This step-and-scan type exposure apparatus has a feature that the exposure area can be expanded without increasing the size of the projection optical system because the exposure field is slit-shaped.
[0007]
As described above, when ultraviolet rays are used as an exposure light source, ammonium sulfate (NH ₄ ) ₂ SO ₄ or silicon dioxide SiO ₂ adheres to the surface of an optical element disposed in the optical path as a result of long-term use of the apparatus, and optical A phenomenon in which the characteristics are significantly reduced occurs. This is generated by causing a chemical reaction when ammonia NH ₃ , sulfurous acid SO ₂ , Si compound and the like contained in the surrounding environment are irradiated with ultraviolet rays. Conventionally, in order to prevent such deterioration of the optical element, the entire optical path is purged with an inert gas such as clean dry air or nitrogen.
[0008]
Further, it is known that in an ArF excimer laser having a wavelength near 193 nm, there are a plurality of oxygen ( O ₂ ) absorption bands in the band near the wavelength. In addition, oxygen absorbs the light to generate ozone ( O ₃ ). This ozone further increases the light absorption and significantly lowers the transmittance. The product adheres to the surface of the optical element, reducing the efficiency of the optical system.
[0009]
Therefore, in the optical path of the exposure optical system of a projection exposure apparatus that uses far ultraviolet rays as a light source such as an ArF excimer laser, there is a method of suppressing the oxygen concentration present in the optical path to a low level by purging with an inert gas such as nitrogen. It has been taken. Furthermore, when an F ₂ laser having a shorter wavelength than ArF is used, the absorption coefficient of oxygen is very large, so that exposure light is absorbed when oxygen is contained in the air, and is used as an exposure light source. I can't do it. Therefore, a method is used in which exposure air is prevented from being absorbed by eliminating air in the exposure apparatus, filling with an atmospheric gas such as helium or nitrogen, and keeping the oxygen concentration low.
[0010]
However, replacing the atmospheric gas in the exposure apparatus as described above with helium or nitrogen gas causes a decrease in throughput due to the time required for the atmospheric gas replacement. Further, since a large amount of replacement gas is required and the structure of the exposure apparatus chamber is complicated, there is a serious problem in terms of cost. Therefore, it is preferable to replace the minimum range on the optical path of the laser beam with an inert gas such as nitrogen gas or helium gas.
[0011]
In order to minimize the gas replacement region, a method of storing the illumination optical system and projection optical system on the optical path in a plurality of cases and replacing the gas inside is disclosed in JP-A-6-21600. Proposed. It is possible to replace all the optical paths from the light source to the wafer by providing a housing for coupling between the housings and providing a path for supplying a replacement gas therein.
[0012]
[Problems to be solved by the invention]
By the way, on the optical path of the illumination optical system, there is an illumination aperture stop switching section for operating the illumination area and shape on the secondary light source, and a driveable blind section for defining the shape of the illumination area on the reticle. Has been placed. When the vibration generated when driving these units is transmitted to the optical elements constituting the illumination optical system, there is a risk that the image performance of the illumination light is significantly deteriorated. In particular, the blind portion used in the scanner needs to be always driven during scanning exposure in order to keep the irradiation area on the reticle constant. Therefore, it is preferable that the drive unit in the illumination optical system has a structure that does not transmit vibration to the housing in which the optical element is housed.
[0013]
In addition, a reticle stage is arranged between the illumination optical system and the projection optical system to detect the relative position between the reticle and the wafer and to perform alignment (alignment). In recent exposure apparatuses, the accuracy of nano-order alignment is required for the reticle stage, so even a minute vibration is at a level that cannot be ignored. Particularly in the case of a reticle stage used in a scanner, the vibration acts as a disturbance to the scanning exposure system, and an exposure control system that ensures stable exposure accuracy when performing synchronous scanning of the mask stage and wafer stage during scanning exposure. As a result, the control was unstable. For this reason, the reticle stage is preferably supported independently without being connected to other units.
[0014]
The drive unit positioned on the optical path from the illumination optical system to the projection optical system needs to be connected to the housing in which the optical element is accommodated without transmitting vibration. Therefore, it has been a very difficult problem to make only the minimum necessary area on the optical path a sealed space.
[0015]
SUMMARY OF THE INVENTION An object of the present invention is to provide an exposure apparatus capable of connecting a housing housing an optical element and a housing housing a drive unit without transmitting vibrations to form a sealed structure. .
[0016]
[Means for Solving the Problems]
To achieve the above object, the present invention is via the illumination optical system by exposure light from the light source illuminates the original, a projection exposure a pattern formed on the original plate onto the base plate via a projection optical system an exposure apparatus that has a plurality of housings disposed within the optical Gakumoto element disposed on the optical path of the exposure light reaching the projection optical system from the light source, between said plurality of housings An elastic body to be connected and hermetically sealed, and a light shielding means for preventing exposure of exposure light to the elastic body are provided.
[0017]
Further, in the present invention, it is desirable to use a fluororesin as the elastic body, and as the light shielding means, a light shielding member having one end fixed to one of adjacent housings and vibrationally insulated from the other housing is provided. Preferably, a double sheath tube may be used as the light shielding member.
[0018]
In a specific exposure apparatus according to the present invention, an I-ray, a KrF excimer laser, or illumination light (ArF excimer laser or F ₂ laser) including a wavelength region having absorption characteristics with respect to oxygen is used as a light source. In a projection exposure apparatus having an illumination optical system for irradiating light from a light source to a formed mask (hereinafter also referred to as a reticle) and a projection optical system for forming an image of an illuminated pattern on a wafer, An illumination optical system and a projection optical system are arranged in a sealed housing, and a gas supply system that supplies clean dry air or an inert gas having a smaller absorption characteristic than oxygen to the wavelength range of illumination light in the housing. It is provided that almost the entire atmosphere present in the optical path of the illumination light in the housing is replaced with clean dry air or a substance other than oxygen (an inert gas such as nitrogen).
[0019]
The exposure apparatus according to the present invention uses an elastic body such as rubber or resin as a sealing member that connects the drive unit and a housing in which an optical element is disposed, and directly uses the elastic body used as the sealing member. It is preferable to provide a light shielding member to prevent the laser beam from being irradiated.
[0020]
According to the exposure apparatus of the present invention, by using an elastic body as the sealing member, vibration from the drive unit to the housing that houses the optical element, and position detection such as a reticle stage from the illumination optical system and the projection optical system are performed. The connection between the housings can be a sealed structure without transmission of minute vibrations to the apparatus. Furthermore, since the exposure light is not directly applied to the elastic body used as the sealing member, the present invention can also prevent the elastic body from being deteriorated.
[0025]
DETAILED DESCRIPTION OF THE INVENTION
<First Embodiment>
FIG. 1 is a view schematically showing a step-and-scan type exposure apparatus according to the first embodiment of the present invention as viewed from the side.
[0026]
In the figure, reference numeral 1 denotes a light source which emits pulses with a KrF excimer laser having an oscillation wavelength of about 248 nm, an ArF excimer laser having an oscillation wavelength of about 193 nm, or an F2 laser having an oscillation wavelength of about 157 nm. . Optical elements such as a mirror, an optical integrator, and a lens are arranged on the optical path of the exposure light from the light source to the projection optical system. The laser beam from the light source 1 is guided to a first illumination optical system housed in a housing 3 placed on a pedestal 2, reflected by an internal mirror 3a, and shaped optics for shaping into a predetermined beam shape. The light enters the optical integrator 3d through the system 3b and the mirror 3c. Near the exit surface of the optical integrator 3d, a secondary light source switching unit 4a housed in the housing 4 is disposed.
[0027]
The light from the secondary light source is collected by the condenser lens 5 a housed in the housing 5 and enters the variable blind 6 a housed in the housing 6. In the variable blind 6a, a light shielding plate is disposed in the vicinity of a surface orthogonal to the optical axis including the condensing point formed by the condensing lens 5a, and an illumination area on the pattern surface of the mask 8 as an original is arbitrarily set. It can be set. FIG. 2 shows a state where the mask 8 is illuminated. Light from the variable blind 6 a enters the second illumination optical system housed in the housing 7. The second illumination optical system is composed of condensing lenses 7a and 7c in the housing 7 and a mirror 7b.
[0028]
The light from the second illumination optical system illuminates a part of the pattern 8a formed on the mask 8 with a slit light beam 8b, and the above pattern is formed on the wafer 12 as a substrate by the projection optical system 11 shown in FIG. A part of 8a is reduced and projected. At this time, as shown by the arrows shown in FIG. 1, the mask 8 and the wafer 12 are scanned in opposite directions with respect to the projection optical system 11 and the slit light beam 8b at the same speed ratio as the reduction ratio of the projection optical system 11. (SCAN), the pattern 8a on the entire surface of the mask 8 is transferred to one chip region or a plurality of chip regions on the wafer 12 by repeating multi-pulse exposure by pulse emission from the light source 1.
[0029]
Reference numeral 10 denotes a mask stage, which scans in the direction of the arrow by a drive system (not shown) while holding the mask 8 and the mask chuck 9 holding the mask 8. A bar mirror 15 is fixed to the mask stage 10, and a laser interferometer 16 detects the speed of the mask stage 10. The mask stage 10 and the laser interferometer 16 are both mounted on a support surface plate 17. The support surface plate 17 is fixed on a lens barrel surface plate 20 that holds the projection optical system 11 from the floor via a support column 18 and a damper 19.
[0030]
A wafer stage 14 scans in the direction of an arrow by a drive system (not shown) while holding the wafer 12 and the wafer chuck 13 holding the wafer 12. Reference numeral 21 denotes a bar mirror fixed to the wafer stage 14, and reference numeral 22 denotes a laser interferometer for detecting the speed of the wafer stage 14, which is fixed to the lens barrel surface plate 20. Further, the wafer stage 14 is placed on the stage surface plate 24 via the damper 23 from the floor. Further, a relative distance in the vertical direction in the figure between the lens barrel surface plate 20 and the stage surface plate 24 is measured by a laser interferometer 25 fixed to the lens barrel surface plate 20. As described above, the laser interferometers 22 and 25 guarantee the positional relationship between the lens barrel surface plate 20 and the wafer stage 14 and the predetermined relative positional relationship between the mask 8 and the wafer 12.
[0031]
The housings 3, 4, 5, 6, and 7 that are blocks of the illumination system have a sealed structure, and are supported by a gantry (not shown). The housings 3 to 7 and the mask stage cover 31 are connected by sealing members 26, 27, 28, 29, and 30 made of fluororubber. A path for gas to pass through is provided inside each of the casings 3 to 7 and has a so-called serial purge structure. In order to prevent exposure light from being directly irradiated to each of the sealing members 26 to 30, light shielding members 41, 42, 43, 44, and 45 are provided as light shielding means.
[0032]
<Second Embodiment>
FIG. 3 is a cross-sectional view showing an example of a light-shielding member mounting structure according to the second embodiment of the present invention. This attachment structure is configured by disposing a sealing member 34 and a light shielding member 35 between end portions of two adjacent casings 32 and 33 having substantially the same shape. The sealing member 34 is formed of a tubular elastic body having a substantially constant thickness and having a bulging portion whose outer shape is increased in the middle. One end is airtight on the outer periphery of the housing 32 and the other end is on the outer periphery of the housing 33. And can be expanded and contracted in the axial direction. The sealing member 34 is preferably made of an elastic rubber made of a fluororesin material.
[0033]
The light shielding member 35 has a tubular body whose inner diameter is larger than the light passage hole Ho1 of the housing 32 and through which the exposure light passes, and an outer flange, and exposure light passing through the light passage holes Ho1 and Ho2 as light shielding means. On the other hand, the inner surface of the sealing member 34 is covered to prevent the exposure light from being irradiated to the sealing member 34. The outer flange of the light shielding member 35 is fixed in contact with the outer surface of the end plate portion of one housing 32 in a concentric manner. The front end of the light shielding member 35 is loosely inserted into a hole Ho2 formed in the end plate portion of the other casing 33, and is insulated from the casing 33 in a vibrational manner so that it can be displaced in the axial direction. is there.
[0034]
<Third Embodiment>
FIG. 4 is a cross-sectional view showing an example of a light-shielding member mounting structure according to the third embodiment of the present invention. In this attachment structure, in addition to the sealing member 38 and the light shielding member 39, a tubular light shielding member 40 that loosely fits on the outer periphery of the light shielding member 39 between the ends of two adjacent housings 36 and 37 having different sizes. Is arranged. The sealing member 38 has an outer flange integrally, is airtightly fixed to the end plate portion of the housing 36 having the larger outer flange, and the other end is airtightly fitted to the outer periphery of the housing 37. The sealing member 38 is extendable in the axial direction, and connects and seals between the housings 36 and 37. The sealing member 38 is preferably made of an elastic rubber made of a fluororesin material.
[0035]
The light shielding member 39 has a tubular shape whose inner diameter is slightly larger than the diameter of the light passage hole Ho1 and whose outer diameter is smaller than the inner diameter of the light shielding member 40. The light shielding member 39 is concentrically disposed inside the sealing member 38, the outer flange is fixed to the end plate portion of the housing 36, and the tip is free. The light shielding member 40 is a tubular body whose inner diameter is larger than the outer diameter of the light shielding member 39 and the diameter of the light passage hole Ho2 and whose outer diameter is smaller than the inner diameter of the sealing member 38. Further, the light shielding member 40 is fixed to the end plate surface of the casing 37 having the smaller base end, and the distal end is free. The two light shielding members 39, 40 constituting the light shielding means are dimensioned so that they always have overlapping portions, the ends of the double sheath tube are loosely fitted to each other, and are insulated from each other in vibration. The inner surface of the sealing member 38 is covered with the exposure light passing through the light passage holes Ho1 and Ho2, and the exposure light is prevented from being irradiated to the sealing member 38.
[0036]
The housing 3 that houses the first illumination optical system is provided with a replacement gas supply unit, and the mask stage cover unit 31 is provided with a replacement gas exhaust system, so that the internal gas is supplied according to a preset program. Helium replacement. The replacement gas may be another inert gas such as nitrogen or neon.
[0037]
Further, the gas replacement means may have a so-called parallel purge structure in which a replacement gas supply unit and a replacement gas exhaust unit are provided in each space formed by two adjacent casings and a sealing member.
[0038]
<Embodiment of Semiconductor Production System>
Next, an example of a production system of a semiconductor device (a semiconductor chip such as an IC or LSI, a liquid crystal panel, a CCD, a thin film magnetic head, a micromachine, etc.) using the apparatus according to the present invention will be described. In this method, maintenance services such as troubleshooting, periodic maintenance, and software provision for manufacturing apparatuses installed in a semiconductor manufacturing factory are performed using a computer network outside the manufacturing factory.
[0039]
FIG. 5 shows the whole system cut out from a certain angle. In the figure, reference numeral 101 denotes a business office of a vendor (apparatus supply manufacturer) that provides a semiconductor device manufacturing apparatus. Examples of manufacturing apparatuses include semiconductor manufacturing apparatuses for various processes used in semiconductor manufacturing plants, such as pre-process equipment (lithographic apparatuses such as exposure apparatuses, resist processing apparatuses, etching apparatuses, heat treatment apparatuses, film forming apparatuses, and flattening apparatuses. As well as post-processing equipment (assembly equipment, inspection equipment, etc.). The office 101 includes a host management system 108 that provides a maintenance database for manufacturing apparatuses, a plurality of operation terminal computers 110, and a local area network (LAN) 109 that connects these to construct an intranet or the like. The host management system 108 includes a gateway for connecting the LAN 109 to the Internet 105, which is an external network of the office, and a security function for restricting access from the outside.
[0040]
On the other hand, 102 to 104 are manufacturing factories of semiconductor manufacturers as users of manufacturing apparatuses. The manufacturing factories 102 to 104 may be factories belonging to different manufacturers, or factories belonging to the same manufacturer (for example, a factory for a pre-process, a factory for a post-process, etc.). In each of the factories 102 to 104, a plurality of manufacturing apparatuses 106, a local area network (LAN) 111 that connects them together to construct an intranet, etc., and a host as a monitoring apparatus that monitors the operating status of each manufacturing apparatus 106 A management system 107 is provided. The host management system 107 provided in each factory 102 to 104 includes a gateway for connecting the LAN 111 in each factory to the Internet 105 that is an external network of the factory. As a result, the host management system 108 on the vendor's office 101 side can be accessed from the LAN 111 of each factory via the Internet 105, and access is permitted only to limited users due to the security function of the host management system 108. . Specifically, status information (for example, a symptom of a manufacturing apparatus in which a trouble has occurred) indicating the operating status of each manufacturing apparatus 106 is notified from the factory side to the vendor side via the Internet 105, and the notification is also handled. It is possible to receive response information (for example, information for instructing a coping method for trouble, coping software or data), maintenance information such as the latest software and help information from the vendor side. A communication protocol (TCP / IP) generally used on the Internet is used for data communication between each factory 102 to 104 and the vendor office 101 and data communication on the LAN 111 in each factory. . Instead of using the Internet as an external network outside the factory, it is also possible to use a high-security dedicated line network (such as ISDN) without being accessible from a third party. Further, the host management system is not limited to the one provided by the vendor, and the user may construct a database and place it on the external network, and allow access to the database from a plurality of factories of the user.
[0041]
FIG. 6 is a conceptual diagram showing the overall system of the present embodiment cut out from an angle different from that in FIG. In the previous example, a plurality of user factories each equipped with a manufacturing apparatus and a management system of a vendor of the manufacturing apparatus are connected via an external network, and production management of each factory or at least one unit is performed via the external network. Data communication of manufacturing equipment was performed. On the other hand, in this example, a factory equipped with a plurality of vendors' manufacturing devices and a management system of each vendor of the plurality of manufacturing devices are connected by an external network outside the factory, and maintenance information of each manufacturing device is obtained. Data communication. In the figure, reference numeral 201 denotes a manufacturing factory of a manufacturing apparatus user (semiconductor device manufacturer), and a manufacturing apparatus that performs various processes on the manufacturing line of the factory, in this case, an exposure apparatus 202, a resist processing apparatus 203, and a film forming processing apparatus. 204 has been introduced. In FIG. 6, only one manufacturing factory 201 is depicted, but actually, a plurality of factories are similarly networked. Each device in the factory is connected by a LAN 206 to form an intranet, and the host management system 205 manages the operation of the production line.
[0042]
On the other hand, each business office of a vendor (apparatus supply manufacturer) such as the exposure apparatus manufacturer 210, the resist processing apparatus manufacturer 220, and the film formation apparatus manufacturer 230 has host management systems 211, 221 for performing remote maintenance of the supplied devices. 231 and these comprise a maintenance database and an external network gateway as described above. The host management system 205 that manages each device in the user's manufacturing factory and the vendor management systems 211, 221, and 231 of each device are connected by the external network 200, which is the Internet or a dedicated line network. In this system, if a trouble occurs in any one of a series of production equipment on the production line, the operation of the production line is suspended, but remote maintenance via the Internet 200 is received from the vendor of the troubled equipment. Therefore, it is possible to respond quickly and to minimize downtime of the production line.
[0043]
Each manufacturing apparatus installed in the semiconductor manufacturing factory includes a display, a network interface, and a computer that executes network access software stored in a storage device and software for operating the apparatus. The storage device is a built-in memory, a hard disk, or a network file server. The network access software includes a dedicated or general-purpose web browser, and provides, for example, a user interface having a screen as shown in FIG. 7 on the display. The operator who manages the manufacturing apparatus in each factory refers to the screen, and the manufacturing apparatus model 401, serial number 402, trouble subject 403, occurrence date 404, urgency 405, symptom 406, countermeasure 407, progress 408, etc. Enter the information in the input field on the screen. The input information is transmitted to the maintenance database via the Internet, and appropriate maintenance information as a result is returned from the maintenance database and presented on the display. Further, the user interface provided by the web browser further realizes hyperlink functions 410 to 412 as shown in the figure, and the operator can access more detailed information on each item, or the latest software used for the manufacturing apparatus from the software library provided by the vendor. Version software can be pulled out, and operation guides (help information) for use by factory operators can be pulled out. Here, the maintenance information provided by the maintenance database includes the information related to the present invention described above, and the software library also provides the latest software for realizing the present invention.
[0044]
Next, a semiconductor device manufacturing process using the production system described above will be described. FIG. 8 shows the flow of the entire manufacturing process of the semiconductor device. In step 1 (circuit design), a semiconductor device circuit is designed. In step 2 (mask production), a mask on which the designed circuit pattern is formed is produced. On the other hand, in step 3 (wafer manufacture), a wafer is manufactured using a material such as silicon. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer. The next step 5 (assembly) is called a post-process, and is a process for forming a semiconductor chip using the wafer produced in step 4, and is an assembly process (dicing, bonding), packaging process (chip encapsulation), etc. Process. In step 6 (inspection), the semiconductor device manufactured in step 5 undergoes inspections such as an operation confirmation test and a durability test. Through these steps, the semiconductor device is completed and shipped (step 7). The pre-process and post-process are performed in separate dedicated factories, and maintenance is performed for each of these factories by the remote maintenance system described above. In addition, information for production management and apparatus maintenance is communicated between the pre-process factory and the post-process factory via the Internet or a dedicated network.
[0045]
FIG. 9 shows a detailed flow of the wafer process. In step 11 (oxidation), the wafer surface is oxidized. In step 12 (CVD), an insulating film is formed on the wafer surface. In step 13 (electrode formation), an electrode is formed on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. In step 15 (resist process), a photosensitive agent is applied to the wafer. In step 16 (exposure), the circuit pattern of the mask is printed onto the wafer by exposure using the exposure apparatus described above. In step 17 (development), the exposed wafer is developed. In step 18 (etching), portions other than the developed resist image are removed. In step 19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer. Since the manufacturing equipment used in each process is maintained by the remote maintenance system described above, it is possible to prevent troubles in advance and to recover quickly even if troubles occur. Productivity can be improved.
[0046]
【The invention's effect】
As described above, according to the present invention, by using an elastic body for the sealing member, even if there is a drive unit disposed on the illumination optical system and the projection optical system, the sealing is performed without transmitting vibrations. The reserved area can be secured.
[0047]
In the present invention, since the sealing member used for the connecting portion between adjacent housings is provided with a tubular light shielding member as a light shielding means, the sealing member can be prevented from being directly irradiated with laser light. Therefore, stable purge performance can be obtained.
[Brief description of the drawings]
FIG. 1 is a diagram for explaining a configuration of a projection exposure apparatus according to a first embodiment of the present invention.
FIG. 2 is a view for explaining that an illumination area on a mask of the exposure apparatus of the present invention is set by a variable blind.
FIG. 3 is a cross-sectional view for explaining an example in which a sealed structure using an elastic body according to a second embodiment of the present invention and a light shielding member for preventing exposure light from being directly irradiated to the elastic body are provided.
FIG. 4 is a cross-sectional view for explaining an example in which a sealing structure using an elastic body according to a third embodiment of the present invention and a light shielding member for preventing exposure light from being directly irradiated to the elastic body are provided.
FIG. 5 is a conceptual view of a semiconductor device production system using an apparatus according to the present invention as seen from a certain angle.
FIG. 6 is a conceptual diagram of a semiconductor device production system using the apparatus according to the present invention as seen from another angle.
FIG. 7 is a specific example of a user interface.
FIG. 8 is a diagram illustrating a flow of a device manufacturing process.
FIG. 9 is a diagram illustrating a wafer process.
[Explanation of symbols]
1: light source, 2: mount, 3: housing, 3a: mirror, 3b: molding optical system, 3c: mirror, 3d: optical integrator, 4: housing, 4a: secondary light source switching unit, 5: housing, 5a: condenser lens, 6: housing, 6a: variable blind, 7: housing, 7a: condenser lens, 7b: mirror, 7c: condenser lens, 8: mask, 8a: mask pattern, 8b: slit shape Luminous flux, 9: mask chuck, 10: mask stage, 11: projection optical system, 12: wafer, 13: wafer chuck, 14: wafer stage, 15: bar mirror, 16: laser interferometer, 17: support platen, 18: Support column, 19: damper, 20: lens barrel surface plate, 21: bar mirror, 22: laser interferometer, 23: damper, 24: stage surface plate, 25: laser interferometer, 26-30: sealing member (elastic body), 31: Scstage cover section, 32, 33: housing, 34: sealing member (elastic body), 35: light shielding member, 36, 37: housing, 38: sealing member (elastic body), 39, 40: light shielding member, 41 To 45: light shielding member,
101: Vendor's office, 102, 103, 104: Manufacturing factory, 105: Internet, 106: Manufacturing equipment, 107: Factory host management system, 108: Vendor side host management system, 109: Vendor side local area network (LAN), 110: operation terminal computer, 111: factory local area network (LAN), 200: external network, 201: manufacturing apparatus user manufacturing factory, 202: exposure apparatus, 203: resist processing apparatus, 204: film formation Processing apparatus, 205: Factory host management system, 206: Factory local area network (LAN), 210: Exposure apparatus manufacturer, 211: Host management system of the office of the exposure apparatus manufacturer, 220: Resist processing apparatus manufacturer, 221: Resist processing equipment manufacturer business Host management system, 230: film forming apparatus manufacturer, 231: host management system at the office of the film forming apparatus manufacturer, 401: type of manufacturing apparatus, 402: serial number, 403: subject of trouble, 404: date of occurrence, 405 : Urgency, 406: Symptom, 407: Countermeasure, 408: Progress, 410, 411, 412: Hyperlink function.

Claims (5)

Via the illumination optical system by exposure light from the light source illuminates the original, a pattern formed on the original plate there is provided an exposure apparatus for projection exposure onto a plate via a projection optical system, said from said light source a plurality of housing the light Gakumoto child was placed inside which is disposed on the optical path of the exposure light reaching the projection optical system, and an elastic body for sealing connecting between said plurality of housings, the elastic member An exposure apparatus comprising: a light shielding means for preventing exposure light from being irradiated.   The exposure apparatus according to claim 1, wherein a fluororesin is used as the elastic body.   The exposure apparatus according to claim 1, wherein the light shielding unit includes a light shielding member having one end fixed to one of adjacent housings and vibrationally insulated from the other housing.   The exposure apparatus according to claim 3, wherein a double sheath tube is used as the light shielding member. Exposing the substrate using the exposure apparatus according to any one of claims 1 to 3,
Developing the exposed substrate;
Forming a device from the developed substrate.

Images