JP4683752B2 - Ceramic substrate having dividing grooves - Google Patents

Description

【００４８】
この結果、本発明のセラミック基板１は、クラック発生率が１．０％と低く、また、セラミック基板１の変形度合いを示す直角度、直線度、平行度の平均値が０．０１以下とバラツキを小さくすることができ、優れていた。
【００４９】
【発明の効果】
以上のように、本発明によれば、内側に製品領域と、前記製品領域を囲んで配置されたダミー領域とを有するとともに、前記製品領域の表面に形成された複数の縦横の分割溝によって複数の製品部が区画されている分割溝を有するセラミック基板であって、前記ダミー領域は、前記製品領域側を囲んで配置された第１ダミー領域と、該第１ダミー領域の外側を囲んで配置された第２ダミー領域とからなり、前記第１ダミー領域の表面には縦横の分割溝を形成されており、かつ前第２ダミー領域の表面には、前記第１ダミー領域と前記第２ダミー領域とを区画する境界の延長線上で外辺に達する縦及び／又は横の切断溝を形成されているとともに、前記第１ダミー領域の表面に形成した縦横の分割溝間のピッチが、前記製品領域から前記第２ダミー領域に向かって順次広くなっていることによって、電極や抵抗体の実装時や印刷時あるいはセラミック基板の取り扱い時に荷重が加わったとしてもセラミック基板の割れを効果的に防止することができるとともに、各分割溝にはクラックがなく、かつ安定した寸法精度を有する製品を切り出すことができ、特に１．０ｍｍ×０．５ｍｍ以下の寸法を有する製品を多数切り出すことが可能な分割溝を有するセラミック基板を提供することができる。
【００５０】
なお、前記セラミック基板は、前記第２ダミー領域の表面に、外辺に未達の縦横の分割溝があっても構わない。
【００５１】
さらに、本発明は、前記製品領域における縦横の分割溝間のピッチ（Ｐ）が、前記第１ダミー領域の表面に形成した縦横の分割溝間のピッチ（Ｑ）に対し、１＜Ｑ／Ｐ＜４であるように構成したことによって、１．０ｍｍ×０．５ｍｍよりさらに小さな０．６ｍｍ×０．３ｍｍ以下の寸法を有する製品を多数切り出すことが可能な分割溝を有するセラミック基板を提供することができる。
【図面の簡単な説明】
【図１】本発明に係る分割溝を有するセラミック基板の一例を示す平面図である。
【図２】図１に示すセラミック基板の部分斜視図である。
【図３】セラミック基板の分割状態を示す模式図である。
【図４】グリーンシートに大きな体積を有するスリット刃を押し当てた時の状態を示す模式断面図である。
【図５】実験に使用する比較例としてのセラミック基板を示す平面図である。
【図６】（ａ）〜（d）は、実施にあたっての測定方法を説明するための模式図である。
【図７】従来の分割溝を有するセラミック基板を示す平面図である。
【図８】グリーンシートの製品領域とダミー領域とに密度差が発生した時の状態を示す模式断面図である。
【符号の説明】
１：セラミック基板
２：製品領域における横方向の分割溝
３：製品領域における横方向の分割溝
４：製品領域と第１ダミー領域を区画する横方向の分割溝
５：製品領域と第１ダミー領域を区画する縦方向の分割溝
６：製品部
７：第１ダミー領域における横方向の分割溝
８：第１ダミー領域における縦方向の分割溝
９：第１ダミー領域と第２ダミー領域を区画する横方向の切断溝
10：第１ダミー領域と第２ダミー領域を区画する縦方向の切断溝
11：ダミー部
Ｓ：製品領域
Ｔ：第１ダミー領域
Ｕ：第２ダミー領域
Ｒ：ダミー領域[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a ceramic substrate having divided grooves used when a large number of chip-shaped electronic components such as chip resistors are manufactured.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, chip resistors having electrodes and resistors on a small substrate made of ceramics have been widely used. For example, in a resistor mounted on a hybrid IC substrate (HIC substrate) or the like, an HIC substrate With the miniaturization of wiring and miniaturization of the HIC substrate, the dimensions are changed from 3.2 mm × 1.6 mm to 2.0 mm × 1.25 mm, 1.6 mm × 0.8 mm, 1.0 mm × 0.5 mm. It is downsized.
[0003]
And when manufacturing such chip-like electronic components such as resistors, as shown in FIG. 7, the plurality of vertical and horizontal dividing grooves 21 and 22 are provided on one side or both sides, and adjacent dividing grooves 21 and A ceramic substrate 20 having a dividing groove with a part defined by 22 as a product portion 23 is used.
[0004]
The ceramic substrate 20 having such dividing grooves is formed by forming a slurry containing a ceramic raw material into a green sheet by using a doctor blade method or the like, and then providing a gold plate having a plurality of slit blades on one or both sides of the green sheet. It is manufactured by pressing the mold to form vertical and horizontal divided grooves and punching it into the size of the ceramic substrate 20 with a die, followed by firing. When chip resistors are manufactured from this ceramic substrate 20, they are adjacent to each other. After printing and baking an electrode or a resistor on the part partitioned by the dividing grooves 21 and 22, the strip-shaped substrate is taken out by dividing along the dividing groove 21 on the primary side, and then the electrode is printed and printed on the divided end faces. Then, the chip resistor as a product is obtained by dividing along the dividing groove 22 on the secondary side. Which was. Note that other chip-shaped electronic components such as a chip capacitor and a chip inductor have also been manufactured using a ceramic substrate 20 having divided grooves as shown in FIG.
[0005]
However, when the end portions of the dividing grooves 21 and 22 reach the outermost side of the ceramic substrate 20 as in the ceramic substrate 20 shown in FIG. 7, due to the load applied at the time of mounting and printing the electrodes and resistors. Even if the split grooves 21 and 22 are cracked and cracked before splitting, or even when the ceramic substrate 20 is struck or bent during handling, the split grooves 21 and 22 are cracked and before splitting. There was a problem such as cracking.
[0006]
Therefore, as a solution to such a problem, Japanese Patent Application Laid-Open No. 10-264130 provides a dummy region in which vertical and horizontal dividing grooves formed in the product region are extended outside the product region, A ceramic substrate in which the depth of the dividing groove in the dummy region is shallower than the dividing groove in the product region is disclosed, and Japanese Patent Application Laid-Open No. 9-11221 discloses a ceramic substrate formed in the product region outside the product region. A ceramic substrate is disclosed in which a dummy region is provided in which vertical and horizontal dividing grooves are extended, and an end portion of the dividing groove in the dummy region does not reach the outermost side of the ceramic substrate.
[0007]
Each of these ceramic substrates has a dummy area, and since the strength of this dummy area is high, cracking of the ceramic substrate is prevented even when a load is applied when mounting electrodes, resistors, printing, or handling the ceramic substrate. There was an advantage of being able to.
[0008]
[Problems to be solved by the invention]
However, with the recent progress of miniaturization of chip-shaped electronic components, there is a demand for one having a size of 1.0 mm × 0.5 mm or less, for example, one having an extremely small size of 0.6 mm × 0.3 mm is required. However, when manufacturing a product having a size of 1.0 mm × 0.5 mm or less, the ceramic substrate disclosed in Japanese Patent Application Laid-Open No. 10-264130 or the method disclosed in Japanese Patent Application Laid-Open No. 9-11221 is disclosed. A ceramic substrate could not be used.
[0009]
That is, when the product dimension is 1.0 mm × 0.5 mm or less and the pitch P between the divided grooves is narrow, as shown in FIG. 8, when the divided grooves are formed by the slit blade, the compressive stress applied to the product region is a dummy. Since the green sheet density difference between the product region and the dummy region is larger than that in the region, the cracks are generated in the dividing grooves that divide the product region and the dummy region.
[0010]
Further, as in the ceramic substrate disclosed in Japanese Patent Application Laid-Open No. 9-11221, if the dummy region is too wide for the product area defined by the vertical and horizontal dividing grooves in the product region, the green sheet is fired. In addition, there is a problem that a shrinkage difference occurs between the product region and the dummy region, and the ceramic substrate is deformed.
[0011]
[Means for Solving the Problems]
Therefore, a ceramic substrate having a splitting groove of the present invention has been made in view of the above problems, and product area inside, which has a dummy region disposed surrounding the product region, a plurality of which are formed on the surface of the product region met ceramic substrate having a splitting groove in which a plurality of product portions by vertical and horizontal dividing grooves are partitioned, before Symbol dummy region includes a first dummy area that is disposed to surround the front SL product region side, said first It consists of a second dummy area that is disposed to surround the outer dummy region, in the prior SL on the surface of the first dummy region is formed dividing grooves aspect, and before Symbol surface of the second dummy region, together they are formed the longitudinal and / or transverse cutting grooves reaching to the outer sides in the extension of the boundary that divides the second dummy area and the first dummy area, formed on the surface of the first dummy area vertically and horizontally Between the split grooves Ji, characterized in that the are from the product area is successively wider toward the second dummy area.
[0012]
Further, a ceramic substrate having a splitting groove of the present invention, prior Symbol surface of the second dummy area, characterized in that it is formed dividing grooves of unreached aspect the perimeter.
[0013]
Furthermore, a ceramic substrate having a splitting groove of the present invention, prior Symbol pitch between vertical and horizontal dividing grooves in the product region (P) is, pitch between the first aspect formed on the surface of the dummy region dividing groove (Q) to, wherein the Ru 1 <Q / P <4 der.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below.
[0015]
FIG. 1 is a plan view showing an example of a ceramic substrate having divided grooves according to the present invention.
[0016]
The ceramic substrate 1 is formed of a plate-like body having a substantially rectangular planar shape, and has a product region S defined by a horizontal dividing groove 4 and a vertical dividing groove 5 on the inside thereof. In the region S, a plurality of vertical and horizontal dividing grooves 2 and 3 are formed. The product portion 6 partitioned by the adjacent dividing grooves 2 and 3 in the product region S has a rectangular planar shape, the pitch P2 between the vertical dividing grooves 3 and the pitch between the horizontal dividing grooves 2. P1 is configured to have the same pitch.
[0017]
In addition, a dummy region R is surrounded by the product region S. The dummy region R includes a first dummy region T near the product region and a second dummy region U outside the first dummy region T. The product region S and the first dummy region T are partitioned by the dividing grooves 4 and 5, and the first dummy region T and the second dummy region U are partitioned by the cutting grooves 9 and 10, and the first dummy end of the longitudinal cutting groove 10 partitioning the region T and the second dummy region U only adapted to reach the outermost sides of the ceramic substrate 1.
[0018]
Further, the first dummy region T has a plurality of vertical and horizontal dividing grooves 7, 8, and the end portions of the dividing grooves 7, 8 are cutting grooves 9 that partition the first dummy region T and the second dummy region U, It is configured to reach 10.
[0019]
Further, the pitches Q4 and Q5 between the vertical division grooves 8 in the first dummy region T are larger than the pitch P2 between the vertical division grooves 3 in the product region S, and sequentially from the product region side toward the outside. In FIG. 1, Q4 <Q5 so that it is widened in two stages, and the pitches Q1 to Q3 between the lateral division grooves 7 in the first dummy region T are as follows: It is configured to be larger than the pitch P1 between the lateral dividing grooves 2 in the product region S and gradually increase from the product region side toward the outside, and in FIG. 1, three stages such as Q1 <Q2 <Q3 are established. It is designed to be wide. In the present invention, the term “sequentially widen” means that gradually widens or gradually widens.
[0020]
Further, the sectional shapes of the dividing grooves 2 to 5, 7, 8 and the cutting grooves 9, 10 formed in the ceramic substrate 1 are V-shaped.
[0021]
For example, in order to take out the chip resistor using the ceramic substrate 1, after printing and baking electrodes and resistors on the product portion 6 in the product region S of the ceramic substrate 1, the first dummy region T and the second dummy A vertical cutting groove 10 that divides the region U is removed by removing the vertical second dummy region U2, and a horizontal cutting groove 9 that divides the first dummy region T and the second dummy region U is divided by For example, as shown in FIG. 3, after removing the second dummy area U1 and further removing the horizontal first dummy portion T1 along the horizontal dividing groove 4 that partitions the product area S and the first dummy area T. The strip-shaped substrate is taken out by being conveyed between the small rollers and being divided along the horizontal dividing grooves 2 and 7. At this time, the ceramic substrate 1 may be sent so that the horizontal dividing grooves 2 and 7 are positioned perpendicular to the conveying direction.
[0022]
Next, after printing and printing an electrode on the divided end face in the product region S of the obtained strip-shaped substrate, again so that the vertical divided grooves 3 and 8 of the strip-shaped substrate are perpendicular to the transport direction, A chip resistor can be manufactured by conveying between the rollers of FIG. 3 and dividing along the longitudinal dividing grooves 3 and 8.
[0023]
And according to the ceramic substrate 1 of this invention, it has the dummy area | region R surrounding the outer side of the product area | region S, and the edge part reached even the outermost side in the 2nd dummy area | region U in the outermost part. Since there is no dividing groove, the ceramic substrate has higher strength than the product region S and the first dummy region T, and even if a load is applied during mounting of electrodes or resistors, printing, or handling of the ceramic substrate 1 1 cracks can be effectively prevented.
[0024]
FIG. 1 shows an example in which only the end of the longitudinal cutting groove 10 that divides the first dummy region T and the second dummy region U reaches the outermost side. may be allowed to reach up to the lateral ends only the outermost sides of the cutting groove 9 partitioning the region T and the second dummy region U, even more compartments and first dummy area T and a second dummy region U The ends of both the vertical and horizontal cutting grooves 9 and 10 may reach the outermost sides. However, if the end portions of the cutting grooves 9 and 10 reach the outermost side, cracks are likely to occur in the ceramic substrate 1 starting from that portion, so that the first dummy region T can be easily divided. It is preferable that only the end portions of either the vertical or horizontal cutting grooves 9 and 10 reach the outermost side.
[0025]
Furthermore, according to the ceramic substrate 1 of the present invention, the first dummy region T is provided between the product region S and the second dummy region U, and a plurality of the first dummy regions T are provided on both sides like the product region S. Since the vertical and horizontal dividing grooves 7 and 8 are formed, when the dividing grooves 2 to 5 and 7 and the cutting grooves 9 and 10 are formed by the slit blade, the compressive stress applied to the product region S and the first dummy Since the compressive stress applied to the region T can be approximated and the density difference between the product region S and the first dummy region T in the green sheet can be reduced, the product part 6 in the center of the product region S and the outer peripheral part of the product region S Variation in the size of the product portion 6 can be suppressed, and cracks can be prevented from occurring in the divided grooves 4 and 5 that partition the product region S and the first dummy region T.
[0026]
Therefore, it is possible to provide the ceramic substrate 1 having a dividing groove from which a product with stable dimensional accuracy can be taken out.
[0027]
As described above, the dividing grooves 7 and 8 formed in the first dummy region T have the pitches Q4 and Q5 between the vertical dividing grooves 8 in the first dummy region T and the vertical divisions in the product region S. The pitch Q1 is larger than the pitch P2 between the grooves 2 and widens gradually or stepwise from the product region side toward the outside, and the pitch Q1, between the lateral division grooves 7 in the first dummy region T is set. Q2 and Q3 are preferably configured to be larger than the pitch P1 between the lateral division grooves 7 in the product region S and gradually or stepwise from the product region side toward the outside.
[0028]
Because the pitches Q1 to Q5 between the dividing grooves 7 and 8 in the first dummy region T are the same as or slightly larger than the pitches P1 and P2 between the dividing grooves 2 and 3 in the product region S, it is divided by the slit blade. When forming the grooves 2 to 5, 7, 8 and the cutting grooves 9, 10, a large density difference occurs between the first dummy region T and the second dummy region U of the green sheet, Since there is a risk that cracks may occur in the cutting grooves 9 and 10 that define the second dummy region U, the pitches Q4 and Q5 between the vertical division grooves 8 in the first dummy region T are set vertically from the product region side. The first dummy region T is configured so as to be gradually or gradually widened toward the second dummy region U2, and the pitches Q1 to Q3 between the horizontal dividing grooves 7 in the first dummy region T are set to the second horizontal region from the product region side. Towards the dummy area U1 By being configured to be gradually or stepwise widened, it is possible to suppress dimensional variations that occur in the product region S when the divided grooves 2 to 5, 7, 8 and the cutting grooves 9, 10 are formed by the slit blade, It is possible to prevent cracks from occurring in the dividing grooves 4 and 5 that partition the product region S and the first dummy region T and in the cutting grooves 9 and 10 that partition the first dummy region T and the second dummy region U. it can.
[0029]
However, in order to achieve such an effect, the ratio of the pitches Q4 and Q5 between the vertical division grooves 8 in the first dummy region T to the pitch P2 between the vertical division grooves 3 in the product region S (Q4 and Q4). Q5 / P2) is 1 <Q4, Q5 / P2 <4, and the pitch Q1 between the horizontal dividing grooves 7 in the first dummy region T with respect to the pitch P1 between the horizontal dividing grooves 2 in the product region S. The ratio of Q3 (Q1 to Q3 / P1) is preferably 1 <Q1 to Q3 / P1 <4.
[0030]
That is, the ratio of the pitches Q4 and Q5 between the vertical dividing grooves 8 in the first dummy region T to the pitch P2 between the vertical dividing grooves 3 in the product region S is smaller than 1 and / or the horizontal in the product region S. When the ratio of the pitches Q1 to Q3 between the lateral dividing grooves 7 in the first dummy region T to the pitch P1 between the dividing grooves 2 in the direction is smaller than 1, the ceramic substrate 1 is divided into the dividing grooves 2 to 5, 7, 8 and This is because the product portion 6 and the dummy portion 11 cannot be distinguished from each other when divided along the cutting grooves 9 and 10, and conversely, the first dummy region T with respect to the pitch P 2 between the vertical division grooves 3 in the product region S. The ratio of the pitches Q4 and Q5 between the vertical dividing grooves 8 in the horizontal direction is 4 or more and / or the horizontal dividing grooves 7 in the first dummy region T with respect to the pitch P1 between the horizontal dividing grooves 2 in the product region S of When the ratio of the grooves Q1 to Q3 is 4 or more, when the divided grooves 2 to 5, 7, and 8 and the cutting grooves 9 and 10 are formed by the slit blade, the green sheet product area S and the first dummy area T This is because the density difference becomes too large, and cracks are generated in the divided grooves 4 and 5 that partition the product region S and the first dummy region T.
[0031]
In FIG. 1, the pitches Q4 and Q5 between the vertical division grooves 8 in the first dummy region T are widened in two steps, and the pitches Q1 to Q1 between the horizontal division grooves 7 in the first dummy region T are widened. Although an example is shown in which Q3 is widened in three stages, the degree to which the pitches Q1 to Q5 between the dividing grooves 7 and 8 are widened depends on the distance from the product region S to the second dummy region U. What is necessary is just to select suitably.
[0032]
By the way, the ceramic substrate 1 of FIG. 1 is formed with the above-described divided grooves 2 to 5 and 7 and the cutting grooves 9 and 10 on both sides as shown in a partial perspective view of FIG. The total depth of the horizontal dividing grooves 2, 4, 7 and the cutting groove 9 on the side and the horizontal dividing grooves 2, 4, 7 and the cutting groove 9 on the back surface side is the vertical dividing grooves 3, 5 on the printing surface side. , 8 and the cutting groove 10 and the vertical dividing grooves 3, 5, 8 and the cutting groove 10 on the back side thereof are formed deeper than the total depth. This is because the primary division is performed, and when dividing along the horizontal division grooves 2, 4, 7 and the cutting groove 9, if there is no strength in the vertical division groove portion, the longitudinal direction is caused by the load acting on the primary division. This is because the split grooves 3, 5 and 8 and the cut groove 10 are also cracked.
[0033]
In addition, about the depth of the dividing grooves 2-5,7,8 and the cutting grooves 9,10 on the printing surface side and the back surface side, the dividing grooves 2-5,7,8 on the printing surface side to which a pressing force is applied at the time of dividing and The depth of the cut grooves 9 and 10 is increased, and the depth of the split grooves 2 to 5, 7 and 8 and the cut grooves 9 and 10 on the back side is such that the breaking direction at the time of division is perpendicular to the thickness direction of the substrate 1. In order to do so, it is sufficient if it is deep enough to guide the division direction. Therefore, the vertical and horizontal dividing grooves 2 to 5 and 7 and the cutting grooves 9 and 10 on the printing surface side are both formed deeper than the dividing grooves 2 to 5 and 7 and the cutting grooves 9 and 10 on the back side. It is preferable to keep it.
[0034]
Further, the opening angles θ1 and θ2 of the vertical and horizontal dividing grooves 2 to 5 and 7 and the cutting grooves 9 and 10 are the same as the vertical and horizontal dividing grooves 2 to 5 and 7 and the cutting grooves 9 and 10 on the printing surface side. 25 ± 10 °, and the vertical and horizontal dividing grooves 2 to 5, 7, and 8 and the cutting grooves 9 and 10 on the back side are preferably 40 ± 5 °.
[0035]
Here, the opening angle θ1 of the dividing grooves 2 to 5, 7, 8 and the cutting grooves 9, 10 on the printing surface side is defined as the opening angle θ2 of the dividing grooves 2 to 5, 7, 8 and the cutting grooves 9, 10 on the back surface side. As shown in FIG. 4, when the slit blade A is pressed against the green sheet, when the volume of the slit blade A pushed into the green sheet is large, the raised portion D is formed at the periphery of the dividing groove of the green sheet. This is because the electrodes and resistors cannot be printed with high accuracy in the subsequent process, and cracks are likely to occur in the green sheet from the tip of the V-shaped dividing groove. The opening angle θ2 of 5, 7 and 8 and the cutting grooves 9 and 10 is made wider than the opening angle θ1 of the dividing grooves 2 to 5 and 7 and 8 and the cutting grooves 9 and 10 on the printing surface side. When manufacturing with high productivity, the slit blade This is to ensure a degree.
[0036]
On the other hand, as a ceramic for forming such a ceramic substrate 1, an alumina sintered body having an Al2O3 content of 93.0 to 99.6% by weight is used as a seed. Various ceramics such as a sintered body, a mullite sintered body, a forsterite sintered body, a steatite sintered body, a glass ceramic, and the like can be used. A slurry is prepared by kneading various ceramic raw materials with a solvent, an organic binder, etc., and after producing a green sheet by a tape forming method such as a doctor blade method, the green sheet is shown on both sides or one side as shown in FIG. A die provided with a slit blade corresponding to the dividing grooves 2 to 5, 7, 8 and the cutting grooves 9, 10 of the ceramic substrate 1 is pressed to a predetermined depth, and the dividing grooves 2 to 2 are pressed. After forming the 7,8 and cutting grooves 9 and 10, it is kill obtained by firing various ceramic raw material at a temperature which can be sintered.
[0037]
Although the embodiment of the present invention has been described above, the present invention is not limited to the above-described embodiment, and may be improved or changed without departing from the gist of the present invention. Nor.
[0038]
【Example】
Here, an experiment was conducted to examine the presence or absence of cracks and dimensional accuracy when the ceramic substrate 1 of the present invention shown in FIG. 1 and the ceramic substrate 15 as a comparative example shown in FIG.
[0039]
In the experiment, each of the ceramic substrates 1 and 15 is formed of an alumina sintered body having an Al 2 O 3 content of 96.0% by weight, a plate shape having an outer side dimension of 60.0 mm × 49.5 mm and a thickness of 0.2 mm. The body. The product size in the product region S was 0.58 mm × 0.29 mm, and the number of products in the product region was 3500.
[0040]
The ceramic substrate 1 of the present invention has a structure in which a first dummy region T having vertical and horizontal dividing grooves 7 and 8 on the outside of the product region S and a second dummy region U on the outside thereof are provided. The ceramic substrate of the comparative example has a structure having dummy regions W that do not have dividing grooves on the outside of the product region S, and 20 substrates are manufactured.
[0041]
In the ceramic substrate 1 of the present invention, the pitch between the divided grooves 7 and 8 in the first dummy region T is 0.37 mm for Q1, 0.50 mm for Q2, 1.00 mm for Q3, and 0.90 mm for Q4. , Q5 was set to 1.25 mm.
[0042]
Then, the obtained 20 ceramic substrates 1 of the present invention and the 20 ceramic substrates 15 of the comparative examples were subjected to appearance inspection, cracked ones were cracked, and the ratio to the total number of cracks was the crack generation ratio. In addition, in measuring the dimensional accuracy, squareness, parallelism, and linearity were measured, respectively.
[0043]
The results are as shown in Table 1.
[0044]
For example, as shown in FIG. 6A, when measuring the perpendicularity at the corner portion C1 of the ceramic substrates 1 and 15, as shown in FIG. 6B, the perpendicularity is measured. The maximum width B between the imaginary line and the short side drawn perpendicularly from the end of the long side was taken as the square, and the squareness of the other corners C2 to C4 was measured in the same manner.
[0045]
In measuring the parallelism, as shown in FIG. 6C, the width of the second horizontal dummy area U1 in the upper part of the ceramic substrates 1 and 15 is W1, and the second horizontal dummy area U1 in the lower part is in the lower part. Is W2, the width of the vertical second dummy region U2 on the left is L1, and the width of the vertical second dummy region U2 on the right is L2, the parallelism L is L = ( W1−W2), and the parallelism W was calculated by W = (L1−L2).
[0046]
For the measurement of the linearity, for example, as shown in FIG. 6 (d), a virtual line that linearly connects the dividing grooves 4 and 5 partitioning the product region S of the ceramic substrate and the intersection is drawn, and the virtual line is divided. The maximum width C between the grooves 4 and 5 was defined as linearity.
[0047]
[Table 1]

[0048]
As a result, the ceramic substrate 1 of the present invention has a low crack occurrence rate of 1.0%, and the average value of the squareness, linearity, and parallelism indicating the degree of deformation of the ceramic substrate 1 varies as 0.01 or less. Can be reduced and was excellent.
[0049]
【The invention's effect】
As described above, according to the present invention, a plurality and product areas inside, by the conjunction and a dummy area disposed to surround the product region, the product region dividing groove of a plurality of vertical and horizontal formed on the surface of met ceramic substrate having a splitting groove products of are partitioned, before Symbol dummy region, surrounded a first dummy area that is disposed to surround the front SL product region side, the outer side of the first dummy area in it and a deployed second dummy area, before SL on the surface of the first dummy region is formed dividing grooves aspect, and on the surface before the second dummy region, wherein the first dummy area A vertical and / or horizontal cutting groove reaching the outer side is formed on an extended line of a boundary partitioning the second dummy area, and a pitch between vertical and horizontal dividing grooves formed on the surface of the first dummy area is , From the product area to the second da By that is successively wider towards the chromatography region, it is possible to prevent cracking of the ceramic substrate effectively even load is applied at the electrode and resistor of the mounting or during printing or when the ceramic substrate handling, Each divided groove has no cracks and can cut out a product having stable dimensional accuracy, and in particular, a ceramic substrate having a divided groove capable of cutting out a large number of products having a size of 1.0 mm × 0.5 mm or less. Can be provided.
[0050]
Incidentally, before Symbol ceramic substrate, before Symbol surface of the second dummy area, there may be a division groove in the unreached aspect the perimeter.
[0051]
Furthermore, the present invention is, before Symbol pitch between vertical and horizontal dividing grooves in the product region (P) is, over the previous SL pitch between the divided grooves aspect formed on the surface of the first dummy area (Q), 1 <Q by thus constructed is / P <4, a ceramic substrate having a splitting groove capable of cutting a large number of products having the following dimensions smaller 0.6 mm × 0.3 mm than 1.0 mm × 0.5 mm Can be provided.
[Brief description of the drawings]
FIG. 1 is a plan view showing an example of a ceramic substrate having divided grooves according to the present invention.
FIG. 2 is a partial perspective view of the ceramic substrate shown in FIG.
FIG. 3 is a schematic diagram showing a divided state of a ceramic substrate.
FIG. 4 is a schematic cross-sectional view showing a state when a slit blade having a large volume is pressed against a green sheet.
FIG. 5 is a plan view showing a ceramic substrate as a comparative example used in the experiment.
FIGS. 6A to 6D are schematic views for explaining a measurement method in carrying out. FIG.
FIG. 7 is a plan view showing a ceramic substrate having a conventional dividing groove.
FIG. 8 is a schematic cross-sectional view showing a state when a density difference occurs between a product area and a dummy area of a green sheet.
[Explanation of symbols]
1: Ceramic substrate 2: Horizontal dividing groove 3 in the product area 3: Horizontal dividing groove 4 in the product area 4: Horizontal dividing groove dividing the product area and the first dummy area 5: Product area and the first dummy area Vertical dividing groove 6: product part 7: horizontal dividing groove 8 in the first dummy area 8: vertical dividing groove 9 in the first dummy area 9: dividing the first dummy area and the second dummy area Horizontal cutting groove
10: Longitudinal cutting groove that divides the first dummy area and the second dummy area
11: Dummy part S: Product area T: First dummy area U: Second dummy area R: Dummy area

Claims (3)

And product area inside, which has a dummy region disposed surrounding the product area, the dividing groove in which a plurality of product portions by a plurality of vertical and horizontal dividing grooves formed on the surface of the product region is partitioned The dummy substrate includes a first dummy region disposed so as to surround the product region side , and a second dummy region disposed so as to surround the outside of the first dummy region, the surface of the first dummy region and dividing grooves of the vertical and horizontal are formed, and on the surface of the second dummy area, outside in the extension of the boundary partitioning the said first dummy region and the second dummy region The vertical and / or horizontal cutting grooves reaching the sides are formed, and the pitch between the vertical and horizontal division grooves formed on the surface of the first dummy region is sequentially increased from the product region toward the second dummy region. Wide A ceramic substrate having a splitting groove, characterized in that is.   2. The ceramic substrate having divided grooves according to claim 1, wherein vertical and horizontal divided grooves that do not reach the outer side are formed on a surface of the second dummy region. Wherein the pitch between vertical and horizontal dividing grooves in the product region (P) is, with respect to pitch (Q) between vertical and horizontal dividing grooves in the first dummy region, which is a 1 <Q / P <4 The ceramic substrate which has the division | segmentation groove | channel of Claim 1 or Claim 2.

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