JP4693582B2 - Wafer storage paper container - Google Patents

Description

  The present invention relates to a wafer storage container that protects contents from damage or damage due to an impact received during transportation or the like.

  As semiconductor integrated circuits (ICs) become smaller and more highly integrated, the circuit line width (process rule) becomes smaller, and even a slight amount of dust (contamination, contamination) may not adhere to the silicon wafer substrate. It has been demanded. Also, not only dust but also surface damage / breakage or electrification can cause non-standard products that cannot be used in manufacturing, reducing yield, preventing dust generation, breakage, and electrification, and wafer quality. Careful attention has been paid to the storage so as not to damage it.

  At present, most of the wafer storage containers that are generally used are made of plastic. In order to prevent generation of dust from the container itself, hard plastic is used as the material, and the inner surface is sufficiently smoothed. In addition, in order to prevent dust from entering from the outside, the opening is subjected to high-precision fitting processing, and a high-performance sealing material is used. The wafer is securely fixed in the container by the holding member. However, since the fixing is reliable, the wafer is weak against impact, and during transportation, the container is further accommodated in another box made of cushioning material (mainly cardboard material). Transported. Although the container is made to be reusable as a container several times, it is basically regarded as a consumable item because it takes time and cost for processes such as cleaning. Used containers are picked up by recyclers and recycled into other plastic products.

  Patent Document 1 describes a plastic wafer storage container. However, in the present invention, it is proposed that a sealed container containing a wafer is filled with a liquid to improve impact resistance and prevent electrification. ing.

  Patent Document 2 also relates to a plastic wafer storage container, but in the invention, focusing on the material of the container main body, pre-foamed particles of thermoplastic polyester resin are molded in-mold to lower the degree of wear. It has been proposed to prevent dust generation caused by the wafer rubbing against the container body due to an impact during movement or the like.

  Despite being stored with such care, some wafers are ineligible as materials for IC substrates due to adhesion of dust or damage to the surface. Such wafers can be used as materials for different products such as solar cells and resistors whose internal characteristics are important even if they are not suitable for IC substrates whose surfaces are processed. It is sent to a separate process along with non-qualified products produced in the manufacturing process. In this case, the wafer quality is not required to be as accurate as required for semiconductor manufacturing, and for example, some dust is allowed to adhere.

  Conventionally, containers such as those described above have been used to store such nonstandard wafers. However, it is necessary to say that the packaging of the container is excessive compared to the accuracy required for the wafer as the contents, and the cost is low. It is expensive, bulky, and not easy to recycle, so it is very uneconomical as a container for storing nonstandard wafers.

Japanese Unexamined Patent Publication No. 08-148550 Japanese Patent Laid-Open No. 2001-010693

  The problem to be solved by the present invention is to provide a wafer storage container that is low in cost, is not bulky, can be easily recycled, and can protect the contents (wafers) from damage or damage caused by impact during transportation. That is.

The present invention, which has been made to solve the above-mentioned problems, is a container for storing non-standard wafers, and grips one by one a cardboard box and wafers made of hard paper and arranged in parallel with each other. A wafer storage paper container comprising: a plate-shaped wafer gripping portion; and a wafer fixing portion that is formed of a corrugated cardboard assembly and fixes the wafer gripping portion in a box.

In the wafer storage paper container of the present invention, the material of the box covering the outermost side is made of corrugated cardboard, so that fine impacts from the outside that are received during transportation and the like are almost absorbed by the box. When a large impact is applied from the outside, the wafer fixing portion made of the corrugated cardboard assembly absorbs the impact and protects the wafer of contents from breakage / damage.

In wafer storage sheet made container according to the present invention, has a cardboard of the box, with those made of hard paper to U Fine gripper, by using those made from the assembly of cardboard wafer fixing unit, the container All can be made of paper. By doing so, recycling after use becomes easy, and a packaging container useful from the viewpoint of resource recycling can be obtained.

  In this case, it is desirable that the hard paper used for the wafer gripping part has a thickness of 0.6 to 1.0 mm.

  The wafer gripping part has a V-shaped concave part with an acute angle at the part that grips the wafer. Although the optimum depth and pitch of the V-shaped recesses differ depending on the size and weight of the wafer to be accommodated, the angle of the tip is preferably 20 to 60 degrees. In this way, compared to the case where the obtuse angle V-shape or the U-shape is used to hold the entire end surface of the wafer, the rigidity of the wafer grip (when the wafer moves by a unit length in the in-plane direction) Reaction force) is weakened, and the ability to protect the wafer against external impact is enhanced.

  On the other hand, by providing the portion of the plate-like wafer gripping part that grips the wafer toward the center of the wafer, it is possible to prevent excessive flexibility of wafer holding. That is, when the plate-shaped wafer gripping part is not directed to the center of the wafer, when the wafer is about to move in the in-plane direction, the wafer gripping part itself has a large deflection, and the wafer moves excessively and the gripping part May come off.

  By adopting the configuration as described above, a further outer box for accommodating the container, which has been conventionally required for improving the impact resistance, is unnecessary in the present invention. Therefore, it is possible to reduce the space necessary for loading a large number of wafers, and at the same time, the loading weight is reduced as a whole, so that a reduction in transportation cost can be expected.

  Hereinafter, an embodiment of a wafer storage paper container of the present invention will be described with reference to the drawings.

  FIG. 1 is a perspective view showing a use state of the present embodiment. This embodiment is a container for storing a 4-inch (diameter of about 10 cm) silicon wafer. The container 10 is made of corrugated cardboard, the gripper assembly 11 has a plate-shaped wafer gripper 11a, and the gripper assembly. The wafer holding unit 12 is configured to fix the three-dimensional body 11 in the box 10, and the wafer holding unit 11a holds the wafers 13 arranged in parallel to each other one by one. In this drawing, a state in which a cardboard shock absorbing plate 14 is inserted between both ends of the gripper assembly 11 and the box 10 is shown. FIG. 2A shows a longitudinal sectional view, and FIG. 2B shows a transverse sectional view.

  FIG. 3 shows a development view of the box 10 of the present embodiment. The box 10 is the same as a normal cardboard box.

FIG. 4 is a development view of the gripping part assembly 11 having the wafer gripping part 11a of this embodiment. In this embodiment, the gripping part assembly 11 is made of card paper having a basis weight of 600 g / m ² (thickness 780 ± 20 μm), and has a back part 11b and wafer gripping parts 11a provided on both sides thereof. The wafer gripping portion 11a is provided with a large number of acute-angled V-shaped concave portions at regular intervals, and the tip angle is about 29 degrees. The gripper assembly 11 having a U-shape formed by bending the wafer gripping portions 11a on both sides in the same direction with respect to the back portion 11b is fixed to the wafer fixing portion 12 by a method described later. By doing so, two wafer gripping portions 11a can be formed simultaneously.

  The wafer fixing portion 12 of this embodiment is formed of a corrugated board assembly. FIG. 5 shows a development view thereof. Arrows 12a and 12b on the drawing are for indicating the orientation of the surface of the wafer to be accommodated, and are actually indicated by the sewing blade (12a) and the punch (12b). Further, a scale 12c is provided for every five wafers by cutting with a Thomson blade at the time of die cutting, and the number of stored wafers 13 can be easily confirmed.

  From the unfolded state of FIG. 5, the left and right tabs 12d and 12e are bent to the back side in FIG. 5, and the upper and lower tabs 12f and 12g are also bent to the back side. The upper and lower tab cuts 12h and 12i and the left and right tab cuts 12j and 12k are engaged with each other and fixed, whereby the wafer fixing portion 12 is completed.

  The plurality of cuts 12l and 12m provided around the left and right tabs 12d and 12e are inserted into the cuts 11c and 11d (FIG. 4) on the back of the folded gripper assembly 11, thereby It is for fixing to a letter shape. By making the direction of the cuts 12l and 12m pass through the center of the wafer 13, the wafer gripping portion 11a can be fixed toward the center of the wafer 13 as shown in FIG.

  A reverse insertion preventing claw 12n and a hole 12o are provided in the center of the upper and lower tabs 12f and 12g, respectively. At the time of storage, the claw 12n is inserted into the hole 12o and fixed. Further, when the upper and lower wafer fixing portions 12 are set in the box body 10 in the wrong direction, the claws 12n collide with each other and the box body 10 cannot be covered, so that a setting error can be prevented. .

  As shown in FIG. 1, a buffer plate 14 made of corrugated cardboard is inserted between both ends of the stored wafer gripping portion 11 and the box body 10, so that the gripping portion assembly 11 holding the wafer is seen from both sides. By sandwiching and holding by 14, it is possible to further improve impact resistance while ensuring ease of recycling.

  In this embodiment, as shown in FIG. 2 (a), the upper and lower two wafer fixing portions 12 are respectively provided with one and two holding portions, a total of three holding portion assemblies 11 (wafer holding portions 11a are six locations). However, when a larger wafer, for example, an 8-inch wafer is stored, as shown in FIG. A solid 21 may be provided. In this case, the angle of the tip of the V-shaped recess is preferably about 26 degrees. In this manner, the wafer can be more stably fixed by changing the number and shape of the gripper assembly 11 (wafer gripper 11a) according to the size and weight of the wafer to be accommodated.

  In still another embodiment, a buffer material other than paper may be used for the wafer fixing unit 12. For example, a bulk material such as urethane or polystyrene foam can be used.

1 is a perspective view of an embodiment of a wafer storage paper container according to the present invention. 1 is a longitudinal sectional view (a) and a transverse sectional view (b) of an embodiment of a wafer storage paper container according to the present invention. 1 is a development view of a box of an embodiment of a wafer storage paper container according to the present invention. 1 is an exploded view of a gripper assembly of an embodiment of a wafer storage paper container according to the present invention. FIG. 3 is a development view of a wafer fixing portion of an embodiment of a wafer storage paper container according to the present invention. Longitudinal sectional view (a), transverse sectional view (b) of another embodiment of the wafer storage paper container according to the present invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 10, 20 ... Box 11, 21 ... Holding part assembly 11a ... Wafer holding part 11b ... Back part 11c, 11d ... Back notch 12, 22 ... Wafer fixing part 12a, 12b ... Arrow display 12c ... Scale 12d, 12e ... Left and right Tabs 12f, 12g ... Upper and lower tabs 12h, 12i ... Upper and lower tab cuts 12j, 12k ... Left and right tab cuts 12l, 12m ... Holding cuts 12n ... Reverse insertion preventing claws 12o ... Hole 13, 23 ... Silicon wafer 14 ... Buffer Board

Claims (3)

A container for storing non-standard wafers, comprising a corrugated box, a plate-shaped wafer gripper for holding wafers made of hard paper and arranged parallel to each other, and a corrugated cardboard assembly. A wafer storage paper container, comprising: a wafer fixing part for fixing the wafer gripping part in the box. 2. The wafer storage paper container according to claim 1, wherein a portion of the wafer gripping portion for gripping the wafer has an acute-angled V-shaped concave portion. 3. A wafer storage paper container according to claim 1, wherein a portion of the wafer gripping portion for gripping the wafer is provided toward the center of the wafer.

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