JP4695286B2

JP4695286B2 - Embedding apparatus and temperature control method thereof

Info

Publication number: JP4695286B2
Application number: JP2001121919A
Authority: JP
Inventors: 俊幸藤牧; 正則山辺; 雄司北澤; 茂雄関
Original assignee: Sakura Seiki Co Ltd
Current assignee: Sakura Seiki Co Ltd
Priority date: 2001-04-20
Filing date: 2001-04-20
Publication date: 2011-06-08
Anticipated expiration: 2021-04-20
Also published as: JP2002318177A

Description

【０００１】
【発明の属する技術分野】
本発明は包埋装置及びその温度制御方法に関し、更に詳細には組織片等の試料を、所定の融点を有するパラフィン等の包埋材中に埋め込む包埋装置及びその温度制御方法に関する。
【０００２】
【従来の技術】
人体等から採取した組織片を顕微鏡標本とするには、採取した組織片を、所定の融点を有するパラフィン等の包埋材中に埋め込んだ後、包埋材と共に組織片を薄片に切断する。
かかる組織片をパラフィン等の包埋材中に埋め込む包埋作業を、図９に示す包埋装置１００を用いて行われる。
図９に示す包埋装置１００には、包埋材としてのパラフィンが溶融されて貯留された貯留槽１０２と、貯留槽１０２に貯留されている溶融パラフィンの液面よりも下方に位置する、流量調整弁としてのニードル弁１０４と、貯留槽１０２とニードル弁１０４とを連結する配管の途中に設けられた制御弁の開閉スイッチ１０６とが設けられている。
この貯留槽１０２とニードル弁１０４とを連結する配管は、図１０に示す様に、下方に突出するＵ字状の配管１０８である。かかるＵ字状の配管１０８のうち、貯留槽１０２側の立ち上がり配管部に、開閉スイッチ１０６によって開閉される制御弁１１０が設けられている。
この様な包埋装置１００に用いるパラフィンは、通常、融点（凝固点）が５５〜６０℃であるため、パラフィンを溶融状態に保持すべく、貯留槽１０２を加熱する貯留槽加熱ヒータ１１２、制御弁１１０及びその近傍の配管部を加熱する制御弁加熱ヒータ１１４、及び制御弁１１０からニードル弁１０４までの配管部を加熱する配管加熱ヒータ１１６が設けられている。かかる貯留槽加熱ヒータ１１２、制御弁加熱ヒータ１１４及び配管加熱ヒータ１１６は、包埋装置１００の運転の開始時又は停止時に、同時にＯＮ−ＯＦＦされる。
【０００３】
【発明が解決しようとする課題】
図９及び図１０に示す包埋装置１００を用い、組織片をパラフィン中に埋め込む包埋作業を行う際には、組織片を挿入した容器をニードル弁１０４の出口下方に載置し、開閉スイッチ１０６を押して制御弁１１０を開とした後、ニードル弁１０４の開度を調整し、所定量の溶融パラフィンを容器に充填する。
図９及び図１０に示す包埋装置１００では、夜間等の包埋作業を長時間行わない場合には、省エネルギー等の観点から包埋装置１００のメイン電源をＯＦＦとすることが多い。
この様に、包埋装置１００のメイン電源をＯＦＦにすると、制御弁加熱ヒータ１１４及び配管加熱ヒータ１１６もＯＦＦとなるため、制御弁１１０及び配管１０８に充填されているパラフィンは凝固する。
ところで、制御弁１１０は、配管１０８に比較して熱容量が大であり、加熱され難く冷却され難いため、制御弁１１０内のパラフィンは配管１０８内のパラフィンよりも後に凝固する。
更に、制御弁１１０内のパラフィンが凝固すると、パラフィンの凝固に因る収縮に伴なって制御弁１１０の弁体が移動して弁座との間に隙間が形成され、制御弁１１０が開放状態となり易い。
【０００４】
また、包埋装置１００の運転開始時に、制御弁加熱ヒータ１１４及び配管加熱ヒータ１１６に同時に通電されて、配管１０８と制御弁１１０が同時に加熱されると、配管１０８内のパラフィンが溶融状態となっても、制御弁１１０内のパラフィンは依然として凝固状態にある場合がある。
この場合、制御弁１１０が開放状態となっていると、貯留槽１０２の溶融パラフィンが漏れ出したり、ニードル弁１０４から空気が配管内に入り込み、制御弁１１０の直下に空気溜りが形成されるおそれがある。制御弁１１０の直下の空気溜りは、溶融パラフィンの流動方向と逆方向に貯留槽１０２方向に移動せんとするため、溶融パラフィンの流動に伴なってニードル弁１０４から排出され難く次第に成長する。
この様に、制御弁１１０の直下に空気溜りが形成されると、貯留槽１０２の溶融パラフィンの液面とニードル弁１０４との高さ差を利用して溶融パラフィンをニードル弁１０４から吐出する包埋装置１００では、ニードル弁１０４から溶融パラフィンを安定して吐出し難くなる。
一方、制御弁１１０の直下の空気溜りは、送りポンプを設けて溶融パラフィンを強制的に送り出すことによって容易に排出できる。
しかしながら、送りポンプを装着するには、送りポンプを装着するスペースを確保することを要するため、包埋装置１００が大型化する。しかも、送りポンプには脈動が発生し易く、ニードル弁１０４から吐出される溶融パラフィンの吐出量も脈動する。
そこで、本発明の課題は、所定の融点を有するパラフィン等の包埋材が溶融されて貯留されている貯留槽の溶融包埋材の液面と流量調節弁との高低差を利用して溶融包埋材を流量調節弁から吐出する包埋装置であって、流量調整弁から溶融包埋材を安定して吐出し得る包埋装置及びその温度制御方法を提供することにある。
【０００５】
【課題を解決するための手段】
本発明者等は、前記課題を解決すべく検討を重ねた結果、Ｕ字状の配管１０８のうち、流量調整弁であるニードル弁１０４側の立ち上がり配管部に、開閉スイッチ１０６によって開閉される制御弁１１０を設けることによって、制御弁１１０の直下に空気溜りが形成されても、容易にニードル弁１０４から溶融包埋材を吐出できることを知り、本発明に到達した。
すなわち、本発明は、組織片等の試料を、所定の融点を有するパラフィン等の包埋材中に埋め込む包埋装置において、該包埋材が溶融されて貯留されている貯留槽と、前記貯留槽に貯留されている溶融包埋材の液面よりも下方に設けられ、前記試料を埋め込むに必要な所定量の溶融包埋材を吐出する流量調整弁とが、下方に突出するＵ字状の配管によって連結され、前記Ｕ字状の配管のうち、前記流量調整弁側の立ち上がり配管部に制御弁が設けられ、前記Ｕ字状の配管に充填されて凝固された包埋材を溶融する際に、制御弁内に凝固された包埋材が、貯留槽から制御弁に至る配管部内の包埋材よりも先に溶融されるように、前記制御弁及び配管に配設された加熱ヒータを制御する制御部が設けられ、前記Ｕ字状の配管には、貯留槽から制御弁に至る第１配管部を加熱する第１加熱ヒータと、前記制御弁を加熱する制御弁加熱ヒータと、前記制御弁から流量調整弁に至る第２配管部を加熱する第２加熱ヒータとが設けられ、前記制御部は、前記Ｕ字状の配管に充填されて凝固された包埋材を溶融する際に、前記制御弁及び第２配管部の包埋材が溶融されるまでは、前記第１配管部の包埋材が凝固状態を維持し得る凝固点近傍の温度で保持されるように、前記第１加熱ヒータ、制御弁加熱ヒータ及び第２加熱ヒータを制御することを特徴とする包埋装置にある。
【０００６】
また、本発明は、所定の融点を有するパラフィン等の包埋材が溶融されて貯留されている貯留槽と、前記貯留槽に貯留されている溶融包埋材の液面よりも下方に設けられ、組織片等の試料を埋め込むに必要な所定量の溶融包埋材を吐出する流量調整弁とが、下方に突出するＵ字状の配管によって連結され、且つ前記Ｕ字状の配管のうち、前記流量調整弁側の立ち上がり配管部に制御弁が設けられ、前記Ｕ字状の配管には、貯留槽から制御弁に至る第１配管部を加熱する第１加熱ヒータと、前記制御弁を加熱する制御弁加熱ヒータと、前記制御弁から流量調整弁に至る第２配管部を加熱する第２加熱ヒータとが設けられている包埋装置を用い、前記Ｕ字状の配管に充填されて凝固された包埋材を溶融する際に、前記制御弁内に凝固された包埋材が、前記貯留槽から制御弁に至る配管部内の包埋材よりも先に溶融されるように、前記Ｕ字状の配管に充填されて凝固された包埋材を溶融する際に、前記制御弁及び第２配管部を包埋材の溶融温度以上に昇温するまでは、前記第１配管部を前記包埋材が凝固状態を維持し得る凝固点近傍の温度に保持するように、前記第１加熱ヒータ、制御弁加熱ヒータ及び第２加熱ヒータを制御し、前記制御弁及び第２配管部を包埋材の溶融温度以上に昇温した後、前記第１配管部を包埋材の溶融温度以上に昇温するように、前記第１加熱ヒータ、制御弁加熱ヒータ及び第２加熱ヒータを制御することを特徴とする包埋装置の温度制御方法にある。
【０００７】
本発明の包埋装置では、包埋材が溶融されて貯留されている貯留槽と、貯留槽に貯留されている溶融包埋材の液面よりも下方に設けられた流量調整弁とが、下方に突出するＵ字状の配管によって連結され、このＵ字状の配管のうち、流量調整弁側の立ち上がり配管部に制御弁が設けられている。このため、制御弁の直下に空気溜りが形成されても、空気溜りの移動方向は、溶融包埋材の流動方向と同様に、流量調整弁の方向であるため、流量調整弁から空気溜りを容易に抜き出すことができる。その結果、貯留槽の溶融包埋材の液面と流量調節弁との高低差を利用して溶融包埋材を流量調節弁から吐出する包埋装置でも、流量調整弁から溶融包埋材を安定して吐出できる。
更に、かかる包埋装置に、Ｕ字状の配管に充填されて凝固された包埋材を溶融する際に、制御弁内に凝固された包埋材が、貯留槽から制御弁に至る配管部に充填された包埋材の溶融よりも先に溶融されるように、制御弁及び配管に配設された加熱ヒータを制御する制御部を設けた場合、制御弁内の包埋材の凝固に伴なう収縮によって弁座から引離された弁体を、弁座に密着させて制御弁を閉状態とした後、貯留槽から制御弁に至る配管部内に充填されて凝固された包埋材を溶融するため、溶融された包埋材の漏出も防止でき、更に安定して溶融包埋材を流量調整弁から吐出できる。
【０００８】
【発明の実施の形態】
本発明に係る包埋装置の一例を図１に示す。図１（ａ）は包埋装置１０の平面図であり、図１（ｂ）は包埋装置１０の側面図である。
図１に示す包埋装置１０には、包埋材としてのパラフィンが溶融されて貯留された貯留槽１２と、貯留槽１２に貯留されている溶融パラフィンの液面よりも下方に位置する、流量調整弁としてのニードル弁１４と、貯留槽１２とニードル弁１４とを連結する配管の途中に設けられた制御弁の開閉スイッチ１６とが設けられている。
この包埋装置１０のニードル弁１４の左右前方には、組織片が挿入される容器等を温めるホットプレート１８，１８が設けられ、ニードル弁１４の左右後方には、容器等に挿入された組織片等を扱うピンセット等の器具を温める器具ホルダ２２，２２が設けられている。
更に、ニードル弁１４の前方には、ペルチェ素子によって冷却されているコールドスポット２０が形成されている。このコールドスポット２０は、組織片が挿入された容器に充填された溶融パラフィンを凝固させる際に使用される。
尚、包埋装置１０に装着された貯留槽１２の上方の蓋２４は、開閉自在に装着されており、貯留槽１２にパラフィンの補給等を自在に行うことができる。
【０００９】
図１に示す包埋装置１０では、貯留槽１２とニードル弁１４とを連結する配管は、図２に示す様に、下方に突出するＵ字状の配管３０である。かかる配管３０のうち、ニードル弁１４側の立ち上がり配管部に、開閉スイッチ１６によって開閉される制御弁Ｖが設けられている。
この様な包埋装置１０に用いるパラフィンは、通常、融点（凝固点）が５５〜６０℃であるため、パラフィンを溶融状態に保持すべく、貯留槽１２を加熱する貯留槽加熱ヒータ４０、貯留槽１２から制御弁Ｖに至る第１配管部３２を加熱する第１加熱ヒータ４２、制御弁Ｖ及びその近傍の配管部を加熱する制御弁加熱ヒータ４４、及び制御弁Ｖからニードル弁１０４までの第２配管部３６を加熱する第２加熱ヒータ４６が設けられている。かかる貯留槽加熱ヒータ４０、第１加熱ヒータ４２、制御弁加熱ヒータ４４及び第２加熱ヒータ４６は、包埋装置１０の運転の開始時又は停止時に、同時にＯＮ−ＯＦＦされる。
かかる加熱ヒータのうち、第１加熱ヒータ４２、制御弁加熱ヒータ４４及び第２加熱ヒータ４６の各加熱程度は、第１配管部３２、制御弁Ｖ及び第２配管部３６の各々に設けられた温度センサから送信される温度信号に基づいて制御部４８によって制御される。
【００１０】
この制御部４８には、マイクロコンピュータが設けられており、図３に示す様に、ＣＰＵ５０、メモリ５２、液晶等の表示部５４及びテンキー等の入力部５６から成り、配管部３２，３６及び制御弁Ｖに設けられた各温度センサからの現在温度の信号に基づいて加熱ヒータ４２、制御弁加熱ヒータ４４及び加熱ヒータ４６の各々を制御する。
ここで、メモリ５２には、予め第１配管部３２，第２配管部３６及び制御弁Ｖの設定温度Ｔ₁、第２配管部３６の下限設定温度Ｔ₂、制御弁Ｖの下限設定温度Ｔ_V、及び使用パラフィンの凝固状態を維持し得る凝固点近傍温度（Ｔ_F）の各々を入力部５６から入力して記憶させておく。
かかる制御部４８による各加熱ヒータの制御手順は、図４に示す手順に従ってなされる。
先ず、図１に示す包埋装置１０のメインスッチがＯＮされたとき、貯留槽加熱ヒータ４０、第１加熱ヒータ４２、制御弁加熱ヒータ４４及び第２加熱ヒータ４６がＯＮ状態となる（ステップＳ１）。
【００１１】
更に、制御弁Ｖの現在温度がメモリ５２に記憶されている下限設定温度（Ｔ_V）よりも低温で且つ第１配管部３２の現在温度がメモリ５２に記憶されている凝固点近傍温度（Ｔ_F）以上である場合（ステップＳ２，Ｓ３）、第１配管部３２の温度を現在温度に維持するように、第１加熱ヒータ４２を制御し（ステップＳ４）、制御弁Ｖ及び第２配管部３６を昇温するように第２加熱ヒータ４６及び制御弁加熱ヒータ４４を制御する。
この際に、第２配管部３６の現在温度がメモリ５２に記憶されている下限設定温度（Ｔ₂）よりも低温である場合（ステップＳ５）又は制御弁Ｖの現在温度が下限設定温度（Ｔ_V）よりも低温である場合（ステップＳ６）は、ステップＳ４に戻り、制御弁Ｖ及び第２配管部３６の昇温を続行するように第２加熱ヒータ４６及び制御弁加熱ヒータ４４を制御する。
一方、第２配管部３６の現在温度が下限設定温度（Ｔ₂）以上で且つ制御弁Ｖの現在温度が下限設定温度（Ｔ_V）以上となったとき（ステップＳ５，Ｓ６）、第１配管部３２、制御弁Ｖ及び第２配管部３６の温度をメモリ５２に記憶されている設定温度（Ｔ₁）に昇温するように第２加熱ヒータ４６及び制御弁加熱ヒータ４４を制御する（ステップＳ７）。
次いで、第１配管部３２、制御弁Ｖ及び第２配管部３６の温度が設定温度（Ｔ₁）に昇温されたとき（ステップＳ８）、分注可能ランプを点灯する（ステップＳ９）。
【００１２】
かかる図４のステップＳ３において、第１配管部３２の現在温度が凝固点近傍温度（Ｔ_F）よりも低温の場合は、第1配管部３２内のパラフィンは凝固状態にある。このため、第１配管部３２の温度を、パラフィンの凝固状態を維持し得る凝固点近傍温度（Ｔ_F）まで昇温して維持するように第１加熱ヒータ４２を制御する（ステップＳ１０）。
ここで、第１配管部３２の温度を、パラフィンの融点以上に昇温すると、制御弁Ｖ及び第２配管部３６内のパラフィンが凝固状態である場合、制御弁Ｖ内のパラフィンの凝固に伴なう収縮に因る弁体の移動によって形成された、弁体と弁座との間の隙間から貯留槽１２の溶融パラフィンが漏れ易くなる。
このため、第２配管部３６の温度が下限設定温度（Ｔ₂）以上で且つ制御弁Ｖの温度が下限設定温度（Ｔ_V）以上に加熱され、第２配管部３６及び制御弁Ｖ内のパラフィンが完全に溶融されるまで、第１配管部３２の温度を凝固点近傍温度（Ｔ_F）に維持するように第１加熱ヒータ４２を制御する（ステップＳ１０，Ｓ１１，Ｓ１２）。
一方、ステップＳ１０，Ｓ１１において、第２配管部３６の温度が下限設定温度（Ｔ₂）以上で且つ制御弁Ｖの温度が下限設定温度（Ｔ_V）以上に加熱されときには、ステップ７に移行し、第１配管部３２、制御弁Ｖ及び第２配管部３６の温度を設定温度（Ｔ₁）に昇温するように第１加熱ヒータ４２、制御弁加熱ヒータ４４及び第２加熱ヒータ４６を制御する。
尚、ステップ２において、最も熱容量が大きい制御弁Ｖの現在温度が下限設定温度（Ｔ_V）よりも高温である場合は、制御弁Ｖよりも熱容量の小さい第１配管部３２及び第２配管部３６の温度は、いずれもパラフィンの融点以上であるため、直ちにステップ７に移行する。
【００１３】
図１に示す包埋装置１０を長時間運転停止した後、運転再会する場合の様に、Ｕ字状の配管３０及び制御弁Ｖ内のパラフィンが凝固状態であるとき、図４に示す手順に従って各加熱ヒータを制御しつつ、凝固状態のパラフィンを溶融した。この場合の第１配管部３２、制御弁Ｖ及び第２配管部の温度パターンを図５に示す。
ここで、メモリ５２の設定温度（Ｔ₁）を６２℃とし、第２配管部３６の下限設定温度（Ｔ₂）及び制御弁Ｖの下限設定温度（Ｔ_V）を各々６１℃とした。更に、第１配管部３２内のパラフィンの凝固状態を維持し得る凝固点近傍温度（Ｔ_F）を４０℃とした。
この場合、図４に示す手順のステップ３において、第１配管部３２の現在温度が４０℃よりも低温であるため、ステップＳ１０に移行し、第１配管部３２を４０℃に昇温して維持するように第１加熱ヒータ４２を制御する。
この様に、第１配管部３２を４０℃に維持している間に、第２配管部３６及び制御弁Ｖを昇温するように第２加熱ヒータ４６及び制御弁加熱ヒータ４４を制御する。第２配管部３６及び制御弁Ｖの温度が共に６１℃以上となったとき（ステップＳ１１，Ｓ１２）、ステップＳ７に移行し、第１配管部３２、制御弁Ｖ及び第２配管部３６を６２℃に昇温するように第１加熱ヒータ４２、制御弁加熱ヒータ４４及び第２加熱ヒータ４６を制御する。
【００１４】
次に、短時間の停電等の影響によって、例えば図６に示す様に、制御弁Ｖの温度が６１℃よりも低温となったものの、第１配管部３２は４０℃以上であり且つ第２配管部３６の温度も６１℃以上の場合は、図４に示すステップＳ４に移行し、第１配管部３２の温度を現在温度に維持するように、第１加熱ヒータ４２を制御する。
この様に、第１配管部３２の温度を現在温度に維持している間に、制御弁Ｖを昇温するように制御弁加熱ヒータ４４を制御する。第２配管部３６及び制御弁Ｖの温度が共に６１℃以上となったとき（ステップＳ５，Ｓ６）、ステップＳ７に移行し、第１配管部３２、制御弁Ｖ及び第２配管部３６を６２℃に昇温するように第１加熱ヒータ４２、制御弁加熱ヒータ４４及び第２加熱ヒータ４６を制御する。
また、比較的長い停電等の影響によって、例えば図７に示す様に、第１配管部３２の温度が４０℃よりも低温となって、第１配管部３２内のパラフィンが凝固し、制御弁Ｖの温度も６１℃よりも低温となったものの、第２配管部３６の温度は６１℃以上の場合は、図４に示すステップＳ１０に移行し、第１配管部３６の温度を４０℃に昇温して維持するように、第１加熱ヒータ４２を制御する。
この様に、第１配管部３２を４０℃に維持している間に、制御弁Ｖを昇温するように制御弁加熱ヒータ４４を制御する。第２配管部３６及び制御弁Ｖの温度が共に６１℃以上となったとき（ステップＳ１１，Ｓ１２）、ステップＳ７に移行し、第１配管部３２、制御弁Ｖ及び第２配管部３６を６２℃に昇温するように第１加熱ヒータ４２、制御弁加熱ヒータ４４及び第２加熱ヒータ４６を制御する。
【００１５】
図５〜図７に示す様に、第１配管部３２の６２℃の昇温を、制御弁Ｖ及び第２配管部３６の温度が６１℃に到達した後とすることは、制御弁Ｖ及び第２配管部３６内のパラフィンが完全に溶解されたことを確認してから所定温度に昇温することを意味している。このため、制御弁Ｖ及び第２配管部３６内のパラフィンの溶解が不完全な状態で第１配管部３２を昇温することを確実に防止できる。
【００１６】
ところで、図１に示す包埋装置１０には、前述した様に、ニードル弁１４の左右前方に、組織片が挿入される容器等を温めるホットプレート１８，１８が設けられ、ニードル弁１４の左右後方には、容器等に挿入された組織片等を扱うピンセット等の器具を温める器具ホルダ２２，２２が設けられている。
かかるホットプレート１８，１８及び器具ホルダ２２，２２は、図８に示す金属板６０上に設けられている。この金属板６０は、器具ホルダ２２，２２が設けられるアルミブロックから成る第２金属板としての器具ホルダ部６２と、ホットプレート１８，１８が設けられるアルミ板から成る第１金属板としてのホットプレート部６４とから構成される。ホットプレート部６４は、その略中央部がペルチェ素子によって冷却されるコールドスポット２０が設けられる切欠部６６によって幅狭部６８に形成されている。このため、ホットプレート部６４の幅狭部６８を挟む両端部６４ａ，６４ａに、第１ヒータとしてのラバーヒータ７０，７０が装着されている。
【００１７】
かかるホットプレート部６４と所定の接合面積で接合されている器具ホルダ部６２には、第２ヒータとしてのカートリッジヒータ７２が装着されており、ラバーヒータ７０，７０及びカートリッジヒータ７２は、制御部７４によって制御されている。この制御部７４には、ホットプレート部６４の１箇所に設けられた温度センサ７６からの温度信号が送信されている。
かかる制御部７４では、ホットプレート１８，１８の設定温度に対して器具ホルダ２２，２２の温度が５℃程高温となるように、ホットプレート部６４のラバーヒータ７０，７０の通電率よりも器具ホルダ部６２のカートリッジヒータ７２の通電率を高くし、温度センサ７６の温度信号に対しては主としてラバーヒータ７０，７０を制御する。
尚、制御部７４は、ホットプレート部６４の１箇所に設けられた温度センサ７６からの温度信号に基づいてラバーヒータ７０，７０を制御するため、温度センサ７６を設ける位置については、予め所望の温度制御が可能であることを確認しておくことが必要である。
【００１８】
以上、述べてきた図１〜図８に示す包埋装置１０によれば、例え制御弁Ｖの直下に空気溜りが形成されても成長し難く、ニードル弁１４から安定して溶融パラフィンを吐出することができるため、組織片等の包埋処理を容易に行うことができる。
また、長期間の運転停止した包埋装置１０の運転を再開等する際に、制御弁から溶融パラフィンが漏出する事態や空気の漏れ込みを防止でき、安全に且つ確実に包埋処理を施すことができる。
【００１９】
【発明の効果】
本発明の包埋装置では、貯留槽に貯留されている溶融包埋材の液面と流量調節弁との高低差を利用し、貯留槽に貯留されている溶融包埋材を流量調節弁から安定して吐出できるため、組織片等の包埋処理を安全に且つ確実に行うことができる。
【図面の簡単な説明】
【図１】本発明に係る包埋装置の一例を説明するための平面図及び側面図である。
【図２】図１に示す包埋装置の配管等の概略を説明するための概略図である。
【図３】図２に示す包埋装置を制御する制御部の概略を説明するための概略図である。
【図４】図３に示す制御部の制御の手順を説明するフローチャートである。
【図５】図４に示す制御手順によって図２に示す配管等の温度を制御した一例を示す温度グラフである。
【図６】図４に示す制御手順によって図２に示す配管等の温度を制御した他の例を示す温度グラフである。
【図７】図４に示す制御手順によって図２に示す配管等の温度を制御した他の例を示す温度グラフである。
【図８】図１に示す包埋装置のホットプレート１８，１８及び器具ホルダ２２，２２が設けられる金属板の概略を説明するための概略図である。
【図９】従来の包埋装置を説明するための側面図である。
【図１０】図９に示す包埋装置の配管等の概略を説明するための概略図である。
【符号の説明】
１０包埋装置
１２貯留槽
１４ニードル弁（流量調整弁）
１８ホットプレート
２０器具ホルダ
３０Ｕ字状の配管
３２第１配管部
３６第２配管部
４２第１加熱ヒータ
４４制御弁加熱ヒータ
４６第２加熱ヒータ
４８，７４制御部
６０金属板
６２器具ホルダ部（第２金属板）
６４ホットプレート部（第１金属板）
７０ラバーヒータ（第１ヒータ）
７２カートリッジヒータ（第２ヒータ）
７６温度センサ
Ｖ制御弁[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an embedding device and a temperature control method thereof, and more particularly to an embedding device for embedding a sample such as a tissue piece in an embedding material such as paraffin having a predetermined melting point and a temperature control method thereof.
[0002]
[Prior art]
In order to use a tissue piece collected from a human body or the like as a microscope specimen, the collected tissue piece is embedded in an embedding material such as paraffin having a predetermined melting point, and then the tissue piece is cut into a thin piece together with the embedding material.
An embedding operation for embedding the tissue piece in an embedding material such as paraffin is performed using an embedding apparatus 100 shown in FIG.
The embedding device 100 shown in FIG. 9 has a storage tank 102 in which paraffin as an embedding material is melted and stored, and a flow rate that is located below the liquid level of the molten paraffin stored in the storage tank 102. A needle valve 104 as an adjustment valve and a control valve opening / closing switch 106 provided in the middle of a pipe connecting the storage tank 102 and the needle valve 104 are provided.
The pipe connecting the storage tank 102 and the needle valve 104 is a U-shaped pipe 108 protruding downward as shown in FIG. A control valve 110 that is opened and closed by an open / close switch 106 is provided in the rising pipe portion on the storage tank 102 side of the U-shaped pipe 108.
Since the paraffin used for such an embedding apparatus 100 usually has a melting point (freezing point) of 55 to 60 ° C., a storage tank heater 112 for heating the storage tank 102 and a control valve to keep the paraffin in a molten state. A control valve heater 114 that heats 110 and a pipe section in the vicinity thereof, and a pipe heater 116 that heats a pipe section from the control valve 110 to the needle valve 104 are provided. The storage tank heater 112, the control valve heater 114, and the pipe heater 116 are turned on and off at the same time when the operation of the embedding apparatus 100 is started or stopped.
[0003]
[Problems to be solved by the invention]
When performing the embedding operation of embedding a tissue piece in paraffin using the embedding apparatus 100 shown in FIGS. 9 and 10, the container into which the tissue piece is inserted is placed below the outlet of the needle valve 104, and an open / close switch After the control valve 110 is opened by pressing 106, the opening degree of the needle valve 104 is adjusted, and a predetermined amount of molten paraffin is filled in the container.
In the embedding device 100 shown in FIG. 9 and FIG. 10, when the embedding work at night or the like is not performed for a long time, the main power of the embedding device 100 is often turned off from the viewpoint of energy saving or the like.
Thus, when the main power supply of the embedding device 100 is turned off, the control valve heater 114 and the pipe heater 116 are also turned off, so that the paraffin filled in the control valve 110 and the pipe 108 is solidified.
By the way, the control valve 110 has a larger heat capacity than the pipe 108 and is not easily heated and cooled, so that the paraffin in the control valve 110 is solidified later than the paraffin in the pipe 108.
Further, when the paraffin in the control valve 110 is solidified, the valve body of the control valve 110 is moved along with the contraction due to the solidification of the paraffin, and a gap is formed between the valve and the valve seat, and the control valve 110 is in an open state. It is easy to become.
[0004]
Moreover, when the operation of the embedding device 100 is started, when the control valve heater 114 and the pipe heater 116 are energized at the same time and the pipe 108 and the control valve 110 are heated at the same time, the paraffin in the pipe 108 is in a molten state. However, the paraffin in the control valve 110 may still be in a solidified state.
In this case, if the control valve 110 is in an open state, molten paraffin in the storage tank 102 leaks out, air enters the pipe from the needle valve 104, and an air pocket may be formed immediately below the control valve 110. There is. Since the air reservoir immediately below the control valve 110 moves toward the storage tank 102 in the direction opposite to the flow direction of the molten paraffin, it is difficult to be discharged from the needle valve 104 along with the flow of the molten paraffin and grows gradually.
In this way, when an air pocket is formed immediately below the control valve 110, a package that discharges the molten paraffin from the needle valve 104 using the height difference between the liquid level of the molten paraffin in the storage tank 102 and the needle valve 104. In the embedding device 100, it is difficult to stably discharge molten paraffin from the needle valve 104.
On the other hand, the air reservoir immediately below the control valve 110 can be easily discharged by providing a feed pump and forcibly sending molten paraffin.
However, in order to mount the feed pump, it is necessary to secure a space for mounting the feed pump, so that the embedding device 100 is enlarged. Moreover, pulsation is likely to occur in the feed pump, and the discharge amount of molten paraffin discharged from the needle valve 104 also pulsates.
Accordingly, an object of the present invention is to use the difference in height between the liquid level of the molten embedding material of the storage tank in which the embedding material such as paraffin having a predetermined melting point is melted and stored and the flow rate control valve. It is an embedding device that discharges an embedding material from a flow control valve, and provides an embedding device that can stably discharge a molten embedding material from the flow control valve, and a temperature control method therefor.
[0005]
[Means for Solving the Problems]
As a result of repeated investigations to solve the above problems, the inventors of the present invention have a control that is opened and closed by the opening / closing switch 106 in the rising pipe portion of the U-shaped pipe 108 on the side of the needle valve 104 that is a flow regulating valve. By providing the valve 110, it was found that the molten embedding material can be easily discharged from the needle valve 104 even if an air pocket is formed immediately below the control valve 110, and the present invention has been achieved.
That is, the present invention relates to an embedding apparatus for embedding a sample such as a tissue piece in an embedding material such as paraffin having a predetermined melting point, a storage tank in which the embedding material is melted and stored, and the storage A U-shaped protrusion that is provided below the liquid level of the molten embedding material stored in the tank and that discharges a predetermined amount of the molten embedding material necessary for embedding the sample. Among the U-shaped pipes, a control valve is provided in the rising pipe portion on the flow rate adjusting valve side, and the embedding material filled and solidified in the U-shaped pipes is melted. When the embedding material solidified in the control valve is melted before the embedding material in the piping section from the storage tank to the control valve, the heater provided in the control valve and the piping The U-shaped pipe is controlled from the storage tank. A first heater that heats the first piping section, a control valve heater that heats the control valve, and a second heater that heats the second piping section that extends from the control valve to the flow rate adjustment valve. And when the embedding material filled and solidified in the U-shaped pipe is melted, the control section until the embedding material of the control valve and the second pipe section is melted. The first heating heater, the control valve heating heater, and the second heating heater are controlled so that the embedding material of one piping portion is maintained at a temperature in the vicinity of a freezing point at which a solidified state can be maintained. In the device.
[0006]
Further, the present invention is provided below a storage tank in which an embedding material such as paraffin having a predetermined melting point is melted and stored, and a liquid level of the molten embedding material stored in the storage tank. A flow rate adjusting valve that discharges a predetermined amount of the melt embedding material necessary for embedding a sample such as a tissue piece is connected by a U-shaped pipe projecting downward, and among the U-shaped pipes, A control valve is provided in the rising pipe portion on the flow rate adjusting valve side, and the U-shaped pipe has a first heater for heating the first pipe portion from the storage tank to the control valve, and heats the control valve. The U-shaped pipe is filled and solidified using an embedding device provided with a control valve heater that performs heating and a second heater that heats the second pipe from the control valve to the flow rate adjustment valve. The embedding material solidified in the control valve when melting the embedding material The as melted before the capsule Umazai in the pipe section leading to the control valve from the reservoir, when melting the embedding material which is solidified is filled into the U-shaped pipe, the control valve Until the temperature of the second piping part is raised to the melting temperature of the embedding material or higher, the first piping part is maintained at a temperature near the freezing point at which the embedding material can maintain a solidified state. The heater, the control valve heater and the second heater are controlled, and the control valve and the second piping part are heated to a melting temperature of the embedding material, and then the first piping part is melted at the embedding material melting temperature. In the temperature control method of the embedding apparatus, the first heater, the control valve heater, and the second heater are controlled so that the temperature is increased as described above.
[0007]
In the embedding device of the present invention, a storage tank in which the embedding material is melted and stored, and a flow rate adjusting valve provided below the liquid level of the molten embedding material stored in the storage tank, It is connected by a U-shaped pipe projecting downward, and a control valve is provided in the rising pipe portion on the flow rate regulating valve side of the U-shaped pipe. For this reason, even if an air pool is formed immediately below the control valve, the direction of movement of the air pool is the same as the flow direction of the molten embedding material. Can be easily extracted. As a result, even in an embedding device that discharges the molten embedding material from the flow control valve using the difference in level between the liquid level of the molten embedding material in the storage tank and the flow control valve, the molten embedding material is removed from the flow control valve. Stable ejection.
Further, when the embedding material filled in the U-shaped pipe and melted into the embedding device is melted, the embedding material solidified in the control valve is connected to the control valve from the storage tank. If the control unit that controls the heater installed in the control valve and piping is provided so that it is melted before the embedding material filled in is melted, the embedding material in the control valve is solidified. An embedding material that has been solidified by filling the piping from the storage tank to the control valve after the valve body that has been pulled away from the valve seat due to contraction is brought into close contact with the valve seat and the control valve is closed. Therefore, leakage of the molten embedding material can be prevented, and the molten embedding material can be discharged from the flow control valve more stably.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
An example of an embedding device according to the present invention is shown in FIG. FIG. 1A is a plan view of the embedding device 10, and FIG. 1B is a side view of the embedding device 10.
The embedding device 10 shown in FIG. 1 has a storage tank 12 in which paraffin as an embedding material is melted and stored, and a flow rate that is located below the liquid level of the molten paraffin stored in the storage tank 12. A needle valve 14 as an adjustment valve and a control valve opening / closing switch 16 provided in the middle of a pipe connecting the storage tank 12 and the needle valve 14 are provided.
Hot plates 18 and 18 for warming a container or the like into which a tissue piece is inserted are provided on the left and right front sides of the needle valve 14 of the embedding device 10, and the tissues inserted in the containers or the like are provided on the left and right rear sides of the needle valve 14. Instrument holders 22 and 22 are provided for warming instruments such as tweezers for handling pieces and the like.
Further, a cold spot 20 cooled by a Peltier element is formed in front of the needle valve 14. The cold spot 20 is used when the molten paraffin filled in the container in which the tissue piece is inserted is solidified.
In addition, the lid | cover 24 above the storage tank 12 with which the embedding apparatus 10 was mounted | worn is mounted | worn so that opening and closing is possible, and replenishment of paraffin etc. to the storage tank 12 can be performed freely.
[0009]
In the embedding device 10 shown in FIG. 1, the pipe connecting the storage tank 12 and the needle valve 14 is a U-shaped pipe 30 protruding downward as shown in FIG. 2. A control valve V that is opened and closed by the opening / closing switch 16 is provided in the rising piping portion on the needle valve 14 side of the piping 30.
Since the paraffin used for such an embedding apparatus 10 usually has a melting point (freezing point) of 55 to 60 ° C., a storage tank heater 40 and a storage tank for heating the storage tank 12 to keep the paraffin in a molten state. The first heater 42 that heats the first piping section 32 from 12 to the control valve V, the control valve heater 44 that heats the control valve V and the piping section in the vicinity thereof, and the first heater from the control valve V to the needle valve 104 The 2nd heater 46 which heats the 2 piping part 36 is provided. The storage tank heater 40, the first heater 42, the control valve heater 44 and the second heater 46 are turned on and off at the same time when the operation of the embedding apparatus 10 is started or stopped.
Among the heaters, the heating degree of the first heater 42, the control valve heater 44, and the second heater 46 is provided in each of the first piping portion 32, the control valve V, and the second piping portion 36. It is controlled by the controller 48 based on the temperature signal transmitted from the temperature sensor.
[0010]
The control unit 48 is provided with a microcomputer, and as shown in FIG. 3, is composed of a CPU 50, a memory 52, a display unit 54 such as a liquid crystal and an input unit 56 such as a numeric keypad. Each of the heater 42, the control valve heater 44 and the heater 46 is controlled based on the current temperature signal from each temperature sensor provided in the valve V.
Here, in the memory 52, the preset temperature T _{1 of} the first pipe part 32, the second pipe part 36 and the control valve V, the lower limit set temperature T ₂ of the second pipe part 36, and the lower limit set temperature T of the control valve V are stored. Each of _V and the temperature near the freezing point (T _F ) capable of maintaining the solidification state of the paraffin used is input from the input unit 56 and stored.
The control procedure of each heater by the control unit 48 is performed according to the procedure shown in FIG.
First, when the main switch of the embedding device 10 shown in FIG. 1 is turned on, the storage tank heater 40, the first heater 42, the control valve heater 44, and the second heater 46 are turned on (step S1). .
[0011]
Further, the temperature near the freezing point (T _F ) in which the current temperature of the control valve V is lower than the lower limit set temperature (T _V ) stored in the memory 52 and the current temperature of the first piping section 32 is stored in the memory 52. ) If it is above (steps S2 and S3), the first heater 42 is controlled so as to maintain the temperature of the first piping section 32 at the current temperature (step S4), and the control valve V and the second piping section 36 are controlled. The second heater 46 and the control valve heater 44 are controlled so as to raise the temperature.
At this time, when the current temperature of the second piping section 36 is lower than the lower limit set temperature (T ₂ ) stored in the memory 52 (step S5), or the current temperature of the control valve V is the lower limit set temperature (T If the temperature is lower than _V ) (step S6), the process returns to step S4, and the second heater 46 and the control valve heater 44 are controlled so as to continue to raise the temperature of the control valve V and the second piping section 36. .
On the other hand, when the current temperature of the second pipe section 36 is equal to or higher than the lower limit set temperature (T ₂ ) and the current temperature of the control valve V is equal to or higher than the lower limit set temperature (T _V ) (steps S5 and S6), the first pipe. The second heater 46 and the control valve heater 44 are controlled so as to raise the temperature of the part 32, the control valve V and the second piping part 36 to the set temperature (T ₁ ) stored in the memory 52 (step). S7).
Next, when the temperatures of the first piping part 32, the control valve V, and the second piping part 36 are raised to the set temperature (T ₁ ) (step S8), the dispenseable lamp is turned on (step S9).
[0012]
In step S3 of FIG. 4, when the current temperature of the first piping part 32 is lower than the freezing point vicinity temperature (T _F ), the paraffin in the first piping part 32 is in a solidified state. For this reason, the first heater 42 is controlled so that the temperature of the first piping section 32 is raised to and maintained at a temperature near the freezing point (T _F ) at which the solidified state of paraffin can be maintained (step S10).
Here, when the temperature of the first piping part 32 is raised to the melting point of paraffin or more, when the paraffin in the control valve V and the second piping part 36 is in a solidified state, the paraffin in the control valve V is solidified. The molten paraffin in the storage tank 12 easily leaks from the gap between the valve body and the valve seat, which is formed by the movement of the valve body due to the contraction.
Therefore, the temperature of the second temperature is the lower limit set temperature of the pipe section 36 (T ₂₎ or more and the control valve V is heated to above the lower limit set temperature (T _V), the second pipe portion 36 and the control valve in the V Until the paraffin is completely melted, the first heater 42 is controlled so as to maintain the temperature of the first piping section 32 at a temperature near the freezing point (T _F ) (steps S10, S11, S12).
On the other hand, in steps S10 and S11, when the temperature of the second piping section 36 is higher than the lower limit set temperature (T ₂ ) and the temperature of the control valve V is heated higher than the lower limit set temperature (T _V ), the process proceeds to step 7. The first heater 42, the control valve heater 44, and the second heater 46 are controlled so that the temperature of the first piping section 32, the control valve V, and the second piping section 36 is raised to the set temperature (T ₁ ). To do.
In step 2, when the current temperature of the control valve V having the largest heat capacity is higher than the lower limit set temperature (T _V ), the first piping section 32 and the second piping section having a smaller heat capacity than the control valve V. Since all the temperatures of 36 are equal to or higher than the melting point of paraffin, the process immediately proceeds to step 7.
[0013]
When the U-shaped pipe 30 and the paraffin in the control valve V are in a solidified state as in the case of reuniting the operation after the operation of the embedding device 10 shown in FIG. 1 is stopped for a long time, the procedure shown in FIG. 4 is followed. While controlling each heater, the solidified paraffin was melted. FIG. 5 shows temperature patterns of the first piping part 32, the control valve V, and the second piping part in this case.
Here, setting of the memory 52 temperature (T ₁₎ and 62 ° C., was second lower limit set temperature of the pipe section 36 (T ₂₎ and the lower limit set temperature of the control valve V a (T _V) and each 61 ° C.. Furthermore, the freezing point vicinity temperature (T _F ) capable of maintaining the solidification state of the paraffin in the first piping part 32 was set to 40 ° C.
In this case, in step 3 of the procedure shown in FIG. 4, since the current temperature of the first piping part 32 is lower than 40 ° C., the process proceeds to step S10 and the first piping part 32 is heated to 40 ° C. The first heater 42 is controlled so as to be maintained.
In this manner, the second heater 46 and the control valve heater 44 are controlled so as to raise the temperature of the second pipe portion 36 and the control valve V while the first piping portion 32 is maintained at 40 ° C. When the temperature of both the second piping part 36 and the control valve V becomes 61 ° C. or more (steps S11 and S12), the process proceeds to step S7, and the first piping part 32, the control valve V and the second piping part 36 are changed to 62. The first heater 42, the control valve heater 44, and the second heater 46 are controlled so as to raise the temperature to ° C.
[0014]
Next, for example, as shown in FIG. 6, although the temperature of the control valve V is lower than 61 ° C. due to the influence of a power failure or the like for a short time, the first piping portion 32 is 40 ° C. or higher and the second When the temperature of the piping part 36 is 61 ° C. or more, the process proceeds to step S4 shown in FIG. 4 and the first heater 42 is controlled so that the temperature of the first piping part 32 is maintained at the current temperature.
In this manner, the control valve heater 44 is controlled so as to raise the temperature of the control valve V while maintaining the temperature of the first piping section 32 at the current temperature. When the temperatures of the second piping part 36 and the control valve V both become 61 ° C. or more (steps S5 and S6), the process proceeds to step S7, and the first piping part 32, the control valve V and the second piping part 36 are moved to 62. The first heater 42, the control valve heater 44, and the second heater 46 are controlled so as to raise the temperature to ° C.
Further, for example, as shown in FIG. 7, the temperature of the first piping part 32 becomes lower than 40 ° C. due to the influence of a relatively long power failure or the like, and the paraffin in the first piping part 32 is solidified, and the control valve When the temperature of V is also lower than 61 ° C., but the temperature of the second piping part 36 is 61 ° C. or more, the process proceeds to step S10 shown in FIG. 4 and the temperature of the first piping part 36 is set to 40 ° C. The first heater 42 is controlled so that the temperature is raised and maintained.
In this manner, the control valve heater 44 is controlled so as to raise the temperature of the control valve V while maintaining the first piping portion 32 at 40 ° C. When the temperature of both the second piping part 36 and the control valve V becomes 61 ° C. or more (steps S11 and S12), the process proceeds to step S7, and the first piping part 32, the control valve V and the second piping part 36 are changed to 62. The first heater 42, the control valve heater 44, and the second heater 46 are controlled so as to raise the temperature to ° C.
[0015]
As shown in FIGS. 5 to 7, the temperature rise of 62 ° C. of the first piping portion 32 is made after the temperature of the control valve V and the second piping portion 36 reaches 61 ° C. It means that the temperature is raised to a predetermined temperature after confirming that the paraffin in the second piping part 36 is completely dissolved. For this reason, it is possible to reliably prevent the temperature of the first piping portion 32 from being raised in a state where the dissolution of paraffin in the control valve V and the second piping portion 36 is incomplete.
[0016]
By the way, as described above, the embedding device 10 shown in FIG. 1 is provided with hot plates 18 and 18 for heating a container or the like into which a tissue piece is inserted, on the left and right front sides of the needle valve 14. On the rear side, there are provided instrument holders 22 and 22 for warming instruments such as tweezers for handling tissue pieces inserted in containers or the like.
The hot plates 18 and 18 and the instrument holders 22 and 22 are provided on a metal plate 60 shown in FIG. The metal plate 60 includes a device holder 62 as a second metal plate made of an aluminum block on which the device holders 22 and 22 are provided, and a hot plate as a first metal plate made of an aluminum plate on which the hot plates 18 and 18 are provided. Part 64. The hot plate part 64 is formed in a narrow part 68 by a notch part 66 provided with a cold spot 20 cooled at its substantially central part by a Peltier element. Therefore, rubber heaters 70 and 70 as first heaters are attached to both end portions 64a and 64a sandwiching the narrow portion 68 of the hot plate portion 64.
[0017]
A cartridge heater 72 as a second heater is mounted on the instrument holder 62 joined to the hot plate 64 with a predetermined joining area, and the rubber heaters 70 and 70 and the cartridge heater 72 are connected to the controller 74. Is controlled by. The control unit 74 is transmitted with a temperature signal from a temperature sensor 76 provided at one location of the hot plate unit 64.
In such a control unit 74, the appliance is more than the energization rate of the rubber heaters 70, 70 of the hot plate portion 64 so that the temperature of the appliance holders 22, 22 is about 5 ° C. higher than the set temperature of the hot plates 18, 18. The energization rate of the cartridge heater 72 of the holder 62 is increased, and the rubber heaters 70 and 70 are mainly controlled with respect to the temperature signal of the temperature sensor 76.
The control unit 74 controls the rubber heaters 70 and 70 based on the temperature signal from the temperature sensor 76 provided at one location of the hot plate unit 64. It is necessary to confirm that temperature control is possible.
[0018]
As described above, according to the embedding device 10 shown in FIGS. 1 to 8, even if an air pocket is formed immediately below the control valve V, it is difficult to grow, and the molten paraffin is stably discharged from the needle valve 14. Therefore, the embedding process such as a tissue piece can be easily performed.
Moreover, when resuming the operation of the embedding device 10 that has been stopped for a long period of time, it is possible to prevent a situation where molten paraffin leaks from the control valve and air leakage, and to perform the embedding process safely and reliably. Can do.
[0019]
【The invention's effect】
In the embedding device of the present invention, the difference in level between the liquid level of the molten embedding material stored in the storage tank and the flow control valve is used, and the molten embedding material stored in the storage tank is removed from the flow control valve. Since it can discharge stably, embedding processing of a tissue piece etc. can be performed safely and reliably.
[Brief description of the drawings]
FIG. 1 is a plan view and a side view for explaining an example of an embedding device according to the present invention.
FIG. 2 is a schematic diagram for explaining the outline of piping and the like of the embedding apparatus shown in FIG.
FIG. 3 is a schematic diagram for explaining an outline of a control unit that controls the embedding apparatus shown in FIG. 2;
4 is a flowchart illustrating a control procedure of a control unit shown in FIG.
5 is a temperature graph showing an example in which the temperature of the piping shown in FIG. 2 is controlled by the control procedure shown in FIG.
6 is a temperature graph showing another example in which the temperature of the piping shown in FIG. 2 is controlled by the control procedure shown in FIG.
7 is a temperature graph showing another example in which the temperature of the piping shown in FIG. 2 is controlled by the control procedure shown in FIG.
8 is a schematic view for explaining an outline of a metal plate on which hot plates 18 and 18 and instrument holders 22 and 22 of the embedding apparatus shown in FIG. 1 are provided.
FIG. 9 is a side view for explaining a conventional embedding device.
10 is a schematic diagram for explaining the outline of piping and the like of the embedding device shown in FIG. 9;
[Explanation of symbols]
10 Embedding device 12 Storage tank 14 Needle valve (flow adjustment valve)
18 Hot plate 20 Appliance holder 30 U-shaped piping 32 First piping portion 36 Second piping portion 42 First heater 44 Control valve heater 46 Second heaters 48 and 74 Controller 60 Metal plate 62 Appliance holder ( Second metal plate)
64 Hot plate part (first metal plate)
70 Rubber heater (first heater)
72 Cartridge heater (second heater)
76 Temperature sensor V Control valve

Claims

In an embedding device for embedding a sample such as a tissue piece in an embedding material such as paraffin having a predetermined melting point,
A storage tank in which the embedding material is melted and stored, and a predetermined amount of the melt packing required to embed the sample is provided below the liquid level of the melt embedding material stored in the storage tank. The flow control valve for discharging the filling material is connected by a U-shaped pipe projecting downward,
Among the U-shaped pipes, a control valve is provided on the rising pipe part on the flow regulating valve side ,
When the embedding material filled and solidified in the U-shaped pipe is melted, the embedding material solidified in the control valve is ahead of the embedding material in the piping section from the storage tank to the control valve. A control unit for controlling the heater provided in the control valve and the piping is provided so as to be melted,
The U-shaped pipe includes a first heater that heats the first pipe section from the storage tank to the control valve, a control valve heater that heats the control valve, and a flow control valve from the control valve. A second heater for heating the second piping part is provided,
When the control part melts the embedding material filled and solidified in the U-shaped pipe, the control pipe and the second pipe part until the embedding material is melted, the first pipe An embedding apparatus that controls the first heater, the control valve heater, and the second heater so that a portion of the embedding material is maintained at a temperature near a freezing point at which a solidified state can be maintained .

A first metal provided with a first heater on the other surface side so that a hot plate for holding a container or the like filled with a molten embedding material is placed on the one surface side in the vicinity of the flow control valve The plate and the second metal plate provided with the second heater on the other side are joined with a predetermined joining area so that the instrument holder on which the instrument such as tweezers is inserted and kept warm is formed on the one side. ,
Temperature control for controlling the first heater and the second heater so that the portion of the second metal plate on which the instrument holder is formed is higher in temperature than the portion of the first metal plate on which the hot plate is formed. The embedding device according to claim 1, wherein means are provided.

A first metal plate provided with a first heater on the other side so that hot plates are formed on one side in two places, and a second heater on the other side so that the instrument holder is formed on one side. The provided second metal plate is bonded with a predetermined bonding area,
Based on the temperature detected by a temperature sensor provided at a predetermined location between the hot plates of the first metal plate, the first heater and the second heater are set so that the instrument holder has a predetermined temperature higher than the hot plate. The embedding apparatus according to claim 2, further comprising temperature control means for controlling the heater.

A storage tank in which an embedding material such as paraffin having a predetermined melting point is melted and stored, and a sample such as a tissue piece provided below the liquid level of the molten embedding material stored in the storage tank And a flow rate adjusting valve that discharges a predetermined amount of the melt embedding material necessary for embedding the gas, and is connected by a U-shaped pipe protruding downward,
In addition, a control valve is provided in the rising pipe portion on the flow rate adjusting valve side of the U-shaped pipe, and the U-shaped pipe includes a first pipe section that heats the first pipe section from the storage tank to the control valve. Using an embedding apparatus provided with 1 heater, a control valve heater for heating the control valve, and a second heater for heating a second piping section from the control valve to the flow rate adjustment valve ,
When the embedding material filled and solidified in the U-shaped pipe is melted, the embedding material solidified in the control valve is more than the embedding material in the piping part extending from the storage tank to the control valve. To be melted first ,
When the embedding material filled and solidified in the U-shaped piping is melted, the first piping portion is raised until the control valve and the second piping portion are heated to a temperature equal to or higher than the melting temperature of the embedding material. Controlling the first heater, the control valve heater and the second heater so that the embedding material is maintained at a temperature in the vicinity of the freezing point at which the embedding material can maintain the solidified state.
The first heater and the control valve are configured to raise the temperature of the first piping part to a temperature higher than the melting temperature of the embedding material after the control valve and the second piping part are heated to a temperature higher than the melting temperature of the embedding material. The temperature control method of the embedding apparatus which controls a heater and a 2nd heater .

When the current temperature of the first piping part is equal to or higher than the solidification temperature of the embedding material when the temperature of the second piping part and / or the control valve is lower than the set temperature due to a disturbance or the like, the first piping part is The first heating heater and the control valve are heated so that the temperature of the control valve and the second piping part is raised to a set temperature, and the temperature of the first piping part is raised to the melting temperature of the embedding material. The temperature control method for an embedding apparatus according to claim 4 , wherein the heater and the second heater are controlled.

If the current temperature of the first piping section is lower than the solidification temperature of the embedding material when the temperature of the second piping section and / or the control valve is lower than the set temperature due to disturbance or the like, the first piping section Is maintained at a temperature in the vicinity of the freezing point at which the embedding material can maintain a solidified state, and the control valve and the second piping part are heated to a temperature higher than the melting temperature of the embedding material, and then the first piping part is embedded. The temperature control method for an embedding apparatus according to claim 5 , wherein the first heater, the control valve heater, and the second heater are controlled so that the temperature is raised to a temperature equal to or higher than a melting temperature of the material.