JP4699866B2 - Piezoelectric vibrator and manufacturing method thereof, oscillator, radio timepiece, and electronic device - Google Patents

Description

  The present invention relates to a piezoelectric vibrator and a manufacturing method thereof, an oscillator, a radio timepiece, and an electronic device.

  In recent years, various piezoelectric vibrators have been used as time sources, timing sources of control signals, and the like in mobile phones and portable information terminal devices. Some of these piezoelectric vibrators include a sealed container in which a base member and a lid member are overlapped and joined, and a piezoelectric vibrator piece provided in the sealed container. The reason why the inside is sealed by the sealed container is to stabilize the vibration characteristics of the piezoelectric vibrator piece by keeping the periphery of the piezoelectric vibrator piece in a vacuum state. As these piezoelectric vibrators, those in which a bonding film made of a metal such as aluminum is provided between the base member and the lid member in order to join the base member and the lid member are well known (for example, (See Patent Document 1).

However, when a bonding film made of such a metal is provided, a plurality of lead electrodes for applying a voltage to the piezoelectric vibrator piece can be extended on the overlapping surface between the lid member and the base member. Can not. This is because if a bonding film made of metal is provided between the lid member and the base member, the bonding film and the plurality of extraction electrodes interfere with each other, and the plurality of extraction electrodes are short-circuited.
Therefore, instead of providing a bonding film, for example, a base member is provided with a through hole leading to the inside of the sealed container, and the electrode portion connected to the piezoelectric vibrator piece is connected to the external electrode through the through hole. It is possible.
JP 2000-68780 A

  However, in the configuration provided with the through hole as described above, a minute gap is likely to be generated in the through hole due to various factors such as deterioration with time and impact, and outside air enters the sealed container from the gap. There is a problem. When such outside air enters, the vibration characteristics of the piezoelectric vibrator piece are affected. This becomes a more serious problem as more through holes are provided. In addition, if the piezoelectric vibrator is made smaller due to the recent demand for downsizing of portable information terminal devices and the like, it becomes difficult to provide a through hole having a size that functions properly.

  The present invention has been made in view of such circumstances, and a plurality of electrodes for applying a voltage to a piezoelectric vibrator piece can be quickly and easily maintained while maintaining airtightness in a sealed container for a long period of time. It is an object of the present invention to provide a piezoelectric vibrator and a method for manufacturing the same, an oscillator, a radio timepiece, and an electronic device.

In order to solve the above problems, the present invention provides the following means.
The piezoelectric vibrator according to the present invention includes a sealed container in which a plate-shaped lid member and a base member are overlapped and joined in the thickness direction, a piezoelectric vibrator piece provided in the sealed container, and the lid A plurality of electrode portions that are provided on one of the main surfaces of the member on one side of the base member and connected to the piezoelectric vibrator piece to apply a voltage to the piezoelectric vibrator piece; A plurality of extraction electrodes provided on one main surface of the lid member and extending each of the plurality of electrode portions to an edge of one main surface of the lid member, and both main surfaces of the plurality of extraction electrodes An insulating film provided on one main surface arranged on the base member side over the plurality of extraction electrodes, and for insulating each of the plurality of extraction electrodes from each other, and both main surfaces of the insulating film One of the main surfaces disposed on the base member side A first bonding film made of metal for bonding the lid member and the base member, and provided on one of the main surfaces of the main surface of the base member disposed on the lid member side. A second bonding film made of a metal for bonding the lid member and the base member, and a eutectic alloy film provided between the first bonding film and the second bonding film, And an external electrode electrically connected to the plurality of extraction electrodes from a side surface of the sealed container.

  In the piezoelectric vibrator according to the present invention, the lid member and the base member are easily joined via the first and second joining films and the eutectic alloy film, and an external electrode is formed from the side surface of the sealed container. Is done. When an AC voltage is applied to the external electrode, the voltage is applied to the piezoelectric vibrator piece via the extraction electrode and the electrode portion. At this time, since the insulating film is provided at least between the extraction electrode and the first bonding film, conduction between the extraction electrode and the first bonding film can be prevented. Moreover, since the external electrode is connected to the extraction electrode from the side surface of the sealed container, it is not necessary to provide a through hole or the like on the bottom surface of the sealed container. Therefore, the piezoelectric vibrator piece can be operated while keeping the airtightness in the hermetic container high for a long time while being small. This also contributes to further miniaturization and improved reliability of oscillators, electronic devices, radio timepieces and the like provided with this piezoelectric vibrator.

  The piezoelectric vibrator according to the present invention is characterized in that the eutectic alloy film is made of gold and tin.

  In the piezoelectric vibrator according to the present invention, since the eutectic alloy film is made of gold and tin, the lid member and the base member can be reliably bonded and lead-free can be realized.

  The piezoelectric vibrator according to the present invention is characterized in that a eutectic temperature of the eutectic alloy film is set higher than a reflow temperature when mounted on a substrate.

  In the piezoelectric vibrator according to the present invention, since the eutectic temperature of the eutectic alloy film is set higher than the reflow temperature when mounted on the substrate, the eutectic alloy film is melted during the reflow process. It is possible to mount quickly and easily without making it.

Further, the piezoelectric vibrator according to the present invention is characterized in that the plurality of electrode portions are composed of at least three.
The piezoelectric vibrator according to the present invention is characterized in that a plurality of the piezoelectric vibrator pieces are provided.

  In the piezoelectric vibrators according to these inventions, since at least three electrode portions are provided and a plurality of piezoelectric vibrator pieces are provided, various demands such as a device in which the piezoelectric vibrator is incorporated, Can respond widely.

The oscillator according to the present invention is characterized in that the piezoelectric vibrator is electrically connected to an integrated circuit as an oscillator.
The radio timepiece according to the present invention is characterized in that the piezoelectric vibrator is electrically connected to a filter portion.
Furthermore, an electronic apparatus according to the present invention includes the piezoelectric vibrator.

  In the oscillator, the radio timepiece, and the electronic device according to these inventions, the size can be further reduced, the reliability can be improved, and the environmental problems can be improved.

  In addition, the piezoelectric vibrator manufacturing method according to the present invention includes a sealed container in which a plate-shaped lid member and a base member are overlapped and joined in the thickness direction, and a piezoelectric vibrator provided in the sealed container. A piezoelectric vibrator comprising: a piece, wherein one of the principal surfaces of the lid member disposed on the base member side is connected to the piezoelectric vibrator piece and the piezoelectric vibration An electrode forming step of forming a plurality of electrode portions for applying a voltage to the child piece, and a plurality of extraction electrodes each extending the plurality of electrode portions to an edge of one main surface of the lid member; An insulating film forming step for forming an insulating film over the plurality of lead electrodes formed in the electrode forming step, and bonding the lid member and the base member on the insulating film formed in the insulating film forming step Made of metal to make And bonding the lid member and the base member to one of the main surfaces of the main surface of the base member, which is disposed on the lid member side. A second bonding film forming step of forming a second bonding film made of metal, and a connecting step of electrically connecting the piezoelectric vibrator piece to a plurality of electrode portions formed in the electrode forming step And at least one of the first bonding film formed in the first bonding film forming step and the second bonding film formed in the second bonding film forming step. A film forming step of forming a eutectic alloy film made of metal or a laminated metal film in which a plurality of metals are laminated, and the lid member sandwiching the eutectic alloy film or laminated metal film formed in this film forming step A state in which the base member is overlaid A eutectic bonding step in which the eutectic alloy film or the laminated metal film is heated to eutectic-bond the lid member and the base member, and the lid member and the base member that are eutectic bonded in the eutectic bonding step An external electrode forming step of forming an external electrode electrically connected to the extraction electrode from a side surface of the sealed container.

According to the method for manufacturing a piezoelectric vibrator according to the present invention, in the electrode forming step, a plurality of electrode portions and a plurality of lead electrodes are formed on one main surface of the lid member. An insulating film is formed over the extraction electrode. Then, in the first bonding film forming step, the first bonding film is formed on the insulating film, and in the second bonding film forming step, the second bonding film is formed on one main surface of the base member. The Further, in the connecting step, the piezoelectric vibrator is electrically connected to the electrode portion, and in the film forming step, the eutectic alloy film is formed on at least one of the first bonding film and the second bonding film. Alternatively, a laminated metal film is formed. Then, in the eutectic bonding step, the eutectic alloy film or the laminated metal film is heated in a state where the lid member and the base member are overlapped with the eutectic alloy film or the laminated metal film interposed therebetween, and the lid member and the base member are heated. And eutectic bonding. Further, in the external electrode forming step, the external electrode is electrically connected to the extraction electrode from the side surface of the sealed container.
Accordingly, since the insulating film is provided between the extraction electrode and the first bonding film, a piezoelectric vibrator that prevents conduction between the extraction electrode and the first bonding film can be obtained. Further, since the external electrode is connected to the extraction electrode from the side surface of the sealed container, there is no need to provide a through hole or the like on the bottom surface of the sealed container.

  In the piezoelectric vibrator manufacturing method according to the present invention, the eutectic temperature of the eutectic alloy film or the laminated metal film formed in the film forming step is a reflow temperature when the piezoelectric vibrator is mounted on a substrate. In the eutectic bonding step, the heating temperature is set higher than the reflow temperature.

According to the method for manufacturing a piezoelectric vibrator according to the present invention, the eutectic temperature of the eutectic alloy film or the laminated metal film is set to be higher than the reflow temperature when the piezoelectric vibrator is mounted on the substrate. In the process, the heating temperature is set higher than the reflow temperature.
Therefore, it is possible to obtain a crystal resonator that can be mounted quickly and easily without melting the eutectic alloy film during the reflow process.

  According to the present invention, since it is possible to prevent the extraction electrode and the first bonding film from conducting without providing a through hole or the like, the piezoelectricity is maintained while maintaining the airtightness in the sealed container for a long period of time. A plurality of electrodes for applying a voltage to the vibrator piece can be provided quickly and easily.

(Embodiment 1)
Hereinafter, a crystal resonator (piezoelectric resonator) according to a first embodiment of the present invention will be described with reference to the drawings.
In FIG. 1, reference numeral 1 denotes a crystal resonator.
The crystal resonator 1 includes a sealed container 2 formed in a substantially rectangular shape, and a crystal resonator piece (piezoelectric vibrator piece) 3 provided in the sealed container 2.

  The quartz crystal resonator element 3 is configured as a tuning fork type oscillator element in which two resonating arm portions 3a (shown in FIG. 18) extending in parallel are integrally connected on the base end side. The base end portion of the quartz crystal resonator element 3 is electrically connected to an electrode unit 15 described later, thereby being cantilevered and fixed in the sealed container 2. The crystal resonator element 3 is made of crystal, and vibrates at a predetermined frequency by applying a voltage.

Further, the sealed container 2 is configured by a substantially rectangular plate-shaped lid member 6 and a base member 7 being overlapped with each other in the thickness direction.
The lid member 6 and the base member 7 are made of glass such as soda lime glass.
A rectangular lid-side concave portion 10 is formed on one main surface 6 a disposed on the base member 7 side (inner side of the sealed container 2) among both main surfaces of the lid member 6. Similarly, a rectangular base-side concave portion 11 is formed on one main surface 7a disposed on the lid member 6 side (the inner side of the sealed container 2) among the two main surfaces of the base member 7. . The lid member 6 and the base member 7 are joined with the one main surface 6a and the one main surface 7a being overlapped with each other with the lid-side recess 10 and the base-side recess 11 facing each other. Thus, by making the lid-side recess 10 and the base-side recess 11 face each other, a cavity 12 is formed in the sealed container 2, and the cavity 12 allows vibration of the crystal resonator element 3. It is like that. The airtight container 2 is hermetically sealed, and the cavity 12 is maintained in a vacuum state.

On one main surface 6a of the lid member 6, an electrode part 15 to which the crystal resonator element 3 is electrically connected and these two electrode parts 15 are extended to the edge part of the one main surface 6a. A lead electrode 16 is provided.
The electrode portion 15 and the extraction electrode 16 are made of a conductive member such as Cr or Ti. As shown in FIG. 7, two electrode portions 15 are provided side by side on one end side in the length direction of the lid-side concave portion 10, and these two electrode portions 15 apply a voltage to the crystal resonator element 3. It functions as positive and negative electrode terminals for application. The extraction electrodes 16 are provided at both ends in the width direction (length direction) W of the lid member 6, and the extraction electrodes 16 at both ends are provided over the entire length in the depth direction D. Of the lead electrodes 16 at both ends, one lead electrode 16a is formed integrally with one electrode portion 15a. On the other hand, the other lead electrode 16b includes a lead portion 17, and this lead portion 17 is formed integrally with the other electrode portion 15b. Of the one main surface 6a, the surface on which the electrode portion 15 and the extraction electrode 16 extend is an electrode surface 25, and the other surface on which the electrode portion 15 and the extraction electrode 16 do not extend is a non-electrode. Surface 26 is formed.

Furthermore, the crystal resonator 1 in the present embodiment includes an insulating film 22 (shown in FIG. 1) made of, for example, SiO ₂ or SiN. As shown in FIG. 9, the insulating film 22 is provided across the two extraction electrodes 16 on one main surface 16 c disposed on the base member 7 side among the two main surfaces of the extraction electrode 16. That is, the insulating film 22 is provided so as to extend over the one main surface 16 c and the non-electrode surface 26 of the extraction electrode 16, and the entire circumference of the edge of the one main surface 6 a of the lid member 6 including the extraction electrode 16. It is provided over. In the insulating film 22, a recess 22 b shown in FIG. 2 is formed in a portion extending over the region of the non-electrode surface 26. Further, the four corners of the insulating film 22 are removed in accordance with the arc shape of the external terminal connection portion 21 described later.

  Further, as shown in FIG. 2, of the two main surfaces of the insulating film 22, one main surface 22 a disposed on the base member 7 side has a first made of chromium (Cr), nickel (Ni), or the like. A bonding film 19 is provided. In the first bonding film 19, a similar recess 19 a is provided according to the recess 22 b of the insulating film 22. A second bonding film 20 made of chromium (Cr), nickel (Ni), or the like is provided on one main surface 7a of the base member 7. The second bonding film 20 is formed flat. The four corners of the first bonding film 19 and the second bonding film 20 are removed in an arc shape.

Further, a eutectic alloy film 28 made of a eutectic alloy is provided between the first bonding film 19 and the second bonding film 20, and the lid member 6 and the base member 7 are eutectic bonded. ing. Further, since the first bonding film 19 is provided with a recess 19 a and the second bonding film 20 is formed flat, between the first bonding film 19 and the second bonding film 20. A clearance is formed, but a eutectic alloy film 28 is provided so as to fill the clearance. That is, the film thickness of the eutectic alloy film 28 is different between the portion located in the depression 19a and the other portions, and the thickness of the portion located in the depression 19a is large.
Further, the eutectic alloy film 28 is made of gold (Au) and tin (Sn), and the eutectic temperature is set to 280 ° C. This eutectic temperature is higher than the maximum reflow temperature when the crystal unit 1 is mounted on the substrate by the reflow process. For example, the maximum temperature of reflow is 260 ° C., and the quartz crystal unit 1 is mounted by being placed in this 260 ° C. environment for about 10 seconds.

Further, the four corners of the base member 7 are notched in an arc shape, and external terminal connection portions 21 are provided following this arc shape (shown in FIG. 5).
The external terminal connection portion 21 is provided with an external terminal (external electrode) 27. One end of the external terminal 27 in the height direction H of the sealed container 2 is electrically connected to the extraction electrode 16, and the other end is connected to the bottom surface of the sealed container 2 (the other main surface of the base member 7). It extends to. That is, the external terminal 27 is connected to the extraction electrode 16 from the side surface of the sealed container 2. The external terminals 27 are formed in pairs. That is, the external terminal 27 extends between two external terminal connection portions 21 formed on one end side in the width direction W among the four external terminal connection portions 21 as shown in FIG. Similarly, it extends between the two external terminal connection portions 21 formed on the other end side in the width direction W. The pair of external terminals 27 are connected to the one extraction electrode 16 a or the other extraction electrode 16 b described above, and function as positive and negative external electrodes for applying a voltage to the crystal resonator element 3. It has become.

  Under such a configuration, when a predetermined voltage is applied to the external terminal 27, the voltage is applied to the crystal resonator element 3 via the extraction electrode 16 and the electrode portion 15. Then, due to the piezoelectric effect, the vibrating arms 3a bend and move with a predetermined period in a direction in which they approach or separate from each other, that is, in a reverse phase mode.

Next, a method for manufacturing the crystal unit 1 in the present embodiment will be described.
First, the lid member 6 is formed and processed. That is, as shown in FIGS. 3 and 4, the lid wafer 30 made of glass is polished and cleaned until it reaches a predetermined thickness. Then, the work-affected layer on the outermost surface is removed by etching or the like. Further, a plurality of lid-side recesses 10 are formed on one main surface 30a of the lid wafer 30 by etching or the like. 3 and 4, only one lid-side recess 10 is clearly shown for simplification, but actually, a plurality of lid-side recesses are formed on one main surface 30a of the lid wafer 30. 10 are continuously formed in the matrix direction. That is, the lid portion wafer 30 is formed by integrally forming a plurality of lid members 6. Here, the lid portion wafer 30 corresponds to the lid member 6. Further, one main surface 30 a of the lid portion wafer 30 corresponds to one main surface 6 a of the lid member 6.

Further, the base member 7 is formed and processed. That is, similarly to the lid member 6, as shown in FIGS. 5 and 6, a plurality of base side recesses 11 are formed on one main surface 31 a of the base wafer 31 made of glass. Here, the base wafer 31 corresponds to the base member 7, and one main surface 31 a of the base wafer 31 corresponds to one main surface 7 a of the base member 7.
Furthermore, through holes 32 are provided in each of the four corners of the rectangle when each base-side recess 11 is enclosed in a rectangle with a predetermined size. The through hole 32 is divided into four parts in a dicing process described later. The four parts are used as the external terminal connection part 21 described above.

Furthermore, the quartz crystal piece 3 (shown in FIG. 18) of the tuning fork type is formed and processed by polishing or etching the artificial quartz.
Then, as shown in FIGS. 7 and 8, the electrode portion 15 and the extraction electrode 16 are formed on one main surface 30a of the lid portion wafer 30 (electrode formation step). That is, an electrode layer is formed on one main surface 30a by sputtering or vapor deposition, and the electrode portion 15 and the extraction electrode 16 are integrally patterned by etching or the like.

Further, as shown in FIGS. 9 and 10, an insulating film 22 is formed (insulating film forming step). That is, the insulating film 22 is formed on the entire periphery of the edge of the one main surface 30a including the surface of the extraction electrode 16 over the plurality of extraction electrodes 16 by sputtering, vapor deposition, vapor phase growth method, coating method, or the like. The insulating film 22 is thicker than the extraction electrode 16 and is about several μm. Then, in accordance with the through hole 32 formed in the base wafer 31, the four corners of the insulating film 22 are removed in an arc shape by photolithography patterning. Similarly, the insulating films on the surfaces of the electrode portion 15 and the lid-side recess 10 are also removed.
Here, as shown in FIG. 11, since the lead electrode 16 is provided on one main surface 30a, the one main surface 16c of the lead electrode 16 is equivalent to the thickness h of the lead electrode 16. A difference in height occurs between the non-electrode surface 26 and the non-electrode surface 26. Therefore, when the insulating film 22 is formed over the plurality of extraction electrodes 16, a difference in height occurs on the surface of the insulating film 22. The lowered portion of the insulating film 22 becomes the above-described depression 22b.

Then, as shown in FIGS. 12 and 13, a first bonding film 19 is formed (first bonding film forming step). That is, the first bonding film 19 is formed on the insulating film 22 (one main surface 22a of the insulating film 22) by sputtering or vapor deposition. Then, four corners of the first bonding film 19 are removed in an arc shape according to the insulating film 22 by patterning by photolithography. Similarly, the first bonding film 19 on the surfaces of the electrode portion 15 and the lid-side recess 10 is also removed.
As shown in FIG. 13, the first bonding film 19 includes a first base film 33 provided on the insulating film 22 and a first bonding film 34 provided on the first base film 33. And a two-layer structure. The first base film 33 is made of a metal such as chromium (Cr) and has a thickness of about 50 to 500 angstroms. The first bonding film 34 is made of a metal such as gold (Au) and has a thickness of 1000 angstroms. In the first base film 33 and the first bonding film 34, recesses 33 a and 34 a are formed in accordance with the recess 22 b of the insulating film 22, respectively.

Further, as shown in FIGS. 14 and 15, the second bonding film 20 is formed (second bonding film forming step). That is, the second bonding film 20 is formed on the entire circumference of one main surface 31a of the base wafer 31 by sputtering, vapor deposition, or the like. Then, four corners of the second bonding film 20 are removed in an arc shape according to the through hole 32 by patterning by photolithography.
As shown in FIG. 15, the second bonding film 20 includes a second base film 41 provided on one main surface 31 a of the base wafer 31, and a second base film 41 provided on the second base film 41. It has a two-layer structure with two bonding films 42. The second base film 41 is made of a metal such as chromium (Cr) and has a thickness of about 50 to 500 angstroms. The second bonding film 42 is made of a metal such as gold (Au) and has a thickness of 1000 angstroms. The second base film 41 and the second bonding film 42 are formed flat.

  Then, as shown in FIGS. 16 and 17, a eutectic alloy film 45 made of a eutectic alloy is provided (film forming step). That is, the eutectic alloy film 45 is formed on the second bonding film 20 by, for example, screen printing. The eutectic alloy film 45 is made of a eutectic alloy of gold and tin, the weight ratio of gold and tin is set to 8: 2, and the eutectic temperature is 280 ° C. Further, the eutectic alloy film 45 at this time is formed flat and has a film thickness of several tens of μm. The eutectic temperature is higher than the maximum temperature during the reflow process.

As shown in FIGS. 18 and 19, the base end portion of the crystal resonator element 3 is electrically connected to the electrode portion 15 formed in the electrode formation step (connection step). Thereby, the crystal oscillator piece 3 is fixed.
Next, as shown in FIG. 20, the lid wafer 30 and the base wafer 31 are eutectic bonded (eutectic bonding step). That is, in vacuum, the base wafer 31 is overlaid on the lid wafer 30 so as to cover the crystal resonator element 3 and the like. At this time, the respective lid-side recesses 10 and the base-side recesses 11 face each other, whereby a cavity 12 is formed. At this time, the eutectic alloy film 45 is overlaid on the first bonding film 19. Since the eutectic alloy film 45 is formed flat and the first bonding film 19 has depressions 33a and 34a, the eutectic alloy film 45 is formed between the first bonding film 19 and the eutectic alloy film 45. Clearances C ₁ and C ₂ are formed.

In this manner, the entire periphery is heated in a state where the lid wafer 30 and the base wafer 31 are overlapped and a predetermined pressure is applied. When the ambient temperature rises and the eutectic alloy film 45 reaches 280 ° C., the eutectic alloy film 45 melts and liquefies. The temperature at the time of liquefaction becomes the eutectic temperature, which is higher than the maximum temperature during the reflow treatment. When the eutectic alloy layer 45 is liquefied, since itself becomes deformable in response to the space, as shown in FIG. 21, the liquefied eutectic alloy, according to the shape of such clearance C _1, C ₂ And the clearances C ₁ and C ₂ are filled. Further, the gold of the first bonding film 34 and the second bonding film 42 diffuses into the liquefied eutectic alloy. Then, when the entire periphery of the lid wafer 30 and the base wafer 31 is cooled, the liquefied eutectic alloy is solidified and the lid wafer 30 and the base wafer 31 are eutectic bonded. The solidified eutectic alloy at this time becomes the eutectic alloy film 28. The difference between the eutectic alloy film 45 and the eutectic alloy film 28 is the difference before and after the film forming process. That is, while the eutectic alloy film 45 is flat, the eutectic alloy film 28 fills the clearances C ₁ , C _2, etc., so that the film thickness becomes larger at the depressions 33 a, 34 a as described above. ing. The eutectic alloy film 45 has a weight ratio of gold to tin of 8: 2, but the eutectic alloy film 28 diffuses gold in the first bonding film 34 and the second bonding film 42. As a result, the weight ratio of gold has increased.
Thus, the lid wafer 30 and the base wafer 31 are thermally expanded by the temperature rise until the ambient temperature of the lid wafer 30 and the base wafer 31 rises to normal temperature. It shrinks by cooling and is restored.

  Next, as shown in FIGS. 22 and 23, external terminals 27 are provided in the respective sealed containers 2 (external electrode forming step). That is, a metal mask is applied to the other main surface of the base wafer 31, and a thin film is formed by sputtering or vapor deposition. Thus, a pair of external terminals 27 extending from the inner surface of the through hole 32 to the other main surface of the base wafer 31 is provided. The external terminals 27 are connected to the four corners of the extraction electrode 16 through the through holes 32.

Further, in the dicing process, the lid wafer 30 and the base wafer 31 are cut. That is, the lid wafer 30 and the base wafer 31 after the external electrode forming step are placed on a dicing saw, and a straight line connecting the through holes 32 is cut in a matrix direction by a dicing blade. Thereby, the through hole 32 is divided into four parts, and each of the divided parts becomes the arc-shaped external terminal connection part 21 as described above.
Then, when the top and bottom of each cut are inverted, the crystal resonator 1 shown in FIG. 1 is obtained.

As described above, according to the crystal resonator 1 of the present embodiment, since the insulating film 22 is provided between the extraction electrode 16 and the first bonding film 19, the first bonding film 19 and the extraction electrode 16 are provided. Are insulated from each other and do not interfere with each other. Therefore, the extraction electrode 16 and the first bonding film 19 can be prevented from conducting. In addition, the external terminal connection portion 21 is formed by dividing the through hole 32, and the external terminal 27 is connected to the extraction electrode 16 from the side surface of the sealed container 2 through the external terminal connection portion 21. The through hole 32 can be left on the other main surface of the base member 7. Therefore, outside air does not enter from the gap of the through hole.
Therefore, it is possible to easily provide a plurality of electrodes for applying a voltage to the crystal resonator element 3 while maintaining the hermeticity in the sealed container 2 for a long period of time.

Further, as shown in FIG. 11, the surface of the insulating film 22 has a height difference, and a recess 22 b is formed in the insulating film 22. Therefore, in order to seal the lid member 6 and the base member 7, the insulating film 22 is sealed. The lid member 6 and the base member 7 need to be in close contact with each other without any gap, but according to the crystal resonator 1 in the present embodiment, the step of flattening can be made unnecessary. That is, since the eutectic alloy film 45 is melted and liquefied, the clearances C ₁ , C _2, etc. can be easily closed, so that the height difference of the insulating film 22 is allowed, and the lid wafer 30 and the base wafer 31 can be easily and quickly joined.
Furthermore, since the eutectic alloy films 28 and 45 are made of gold and tin, the lid wafer 30 and the base wafer 31 can be reliably bonded and lead-free can be realized.

Further, since the eutectic temperature of the eutectic alloy films 28 and 45 is set higher than the maximum temperature during the reflow process when mounted on the substrate, the eutectic alloy film 28 is melted during the reflow process. Therefore, the crystal unit 1 can be mounted quickly and easily.
Further, since the lid member 6 and the base member 7 are made of the same member called glass, the thermal expansion coefficients of the lid member 6 and the base member 7 can be matched. Therefore, in the eutectic bonding step, the deformation amounts at the time of thermal expansion and contraction can be matched, and the lid member 6 and the base member 7 can be bonded accurately and reliably.

(Embodiment 2)
Next, a second embodiment of the present invention will be described.
24 to 27 show a second embodiment of the present invention.
24 to 27, the same components as those shown in FIGS. 1 to 23 are denoted by the same reference numerals, and the description thereof is omitted.
This embodiment and the first embodiment have the same basic configuration, and only the differences will be described here.

  In the present embodiment, as shown in FIG. 24, the lid-side recess 10 is divided into two in the width direction W, and two pairs of electrode portions 15 are formed in the partitioning portion 36 that divides the lid-side recess 10. Is provided. The sorting portion 36 constitutes one main surface 6 a of the lid member 6. In addition, each electrode portion 15 extends to four corners of one main surface 6 a via the lead-out portion 17. These electrode portions 15 are provided with angular velocity sensors (piezoelectric vibrator pieces) 37 shown in FIG.

  When quartz is used as the piezoelectric element of the angular velocity sensor 37, it has highly stable electrical characteristics against changes in environmental temperature. The angular velocity sensor 37 has a base portion 37b at the center in the length direction thereof, a pair of vibrating arm portions 37a for vibration extending in one direction from the base portion 37b, and a base portion facing the pair of vibrating arm portions 37a. This is a structure having a pair of vibrating arms 37a for detection extending from 37b to the opposite side, and the appearance is H-shaped when seen from the plane. The operating principle of the H-type angular velocity sensor (piezoelectric vibration gyro) 37 will be briefly described below.

  An excitation electrode (not shown) is formed on the vibrating arm portion 37a for vibration. When a predetermined AC voltage is applied, an electric field is generated in the depth direction D, and the pair of vibrating arm portions 37a are bent. Do exercise. In this state, when the rotational angular velocity ω acts around the axis extending in the width direction W, a Coriolis force corresponding to the rotational angular velocity ω acts in a direction perpendicular to the vibration direction, and the vibrating arm portion 37a moves in the height direction. Vibrate to H. This vibration is transmitted to the vibration arm part 37a for detection via the base part 37b, and the pair of vibration arm parts 37a for detection also vibrate at the resonance frequency. The vibration arm portion 37a for detection is provided with an electrode pad (not shown) for vibration detection on its side surface, and an AC voltage generated according to compression and tensile deformation of the vibration arm portion 37a for detection is provided. Detect electrical signals. By extracting the detected electrical signal to a circuit (not shown) outside the package and processing it, it becomes possible to know the rotational angular velocity ω and its rotational direction.

Four external terminals are required to connect electrical signals between the detection element and an external circuit. That is, the sum of a pair of external terminals for applying an AC voltage to the vibrating arm portion 37a for vibration and a pair of external terminals for connecting to the electrode pads of the vibrating arm portion 37a for detection and taking out a detection signal. There will be four. The two pairs of electrode portions 15 described above are connected to a total of four external terminals.
Alternatively, although not shown, it is also possible to arrange a semiconductor integrated circuit in the sealed container 2 and perform signal processing. In this case, the detection element is electrically connected to the semiconductor integrated circuit. The number of connections between the semiconductor integrated circuit and the circuit outside the sealed container 2 is, for example, “VDD (DC voltage)”, “GND”, “VOUT”, “VREF”, and “startup”.

  Such a crystal unit 1 is manufactured as follows. That is, as shown in FIG. 24, the lid-side concave portion 10 divided into two via the dividing portion 36 is formed on one main surface 30 a of the lid portion wafer 30. In the electrode forming step, the two pairs of electrode portions 15 are formed in the partitioning portion 36, and the lead electrodes 16 extending from the electrode portion 15 to four corners are integrally formed on one main surface 30a. . Then, after the insulating film forming step and the first bonding film forming step shown in FIGS. 25 and 26, as shown in FIG. 27, the H-shaped angular velocity sensor 37 is electrically connected to the electrode portion 15 in the connecting step. To do. Further, the crystal resonator 1 is manufactured in the same manner as described above.

  As described above, even in the angular velocity sensor 37 that requires four or more external terminals, the electrode can be easily pulled out by the present invention. Therefore, a decrease in mechanical strength of the base member 7 can be suppressed as compared with the conventional method in which a large number of through holes are provided on the bottom surface of the base member 7. Therefore, the angular velocity sensor 37 can be stably operated over a long period.

In the first and second embodiments, the first and second base films 33 and 41 are made of chromium. However, the present invention is not limited to this and can be changed as appropriate. For example, it may be made of nickel (Ni).
In addition, although the first and second bonding films 34 and 42 are made of gold, the present invention is not limited to this and can be changed as appropriate.
Further, although the eutectic alloy film 45 is provided on the second bonding film 20, the present invention is not limited to this, and the eutectic alloy film 45 may be provided on the first bonding film 19 or the first and second bonding films. It may be provided on both of the films 19 and 20.
Further, although the eutectic alloy film 45 is provided by screen printing, it is not limited to this and can be changed as appropriate.

Further, although the eutectic alloy film 45 is made of gold and tin, the present invention is not limited to this and can be changed as appropriate. For example, it may be made of gold (Au) and silicon (Si). In this case, if the weight ratio of gold to silicon is 94: 6 and the eutectic temperature is 370 ° C., it is preferable in that it becomes higher than the maximum temperature (260 ° C.) during the reflow treatment. Further, it may be made of gold (Au) and germanium (Ge). In this case, the weight ratio of gold to germanium is preferably 88:12 and the eutectic temperature is preferably 356 ° C. Further, it may be made of aluminum (Al) and zinc (Zn). In this case, the weight ratio of aluminum to zinc is preferably 5:95 and the eutectic temperature is preferably 382 ° C.
If the maximum temperature during the reflow process is lower, a eutectic alloy composed of tin (Sn) and silver (Ag) can be used. In this case, the weight ratio of tin and silver can be 96.5: 3.5, and the eutectic temperature can be 221 ° C. Furthermore, a eutectic alloy composed of tin (Sn), silver (Ag), and copper (Cu) can be used. In this case, the weight ratio of tin, silver, and copper can be 96.5: 3.0: 0.5, and the eutectic temperature can be 227 ° C.

  In the film forming step, the eutectic alloy film 45 is formed. Instead, a laminated metal film in which a plurality of metals are laminated may be formed. In addition to laminating gold and tin, the laminated metal film may be a combination of the above metals.

Moreover, although the electrode part 15 and the extraction electrode 16 are made of conductive members such as Cr and Ti, for example, the members are not limited to this, and the members can be changed as appropriate. In this case, the conductive member is preferably made of a material that can be easily combined with the lid member 6.
The members of the insulating film 22 and the first and second bonding films 19 and 20 can be changed as appropriate.
Further, the plurality of crystal resonators 1 are manufactured in a lump using the lid wafer 30 and the base wafer 31, but the present invention is not limited to this, and may be manufactured individually.
Further, although the piezoelectric vibrator piece is the crystal vibrator piece 3 made of quartz, the present invention is not limited thereto, and vibrator pieces made of various piezoelectric single crystal materials such as lithium niobate may be used.
Furthermore, although the angular velocity sensor 37 is provided, the present invention is not limited to this, and a vibrator piece for various sensors for measuring other physical quantities, a thickness sliding vibrator piece (AT cut, BT cut), and other cuts. An angular vibrator piece may be used. Furthermore, a surface acoustic wave element may be used.

  Further, the pattern of the extraction electrode 16 and the number of the electrode portions 15 can be appropriately changed. For example, as shown in FIG. 28, two pairs of electrode portions 15 can be arranged in the width direction W at the long side edge portion of the lid-side concave portion 10. Then, after the insulating film forming step and the first bonding film forming step shown in FIGS. 29 and 30, as shown in FIG. 31, in the connecting step, the crystal resonator pieces 3 are respectively applied to the pair of electrode portions 15. Connect electrically. That is, two crystal resonator pieces 3 are provided. Note that the number of crystal resonator pieces 3 may be two or more, and the number of crystal resonator pieces 3 may be changed as appropriate.

(Embodiment 3)
Next, a third embodiment of the present invention will be described with reference to FIG.
In FIG. 32, reference numeral 38 denotes an oscillator according to the third embodiment of the present invention.
The oscillator 38 is configured by using the crystal resonator 1 of the first or second embodiment as an oscillator.
The oscillator 38 includes a substrate 40 on which an electronic component 39 such as a capacitor is mounted. An integrated circuit 43 for an oscillator is mounted on the substrate 40, and the crystal unit 1 is mounted in the vicinity of the integrated circuit 43. The electronic component 39, the integrated circuit 43, and the crystal unit 1 are electrically connected by a wiring pattern (not shown). Each component is molded with a resin (not shown).

Under such a configuration, when a voltage is applied to the crystal unit 1, the above-mentioned crystal unit piece vibrates, and the vibration is converted into an electric signal by the piezoelectric characteristics of the crystal, and the integrated circuit 43 is electrically connected. Input as a signal. The input electrical signal is subjected to various processes by the integrated circuit 43 and output as a frequency signal. Thereby, the crystal unit 1 functions as an oscillator.
Further, by selectively setting the configuration of the integrated circuit 43, for example, an RTC (real-time clock) module or the like as required, the operating date and time of the device and external device can be set in addition to a single-function oscillator for a clock. Functions such as control and provision of time and calendar can be provided.

  As described above, according to the oscillator 38 in the present embodiment, not only can the same effect as the crystal resonator 1 according to the first or second embodiment described above be obtained, but also a highly accurate frequency signal that is stable over a long period of time can be obtained. Obtainable.

Next, a modification of the third embodiment of the present invention will be described with reference to FIG.
In FIG. 33, reference numeral 380 denotes an oscillator according to a modification of the third embodiment of the present invention.
The oscillator 380 is configured such that the crystal resonator element 3 is used as an oscillator and the integrated circuit 43 is also mounted in the sealed container 2.
The oscillator 380 includes four extraction electrodes 16. The four lead electrodes 16 function as a power supply terminal, a ground terminal, and two frequency output terminals (a pair), respectively.
An integrated circuit 43 that is an oscillation circuit component is provided in the sealed container 2. The integrated circuit 43 is electrically connected to the four extraction electrodes 16 and the crystal resonator element 3.

The oscillator 380 is manufactured as follows. That is, the integrated circuit 43 is attached in the integrated circuit attaching step before or after the connecting step. Then, the lid member 6 and the base member 7 are eutectic bonded as described above, whereby the oscillator 380 is obtained.
Here, it is necessary to finally finely adjust the frequency of the crystal resonator element 3 of the obtained oscillator 380. Therefore, in the frequency adjustment step, a laser is irradiated from the outside of the hermetic container 2 to the metal film provided on the vibrating arm portion 3 a of the crystal resonator element 3. The laser transmitted through the glass of the sealed container 2 reaches the metal film and evaporates the metal film. Then, the frequency of the crystal resonator element 3 is finely adjusted by trimming.

According to the oscillator 380 in the present embodiment, in the frequency adjustment step, the frequency is adjusted while applying a voltage to the integrated circuit 43 via the external terminal 27 to vibrate the vibrating arm portion 3a and monitoring the frequency. be able to. Therefore, adjustment with high frequency accuracy is possible.
Further, according to the oscillator 380 in the present embodiment, not only can the same effect as the crystal resonator 1 according to the first or second embodiment described above be obtained, but also a stable and highly accurate frequency signal can be obtained over a long period of time. be able to.
Further, similarly to the third embodiment, it is possible to provide the same function by selectively setting the configuration of the integrated circuit 43 according to the request, such as the RTC module.
The crystal resonator element 3 is not limited to the tuning fork type, but may be a thickness-sliding vibration element (AT cut or BT cut) or other vibration mode (SC cut or GT cut).

(Embodiment 4)
Next, a fourth embodiment of the present invention will be described.
In the present embodiment, a portable information device will be described as an electronic device including the crystal unit 1 in the first or second embodiment.
In FIG. 34, the code | symbol 46 shows a portable information device, The functional structure of the portable information device 46 is demonstrated with reference to FIG.

The portable information device 46 includes a power supply unit 47 for supplying power. The power supply unit 47 is made of, for example, a lithium secondary battery.
The power supply unit 47 includes a control unit 48 that performs various controls, a clock unit 51 that counts time, a communication unit 52 that communicates with the outside, a display unit 56 that displays various types of information, and respective functions. A voltage detection unit 53 for detecting the voltage of the unit is connected in parallel. The power supply unit 47 supplies power to each functional unit.

  The control unit 48 controls each function unit to control the operation of the entire system such as transmission and reception of audio data, measurement and display of the current time, and the like. The control unit 48 includes a ROM in which a program is written in advance, a CPU that reads and executes the program written in the ROM, and a RAM that is used as a work area for the CPU.

  The timer unit 51 includes an integrated circuit including an oscillation circuit, a register circuit, a counter circuit, an interface circuit, and the like, and the crystal unit 1. When a voltage is applied to the crystal unit 1, the above-described crystal unit piece vibrates, and the vibration is converted into an electric signal by the piezoelectric characteristics of the crystal and input to the oscillation circuit as an electric signal. The output of the oscillation circuit is binarized and counted by a register circuit and a counter circuit. Then, signals are transmitted to and received from the control unit 48 via the interface circuit, and the current time, current date, calendar information, etc. are displayed on the display unit 56.

The communication unit 52 has functions similar to those of a conventional mobile phone, and includes a radio unit 57, a voice processing unit 58, a switching unit 61, an amplification unit 62, a voice input / output unit 63, a telephone number input unit 66, and a ring tone generation unit. 67 and a call control memory unit 68.
The wireless unit 57 exchanges various data such as audio data with the base station via an antenna. The audio processing unit 58 encodes and decodes the audio signal input from the radio unit 57 or the amplification unit 62. The amplifying unit 62 amplifies the signal input from the audio processing unit 58 or the audio input / output unit 63 to a predetermined level. The voice input / output unit 63 includes a speaker, a microphone, and the like, and amplifies a ringtone and a received voice or collects a speaker voice.

  In addition, the ring tone generator 67 generates a ring tone in response to a call from the base station. The switching unit 61 switches the amplifying unit 62 connected to the voice processing unit 58 to the ringing tone generating unit 67 only when an incoming call is received, so that the ringing tone generated in the ringing tone generating unit 67 causes the amplifying unit 62 to be switched. To the voice input / output unit 63. The call control memory unit 68 stores a program related to incoming / outgoing call control of communication. The telephone number input unit 66 includes, for example, number keys from 0 to 9 and other keys. By pressing these number keys, the telephone number of the call destination is input.

  When the voltage applied to each functional unit such as the control unit 48 by the power supply unit 47 falls below a predetermined value, the voltage detection unit 53 detects the voltage drop and notifies the control unit 48 of the voltage drop. . The predetermined voltage value at this time is a value set in advance as a minimum voltage necessary to stably operate the communication unit 52, and is, for example, about 3V. Upon receiving the voltage drop notification from the voltage detection unit 53, the control unit 48 prohibits the operations of the radio unit 57, the voice processing unit 58, the switching unit 61, and the ring tone generation unit 67. In particular, it is essential to stop the operation of the wireless unit 57 with high power consumption. Further, the display unit 56 displays that the communication unit 52 has become unusable due to insufficient battery power.

That is, the operation of the communication unit 52 can be prohibited by the voltage detection unit 53 and the control unit 48, and that effect can be displayed on the display unit 56. This display may be a text message, but as a more intuitive display, a x (X) mark may be attached to the telephone icon displayed at the top of the display surface of the display unit 56.
In addition, the crystal unit 1 includes a power cutoff unit 69 that can selectively cut off the power supply of the portion related to the function of the communication unit 52, and the function of the communication unit 52 can be reduced by the power cutoff unit 69. Stop surely.

  As described above, according to the portable information device 46 of the present embodiment, not only can the same effect as the crystal resonator 1 according to the first or second embodiment described above be achieved, but also a highly accurate time measurement that is stable over a long period of time. Information can be displayed.

(Embodiment 5)
Next, a fifth embodiment of the present invention will be described.
In the present embodiment, a radio-controlled timepiece will be described as an electronic device including the crystal unit 1 in the first or second embodiment.
In FIG. 35, reference numeral 71 denotes a radio timepiece.

  The radio clock 71 is a clock having a function of receiving a standard radio wave including time information and automatically correcting and displaying the correct time. In Japan, there are transmitting stations (transmitting stations) that transmit standard radio waves to Fukushima Prefecture (40 KHz) and Saga Prefecture (60 KHz), each transmitting standard radio waves. Long waves such as 40 KHz or 60 KHz have the property of propagating the surface of the earth and the property of propagating while reflecting the ionosphere and the surface of the earth, so the propagation range is wide and the above two transmitting stations cover all of Japan. .

A functional configuration of the radio timepiece 71 will be described with reference to FIG.
The antenna 74 receives the long standard wave of 40 KHz or 60 KHz. The long standard radio wave is obtained by subjecting time information called a time code to AM modulation on the 40 KHz or 60 KHz carrier wave.
The received long standard wave is amplified by the amplifier 75 and filtered and tuned by the filter (filter unit) 80 having the crystal resonator 1. The crystal resonator 1 in this embodiment includes crystal resonator portions 76 and 79 having the same resonance frequency of 40 KHz and 60 KHz as the carrier frequency.
Further, the filtered signal having a predetermined frequency is detected and demodulated by the detection and rectification circuit 81. Subsequently, the time code is taken out via the waveform shaping circuit 84 and counted by the CPU 85. The CPU 85 reads information such as the current year, accumulated date, day of the week, and time. The read information is reflected on the RTC 86, and accurate time information is displayed.

Since the carrier wave is 40 KHz or 60 KHz, the crystal vibrator portions 76 and 79 are preferably vibrators having the tuning fork type structure described above. Taking 60 KHz as an example, it is possible to configure the tuning fork vibrator piece as a dimension example having a total length of about 2.8 mm and a base width dimension of about 0.5 mm.
In the circuit block diagram shown in FIG. 35, crystal resonator units 76 and 79 having resonance frequencies of 40 KHz and 60 KHz are respectively drawn in parallel. In the present invention, since the tuning fork type crystal resonator piece corresponding to these two frequencies can be stored in one package, the mounting area is larger than when mounting two resonators stored in separate containers. It can be greatly reduced. Therefore, it is particularly suitable for electronic devices that require downsizing, such as watches and portable devices.

Although the above description has been given with an example in Japan, the frequency of the long standard radio wave is different overseas. For example, in Germany, a standard radio wave of 77.5 KHz is used. Therefore, when a radio timepiece that can be handled overseas is incorporated into a portable device, a crystal resonator having a frequency different from that in Japan is required. In the present invention, it is easy to install the extraction electrode, and it is possible to further incorporate vibrator pieces other than the vibrator pieces of 40 KHz and 60 KHz in one package. For example, as shown in FIG. 36, four crystal resonator pieces 3a ′, 3b ′, 3c ′, and 3d ′ are provided. Then, the resonance frequency of the crystal oscillator piece 3a ′ is set to 40 kHz, the resonance frequency of the crystal oscillator piece 3b ′ is 60 kHz, the resonance frequency of the crystal oscillator piece 3c ′ is 77.5 kHz, and the crystal oscillator piece 3d ′ The resonance frequency is set to 32.768 kHz. The resonance frequency of the vibrator piece constituting the filter circuit can be determined by adjusting the length of the vibrating arm portion.
The method of mounting two or more crystal resonator pieces is not limited to this, and a plurality of vibrating arm portions can be formed so as to extend from a common base portion.
As described above, since the radio-controlled timepiece 71 in which a plurality of vibrator pieces are housed in one package is configured using the present invention, it is compared with the case where a plurality of vibrators housed in individual containers are mounted. As a result, the mounting area can be greatly reduced. In addition, since the external electrode is formed while suppressing a decrease in mechanical strength of the base member, the radio timepiece can function with a stable accuracy over a long period of time.

  The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.

It is sectional drawing which shows a mode when the crystal resonator as the 1st Embodiment of this invention is seen from the side surface. It is sectional drawing which expands and shows the joining site | part of the cover member of FIG. 1, and a base member. FIG. 7 is a plan view showing a state in which a lid-side recess is formed in the lid wafer in the manufacturing process of the crystal unit of FIG. 1. It is a side view which shows the wafer for lid | cover parts of FIG. FIG. 2 is a plan view showing a state where a lid-side recess and a through hole are formed in a base wafer in the manufacturing process of the crystal unit of FIG. 1. It is a side view which shows the wafer for lid | cover parts of FIG. FIG. 3 is a plan view showing a state where lead electrodes and electrode portions are formed on a lid wafer in the manufacturing process of the crystal unit of FIG. 1. It is AA arrow sectional drawing of FIG. FIG. 3 is a plan view showing a state in which an insulating film is formed on the lid wafer in the manufacturing process of the crystal unit of FIG. 1. FIG. 10 is a cross-sectional view taken along line BB in FIG. 9. It is explanatory drawing which shows a mode that the height difference produced in the surface of the insulating film in the insulating film formation process. FIG. 7 is a plan view showing a state in which a first bonding film is formed on the lid wafer in the manufacturing process of the crystal unit of FIG. 1. It is BB arrow sectional drawing of FIG. FIG. 5 is a plan view showing a state in which a second bonding film is formed on a base wafer in the manufacturing process of the crystal unit of FIG. 1. It is CC sectional view taken on the line of FIG. FIG. 2 is a plan view showing a state in which a eutectic alloy film is formed on a base wafer in the manufacturing process of the crystal unit of FIG. 1. It is CC sectional view taken on the line of FIG. FIG. 3 is a plan view showing a state in which a crystal resonator piece is provided on a lid wafer in the manufacturing process of the crystal resonator of FIG. 1. FIG. 19 is a cross-sectional view taken along line BB in FIG. 18. FIG. 2 is a side view showing a state in which a base wafer is superposed on a lid wafer in the manufacturing process of the crystal unit of FIG. 1. FIG. 3 is a side view showing a state in which the lid wafer and the base wafer are eutectic bonded in the manufacturing process of the crystal unit of FIG. 1. FIG. 2 is a plan view showing a state in which external electrodes are formed on a base wafer in the manufacturing process of the crystal unit of FIG. 1. FIG. 23 is a cross-sectional view taken along line BB in FIG. 22. FIG. 10 is a plan view showing a state in which extraction electrodes are formed on a lid wafer in a manufacturing process of a crystal resonator as a second embodiment of the present invention. It is a top view which shows a mode that the insulating film was formed in the wafer for lid | cover parts of FIG. It is a top view which shows a mode that the 1st bonding film was formed in the wafer for lid | cover parts of FIG. It is a top view which shows a mode that the angular velocity sensor was provided in the wafer for lid | cover parts of FIG. It is a top view which shows the modification of an extraction electrode. It is a top view which shows a mode that the insulating film was formed in the wafer for lid | cover parts of FIG. FIG. 30 is a plan view showing a state in which a first bonding film is formed on the lid wafer in FIG. 29. FIG. 31 is a plan view showing a state in which a plurality of crystal resonator pieces are provided on the lid wafer in FIG. 30. It is a top view which shows the oscillator as the 3rd Embodiment of this invention. It is a top view which shows the oscillator as a modification of the 3rd Embodiment of this invention. It is a block diagram which shows the portable information device as the 4th Embodiment of this invention. It is a block diagram which shows the radio timepiece as the 4th Embodiment of this invention. FIG. 36 is an explanatory view showing an example in which four crystal resonator pieces of the crystal resonator of FIG. 35 are provided.

Explanation of symbols

1 Crystal resonator (piezoelectric resonator)
2 Sealed container 3 Crystal resonator piece (piezoelectric vibrator piece)
6 Lid member 6a One main surface (one main surface of the lid member)
7 Base member 15 Electrode portion 16 Lead electrode 19 First bonding film 20 Second bonding film 22 Insulating film 26 Non-electrode surface 27 External terminal (external electrode)
28, 45 Eutectic alloy film 37 Angular velocity sensor (piezoelectric vibrator piece)
38,380 Oscillator 43 Integrated circuit 46 Portable information device (electronic device)
71 Radio clock (electronic equipment)
80 Filter (Filter part)

Claims (10)

A sealed container in which a plate-like lid member and a base member are overlapped and joined in the thickness direction;
A piezoelectric vibrator piece provided in the sealed container;
A plurality of electrode portions provided on one of the main surfaces of the lid member on the base member side, connected to the piezoelectric vibrator piece and applying a voltage to the piezoelectric vibrator piece; ,
A plurality of extraction electrodes provided on one main surface of the lid member and extending each of the plurality of electrode portions to an edge of the one main surface of the lid member , between the extraction electrodes; A plurality of extraction electrodes provided with minute gaps ,
An insulating film provided on one of the main surfaces of the plurality of extraction electrodes on the base member side over the plurality of extraction electrodes to insulate each of the plurality of extraction electrodes from each other When,
A first bonding film made of metal for bonding the lid member and the base member, provided on one of the main surfaces of the insulating film on one side of the base member;
Of the two main surfaces of the base member, provided on one main surface disposed on the lid member side, a second bonding film made of metal for bonding the lid member and the base member;
A eutectic alloy film provided between the first bonding film and the second bonding film;
An external electrode electrically connected to the plurality of lead electrodes from a side surface of the sealed container;
A piezoelectric vibrator comprising:   The piezoelectric vibrator according to claim 1, wherein the eutectic alloy film is made of gold and tin. 3. The piezoelectric vibrator according to claim 1, wherein a eutectic temperature of the eutectic alloy film is set to be higher than 260 degrees which is a maximum reflow temperature when mounted on a substrate. .   The piezoelectric vibrator according to any one of claims 1 to 3, wherein the plurality of electrode portions include at least three.   The piezoelectric vibrator according to any one of claims 1 to 4, wherein a plurality of the piezoelectric vibrator pieces are provided.   6. An oscillator, wherein the piezoelectric vibrator according to claim 1 is electrically connected to an integrated circuit as an oscillator.   6. A radio timepiece, wherein the piezoelectric vibrator according to claim 1 is electrically connected to a filter portion.   An electronic apparatus comprising the piezoelectric vibrator according to any one of claims 1 to 5. A method of manufacturing a piezoelectric vibrator comprising: a sealed container in which a plate-like lid member and a base member are overlapped and joined in a thickness direction; and a piezoelectric vibrator piece provided in the sealed container,
A plurality of electrode portions that are connected to the piezoelectric vibrator piece and apply a voltage to the piezoelectric vibrator piece on one of the main faces of the lid member on the base member side, and these A plurality of extraction electrodes extending each of the plurality of electrode portions to an edge of one main surface of the lid member, and a plurality of extraction electrodes provided with a minute gap between the respective extraction electrodes ; Forming an electrode; and
An insulating film forming step of forming an insulating film over the plurality of lead electrodes formed in the electrode forming step;
A first bonding film forming step of forming a first bonding film made of metal for bonding the lid member and the base member on the insulating film formed in the insulating film forming step;
A second bonding film made of metal for bonding the lid member and the base member is formed on one of the main surfaces of the base member on one side of the lid member. 2 bonding film forming step;
A connecting step of electrically connecting the piezoelectric vibrator piece to the plurality of electrode portions formed in the electrode forming step;
From a plurality of metals on at least one of the first bonding film formed in the first bonding film forming step and the second bonding film formed in the second bonding film forming step. A film forming step of forming a eutectic alloy film or a laminated metal film in which a plurality of metals are laminated,
The eutectic alloy film or the laminated metal film is heated in a state where the lid member and the base member are overlapped with the eutectic alloy film or the laminated metal film formed in the film forming step interposed therebetween, A eutectic bonding step of eutectic bonding the lid member and the base member;
An external electrode forming step of forming an external electrode electrically connected to the extraction electrode from a side surface of the sealed container having a lid member and a base member that are eutectic bonded in the eutectic bonding step;
A method of manufacturing a piezoelectric vibrator, comprising: The eutectic temperature of the eutectic alloy film or the laminated metal film formed in the film forming step is set to be higher than 260 degrees which is the maximum reflow temperature when the piezoelectric vibrator is mounted on the substrate,
The method for manufacturing a piezoelectric vibrator according to claim 9, wherein, in the eutectic bonding step, the heating temperature is set higher than the reflow temperature.

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