JP4707463B2 - Easy adhesive film and card media - Google Patents

Description

  The present invention relates to an easily-adhesive film and a card medium having sufficient temporary adhesive strength at a low temperature and in a short time during temporary bonding.

  Conventionally, when attaching an easy-adhesion film partially having an adhesive layer such as a hologram, name sheet (sign panel), thermal layer, rewrite layer, magnetic tape, etc. Temporary adhesion was performed, and then it was pressed and attached to the card.

  Examples of the adhesive used for the easily adhesive film include acrylic resins, synthetic rubbers, phenol resins, and the like. Moreover, the invention disclosed by patent documents 1 to 3 is well-known as a conventional invention regarding an easily bonding film.

  Patent Document 1 discloses an invention that provides an easy-adhesive film excellent in adhesion between layers, heat laminate suitability with PVC (vinyl chloride resin), and the like.

  Patent Document 2 discloses an invention that provides an easy-adhesive film excellent in printability, ink receptivity, and anti-blocking properties in various printings.

Patent Document 3 discloses a polyurethane adhesive having excellent adhesive strength and an invention for obtaining a decorative sheet coating material having a curved surface or an uneven surface using this adhesive.
JP-A-11-268213 JP 11-342565 A JP-A-5-320614

When performing positioning by temporary adhesion of conventional adhesives as described above the card substrate, the conditions for temporary adhesion, it is common to press 5 seconds at about 120 ° C..

  However, when temporary pressing is performed under these conditions, for example, when PET-G is used for the card substrate, the temperature at the time of temporary bonding exceeds the softening point of PET-G, Distortion occurs and the position accuracy of the easily adhesive film cannot be guaranteed.

  Further, the easy-adhesion film has a so-called winding process in which the film is wound into a roll and stored after completion of printing at the time of film production (film printing process). When the surface of the easy-adhesion film wound up in this winding process contacts with another surface, it may adhere to the other surface.

  This phenomenon is called blocking, but if the adhesive layer uses a softening point lower than that of the card base material for the purpose of preventing the above-mentioned distortion to the card base material, instead of suppressing the distortion of the card base material. Therefore, the blocking phenomenon frequently occurs.

As described above, in the conventional technology, the card base material is deteriorated in distortion position accuracy by increasing the press time at the time of temporary bonding, or by creating an adhesive layer using a material having a low softening point. There were only things that caused the phenomenon.

  Then, in view of the conventional subject, this invention aims at providing the easily-adhesive film and card | curd medium which have sufficient temporary adhesive strength at low temperature and a short time at the time of temporary bonding.

In order to achieve the above object, the invention described in claim 1 is an easy-adhesion film in which a rewrite layer and an adhesive layer are laminated, and the adhesive layer is provided on one surface of an intermediate layer in the rewrite layer. The adhesive layer includes a first polyester resin having a glass transition point lower than 0 ° C., a second polyester resin having a glass transition point higher than 50 ° C., an epoxy resin, and silica.

  The invention according to claim 2 is the easy-adhesive film according to claim 1, wherein the ratio of the adhesive layer when the resin of the adhesive layer is 10 parts by weight is 3.0 to 5.0 parts by weight of the epoxy resin. The first polyester resin is 4.0 to 7.0 parts by weight, the second polyester resin is 0.5 to 3.0 parts by weight, and the silica is 5 to 15% by weight based on the solid content of the resin. It is characterized by that.

  The invention according to claim 3 is the easy-adhesion film according to claim 1 or 2, wherein the easy-adhesion film has at least two or more layers including an adhesive layer, and between each of the plurality of layers, It further has an anchor layer having a polyester-based urethane resin and an isocyanate-based curing agent.

  The invention according to claim 4 is the easy-adhesion film according to any one of claims 1 to 3, wherein the glass transition point of the first polyester resin is −40 to 0 ° C.

  The invention according to claim 5 is the easy-adhesion film according to any one of claims 1 to 3, wherein the glass transition point of the second polyester resin is 50 to 100 ° C.

  The invention according to claim 6 is a card medium to which the easy-adhesion film according to claims 1 to 5 is attached.

Thus, according to the present invention, it is possible to provide an easy-adhesion film having sufficient temporary adhesive strength at a low temperature and in a short time during temporary bonding.

  Below, the easily-adhesive film of this embodiment is demonstrated using drawing. In addition, this embodiment is not limited to what is described below, A various change is possible in the range which does not deviate from the meaning. Moreover, the easy-adhesion film of this embodiment is demonstrated using a rewritable sheet.

  As shown in FIG. 1, the easy-adhesion film 1 of this embodiment is composed of a reversible thermosensitive recording layer (rewrite layer) 2 and an adhesive layer 3. And it affixes on the card | curd base material 4 through this contact bonding layer 3. FIG. Resin is used as the material of the card base 4.

  Examples of the resin used include general-purpose polystyrene resin, impact-resistant polystyrene resin, acrylonitrile styrene resin, ABS (acrylonitrile-butadiene-styrene copolymer) resin, acrylic resin, polyethylene resin, polypropylene resin, polyamide resin, polyacetal. Conventional card base materials such as resin, PC (polycarbonate) resin, vinyl chloride resin, modified PPO resin, polybutylene terephthalate resin, polyphenylene sulfide resin, thermoplastic resin, alloy resin, reinforced resin by adding glass fiber, etc. And publicly known resins applicable to In addition, PET-G was used for the card | curd base material 4 in this embodiment. This is because the influence in the case of considering the environmental aspect is larger than that of PVC or the like.

  Next, the easily adhesive film 1 will be described in more detail.

<First Embodiment>
FIG. 2 is a block diagram illustrating a configuration of the easy-adhesion film 1 of the present embodiment.
As described above, the easy-adhesion film 1 of the present embodiment includes the rewrite layer 2 and the adhesive layer 3. The rewrite layer 2 includes a protective layer 21, a recording layer 22, a silver layer 23, and an intermediate layer 24.

The protective layer 21 is a layer that is provided on the surface of the rewrite layer 2 and protects the rewrite layer 2. The recording layer 22 is a layer for recording data, and for example, data is rewritten and recorded by a thermal head. The silver layer 23 is a layer that facilitates reflection of data recorded in the recording layer 22 such as data when reading rewrite data. Intermediate layer 24 is a layer serving as a base of the rewrite layer, in the present embodiment is formed by using a PET. These layers are sequentially stacked in the order described above. Thereby, the rewrite layer 2 of the present embodiment is formed.

  The adhesive layer 3 is a layer that adheres the rewrite layer 2 and the card substrate 4. And this adhesive layer 3 is the most characteristic part of the easy-adhesion film of this embodiment.

  In order to obtain sufficient temporary adhesive strength at a low temperature and in a short time, which is the object of the present invention, the adhesive layer 3 includes a low Tg (glass transition temperature) polyester resin and a high Tg polyester resin. , Epoxy resin and silica.

And the easy-adhesion film 1 having the adhesive layer 3 formed by the above-described configuration is (i) that the blocking is not generated when the rewritable layer 2 is wound up, and (ii) the conditions for temporary adhesion are as follows: Performed at low temperature and in a short time (heating temperature: about 80 ° C., heating time: about 2 to 3 seconds, applied pressure: about 2 kg / cm ² ), (iii) the adhesive strength after this attachment is above a certain level It must be present (adhesive strength: 6 N / cm or more).

  Therefore, the Tg of the polyester resin used for the adhesive layer 3 of the present embodiment is more preferably a polyester resin having a low Tg of −40 to 0 ° C. and a polyester resin having a high Tg of 50 to 100 ° C. Moreover, as for an epoxy resin, it is more preferable that a softening point is 60-90 degreeC. Furthermore, the silica preferably has an average particle diameter of 2 to 5 μm.

By configuring the adhesive layer 3 in this way, the following effects are produced.
First, the effect of increasing the adhesive strength between the easy-adhesive film 1 and the card substrate 4 is produced by the high Tg polyester resin. In addition, a blocking effect is slightly produced. Next, the low Tg polyester resin has the effect of lowering the temperature during temporary bonding and shortening the heating time associated therewith. It also has a slight effect of increasing the adhesive strength.

Epoxy resin produces the effect of lowering the temperature during temporary bonding and shortening the heating time associated therewith. Furthermore, the epoxy resin also has an antiblocking effect. Finally, silica produces an antiblocking effect.
As described above, the effects of the four components constituting the adhesive layer 3 are combined, and the conditions (i) to (iii) can be satisfied.

  Hereinafter, the easy-adhesion film of the present embodiment, particularly the adhesive layer 3 will be described in more detail using examples. The low Tg / high Tg polyester resin, epoxy resin, and silica in each example may be well-known ones that are generally commercially available.

Moreover, the well-known general structure may be sufficient as the protective layer 21 in the easily bonding film of each Example mentioned later. This time, the following configuration is assumed.
-Protective layer: Silica added to ultraviolet (UV) curable resin (1) Silica: average particle size 3-5 μm, addition amount 10% (based on solid content of resin)

[Example 1]
The composition described below is most preferable as the composition ratio of the adhesive layer 3 in the present embodiment.
Adhesive layer: epoxy resin, low Tg polyester resin, high Tg polyester resin, silica (1) epoxy resin (softening point 75-85 ° C) 4.0 parts by weight (2) low Tg polyester resin (Tg -29 ° C) 5 0.5 parts by weight (3) High Tg polyester resin (Tg 85 ° C.) 0.5 parts by weight (4) Silica (average particle size 3 μm) 1.0 part by weight

  As a result of taking the configuration as described above, the adhesive layer 3 of the present example was able to satisfy the conditions (i) to (iii) most preferably.

[Example 2]
In this example, among the composition ratios in Example 1, the epoxy resin was increased and the low Tg polyester resin was decreased. The composition ratio of the adhesive layer 3 at this time is as described below.
Adhesive layer: epoxy resin, low Tg polyester resin, high Tg polyester resin, silica (1) Epoxy resin (softening point 75 to 85 ° C) 4.5 parts by weight (2) Low Tg polyester resin (Tg -29 ° C) 5 0.0 part by weight (3) High Tg polyester resin (Tg 85 ° C.) 0.5 part by weight (4) Silica (average particle size 3 μm) 1.0 part by weight

  As a result of adopting the above-described configuration, each of the conditions (i) to (iii) can be more preferably satisfied even in the adhesive layer 3 of this example.

  Incidentally, in Example 1 and Example 2 above, both conditions (i) to (iii) can be preferably satisfied, but the composition ratio described in Example 1 is applied. Was more satisfied with the conditions (i) to (iii).

[Example 3]
In this embodiment, the composition ratio of the adhesive layer 3 is set as follows, that is, the silica is reduced.
Adhesive layer: Epoxy resin, low Tg polyester resin, high Tg polyester resin, silica (1) Epoxy resin (softening point 75 to 85 ° C) 4.5 parts by weight (2) Low Tg polyester resin (Tg -29 ° C) 5 0.0 part by weight (3) High Tg polyester resin (Tg 85 ° C.) 0.5 part by weight (4) Silica (average particle size 3 μm) 0.5 part by weight

  As a result of taking the configuration as described above, each of the conditions (i) to (iii) was able to be satisfied also in the adhesive layer 3 of the present example. However, when compared with Examples 1 and 2 described above, in this example, blocking (i) may occur slightly.

[Example 4]
In this example, among the composition ratios of the adhesive layer 3 in Example 3, the epoxy resin was decreased and the low Tg polyester resin was increased.
Adhesive layer: epoxy resin, low Tg polyester resin, high Tg polyester resin, silica (1) epoxy resin (softening point 75-85 ° C) 4.0 parts by weight (2) low Tg polyester resin (Tg -29 ° C) 5 0.5 part by weight (3) High Tg polyester resin (Tg 85 ° C.) 0.5 part by weight (4) Silica (average particle size 3 μm) 0.5 part by weight

As a result of taking the configuration as described above, each of the conditions (i) to (iii) was able to be satisfied also in the adhesive layer 3 of the present example. However, when compared with Examples 1 and 2 described above, in this example, as in Example 3, blocking (i) may occur slightly.
Table 1 shows the evaluation results of Examples 1 to 4 so far.

[Example 5]
Next, unlike the configuration (four components) of the adhesive layer 3 in Examples 1 to 4, the adhesive layer 3 was configured with three components. In this embodiment, the configuration is as follows.
Adhesive layer: Epoxy resin, low Tg polyester resin, high Tg polyester resin (1) Epoxy resin (softening point 75 to 85 ° C.) 4.0 parts by weight (2) Low Tg polyester resin (Tg −29 ° C.) 4.0 Part by weight (3) High Tg polyester resin (Tg 85 ° C.) 2.0 parts by weight

  As a result of adopting the configuration as described above, the adhesive layer 3 of this example was able to satisfy the above conditions (i) to (iii). However, with respect to the condition (i), some blocking may occur. Further, among the conditions of (i), when the heating time was checked at 5 seconds, the blocking decreased.

  Next, in Examples 6 and 7, the adhesive layer 3 was composed of three components: a low Tg polyester resin, a high Tg polyester resin, and silica. Further, among the above conditions (i) to (iii), the heating time in (ii) was set to 5 seconds for checking.

[Example 6]
The adhesive layer 3 in this example was configured as shown below.
Adhesive layer: Low Tg polyester resin, high Tg polyester resin, silica (1) Low Tg polyester resin (Tg -29 ° C) 7.0 parts by weight (2) High Tg polyester resin (Tg 85 ° C) 3.0 parts by weight (3) Silica (average particle size 6.2 μm) 0.5 parts by weight

  As a result of adopting the configuration as described above, the adhesive layer 3 of this example was able to satisfy the above conditions (i) to (iii). However, there were some cases where blocking occurred, or when temporary bonding was not possible even when the heating time was changed to 5 seconds.

[Example 7]
The adhesive layer 3 in this example was configured as shown below.
Adhesive layer: Low Tg polyester resin, high Tg polyester resin, silica (1) Low Tg polyester resin (Tg -29 ° C) 7.0 parts by weight (2) High Tg polyester resin (Tg 85 ° C) 3.0 parts by weight (3) Silica (average particle size 3.9 μm) 1.0 part by weight

As a result of adopting the configuration as described above, the adhesive layer 3 of this example was able to satisfy the above conditions (i) to (iii). Unlike Example 6, there was almost no occurrence of blocking, but there were some cases where temporary bonding could not be achieved even when the heating time was changed to 5 seconds.
Table 2 shows the evaluation results of Examples 5 to 7 so far.

  Further, in addition to the above-described examples, the composition ratio of the adhesive layer 3 of the present embodiment was verified as a configuration as described below.

[Example 8]
First, the adhesive layer 3 in this example was configured as shown below.
Adhesive layer: epoxy resin, low Tg polyester resin, high Tg polyester resin, silica (1) epoxy resin (softening point 75-85 ° C) 4.0 parts by weight (2) low Tg polyester resin (Tg -29 ° C) 5 0.0 part by weight (3) High Tg polyester resin (Tg 85 ° C.) 1.0 part by weight (4) Silica (average particle size 3 μm) 0.5 part by weight

  As a result of adopting the configuration as described above, the adhesive layer 3 of this example was able to satisfy the conditions (i) to (iii) to some extent. However, blocking may occur in the condition (i).

[Example 9]
The configuration of the adhesive layer 3 in this example was changed to 1.0 part by weight of silica in the configuration of Example 8.
Adhesive layer: epoxy resin, low Tg polyester resin, high Tg polyester resin, silica (1) epoxy resin (softening point 75-85 ° C) 4.0 parts by weight (2) low Tg polyester resin (Tg -29 ° C) 5 0.0 part by weight (3) High Tg polyester resin (Tg 85 ° C.) 1.0 part by weight (4) Silica (average particle size 3 μm) 1.0 part by weight

  As a result of adopting the configuration as described above, the adhesive layer 3 of this example was able to satisfy the conditions (i) to (iii) to some extent. However, with regard to the condition (ii), temporary bonding may not be possible.

[Example 10]
In this comparative example, the adhesive layer 3 was composed of three components, unlike the four components of Examples 8 and 9 above. In this embodiment, the configuration is as follows.
Adhesive layer: Low Tg polyester resin, high Tg polyester resin, silica (1) Low Tg polyester resin (Tg -29 ° C) 7.0 parts by weight (2) High Tg polyester resin (Tg 85 ° C) 3.0 parts by weight (3) Silica (average particle size 3 μm) 0.5 parts by weight

As a result of adopting the configuration as described above, the adhesive layer 3 of this example was able to satisfy the conditions (i) to (iii) to some extent. However, blocking may occur in the condition (i).
Table 3 shows the evaluation results of Examples 8 to 10 described above.

[Example 11]
The adhesive layer 3 in this example was configured as shown below.
Adhesive layer: Epoxy resin, low Tg polyester resin, high Tg polyester resin (1) Epoxy resin (softening point 75 to 85 ° C.) 2.0 parts by weight (2) Low Tg polyester resin (Tg −29 ° C.) 2.67 Parts by weight (3) High Tg polyester resin (Tg 85 ° C.) 5.33 parts by weight

  As a result of adopting the configuration as described above, the adhesive layer 3 of this example was able to satisfy the conditions (i) to (iii) to some extent. However, with regard to the condition (i), there were cases where temporary bonding could not be performed regardless of whether the heating time was 3 seconds or 5 seconds.

[Example 12]
The adhesive layer 3 in this example was composed of two components as shown below.
Adhesive layer: Epoxy resin, low Tg polyester resin (1) Epoxy resin (softening point 75 to 85 ° C.) 5.0 parts by weight (2) Low Tg polyester resin (Tg −29 ° C.) 5.0 parts by weight

  As a result of adopting the configuration as described above, the adhesive layer 3 of this example was able to satisfy the conditions (i) to (iii) to some extent. In particular, with regard to the condition (i), temporary bonding could be performed regardless of whether the heating time was 3 seconds or 5 seconds. However, regarding the conditions (ii) and (iii), blocking occurred and the adhesive strength was sometimes weak.

[Example 13]
The adhesive layer 3 in this example was configured as shown below. In addition, of the above (i) to (iii), the heating time in (ii) was set to 5 seconds for checking.
Adhesive layer: Low Tg polyester resin, high Tg polyester resin, silica (2) Low Tg polyester resin (Tg -29 ° C) 6.0 parts by weight (3) High Tg polyester resin (Tg 85 ° C) 4.0 parts by weight (3) Silica (average particle size 6.2 μm) 0.5 parts by weight

As a result of adopting the configuration as described above, the adhesive layer 3 of this example was able to satisfy the above conditions (i) to (iii). However, regarding the condition (ii), there were cases where temporary bonding could not be performed even though the heating time was set to 5 seconds.
Table 4 shows the evaluation results of Examples 11 to 13 so far.

  As described above, from the results of Examples 1 to 13, the configuration shown in Example 1 is the most preferable configuration of the adhesive layer 3 for the easy-adhesion film of the present embodiment.

  As described above, since the adhesive layer 3 is formed of a high Tg / low Tg polyester resin, epoxy resin, and silica, the temporary adhesive condition (about 120 ° C. for 5 seconds) of the conventional easy-adhesive film is temporarily increased. It becomes possible to have sufficient temporary adhesive strength at a low temperature and in a short time during bonding. In particular, in the easy-adhesion film of the present embodiment, the epoxy resin is 3.0 to 5.0 parts by weight, the low Tg polyester resin is 4.0 to 7.0 parts by weight, and the high Tg polyester resin in 10 parts by weight of the resin. Is most preferably 0.5 to 3.0 parts by weight, and silica is most preferably 5 to 15% by weight based on the solid content of the resin.

  As described above, the present embodiment is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present embodiment. For example, although the easy-adhesion film of the present embodiment has been described as a rewritable sheet, it goes without saying that it may be a hologram or a name sheet (sign panel).

<Second Embodiment>
Furthermore, in the easy-adhesion film of the present embodiment, it is possible to further strengthen the adhesion between the layers by using an anchor layer between the layers.

  Conventionally, the adhesive was applied to the untreated intermediate layer 24 (not subjected to the adhesion treatment), but the adhesive strength was less than 6 N / cm because the adhesive did not adhere to the untreated intermediate layer. It was. In addition, the processed intermediate layer 24 (adhesive treatment) was also examined. First, if the edge part is uncoated with a double-sided easy-adhesive product, blocking occurs when aging is performed after the winding process. Resulting in. In addition, in the case of full-side coating with a double-sided easy-adhesive product, although it adheres itself, it will be turned around and blocking will occur if it is aged after the winding process. Furthermore, there was no single-side easy-adhesive product having an adhesive strength of 6 N / cm or more with a tensile tester after bonding.

Below, the easily-adhesive film of this embodiment is demonstrated using drawing.
FIG. 3 is a block diagram illustrating a case where an anchor layer is provided between the layers of the easy-adhesion film 11.

  The easy-adhesion film 11 of the present embodiment includes an anchor layer 31a between the protective layer 21 and the recording layer 22, an anchor layer 31b between the recording layer 22 and the silver layer 23, and the intermediate layer 24 and the adhesive layer 3. Anchor layers 31c are provided between the layers.

  The anchor layers 31a, 31b, 31c of this embodiment are formed from a urethane polyester resin and an isocyanate curing agent.

  The easy-adhesion film 11 of this embodiment having an anchor layer between each layer is (iv) not to cause blocking when winding the rewritable layer 2, and (v) a tensile testing machine to be performed after bonding. It is necessary that the adhesive strength at is 6 N / cm or more.

  Therefore, the ratio of the urethane polyester resin and the isocyanate curing agent used in the anchor layers 31a, 31b, and 31c of the present embodiment is more preferably 1 part by weight of the isocyanate curing agent with respect to 10 parts by weight of the urethane polyester resin. . Moreover, it is more preferable to perform an aging process at about 60 degreeC for 5 hours with respect to the easily bonding film containing the anchor layer formed in this way.

  By forming the anchor layers 31a, 31b, and 31c in this manner and further performing aging, no blocking occurs in the winding process of the easy-adhesive film, and the adhesive layer is brought into close contact with the unprocessed intermediate layer. Thus, it is possible to provide an easy-adhesion film having an adhesive strength after bonding of 6 N / cm or more.

  Next, the Example regarding the quantity of the urethane polyester resin used for the anchor layer of this embodiment and an isocyanate type hardening | curing agent is demonstrated using a table | surface. Table 5 is a table showing the ratio between the urethane polyester resin and the isocyanate curing agent, and the evaluation results of performing aging on the anchor layer formed at the ratio.

  As shown in Table 5, the urethane polyester resin having 1 part by weight of the isocyanate curing agent with respect to 10 parts by weight could most preferably satisfy the conditions (iv) and (v). The above (iv) and (v) are also applicable to those having an isocyanate curing agent in parts by weight with respect to 10 parts by weight of the urethane polyester resin and those having 3 parts by weight of the isocyanate curing agent with respect to 10 parts by weight of the urethane polyester resin. It is possible to satisfy the conditions. However, when the aging time is taken into consideration, an isocyanate curing agent having 1 part by weight with respect to 10 parts by weight of the urethane polyester resin is more preferable.

  Thus, according to the easy-adhesion film 11 of this embodiment, since an anchor layer is provided between each layer, the adhesive force of each layer is strengthened, and further, it is possible to prevent blocking and strengthen the adhesive strength after bonding. It becomes.

It is a figure which shows the case where the easily bonding film 1 is affixed on the card | curd base material 4. FIG. It is a figure which shows the easily-adhesive film 1 of 1st Embodiment. It is a figure which shows the easily-adhesive film 11 of 2nd Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,11 Easy-adhesion film 2 Reversible thermosensitive recording (rewrite) layer 21 Protective layer 22 Recording layer 23 Silver layer 24 Intermediate layer 3 Adhesive layer 31a, b, c Anchor layer 4 Card base material

Claims (6)

A rewritable layer and an adhesive layer are laminated, and an easy-adhesive film having an adhesive layer on one surface of the intermediate layer in the rewritable layer ,
The adhesive layer is
An easily adhesive film comprising a first polyester resin having a glass transition point lower than 0 ° C, a second polyester resin having a glass transition point higher than 50 ° C, an epoxy resin, and silica.   The proportion of the adhesive layer when the resin of the adhesive layer is 10 parts by weight is 3.0 to 5.0 parts by weight for the epoxy resin and 4.0 to 7.0 parts by weight for the first polyester resin. The easily adhesive film according to claim 1, wherein the second polyester resin is 0.5 to 3.0 parts by weight, and the silica is 5 to 15% by weight based on the solid content of the resin. . The easy-adhesive film has at least two or more layers including the adhesive layer,
The easily adhesive film according to claim 1, further comprising an anchor layer having a polyester urethane resin and an isocyanate curing agent between each of the plurality of layers.   The easily adhesive film according to any one of claims 1 to 3, wherein the glass transition point of the first polyester resin is -40 to 0 ° C.   The easily adhesive film according to any one of claims 1 to 3, wherein the glass transition point of the second polyester resin is 50 to 100 ° C.   A card medium on which the easy-adhesion film according to claim 1 is attached.

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