JP4710751B2 - Bulk feeder and electronic component mounting equipment - Google Patents

Description

  The present invention relates to a bulk feeder provided with a transport path for transporting electronic components and an electronic component mounting apparatus.

  As a part feeder that supplies electronic components to an electronic component mounting apparatus, a bulk feeder that stores a plurality of electronic components in a bulk shape is known. The bulk feeder includes a conveyance path that conveys electronic components in a state in which the electronic components are regulated in a predetermined posture, and conveys a plurality of electronic components stored in a bulk shape one by one and supplies them to the electronic component mounting apparatus. The electronic component supplied to the electronic component mounting apparatus is mounted on the substrate as it is, or mounted on the substrate after being sucked by the nozzle.

The conveyance path is formed by a closed space with openings at both ends surrounding the four sides of the electronic component so that the electronic component can be conveyed in a fixed posture. Electronic components are transported. Since the transport speed of electronic components is a factor that directly affects the supply efficiency of electronic components in the bulk feeder, it has traditionally been intended to ensure transport speed while regulating posture changes during transport of electronic components. A feeder has been proposed. For example, a bulk feeder is known in which an air passage is formed along a transport path and a cross-sectional area for air flow is enlarged to ensure a transport speed of electronic components (patent). Reference 1).
JP-A-10-294597

  In recent years, with the progress of miniaturization and weight reduction of electronic devices and the like, further miniaturization of electronic components mounted thereon has been demanded. For example, when handling a micro component such as a 0603 (vertical dimension is 0.6 mm, horizontal dimension is 0.3 mm) with a bulk feeder, the cross-sectional shape of the transport path is set to the micro component in order to regulate the posture change during transport. It is necessary to match the outer shape as much as possible. However, as a result, the cross-sectional area of the conveyance path is reduced, and the cross-sectional area of the air passage formed along this is further reduced. If the cross-sectional area for air flow becomes extremely small, the pipe resistance increases, so it is difficult to secure the air flow rate itself, and the transportation speed of electronic parts decreases and the supply efficiency deteriorates. appear.

  In view of the above, an object of the present invention is to provide a bulk feeder and an electronic component mounting apparatus that can ensure the conveyance speed of minute components.

The invention according to claim 1 is a bulk feeder that transports electronic components of a component transport unit by the flow of air, wherein the component transport unit is disposed above the transport path and a transport path in which electronic components are transported. An air flow path provided in parallel with the transport path, a partition wall that regulates a change in posture of an electronic component transported through the transport path and separates the transport path and the air flow path, and the transport path and the air A side cover that covers the flow path from the side, and the transport path, the air flow path, and the partition are formed over the entire length of the component transport unit, and the end of the partition and the side cover the space formed between the communicated to the air flow path and the transport path.

The invention according to claim 2 is a bulk feeder for transporting electronic components of a component transport unit by air flow, wherein the component transport unit is disposed above a transport path for transporting electronic components and the transport path. An air flow path provided in parallel with the transport path, a partition wall that regulates a change in posture of an electronic component transported through the transport path and separates the transport path and the air flow path, and the transport path and the air A side cover that covers the flow path from the side, and the transport path, the air flow path, and the partition are formed over the entire length of the component transport unit, and are formed on a surface of the side cover that faces the partition. to form a communication groove for communicating said air flow path and the transport path.

  Invention of Claim 3 is an electronic component mounting apparatus which mounts the electronic component supplied from the parts feeder which accommodated the several electronic component on a board | substrate, Comprising: The bulk of Claim 1 or 2 is provided in the said parts feeder A feeder was used.

  According to the present invention, since the air flow path communicates with the conveyance path through the space formed between the partition wall and the side lid, the air flow path can be formed in any cross-sectional shape regardless of the change in the cross-sectional shape of the conveyance path. Can be formed. As a result, even when the cross-sectional shape of the conveyance path is reduced to match the cross-section of the micro component, it is not necessary to reduce the cross-sectional shape of the air flow path in accordance with this, so that a smooth air flow is ensured. It is possible to reduce the conveyance speed of the minute parts in the conveyance path.

  Embodiments of the present invention will be described with reference to the drawings. 1 is a side view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a side sectional view of a bulk feeder according to an embodiment of the present invention, and FIG. 3 is a part of the bulk feeder according to the embodiment of the present invention. FIG. 4A and FIG. 4B are cross-sectional views in which a part of the bulk feeder according to the embodiment of the present invention is enlarged.

  First, the overall configuration of the electronic component mounting apparatus will be described with reference to FIG. In the figure, an electronic component mounting apparatus 1 has a function of mounting an electronic component supplied from a bulk feeder 2 containing a plurality of electronic components on a substrate 3. The bulk feeder 2 is mounted on the base 5 while being supported at a predetermined height by the carrier 4. The substrate 3 is held at a predetermined position by a substrate transport path 6 provided on the base 5. The board transport path 6 carries the board 3 before mounting into the electronic component mounting apparatus 1 and also transports the board 3 after mounting from the electronic component mounting apparatus 1 and the board 3 before mounting which has been carried in a predetermined manner. A holding function for temporarily holding the position is provided. The mounting head 7 has a function of picking up an electronic component supplied from the bulk feeder 2 and transferring it to the substrate 3 held at a predetermined position. The mounting head 7 is configured to be horizontally movable by a horizontal moving means such as an orthogonal robot (not shown), and the nozzle 8 provided at the bottom is configured to be vertically movable with respect to the mounting head 7 and to be rotatable in a horizontal plane. Has been. Therefore, the electronic component adsorbed by the nozzle 8 can be changed to an arbitrary position and angle, and is imaged from below by the recognition camera 9 before being mounted on the substrate 3, and based on the analysis result of the captured image. The position and angle are corrected to normal.

  Next, the bulk feeder will be described with reference to FIG. In the figure, a bulk feeder 2 includes a component storage unit 10 that stores a plurality of electronic components in a bulk shape, and a component transport unit 11 that transports a plurality of electronic components stored in the component storage unit 10 to a suction position by a nozzle 8. The component storage unit 10 and the component transport unit 11 are disposed on the upper portion of the base 12. The lower part of the base 12 is engaged with the upper part of the carrier 4 so that the bulk feeder 2 mounted on the upper part of the carrier 4 can be locked. The component conveyance unit 11 is provided between a component carry-in port 10 a provided at the lower part of the component storage unit 10 and one end side of the upper part of the base 12. One end of the upper portion of the base body 12 is a portion that is a position where an electronic component is attracted by the nozzle 8 when the bulk feeder 2 is mounted on the base 5. The component transport unit 11 is a pipe having openings at both ends, and transports an electronic component carried in from the component carry-in port 10 a side to a suction position by the nozzle 8.

The component carry-in device 13 has a function of carrying electronic components stored in a bulk shape in the component storage unit 10 one by one into the component transport unit 11. The component carry-in device 13 moves the cylindrical body 13a inserted and fitted in the component carry-in port 10a up and down (see arrow a), and repeats the operation of taking the tip of the cylindrical body 13a into and out of the component storage unit 10, Fluidizing bulk electronic components, cylindrical body 13
It is designed to drop one by one inside a. The inside of the cylindrical body 13a communicates with one open end of the component conveying unit 11, and the dropped electronic component is carried into the component conveying unit. The vertical movement of the cylindrical body 13a is realized by converting the rotational drive of the motor 13b by a cam mechanism.

  The other end of the component transport unit 11 is connected to a vacuum hose 14 that communicates with a vacuum source (not shown). An air flow from the component carry-in port 10 a toward the suction position by the nozzle 8 is generated in the component transport unit 11 that is vacuum-sucked from the other end side, and the electronic component carried into the component transport unit 11 is sucked by the nozzle 8. Transported to position. An opening 15 for taking out an electronic component is formed in the upper part on the other end side of the component conveying unit 11, and the electronic component conveyed by the component conveying unit 11 by the air flow is forced at the position of the opening 15. To be stopped. This position is a position where the electronic component is picked up by the nozzle 8, the nozzle 8 is lowered to pick up the electronic component, and is picked up to complete the pickup (see arrow b).

Next, the component conveyance part 11 is demonstrated. FIG. 3 is an enlarged perspective view of a part of the component conveying unit 11 . In the same figure, the component conveying part 11 is comprised by the pipe line provided in parallel with 2 steps | paragraphs of upper and lower sides, and the upper line is the air flow path 16 for air to flow, and the lower line Is a conveyance path 17 through which the electronic component P is conveyed. The upper air flow path 16 and the lower conveyance path 17 are separated by a partition wall 18. The air flow path 16, the conveyance path 17, and the partition wall 18 are formed over the entire length of the component conveyance unit 11, and the electronic component P stored in the component storage unit 10 is conveyed to the opening 15 through the conveyance path 17. (See arrow c). It should be noted that the side of the air flow path 16 that communicates with the tubular body 13a has the electronic component P inadvertently formed by forming a cross section of the flow path smaller than the cross section of the electronic component P or by providing an unshown entry prevention net. The air passage 16 is prevented from entering.

FIG. 4 is an enlarged cross-sectional view of a part of the component conveying unit 11 . In the same figure, the air flow path 16 and the conveyance path 17 are covered from the side by a side lid 19 to form an airtight conduit. The side lid 19 is detachable, and is released for opening the air flow path 16 and the conveyance path 17 to the outside for convenience during maintenance. From the viewpoint of the frictional force acting between the electronic component P being transported in the transport path 17 and the duct resistance of the air, and from the viewpoint of regulating the posture change of the electronic component P being transported, The cross-sectional shape is slightly larger than the cross-sectional shape of the electronic component P.

  4A, when the air flow path 16 and the conveyance path 17 are covered with the side lid 19, the air flow path 16 and the conveyance path are formed by the space S1 generated between the end of the partition wall 18 and the side lid 19. 17 is not an independent pipe line, but is in a state of communication in part. In FIG. 4B, the air flow path 16 and the conveyance path 17 can also be formed by forming a communication groove 19 a that communicates the air flow path 16 and the conveyance path 17 on the surface of the side lid 19 that faces the end of the partition wall 18. In this case, since the larger partition wall 18 can be provided, the posture of the electronic component P being conveyed can be further stabilized.

Next, the air flow in the component conveyance part 11 is demonstrated. In FIG. 2, an air flow is generated in the component transport unit 11 from the component carry-in port 10 a toward the suction position by the nozzle 8, and the electronic component P carried into the transport path 17 from the component carry-in port 10 a to the opening 15. Be transported. 4 (a) and 4 (b), the conveyance path 17 is mostly shielded by the electronic component P and has a small air flow path area, but the air and the inner wall surface of the conveyance path 17 and the electronic component P Since the surface contact area is large, the pipe resistance is large. For this reason, the flow of air in the transport path 17 is hindered and the flow velocity cannot be ensured. On the other hand, since there is no air flow path 16 that shields the cross section, a sufficient air flow area can be secured, and a smooth air flow can be secured. Since the air flow path 16 and the conveyance path 17 communicate with each other over the entire length by the space S <b> 1 or S <b> 2, the air flowing in the air flow path 16 comes into contact with the upper part of the electronic component P in the conveyance path 17. The electronic component P is sucked in the air flow direction (see arrow d in FIG. 3) due to the viscosity of the air, and moves in the transport path 17. Further, the electronic component P in the transport path 17 is an upforce that attempts to lift the electronic component P from the bottom wall of the transport path 17 by the venturi effect due to the air flow that flows in the upper air flow path 16 at a high speed. Therefore, the frictional force acting between the electronic component P and the bottom wall is reduced, and the electronic component P can move in the transport path 17 more smoothly.

  As described above, the air flow path 16 communicates with the transport path 17 through the spaces S1 and S2 formed between the partition wall 18 and the side lid 19, so that the air flow path 16 can be arbitrarily set regardless of the change in the cross-sectional shape of the transport path 17. It can be formed in a cross-sectional shape. Therefore, even when the cross-sectional shape of the conveyance path 17 is reduced to match the cross-section of the micro component, it is not necessary to reduce the cross-sectional shape of the air flow path 16 in accordance with this, so that a smooth air flow is ensured. And the transport speed of the micro parts in the transport path 17 is not reduced. Moreover, since the conveyance speed of a micro component does not fall, the supply efficiency of the micro component in the bulk feeder 2 does not deteriorate, and the deterioration of the mounting efficiency in the electronic component mounting apparatus can be prevented.

  According to the present invention, since the air flow path communicates with the conveyance path through the space formed between the partition wall and the side lid, the air flow path can be formed in any cross-sectional shape regardless of the change in the cross-sectional shape of the conveyance path. It is advantageous in that it can be formed in a simple manner, and it does not decrease the transport speed of the micro parts in the transport path by ensuring a smooth air flow, and is useful in the mounting field using a bulk feeder.

The side view of the electronic component mounting apparatus of embodiment of this invention Side sectional view of a bulk feeder according to an embodiment of the present invention The perspective view which expanded a part of bulk feeder of an embodiment of the invention (A) (b) Sectional drawing which expanded some bulk feeders of embodiment of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 Bulk feeder 16 Air flow path 17 Conveyance path 18 Bulkhead 19 Side cover 19a Communication groove S1, S2 Space P Electronic component

Claims (3)

A bulk feeder that transports electronic components in a component transport section by air flow,
The component transport unit includes a transport path for transporting electronic components, an air flow path provided in parallel with the transport path above the transport path, and an attitude change of the electronic component transported through the transport path. A partition that regulates and separates the conveyance path and the air flow path, and a side lid that covers the conveyance path and the air flow path from a side,
The transport path, the air flow path, and the partition are formed over the entire length of the component transport unit, and the transport path and the air flow are formed by a space formed between an end of the partition and the side lid. A bulk feeder characterized by communicating roads. A bulk feeder that transports electronic components in a component transport section by air flow,
The component transport unit includes a transport path for transporting electronic components, an air flow path provided in parallel with the transport path above the transport path, and an attitude change of the electronic component transported through the transport path. A partition that regulates and separates the conveyance path and the air flow path, and a side lid that covers the conveyance path and the air flow path from a side,
The conveyance path, the air flow path, and the partition are formed over the entire length of the component conveyance unit, and a communication groove that connects the conveyance path and the air flow path to a surface of the side cover that faces the partition. bulk feeder, characterized in that the formation of the. An electronic component mounting apparatus for mounting an electronic component supplied from a parts feeder containing a plurality of electronic components on a substrate,
The electronic component mounting apparatus using the bulk feeder of Claim 1 or 2 for the said parts feeder.

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