JP4729435B2 - Adhesive tape manufacturing apparatus and adhesive tape roll - Google Patents

Description

  The present invention relates to a technique for producing a cleaning adhesive tape wound so that the adhesive surface faces the front side, and more specifically, an adhesive in which a release material layer as a peeling means for the next layer is provided on the adhesive material layer. The present invention relates to a tape manufacturing apparatus and an adhesive tape roll manufactured thereby.

  For example, as shown in Patent Document 1, a cleaning pressure-sensitive adhesive tape roll is formed by winding a single-sided pressure-sensitive adhesive tape having an adhesive surface on one surface of a belt-shaped base material in a roll shape so that the pressure-sensitive adhesive surface faces the front side. It is preferably attached to a special jig (see FIG. 3B of Patent Document 1) and rolled while bringing the adhesive surface into contact with the surface to be cleaned such as the floor, thereby adhering the dust on the surface to be cleaned. Can be caught on the surface.

  The other surface (anti-adhesive surface) of the base material is provided with a release treatment surface to which a release material such as silicon resin is applied. The peel-treated surface is a contact surface with which the adhesive surface of the lower-layer adhesive tape comes into contact when the adhesive tape is laminated in a roll shape, and is provided to facilitate peeling when the outermost-layer adhesive tape is peeled off. .

  However, the material cost and the production cost are higher on the peeling treatment surface than before. In addition, if the adhesive strength (interlayer adhesive strength) of the adhesive layer to the release treatment surface is too weak, when the adhesive tape roll is rolled on the floor surface, the interlayer adhesive strength is reduced to the adhesive strength between the adhesive tape and the floor surface. It may be lost and the adhesive tape may stick to the floor surface, which may cause a so-called rail pulling phenomenon.

  In view of this, the present applicant has proposed a technique that eliminates the above-described peeling treatment surface as Japanese Patent Application No. 2005-315992. According to this, by further providing, for example, a strip-like release material layer on the adhesive material layer, the release treatment surface provided on the back surface of the substrate becomes unnecessary, and production can be performed at a lower cost.

  However, the above-mentioned prior application invention still has the following problems. That is, since this release material layer is made of a material having a high viscosity mainly composed of slightly adhesive rubber or the like, it is uniformly applied in a streak of a certain width using the same coating apparatus as the adhesive material. For this, the coating speed must be slowed down.

  However, when the coating speed is slow, the release material layer can be formed stably, but the productivity is remarkably lowered because the coating speed is slow. Conversely, when the coating speed is increased, the width of the release material layer may be uneven, or the release material layer may be cut off in the middle.

Utility Model Registration No.2521127

  Therefore, the present invention has been made to solve the above-described problems, and the object thereof is to uniformly form a release material layer as a peeling means for the next layer on the adhesive material layer, and has good mass productivity. It is providing the adhesive tape manufacturing apparatus and the adhesive tape roll manufactured by this.

  In order to achieve the above-described object, the present invention has several features described below. Invention of Claim 1 is equipped with the tape base material conveyance path which conveys the tape base material sent out from the mother roll toward a winding roll, and one side of the said tape base material on the said tape base material conveyance path In a pressure-sensitive adhesive tape manufacturing apparatus for applying a pressure-sensitive adhesive material to form a pressure-sensitive adhesive layer, first coating means for forming the pressure-sensitive adhesive layer on one surface of the tape base material, and the other surface of the base material And a second coating means for partially forming a release material layer on the pressure-sensitive adhesive layer, and the second coating means is positioned at a predetermined height away from the tape base material. It is provided and it is characterized by dripping and fixing the said peeling material on the said adhesive material layer.

  Invention of Claim 2 is the said Claim 1, The said 1st coating means contains the cooling roller provided with the cooling function, and the coating unit which discharges the said adhesive material, The said coating unit is The tape base material is disposed opposite to the cooling roller.

  A third aspect of the present invention is characterized in that, in the first or second aspect, the first coating means applies the pressure-sensitive adhesive material to substantially the entire surface or a streak of the tape base material.

  According to a fourth aspect of the present invention, in the first, second, or third aspect, the second coating means is a discharge unit that drops the release material on the tape base material, and a drop on the tape base material. A fixing unit that fixes the release material to the tape base material, and the fixing unit includes a pair of fixing rollers that fix the release material to the tape base material.

  A fifth aspect of the present invention is characterized in that, in the fourth aspect, the fixing rollers are provided to face each other across the dropping point of the release material.

  A sixth aspect of the invention is characterized in that the fixing roller of the fourth or fifth aspect is movably provided so that the distance from the fixing unit to the dropping point of the release material can be adjusted.

  A seventh aspect of the present invention provides the method according to any one of the first to sixth aspects, wherein the second coating means forms the release material layer on the pressure-sensitive adhesive layer in a streak shape, a dot shape, or a wave shape. It is characterized by dripping.

  The invention described in claim 8 is characterized in that, in any one of claims 1 to 7, the release material layer has a width of 1 mm or less and a thickness of 30 to 120 μm. Yes.

  According to a ninth aspect of the present invention, in any one of the first to eighth aspects, between the first coating means and the second coating means, static electricity charged on the tape base material is provided. It is characterized in that a charge eliminating means for removing is provided.

  The invention according to claim 10 is the invention according to any one of claims 1 to 9, wherein the release material layer material is mainly composed of a rubber acrylic, urethane, EVA and / or amorphous α-olefin. It is characterized in that a synthetic resin material is used.

  The present invention also includes a pressure-sensitive adhesive tape roll wound so that the pressure-sensitive adhesive surface of the pressure-sensitive adhesive tape produced by the manufacturing apparatus faces the front side.

According to the first aspect of the invention, the release material layer can be formed on the adhesive material layer with a uniform width by fixing the adhesive on the adhesive material layer while dropping the release material layer. In addition, since the conveyance speed of the adhesive tape can be increased, productivity is greatly improved.

In addition, by dropping the release material from the discharge unit onto the tape substrate and fixing it with the fixing roller of the fixing unit, the release material layer can be uniformly fixed on the adhesive layer of the tape substrate and fixed. By making the roller position up and down, it is possible to fix the release material layer in a desired state by changing the position of the fixing roller according to the material, properties, coating width, etc. of the release material layer. it can.

According to invention of Claim 2 and 3, as a 1st coating means, by arrange | positioning a coating unit facing a cooling roller on both sides of a tape base material, the tape substrate whole surface or streaks An adhesive material layer can be formed uniformly.

According to the fourth aspect of the present invention, the strip-like release material layer can be formed by continuously dropping the release material from the discharge unit. Moreover, a dotted release material layer can be formed by intermittently dropping the release material. Furthermore, a wavy release material can be formed by reciprocating the discharge unit or the tape base material left and right.

According to the invention described in claim 5, when the width of the release material layer is 1 mm or less and the thickness is 30 to 120 μm, if the width of the release material layer is larger than 1 mm, the adhesive strength is reduced. It may be too much. In addition, when the thickness of the release material layer is thinner than 30 μm, the adhesive surface may stick to the upper base material and may cause destruction of the base material. On the other hand, if it is thicker than 120 μm, the adhesive strength may be excessively reduced.

According to the sixth aspect of the present invention, by providing a static eliminating means for removing static electricity charged on the tape base material between the first coating means and the second coating means, It is possible to prevent the release material that has drooped due to the electroadsorption force from being sucked and displaced.

According to the seventh aspect of the present invention, since the release material layer is made of a synthetic resin material mainly composed of rubber acrylic, urethane, EVA and / or amorphous α-olefin, Thus, while maintaining the rewinding force, the phenomenon that the adhesive tape sticks to the floor, the so-called rail pulling phenomenon, can be prevented.

According to the eighth aspect of the invention, the adhesive tape is wound so that the adhesive surface faces the front side, thereby removing the dust attached to the surface to be cleaned while the adhesive surface is in contact with the surface to be cleaned. A pressure-sensitive adhesive tape roll is obtained.

  FIG. 1 is a perspective view of a pressure-sensitive adhesive tape roll produced by the pressure-sensitive adhesive tape manufacturing apparatus of the present invention, and FIG. The pressure-sensitive adhesive tape roll 1 has a pressure-sensitive adhesive tape 2 in which a pressure-sensitive adhesive surface 22a of a pressure-sensitive adhesive layer 22 is formed on one surface of a tape-like substrate 21, and the pressure-sensitive adhesive surface 22a faces the front side (the upper surface side in FIG. 1). And wound in a roll shape along the core 3.

  Usually, a core made of cardboard is used for the core 3, but other materials such as a synthetic resin may be used. In addition, a so-called coreless type in which only the adhesive tape 2 is wound in a roll shape without using the core 3 may be used, and in the present invention, the core 3 is an arbitrary component.

The base material 21 is made of paper, for example, and as shown in FIG. 2, an adhesive surface 22a of an adhesive material layer 22 to which an adhesive material is applied is formed on one surface (surface). In this example, the pressure-sensitive adhesive is composed of SIS (styrene-isoprene-styrene) based synthetic rubber to which various additives such as tackifier, naphthenic oil, and anti-aging agent are added.

  In addition, the kind of adhesive material may be arbitrarily selected according to the cleaning surface (for example, a flooring, a carpet, etc.) used, such as strong adhesion and weak adhesion. Further, the material of the base material 21 may be a resin film or a non-woven fabric other than paper.

  The adhesive surface 22a is composed of an adhesive material layer in which an adhesive material is solidly applied to one surface of the base material 21 to a uniform thickness T1, and in this example, the thickness T1 of the adhesive material layer is 10 to 20 μm. Has been applied.

  At both ends of the adhesive surface 22a of the substrate 21, there are provided non-adhesive portions (dry edges) 23, 23 to which no adhesive material is applied. In this embodiment, the non-adhesive portions 23, 23 are arbitrary. Component.

  A peeling means 4 is provided on the adhesive surface 22a to prevent the upper-layer-side adhesive tape 2 and the lower-layer-side adhesive tape 2 from sticking to each other. As shown in FIG. 2, the peeling means 4 has a release material layer 41 formed in a streak shape in parallel along the feeding direction of the adhesive tape 2 on the adhesive surface 22a, and these are separated by a predetermined interval (this In the example, a large number are arranged with a spacing W1 = 1.7 mm).

  The release material layer 41 preferably has a width W2 of 1 mm or less and a thickness T2 of 30 to 120 μm. That is, if the width of the release material layer 41 is larger than 1 mm, the adhesive force of the adhesive surface 22a may be excessively reduced. Moreover, when the thickness of the release material layer 41 is less than 30 μm, the adhesive surface may stick to the upper base material, which may cause base material destruction. On the other hand, if it is thicker than 120 μm, the adhesive strength may be excessively reduced.

In this embodiment, the release material layer 41 is formed in a streak shape along the feeding direction of the pressure-sensitive adhesive tape 2. However, in addition to this, the release material layer 41 may have a lattice shape or a wavy shape. It is provided not good. That is, if the occupation ratio per unit area with respect to the adhesive surface 22a is 5% or more and 50% or less (more preferably 10% or more and 30% or less), the form is arbitrary according to the specification.

  That is, when the exclusive area of the release material layer 41 is less than 5%, the release material layer 41 is too small, and the base material may stick to the adhesive surface and may cause destruction of the base material when peeled off. On the other hand, if it is larger than 50%, the adhesive force to the surface to be cleaned is too small, so that not only the cleaning ability may be lowered but also a rail pulling phenomenon may be caused.

  In this example, the release material layer 41 is mainly composed of a rubber material such as CEBC (olefin crystal: ethylene: butylene: olefin crystal block copolymer), and SIS system is used to improve the affinity with the adhesive surface 22a. It consists of a polymer added in a small amount and various additives such as tackifier and paraffin oil.

In this example, the release material layer 41 is obtained by using an additive such as paraffin oil to obtain slight adhesion and elasticity, but in addition to this, microballoon mixing, N ₂ gas or CO ₂ gas is used. Mechanical techniques such as mechanical foaming may also be used. As another method, an elastic powder may be mixed, or a plasticizer may be added to the acrylic adhesive material.

  When it is necessary to make the base material 21 thin, a laminate film 24 for reinforcing the base material 21 can be provided on the other surface (back surface) of the base material 21. In this example, the laminate film 24 is made of a thin film made of polyethylene and is provided integrally with the base material 21.

  Usually, the laminate film 24 can be made unnecessary by controlling the adhesiveness of the release material layer 41. In addition, when the base material 21 is a plastic film, the laminate film 24 is unnecessary.

  Referring to FIG. 1 again, the adhesive tape 2 is provided with a cut line 5 for cutting almost every circumference. The cut 5 is a cutting means used for cutting the adhesive tape 2 along the width direction. In this example, the cut 5 is a so-called perforation in which cut portions and uncut portions are alternately arranged.

  Next, with reference to FIGS. 3-5, the manufacturing apparatus of the adhesive tape of this invention is demonstrated. FIG. 3 is a schematic view of an adhesive tape manufacturing apparatus according to an embodiment of the present invention. The manufacturing apparatus 100 includes a drive unit and a control unit (not shown) inside, and includes a tape substrate conveyance path 130 that conveys the tape substrate 21 wound around the mother roll 110 toward the take-up roller 120. .

  In this example, the manufacturing apparatus 100 is a so-called biaxial feeding type in which two rolls of mother roll 110 including a preliminary roll can be attached, and either one is selected and fed out. The tape base material conveyance path 130 is provided with a tape cutting unit 101 for cutting the tape base material 21 when the mother roll 110 is switched.

In addition to this, on the tape base material conveyance path 130, the tape length measurement part for measuring the feeding amount of the tape base material 21, and the tape which measures whether the tape base material 21 is conveyed with appropriate tension While such tension detection unit (both not shown) are provided, which are optional components der because in the present invention, a description thereof will be omitted.

  On the tape base material conveyance path 130 of the manufacturing apparatus 100, the 1st coating means 200 for apply | coating an adhesive material to one surface of the tape base material 21, and forming the adhesive material layer 22 is provided. As shown in FIG. 4, the first coating unit 200 includes a cooling roller 210 including a predetermined cooling unit (not shown) and a coating unit 220 that discharges an adhesive material.

  The first coating means 200 is further provided with guide rollers 231 to 237 for bringing the tape base material 21 into contact with the cooling roller 210 with a constant tension. In the present invention, among the guide rollers, the guide roller 236 is a chiller roller that further cools the tape base material 21 cooled by the cooling roller 210, and the guide roller 237 is a drive roller that sends out the tape base material 21, The other guide rollers are free rollers.

  The cooling roller 210 is a rotational driving roller that is driven via a driving means (not shown), and in this example, it rotates counterclockwise in FIG. The surface of the cooling roller 210 is cooled by the cooling means.

  The coating unit 220 includes a discharge nozzle 221 disposed opposite to the surface of the cooling roller 210 with the tape base material 21 interposed therebetween, and a movable arm 222 for adjusting the position of the discharge nozzle 221, and the discharge nozzle 221. Is connected to a melting unit of an adhesive material (not shown).

  The coating unit 220 is movable in the three-axis directions of XYZ via the movable arm 222, and appropriately adjusts the position of the discharge nozzle 221 according to the application conditions such as the material of the adhesive material and the melting temperature. Be able to.

  In this example, the discharge nozzle 221 is provided on the tape base material 21 so that the adhesive material layer 22 is uniformly applied to a thickness of 15 μm, but the application thickness of the adhesive material depends on the specification. Can be changed arbitrarily.

  Next to the first coating means 200, second coating means 300 for forming the release material layer 41 is provided. As shown in FIG. 5, the second coating means 300 fixes the discharge unit 310 for dropping the release material onto the tape base material 21 and fixes the release material dropped onto the tape base material 21 to the tape base material 21. And a fixing unit 320.

  The second coating means 300 is further provided with guide rollers 331 to 335 for conveying the tape base material 21 with a constant tension. In this example, the guide roller 335 is a chiller roller cooled by the cooling means in order to cool the release material layer 41 formed on the tape base material 21, and is rotationally driven by a driving means (not shown).

  Among the guide rollers 331 to 335, the guide roller 332 is a tension roller for sending the tape base material 21 to the second coating means 300 in a state where the tape base material 21 is stretched with a constant tension. The tension roller 332 includes a free roller attached to the distal end side of a rotation lever 336 that is pivotally supported about the rotation axis of the guide roller 333.

  The rotation lever 336 is spring-biased in a direction that always presses the tension roller 332 outward (right side in FIG. 5) by a spring-biasing means (not shown), thereby tensioning the tape substrate 21 with a constant tension. Be able to.

  The discharge unit 310 is connected to a peeling material melting unit (not shown), and is held at a predetermined height away from the fixing unit 320. A discharge nozzle 311 is provided on the lower end surface of the discharge unit 310 for dripping the molten release material 41 downward.

  The fixing unit 320 guides the fixing rollers 321 and 321 arranged to be opposed to each other on both sides of the tape base material 21, the holding unit 322 that holds the fixing rollers 321 and 321, and the holding unit 322 slidably up and down. And a slider 323.

  The fixing rollers 321 and 321 are preferably rollers having a smooth surface whose surface is plasma-treated, and are set to rotate at a constant surface speed by a predetermined driving means. The fixing rollers 321 and 321 are provided symmetrically with respect to the drop point of the discharge nozzle 311 so that the flow of the release material 41 dropped from the discharge unit 310 can be stabilized and fixed to the tape substrate 21. ing.

  In this example, the fixing rollers 321 and 321 are formed of plasma rollers. However, a silicon rubber roller or a fluorine coat roller may be used in addition to this, as long as the molten release material 41 does not stick to the fixing roller 321 side. For example, it can be arbitrarily selected according to the specification.

  The holding unit 322 includes a sturdy metal frame that holds the fixing rollers 321 and 321, and is provided so that the height can be adjusted up and down via a slider 323. The slider 323 includes a biaxial slider in the X-axis direction (left and right direction in FIG. 5) and the Z-axis direction (up and down direction in FIG. 5), and the holding unit 322 is subjected to coating conditions such as the material of the release material 41 and the melting temperature. Accordingly, the fixing positions of the fixing rollers 321 and 321 can be freely changed.

  Referring to FIG. 3, a neutralizing unit 400 for removing static electricity charged on the tape base 21 is provided between the first coating unit 200 and the second coating unit 300. The static elimination means 400 is made of a contact-type static elimination body that comes into contact with a polyethylene layer provided under the tape base material 21. In addition, as long as the static elimination means 400 can remove the static electricity charged to the tape base material 21, the form will not be specifically limited.

  According to this, by removing the static electricity charged on the tape base material 21, the release material dripping down by the second coating means 300 is attracted to the tape base material 21 by the electrostatic adsorption force, and in a deformed state. Fixing can be prevented.

  Next, with reference to FIGS. 3-6, an example of the manufacture procedure of the adhesive tape by the manufacturing apparatus of this invention is demonstrated. First, as a preparation, after the mother roll 110 is attached to the manufacturing apparatus 100, the tape base material 21 is set on the tape base material conveyance path 130, and one end thereof is wound around the take-up roll 120.

  After the initial preparation is completed, when the start button is operated, the control means (both not shown) rotationally drives each guide roller including the winding roller 120. Thereby, the tape base material 21 starts moving along the tape base material conveyance path 130.

  When the tape base material 21 is conveyed to the first coating means 200, the adhesive material pushed out from the discharge nozzle 221 is uniformly applied to one surface (the right surface in FIG. 4) of the tape base material 21. Thereby, the adhesive material layer 22 having a certain thickness is formed on the tape base material 21.

  The tape base material 21 that has passed through the first coating means 200 is first cooled from the back side of the tape base material 21 by the chiller roller 236, and then further cooled by passing through the guide roller 237, whereby the adhesive material layer 22 is fixed.

  The tape base 21 is stretched to a constant tension by the tension rollers 332 and 333, and goes to the static elimination means 400, and the static electricity charged on the tape base 21 is neutralized by the static elimination means 400.

  The tape base material 21 that has been neutralized by the static eliminating means 400 is conveyed to the next second coating means 300. In the second coating means 300, the melt release material 41 pushed out from the discharge nozzle 310 of the discharge unit 310 falls freely and is dropped onto the adhesive surface 22 a of the tape substrate 21 almost simultaneously with the fixing rollers 321 and 321. Inhaled in between.

  The release material 41 that has fallen on the adhesive surface 22a is pressed against the tape base material 21 by the fixing rollers 321 and 321 and rolled so as to be slightly flat, thereby being fixed onto the tape base material 21. Thereafter, the tape substrate 21 is cooled by the chiller roller 335, whereby the release material layer 41 is fixed on the tape substrate 21.

  In this example, the release material layer 41 is formed by hanging the melt release material 41 in a streak shape at a predetermined interval from the discharge nozzle 311 as shown in FIG. As shown, the release material layer 41 can also be formed in a dot shape by intermittently discharging at a constant time interval. Furthermore, as shown in FIG. 6C, the discharge nozzle 311 can be formed in a wave shape by reciprocating in the left-right direction by a driving means (not shown). In addition, you may move the tape base material 21 right and left.

  Finally, the tape base material 21 is wound up by the winding roller 120 via the inspection processing means for the release material layer 41, and the series of manufacturing steps is completed.

  In this example, nothing is provided in the discharge unit 300. More preferably, however, a windshield, a vibration isolating means, or the like is incorporated so that the flow of the molten release material 41 is not disturbed by wind or vibration. But you can.

The perspective view of the adhesive tape roll produced with the manufacturing apparatus of this invention. AA sectional view taken on the line AA of FIG. The structure figure which showed typically the manufacturing apparatus of the adhesive tape which concerns on one Embodiment of this invention. The principal part enlarged view of a 1st coating means. The principal part enlarged view of a 2nd coating means. (A) The schematic diagram at the time of forming a peeling material layer in the shape of a line, (b) The schematic diagram at the time of forming a peeling material layer in the shape of a dot.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Adhesive tape roll 2 Adhesive tape 21 Base material 22 Adhesive surface 3 Core 41 Release material layer 100 Manufacturing apparatus 110 Mother roll 120 Winding roll 130 Tape base material conveyance path 200 1st coating means 210 Cooling roll 220 Coating unit 300 Second coating means 310 Discharge unit 320 Fixing unit 321 Fixing roller

Claims (8)

A tape base material transport path for transporting the tape base material fed from the mother roll toward the take-up roll is provided, and an adhesive material is applied to one surface of the tape base material on the tape base material transport path. In the production apparatus of the adhesive tape that forms the layer,
As a first coating means for forming the adhesive layer on one surface of the tape base material , and as a peeling means for the other surface of the base material, provided at a position away from the tape base material by a predetermined height, A second coating means for partially forming a release material layer on the adhesive material layer,
The second coating means includes a discharge unit for dropping a release material on the tape base material, and a fixing unit for fixing the release material dropped on the tape base material to the tape base material. The fixing unit includes a pair of fixing rollers for fixing the release material to the tape base material.
Each of the fixing rollers is provided oppositely across the dropping point of the release material, and is provided so that the distance from the discharge unit to the dropping point can be adjusted . Manufacturing equipment.   The first coating means includes a cooling roller having a cooling function and a coating unit that discharges the adhesive material. The coating unit faces the cooling roller across the tape base material. The pressure-sensitive adhesive tape manufacturing apparatus according to claim 1, wherein the pressure-sensitive adhesive tape is arranged. The first coating section, adhesive tape manufacturing apparatus according to claim 1 or 2, characterized in that the coating fabric on almost the whole or streaks on one surface of the tape substrate of the above adhesive. 4. The adhesive tape according to claim 1, wherein the second coating means drops the release material in a streak shape, a dotted shape, or a wave shape on the adhesive material layer. 5. Manufacturing equipment.   The pressure-sensitive adhesive tape manufacturing apparatus according to any one of claims 1 to 4, wherein the release material layer has a width of 1 mm or less and a thickness of 30 to 120 µm.   6. A neutralizing means for removing static electricity charged on the tape base material is provided between the first coating means and the second coating means. The manufacturing apparatus of the adhesive tape of 1 item | term.   The synthetic resin material which has rubber type acrylic type, urethane type, EVA type and / or amorphous α-olefin type as a main component is used as the release material. The manufacturing apparatus of the adhesive tape of description.   A pressure-sensitive adhesive tape roll, wherein the pressure-sensitive adhesive tape produced by the pressure-sensitive adhesive tape manufacturing apparatus according to any one of claims 1 to 7 is wound so that the pressure-sensitive adhesive surface faces the front side.

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