JP4741252B2 - COMPOSITE SHEET, LAMINATE, AND METHOD FOR PRODUCING COMPRESSED LAMINATE - Google Patents

Description

  The present invention relates to a composite sheet comprising a conductor pattern layer and a dielectric layer, a laminate, and a method for producing a pressure-bonded laminate obtained by pressing a laminate of the conductor pattern layer and the dielectric layer.

  Conventionally, a multilayer ceramic capacitor in which a large number of dielectric layers and internal electrode layers are laminated to form a laminate, and the internal electrode layers are alternately connected to external electrodes at different end faces of the laminate is as follows. It was manufactured.

  As shown in FIG. 6, after applying and drying the dielectric slurry on the support, the electrode-attached sheet 17 on which the conductive paste serving as the internal electrode is printed is sequentially laminated until the predetermined number of layers is reached.

  According to such a manufacturing method, the greater the number of stacked layers, the step due to the difference in thickness between the printed portion of the internal electrode and the non-printed portion of the internal electrode depending on the thickness of the internal electrode, that is, the central portion and the end of the capacitor. The level | step difference in a part became large and the problem that delamination, such as delamination, generate | occur | produced after baking occurred.

As a method for solving such a problem, a conductor printed on a dielectric layer as shown in FIG. 7 in order to prevent a step due to a difference in thickness between a printed portion of the internal electrode and a non-printed portion of the internal electrode. There has been proposed a method in which a dielectric embedded ink having the same composition as that of a dielectric is embedded in advance in a portion corresponding to a gap in the pattern layer and laminated. According to this method, it is possible to reduce the step due to the presence or absence of printing of the internal electrode in the pressurization laminating step and the pressing step after the lamination. The difference in applied pressure is reduced to effectively prevent delamination (see, for example, Patent Document 1).
JP-A-2-36514 JP 59-228711 A

  However, such a manufacturing method requires an additional step of embedding the dielectric embedding ink in the gap between the conductor pattern layers printed on the dielectric layer, and in addition, a high-precision alignment is required at the time of embedding. Will be.

  In order to eliminate such a process, as shown in FIG. 8, after a conductor pattern layer is first printed on a support, a method of applying a dielectric so as to cover it has been proposed (for example, Patent Document 2).

  However, in such a manufacturing method, as the dielectric is dried, the dielectric thickness of the non-printing portion of the internal electrode becomes thinner than the dielectric thickness of the printing portion of the internal electrode, and finally a step is generated on the surface. End up.

  An object of the present invention is to suppress a step due to a difference in thickness of a conductor pattern layer without embedding a dielectric embedded ink in a non-formation region (a gap portion) of the conductor pattern layer printed on the dielectric layer. It is to provide a composite sheet.

The composite sheet of the present invention is a composite sheet in which a conductor pattern layer and a dielectric layer are overlapped, and both the hardness of the conductor pattern layer and the hardness of the dielectric layer are changed to an organic binder, a dispersant and a plasticizer The surface hardness a of the conductor pattern layer and the surface hardness b of the dielectric layer satisfy the relational expression of | a−b | ≦ 98 MPa by adjusting the content of is there.

  Furthermore, the surface hardness a of the conductor pattern layer and the surface hardness b of the dielectric layer are both 68.6 MPa or more.

Further, the laminate of the present invention is a laminate comprising a large number of conductor pattern layers and dielectric layers, wherein both the hardness of the conductor pattern layer and the hardness of the dielectric layer are determined using an organic binder and a dispersant. And by adjusting the content of the plasticizer, the surface hardness a of the conductor pattern layer and the surface hardness b of the dielectric layer satisfy a relational expression of | a−b | ≦ 98 MPa. To do.

  Furthermore, the surface hardness a of the conductor pattern layer and the surface hardness b of the dielectric layer of the laminate are both 68.6 MPa or more.

  Moreover, the manufacturing method of the crimping | compression-bonded laminated body of this invention laminates | stacks the composite sheet of Claim 1, and consists of a sparse part corresponding to the non-formation area | region of a conductor pattern layer, and a dense part corresponding to the other area | region. A step of forming a laminated body, and a step of forming a pressure-bonded laminated body by pressing the laminated body in a laminating direction and moving a part of the conductor pattern layer and the dielectric layer from the dense portion to the sparse portion. It has.

  In addition, the composite sheet is formed on a support, and after being laminated together with the support, a laminate is formed by repeating a process of peeling only the support.

  Furthermore, the composite sheet is formed on a support and is laminated in a state of being peeled from the support.

  Furthermore, the method for manufacturing a pressure-bonded laminate according to the present invention includes a conductor pattern layer and a dielectric layer, and a sparse portion corresponding to a non-formation region of the conductor pattern layer and a dense portion corresponding to other regions. 5. The step of forming the laminate according to claim 4, and press-bonding the laminate in the laminating direction to move a part of the conductor pattern layer and the dielectric layer from the dense portion to the sparse portion. And a step of forming a laminated body.

  According to the composite sheet of the present invention, in the composite sheet formed by superimposing the conductor pattern layer and the dielectric layer, the hardness of the conductor pattern layer and the hardness of the dielectric layer are set to be approximately equal. At this time, even if the applied pressure is large or small due to the step corresponding to the non-formation region of the conductive pattern layer, the conductive pattern layer and the dielectric layer move / deform from a large applied pressure portion to a small applied portion, As a result, the entire composite sheet can be uniformly pressure-bonded. In particular, when the surface hardness a of the conductor pattern layer and the surface hardness b of the dielectric layer satisfy the relational expression | a−b | ≦ 98 MPa, the above movement / deformation of the conductor pattern layer and the dielectric layer is more effective. Therefore, the entire composite sheet can be uniformly pressure-bonded.

  In addition, the surface hardness a of the conductor pattern layer and the surface hardness b of the dielectric layer are both set to be 68.6 MPa or more, thereby suppressing excessive movement and deformation of the conductor pattern layer and the dielectric layer. Thus, the sheet shape can be maintained.

  Further, according to the laminate of the present invention, in the laminate formed by laminating a large number of conductor pattern layers and dielectric layers, the hardness of the conductor pattern layer and the hardness of the dielectric layer are set substantially equal. When pressure is applied, the conductor pattern layer and the dielectric layer move / deform from a part with a large pressure to a small part even if the pressure is large or small due to a step corresponding to the non-formation area of the conductor pattern layer. And the above-mentioned level | step difference is relieve | moderated, and it becomes possible to apply pressure bonding to the whole laminated body uniformly. In particular, when the surface hardness a of the conductor pattern layer and the surface hardness b of the dielectric layer satisfy the relational expression | a−b | ≦ 98 MPa, the above movement / deformation of the conductor pattern layer and the dielectric layer is more effective. Therefore, the entire laminate can be uniformly pressure-bonded.

  In addition, the surface hardness a of the conductor pattern layer and the surface hardness b of the dielectric layer are both set to be 68.6 MPa or more, thereby suppressing excessive movement and deformation of the conductor pattern layer and the dielectric layer. Thus, the laminate shape can be maintained. The effect is more effective as the number of layers increases.

  Furthermore, the method for manufacturing a pressure-bonded laminate according to the present invention includes a step of forming a composite sheet by superimposing a conductor pattern layer and a dielectric layer, and laminating a plurality of composite sheets to correspond to a non-formation region of the conductor pattern layer. Forming a laminated body composed of dense portions corresponding to the portion and other regions, and pressing the laminated body in the laminating direction to move a part of the conductor pattern layer and the dielectric layer from the dense portion to the sparse portion. In the method of manufacturing a pressure-bonded laminate having a step of forming a pressure-bonded laminate, the hardness of the conductor pattern layer and the hardness of the dielectric layer are set to be approximately equal. Even if the applied pressure is large or small due to a step corresponding to the non-formation area of the conductive pattern layer, the conductive pattern layer and the dielectric layer move / deform from a dense portion where the applied pressure is large to a small sparse portion. For pattern layer thickness By step is alleviated that enables uniform applied pressure bonding of the laminate as a whole, delamination including after firing can be effectively prevented from occurring.

  In addition, the composite sheet is formed on a support, and after being laminated together with the support, a laminate is formed by repeating a process of peeling only the support.

  Furthermore, the composite sheet is formed on a support and is laminated in a state of being peeled from the support.

  Furthermore, according to the method for manufacturing a pressure-bonded laminate of the present invention, the conductor pattern layer and the dielectric layer are laminated, and the sparse portion corresponding to the non-formation region of the conductor pattern layer and the dense portion corresponding to the other region. A step of forming a laminated body comprising: a step of pressurizing the laminated body in the laminating direction and forming a pressure-bonded laminated body by moving a part of the conductor pattern layer and the dielectric layer from the dense part to the sparse part. Since the hardness of the conductor pattern layer and the hardness of the dielectric layer are set to be approximately equal in the manufacturing method of the pressure-bonded laminate, the pressure is caused by a step corresponding to the non-formation region of the conductor pattern layer when the laminate is pressed. Even if the applied pressure is large or small, the conductive pattern layer and dielectric layer move and deform from the dense part where the applied pressure is large to the small sparse part, and the step due to the thickness of the conductive pattern layer is alleviated. Uniform pressure throughout the body Wear is possible, delamination including after firing can be effectively prevented from occurring.

  Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 3 is a cross-sectional view showing a multilayer ceramic capacitor (multilayer electronic component) formed using the multilayer body according to one embodiment of the present invention. The multilayer ceramic capacitor 1 is roughly composed of an insulating layer 2, An internal electrode (conductor pattern layer) 3, a dielectric layer 4, and an external electrode 5 are included.

  The multilayer ceramic capacitor 1 is made of the same material as that of the dielectric layer 4 on both upper and lower main surfaces of a pressure-bonded laminate 1 ′ obtained by alternately laminating internal electrodes 3 and dielectric layers 4 having a predetermined dielectric constant. The insulating layer 2 is formed, and an external electrode 5 electrically connected to the internal electrode 3 is attached and formed at both ends thereof. The multilayer ceramic capacitor 1 applies a predetermined voltage to the adjacent internal electrodes 3-3 through the external electrodes 5, and applies a predetermined capacitance to the dielectric layer 4 disposed between the internal electrodes 3-3. It functions as a capacitor by forming.

  In addition, what is necessary is just to set suitably the lamination | stacking number of the dielectric material layer 4 and the internal electrode 3, for example, set to 30-600 layers. The material and thickness of the dielectric layer 4 and the facing area of the internal electrode 3 may be determined as appropriate according to the desired capacitance.

  The dielectric layer 4 is formed by applying and drying a dielectric slurry by a doctor blade method or the like, and this dielectric slurry is made by mixing a dielectric material, an organic binder, an organic solvent, a dispersant, a plasticizer, and the like. Become.

  The dielectric material is not particularly limited as long as it is used for a general ceramic capacitor, and a temperature compensation material and a high dielectric constant material are also used. For example, a barium titanate-based lead-containing perovskite material may be used.

  The organic binder is not particularly limited, and may be appropriately selected from various ordinary organic binders such as polyvinyl butyral, ethyl cellulose, acrylic polymer, vinyl chloride polymer, ester polymer, imide polymer, and urethane polymer.

  The organic solvent is not particularly limited, and ketone solvents such as acetone, methyl ethyl ketone (MEK), methyl isobutyl ketone (MIBK), cyclohexanone, ester solvents such as methyl acetate, ethyl acetate, butyl acetate, methanol, ethanol, isopropanol, α -Alcohol solvents such as terpineol, hydrocarbon solvents such as hexane, benzene, toluene, xylene, ether solvents such as glycol dimethyl ether, glycol monoethyl ether, dioxane, tetrahydrofuran, acetic acid, propionic acid, hexanoic acid, isononanoic acid, What is necessary is just to select suitably from the various solvents of carboxylic acid-type solvents, such as octylic acid, and these solvents can also be used in mixture of 2 or more types.

  The hardness of the dielectric layer 4 can be adjusted by changing the contents of the organic binder, dispersant, plasticizer, and the like in the dielectric slurry. Here, the hardness of the dielectric layer 4 means the degree of external change due to pressurization. For example, in the indentation test in which an indenter having a triangular pyramid shape is pushed at an extremely low load, the relationship between the load and the indentation depth. The surface hardness obtained from the load displacement curve representing can be used. The measuring device used for the indentation test is not particularly limited as long as it can measure the depth of the minute indentation that can be obtained by pushing the indenter at an extremely low load (for example, an ultra-small indentation hardness tester, a scanning device). In this embodiment, a nanoindentation tester manufactured by Elionix Co., Ltd. having high displacement resolution was used. The hardness of the dielectric layer 4 is measured in a dry state, that is, in a state where the remaining amount of the solvent is less than 1%.

  The hardness b of the dielectric layer 4 may be in the range of 68.6 to 303.8 MPa, for example.

  The conductive pattern layer 3 is formed by applying and drying this conductive paste by screen printing or a coating method, and this conductive paste is made by mixing a conductive material, an organic binder, an organic solvent, a dispersant, a plasticizer, and the like. Become.

  As the conductive material, an electrode material suitable for the above-described dielectric material may be selected. Conductive materials made of various conductive metals and alloys such as nickel, silver, platinum, palladium, gold, copper, or the above-mentioned conductive materials after firing. Various oxides, organometallic compounds, and the like that are used as materials may be used. For example, what is necessary is just to select suitably from 1 or more types of noble metals selected from Pb, Pt, Ag, Au, etc., or its alloy, or base metals, such as Ni and Cu.

  The organic binder is not particularly limited, and may be appropriately selected from various ordinary organic binders such as polyvinyl butyral, ethyl cellulose, acrylic polymer, vinyl chloride polymer, ester polymer, imide polymer, and urethane polymer. Polyvinyl butyral.

  The organic solvent is not particularly limited, and ketone solvents such as acetone, methyl ethyl ketone (MEK), methyl isobutyl ketone (MIBK), cyclohexanone, ester solvents such as methyl acetate, ethyl acetate, butyl acetate, methanol, ethanol, isopropanol, α -Alcohol solvents such as terpineol, hydrocarbon solvents such as hexane, benzene, toluene, xylene, ether solvents such as glycol dimethyl ether, glycol monoethyl ether, dioxane, tetrahydrofuran, acetic acid, propionic acid, hexanoic acid, isononanoic acid, What is necessary is just to select suitably from the various solvents of carboxylic acid-type solvents, such as octylic acid, and these solvents can also be used in mixture of 2 or more types.

  The hardness of the conductor pattern layer 3 can be adjusted by changing the content of the organic binder, dispersant, plasticizer, etc. in the conductive paste, similar to the dielectric layer 4, and the same as the dielectric layer 4. What is necessary is just to measure surface hardness with a measuring method.

  What is necessary is just to make the surface hardness a of the conductor pattern layer 3 into the range of 68.6-303.8 MPa, for example.

  Here, the hardness of the conductor pattern layer 3 and the hardness of the dielectric layer 4 are set so as to be substantially equal to each other, and this causes a step corresponding to a non-formation region of the conductor pattern layer 3 when pressurizing. Even if there is a magnitude in the pressing force, the conductor pattern layer 3 and the dielectric layer 4 move / deform from a portion where the pressing force is large to a small portion without restraining each other, and the above-described step is alleviated. The entire laminate 1 can be uniformly pressure-bonded.

  In particular, the surface hardness a of the conductor pattern 3 and the surface hardness b of the dielectric layer 4 are preferably set in a range of | a−b | ≦ 98 MPa. The above movement / deformation occurs more effectively, and the entire laminate 1 can be uniformly pressure-bonded.

  The material of the external electrode 5 is not particularly limited, and a material generally used for a multilayer ceramic capacitor may be used.

≪Manufacturing method≫
Hereinafter, a method for manufacturing the above-described multilayer ceramic capacitor will be described with reference to FIGS.

  Here, FIG. 1 is a cross-sectional view for explaining a method for producing a laminate according to an embodiment of the present invention, wherein (a) is a diagram showing a process of forming a composite sheet, and (b) is a composite sheet. The figure showing the process of laminating | stacking (c) is a figure showing a laminated body. FIG. 2 is a cross-sectional view illustrating a process of pressurizing the laminate according to the embodiment of the present invention. FIG. 3 is a cross-sectional view illustrating a multilayer ceramic capacitor formed using the multilayer body according to the embodiment of the present invention.

<Step 1>
First, as shown in FIG. 1A, a dielectric layer 4 is formed on a support 6 by applying the above-mentioned dielectric slurry by a doctor blade method or the like and drying it. The above-mentioned conductive paste is applied by screen printing, a coating method, or the like and dried to form the conductive pattern layer 3 to obtain a composite sheet 7.

  Here, the contents of the organic binder, the dispersant, the plasticizer, and the like are adjusted so that the hardness of the conductor pattern layer 3 and the hardness of the dielectric layer 4 are substantially equal.

  Examples of the material of the support 6 include polyesters such as polyethylene terephthalate and polyethylene-2,6-naphthalate, polyolefins such as polypropylene, plastics such as cellulose derivatives, polyamide, and polycarbonate. Polyethylene terephthalate is preferable in terms of excellent tensile strength and heat resistance.

<Process 2>
Next, as shown in FIG. 1B, a composite sheet 7 is laminated with a support 6 using an adsorption plate 11 on an insulating layer 2 made of the same composition as the dielectric layer 4, and then the support A plurality of composite sheets 7 are laminated by repeating the process of peeling only 6 a plurality of times, and as shown in FIG. 1 (c), the sparse part 8 corresponding to the non-formation region of the conductor pattern layer 3 and other regions The laminate 1 having the corresponding dense portion 9 is formed.

<Step 3>
Then, as shown in FIG. 2, the laminate 1 is pressed in the laminating direction, and a part of the conductor pattern layer 3 and the dielectric layer 4 is moved from the dense portion 9 to the sparse portion 8, so that the crimp laminate 1 ′ is formed. Form.

  In this way, when the laminate 1 (or the composite sheet 7) is pressed, even if the applied pressure is large or small due to a step corresponding to the non-formation region of the conductor pattern layer 3, the conductor pattern layer 3 and the dielectric The body layer 4 is moved and deformed so as to be pushed out from the dense portion 9 having a large applied pressure to the small sparse portion 8, and the step due to the thickness of the conductor pattern layer 3 is relaxed. Wearing is possible. In addition, the pressure-bonded laminate 1 ′ thus formed can effectively suppress the occurrence of delamination including after firing.

  The pressure-bonded laminate 1 ′ formed as described above is separated into individual chip-type multilayer ceramic bodies and fired at 1340 ° C. Then, the multilayer ceramic capacitor 1 as shown in FIG. 3 was obtained by forming the external electrode for taking out electricity by electrically connecting to both ends of the internal electrode.

  First, dielectric layer 4 is composed of 9 to 13 parts by weight of polyvinyl butyral (PVB) as an organic binder and 1 to 3 parts by weight of diisononyl phthalate (DINP) as a plasticizer with respect to 100 parts by weight of ceramic dielectric powder. A dielectric slurry was prepared by mixing 120 parts by weight of ethanol as a solvent, and this dielectric slurry was formed and dried to a thickness of 3.0 μm.

  Next, with respect to 100 parts by weight of the metallic nickel powder, 4.5 to 7.5 parts by weight of PVB as an organic binder, 0.5 to 3 parts by weight of DINP as a plasticizer, and 90 parts by weight of octylic acid as a solvent , And a conductive paste was printed and dried on the dielectric layer 4 with a thickness of 1.7 μm by a screen printing method or the like to obtain a conductor pattern layer 3.

  The composite sheet 7 formed by laminating these dielectric layers 4 and the internal electrodes 3 is successively pressed and laminated at a pressure of 3.92 MPa on the insulating layer 2 which is the outermost layer, and then the outermost insulating layer is again formed. Layer 2 was laminated to form laminate 1. Then, the entire laminate 1 was pressed at a pressure of 98 MPa to form a press-bonded laminate 1 ′.

Table 1 shows the results obtained by quantitatively measuring the size of the step and the deformation rate of the pressure-bonded laminate 1 ′ thus obtained.

In Table 1, “step” refers to the conductive pattern layer 3 (or dielectric layer 4) located in the uppermost layer and the lowermost layer in the press-bonded laminate 1 ′ after pressing, as shown in FIG. 4 represents a value obtained by measuring the magnitudes of the steps L1 and L2 in the dense portion 9 and the sparse portion 8 and adding them, and the “deformation rate” is shown in FIGS. 4 (a) and 4 (b). as, at the site of 20mm inward from the end of the crimp laminate 1 'of the planar shape 150 mm ^2, the ratio of deformation amount T2 in the longitudinal direction of the internal electrode located on the outermost layer to the thickness T1 of the crimping laminate 1' ( T1 / T2 × 100).

  According to this, if the hardness of the dielectric layer 4 and the hardness of the conductor pattern layer 3 are adjusted to be in the range of 68.6 to 303.8 MPa, the step in the laminated ceramic capacitor after lamination is improved. And it turns out that a deformation | transformation can be suppressed. In particular, the surface hardness a of the conductor pattern layer 3 and the surface hardness b of the dielectric layer 4 obtained by an indentation test with an extremely low load are | a−b | ≦ 98 MPa, preferably | a−b | ≦ 29. By adjusting the pressure to 4 MPa, a multilayer ceramic capacitor can be obtained in which deformation is suppressed and the level difference is small.

  In addition, the surface hardness obtained by the indentation test of the very low load of the dielectric material layer 4 and the conductor pattern layer 3 in Table 1 is the same as Example No. The dielectric layer 4 and the conductive pattern layer 3 of 1 are respectively 11.5 parts by weight of polyvinyl butyral (PVB) and 1.1 parts of diisononyl phthalate (DINP) as a plasticizer with respect to 100 parts by weight of ceramic dielectric powder. A dielectric slurry formed by mixing 9 parts by weight is formed and dried to 6.5 parts by weight of PVB and 1.6 parts by weight of DINP as a plasticizer with respect to dielectric layer 4 and 100 parts by weight of metallic nickel powder. It is the conductor pattern layer 3 which printed and dried the electrically conductive paste formed by mixing a part.

  The pressure-bonded laminate 1 ′ formed as described above is separated into individual chip-type multilayer ceramic bodies and fired at 1340 ° C. Then, the multilayer electrode capacitor was obtained by forming the external electrode for electrically connecting to both ends of the internal electrode and taking out electricity.

  Next, the characteristics of several dozen ceramic capacitors formed as described above were examined. As the multilayer ceramic capacitor, the above-mentioned Example No. Five things were used.

  As a result, according to the present invention, the electrical characteristics similar to those of the multilayer ceramic capacitor embedded with the dielectric ink as shown in FIG. In addition, it was found that no structural defects such as delamination caused by steps due to the thickness of the electrode were observed.

  In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.

  In the above-described embodiments, the multilayer ceramic capacitor has been described as an example. However, the present invention can also be applied to other multilayer electronic components, that is, wiring boards, piezoelectric components, filters, inductors, and resistors.

  Moreover, in the above-mentioned embodiment, the composite sheet 7 was laminated | stacked with the support body 6, and after that, the laminated body 1 was formed so that only the support body 6 might be peeled, However, instead of this, as shown in FIG. In addition, the composite sheet 7 may be laminated in a state of being peeled from the support 6.

It is sectional drawing for demonstrating the manufacturing method of the laminated body which concerns on one Embodiment of this invention, (a) is a figure showing the process of forming a composite sheet, (b) is a figure showing the process of laminating | stacking a composite sheet. (C) is a figure showing a laminated body. It is sectional drawing showing the process of pressing the laminated body which concerns on one Embodiment of this invention. It is sectional drawing showing the multilayer ceramic capacitor formed using the laminated body which concerns on one Embodiment of this invention. It is sectional drawing showing the crimping | bonding laminated body which concerns on one Embodiment of this invention, (a) is a figure which shows a cut position, (b) is a figure showing a level | step difference and a deformation rate. It is sectional drawing for demonstrating the manufacturing method of the laminated body which concerns on other embodiment of this invention, (a) is a figure showing the process of forming a composite sheet, (b) peels a composite sheet from a support body. The figure showing a process, (c) is a figure showing the process of laminating | stacking a composite sheet and forming a laminated body. It is sectional drawing for demonstrating the manufacturing method of the conventional laminated body, (a) is a figure showing the process of forming a sheet | seat with an electrode, (b) is the process of laminating | stacking a sheet | seat with an electrode and forming a laminated body. FIG. It is sectional drawing showing the conventional sheet | seat with an electrode, and shows what embedded the dielectric embedding ink in the clearance gap part of the electrode especially. It is sectional drawing showing the conventional sheet | seat with an electrode, and shows that a dielectric material dents by drying especially.

Explanation of symbols

10 ..... Multilayer ceramic capacitors (electronic parts)
DESCRIPTION OF SYMBOLS 1 ..... Laminated body 1 '..... Crimping laminated body 2 ...... Insulating layer 3, 13 ... Internal electrode (conductor pattern layer)
4, 14 ... Dielectric layer 5 ... External electrode 6, 16 ... Support 7 ... Composite sheet 8 ... ··· Sparse part 9 ······························································ 18

Claims (8)

In the composite sheet composed of the conductor pattern layer and the dielectric layer,
Both hardness hardness and the dielectric layer of the conductor pattern layer, an organic binder, by adjusting the content of the dispersing agent and a plasticizer,
A composite sheet wherein the surface hardness a of the conductor pattern layer and the surface hardness b of the dielectric layer satisfy a relational expression of | a−b | ≦ 98 MPa . 2. The composite sheet according to claim 1, wherein a surface hardness a of the conductor pattern layer and a surface hardness b of the dielectric layer are both 68.6 MPa or more. In a laminate formed by laminating a large number of conductor pattern layers and dielectric layers,
Both hardness hardness and the dielectric layer of the conductor pattern layer, an organic binder, by adjusting the content of the dispersing agent and a plasticizer,
A laminate having a surface hardness a of the conductor pattern layer and a surface hardness b of the dielectric layer satisfying a relational expression of | a−b | ≦ 98 MPa . The laminate according to claim 3 , wherein the surface hardness a of the conductor pattern layer and the surface hardness b of the dielectric layer are both 68.6 MPa or more. A step of laminating a plurality of the composite sheets according to claim 1 to form a laminate comprising a sparse portion corresponding to a non-formation region of the conductor pattern layer and a dense portion corresponding to other regions;
Pressurizing the laminate in the laminating direction, and forming a crimp laminate by moving a part of the conductor pattern layer and the dielectric layer from the dense portion to the sparse portion. Production method. 6. The pressure-bonded laminate according to claim 5 , wherein the composite sheet is formed on a support, and after being laminated together with the support, a laminate is formed by repeating a process of peeling only the support. Body manufacturing method. The method for producing a pressure-bonded laminate according to claim 5 , wherein the composite sheet is formed on a support and laminated in a state of being peeled from the support. The process of forming the laminated body of Claim 3 which laminates | stacks a conductor pattern layer and a dielectric material layer, and consists of a sparse part corresponding to the non-formation area | region of the said conductor pattern layer, and a dense part corresponding to the other area | region. When,
Pressurizing the laminate in the laminating direction, and forming a crimp laminate by moving a part of the conductor pattern layer and the dielectric layer from the dense portion to the sparse portion. Production method.

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