JP4742538B2 - Resin composition and semiconductor product - Google Patents
Resin composition and semiconductor product Download PDFInfo
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- JP4742538B2 JP4742538B2 JP2004244645A JP2004244645A JP4742538B2 JP 4742538 B2 JP4742538 B2 JP 4742538B2 JP 2004244645 A JP2004244645 A JP 2004244645A JP 2004244645 A JP2004244645 A JP 2004244645A JP 4742538 B2 JP4742538 B2 JP 4742538B2
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- 239000011342 resin composition Substances 0.000 title claims description 31
- 239000004065 semiconductor Substances 0.000 title claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 22
- 239000000843 powder Substances 0.000 claims description 20
- 150000001875 compounds Chemical class 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 150000008065 acid anhydrides Chemical class 0.000 claims description 5
- 150000008064 anhydrides Chemical class 0.000 claims description 4
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 claims description 2
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 claims description 2
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 claims description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 230000006866 deterioration Effects 0.000 description 11
- 239000002245 particle Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 125000002723 alicyclic group Chemical group 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 239000000539 dimer Substances 0.000 description 3
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- WADSJYLPJPTMLN-UHFFFAOYSA-N 3-(cycloundecen-1-yl)-1,2-diazacycloundec-2-ene Chemical compound C1CCCCCCCCC=C1C1=NNCCCCCCCC1 WADSJYLPJPTMLN-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
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- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Description
本発明は、樹脂組成物及び半導体製品に関するものである。 The present invention relates to a resin composition and a semiconductor product.
液晶ディスプレーのバックライト以外にも低消費電力、長寿命、軽量といった特徴を有する光半導体（発光ダイオード（ＬＥＤ））（例えば特許文献１参照）を蛍光灯代替照明、自動車のヘッドランプとして使用する試みが行われているが、本目的のために輝度を向上させるとともに輝度の劣化の少ないＬＥＤ製品の開発が必要である。
輝度を上げるためには一定面積に多くのダイオードを並べる必要があるため、表面実装タイプのＬＥＤを使用する必要があり、また照明として使用するためには青〜白色発光させる必要がある。従来より用いられている光半導体素子接着用の導電性接着剤はエポキシなどの樹脂成分に導電性フィラーとして銀粉を配合したものが用いられてきたが、フィラーとして使用している銀粉は青〜白色光（波長３８０〜５００ｎｍ）に対して吸収が大きく反射光の高強度は望めない。また使用するエポキシ樹脂の種類によっては青〜白色光の吸収のみならず青〜白色光による劣化（黄変）の問題があった。また高輝度化にともなう発熱量の増加に対処するため高熱伝導性の接着剤が求められるようになってきており、満足するものは存在しなかった。
In order to increase the luminance, it is necessary to arrange a large number of diodes in a certain area. Therefore, it is necessary to use a surface-mount type LED, and it is necessary to emit blue to white light for use as illumination. Conventionally used conductive adhesives for bonding optical semiconductor elements have been made by blending silver powder as a conductive filler into a resin component such as epoxy, but the silver powder used as a filler is blue to white Absorption is large with respect to light (wavelength 380 to 500 nm), and high intensity of reflected light cannot be expected. Further, depending on the type of epoxy resin used, there is a problem of deterioration (yellowing) due to blue to white light as well as blue to white light absorption. Further, in order to cope with an increase in the amount of heat generated with the increase in brightness, a highly heat-conductive adhesive has been demanded, and there has been no satisfactory one.
本発明は、良好な紫外線反射率を有するとともに紫外線劣化が少なく、さらには良好な熱伝導率を有する半導体接着用樹脂組成物を提供するものであり、本樹脂組成物を用いることで高輝度かつ輝度劣化の少ない光半導体製品を提供するものである。 The present invention provides a resin composition for semiconductor adhesion having a good ultraviolet reflectivity, less ultraviolet deterioration, and a good thermal conductivity. By using this resin composition, high brightness and The present invention provides an optical semiconductor product with little luminance deterioration.
このような目的は、下記［１］〜［６］に記載の本発明により達成される。
［１］（Ａ）一般式（１）で示される化合物から選ばれる少なくとも１種類の化合物、（Ｂ）アルミニウム主成分とする第１の金属粉末、（Ｃ）前記アルミニウムと異なる金属を主成分とする第２の金属粉末を含む樹脂組成物。
Such an object is achieved by the present invention described in the following [1] to [6].
[1] (A) at least one compound selected from compounds represented by the general formula (1), (B) a first metal powder containing aluminum as a main component, and (C) a metal different from the aluminum as a main component. A resin composition comprising a second metal powder.
［２］更に、芳香族環を含まない有機ダイマー酸無水物を含む第［１］項記載の樹脂組成物。
［３］第２の金属粉末（Ｃ）が銀を主成分とする第［１］項記載の樹脂組成物。
［４］第１の金属粉末（Ｂ）と第２の金属粉末（Ｃ）とが体積比で５：９５〜４０：６０で含まれる第［１］項記載の樹脂組成物。
［５］第［１］〜［４］項のいずれかに記載の樹脂組成物を半導体素子と支持部材の接着用に使用して組み立てた半導体製品。
［６］半導体素子が発光ダイオードである第［５］項記載の半導体製品。
[2] The resin composition according to item [1], further comprising an organic dimer acid anhydride not containing an aromatic ring.
[3] The resin composition according to item [1], wherein the second metal powder (C) contains silver as a main component.
[4] The resin composition according to item [1], wherein the first metal powder (B) and the second metal powder (C) are contained in a volume ratio of 5:95 to 40:60.
[5] A semiconductor product assembled by using the resin composition according to any one of items [1] to [4] for bonding a semiconductor element and a support member.
[6] The semiconductor product according to item [5], wherein the semiconductor element is a light emitting diode.
本発明により、良好な紫外線反射率を有するとともに紫外線劣化が少なく、さらには良好な熱伝導率を有する半導体接着用樹脂組成物の提供が可能となり、本樹脂組成物を用いることで高輝度かつ輝度劣化の少ない光半導体製品を提供することが可能となる。 According to the present invention, it is possible to provide a resin composition for semiconductor adhesion that has a good ultraviolet reflectance, little ultraviolet deterioration, and good thermal conductivity. By using this resin composition, high brightness and brightness An optical semiconductor product with little deterioration can be provided.
一般に芳香族環を有しない脂環式のエポキシ樹脂は、紫外線吸収が少なく、紫外線による劣化が少ないことは公知であり、光半導体用の液状封止樹脂などでも、例えばセロキサイド２０２１Ｐ（商品名：ダイセル化学工業（株）製）などが使用されている。この化合物は脂環式のエポキシ基をエステル結合でつないだ構造であるが、車載用途などで要求される高温、加湿下ではエステル結合の劣化が見られる場合があり、紫外線透過率の低下につながる恐れがある。そこで高温、加湿下での劣化を防ぐ目的で本発明では一般式（１）に示される化合物から選ばれる少なくとも１種類の化合物（Ａ）が使用される。
化合物（Ａ）の硬化剤としては特に良好な紫外線透過率が求められる場合には有機ダイマー酸無水物が、より好ましくは芳香族環を含まない有機ダイマー酸無水物が使用される。このような化合物としては、ヘキサヒドロフタル酸無水物、テトラヒドロフタル酸無水物、メチルヘキサヒドロフタル酸無水物、メチルテトラヒドロフタル酸無水物、メチルハイミック酸無水物、トリアルキルテトラヒドロフタル酸無水物などが挙げられる。
In general, an alicyclic epoxy resin having no aromatic ring is known to have little ultraviolet absorption and little deterioration due to ultraviolet rays. For example, Celoxide 2021P (trade name: Daicel) is also used as a liquid sealing resin for optical semiconductors. Chemical Industry Co., Ltd.) is used. This compound has a structure in which an alicyclic epoxy group is connected by an ester bond, but deterioration of the ester bond may be observed under high temperatures and humidification required for in-vehicle applications, leading to a decrease in UV transmittance. There is a fear. Therefore, at least one compound (A) selected from the compounds represented by the general formula (1) is used in the present invention for the purpose of preventing deterioration under high temperature and humidification.
As the curing agent for the compound (A), an organic dimer acid anhydride, more preferably an organic dimer acid anhydride not containing an aromatic ring, is used when particularly good ultraviolet transmittance is required. Such compounds include hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methyl hexahydrophthalic anhydride, methyl tetrahydrophthalic anhydride, methyl hymic acid anhydride, trialkyltetrahydrophthalic anhydride, etc. Is mentioned.
本発明ではアルミニウム主成分とする第１の金属粉末（Ｂ）と前記アルミニウムと異なる金属を主成分とする第２の金属粉末（Ｃ）とが使用される。第１の金属粉末（Ｂ）を使用する理由は、アルミニウムが良好な紫外線反射率を有するためでアルミニウムの含有率が９５％以上であることが好ましい。また平均粒径は２０μｍ以下が好ましく、形状はフレーク状が好ましい。平均粒径がこれより大きい場合にはノズルを用いたディスペンス時にノズル詰まりを起こすあるいは詰まりは起こらないが吐出安定性の悪化する恐れがあるからであり、フレーク状が好ましいのは球状では十分な紫外線反射率が得られないからである。第２の金属粉末（Ｃ）を使用する理由は、第１の金属粉末のみを使用する場合には、良好な導電性、熱伝導性を得ることができないからである。導電性、熱伝導性の観点から第２の金属粉末（Ｃ）としては銀粉が好ましく、平均粒径は１０μｍ以下が、形状はフレーク状が好ましい。平均粒径がこれより大きいと樹脂組成物中での沈降が生じやすく分離の原因となる恐れがあるからで、フレーク状でない場合にも著しく分離しやすくなるからである。
第１の金属粉末（Ｂ）と第２の金属粉末（Ｃ）は体積比で５：９５〜４０：６０の範囲で含まれることが好ましい。金属粉末（Ｂ）がこれより少ないと紫外線の反射率が悪化し、これより多いと導電性、熱伝導性が悪化するからである。
In the present invention, the first metal powder (B) mainly composed of aluminum and the second metal powder (C) mainly composed of a metal different from the aluminum are used. The reason for using the first metal powder (B) is that aluminum has a good ultraviolet reflectance, and the aluminum content is preferably 95% or more. The average particle size is preferably 20 μm or less, and the shape is preferably flakes. If the average particle size is larger than this, nozzle clogging or clogging will not occur at the time of dispensing using a nozzle, but the discharge stability may be deteriorated. This is because the reflectance cannot be obtained. The reason for using the second metal powder (C) is that when only the first metal powder is used, good conductivity and thermal conductivity cannot be obtained. From the viewpoint of electrical conductivity and thermal conductivity, the second metal powder (C) is preferably silver powder, the average particle size is preferably 10 μm or less, and the shape is preferably flaky. This is because if the average particle size is larger than this, precipitation in the resin composition is likely to occur, which may cause separation.
It is preferable that 1st metal powder (B) and 2nd metal powder (C) are contained in the range of 5: 95-40: 60 by volume ratio. This is because if the amount of the metal powder (B) is less than this, the reflectivity of ultraviolet rays is deteriorated, and if it is more than this, the conductivity and thermal conductivity are deteriorated.
本発明の樹脂組成物には、必要により反応性希釈剤、カップリング剤、消泡剤、界面活性剤等の添加剤を用いることができる。
本発明の樹脂組成物は、例えば各成分を予備混合した後、３本ロールを用いて混練した後真空下脱泡することにより製造することができる。
本発明の樹脂組成物を用いて半導体装置を製作する方法は、公知の方法を用いることができる。
If necessary, additives such as a reactive diluent, a coupling agent, an antifoaming agent, and a surfactant can be used in the resin composition of the present invention.
The resin composition of the present invention can be produced, for example, by premixing the components, kneading using three rolls, and degassing under vacuum.
As a method of manufacturing a semiconductor device using the resin composition of the present invention, a known method can be used.
［実施例１、２、３］
化合物（Ａ）としてＥ−ＢＰ（ダイセル化学工業（株）製、一般式（１）に示される脂環式エポキシ樹脂で式中Ａが単結合のもの、以下Ｅ−ＢＰ）、Ｅ−ＤＯＡ（ダイセル化学工業（株）製、一般式（１）に示される脂環式エポキシ樹脂で式中Ａが−Ｃ（ＣＨ3）2−の化合物、以下Ｅ−ＤＯＡ）、硬化剤として４−メチルヘキサヒドロ無水フタル酸（新日本理化（株）製、リカシッドＭＨ−７００）、第１の金属粉末（Ｂ）としてステアリン酸で表面処理されたフレーク状のアルミニウム粉末（平均粒子径１０μｍ、イオン性不純物１０ｐｐｍ以下）と、第２の金属粉末（Ｃ）としてフレーク状の銀粉（平均粒子径３μｍ、最大粒子径４０μｍ）と、ジアザビシクロウンデセン（試薬、以下ＤＢＵ）、シランカップリング剤とを三本ロールで室温、２０分間混練して樹脂組成物を得た。この樹脂組成物を真空チャンバーにて脱泡して、各種評価を行った。
［比較例１、２］
脂環式エポキシ樹脂としてセロキサイド２０２１Ｐ（ダイセル化学工業（株）製、一般式（２）に示される脂環式エポキシ樹脂、以下セロキサイド２０２１Ｐ）、液状エポキシ樹脂としてビスフェノールＦとエピクロルヒドリンとの反応により得られるジグリシジルビスフェノールＦ（エポキシ当量１６５、室温で液体、以下ビスＦエポキシ）を使用した以外は実施例１−３と同様に樹脂組成物を得た。
[Examples 1, 2, and 3]
As compound (A), E-BP (manufactured by Daicel Chemical Industries, Ltd., alicyclic epoxy resin represented by general formula (1) wherein A is a single bond, hereinafter referred to as E-BP), E-DOA ( Daicel Chemical Industries, Ltd., an alicyclic epoxy resin represented by the general formula (1) in which A is —C (CH 3 ) 2 —, hereinafter referred to as E-DOA), and 4-methylhexa as a curing agent Hydrophthalic anhydride (manufactured by Shin Nippon Rika Co., Ltd., Ricacid MH-700), flaky aluminum powder surface-treated with stearic acid as the first metal powder (B) (average particle size 10 μm, ionic impurities 10 ppm) 3) flaky silver powder (average particle diameter 3 μm, maximum particle diameter 40 μm), diazabicycloundecene (reagent, hereinafter DBU), and silane coupling agent as the second metal powder (C) In roll Temperature, was obtained kneaded to a resin composition for 20 minutes. This resin composition was defoamed in a vacuum chamber and subjected to various evaluations.
[Comparative Examples 1 and 2]
Cellulose 2021P (produced by Daicel Chemical Industries, Ltd., alicyclic epoxy resin represented by general formula (2), hereinafter referred to as Celoxide 2021P) as an alicyclic epoxy resin, obtained by reaction of bisphenol F and epichlorohydrin as a liquid epoxy resin A resin composition was obtained in the same manner as in Example 1-3, except that diglycidyl bisphenol F (epoxy equivalent 165, liquid at room temperature, hereinafter bis F epoxy) was used.
［比較例３、４］
表１に示す割合で配合し実施例１−３と同様に樹脂組成物を得た。
[Comparative Examples 3 and 4]
A resin composition was obtained in the same manner as in Example 1-3.
評価方法
・粘度：Ｅ型粘度計（３°コーン）を用い２５℃、２．５ｒｐｍでの値を樹脂組成物作製後に測定した。粘度が１５〜２５Ｐａ・ｓの場合を合格とした。粘度の単位はＰａ・ｓである。
・接着強度：樹脂組成物を用いて、６×６ｍｍのシリコンチップを金フラッシュしたＮｉ−Ｐｄフレームにマウントし、１７５℃オーブン中６０分硬化した。硬化後ならびに吸湿処理（８５℃、８５％、７２時間）後に自動接着力測定装置を用い２６０℃での熱時ダイシェア強度を測定した。吸湿後強度／硬化後強度×１００を保持率（％）とし、硬化後の接着強度が８０Ｎ／チップ以上、保持率が８０％以上の場合を合格とした。接着強度の単位はＮ／チップ。
・体積抵抗率：樹脂組成物を厚さ約３０μｍ、幅０．５ｍｍでプレパラート上に印刷した後、１７５℃オーブン中６０分硬化したものをミリオーム抵抗測定機で測定した。体積抵抗率が１００×１０-4Ω・ｃｍ以下の場合を合格とした。単位はΩ・ｃｍ。
・紫外線反射率[Ａ]：各実施例及び比較例で得られた樹脂組成物をガラス板上に塗布し、１７５℃６０分硬化を行った。その後、紫外分光光度計（３８０ｎｍにて測定）を用いて樹脂組成物の硬化物表面の紫外線反射率[Ａ]を測定した。紫外線反射率[Ａ]が５０％以上の場合を合格とした。
・２５０時間紫外線照射後の紫外線反射率[Ｂ]：各実施例及び比較例で得られた樹脂組成物をガラス板上に塗布し、１７５℃で１時間硬化を行った後、常温で２５０時間紫外線照射を行った。その後、紫外分光光度計（３８０ｎｍにて測定）を用いて樹脂組成物の硬化物表面の紫外線反射率[Ｂ]を測定した。各符号は、以下の通りであり、初期の反射率[Ａ]の７０％以上維持している場合を合格とした。
○：紫外線反射率[Ｂ]は、紫外線反射率[Ａ]の７０％以上である。
×：紫外線反射率[Ｂ]は、紫外線反射率[Ａ]の７０％未満である。
Evaluation Method / Viscosity: Using an E-type viscometer (3 ° cone), the value at 25 ° C. and 2.5 rpm was measured after preparing the resin composition. The case where the viscosity was 15 to 25 Pa · s was regarded as acceptable. The unit of viscosity is Pa · s.
Adhesive strength: Using a resin composition, a 6 × 6 mm silicon chip was mounted on a Ni-Pd frame flashed with gold and cured in an oven at 175 ° C. for 60 minutes. After curing and after moisture absorption treatment (85 ° C., 85%, 72 hours), the hot die shear strength at 260 ° C. was measured using an automatic adhesive force measuring apparatus. The strength after moisture absorption / the strength after curing × 100 was defined as the retention rate (%), and the case where the adhesive strength after curing was 80 N / chip or more and the retention rate was 80% or more was regarded as acceptable. The unit of adhesive strength is N / chip.
Volume resistivity: The resin composition was printed on a preparation with a thickness of about 30 μm and a width of 0.5 mm, and then cured for 60 minutes in a 175 ° C. oven, and measured with a milliohm resistance measuring machine. The case where the volume resistivity was 100 × 10 −4 Ω · cm or less was regarded as acceptable. The unit is Ω · cm.
-Ultraviolet reflectance [A]: The resin composition obtained in each Example and Comparative Example was applied on a glass plate and cured at 175 ° C. for 60 minutes. Thereafter, the ultraviolet reflectance [A] of the cured product surface of the resin composition was measured using an ultraviolet spectrophotometer (measured at 380 nm). The case where the ultraviolet reflectance [A] was 50% or more was regarded as acceptable.
-UV reflectance after ultraviolet irradiation for 250 hours [B]: The resin composition obtained in each Example and Comparative Example was applied on a glass plate and cured at 175 ° C for 1 hour, and then at room temperature for 250 hours. Ultraviolet irradiation was performed. Thereafter, the ultraviolet reflectance [B] of the cured product surface of the resin composition was measured using an ultraviolet spectrophotometer (measured at 380 nm). Each code is as follows, and the case where 70% or more of the initial reflectance [A] is maintained is regarded as acceptable.
○: The ultraviolet reflectance [B] is 70% or more of the ultraviolet reflectance [A].
X: The ultraviolet reflectance [B] is less than 70% of the ultraviolet reflectance [A].
本発明は、良好な紫外線反射率を有するとともに紫外線劣化が少なく、さらには良好な熱伝導率を有する半導体接着用樹脂組成物の提供が可能となり、本樹脂組成物を用いることで高輝度かつ輝度劣化の少ない光半導体製品を提供することが可能となる。 INDUSTRIAL APPLICABILITY The present invention can provide a resin composition for semiconductor adhesion that has a good ultraviolet reflectance, little ultraviolet deterioration, and good thermal conductivity. An optical semiconductor product with little deterioration can be provided.
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| JP5143449B2 (en) * | 2007-03-02 | 2013-02-13 | 株式会社ダイセル | Thermal or active energy ray curable adhesive |
| JP5808991B2 (en) * | 2011-09-13 | 2015-11-10 | 東洋ゴム工業株式会社 | Tire vulcanizing mold |
| JP5854522B2 (en) * | 2013-07-16 | 2016-02-09 | 国立研究開発法人産業技術総合研究所 | Adhesive composition |
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| JP3254625B2 (en) * | 1997-09-22 | 2002-02-12 | 住友ベークライト株式会社 | Conductive resin paste and semiconductor device using the same |
| JP5226162B2 (en) * | 2001-05-14 | 2013-07-03 | 株式会社ダイセル | Liquid epoxy resin composition and use thereof |
| JP2004204228A (en) * | 2002-12-13 | 2004-07-22 | Daicel Chem Ind Ltd | Curable epoxy resin composition and cured product |
| JP4655523B2 (en) * | 2003-07-07 | 2011-03-23 | 住友ベークライト株式会社 | Epoxy resin composition for display element substrate and plastic substrate for display element |
| JP4569109B2 (en) * | 2004-01-08 | 2010-10-27 | 住友ベークライト株式会社 | Metal-containing paste and semiconductor device |
| JP4433876B2 (en) * | 2004-05-18 | 2010-03-17 | 住友金属鉱山株式会社 | Epoxy resin composition and adhesive for optical semiconductor using the same |
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