JP4747490B2 - Patterning substrate manufacturing method - Google Patents

Description

  The present invention relates to a method for manufacturing a patterning substrate capable of forming a pattern using a difference in wettability.

  In general, there are two methods for manufacturing a patterning substrate: a method of making a partition surface lyophobic after forming a lyophilic partition, and a method of making a pattern formation portion lyophilic after forming a lyophobic partition. It can be divided roughly. As the former method, as described in Patent Document 1, plasma irradiation is performed by introducing a gas containing fluorine atoms, and as the latter method, as described in Patent Document 2, repelling is performed. A method in which a protective film is provided on the liquid partition wall and lyophilic treatment such as UV irradiation or oxygen plasma treatment is performed, or as described in Patent Document 3, UV irradiation is performed on the entire surface, and the protrusions are made liquid repellent. There is a method of making the recess and lyophilic.

  However, in the method disclosed in Patent Document 1 described above, since the liquid repellency treatment with fluorine gas adheres to all organic substances, there is a problem that the range of selection of the material for forming the insulating layer is narrowed. In the invention described in 1), since a step of forming a protective film is added, there is a problem that productivity is poor. Moreover, in patent document 3, when making a recessed part lyophilic, a convex part also became lyophilic and there existed a possibility that the liquid repellency of a convex part might fall.

  In general, the partition formed on the patterning substrate is formed higher than the thin film layer on which the organic substance is formed. For example, Patent Document 4 and Patent Document 5 disclose a patterning substrate in which the height of a partition wall is higher than the height of a thin film layer on which a film is formed.

  As an example of a functional element manufactured using such a patterning substrate, an electroluminescent element (hereinafter, electroluminescent may be abbreviated as EL) will be specifically described with reference to the drawings. As shown in FIG. 5, first, electrode layers 52 are formed in a pattern on a substrate 50, and partition walls 51 are formed between the electrode layers 52. Further, a light emitting layer 53 is located on the electrode layer 52, and a counter electrode 54 that is an electrode facing the electrode layer 52 is formed on the light emitting layer 53. In such an EL element, the height of the surface of the partition wall 51 is set so that the fluidized light emitting layer forming coating liquid that forms the light emitting layer 53 is applied on the electrode layer 52. The light emitting layer 53 can be formed in a pattern by forming it so as to be higher than the height of the surface of the coating liquid. That is, when the fluid coating solution for forming the light emitting layer 53 is applied on the electrode layer 52, the partition wall 51 can prevent the coating solution from spreading on the electrode layer 52, and thus the light emitting layer. 53 can be formed in a pattern on the electrode layer 52.

  In the case where a functional element such as an EL element is manufactured as shown in FIG. 5 using the patterning substrate in which the height of the partition wall is higher than the height of the thin film layer to be formed, the electrode layer 52 is formed. When the coating liquid used for forming the functional layer such as the light emitting layer 53 is applied on the functional layer such as the light emitting layer 53, the coating liquid adheres to the side surface of the partition wall 51. For example, as described in Patent Document 6, the cross-sectional shape becomes a concave shape. By forming the concave shape, it is possible to suppress charge concentration caused by the thinness of the film thickness at the end portion, so that it is possible to prevent the deterioration of organic substances forming the functional layer such as the light emitting layer. . However, there is a problem that the thick portions at both ends in the concave shape become non-light emitting portions and the light emitting region becomes narrow.

JP 2000-353594 A JP 2002-22933 A Japanese Patent Laid-Open No. 9-230129 JP 2000-353594 A Japanese Patent Laid-Open No. 11-329741 JP 2001-76881 A

  In the present invention, when the functional layer is formed in a pattern on the substrate surface using a fluid coating liquid, the cross-sectional shape is unlikely to be concave, and the difference in thickness between the central portion and the end portion of the functional layer is preferable. The main object of the present invention is to provide a patterning substrate that can be formed to be small, a method for manufacturing the same, and an EL element that is less susceptible to inconveniences such as a short circuit and a method for manufacturing the same.

  In order to achieve the above object, the present invention forms a pattern between a substrate, a non-dry etched portion that is formed in a pattern on the substrate and cannot be etched by a dry etching process, and the non-dry etched portion. A liquid repellent layer that has a higher contact angle with the liquid than the non-dry etched portion and has a surface lower than the height of the surface of the non-dry etched portion and is etched by the dry etching process. A patterning substrate is provided.

  In the patterning substrate of the present invention, a pattern using the difference in wettability is formed by the non-dry etching portion and the liquid repellent layer. Further, the liquid repellent layer is formed so that the surface height is lower than the surface height of the non-dry etched portion. When a functional element is manufactured using such a patterning substrate of the present invention, the functional layer is formed on the non-dry etched portion. In this case, for example, when a coating liquid for forming a functional layer is applied on the non-dry etching part by a discharge method, the liquid repellent layer can prevent the coating liquid from spreading on the non-dry etching part. Furthermore, in the present invention, since the surface of the liquid repellent layer is formed to be lower than the surface height of the non-dry etched portion, the coating liquid applied on the non-dry etched portion is a liquid repellent. It does not adhere to the side surface of the adhesive layer. Therefore, the cross-sectional shape of the formed functional layer is unlikely to be a concave shape. Further, it is possible to make the film thickness uniform so that the film thickness difference between the center part and the end part becomes relatively small. Furthermore, in the functional layer, when a problem occurs due to the thin film thickness of the end portion, for example, if the functional layer is a light emitting layer of an EL element, a problem such as a short circuit occurs. It has an effect that it is easy to handle the problem, such as providing an insulating layer on the part.

  Furthermore, in such a patterning substrate, the surface roughness of the liquid repellent layer is preferably 2 nm or more. In addition to the material surface, the liquid repellency of the liquid repellent layer can be improved on the shape surface, so that the difference in wettability can be increased, and pattern formation can be facilitated.

  Furthermore, in the present invention, a non-dry etched portion that cannot be etched by the dry etching process and a liquid repellent layer that has a higher contact angle with the liquid than the non-dry etched portion and is etched by the dry etching process are formed on the substrate. The surface of the liquid-repellent layer is lower than the surface of the non-dry-etched portion relative to the substrate-preparing step formed in a pattern and the substrate having the non-dry-etched portion and the liquid-repellent layer. By performing a dry etching treatment process for performing a dry etching process on the entire surface of the substrate and a contact angle recovery process for increasing a contact angle with a liquid on the substrate after the dry etching process step, A contact angle recovery treatment step in which a contact angle with the liquid of the liquid repellent layer is higher than that after the dry etching treatment step. To provide a method of manufacturing a patterning substrate, wherein the door.

  In the present invention, the above-described dry etching process step of performing the dry etching process on the entire surface of the substrate by forming a pattern comprising a liquid repellent layer processed by the dry etching process and a non-dry etching part not processed on the substrate. Even if it goes, only the liquid repellent layer can be selectively etched. At this time, in the present invention, since the dry etching treatment is performed so that the height of the surface of the liquid repellent layer is lower than the height of the surface of the non-dry etched portion, the patterning substrate manufactured according to the present invention is used. When the functional element is manufactured, when forming the functional layer on the non-dry etched portion, the coating liquid for forming the functional layer does not adhere to the side surface of the liquid repellent layer, so the cross-sectional shape is concave. It becomes difficult to be formed. Furthermore, since the wettability of the surface of the non-dry etched part is improved by the dry etching process, the film thickness can be made uniform by forming a functional layer on the non-dry etched part. In the present invention, since the dry etching treatment step is also performed on the liquid repellent layer, the liquid repellency of the liquid repellent layer is reduced. By performing the step, the liquid repellency of the liquid repellent layer once lowered by the dry etching process can be increased again to a desired level. Therefore, the difference in wettability between the non-dry etched portion and the liquid repellent layer can be increased, and the pattern can be formed with high accuracy.

  Furthermore, in the present invention, the contact angle recovery process is preferably a heat process. This is because the liquid repellency can be sufficiently recovered by a simple method without requiring any complicated work.

  In the present invention, the dry etching process in the dry etching process is preferably a plasma irradiation process. This is because the foreign matters existing on the substrate can be easily removed, and the treatment can be performed to make the liquid lyophilic.

  Furthermore, in the present invention, a non-etched portion that cannot be etched by the plasma irradiation treatment and a liquid repellent layer that has a higher contact angle with the liquid than the non-etched portion and is etched by the plasma irradiation treatment are formed on the substrate. The surface of the liquid repellent layer is lower than the height of the surface of the non-etched portion relative to the substrate preparation step formed in a pattern and the substrate having the non-etched portion and the liquid repellent layer. There is provided a method for manufacturing a patterning substrate, comprising: a plasma irradiation processing step of performing plasma irradiation processing on the entire surface of the substrate.

  In the present invention, the plasma irradiation treatment step is performed in which a plasma irradiation treatment is performed on the entire surface of the substrate by forming a pattern comprising a liquid repellent layer processed by the plasma irradiation treatment and a non-etched portion not processed on the substrate. However, only the liquid repellent layer can be selectively etched. In this case, in the present invention, since the surface of the liquid repellent layer is treated so as to be lower than the height of the surface of the non-etched part, the functionality is obtained using the patterning substrate manufactured according to the present invention. When the element is manufactured, when the functional layer is formed on the non-etched portion, the coating liquid for forming the functional layer does not adhere to the side surface of the liquid repellent layer, so that the cross-sectional shape is difficult to be formed into a concave shape. Become. Furthermore, when plasma irradiation treatment is performed, residues such as foreign matters can be removed, so that the lyophilicity of the non-etched portion can be enhanced after the plasma irradiation treatment step. Therefore, the pattern can be formed with high accuracy by a simple process.

  Furthermore, in the present invention, the substrate, the first electrode layer formed in a pattern on the substrate, and a pattern formed between the first electrode layers, the contact angle with the liquid is higher than that of the first electrode layer. A liquid-repellent layer having a surface that is higher than the surface of the first electrode layer, and an organic EL layer that is formed in a pattern on the first electrode layer and includes at least a light-emitting layer; An EL element comprising: an insulating layer formed so as to cover an end portion of the organic EL layer; and a second electrode layer formed in a pattern on the organic EL layer is provided.

  Since the EL element of the present invention is formed such that the surface of the liquid repellent layer is lower than the surface of the first electrode layer, the organic EL layer formed on the first electrode layer is The film thickness difference can be made relatively small. Further, even when inconvenience occurs due to the thin film thickness of the end portion, since the insulating layer is formed so as to cover the end portion of the organic EL layer, such inconvenience is less likely to occur. , Effective in improving display characteristics.

  The surface roughness of the liquid repellent layer is preferably 2 nm or more. This is because the liquid repellency of the liquid repellent layer is effective in improving the shape.

In the present invention, the first electrode layer that cannot be etched by the dry etching process and the liquid repellent layer that has a higher contact angle with the liquid than the first electrode layer and is etched by the dry etching process are formed on the substrate. A substrate preparation step to form a pattern on the substrate,
Dry etching is performed on the entire surface of the substrate such that the surface of the liquid repellent layer is lower than the surface of the first electrode layer with respect to the substrate having the first electrode layer and the liquid repellent layer. A dry etching treatment process for carrying out the treatment;
The contact angle recovery process for increasing the contact angle with the liquid is performed on the substrate after the dry etching process step, so that the liquid repellent layer has a contact angle with the liquid after the dry etching process step. The contact angle recovery process to increase the
An organic EL layer forming step of applying an organic EL layer forming coating solution for forming an organic EL layer including at least a light emitting layer on the first electrode layer, and forming the organic EL layer in a pattern;
A re-dry etching treatment step of performing dry etching treatment again on the entire surface of the substrate after the organic EL layer formation step;
And providing an insulating layer forming step of forming an insulating layer in a pattern so as to cover an end portion of the organic EL layer.

  Since the first electrode layer cannot be etched in the dry etching process, only the liquid repellent layer can be selectively etched even if the entire surface of the substrate is subjected to the dry etching process. At this time, the liquid repellent layer is etched so that the surface thereof is lower than the height of the surface of the first electrode layer. Therefore, when the organic EL layer is formed on the first electrode layer, the liquid repellent layer is formed. Since the working liquid for organic EL layer forming application does not adhere to the side surfaces of the organic EL layer, the cross-sectional shape of the organic EL layer is difficult to be formed in a concave shape. Furthermore, since the wettability of the surface of the first electrode layer is improved by the dry etching process, the organic EL layer forming coating solution can be well spread and formed on the first electrode layer as a uniform film. it can. Further, by performing the contact angle recovery process after the dry etching process, the liquid repellency of the liquid repellent layer once lowered by the dry etching process can be recovered to a predetermined degree again. Further, by performing the re-dry etching treatment step, the liquid repellency of the liquid repellent layer is lowered again, and the insulating layer can be easily formed into a desired shape.

  Furthermore, in the present invention, the contact angle recovery process is preferably a heat process. This is because the liquid repellency can be sufficiently recovered by a simple method without requiring any complicated work.

  In the present invention, the dry etching process in the dry etching process or the re-dry etching process is preferably a plasma irradiation process. This is because the foreign matters existing on the substrate can be easily removed, and the treatment can be performed to make the liquid lyophilic.

  In the present invention, the first electrode layer that cannot be etched by the plasma irradiation treatment and the liquid repellent layer that has a higher contact angle with the liquid than the first electrode layer and is etched by the plasma irradiation treatment are formed on the substrate. The surface of the liquid repellent layer is lower than the height of the surface of the first electrode layer with respect to the substrate preparation step formed in a pattern and the substrate having the first electrode layer and the liquid repellent layer. A plasma irradiation treatment step of performing plasma irradiation treatment on the entire surface of the substrate, and an organic electroluminescent layer forming coating for forming an organic electroluminescent layer including at least a light emitting layer on the first electrode layer. An organic electroluminescent layer forming step of applying a working solution to form an organic electroluminescent layer in a pattern, and an end portion of the organic electroluminescent layer To provide a manufacturing method of the electroluminescent element characterized by having an insulating layer forming step of forming an insulating layer in a pattern Migihitsuji.

  Since the first electrode layer cannot be etched in the plasma irradiation process, only the liquid repellent layer can be selectively etched even if the entire surface of the substrate is subjected to the plasma irradiation process. At this time, the liquid repellent layer is etched so that the surface thereof is lower than the height of the surface of the first electrode layer. Therefore, when the organic EL layer is formed on the first electrode layer, the liquid repellent layer is formed. Since the working liquid for organic EL layer forming application does not adhere to the side surfaces of the organic EL layer, the cross-sectional shape of the organic EL layer is difficult to be formed in a concave shape. In addition, when plasma irradiation treatment is performed, residues such as foreign matters can be removed, so that the lyophilicity of the first electrode layer can be enhanced after the plasma irradiation treatment step. Therefore, when the organic EL layer forming coating liquid is applied onto the first electrode layer in the organic EL layer forming step, the organic EL layer can be formed in a predetermined region with high precision and wettability.

  In the patterning substrate of the present invention, a pattern using the difference in wettability is formed by the non-dry etching portion and the liquid repellent layer. Further, the liquid repellent layer is formed so that the surface height is lower than the surface height of the non-dry etched portion. When a functional element such as an EL element is manufactured using such a patterning substrate of the present invention, if a functional layer such as a light emitting layer is formed on a non-dry etched portion, the cross-sectional shape is unlikely to be concave. Further, it is possible to make the film thickness uniform so that the film thickness difference between the center part and the end part becomes small. In the functional layer, when a problem occurs due to the thin film thickness of the end portion, for example, if the functional layer is a light emitting layer of an EL element, a problem such as a short circuit occurs. As an insulating layer is provided on the part, an effect is obtained that it is easy to process the problem.

  Hereinafter, the patterning substrate of the present invention and the manufacturing method thereof, and further the EL element and the manufacturing method thereof will be described.

A. Patterning Substrate First, the patterning substrate of the present invention will be described.

  The patterning substrate of the present invention is formed in a pattern between a substrate, a non-dry etching portion that is formed in a pattern on the substrate and cannot be etched by a dry etching process, and the non-dry etching portion. It has a contact angle with a liquid higher than that of the dry etching portion and a surface that is lower than the height of the surface of the non-dry etching portion, and has a liquid repellent layer that is etched by the dry etching process. It is characterized by.

  Such a patterning substrate of the present invention will be specifically described with reference to the drawings. FIG. 1 is a schematic sectional view showing an example of a patterning substrate of the present invention. First, a non-dry etched portion 2 is formed in a pattern on the substrate 1. The non-dry etching portion 2 is formed of a material that is not etched with respect to the dry etching process performed in the manufacturing process. Furthermore, a liquid repellent layer 3 having a higher contact angle with the liquid than the non-dry etched portion 2 is formed between the non-dry etched portions 2 in a pattern. The liquid repellent layer 3 contains the liquid repellent substance α. Further, the liquid repellent layer 3 is formed so that the surface thereof is lower than the height of the surface of the non-dry etched portion 2.

  When a functional element is manufactured using such a patterning substrate of the present invention, the functional layer is formed on the non-dry etching portion 2. At this time, for example, when a coating liquid for forming a functional layer is applied on the non-dry etching part 2 by a discharge method, the liquid repellent layer 3 prevents the coating liquid from spreading on the non-dry etching part 2. Can do. Furthermore, in the present invention, since the surface height of the liquid repellent layer 3 is formed lower than the surface height of the non-dry etched portion 2, the coating liquid applied on the non-dry etched portion 2 Does not adhere to the side surface of the liquid repellent layer 3. Therefore, the cross-sectional shape of the formed functional layer is unlikely to be a concave shape. In addition, since the film thickness can be made uniform so that the film thickness difference between the center portion and the end portion is relatively small, the inconvenience caused by the film thickness non-uniformity can be solved.

  Here, the functional element means an optical element that can be manufactured using the patterning substrate of the present invention, and specifically, an EL element, a color filter, a color conversion filter, or the like. Can be mentioned. Further, the functional layer means a member constituting the functional element. Specifically, in the EL element, an organic EL layer such as a light emitting layer, in a color filter, in a colored layer, in a color conversion filter. Means a color conversion layer.

  Such a patterning substrate of the present invention will be described in detail below, divided into each member.

1. Non-dry etching part First, the non-dry etching part in this invention is demonstrated. The non-dry etching part in the present invention is formed in a pattern on the substrate and cannot be etched by the dry etching process.

  In addition, that it cannot etch by the dry etching process here means that the non-dry etching part itself is not influenced by the dry etching process, and the surface is not scraped off. When dry etching processing is performed on such a non-dry etched portion, no change occurs in the non-dry etched portion itself, but foreign matters existing on the surface can be removed. The wettability can be improved.

  In such a non-dry etched portion of the present invention, the degree of wettability is not particularly limited as long as the contact angle with the liquid is lower than that of the liquid repellent layer described later.

  In addition, the method for forming such a non-dry etching portion is not particularly limited, and examples thereof include a method of forming a film that is not etched by a dry etching process by forming a film by a dry method such as an evaporation method. Can do. Specifically, examples of the material that is not etched by the dry etching treatment include inorganic materials such as glass and tin-doped indium oxide (ITO). By using such a material, a non-dry etched portion that cannot be etched by the dry etching process can be formed. Thereby, from the relationship with the liquid repellent layer described later, for example, in manufacturing the patterning substrate of the present invention, the entire surface of the substrate on which the non-dry etched portion and the liquid repellent layer were formed was subjected to a dry etching process. Even in such a case, the dry etching process can be selectively performed without requiring complicated labor.

2. Next, the liquid repellent layer will be described. The liquid repellent layer in the present invention is formed in a pattern between the non-dry etched portions, has a higher contact angle with the liquid than the non-dry etched portions, and is higher than the surface height of the non-dry etched portions. The surface is formed low and is etched by a dry etching process.

  Such a liquid repellent layer is not particularly limited as long as it is formed so that the surface of the liquid repellent layer is lower than the height of the surface of the above-described non-dry etched portion. It is preferable that the height of the surface of the liquid repellent layer is lower than the height of the surface of the non-dry etched portion in the range of 0.05 μm to 10 μm, particularly in the range of 0.1 μm to 5 μm. This is because if the liquid repellent layer is formed so as to have the above difference with respect to the non-dry etched portion, a good pattern can be formed when the functional layer is formed on the non-dry etched portion.

  Furthermore, in the liquid-repellent layer in the present invention, the degree of liquid repellency is not particularly limited as long as the contact angle with the liquid is higher than that of the above-described non-dry etched portion. Specifically, the contact angle with respect to the liquid repellent layer of pure water is preferably in the range of 30 ° to 150 °, and more preferably in the range of 50 ° to 120 °.

  Here, the contact angle is measured by using pure water and measuring the contact angle with a contact angle measuring device (CA-Z type manufactured by Kyowa Interface Science Co., Ltd.) (dropping a droplet from a microsyringe). Seconds later) and based on the result.

  Further, the surface roughness of the liquid repellent layer in the present invention is not particularly limited as long as the liquid repellency is not lowered, but specifically, it is preferably 2 nm or more. Among these, it is preferably 5 nm or more, more preferably 10 nm or more, and most preferably 20 nm or more. By setting the surface roughness within the above range, the liquid repellency of the liquid repellent layer can be improved not only on the material surface but also on the shape surface, and the difference in wettability with the non-dry etched portion can be increased. This is because it can be made larger.

  In addition, the said surface roughness is prescribed | regulated based on the result measured using AFM (atomic force scanning microscope).

  In the present invention, as a method of forming such a liquid repellent layer, a liquid repellent layer having a material having a contact angle with a liquid higher than that of a non-dry etched portion and etched by a dry etching process is used. A method of forming a coating liquid by applying it on a substrate and patterning it can be mentioned. Specific examples of the liquid repellent layer forming coating liquid include a solution obtained by dissolving a material having liquid repellency after being etched by a dry etching process in an appropriate solvent. For example, as such a material, there are a case where a resin is used and the resin itself has liquid repellency, and a case where a resin is used to add an additive to impart liquid repellency. Hereinafter, the material for forming the liquid repellent layer in the present invention will be specifically described.

  First, when a resin is used and the resin material itself has liquid repellency, as a material for forming the liquid repellent layer, polytetrafluoroethylene, an acrylate or methacrylate containing a fluoroaliphatic group, and an acrylate not containing fluorine Alternatively, a fluorine-containing polymer compound such as a copolymer of methacrylate can be used. Examples of the methacrylate monomer containing a fluoroaliphatic group include 2,2,2-trifluoroethyl methacrylate, 2,2,3,3,3-pentafluoromethacrylate, 2- (perfluorobutyl) ethyl methacrylate, 2- ( Perfluorooctyl) ethyl methacrylate, 2- (perfluorohexyl) ethyl methacrylate, 2- (perfluorodecyl) ethyl methacrylate, 2- (perfluoro-3-methylbutyl) ethyl methacrylate, 3- (perfluoro-3-methylbutyl) 2-hydroxypropyl methacrylate, 2- (perfluoro-5-methylhexyl) ethyl methacrylate, 3- (perfluoro-5-methylbutyl) -2-hydroxypropyl methacrylate, 2- (perfluoro-7-methyloctyl) ) Ethyl methacrylate, 3- (perfluoro-7-methyloctyl) -2-hydroxypropyl methacrylate, 2- (perfluoro-9-methyldecyl) ethyl methacrylate, 3- (perfluoro-8-methyldecyl) -2-hydroxy Propyl methacrylate, 2,2,3,3-tetrafluoropropyl methacrylate, 1H, 1H, 5H-octafluoropentyl methacrylate, 1H, 1H, 7H-dodecafluoroheptyl methacrylate, 1H, 1H, 9H-hexadecafluorobetyl methacrylate 1H, 1H, 11H-icosafluorononyl methacrylate, 2,2,2-trifluoro-1-trifluorohethylethyl methacrylate, 2,2,3,4,4,4-hexafluorobutyl methacrylate, etc. It is possible. Furthermore, examples of the acrylate monomer containing a fluoroaliphatic group include 3- (perfluoro-3-methylbutyl) -2-hydroxypropyl acrylate, 2- (perfluoro-5-methylhexyl) ethyl acrylate, 2- (perfluoro- 9-methyloctyl) ethyl acrylate, 2- (perfluoro-9-methyldecyl) ethyl acrylate, 2,2,3,3,3-tetrafluoroacrylate, 1H, 1H, 5H-octafluorobenzyl acrylate, 1H, 1H , 7H-dodecafluoroheptyl acrylate, 1H, 1H, 9H-hexadecafluorononyl acrylate, 1H, 1H, 11H-icosafluorodecyl acrylate, 2,2,2-trifluoro-1-trifluoromethyl ethyl acrylate, 2 , 2,3,4 , It may be mentioned 4-hexafluorobutyl acrylate. As described above, by selecting one or two or more of the above-mentioned methacrylate monomers or acrylate monomers containing a fluoroaliphatic group and copolymerizing them with an acrylate monomer or methacrylate monomer not containing fluorine. A fluorine-containing polymer compound can be obtained. In addition, the case where one or more types are selected from the above-mentioned methacrylate monomer or acrylate monomer containing a fluoroaliphatic group, and a copolymer composed only of these may be used.

  It is also possible to form the liquid repellent layer using a copolymer obtained by copolymerizing the above-described fluorine-containing polymer compound and a general polymer material not containing fluorine.

  On the other hand, as a material for forming a liquid repellent layer in the case of imparting liquid repellency by adding an additive to a resin material, photosensitive polyimide resin, acrylic resin, other, photo-curing resin, thermosetting resin In addition, there may be mentioned those obtained by adding an additive having liquid repellency to a resin such as a fluorine compound-containing resin or a silicon-containing resin.

  For example, the additive having liquid repellency is not particularly limited as long as it does not adversely affect the member formed on the substrate when the patterning substrate is used in various applications. Specific examples include surfactants, fluorine-based resins, silicon-based resins, copolymer oligomers based on perfluoroalkyl group-containing acrylates or methacrylates, and silicon-containing compounds having fluorine compounds. .

  There are various types of surfactants, and examples thereof include those obtained by substituting hydrogen in the lipophilic group of general surfactants with fluorine to form perfluoroalkyl groups. Specifically, anions such as perfluoroalkyl carboxylate, perfluoroethylene oxide, perfluoroalkyl oligomer, ammonium salt of perfluoroalkyl sulfonic acid, potassium salt of perfluoroalkyl sulfonic acid, potassium salt of perfluoroalkyl carboxylic acid, etc. Examples thereof include cationic types such as perfluoroalkyl quaternary ammonium iodide, and nonionic types such as perfluoroalkyl polyoxyethylene ethanol and fluorinated alkyl esters.

  As the copolymer oligomer, it is preferable to use one having a perfluoroalkyl group-containing acrylate or methacrylate as a main component. Examples of commercially available products include Surflon (random type oligomer; manufactured by Seimi Chemical Co.), Aron G (graft type oligomer; manufactured by Toa Gosei Chemical Co., Ltd.), Modiper F (block type oligomer; manufactured by NOF Corporation), and the like. it can.

  Further, the silicon-containing compound having a fluorine compound is preferably a polysiloxane containing a fluoroalkyl group. Specific examples include one or more hydrolyzed condensates and cohydrolyzed condensates of fluoroalkylsilane. Moreover, you may use what is generally known as a fluorine-type silane coupling agent.

  In the present invention, even when the resin material itself is formed of a material having liquid repellency, the above-described additive for imparting liquid repellency may be added if necessary.

3. Next, the substrate will be described. The substrate in the present invention has the above-mentioned non-dry etching portion and liquid repellent layer formed on the surface thereof, and functions as a support for holding the patterning substrate in a certain shape.

  The material for forming such a substrate is not particularly limited, and may be, for example, a transparent material or an opaque material, and examples thereof include an inorganic material such as glass and an organic material such as a resin. The resin that can be specifically used is preferably one that can be formed into a film, and more preferably a polymer material that is relatively high in solvent resistance and heat resistance. For example, fluorine resin, polyethylene, polypropylene, polyvinyl chloride, polyvinyl fluoride, polystyrene, ABS resin, polyamide, polyacetal, polyester, polycarbonate, modified polyphenylene ether, polysulfone, polyarylate, polyetherimide, polyethersulfone, polyamide Imide, polyimide, polyphenylene sulfide, liquid crystalline polyester, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polymicroxylene dimethylene terephthalate, polyoxymethylene, polyethersulfone, polyetheretherketone, polyacrylate, acrylonitrile-styrene resin , Phenolic resin, urea resin, melamine resin, unsaturated polyester resin, epoxy Examples of the resin include polyurethane resin, polyurethane, silicone resin, and amorphous polyolefin. In the present invention, any polymer material that satisfies other conditions can be used, and these two or more types of copolymers may be used.

B. Patterning Substrate Manufacturing Method Next, the patterning substrate manufacturing method of the present invention will be described. The method for producing a patterning substrate of the present invention can be divided into two modes depending on the difference in steps after the non-dry etching portion and the liquid repellent layer are formed in a pattern. Hereinafter, the patterning substrate manufacturing method of the present invention will be described separately for the first embodiment and the second embodiment.

1. First Embodiment A method for manufacturing a patterning substrate according to the present embodiment has a contact angle between a non-dry etching portion that cannot be etched by a dry etching process and a liquid higher than that of the non-dry etching portion. A substrate preparation step of forming a liquid repellent layer to be patterned on the substrate;
Dry etching is performed on the entire surface of the substrate such that the surface of the liquid-repellent layer is lower than the surface of the non-dry-etched portion relative to the substrate having the non-dry-etched portion and the liquid-repellent layer. A dry etching treatment process for carrying out the treatment;
The contact angle recovery process for increasing the contact angle with the liquid is performed on the substrate after the dry etching process step, so that the liquid repellent layer has a contact angle with the liquid after the dry etching process step. And a contact angle recovery treatment step of increasing the height.

  In the present embodiment, the dry etching is performed on the entire surface of the substrate by forming a pattern comprising a liquid repellent layer processed by the dry etching process and a non-dry etched part that cannot be processed on the substrate. Even when the treatment step is performed, only the liquid repellent layer can be selectively etched. At this time, in this embodiment, since the dry etching process is performed so that the height of the surface of the liquid repellent layer is lower than the height of the surface of the non-dry etching portion, the patterning substrate manufactured according to this embodiment is used. When the functional element is manufactured using the coating layer, the cross-sectional shape is concave because the coating liquid for forming the functional layer does not adhere to the side surface of the liquid repellent layer when the functional layer is formed on the non-dry etched portion. Hard to be formed into a shape. Furthermore, since the wettability of the surface of the non-dry etched part is improved by the dry etching process, the film thickness can be made uniform by forming a functional layer on the non-dry etched part. In the present embodiment, the dry etching treatment process is also performed on the liquid repellent layer, so that the liquid repellency is reduced in the liquid repellent layer, but the contact angle recovery treatment is performed. By performing the process, the liquid repellency of the liquid repellent layer once lowered by the dry etching process can be increased again to a desired level. Therefore, since the difference in wettability between the non-dry etched portion and the liquid repellent layer can be increased, the pattern can be formed with high accuracy.

  A method for manufacturing the patterning substrate of this embodiment will be described with reference to the drawings. FIG. 2 is a process diagram showing an example of a method for manufacturing a patterning substrate according to this embodiment. First, as shown in FIG. 2A, on the substrate 1 on which the non-dry etching portion 2 is formed in a pattern, a repellent having a contact angle higher than the contact angle with the liquid that the non-dry etching portion 2 has. A liquid repellent layer forming coating solution is applied to form the liquid repellent film 3. The liquid repellent film 3 contains the liquid repellent substance α. Thereafter, as shown in FIG. 2B, the liquid-repellent film 3 is irradiated with ultraviolet rays 5 through a mask 4 to perform development, washing, and the like, as shown in FIG. A liquid repellent layer 3 ′ is formed in a pattern.

  Furthermore, after forming the liquid repellent layer 3 ′ in a pattern, a dry etching process 6 is performed on the entire surface of the substrate 1 as shown in FIG. At this time, in this embodiment, the non-dry etching portion 2 is formed from a material that is not etched by the dry etching process 6, and conversely, the liquid repellent layer 3 ′ is formed from a material that is etched by the dry etching process 6. Since it is formed, only the liquid repellent layer 3 'is inevitably etched. In this dry etching process 6, the liquid repellent layer 3 ′ is processed so that the surface thereof is lower than the surface of the non-dry etching part 2. Thereby, when a functional element is produced using the patterning substrate manufactured according to this embodiment, when the functional layer is formed on the non-dry etching portion 2, the coating liquid for forming the functional layer is a liquid repellent layer. Since it does not adhere to the 3 ′ side surface, the cross-sectional shape is unlikely to be concave.

  Further, when the liquid repellent layer 3 ′ is patterned by the dry etching process 6, the residue (repellent repellent) of the liquid repellent film 3 remaining on the non-dry etched portion 2 from which the liquid repellent film 3 has been removed. Liquid substances α) and the like can be removed. Therefore, after the dry etching process 6, the lyophilicity of the surface of the non-dry etched portion 2 from which the liquid repellent film 3 has been removed can be enhanced. Accordingly, when a fluid coating solution is applied onto the non-dry etching portion 2, the coating solution wets and spreads on the non-dry etching portion with good wettability, so that the patterning substrate manufactured according to this embodiment is used. Thus, the thickness of the functional layer can be made uniform so that the film thickness difference between the center and the end is relatively small.

  In this embodiment, since the liquid repellent layer 3 'is also subjected to the dry etching process, the liquid repellent layer 3' is also made lyophilic, and the liquid repellency is lowered.

  Therefore, heat treatment 7 is performed as shown in FIG. In this embodiment, by performing the heat treatment 7, the liquid repellency of the liquid repellent layer 3 ′ once lowered by the dry etching treatment 6 can be increased again to a predetermined level. That is, the liquid repellent layer 3 ′ after the heat treatment 7 can have a higher contact angle with the liquid than the liquid repellent layer 3 ′ after the dry etching process 6. Accordingly, a patterning substrate having a sufficient difference in wettability can be easily manufactured by a simple method according to the pattern of the liquid repellent layer formed with high accuracy.

  Hereinafter, the manufacturing method of the substrate for patterning of this embodiment is demonstrated in detail for every process.

(1) Substrate preparation step First, the substrate preparation step will be described. The substrate preparation step in this embodiment includes a non-dry etching portion that cannot be etched by a dry etching process, a liquid repellent layer that has a higher contact angle with the liquid than the non-dry etching portion, and is etched by the dry etching process. Is formed in a pattern on the substrate.

  In this step, a substrate on which a non-dry etched portion and a liquid repellent layer are formed in a pattern is prepared. In such a process, the order in which the non-dry etched portion and the liquid repellent layer are formed on the substrate is not particularly limited. After forming the non-dry etched portion, a liquid repellent layer may be formed, or vice versa. In particular, it is preferable to form the liquid repellent layer after forming the non-dry etched portion. When the non-dry etched portion and the liquid repellent layer are formed in this order, the liquid repellent layer is patterned by removing the liquid repellent layer formed on the non-dry etched portion. At this time, the residue of the liquid repellent layer remaining on the non-dry etched portion can be removed by a dry etching treatment step described later, and the effect of this embodiment can be utilized more effectively. .

  Hereinafter, the formation method will be described separately for the non-dry etched portion and the liquid repellent layer.

(A) Method for forming non-dry etched portion The method for forming the non-dry etched portion is not particularly limited, but a material that is not etched by the dry etching process in a dry etching process described later is deposited by vapor deposition or sputtering through a mask. A method of forming a pattern by forming a film by a dry method such as a CVD method or a CVD method can be given.

  Note that the material that is not specifically etched by the dry etching process is the same as that described in the item “A. Patterning substrate 1. Non-dry etching portion” described above, and thus the description thereof is omitted here.

  In addition, the pattern of the non-dry etching portion is determined according to the pattern of the functional layer in the functional element manufactured using the patterning substrate of this embodiment. For example, when an EL element is produced as a functional element, an organic EL layer such as a light emitting layer is formed on the non-dry etched portion. Therefore, as a pattern of the non-dry etched portion, a pattern of an organic EL layer such as a light emitting layer is used. According to

(B) Formation of liquid repellent layer Next, a method of forming the liquid repellent layer will be described. The method for forming the liquid repellent layer in this step is not particularly limited as long as it is a method capable of accurately forming the liquid repellent layer in a desired pattern. Specifically, a photolithographic method using a photosensitive resin, a discharge method such as an inkjet method, a gravure printing method, a flexographic printing method, an offset printing method, a printing method such as a screen printing method, a thermal transfer method, a laser transfer method, etc. A well-known patterning method can be mentioned.

  Other than that, the liquid-repellent layer forming coating solution is the same as that described in “A. Patterning substrate 2. Liquid-repellent layer”, and the description is omitted here.

(2) Dry etching process Next, the dry etching process in this embodiment is demonstrated. The dry etching treatment step is performed so that the surface of the liquid repellent layer is lower than the surface of the non-dry etched portion relative to the substrate having the non-dry etched portion and the liquid repellent layer. This is a step of performing a dry etching process.

  In this embodiment, the non-dry etching part is formed from a material that is not etched by the dry etching process in this step, and the liquid repellent layer is formed from a material that is etched. Therefore, even if the entire substrate is subjected to a dry etching process in this step, only the liquid repellent layer is inevitably etched, so that a selective dry etching process can be performed without any troublesome work.

  In this step, the dry etching process is performed so that the height of the surface of the liquid repellent layer is lower than the height of the surface of the non-dry etched portion. Thereby, when producing a functional element using the patterning substrate of the present embodiment, the coating liquid applied on the non-dry etched portion does not adhere to the side surface of the liquid repellent layer. Is difficult to become concave.

  Furthermore, generally, when a dry etching process is performed, residues such as foreign matters can be removed, so that the wettability is improved at the position where the dry etching process is performed. Further, wettability is improved by performing dry etching treatment and modifying the surface.

  Here, the improvement of wettability means that the wettability changes in the direction in which the contact angle with the liquid decreases.

  In the present embodiment, since such a dry etching process is performed on the entire surface of the substrate, the liquid repellency of the liquid repellent layer is lowered. Therefore, in the present embodiment, by performing the liquid repellency recovery process described later, a patterning substrate finally obtained is easily manufactured with a pattern having a sufficient wettability difference formed thereon. be able to.

  The dry etching treatment in this step is not particularly limited, and specific examples include plasma irradiation treatment and UV-ozone cleaning treatment. Among these, plasma irradiation treatment is preferable. This is because foreign substances and the like existing on the substrate can be easily removed.

  The plasma irradiation treatment is not particularly limited as long as residues such as foreign matters can be removed and lyophilicity can be achieved.

  Moreover, as a reactive gas used when performing plasma irradiation processing, it is possible to use the reactive gas generally used. Especially, it is preferable that it is a reactive gas which can remove a foreign material efficiently. Examples of the composition of such a reactive gas include a combination of a gas containing fluorine or a fluorine compound, a gas containing chlorine or a chlorine compound, oxygen, or argon.

  Next, the UV-ozone cleaning is not particularly limited as long as foreign substances and the like can be similarly removed and lyophilicity can be achieved.

  Specifically, as ozone used in the present embodiment, oxygen or air containing ozone is suitable.

  In this step, it is preferable to perform a dry etching process so that the surface roughness of the surface of the liquid repellent layer is in the range described in “A. Patterning substrate 2. Liquid repellent layer”.

  In this embodiment, only the material surface is obtained by adjusting the dry etching process so that the surface roughness of the surface of the liquid-repellent layer after the dry etching process is within the above-described range. Not only that, the liquid repellent layer after the contact angle recovery process described later can achieve sufficient liquid repellency also in terms of shape.

(3) Contact Angle Recovery Processing Step Next, the contact angle recovery processing step will be described. In the contact angle recovery process in this embodiment, the contact angle recovery process for increasing the contact angle with the liquid is performed on the substrate after the dry etching process step, so that the contact angle with the liquid of the liquid repellent layer is increased. This is a step of making the height higher than that after the dry etching treatment step.

  By performing such a process, even when the liquid repellency of the liquid repellent layer is lowered by the above-described dry etching process, the liquid repellency can be restored to a desired level again. Therefore, the difference in wettability between the liquid repellent layer and the non-dry etched portion can be increased, and the pattern can be formed with high accuracy.

  As the contact angle recovery treatment in this step, the contact angle with the liquid of the liquid repellent layer after this step is greater than the contact angle with the liquid of the liquid repellent layer after the dry etching treatment. The processing method is not particularly limited as long as the processing method is high. Specific examples include heat treatment and light irradiation. Among these, heat treatment is preferable. This is because it is a simple method without requiring a particularly troublesome work and the contact angle with the liquid can be sufficiently increased.

  Specifically, the heat treatment is not particularly limited as long as the temperature of the entire substrate can be easily raised and heated without unevenness. For example, a commonly used heating device or the like can be used. Specifically, an oven, a far infrared heater, a hot plate, light irradiation, and the like can be given. Among these, a heating method using a hot plate is preferable. This is because the hot plate conducts heat directly from the lower side of the substrate and heats it, so that it is excellent in thermal efficiency and has little heating unevenness.

  Further, the temperature in the heat treatment is not particularly limited as long as it does not cause thermal degradation of the substrate or the like.

  In this step, by performing the contact angle recovery treatment, the liquid repellency of the liquid repellent layer once lowered can be increased to a desired level again. The contact angle with respect to the liquid repellent layer is preferably in the range of 30 ° to 150 °, and more preferably in the range of 50 ° to 120 °. This is because if the liquid repellency is in the above range, it is possible to easily prevent the coating liquid from proceeding at the boundary of the liquid repellent layer.

  In addition, the contact angle with the liquid was defined based on the result measured by the same method as described above.

2. Second Embodiment Next, a method for manufacturing a patterning substrate according to a second embodiment will be described.

The patterning substrate manufacturing method of this embodiment includes a non-etched portion that cannot be etched by plasma irradiation treatment and a liquid repellent layer that has a higher contact angle with the liquid than the non-etched portion and is etched by plasma irradiation treatment. A substrate preparation step of forming a pattern on the substrate;
Plasma treatment is performed on the entire surface of the substrate so that the surface of the liquid repellent layer is lower than the surface of the non-etched portion relative to the substrate having the non-etched portion and the liquid repellent layer. And a plasma irradiation treatment step to be performed.

  In the present invention, the plasma irradiation processing step of performing plasma irradiation processing on the entire surface of the substrate by forming a pattern comprising a liquid repellent layer processed by plasma irradiation processing and a non-etched portion that cannot be processed on the substrate. Even if it performs, only a liquid repellent layer can be etched selectively. In this case, in the present invention, since the surface of the liquid repellent layer is treated so as to be lower than the height of the surface of the non-etched part, the functionality is obtained using the patterning substrate manufactured according to the present invention. When the element is manufactured, when the functional layer is formed on the non-etched portion, the coating liquid for forming the functional layer does not adhere to the side surface of the liquid repellent layer, so that the cross-sectional shape is difficult to be formed into a concave shape. Become. Furthermore, when plasma irradiation treatment is performed, residues such as foreign matters can be removed, so that the lyophilicity of the non-etched portion can be enhanced after the plasma irradiation treatment step. Therefore, the pattern can be formed with high accuracy by a simple process.

  The manufacturing method of the patterning substrate of this embodiment having such advantages will be described separately for each step of the substrate preparation step and the plasma irradiation treatment step.

(1) Substrate preparation step The substrate preparation step in this embodiment has a higher contact angle between the non-etched part that cannot be etched by the plasma irradiation process and the liquid than the non-etched part, and is etched by the plasma irradiation process. In this step, the liquid layer is formed in a pattern on the substrate.

  In this step, a substrate having a non-etched portion and a liquid repellent layer formed in a pattern is prepared. In this process, the order in which the non-etched part and the liquid repellent layer are formed on the substrate is not particularly limited. After forming the non-etched portion, a liquid repellent layer may be formed, or vice versa. In particular, it is preferable to form the liquid repellent layer after forming the non-etched portion. When the non-etched part and the liquid repellent layer are formed in this order, the liquid repellent layer is patterned by removing the liquid repellent layer formed on the non-etched part. This is because the residue of the liquid repellent layer remaining on the non-etched portion can be removed by a plasma irradiation treatment step described later, and the effects of this embodiment can be utilized more effectively.

  In this step, the same non-etched portion as that described above can be used as the non-etched portion. Accordingly, since the non-etched portion and the liquid repellent layer are the same as in the first embodiment, the description thereof is omitted here.

(2) Plasma irradiation treatment step In this embodiment, the plasma irradiation treatment step is performed on the surface of the liquid repellent layer with respect to the substrate having the non-etched portion and the liquid repellent layer, rather than the height of the surface of the non-etched portion. This is a step of performing plasma irradiation treatment on the entire surface of the substrate so that the lower is lower.

  By performing the plasma irradiation treatment, it is possible to remove residues such as foreign matters present in unnecessary portions. That is, when the liquid repellent layer is formed in a pattern in the substrate preparation step, the region from which the liquid repellent layer has been removed, for example, the residue of the liquid repellent layer remaining on the non-etched portion can be removed. The lyophilicity of the non-etched part can be achieved.

  Since the plasma irradiation process in this step is the same as that described in the first embodiment, description thereof is omitted here.

C. EL Element Next, the EL element will be described.

  The EL element of the present invention is formed in a pattern between a substrate, a first electrode layer formed in a pattern on the substrate, and between the first electrode layers, and a contact angle with a liquid rather than the first electrode layer. And a liquid repellent layer having a surface formed lower than the surface of the first electrode layer, and an organic EL layer formed in a pattern on the first electrode layer and including at least a light emitting layer And an insulating layer formed so as to cover an end of the organic EL layer, and a second electrode layer formed in a pattern on the organic EL layer.

  In the EL element of the present invention, since the liquid repellent layer is formed such that the height of the surface is lower than the height of the surface of the first electrode layer, the organic layer formed on the first electrode layer Since the EL layer is not affected by the side surface of the liquid repellent layer, its cross-sectional shape is unlikely to be concave. In addition, even when there is a possibility that a problem such as a short circuit may occur due to the thin film thickness at the end portion, such a problem is caused because the insulating layer is formed so as to cover the end portion of the organic EL layer. Can be eliminated. In addition, since the difference in film thickness between the center portion and the end portion can be made relatively small, it is possible to suppress the occurrence of light emission unevenness due to the non-uniformity of the film thickness of the organic EL layer.

  The EL element of the present invention having such advantages will be specifically described with reference to the drawings. FIG. 3 is a schematic cross-sectional view showing an example of the EL element of the present invention. First, the first electrode layer 31 is formed in a pattern on the substrate 30. Further, a liquid repellent layer 32 is formed in a pattern between the first electrode layers 31, and the height of the surface thereof is lower than the height of the surface of the first electrode layer 31. The liquid repellent layer 32 contains the liquid repellent substance α. In addition, since the liquid repellent layer 32 has a higher contact angle with the liquid than the first electrode layer 31, the first electrode layer 31 and the liquid repellent layer 32 form a pattern due to a difference in wettability. It becomes.

  Utilizing such a difference in wettability, the light emitting layer 33 is formed in a pattern on the first electrode layer 31. In the present invention, when the light emitting layer is formed on the first electrode layer 31 by making the surface height of the liquid repellent layer 32 lower than the surface height of the first electrode layer 31. The light emitting layer forming coating solution does not adhere to the side surface of the liquid repellent layer 32. Accordingly, the cross-sectional shape of the formed light emitting layer 33 is unlikely to be a concave shape. In addition, even when there is a risk of inconvenience due to the fact that the thickness of the light emitting layer 33 is thinner than the central portion, the inconvenience occurs because the insulating layer 34 is formed so as to cover the end. Can be avoided.

  A second electrode layer 35, which is an electrode facing the first electrode layer 31, is formed on the light emitting layer 33.

  Hereinafter, each member of the EL element of the present invention will be described in detail.

1. Substrate The substrate used in the present invention is not particularly limited, but when emitting light on the substrate surface side, a highly transparent one is preferable, and an inorganic material such as glass or a transparent resin is used. Can do.

  The transparent resin is not particularly limited as long as it can be formed into a film, but a polymer material having high transparency, relatively high solvent resistance and heat resistance is preferable. Specifically, polyethersulfone, polyethylene terephthalate (PET), polycarbonate (PC), polyetheretherketone (PEEK), polyvinyl fluoride (PFV), polyacrylate (PA), polypropylene (PP), polyethylene (PE) , Amorphous polyolefin, fluorine resin, polyethylene, polypropylene, polyvinyl chloride, polyvinyl fluoride, polystyrene, ABS resin, polyamide, polyacetal, polyester, polycarbonate, modified polyphenylene ether, polysulfone, polyarylate, polyetherimide, polyether Sulphone, polyamideimide, polyimide, polyphenylene sulfide, liquid crystalline polyester, polyethylene terephthalate, polybutylene terephthalate, polymic Ixylene dimethylene terephthalate, polyoxymethylene, polyethersulfone, polyetheretherketone, polyacrylate, acrylonitrile-styrene resin, ABS resin, phenol resin, urea resin, melamine resin, unsaturated polyester resin, epoxy resin, polyurethane, silicone Examples thereof include resins and amorphous polyolefins.

2. Electrode layer As described above, the first electrode layer is formed on the substrate. Furthermore, a second electrode layer, which is an electrode facing the first electrode layer, is formed on the organic EL layer described later. Hereinafter, the first electrode layer and the second electrode layer may be collectively referred to as an electrode layer.

  Such an electrode layer is not particularly limited as long as it is usually used for an EL element. Specifically, the electrode layer which is composed of an anode and a cathode and is located on the side where light is emitted from either the anode or the cathode is preferably transparent or translucent. Further, the anode is preferably a conductive material having a large work function so that holes can be easily injected. On the other hand, the cathode is preferably a conductive material having a small work function so that electrons can be easily injected. A plurality of materials may be mixed. The resistance is preferably as small as possible. Generally, a metal material is used, but an organic substance or an inorganic compound may be used.

  Further, in the present invention, the organic EL layer described later is formed on the first electrode layer, and is formed in a pattern using the difference in wettability between the first electrode layer and the liquid repellent layer. However, the degree of wettability of the first electrode layer is not particularly limited as long as the contact angle with the liquid is lower than that of the liquid repellent layer.

3. Liquid-repellent layer The liquid-repellent layer in the present invention is formed in a pattern between the first electrode layers, has a higher contact angle with the liquid than the first electrode layer, and has a high surface of the first electrode layer. The height of the surface is lower than that.

  Such a liquid repellent layer is the same as that described in the section of “A. Patterning substrate 2. Liquid repellent layer” above, and the description thereof is omitted here.

4). Next, the organic EL layer used in the present invention will be described. In general, examples of the organic EL layer include a light emitting layer, a buffer layer, a hole injection layer, a hole transport layer, an electron injection layer, and an electron transport layer. As such an organic EL layer in the present invention, it is essential to include a light emitting layer. Moreover, it is also possible to combine the light emitting layer and each of the above layers into an organic EL layer composed of a plurality of layers.

  Hereinafter, the light emitting layer which is an essential component in such an organic EL layer will be described.

(Light emitting layer)
In the EL element, the light emitting layer is an essential layer, and is a layer that requires patterning when manufacturing full-color and multi-color displays.

  As a material for forming the light emitting layer, usually, a dye-based, metal complex-based, or polymer-based light-emitting material can be exemplified. Hereinafter, a light emitting material will be described as a material for forming the light emitting layer in the present invention.

(1) Dye-type materials As dye-type materials, cyclopentamine derivatives, tetraphenylbutadiene derivatives, triphenylamine derivatives, oxadiazol derivatives, pyrazoloquinoline derivatives, distyrylbenzene derivatives, distyrylarylene derivatives, silole derivatives, Examples thereof include thiophene ring compounds, pyridine ring compounds, perinone derivatives, perylene derivatives, oligothiophene derivatives, trifumanylamine derivatives, oxadiazole dimers, pyrazoline dimers, and the like.

(2) Metal complex materials Metal complex materials include aluminum quinolinol complex, benzoquinolinol beryllium complex, benzoxazole zinc complex, benzothiazole zinc complex, azomethyl zinc complex, porphyrin zinc complex, europium complex, iridium metal complex, platinum metal. Complex, etc., center metal has Al, Zn, Be etc. or rare earth metal such as Tb, Eu, Dy etc., and ligand has oxadiazole, thiadiazole, phenylpyridine, phenylbenzimidazole, quinoline structure, etc. A metal complex etc. can be mentioned.

(3) Polymeric materials Polymeric materials include polyparaphenylene vinylene derivatives, polythiophene derivatives, polyparaphenylene derivatives, polysilane derivatives, polyacetylene derivatives, etc., polyfluorene derivatives, polyvinylcarbazole derivatives, the above dye bodies, metal complexes Examples include those obtained by polymerizing a system light emitting material.

5. Insulating Layer Next, the insulating layer will be described. The insulating layer in this invention is formed so that the edge part of the said organic EL layer may be covered. In the present invention, the thickness of the surface of the liquid repellent layer is made lower than the height of the surface of the first electrode layer, so that the film thickness at the end of the organic EL layer formed on the first electrode layer is reduced. Even if there is a possibility that inconvenience such as a short circuit may occur due to the thinness of the film, such an inconvenience can be prevented by providing the insulating layer in this way.

  Here, the shape of the insulating layer is not particularly limited as long as the end of the organic EL layer can be covered. Specifically, as shown in FIG. 3, the two organic EL layers 33 may be formed so as to be continuous from one end to the other, or only one end of one organic EL layer is covered. Such a shape may be used.

  Such an insulating layer can be patterned by a vapor deposition method through a mask.

D. Next, a method for manufacturing an EL element of the present invention will be described. The EL device manufacturing method of the present invention can be divided into two modes depending on the difference in the process after the first electrode layer and the liquid repellent layer are formed in a pattern. Hereinafter, the manufacturing method of the EL element of the present invention will be described separately for the third embodiment and the fourth embodiment.

1. Third Embodiment The method of manufacturing an EL element according to this embodiment has a higher contact angle between the first electrode layer that cannot be etched by the dry etching process and the liquid than the first electrode layer, and is etched by the dry etching process. A substrate preparation step of forming a liquid repellent layer in a pattern on the substrate;
Dry etching is performed on the entire surface of the substrate such that the surface of the liquid repellent layer is lower than the surface of the first electrode layer with respect to the substrate having the first electrode layer and the liquid repellent layer. A dry etching treatment process for carrying out the treatment;
The contact angle recovery process for increasing the contact angle with the liquid is performed on the substrate after the dry etching process step, so that the liquid repellent layer has a contact angle with the liquid after the dry etching process step. The contact angle recovery treatment step of increasing the organic EL layer, and applying an organic EL layer forming coating solution for forming an organic EL layer including at least a light emitting layer on the first electrode layer to form an organic EL layer in a pattern An EL layer forming step;
A re-dry etching treatment step of performing dry etching treatment again on the entire surface of the substrate after the organic EL layer formation step;
And an insulating layer forming step of forming an insulating layer in a pattern so as to cover an end portion of the organic EL layer.

  Since the first electrode layer cannot be etched in the dry etching process, only the liquid repellent layer can be selectively etched even if the entire surface of the substrate is subjected to the dry etching process. At this time, the liquid repellent layer is etched so that the surface thereof is lower than the height of the surface of the first electrode layer. Therefore, when the organic EL layer is formed on the first electrode layer, the liquid repellent layer is formed. Since the working liquid for organic EL layer formation does not adhere to the side surface of the organic EL layer, the cross-sectional shape of the organic EL layer is difficult to be formed in a concave shape. Furthermore, since the wettability of the surface of the first electrode layer is improved by the dry etching process, the organic EL layer forming coating solution can be well spread and formed on the first electrode layer as a uniform film. it can. Further, by performing the contact angle recovery process after the dry etching process, the liquid repellency of the liquid repellent layer once lowered by the dry etching process can be recovered to a predetermined degree again. Further, by performing the re-dry etching treatment step, the liquid repellency of the liquid repellent layer is lowered again, and the insulating layer can be easily formed into a desired shape.

  A method for manufacturing the EL element of the present invention having such advantages will be described with reference to the drawings. FIG. 4 is a process diagram showing an example of a method for manufacturing an EL element of the present invention. First, as shown in FIG. 4A, a liquid repellent layer having a higher liquid contact angle than the first electrode layer 41 is formed on the substrate 40 on which the first electrode layer 41 is formed in a pattern. A liquid repellent layer forming coating solution is applied to form a liquid repellent film 42. The liquid repellent film 42 contains a liquid repellent substance α.

  Next, as shown in FIG. 4B, after the ultraviolet ray 44 is irradiated through the mask 43, the liquid repellent film 42 is patterned by developing and washing. Thereby, the liquid repellent layer 42 ′ can be formed in a pattern between the first electrode layers 41 (see FIG. 4C).

  Further, as shown in FIG. 4D, a dry etching process 45 is performed on the entire surface of the substrate 40 having the first electrode layer 41 and the liquid repellent layer 42 ′. At this time, since the first electrode layer 41 is not etched by the dry etching process 45, only the liquid repellent layer 42 ′ is etched even if the dry etching process 45 is performed on the entire surface of the substrate 40. In the present invention, the dry etching process 45 is performed so that the surface of the liquid repellent layer 42 ′ is lower than the height of the surface of the first electrode layer 41.

  By this etching process 45, for example, when the liquid repellent film 42 is patterned, the residue of the liquid repellent film 42 remaining on the first electrode layer 41 from which the liquid repellent film 42 has been removed (liquid repellent property). Substance α) and the like can be removed. Therefore, after the dry etching process 45, the lyophilicity of the surface of the first electrode layer 41 can be improved. In the present invention, since the liquid-repellent layer 42 'is also subjected to the dry etching process 45, the liquid-repellent layer 42' is also made lyophilic and its liquid repellency is lowered.

  Therefore, heat treatment 46 is performed as shown in FIG. In the present invention, by performing the heat treatment 46, the liquid repellency of the liquid repellent layer 42 ′ once lowered by the dry etching process 45 can be increased again to a predetermined level. That is, the liquid repellent layer 42 ′ after the heat treatment 46 can have a higher contact angle with the liquid than the liquid repellent layer 42 ′ after the dry etching process 45. Therefore, since the difference in wettability between the first electrode layer 41 and the liquid repellent layer 42 ′ can be increased, the light emitting layer can be accurately formed on the first electrode layer.

  Further, as shown in FIG. 4 (f), a light emitting layer forming coating solution is applied onto the first electrode layer 41 by a discharge method to form a light emitting layer 47. In the present invention, since a pattern is formed by the difference in wettability between the first electrode layer 41 and the liquid repellent layer 42 ′, the light emitting layer 47 is patterned on the first electrode layer 41 using this pattern. Can be formed. Furthermore, since the surface of the first electrode layer 41 is formed higher than the surface of the liquid repellent layer 42 ', the light emitting layer forming coating solution is affected by the side surface of the liquid repellent layer 42'. Absent. Furthermore, since the surface of the first electrode layer 41 has high lyophilicity by the dry etching process 45 shown in FIG. 4D, the coating solution for forming the light emitting layer wets well on the first electrode layer 41. spread.

  A dry etching process 45 is again performed on the entire surface of the substrate 40 as shown in FIG. In this case, the dry etching process 45 modifies the surfaces of the light emitting layer 47 and the liquid repellent layer 42 ′ to make the light emitting layer 47 and the liquid repellent layer 42 ′ lyophilic. Next, as shown in FIG. 4H, an insulating layer 48 is formed so as to cover the liquid repellent layer 42 ′ and the end of the light emitting layer 47. In the present invention, since the surface of the liquid repellent layer 42 ′ is made lyophilic by performing dry etching again, the insulating layer 48 can be easily formed at a predetermined position. In addition, by forming the insulating layer 48 in this manner, even when there is a possibility that inconvenience such as a short circuit may occur due to the thin film thickness of the end portion, such inconvenience can be easily eliminated.

  Thereafter, an EL element can be manufactured by forming a second electrode layer on the light emitting layer 47.

  Hereinafter, the EL device manufacturing method of the present invention will be described in detail for each process. Note that the dry etching process and the contact angle recovery process are the same as in “B. Patterning Substrate Manufacturing Method” above, and thus the description thereof is omitted here.

(1) Substrate preparation step First, the substrate preparation step will be described. The substrate preparation step in the present invention includes a first electrode layer that cannot be etched by a dry etching process, and a liquid repellent layer that has a higher contact angle with the liquid than the first electrode layer and is etched by the dry etching process. This is a step of forming a pattern on a substrate.

  It should be noted that the fact that the etching cannot be performed by the dry etching process here means that the first electrode layer itself is not affected by the dry etching process as in the case of the non-dry etching part described above, and the surface thereof is shaved off. It means not. When dry etching treatment is performed on such a first electrode layer, the first electrode layer itself does not change, but foreign matters and the like existing on the surface can be removed. The wettability can be improved.

  In this step, a substrate on which the first electrode layer and the liquid repellent layer are formed in a pattern is prepared. In this process, the order in which the first electrode layer and the liquid repellent layer are formed on the substrate is not particularly limited. After forming the first electrode layer, a liquid repellent layer may be formed, or vice versa. In particular, it is preferable to form the liquid repellent layer after forming the first electrode layer. When the first electrode layer and the liquid repellent layer are formed in this order, the liquid repellent layer is patterned by removing the liquid repellent layer formed on the first electrode layer. At this time, the residue of the liquid repellent layer remaining on the first electrode layer can be removed by the dry etching treatment step, and the effects of the present invention can be utilized more effectively.

  For example, a known method can be used as a method for forming the first electrode layer on the substrate, and specific examples include wet coating, vapor deposition, sputtering, and CVD.

  The method for forming the liquid repellent layer is the same as that described in the item “B. Patterning Substrate Manufacturing Method 1. Substrate Preparation Step”, and a description thereof will be omitted. In addition, the first electrode layer and the liquid repellent layer are the same as those described in the above “C. EL element”, and thus the description thereof is omitted here.

(2) Organic EL layer forming step Next, the organic EL layer forming step will be described. The organic EL layer forming step is a step of applying an organic EL layer forming coating solution for forming an organic EL layer on the first electrode layer to form the organic EL layer in a pattern.

  The application method for applying the organic EL layer forming coating solution in this step is not particularly limited, but is preferably a discharge method. This is because the organic EL layer forming coating liquid can be applied in a pattern by effectively utilizing the pattern due to the difference in wettability between the first electrode layer and the liquid repellent layer previously formed on the substrate. . Among these, it is preferable to use an ink jet method.

  In addition, as the organic EL layer forming coating solution used in this step, the organic EL layer in the present invention includes at least the light emitting layer as described above, and thus the light emitting layer forming coating solution for forming the light emitting layer. Can be mentioned.

  Such a light emitting layer forming coating solution is usually composed of a light emitting material, a solvent, and additives such as a doping agent. In addition, when performing full color etc., since the light emitting layer of several colors is formed, the coating liquid for several types of light emitting layer formation is normally used.

  The solvent that can be used for the light emitting layer forming coating solution in the present invention is not particularly limited as long as it is a solvent capable of dissolving or dispersing the light emitting material described in the above “C. EL element”. Specific examples include chloroform, methylene chloride, dichloroethane, tetrahydrofuran, toluene, xylene and the like.

  Further, examples of the additive include a doping material for the purpose of improving the light emission efficiency in the light emitting layer and changing the light emission wavelength. Examples of the doping material include perylene derivatives, coumarin derivatives, rubrene derivatives, quinacridone derivatives, squalium derivatives, porphyrene derivatives, styryl dyes, tetracene derivatives, pyrazoline derivatives, decacyclene, phenoxazone, and the like. Further, a surfactant or the like may be added for the purpose of improving the ejection property.

  The light-emitting material constituting the light-emitting layer forming coating solution is the same as that described in the column “C. EL element”, and the description thereof is omitted here.

  The thickness of such a light emitting layer is preferably in the range of 10 nm to 1000 nm, and more preferably in the range of 10 nm to 500 nm. This is because the above range is sufficient to obtain a function as a light emitting layer.

(3) Re-dry etching process In the present invention, the re-dry etching process is a process of again performing dry etching on the entire surface of the substrate after the organic EL layer forming process.

  In the present invention, the dry etching process is again performed on the entire surface of the substrate before performing the insulating layer forming process described later. In general, by performing a dry etching process, residues such as foreign matters existing in unnecessary portions can be removed, or the surface is modified, so that lyophilicity can be improved. Therefore, in the present invention, the lyophobic layer and the organic EL layer can be made lyophilic. Accordingly, since the liquid repellency of the liquid repellent layer is lowered, it is easy to form a desired shape so as to cover an end portion of the organic EL layer when an insulating layer described later is formed.

  Such a dry etching process in this step is the same as the method described in “B. Patterning Substrate Manufacturing Method”, and therefore the description thereof is omitted here.

(4) Insulating layer forming step The insulating layer forming step in the present invention is a step of forming an insulating layer in a pattern so as to cover an end of the first electrode layer.

  By forming the insulating layer in this way, it is possible to prevent charge concentration or short circuit that may occur at the end. Accordingly, an EL element having excellent display characteristics can be manufactured.

  Such an insulating layer is not particularly limited as long as it has a shape that covers the end of the organic EL layer. For example, the two organic EL layers may be formed on the liquid repellent layer so as to be continuous from end to end, or may be formed so as to cover only one end of the organic EL layer. Good.

  Examples of the method for forming the insulating layer in such a shape include a vapor deposition method through a mask.

  Thus, after forming an insulating layer, an EL element can be manufactured by performing the process of forming a 2nd electrode layer etc. on an organic EL layer.

2. Fourth Embodiment Next, a method for manufacturing an EL element according to a fourth embodiment will be described.

The EL device manufacturing method of this embodiment has a liquid repellency that has a higher contact angle between the first electrode layer that cannot be etched by the plasma irradiation treatment and the liquid than the first electrode layer, and is etched by the plasma irradiation treatment. A substrate preparation step of forming a layer in a pattern on the substrate;
Plasma irradiation is performed on the entire surface of the substrate such that the surface of the liquid repellent layer is lower than the surface of the first electrode layer relative to the substrate having the first electrode layer and the liquid repellent layer. A plasma irradiation treatment process for carrying out the treatment;
An organic electroluminescent layer-forming coating solution for forming an organic electroluminescent layer including at least a light emitting layer is applied on the first electrode layer, and the organic electroluminescent layer is formed in a pattern. A luminescent layer forming step;
An insulating layer forming step of forming an insulating layer in a pattern so as to cover an end portion of the organic electroluminescent layer.

  Since the first electrode layer cannot be etched in the plasma irradiation process, only the liquid repellent layer can be selectively etched even if the entire surface of the substrate is subjected to the plasma irradiation process. At this time, the liquid repellent layer is etched so that the surface thereof is lower than the height of the surface of the first electrode layer. Therefore, when the organic EL layer is formed on the first electrode layer, the liquid repellent layer is formed. Since the working liquid for organic EL layer forming application does not adhere to the side surfaces of the organic EL layer, the cross-sectional shape of the organic EL layer is difficult to be formed in a concave shape. In addition, when plasma irradiation treatment is performed, residues such as foreign matters can be removed, so that the lyophilicity of the first electrode layer can be enhanced after the plasma irradiation treatment step. Therefore, when the organic EL layer forming coating liquid is applied onto the first electrode layer in the organic EL layer forming step, the organic EL layer can be formed in a predetermined region with high precision and wettability.

  A method for manufacturing the EL element of this embodiment having such advantages will be described. In addition, since the organic EL layer forming step and the insulating layer forming step in this embodiment are the same as those in the third embodiment described above, description thereof is omitted here.

(1) Substrate preparation step First, the substrate preparation step will be described. The substrate preparation process in this embodiment includes a first electrode layer that cannot be etched by plasma irradiation treatment, a liquid repellent layer that has a higher contact angle with the liquid than the first electrode layer and is etched by plasma irradiation treatment, Is formed in a pattern on the substrate.

  The first electrode layer used in this step cannot be etched by the plasma irradiation treatment. Therefore, only the liquid repellent layer can be selectively etched even if the entire surface of the substrate is subjected to a plasma irradiation process in a plasma irradiation process described later. Specifically, the first electrode layer may be the same as that described in the above “C. EL element”.

  In this step, the method for forming the first electrode layer and the liquid repellent layer is the same as that in the third embodiment described above, and a description thereof will be omitted.

(2) Plasma irradiation treatment step In this embodiment, the plasma irradiation treatment step is performed on the substrate having the first electrode layer and the liquid repellent layer, with the liquid repellent layer being higher than the surface height of the first electrode layer. In this step, the entire surface of the substrate is subjected to plasma irradiation treatment so that the surface of the substrate becomes lower.

  By performing the plasma irradiation treatment, it is possible to remove residues such as foreign matters present in unnecessary portions. For example, when the liquid repellent layer is formed after forming the first electrode layer in the substrate preparation step, the liquid repellent remaining on the region where the liquid repellent layer has been removed, that is, the first electrode layer. Since the residue of the layer can be removed, the first electrode layer can be made lyophilic.

  Since the plasma irradiation process in this step is the same as that described in the above-mentioned “Method for manufacturing patterning substrate 1. First embodiment”, description thereof is omitted here.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has substantially the same configuration as the technical idea described in the claims of the present invention, and any device that exhibits the same function and effect is the present invention. It is included in the technical scope of the invention.

(Example)
(Production of patterning substrate)
On the glass substrate, ITO was formed in a stripe shape as the first electrode layer. Furthermore, as a material having liquid repellency, a positive photosensitive resin TFR-H (manufactured by Tokyo Ohka Co., Ltd.) mixed with 20% by weight of Modiper F110 (manufactured by Nippon Oil & Fats Co., Ltd.) is spin coated on the entire glass substrate on which ITO is formed. The film was formed, exposed using a photomask, and developed with an alkali developer (NMD-3, manufactured by Tokyo Ohka Kogyo Co., Ltd.). As a result, a liquid repellent layer formed in a pattern was obtained.

  Next, oxygen plasma treatment was performed as a dry etching treatment on the entire surface of the glass substrate having a liquid repellent layer on the surface until the upper portion of the liquid repellent layer was lower than the upper portion of ITO. Further, a heating process was performed with a hot plate at a temperature of 150 ° C. to produce a patterning substrate.

  On the ITO of the patterning substrate thus heat-treated, an organic EL layer forming coating solution was applied by an ink jet method to form an organic EL layer. After forming the organic EL layer, an oxygen plasma treatment was applied to the entire surface of the glass substrate as a re-dry etching treatment. And the insulating layer was formed into a film by the vacuum evaporation method so that the liquid repellent layer surface and the edge part of an organic electroluminescent layer might be covered. As a cathode, calcium was vapor-deposited on the organic EL layer, and further silver was vapor-deposited to obtain an EL device.

  The film thickness distribution of the organic EL layer in the EL element is shown in FIG.

(Comparative example)
A patterning substrate was produced in the same manner as in the above example except that the dry etching treatment and the heat treatment were not performed. As a result, a patterning substrate in which the liquid repellent layer was formed higher than the upper part of the ITO was produced. On the ITO of this patterning substrate, the same organic EL layer forming coating solution as in the above example was applied by an ink jet method to produce an EL device in the same manner as in the above example. The film thickness distribution of the organic EL layer in such an EL element is shown in FIG.

(Evaluation)
From the results shown in FIG. 6, the upper part of the liquid-repellent layer is formed lower than the upper part of the ITO as in the example, so that the upper part of the liquid-repellent layer is formed higher than the upper part of the ITO. It can be seen that the difference in film thickness between the part and the end part is small, and the film thickness can be made uniform.

  In the examples, since the dry etching treatment and the heat treatment are performed, when the coating liquid for forming the organic EL layer is applied onto the ITO by the ink jet method, the liquid repellent layer spreads well only on the ITO. The organic EL layer could be laminated on ITO without spreading on top.

It is a schematic sectional drawing which shows an example of the board | substrate for patterning of this invention. It is process drawing which shows an example of the manufacturing method of the substrate for patterning of this invention. It is a schematic sectional drawing which shows an example of the EL element of this invention. It is process drawing which shows an example of the manufacturing method of the EL element of this invention. It is a schematic sectional drawing which shows an example of the conventional EL element. It is the graph which showed the film thickness distribution of the organic electroluminescent layer in an Example and a comparative example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Substrate 2 ... Non-dry etching part 3 ... Liquid repellent layer alpha ... Liquid repellent substance

Claims (8)

And etching Saree no electrode layer by oxygen plasma irradiation process, the substrate to form the electrode high contact angle with pure water than layer pattern and a liquid repellent layer is etched by the oxygen plasma irradiation process on the substrate A preparation process;
The substrate having the electrode layer and the liquid repellent layer is subjected to oxygen plasma irradiation treatment on the entire surface of the substrate so that the surface of the liquid repellent layer is lower than the surface height of the electrode layer. A dry etching process,
The contact angle recovery treatment for increasing the contact angle with pure water is performed on the substrate after the dry etching treatment step, so that the contact angle of the liquid repellent layer with pure water is changed to the dry etching treatment step. A contact angle recovery treatment process to be higher than after,
A method for producing a patterning substrate comprising:
A patterning substrate manufacturing method , wherein the patterning substrate is used in an organic electroluminescent element . The method for manufacturing a patterning substrate according to claim 1 , wherein the contact angle recovery process is a heat process. The electrode layer, patterning method for manufacturing a substrate according to claim 1 or claim 2, characterized in that is made of scan Zudopu indium oxide. And etching Saree no electrode layer by oxygen plasma irradiation process, the substrate to form the electrode high contact angle with pure water than layer pattern and a liquid repellent layer is etched by the oxygen plasma irradiation process on the substrate A preparation process;
The substrate having the electrode layer and the liquid repellent layer is subjected to oxygen plasma irradiation treatment on the entire surface of the substrate so that the surface of the liquid repellent layer is lower than the surface height of the electrode layer. A method of manufacturing a patterning substrate having a plasma irradiation treatment step ,
A patterning substrate manufacturing method , wherein the patterning substrate is used in an organic electroluminescent element . A first electrode layer that cannot be etched by the oxygen plasma irradiation treatment and a liquid repellent layer that has a higher contact angle with pure water than the first electrode layer and is etched by the oxygen plasma irradiation treatment are patterned on the substrate. A substrate preparation step to be formed on,
Oxygen plasma is applied to the entire surface of the substrate such that the surface of the liquid repellent layer is lower than the surface of the first electrode layer with respect to the substrate having the first electrode layer and the liquid repellent layer. A dry etching treatment process for performing irradiation treatment;
The contact angle recovery treatment for increasing the contact angle with pure water is performed on the substrate after the dry etching treatment step, so that the contact angle of the liquid repellent layer with pure water is changed to the dry etching treatment step. A contact angle recovery treatment process to be higher than after,
An organic electroluminescent layer-forming coating solution for forming an organic electroluminescent layer including at least a light emitting layer is applied on the first electrode layer, and the organic electroluminescent layer is formed in a pattern. A luminescent layer forming step;
A re-dry etching treatment step of again performing oxygen plasma irradiation treatment on the entire surface of the substrate after the organic electroluminescent layer formation step;
And an insulating layer forming step of forming an insulating layer in a pattern so as to cover an end portion of the organic electroluminescent layer. The method of manufacturing an electroluminescent element according to claim 5 , wherein the contact angle recovery process is a heat process. It said first electrode layer is, the manufacturing method of the electroluminescent element according to claim 5 or claim 6, characterized in that is made of scan Zudopu indium oxide. A first electrode layer that cannot be etched by the oxygen plasma irradiation treatment and a liquid repellent layer that has a higher contact angle with pure water than the first electrode layer and is etched by the oxygen plasma irradiation treatment are patterned on the substrate. A substrate preparation step to be formed on,
Oxygen plasma is applied to the entire surface of the substrate such that the surface of the liquid repellent layer is lower than the surface of the first electrode layer with respect to the substrate having the first electrode layer and the liquid repellent layer. A plasma irradiation treatment process for performing irradiation treatment;
An organic electroluminescent layer-forming coating solution for forming an organic electroluminescent layer including at least a light emitting layer is applied on the first electrode layer, and the organic electroluminescent layer is formed in a pattern. A luminescent layer forming step;
And an insulating layer forming step of forming an insulating layer in a pattern so as to cover an end portion of the organic electroluminescent layer.

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