JP4769744B2 - Electronic component mounting apparatus and mounting method - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus and mounting method for mounting a TCP (Tape Carrier Package) as an electronic component on a liquid crystal display panel as a substrate.

  For example, when a liquid crystal display panel as a substrate is manufactured, TCP as an electronic component is mounted on the liquid crystal display panel by a mounting device. When the TCP is mounted on a liquid crystal display panel, the TCP is punched out from a carrier tape by a punching device, and the TCP is received by a carrier that is transported and driven.

  The receiving body conveys the punched TCP to a predetermined position, and delivers it to a plurality of holding heads provided on an index table that is rotationally driven intermittently by a predetermined angle at that position. The TCP delivered to the holding head of the index table reaches the mounting position by cleaning the terminal portion of the TCP and positioning the holding position by the mounting head according to the intermittent rotation of the index table.

The TCP that has reached the mounting position is imaged together with the side portion of the display panel by the imaging camera, and then the display panel is positioned with respect to the TCP based on the imaging. Next, the mounting head is driven in the downward direction, so that the TCP held by the mounting head is mounted on the side portion of the substrate. In this manner, a plurality of TCPs are sequentially mounted at predetermined intervals on the side portion of the display panel.
Such prior art is disclosed in Patent Document 1 and Patent Document 2.
JP 2002-305398 A JP 2006-120929 A

  By the way, the time required for punching TCP from the carrier tape by the punching device, delivering the TCP to the holding head of the index table by the receiving body and transporting it to the mounting position, and the TCP and liquid crystal display transported to the mounting position When the liquid crystal display panel is positioned by taking an image of the side of the panel and the time required to mount the TCP on the side of the liquid crystal display panel is compared, the former work time is the latter work time. It is about twice as long.

  In other words, the former work includes punching TCP from the carrier tape, transporting the punched TCP to the index table holding head, and further cleaning the TCP and positioning the holding head while intermittently driving the index table. Etc. must be done.

  On the other hand, in the latter operation, the TCP and the liquid crystal display panel held by the holding head are imaged, the substrate is positioned based on the imaging, and the mounting head is lowered to mount the TCP on the liquid crystal display panel. It is.

  For this reason, the former has more work than the latter and more mechanical work that takes longer work time. Therefore, the work time may be longer than the latter. This has also been confirmed by measuring the actual working time.

  Thus, the former work time required to supply the TCP punched from the carrier tape to the mounting position is longer than the latter work time required to mount the TCP supplied to the mounting position on the substrate. Even if the former work is performed without a break, a waiting time is generated in the latter work, so that there is a limit in improving productivity due to the waiting time.

  The present invention provides an electronic component mounting in which the punched electronic component can be supplied to the mounting position so that a waiting time does not occur in the mounting operation of mounting the electronic component supplied to the mounting position on the substrate. To provide an apparatus and a mounting method.

The present invention is a mounting apparatus for mounting a plurality of electronic components on a side portion of a substrate,
A punching device for punching the electronic component from the tape-shaped member;
Receiving means for receiving the electronic component punched by the punching device and transporting it to a predetermined position; and
Buffer means having a plurality of holding heads that receive the electronic components transported to a predetermined position by the transport means and stand by at the delivery position;
A delivery means for receiving the electronic component held by the holding head of the buffer means and transporting it to the vicinity of the side portion of the substrate;
A mounting means for receiving the electronic component conveyed by the delivery means and mounting the electronic component on the side portion of the substrate ;
The mounting means includes one mounting head for mounting the electronic component from one end in the width direction of the substrate toward the center, and the other mounting head for mounting the electronic component from the center in the width direction to the other end of the substrate. The electronic component mounting apparatus is characterized by the above.

  It is preferable that the board is positioned at a predetermined position, and the mounting means that receives the electronic component from the delivery means is driven to be positioned with respect to the side portion of the board to mount the electronic component.

The holding head sucks and holds the upper surface of the electronic component conveyed to a predetermined position by the conveying means, and is driven in a direction perpendicular to the side portion of the substrate to stand by at a delivery position. And
The lower surface is preferably brushed when driven to the delivery position.

  The number of holding heads of the buffer means is the same as the number of electronic components mounted on the side portion of the substrate, and the electronic components on the side portion of the substrate are mounted in a state where the electronic component is held. It is preferable to wait at a position corresponding to the position.

When the electronic component is mounted on the side portion of the substrate by the first mounting head and the second mounting head , the electronic component of the substrate is mounted by being driven along the width direction of the substrate. It is preferable to have a pair of backup tools that support the lower surface of the portion.

The present invention is a mounting method for mounting a plurality of electronic components on a side portion of a substrate,
A step of punching the electronic component from the tape-shaped member;
Receiving a punched electronic component and transporting it to a predetermined position;
Receiving the electronic component conveyed to a predetermined position by a plurality of holding heads, and waiting at a delivery position;
Receiving the electronic component from the holding head waiting at the delivery position and transporting it to the vicinity of the side of the substrate;
The electronic component conveyed to near the side of the substrate is received by a pair of mounting heads, and the electronic component is mounted from one end of the side of the substrate toward the center by one mounting head. And mounting the electronic component from the center in the width direction of the side portion of the substrate toward the other end by the other mounting head .

  When the electronic component is mounted on the side portion of the substrate by the first mounting head and the second mounting head, the lower surface of the portion of the substrate on which the electronic component is mounted extends along the width direction of the substrate. It is preferably supported by a pair of backup tools that are driven by

  According to the present invention, the electronic components punched out from the tape-like member are received by the holding head and waited at the delivery position, so that a plurality of electronic components on the substrate are buffered by the electronic components held by the holding head. The mounting efficiency can be improved.

An embodiment of the present invention will be described below with reference to the drawings.
FIG. 1 is a plan view showing a schematic configuration of a mounting apparatus according to the present invention. This mounting apparatus includes a first punching apparatus 3A for punching TCP 2 as an electronic component from a carrier tape 1 as a tape-like member. A second punching device 3B is provided.

  The first punching device 3A and the second punching device 3B are operated alternately, and the TCP 2 punched by one of the punching devices 3A or 3B is a first transport means 4A and a second transport means described later. Received by 4B.

  When the TCP 2 is punched by the first punching device 3A, the second punching device 3B is waiting, and when the TCP 2 is punched from the carrier tape 1 supplied to the first punching device 3A. Then, the second punching device 3B is operated, and a new carrier tape 1 is supplied to the first punching device 3A. Thus, the TCP 2 punched from the carrier tape 1 by the first and second punching devices 3A and 3B is alternately transported by the first transport means 4A and the second transport means 4B as described later. It has become.

  As shown in FIG. 2, the first and second punching devices 3 </ b> A and 3 </ b> B have a mold 13 for punching the TCP 2 from the carrier tape 1. The mold 13 includes an upper mold 13a that is driven in the vertical direction, and a lower mold 13b that is fixedly disposed to face the upper mold 13a. The upper die 13a is provided with a punch 14, and the lower die 13b is provided with a through hole 15 into which the punch 14 enters when the upper die 13a is lowered.

  The carrier tape 1 is passed between the upper mold 13a and the lower mold 13b, and the TCP 2 is punched when the upper mold 13a is lowered, and when it is raised, it is sent at a predetermined pitch in the arrow direction. It will be ready to punch.

  The TCP 2 punched out by the first and second punching devices 3A and 3B are alternately received by the respective receiving tools 16 of the first and second transport means 4A and 4B. As shown in FIGS. 2 and 3, the receiver 16 is driven by a Zθ drive source 18 provided on the Y table 17 in the Z direction as the vertical direction and the θ direction as the rotation direction. .

  The pair of Y tables 17 are provided on a Y guide body 20 provided on the X table 19 along the Y direction so as to be driven by a linear motor (not shown). The pair of X tables 19 is provided on an X guide body 23 arranged along the X direction on the base 22 of the mounting apparatus so as to be driven by a linear motor (not shown). Each X table 19 is driven independently by the linear motor. The X direction and the Y direction are indicated by arrows in FIGS.

  When the TCP 16 is received from one of the first and second punching devices 3A and 3B, the receiver 16 of the first and second transport means 4A and 4B receives a predetermined line indicated by a chain line from the position indicated by the solid line in FIG. Driven in the Y direction to the position. This Y direction is defined as the Y forward direction.

  The TCP 2 held by the holder 16 driven and positioned in the Y-forward direction is sucked and held by one of a plurality of holding heads 26 constituting the buffer means 25 as shown in FIGS. . In this embodiment, the number of holding heads 26 is the same as the number of TCPs 2 mounted on one side of the substrate W, and in this embodiment, 14 holding heads 26 are provided.

  Each holding head 26 is suspended from the Y movable body 27. Each Y movable body 27 is provided on a Y guide body 28 provided at a predetermined interval in the X direction so that it can be driven by a linear motor (not shown). The plurality of Y guide bodies 28 are provided on the fixed portion 29 along the Y direction at predetermined intervals with respect to the X direction.

  The holding head 26 receives the TCP 2 punched out by the punching devices 3A and 3B from the receiving tool 16 and is driven in the Y forward direction. The receiving member 16 that receives the TCP 2 from one of the first and second punching devices 3A and 3B is driven in the Y forward direction and the X direction as shown in FIGS. Is positioned. Next, the receiver 16 is driven upward in the Z direction, and the TCP 2 held therein comes into contact with or approaches the suction surface at the lower end of the holding head 26.

  In this state, a suction force is generated in the holding head 26. As a result, the TCP 2 held by the receiver 16 is attracted to the holding head 26 and delivered. The holding head 26 which has received the TCP 2 approaches the one side portion of the substrate W along the Y guide body 28 together with the Y movable body 27 as shown by the chain line from the position shown by the solid line in FIG. It is driven to the position and waits at that position.

  When the holding head 26 receives the TCP 2 from the holder 16 and is driven in the Y forward direction approaching one side of the substrate W, the TCP 2 held by the holding head 26 has a lower surface provided with a terminal (not shown). Brushing is performed in contact with the rotationally driven brush 30. Thereby, the dirt adhering to the terminal is removed. Note that a volatile solvent such as alcohol is supplied during brushing to prevent the generation of static electricity during brushing.

  The TCP 2 attracted and held by the holding head 26 waiting at a predetermined position is received by the transfer body 32 of one of the first transfer means 31A and the second transfer means 31B and conveyed in the Y forward direction to the transfer position. Is done.

  As shown in FIG. 2, the delivery body 32 has a Y guide body 33 provided on the base 22 along the Y direction. The Y guide body 33 is provided with a Y movable body 34 (not shown) so as to be driven in the Y direction by a linear motor.

  The Y movable body 34 is provided with an X guide body 35 along the X direction. The transfer body 32 is provided on the X guide body 35 so as to be driven in the Z direction by a Z / θ drive source 36. Thereby, the transfer body 32 can be driven in the X, Y, Z and θ directions.

  The delivery body 32 is driven in the Y-forward direction and positioned below the holding head 26 waiting at a predetermined position, and then driven in the upward direction as indicated by a chain line to attract and hold the TCP 2 from the holding head 26. .

  The transfer body 32 having received the TCP 2 is driven in the downward direction, and then driven in the Y forward direction approaching one side of the substrate W as shown by a chain line in FIG. The transfer body 32 driven to a predetermined position in the Y forward direction is driven in the upward direction and stands by. One of the pair of mounting heads 37 constituting the mounting means is positioned above the transfer body 32 driven in the upward direction.

  The mounting head 37 is driven in the downward direction with respect to the transfer body 32 that is driven and positioned in the upward direction, and the TCP 2 is sucked and received from the transfer body 32. At this time, the height at which the mounting head 37 receives the TCP 2 is slightly higher than the position at which the mounting head 37 mounts the TCP 2 on the substrate W.

  The mounting head 37 that has received the TCP 2 is driven in the Y-forward direction as shown by a chain line in FIG. Next, the mounting head 37 is driven in the downward direction to mount the TCP 2 on one side of the substrate W. The mounting head 37 on which the TCP 2 is mounted on the substrate W is driven in the upward direction and then driven in the Y backward direction to stand by.

  The pair of mounting heads 37 are provided so as to be driven in the Z direction by a Z · θ drive source 47 as shown in FIG. The Z / θ drive source 47 is provided on the X / Y table 48 so as to be driven in the X and Y directions. Accordingly, the mounting head 37 can be driven in the X, Y, Z, and θ directions.

  One mounting head 37 receives the TCP 2 from the transfer body 32 of the first transfer means 31A, and as shown in FIG. 5, the left region L with the central line O in the width direction of one side of the substrate W as a boundary. In this embodiment, seven TCPs 2 are mounted in the order indicated by a to g.

  The other mounting head 37 receives TCP2 from the transfer body 32 of the second transfer means 31B and puts seven TCP2 at a side portion of the right region R with the center in the width direction of the substrate W as a to g. Implement in the order shown.

  The receiver 16 of the first and second transport means 4A and 4B and the transfer body 32 of the first and second transfer means 31A and 31B are driven in the X direction and the Y direction. The holder 16 of the first transport unit 4A is driven in the X and Y directions, so that the holder 16 is positioned at positions that sequentially face the seven holding heads 26 corresponding to the region L of the substrate W, and holds each holding. TCP2 is delivered to the head 26. Similarly, the receiver 16 of the second transport unit 4B is driven in the X and Y directions so that it is positioned at positions that sequentially face the seven holding heads 26 corresponding to the region R of the substrate W. TCP 2 is delivered to the holding head 26.

  The transfer body 32 of the first transfer means 31A is positioned in a position that sequentially faces the seven holding heads 26 corresponding to the region L of the substrate W that is driven in the X direction and holds the TCP 2 and stands by. Receive.

  The transfer body 32 of the second transfer means 31B is positioned in a position that sequentially faces the seven holding heads 26 corresponding to the region R of the substrate W that is driven in the X direction and holds the TCP 2 for standby. Receive.

  When the pair of mounting heads 37 mount the TCP 2 on the upper surface of one side portion of the substrate W, the lower surface of the portion of the substrate W on which the TCP 2 is mounted is the Z direction of the pair of backup units 38 shown in FIGS. It is supported by a pair of backup tools 39 provided to be adjustable in height).

  Each backup unit 38 has an X driver 40. The pair of X driving bodies 40 are supported so as to be movable along an X guide body 40a provided on the base 22, and are independently driven in the X direction by a linear motor (not shown). ing.

  Each X drive body 40 is provided with the backup tool 39 that is driven in the Z direction by the Z drive source 39a. The backup tool 39 is positioned in the X direction by the X drive body 40. The lower surface of the portion of the substrate W on which the TCP 2 is mounted can be supported in the order of a to g described above.

  On both sides in the width direction of each X driver 40, a pair of alignment marks provided on the portion of the substrate W where the TCP2 is mounted and a pair of alignment marks (both not shown) provided on the TCP2 are provided. A pair of imaging cameras 41 for imaging is provided.

  That is, each imaging camera 41 simultaneously images one alignment mark provided on the substrate W and one alignment mark provided on the TCP 2 and mounts the substrate W by performing image processing on the imaging signal. Based on the calculation, the pair of mounting heads 37 holding the TCP 2 are driven in the X, Y, and θ directions to position the TCP 2 at the mounting position of the substrate W.

  When the mounting head 37 is positioned, the mounting head 37 is driven in the downward direction, and the TCP 2 held at the lower end is mounted on one side of the substrate W in the order of a to g described above.

  When TCP2 is imaged by the imaging camera 41 and the TCP2 alignment mark is image-processed by the imaging signal, if the TCP2 is defective, the alignment mark cannot be image-processed and its position cannot be recognized. There is. In such a case, the TCP 2 is regarded as a defective product, and before being mounted on the substrate W by the mounting head 37, as shown in FIG. 42 is to be discarded.

  As shown in FIG. 2, the substrate W has an upper surface of a holding table 44 driven in the X, Y, Z, and θ directions, and at least one side portion of the peripheral portion on which the TCP 2 is mounted is the holding table 44. It is held by protruding outward from the side edge.

  When the substrate W is positioned at a predetermined position by the holding table 44, the mounting head 37 and the backup tool 39 are moved in the X direction, which is the longitudinal direction of one side of the substrate W, without moving the substrate W. A plurality of TCPs 2 are sequentially mounted on one side thereof.

  If the mounting head 37 and the backup tool 39 are moved without mounting the substrate W to mount a plurality of TCP2s on one side thereof, the substrate W is moved and the TCP2 is sequentially mounted on the one side as in the prior art. Whenever it is moved, the one side portion protruding from the holding table 44 of the substrate W does not shake in the vertical direction.

  When the substrate W is shaken, the next TCP 2 cannot be mounted on one side of the substrate W until the shake is settled. In particular, when the substrate W is increased in size, the shake increases, so that the time until stabilization is increased and productivity is lowered.

  However, if the substrate W is positioned by the holding table 44, the plurality of TCPs 2 are mounted without moving the substrate W as described above, so that the substrate W is hardly shaken. This eliminates the need for a waiting time until the substrate is settled as in the prior art, so that the productivity can be increased accordingly.

Next, a procedure for mounting a plurality of TCPs 2 on one side of the substrate W by the mounting apparatus having the above configuration will be described.
On one side of the substrate W held by the holding table 44 and positioned at the mounting position, a left region indicated by L with a center line O in the width direction of the substrate W as a boundary, and a right region indicated by R In addition, TCP2 is mounted in the order indicated by a to g in FIG.

  The lower surface of one side of the substrate W is supported in the order in which the TCP2 is mounted by the backup tool 39 by driving the backup unit 38 in the X direction. Therefore, in this embodiment, when the substrate W is positioned by the holding table 44, the first end portion in the longitudinal direction and the lower surface of the middle portion in the longitudinal direction, which are the pair of a portions of the substrate W, are a pair of backup tools. 39.

  When one end portion and the central portion in the longitudinal direction of one side of the substrate W are supported by the pair of backup tools 39, even if the substrate W is shaken immediately after being positioned by the holding table 44, the shake is a pair. It is settled in a short time by the backup tool 39. Thereby, after positioning the substrate W, it is possible to immediately start the mounting of the TCP 2, so that productivity can be improved.

  The TCP 2 is supplied to the pair of mounting heads 37 after the TCP 2 is punched out of the carrier tape 1 by one of the pair of punching devices 3A and 3B, and then to the receiver 16 of the first and second transport means 4A and 4B. Delivered.

  After receiving the TCP 2, the receiving tool 16 is driven in the X direction and positioned so as to correspond to the predetermined holding head 26, and then driven in the Y forward direction to be positioned below the holding head 26. Next, the receiver 16 is driven in the upward direction. As a result, the TCP 2 held by the receiver 16 is delivered to the holding head 26.

  The holding head 26 that has received the TCP 2 is driven in the Y forward direction and stands by. While the holding head 26 is being driven in the Y-forward direction, the terminal portion of the TCP 2 held by the holding head 26 is brushed by the brush 30.

  The transfer body 32 of the first and second transfer means 31A and 31B is driven and positioned in the X and Y directions with respect to the holding head 26 that has received and waited for TCP2. That is, the delivery body 32 is positioned below the TCP 2 held by the holding head 26.

  Next, when the transfer body 32 is driven in the upward direction and receives the TCP 2 from the holding head 26, the transfer body 32 is driven in the downward direction and then driven in the Y forward direction and then driven in the upward direction. And wait. At the same time, the holding head 26 that has delivered the TCP2 is driven in the Y backward direction without changing its height and stands by, where the TCP2 is supplied from the receiver 16 of the first and second transport means 4A, 4B. Will wait.

  A mounting head 37 is driven and positioned in the X and Y directions above the transfer body 32 driven in the Y forward direction. Next, the mounting head 37 is driven in the downward direction to suck and receive the TCP 2 from the transfer body 32.

  The mounting head 37 that has received the TCP 2 is driven in the X and Y directions to be positioned above the position where the TCP 2 on one side of the substrate W is mounted, and then driven in the downward direction. As a result, the TCP 2 attracted and held by the mounting head 37 is mounted on one side of the substrate W in the order of a to g.

  The TCP2 is mounted by the pair of mounting heads 37 at the same time or at different timings. When the mounting by the pair of mounting heads 37 is performed simultaneously, the mounting order is as shown in FIGS. 5A to 5G, and mounting by one mounting head 37 is performed from one end in the width direction of the substrate W toward the center, and the other The mounting head 37 is moved from the center in the width direction of the substrate W toward the other end. Accordingly, it is possible to prevent the pair of mounting heads 37 from interfering with each other in the width direction of the substrate W.

  Before the mounting of the above-described TCP2 on the substrate W is started, or when the substrate W on which a predetermined amount of TCP2 is mounted on one side is replaced with a new substrate W, the pair of punching apparatuses 3A and 3B One is operated without pausing.

  The TCP 2 punched by one punching device 3A or 3B is received by the receiving tool 16 of the first and second transport means 4A and 4B, and is delivered to the holding head 26 constituting the buffer means 25. It is conveyed to the position.

  Next, when the holding head 26 sucks and holds the TCP 2 from the receiving tool 16, the holding head 26 is driven in the Y-forward direction, and the sucked and held TCP 2 is transferred to the transfer body 32 of the first and second transfer means 31A and 31B. Wait at a position where delivery is possible.

  Thus, the 14 holding heads 26 of the buffer means 25 have a time during which TCP2 cannot be mounted on the substrate W, such as when the substrate W on which TCP2 is mounted is replaced with a new substrate W. The TCP 2 punched by one of the pair of punching devices 3A and 3B is stored.

  Therefore, when the TCP 2 is punched out by one of the pair of punching apparatuses 3A and 3B and the time for supplying the TCP 2 to a position where it can be transferred to the mounting head 37, the TCP 2 supplied to the position where it can be transferred is transferred to the substrate W Even if it takes longer than the time for mounting on the side portion of the substrate W, the region on one side of the substrate W in the longitudinal direction indicated by L and the region indicated by a to g on the other end side indicated by R Each of the 14 TCPs 2 stored in advance in the 14 holding heads 26 can be mounted.

  That is, a pair of mounting heads 37 are rested in order to sequentially mount the 14 TCP2s stored in advance in the 14 holding heads 26 on one side of the new substrate W supplied to the holding table 44. Instead, a predetermined number of TCPs 2 can be mounted on the substrate W. Thereby, the operating rate of the pair of mounting heads 37 can be improved, and productivity can be increased.

  When the TCP 2 is mounted on one side of the substrate W by the pair of mounting heads 37, the lower surface of the one side is supported by the pair of backup tools 39 driven in the X direction. That is, the plurality of TCPs 2 are mounted on the substrate W by moving the backup tool 39 without moving the substrate W.

  Therefore, when mounting a plurality of TCP2s on one side of the substrate W, there is almost no vibration on one side of the substrate W held on the holding table 44. This can be done efficiently without waiting for the swing of W to settle. That is, since the TCP2 can be mounted on the substrate W without causing a waiting time due to the swing of the substrate W, productivity can also be improved by this.

  In the above embodiment, the number of holding heads of the buffer means for storing TCP is the same as the number of TCPs mounted on one side of the substrate, but the number of holding heads is mounted on one side of the substrate. It can be more or less than the number of TCPs. In short, if the TCP punched by the punching device can be stored in advance, even if there is a time difference between the punching work and the mounting work, the TCP Therefore, productivity can be improved by the amount stored in the holding head.

  In addition, although two sets of the punching device, the conveying means, and the mounting head are provided, one set may be provided depending on the size of the substrate and the number of TCPs to be mounted.

The top view which shows schematic structure of the mounting apparatus of one embodiment of this invention. The side view of the mounting apparatus shown in FIG. The front view which shows a pair of conveyance means and buffer means. The front view which shows a pair of backup unit. The figure for demonstrating the order which divides and mounts several TCP in the one side part of a board | substrate into the right side part and the left side part.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Carrier tape, 2 ... TCP (electronic component), 3A, 3B ... Punching device, 4A, 4B ... Conveying means, 13 ... Mold, 25 ... Buffer means, 26 ... Holding head, 30 ... Brush, 31A, 31B DESCRIPTION OF SYMBOLS ... Delivery means, 32 ... Delivery body, 37 ... Mounting head, 38 ... Backup unit, 39 ... Backup tool, 41 ... Imaging camera, 44 ... Holding table.

Claims (7)

A mounting device for mounting a plurality of electronic components on a side portion of a substrate,
A punching device for punching the electronic component from the tape-shaped member;
Receiving means for receiving the electronic component punched by the punching device and transporting it to a predetermined position; and
Buffer means having a plurality of holding heads that receive the electronic components transported to a predetermined position by the transport means and stand by at the delivery position;
A delivery means for receiving the electronic component held by the holding head of the buffer means and transporting it to the vicinity of the side portion of the substrate;
A mounting means for receiving the electronic component conveyed by the delivery means and mounting the electronic component on the side portion of the substrate ;
The mounting means includes one mounting head for mounting the electronic component from one end in the width direction of the substrate toward the center, and the other mounting head for mounting the electronic component from the center in the width direction to the other end of the substrate. mounting apparatus of electronic components, characterized in that it.   The board is positioned at a predetermined position, and the mounting means that receives the electronic component from the delivery means is driven to be positioned with respect to the side portion of the board to mount the electronic component. The electronic component mounting apparatus according to claim 1. The holding head sucks and holds the upper surface of the electronic component conveyed to a predetermined position by the conveying means, and is driven in a direction perpendicular to the side portion of the substrate to stand by at a delivery position. And
2. The electronic component mounting apparatus according to claim 1, wherein the lower surface is brushed when driven to the delivery position.   The number of holding heads of the buffer means is the same as the number of electronic components mounted on the side portion of the substrate, and the electronic components on the side portion of the substrate are mounted in a state where the electronic component is held. 2. The electronic component mounting apparatus according to claim 1, wherein the electronic component mounting apparatus stands by at a position corresponding to the position. When the electronic component is mounted on the side portion of the substrate by the first mounting head and the second mounting head , the electronic component of the substrate is mounted by being driven along the width direction of the substrate. 2. The electronic component mounting apparatus according to claim 1, further comprising a pair of backup tools for supporting the lower surface of the portion. A mounting method for mounting a plurality of electronic components on a side portion of a substrate,
A step of punching the electronic component from the tape-shaped member;
Receiving a punched electronic component and transporting it to a predetermined position;
Receiving the electronic component conveyed to a predetermined position by a plurality of holding heads, and waiting at a delivery position;
Receiving the electronic component from the holding head waiting at the delivery position and transporting it to the vicinity of the side of the substrate;
The electronic component conveyed to near the side of the substrate is received by a pair of mounting heads, and the electronic component is mounted from one end of the side of the substrate toward the center by one mounting head. And mounting the electronic component from the center in the width direction of the side portion of the substrate toward the other end by the other mounting head . When the electronic component is mounted on the side portion of the substrate by the first mounting head and the second mounting head, the lower surface of the portion of the substrate on which the electronic component is mounted extends along the width direction of the substrate. 7. The electronic component mounting method according to claim 6 , wherein the electronic component mounting method is supported by a pair of backup tools that are driven in this manner.

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