JP4772746B2 - Worktable for semiconductor devices - Google Patents

Description

  The present invention relates to a work table for a semiconductor device.

  2. Description of the Related Art A burn-in apparatus is known as an apparatus for performing a burn-in test, which is a kind of screening test for revealing an initial failure of a semiconductor device such as an electronic component and removing an initial failure product. This burn-in device is a type of semiconductor test device. A burn-in board with a plurality of semiconductor devices, which are devices under test, is housed in the burn-in device, and voltage is applied to the semiconductor device to apply electrical stress. In addition to heating the air inside the thermostatic chamber and applying a thermal stress at a predetermined temperature, the initial failure becomes obvious. Further, in this burn-in test, an operation power supply and a signal are supplied to the semiconductor device, an operation test of the semiconductor device is performed, and a test is performed to check whether each semiconductor device is operating normally.

  In such a burn-in apparatus, since a long-time burn-in test for several hours to several tens of hours is performed, in order to improve the test efficiency, a plurality of semiconductor devices are mounted on one burn-in board. In general, a plurality of burn-in boards are stored in a burn-in apparatus and a burn-in test is performed.

  Since many semiconductor devices are mounted on the burn-in board, a transfer device is widely used for mounting the semiconductor device on the tray on the burn-in board or removing the mounted semiconductor device without human intervention. ing. A semiconductor device carrying device that performs such work is also called an inserter / uninserter. When inserting a semiconductor device, the semiconductor device arranged on the tray is picked up by the pickup device, and the burn-in board socket is inserted. The operation of inserting into the socket is repeated until the semiconductor devices are inserted into all the sockets. Also, when uninserting a semiconductor device, the semiconductor device inserted in the burn-in board socket is removed by the pickup device and placed on the tray until the semiconductor device is removed from all sockets. repeat.

  However, static electricity is generated when the semiconductor device is picked up or inserted by the pickup device, and this static electricity is accumulated in the semiconductor device. That is, static electricity generated by contact charging such as peeling charging, collision charging, friction charging, and the like is accumulated in the semiconductor device. In particular, the burn-in board socket is generally provided with a claw portion having an opening / closing mechanism for ensuring the mounting of the semiconductor device. The opening / closing mechanism of the claw portion also opens and closes the friction. Static electricity is generated by charging, and the semiconductor device is charged.

  When the burn-in board with this charged semiconductor device is inserted into a burn-in board cart at a ground potential or into a slot of the burn-in device, static electricity accumulated in the semiconductor device is discharged at once, and the semiconductor device May be damaged.

  In order to prevent such damage to the semiconductor device due to static electricity, Japanese Patent Laid-Open No. 7-58184 (Patent Document 1) removes the static electricity of the semiconductor device from the inside of the transfer arm to the semiconductor device picked up by the pickup device. A technique for feeding ions for the purpose is disclosed. However, such a method is not preferable because the structure of the transfer arm is complicated and the transfer arm has many movable parts. In addition, the manufacturing cost of the transfer arm is increased.

  Japanese Patent Application Laid-Open No. 2001-44089 (Patent Document 2) discloses a technique for removing a static electricity from a semiconductor wafer in a clean room by providing a soft X-ray irradiation device above the clean room. However, it is not possible to expect a sufficient charge removal effect simply by providing a soft X-ray irradiation device above the space having a large volume.

Further, after inserting the burn-in board on which the semiconductor device is mounted into the slot of the burn-in device, a continuity test is performed to check whether power and signals are normally supplied to each semiconductor device. If any continuity failure has occurred in this continuity test, the burn-in board is removed from the slot, and an operation is performed to manually check whether the semiconductor device is normally mounted in the socket. This operation is performed by placing a burn-in board on a semiconductor device work table generally called a work table and inserting and removing the semiconductor device from the socket using a socket opening / closing jig. For this reason, even in this confirmation work, the semiconductor device is charged and static electricity is accumulated, and when the burn-in board is returned to the slot of the burn-in device, static electricity is discharged from the semiconductor device all at once, which also damages the semiconductor device. There is a risk.
JP-A-7-58184 JP 2001-44089 A

  Therefore, the present invention has been made in view of the above problems, and suppresses charging of a semiconductor device in a workbench for a semiconductor device on which a burn-in board is placed in order to check whether or not the semiconductor device is normally mounted in a socket. The purpose is to do.

In order to solve the above problems, a work table for a semiconductor device according to the present invention includes:
A support structure body having a top plate on which a burn-in board provided with a socket on which a semiconductor device is mounted is placed;
An ionizer that supplies ions for charge removal to the burn-in board placed on the top plate;
It is characterized by providing.

  In this case, a brush for removing static electricity by brushing the burn-in board, further comprising a brush for removing static electricity having a first ground wiring connected to the ground via a first resistor. It may be.

The socket provided on the burn-in board is provided with an opening / closing mechanism that opens and closes when the semiconductor device is attached / detached.
The semiconductor device workbench is further a socket opening / closing jig for opening / closing the socket opening / closing mechanism provided on the burn-in board, and is connected to the ground via a second resistor. You may make it provide the socket opening / closing jig | tool which has wiring.

In this case, the socket is provided with an outer peripheral portion biased upward by a spring mechanism,
The opening / closing mechanism may be opened by pressing the outer peripheral portion downward using the socket opening / closing jig.

  Moreover, you may make it further provide the 3rd grounding wiring which connects the said work table | surface for semiconductor devices to a ground.

BEST MODE FOR CARRYING OUT THE INVENTION

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the embodiments described below do not limit the technical scope of the present invention.

  FIG. 1 is a perspective view illustrating a semiconductor device workbench 10 according to an embodiment of the present invention. The semiconductor device workbench 10 shown in FIG. 1 is used to adjust the connection between a semiconductor device as a device under test and a socket by placing a burn-in board BIB in which contact failure has occurred in a continuity test in the burn-in device. It is a work table.

  Specifically, the work table 10 for a semiconductor device shown in FIG. 1 includes a support structure main body 20 and an ionizer 30 provided on the support structure main body 20. The support structure main body 20 includes a bottom plate 22 provided at the bottom, a top plate 24 provided at the top, and a columnar support portion 26 provided between the bottom plate 22 and the top plate 24 to support the top plate 24. And is configured.

  The four corners on the back side of the bottom plate 22 are respectively provided with sliding wheels 28. By providing the wheels 28, the semiconductor device work table 10 can be easily moved manually. It becomes possible to move. Normally, the wheel 28 is required to be formed of a conductive material such as carbon-containing resin, and the wheel 28 in the present embodiment is also formed of a conductive material.

  Furthermore, since the semiconductor device workbench 10 is generally required to be grounded, in this embodiment, for example, the semiconductor device workbench 10 is grounded by the ground wiring 29 extending from the bottom plate 22. Has been. That is, one end of the ground wiring 29 is connected to the support structure main body 20 and the other end is connected to the ground.

  A burn-in board BIB is placed on the surface side of the top plate 24. In other words, a user performs a task of confirming the connection of the semiconductor device by placing the burn-in board BIB having the semiconductor device in which the contact failure has occurred in the continuity test. That is, the user confirms and adjusts the continuity between the semiconductor device and the socket by inserting and removing the semiconductor device from the socket on the burn-in board BIB and repeatedly opening and closing the opening and closing mechanism of the socket. By such adjustment work, the semiconductor device and the socket are charged.

  That is, a socket formed of a high-insulation material is charged with several kV of static electricity generated by opening and closing operations. In general, the burn-in board BIB and the top plate 24 of the semiconductor device worktable 10 are insulated. Therefore, static electricity generated in the socket and the semiconductor device is accumulated without being discharged.

  If the ground of the semiconductor device comes into contact with the semiconductor device work table 10 or the burn-in board BIB is inserted into the slot of the burn-in device while the semiconductor device or the socket is charged to a high voltage, the accumulated static electricity is generated. It will be discharged in an instant. During this discharge, the semiconductor device as the device under test may be damaged, or the test circuit in the burn-in device may be damaged.

  For this reason, in the semiconductor device worktable 10 according to the present embodiment, the ionizer 30 is provided on the surface side of the top plate 24. The ionizer 40 is an apparatus that generates ions, and generally includes a type that generates both positive ions and negative ions, and a type that generates one of price ions and negative ions. Which type of ionizer is used can be arbitrarily selected based on whether the main static electricity generated is positive or negative. However, since it is generally considered that the type that generates both positive ions and negative ions is more convenient, in this embodiment, the ionizer 30 has both positive ions and negative ions. The type that occurs is used. Ions generated by the ionizer 30 are supplied onto the burn-in board BIB. For this reason, the charged semiconductor device and socket are gradually discharged and neutralized by the ions supplied by the ionizer 30.

  That is, the air containing the ion for static elimination is sent out from the blower opening 32 of the ionizer 30. If necessary, the distance from the blower port 32 to the burn-in board BIB is adjusted by adjusting the amount of air sent from the blower port 32 or changing the installation position of the ionizer 30.

  FIG. 2 shows a state where the burn-in board BIB is mounted on the semiconductor device workbench 10 of FIG. It is a figure which shows the brush.

  The neutralizing brush 100 according to this embodiment shown in FIG. 2 is formed of a conductive material, and the handle portion is connected to the ground. Specifically, the bristle portion 102 that is the brush portion of the static elimination brush 100 is formed of a flexible conductive material. The bristle portion 102 is implanted in the bristle material support portion 104, and a grip 106 is provided on one end side of the bristle material support portion 104.

  A ground wiring 110 extends from the grip 106 and connects the static eliminating brush 100 to the ground. That is, the ground wiring 110 is electrically connected to the bristle portion 102. Although the method of connecting the bristle part 102 to the ground wiring 110 is arbitrary, for example, by forming the bristle support part 104 and the grip 106 with a conductive material, the bristle part support part 104 and the grip 106 are interposed. The bristle portion 102 may be connected to the ground wiring 110. Alternatively, the bristle support portion 104 is formed of a conductive material, and the ground wiring 110 is embedded in the grip 106 so that one end of the ground wiring 110 is connected to the bristle support portion 104. Good.

  The other end of the ground wiring 110 is connected to the ground via a resistor 112. The resistor 112 has a resistance value of a magnitude suitable for discharging static electricity of a charged semiconductor device or socket at a speed that does not damage the semiconductor device. In the present embodiment, the resistance value of the resistor 112 is 1 M ohm, but the size can be arbitrarily selected within a range in which this object can be achieved.

  The other end of the ground wiring 110 may be connected to an arbitrary ground. For example, it can be connected to a ground different from the semiconductor device workbench 10 of FIG. Alternatively, as shown in FIG. 3, the other end of the ground wiring 110 can be connected to the ground by connecting the support structure main body 20 of the semiconductor device worktable 10 of FIG. That is, since the support structure main body 20 of the semiconductor device worktable 10 is grounded as described above, ground connection can be realized by connecting the ground wiring 110 to the support structure main body 20.

  The user brushes the upper surface of the burn-in board BIB placed on the semiconductor device workbench 10 with the static elimination brush 100, so that the static electricity accumulated in the semiconductor device and the socket can be discharged at a speed that does not damage the semiconductor device. Can be discharged. In addition, when it is assumed that static elimination is not sufficient by one brushing, the user can perform necessary static elimination by brushing the upper surface of the burn-in board BIB a plurality of times.

  FIG. 4 is a view showing a socket opening / closing jig 200 for opening / closing a socket opening / closing mechanism of the burn-in board BIB in a state where the burn-in board BIB is placed on the semiconductor device workbench 10 of FIG.

  The socket opening / closing jig 200 shown in FIG. 4 includes a main body 202 having a through hole 210 formed therein. Since the semiconductor device is attached to and detached from the socket 300 through the cavity of the through hole 210, the through hole 2210 needs to be formed in a shape and size that allows the semiconductor device DUT to pass through.

  In the present embodiment, the main body 202 is formed of a conductive material and has a shape suitable for pressing the outer peripheral portion 310 of the socket 300 on the burn-in board BIB. In the present embodiment, since the outer peripheral portion 310 of the socket 300 is formed in a rectangular shape in plan view, the main body portion 202 of the socket opening / closing jig 200 is also formed in a rectangular shape in plan view.

  The socket 300 has a mounting hole 320 in which a semiconductor device DUT, which is a device under test, is attached and detached, and an opening / closing mechanism for ensuring the mounting of the semiconductor device DUT. In the present embodiment, the socket 300 is formed of a resin material. When mounting the semiconductor device DUT in the socket 300, first, the semiconductor device DUT is inserted into the mounting hole 320.

  In a state where the semiconductor device DUT is inserted into the mounting hole 320, the outer peripheral portion 310 is pushed downward using the socket opening / closing jig 200. As a result, the opening / closing mechanism of the socket 300 is opened, and the semiconductor device DUT, which is a device under test, is inserted to a predetermined position of the socket 300. The outer peripheral portion 310 of the socket 300 is biased upward by the spring mechanism 330. When the outer peripheral portion 310 is not pressed by the socket opening / closing jig 200, the outer peripheral portion 310 moves upward, and the opening / closing mechanism of the socket 300 is moved. Is closed, and the semiconductor device DUT is mounted. Thereby, the mounting of the semiconductor device DUT to the socket 300 is completed.

  The semiconductor device DUT, which is a device under test, is picked up using the dropper 400. That is, the semiconductor device DUT is sucked using the dropper 400 and inserted into the mounting hole 320 of the socket 300. The semiconductor device DUT is also removed from the socket 300 by sucking the semiconductor device DUT with the dropper 400.

  For the socket 300 on the burn-in board BIB in which a contact failure has occurred in the continuity test, the user performs an opening / closing operation of the opening / closing mechanism of the socket 300 with the semiconductor device DUT mounted in order to adjust the continuity. That is, after the outer peripheral portion 310 of the socket 300 is pressed using the socket opening / closing jig 200, the operation of returning the state not pressed is repeated a plurality of times, thereby adjusting the conduction between the semiconductor device DUT and the socket 300. Due to the opening / closing operation of the opening / closing mechanism of the socket 300, static electricity is generated in the socket 300 and the semiconductor device DUT and is charged.

  Therefore, in the socket opening / closing jig 200 according to the present embodiment, the main body portion 202 formed of a conductive material is connected to the ground by the ground wiring 220. That is, one end of the ground wiring 220 is connected to the main body 202 and the other end is connected to the ground via the resistor 230. The resistor 230 has a resistance value that is suitable for discharging the static electricity of the charged semiconductor device DUT and the socket 300 at a speed that does not damage the semiconductor device. In the present embodiment, the resistance value of the resistor 320 is 1 M ohm, but the size of the resistor 320 can be arbitrarily selected as long as the object can be achieved.

  The other end of the ground wiring 220 may be connected to an arbitrary ground. For example, it can be connected to a ground different from the semiconductor device workbench 10 of FIG. Alternatively, as shown in FIG. 5, the other end of the ground wiring 220 can be grounded by connecting it to the support structure body 20 of the semiconductor device worktable 10 of FIG. That is, since the support structure main body 20 of the semiconductor device worktable 10 is grounded as described above, ground connection can be realized by connecting the ground wiring 110 to the support structure main body 20.

  By using such a socket opening / closing jig 200, the static electricity generated in the semiconductor device DUT and the socket 300 can be discharged at a speed that does not damage the semiconductor device DUT. That is, static electricity generated by opening and closing the opening / closing mechanism of the socket 300 can be gradually discharged through the main body 202 and the ground wiring 220.

  In addition, this invention is not limited to the said embodiment, A various deformation | transformation is possible. For example, as shown in FIG. 6, the grounding wires 110 and 220 of both the static elimination brush 100 and the socket opening / closing jig 200 may be connected to the support structure main body 20 of the semiconductor device work table 10. Thereby, the ground of both the static elimination brush 100 and the socket opening / closing jig | tool 200 can be obtained from the work table 10 for semiconductor devices. In addition, when working on the semiconductor device worktable 10, the user can easily secure both the static elimination brush 100 and the socket opening / closing jig 200 around the semiconductor device worktable 10.

  In the above-described embodiment, the semiconductor device worktable 10 includes the wheels 28 on the bottom plate 22. However, the wheels 28 are not necessarily required and can be omitted. In this case, the semiconductor device work table 10 is fixedly used at a predetermined position.

It is a figure for demonstrating the structure of the work table | surface for semiconductor devices which concerns on one Embodiment of this invention. It is a figure for demonstrating the structure of the static elimination brush which concerns on one Embodiment of this invention. FIG. 3 is a diagram for explaining a connection relationship when the ground wiring of the static elimination brush of FIG. 2 is connected to the semiconductor device workbench of FIG. 1. It is a figure for demonstrating the structure of the socket opening / closing jig | tool which concerns on one Embodiment of this invention. FIG. 5 is a diagram illustrating a connection relationship when the ground wiring of the socket opening / closing jig of FIG. 4 is connected to the work table for the semiconductor device of FIG. 1. FIG. 5 is a diagram for explaining a connection relationship when the ground wiring of the static elimination brush of FIG. 2 and the ground wiring of the socket opening / closing jig of FIG. 4 are connected to the work table for the semiconductor device of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Work stand for semiconductor devices 20 Support structure main-body part 22 Bottom plate 24 Top plate 26 Columnar support part 28 Wheel 30 Ionizer 100 Static elimination brush 200 Socket opening / closing jig

Claims (3)

A support structure body having a top plate on which a burn-in board provided with a socket on which a semiconductor device is mounted is placed;
An ionizer that supplies ions for charge removal to the burn-in board placed on the top plate;
A static elimination brush for removing static electricity by brushing the burn-in board, the static elimination brush having a first ground wiring connected to the ground via a first resistor;
Provided with a,
The socket provided in the burn-in board is provided with an opening and closing mechanism that opens and closes when the semiconductor device is attached and detached.
The semiconductor device workbench is further a socket opening / closing jig for opening / closing the socket opening / closing mechanism provided on the burn-in board, and is connected to the ground via a second resistor. A workbench for semiconductor devices , comprising a socket opening / closing jig having wiring . The socket is provided with an outer peripheral portion biased upward by a spring mechanism,
Using said socket opening jig, by pressing the outer peripheral portion downward, the opening and closing mechanism becomes the open state, the semiconductor device for workbench according to claim 1, characterized in that. Connecting the platform for the semiconductor device to the ground, the semiconductor device for workbench according to claim 1 or claim 2 of the third ground line, and further comprising.

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