JP4783956B2 - Thermal conductor and manufacturing method thereof - Google Patents
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- 238000004519 manufacturing process Methods 0.000 title claims description 22
- 239000002470 thermal conductor Substances 0.000 title claims description 14
- 108090000623 proteins and genes Proteins 0.000 claims description 48
- 102000004169 proteins and genes Human genes 0.000 claims description 48
- 239000004020 conductor Substances 0.000 claims description 33
- 108010022355 Fibroins Proteins 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000002490 spark plasma sintering Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 14
- 239000000284 extract Substances 0.000 description 10
- 238000001035 drying Methods 0.000 description 8
- 239000000843 powder Substances 0.000 description 7
- 238000000465 moulding Methods 0.000 description 6
- 241000255789 Bombyx mori Species 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000000605 extraction Methods 0.000 description 4
- -1 polyoxymethylene Polymers 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- 239000003125 aqueous solvent Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 229920001903 high density polyethylene Polymers 0.000 description 3
- 239000004700 high-density polyethylene Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 239000012460 protein solution Substances 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 229920003169 water-soluble polymer Polymers 0.000 description 3
- 241000283973 Oryctolagus cuniculus Species 0.000 description 2
- 229930040373 Paraformaldehyde Natural products 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 108010013296 Sericins Proteins 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000002772 conduction electron Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 210000004907 gland Anatomy 0.000 description 2
- 229920001684 low density polyethylene Polymers 0.000 description 2
- 239000004702 low-density polyethylene Substances 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 238000000746 purification Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000012552 review Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 241000255794 Bombyx mandarina Species 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 241000270708 Testudinidae Species 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 238000012993 chemical processing Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000502 dialysis Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 238000010559 graft polymerization reaction Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 230000009261 transgenic effect Effects 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Description
本発明は、例えば、絹タンパク質を用いた熱伝導体の製造方法に関する。 The present invention relates to a method for producing a heat conductor using, for example, silk protein.
熱伝導体とは、一般的に熱を伝え易い物質を意味する。固体に温度勾配が生ずると、高温側では伝導電子、フォノン及びフォトン等の密度が低温側に較べて増加し、これらの量子が高温側から低温側へ向かって流れることにより熱伝導が生じる。高分子やセラミックスでは、伝導電子の密度が非常に低いため、フォノンによる伝導が支配的になる。 A heat conductor generally means a substance that easily conducts heat. When a temperature gradient occurs in a solid, the density of conduction electrons, phonons, photons, and the like increases on the high temperature side as compared to the low temperature side, and heat conduction occurs as these quanta flow from the high temperature side to the low temperature side. In polymers and ceramics, conduction by phonons becomes dominant because the density of conduction electrons is very low.
パソコン、携帯情報端末及び電力用電子デバイス等の小型・高性能化が進み、これに伴い、機器内部で発生した熱を如何にして放散するかという課題が持ち上がる。特に、絶縁を担う基板材料の樹脂部分が熱抵抗の主原因となる問題が発生している。 With the progress of miniaturization and high performance of personal computers, portable information terminals, electric power electronic devices, and the like, the problem of how to dissipate heat generated inside the equipment is raised. In particular, there is a problem that the resin part of the substrate material responsible for insulation is the main cause of thermal resistance.
一方、家電やIT機器の急速な進歩により、それらに関する機器のターンオーバー期間が短縮されている。それに伴い膨大な量のプリント基板や半導体が廃棄物として捨てられることとなる。今後、このような廃棄は、大きな環境問題となり得る可能性が高い。 On the other hand, the rapid progress of home appliances and IT equipment has shortened the turnover period of equipment related to them. Accordingly, a huge amount of printed circuit boards and semiconductors are discarded as waste. In the future, such disposal is likely to be a major environmental problem.
このような背景において、熱伝導性に優れ、且つ生分解性を有する熱伝導体が望まれている。 In such a background, a heat conductor having excellent heat conductivity and biodegradability is desired.
本発明は、上述した実情に鑑み、熱伝導性に優れ、且つ生分解性を有する熱伝導体の製造方法を提供することを目的とする。 An object of this invention is to provide the manufacturing method of the heat conductor which is excellent in heat conductivity and has biodegradability in view of the situation mentioned above.
上記課題を解決するため鋭意研究を行った結果、本発明者らは、絹タンパク質を出発原料として用いることで熱伝導性に優れ、且つ生分解性を有する熱伝導体を製造できることを見出し、本発明を完成するに至った。 As a result of diligent research to solve the above problems, the present inventors have found that by using silk protein as a starting material, it is possible to produce a thermal conductor having excellent thermal conductivity and biodegradability. The invention has been completed.
本発明は、以下を包含する。 The present invention includes the following.
（１）絹タンパク質を成形に供することを特徴とする、熱伝導体の製造方法。
（２）上記絹タンパク質がフィブロインであることを特徴とする、（１）記載の熱伝導体の製造方法。
（３）上記成形が加圧処理工程を含むことを特徴とする、（１）記載の熱伝導体の製造方法。
（４）上記加圧処理工程が300℃以下で行われることを特徴とする、（３）記載の熱伝導体の製造方法。
（５）絹タンパク質を構成成分とすることを特徴とする熱伝導体。
（６）上記絹タンパク質がフィブロインであることを特徴とする、（５）記載の熱伝導体。
（７）熱伝導率が0.3W/(m・K)以上であることを特徴とする、（５）記載の熱伝導体。
(1) A method for producing a heat conductor, wherein silk protein is used for molding.
(2) The method for producing a heat conductor according to (1), wherein the silk protein is fibroin.
(3) The method for producing a heat conductor according to (1), wherein the molding includes a pressure treatment step.
(4) The method for producing a heat conductor according to (3), wherein the pressure treatment step is performed at 300 ° C. or lower.
(5) A heat conductor comprising silk protein as a constituent.
(6) The heat conductor according to (5), wherein the silk protein is fibroin.
(7) The thermal conductor according to (5), wherein the thermal conductivity is 0.3 W / (m · K) or more.
本発明に係る熱伝導体の製造方法によれば、各種分野で有用な熱伝導性に優れた熱伝導体を効率よく生産することができる。また、本発明に係る熱伝導体は、絹タンパク質から製造されるので生分解性を有する。 According to the manufacturing method of the heat conductor which concerns on this invention, the heat conductor excellent in heat conductivity useful in various fields can be produced efficiently. Moreover, since the heat conductor which concerns on this invention is manufactured from silk protein, it has biodegradability.
さらに、本発明に係る熱伝導体は、誘電特性に優れた誘電体でもあり(国際出願PCT/JP2006/306063号(日本国特許出願2005-088222号を優先権の基礎とする)参照)、優れた熱伝導性と誘電特性とを兼ね備えた材料として各種分野で有用である。 Furthermore, the thermal conductor according to the present invention is also a dielectric having excellent dielectric properties (see International Application PCT / JP2006 / 306063 (Japanese Patent Application 2005-088222 is the basis of priority)), which is excellent. It is useful in various fields as a material having both thermal conductivity and dielectric properties.
以下、本発明を詳細に説明する。
本発明に係る熱伝導体の製造方法により、絹タンパク質から熱伝導性に優れた熱伝導体を製造することができる。ここで、熱伝導体とは、熱を伝え易い物質を意味する。
Hereinafter, the present invention will be described in detail.
By the method for producing a heat conductor according to the present invention, a heat conductor having excellent heat conductivity can be produced from silk protein. Here, the heat conductor means a substance that easily transfers heat.
本発明に係る熱伝導体の製造方法において使用する絹タンパク質としては、例えば家蚕、野蚕、天蚕等の蚕が生産するいずれの絹タンパク質であってもよい。絹は、2種の絹タンパク質(フィブロイン及びセリシン)から構成されている。フィブロインは繊維を形成しているタンパク質である。一方、セリシンは、絹糸を構成しているタンパク質であって、絹においてフィブロインが形成する繊維の外側を層状に覆っているゼラチン様の物性を有するタンパク質である。本発明においては、生産性の点から、フィブロインを絹タンパク質として使用することが好ましい。 The silk protein used in the method for producing a heat conductor according to the present invention may be any silk protein produced by silkworms such as rabbits, wild silkworms, and tengu. Silk is composed of two types of silk proteins (fibroin and sericin). Fibroin is a protein that forms fibers. On the other hand, sericin is a protein constituting a silk thread and has a gelatin-like physical property covering the outside of fibers formed by fibroin in silk. In the present invention, it is preferable to use fibroin as silk protein from the viewpoint of productivity.
絹タンパク質は、蚕が生産する繭からの抽出や精製によって調製することができる。また、蚕の絹糸腺から絹タンパク質を抽出することができる。特に、製造工程の簡便性から家蚕の繭から絹タンパク質を調製することが好ましい。例えば、繭や絹糸腺から抽出溶媒を用いた溶媒抽出を行うことで、絹タンパク質抽出物を抽出することができる。また、上述した絹タンパク質抽出物を、濃縮処理することもできる。さらに、絹タンパク質抽出物を、ろ過、遠心分離、透析又は精製処理等に供することで、当該抽出物から不溶物及び抽出溶媒等を除去したものを用いることができる。なお、本発明において、絹タンパク質抽出物とは、上記抽出方法で得られた絹タンパク質水溶液等の各種溶媒抽出液、その希釈液又はその濃縮液等を意味する。 Silk protein can be prepared by extraction or purification from cocoons produced by cocoons. In addition, silk protein can be extracted from silkworm glands of silkworms. In particular, it is preferable to prepare silk protein from rabbit cocoons because of the simplicity of the manufacturing process. For example, a silk protein extract can be extracted by performing solvent extraction from a cocoon or silk gland using an extraction solvent. Moreover, the silk protein extract mentioned above can also be concentrated. Furthermore, what removed the insoluble matter, the extraction solvent, etc. from the said extract can be used by using a silk protein extract for filtration, centrifugation, dialysis, or a refinement | purification process. In the present invention, the silk protein extract means various solvent extracts such as silk protein aqueous solution obtained by the above extraction method, diluted solutions thereof, concentrated solutions thereof, and the like.
本発明に係る熱伝導体の製造方法においては、絹タンパク質として、上述した絹タンパク質抽出物に加えて、例えば、既知の種々の方法を用いて調製した絹タンパク質を含む繊維、粉末、フィルム、スポンジ、ゲル、溶液等の形態のものを使用することができる。例えば、市販されている絹粉末のシルクパウダーIM(カネボウシルク技術開発センター製)を絹タンパク質として用いることができる。 In the method for producing a heat conductor according to the present invention, as silk protein, in addition to the silk protein extract described above, for example, fibers, powders, films, sponges containing silk protein prepared by using various known methods , Gels, solutions and the like can be used. For example, a commercially available silk powder IM (Kanebo Silk Technology Development Center) can be used as the silk protein.
また、本発明においては、絹タンパク質を化学加工やグラフト重合により化学的に修飾した絹タンパク質を使用することもできる。さらに、トランスジェニック・カイコ等が生産する改変された絹タンパク質を用いることもできる。加えて、化学的、あるいは酵素的に分解した絹タンパク質を用いることもできる。また、これらの改変された絹タンパク質の混合物や各種蚕が生産する絹タンパク質の混合物を使用してもよい。 In the present invention, silk protein obtained by chemically modifying silk protein by chemical processing or graft polymerization can also be used. Furthermore, a modified silk protein produced by a transgenic silkworm or the like can also be used. In addition, chemically or enzymatically degraded silk protein can be used. Moreover, you may use the mixture of these modified silk proteins, and the silk protein which various silkworms produce.
本発明に係る熱伝導体の製造方法では、また、絹タンパク質に各種水性溶媒又は水溶性高分子を添加したものを使用することができる。絹タンパク質に添加することができる水性溶媒としては、例えば、水、グリセロールなどが挙げられる。また、水溶性高分子としては、例えば、ポリビニルピロリドン、ポリビニルアルコール、ポリヒドロキシメタクリレートなどが挙げられる。絹タンパク質に添加する水性溶媒又は水溶性高分子の添加量は、絹タンパク質に対する重量％で、0〜50％、特に0〜40％が好ましい。添加量が50％を超えると、製造した熱伝導体本来の熱伝導率が発現しなくなる可能性がある。 In the manufacturing method of the heat conductor which concerns on this invention, what added various aqueous solvents or water-soluble polymer to silk protein can be used. Examples of the aqueous solvent that can be added to the silk protein include water and glycerol. Examples of the water-soluble polymer include polyvinyl pyrrolidone, polyvinyl alcohol, and polyhydroxy methacrylate. The addition amount of the aqueous solvent or the water-soluble polymer added to the silk protein is 0 to 50%, particularly preferably 0 to 40%, by weight% with respect to the silk protein. If the amount added exceeds 50%, the heat conductivity inherent to the manufactured heat conductor may not be exhibited.
本発明に係る熱伝導体の製造方法では、絹タンパク質を成形に供することで、成形体を製造する。本発明においては、当該成形体が熱伝導体となる。成形方法としては、例えば、絹タンパク質(絹タンパク質抽出物や絹タンパク質溶液等)のキャスト・乾燥処理による製膜化、基板上へのコーティング処理によるフィルム化、あるいは加圧処理による成形加工手法等が挙げられる。加圧処理方法としては、例えばパルス通電焼結法やホットプレス法を用いることができる。また、成形体の形状としては、特に限定されないが、例えば、フィルム、平板、丸棒、円板、角棒、ロッド等が挙げられる。 In the manufacturing method of the heat conductor according to the present invention, a molded body is manufactured by using silk protein for molding. In the present invention, the molded body is a heat conductor. Examples of the molding method include forming a film by casting / drying a silk protein (silk protein extract, silk protein solution, etc.), forming a film by coating on a substrate, or forming by a pressure process. Can be mentioned. As the pressure treatment method, for example, a pulse current sintering method or a hot press method can be used. The shape of the molded body is not particularly limited, and examples thereof include a film, a flat plate, a round bar, a disc, a square bar, and a rod.
キャスト・乾燥処理による製膜化では、特に濃度は限定されないが、例えば、0.05％〜20％程度の絹タンパク質抽出物又は絹タンパク質溶液をプラスチックシャーレ等の表面にキャストし、乾燥処理することで成形体を成形できる。乾燥温度は、特に限定されないが、例えば4℃〜300℃の範囲内が好ましい。また、製膜後に加圧処理や有機溶媒処理等の後処理を加えてもよい。加圧処理の圧力は、特に限定されないが、例えば、0.1〜100MPaが好ましい。 In film formation by casting / drying treatment, the concentration is not particularly limited. For example, it is formed by casting a silk protein extract or silk protein solution of about 0.05% to 20% on the surface of a plastic petri dish, and drying. The body can be shaped. Although drying temperature is not specifically limited, For example, the inside of the range of 4 to 300 degreeC is preferable. Further, post-treatment such as pressure treatment or organic solvent treatment may be added after film formation. Although the pressure of a pressurization process is not specifically limited, For example, 0.1-100 MPa is preferable.
一方、基板上へのコーティング処理によるフィルム化では、特に濃度は限定されないが、例えば、0.05％〜20％程度の絹タンパク質抽出物又は絹タンパク質溶液をプラスチックや金属、あるいはセラミックス基板上へコーティングすることで成形体を成形できる。コーティング後に、乾燥や加圧処理を加えてもよい。乾燥処理の温度や加圧処理の圧力は特に限定されないが、乾燥処理の温度は4〜300℃、加圧処理の圧力は0.1〜100MPaが好ましい。 On the other hand, in the case of film formation by coating on a substrate, the concentration is not particularly limited. For example, a silk protein extract or silk protein solution of about 0.05% to 20% is coated on a plastic, metal, or ceramic substrate. The molded body can be molded with. After coating, drying or pressure treatment may be added. The temperature of the drying treatment and the pressure of the pressure treatment are not particularly limited, but the temperature of the drying treatment is preferably 4 to 300 ° C., and the pressure of the pressure treatment is preferably 0.1 to 100 MPa.
また、加圧処理による成形加工手法では、例えば、絹タンパク質を所望の形状のセル中に入れ、所定時間、加圧処理を行う。加圧処理は、300℃を超えると、成形体の炭化が進む可能性があるため、300℃以下、好ましくは250℃以下、特に好ましくは200℃以下で行われる。一方、加圧処理が室温(例えば23℃)未満で行われると、均一な成形体が成形されない可能性がある。そこで、加圧処理は、例えば室温以上、好ましくは60℃以上、特に好ましくは80℃以上の温度で効率よく行うことができる。さらに、加圧処理は、圧力5MPa以上で行われる。圧力5MPa未満では、均一な成形体が成形されない可能性がある。また、圧力が100MPaを超えると、成形体が脆くなる可能性がある。そこで、加圧処理は、例えば5MPa〜100MPa、好ましくは10MPa〜50MPaで効率よく行うことができる。なお、加圧処理に加えて加熱処理を行う場合には、同時に、又は別個に順次行うことができる。加圧処理時間は、成形体の成形可能な時間に応じて適宜選択することができるが、10〜120分間とすることが好ましい。加圧処理時間が10分未満であると均一な成形体が成形できない可能性がある。また120分間を超えると、成形体が脆くなる可能性がある。次いで、加圧処理によって得られた成形体をセルから取り出し、冷却することによって、所定の形状を有する成形体(すなわち、熱伝導体)を得ることができる。 Moreover, in the shaping | molding processing method by a pressurization process, for example, silk protein is put into the cell of a desired shape, and a pressurization process is performed for a predetermined time. When the pressure treatment exceeds 300 ° C., carbonization of the molded body may proceed. Therefore, the pressure treatment is performed at 300 ° C. or less, preferably 250 ° C. or less, particularly preferably 200 ° C. or less. On the other hand, when the pressure treatment is performed at a temperature lower than room temperature (for example, 23 ° C.), a uniform molded body may not be molded. Therefore, the pressure treatment can be efficiently performed at a temperature of, for example, room temperature or higher, preferably 60 ° C. or higher, particularly preferably 80 ° C. or higher. Further, the pressurizing process is performed at a pressure of 5 MPa or more. If the pressure is less than 5 MPa, a uniform molded body may not be molded. Further, when the pressure exceeds 100 MPa, the molded body may become brittle. Therefore, the pressure treatment can be efficiently performed at, for example, 5 MPa to 100 MPa, preferably 10 MPa to 50 MPa. Note that when heat treatment is performed in addition to the pressure treatment, the heat treatment can be performed simultaneously or separately. The pressure treatment time can be appropriately selected according to the time during which the molded body can be molded, but is preferably 10 to 120 minutes. If the pressure treatment time is less than 10 minutes, a uniform molded product may not be molded. Moreover, when it exceeds 120 minutes, a molded object may become weak. Next, the molded body obtained by the pressure treatment is taken out from the cell and cooled to obtain a molded body having a predetermined shape (that is, a heat conductor).
このように得られた成形体は、そのまま使用することも、あるいは機械的加工によって更に所望の形状とした後に使用することができる。 The molded body thus obtained can be used as it is, or can be used after further forming a desired shape by mechanical processing.
以上に説明した本発明に係る製造方法によれば、熱伝導性に優れた熱伝導体を得ることができる。ここで、熱伝導性としては、例えば、熱伝導率が挙げられる。 According to the manufacturing method according to the present invention described above, a thermal conductor having excellent thermal conductivity can be obtained. Here, as thermal conductivity, thermal conductivity is mentioned, for example.
熱伝導率とは、熱流束密度（x方向に単位時間に単位面積を通過する）と、この方向における温度勾配との比をいう。熱流束密度をJ、温度をT、温度勾配をｄT/dxとすると、熱伝導率κとの関係は次のように表される。 Thermal conductivity refers to the ratio of the heat flux density (passing a unit area per unit time in the x direction) to the temperature gradient in this direction. When the heat flux density is J, the temperature is T, and the temperature gradient is dT / dx, the relationship with the thermal conductivity κ is expressed as follows.
本発明に係る熱伝導体の熱伝導率は、一般的な定常法の他、レーザーフラッシュ法により求めた熱拡散率(cm2/s)、熱容量(J/(g・K))及び密度(g/cm3)の積により計算することができる。定常法や上記方法により測定された熱拡散率、熱容量及び密度に基づく熱伝導率が、0.3W/(m・K)以上、好ましくは0.35W/(m・K)以上、より好ましくは0.45W/(m・K)以上、特に好ましくは0.55W/(m・K)以上である場合に、本発明に係る熱伝導体の熱伝導率が良好であると判断することができる。 The thermal conductivity of the thermal conductor according to the present invention is determined by the thermal diffusivity (cm 2 / s), heat capacity (J / (g g / cm 3 ). Thermal conductivity based on thermal diffusivity, heat capacity and density measured by the steady method or the above method is 0.3 W / (mK) or more, preferably 0.35 W / (mK) or more, more preferably 0.45 W It can be determined that the thermal conductivity of the thermal conductor according to the present invention is good when it is / (m · K) or more, particularly preferably 0.55 W / (m · K) or more.
本発明に係る熱伝導体の製造方法によれば、絹タンパク質を構成成分とする熱伝導性に優れた熱伝導体を得ることができる。また、得られる熱伝導体は、絹タンパク質を構成成分とし、生分解性を有することから、当該熱伝導体の製造及び廃棄において環境に対する負荷が低減されている。 According to the manufacturing method of the heat conductor which concerns on this invention, the heat conductor excellent in the heat conductivity which uses silk protein as a structural component can be obtained. Moreover, since the obtained heat conductor has a silk protein as a constituent component and has biodegradability, the burden on the environment is reduced in the production and disposal of the heat conductor.
また、本発明に係る熱伝導体は、高周波数領域において比誘電率が低く、且つ誘電正接が低いという誘電特性に優れた誘電体としても使用できる(国際出願PCT/JP2006/306063号(日本国特許出願2005-088222号を優先権の基礎とする)参照)。従って、本発明に係る熱伝導体(成形体)は、高周波数領域における低い比誘電率及び低い誘電正接並びに高い熱伝導性及び生分解性を兼ね備えていることから、環境調和型の高熱伝導プリント基板材料、半導体、ICカード及びICタグ用パッケージ材料などに幅広く適用できる。 The thermal conductor according to the present invention can also be used as a dielectric having excellent dielectric properties such as a low relative dielectric constant and a low dielectric loss tangent in a high frequency region (International Application PCT / JP2006 / 306063 (Japan). (See Patent Application 2005-088222 as the basis of priority). Therefore, the thermal conductor (molded body) according to the present invention has a low relative dielectric constant and a low dielectric loss tangent in a high frequency region, and high thermal conductivity and biodegradability. It can be widely applied to substrate materials, semiconductors, IC cards and IC tag packaging materials.
さらに、近年、分子内で秩序性高く自己配列させた構造を有する液晶エポキシ樹脂が高い熱伝導性を有することが報告されている(竹澤 由高、永井 晃及び山田 真治、日立評論、2004年、86[7]、p.521)。従って、本発明に係る熱伝導体においても結晶の配向によっては、さらに高い熱伝導性が期待される。 Furthermore, in recent years, it has been reported that liquid crystal epoxy resins having a highly ordered and self-aligned structure in the molecule have high thermal conductivity (Yoshitaka Takezawa, Satoshi Nagai and Shinji Yamada, Hitachi review, 2004, 86 [7], p.521). Therefore, even in the heat conductor according to the present invention, higher heat conductivity is expected depending on the crystal orientation.
以下、実施例を用いて本発明をより詳細に説明するが、本発明の技術的範囲はこれら実施例に限定されるものではない。 EXAMPLES Hereinafter, although this invention is demonstrated in detail using an Example, the technical scope of this invention is not limited to these Examples.
本発明に係る熱伝導体の製造及びその熱伝導体の熱伝導性
絹微粉末をパルス通電焼結装置を用いて加熱・加圧処理し、「べっ甲」に近い色彩を有する成形体(本発明に係る熱伝導体)を生成した。なお、絹粉末はシルクパウダーIM(カネボウシルク技術開発センター製)を用いた。
Production of thermal conductor according to the present invention and thermal conductivity of the thermal conductor A silk fine powder is heated and pressurized using a pulse current sintering apparatus, and a molded body having a color close to `` tortoise '' (the present invention A heat conductor). Silk powder IM (manufactured by Kanebo Silk Technology Development Center) was used as the silk powder.
先ず、この絹粉末(シルクパウダーIM)に、重量比で20％の蒸留水を添加したものを、内径10mmの黒鉛製ジグに充填し、4.0Pa以下の真空中でパルス通電焼結装置を用いて、加熱・加圧処理することで、成形体(熱伝導体)を成形した。 First, this silk powder (silk powder IM) with 20% by weight distilled water added is filled into a graphite jig with an inner diameter of 10 mm, and a pulse current sintering apparatus is used in a vacuum of 4.0 Pa or less. Thus, a molded body (thermal conductor) was molded by heat and pressure treatment.
成形では、圧力50MPaを加えながら、20K/分の昇温速度で200℃まで昇温した後、直ちに30K/分の冷却速度で冷却した。続いて、100℃の大気雰囲気中で3日間乾燥したものを、次の熱伝導率測定用試料として用いた。乾燥後に得られた成形体の写真を図１に示す。 In molding, the temperature was raised to 200 ° C. at a rate of 20 K / min while applying a pressure of 50 MPa, and then immediately cooled at a rate of 30 K / min. Subsequently, what was dried in an air atmosphere at 100 ° C. for 3 days was used as the next sample for measuring thermal conductivity. A photograph of the molded product obtained after drying is shown in FIG.
得られた成形体試料を用いて、レーザーフラッシュ法により熱拡散率を測定した。また、この成形体試料を用いて、DSCにより熱容量と密度を測定した。 Using the obtained molded product sample, the thermal diffusivity was measured by a laser flash method. In addition, the heat capacity and density were measured by DSC using this compact sample.
上記測定の結果、成形体試料の熱拡散率は0.0018cm2/sであり、熱容量が2.020J/(g・K)、密度が1.19g/cm3であった。従って、得られた成形体の熱伝導率は、0.44W/(m・K)であった。この熱伝導率の値は、φ50mmの試料を用い、試料に一定のジュール熱を与え、その時の熱流量と温度勾配とから直接に熱伝導率を求める定常法で測定した値と同じであった。 As a result of the above measurement, the molded product sample had a thermal diffusivity of 0.0018 cm 2 / s, a heat capacity of 2.020 J / (g · K), and a density of 1.19 g / cm 3 . Therefore, the thermal conductivity of the obtained molded body was 0.44 W / (m · K). The value of this thermal conductivity was the same as the value measured by a steady method using a φ50 mm sample, giving a constant Joule heat to the sample, and directly obtaining the thermal conductivity from the heat flow rate and temperature gradient at that time. .
日立評論, 2004年, 86[7](竹澤 由高、永井 晃及び山田 真治)の第521頁には、HDPE(高密度ポリエチレン)、LDPE(低密度ポリエチレン)、POM(ポリオキシメチレン)、PA(ポリアミド)、PET(ポリエチレンテレフタレート)、PTFE(ポリテトラフルオロエチレン)、PP(ポリプロピレン)、PS(ポリスチレン)及びPVC(ポリ塩化ビニル)等の熱可塑性樹脂の熱伝導率についてのグラフが開示されている。 Hitachi Review, 2004, 86 [7] (Yoshitaka Takezawa, Satoshi Nagai and Shinji Yamada), page 521 contains HDPE (high density polyethylene), LDPE (low density polyethylene), POM (polyoxymethylene), PA (Polyamide), PET (polyethylene terephthalate), PTFE (polytetrafluoroethylene), PP (polypropylene), PS (polystyrene) and PVC (polyvinyl chloride), etc. Yes.
当該グラフを参照すれば、本実施例で得られた成形体は、一般的なプラスチックの中で最高レベルの熱伝導率(0.38W/(m・K)〜0.60W/(m・K))を有する高密度ポリエチレン樹脂に匹敵する高い熱伝導率を有することが判った。 Referring to the graph, the molded body obtained in this example has the highest level of thermal conductivity (0.38 W / (mK) to 0.60 W / (mK)) among general plastics. It was found to have a high thermal conductivity comparable to a high density polyethylene resin having
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