JP4785688B2 - Electrical connection member - Google Patents

Description

The present invention relates to an electrical connection member connected to a connection object, and in particular, the electrical connection member connected to the connection object is adhered by an adhesive layer, and the low melting metal layer is melted by heating the low melting metal layer. It relates to an electrical connecting member for connecting the connection object.

  As prior art 1, there is an electrode connection method for a liquid crystal display device in which a lead electrode terminal of a transparent electrode formed on a liquid crystal panel substrate and an electrode terminal of a drive circuit substrate are connected by an insulating adhesive layer in which conductive particles are dispersed. It is known (see, for example, Patent Document 1).

  In this method of connecting electrodes of a liquid crystal display device, an insulating adhesive in which conductive particles arranged between the lead electrode terminal of the liquid crystal panel substrate and the electrode terminal of the external drive circuit are dispersed is arranged in an insulating portion between the electrode terminals. A pressure head that pressurizes the insulating adhesive, and the insulating adhesive disposed in the insulating portion between the electrode terminals is cured or semi-cured to temporarily connect the liquid crystal panel substrate and the drive circuit substrate; After the conductivity test, all the insulating adhesives are cured to perform the main connection.

  The pressure head has an uneven head tip, and the convex portion has the same pitch as the electrode terminal pitch of the drive circuit board, and has a width narrower than the electrode terminal width and a height longer than the electrode terminal thickness. And the convex part at the tip of the head pressurizes the part other than the electrode terminal.

  Further, the pressure head has a head tip portion that is uneven, the end of the convex portion is rounded, and the portion other than the electrode terminal is pressurized by the rounded convex portion of the head tip.

As the prior art 2, in soldering joining between the connection terminal portions of the flexible wiring board and the insulating solid substrate, a heat-resistant transparent flexible material is sandwiched between transparent press glass plates , and the soldering portion is pressure-fixed. There is known a light beam soldering method in which a soldering portion is irradiated with a light beam to reflow soldering.

  As Prior Art 3, a laser soldering method of a flexible circuit board having a connection terminal and a ceramic circuit board is known (see, for example, Patent Document 3).

  In this laser soldering method, the connection terminal portion of the flexible circuit board with the exposed portion of the connection terminal portion widened is superimposed on the connection terminal portion of the ceramic circuit board on the jig, and the connection terminal portion is directly added thereon. Put a presser glass to fix the pressure.

Next, the presser glass plate is fastened by the glass presser of the jig, and the connection terminal portion is pressure-fixed. In such a set state, a laser beam is irradiated from end to end of the terminal row. At this time, the solder plated in advance on the connection end of the flexible circuit board is melted by heating by laser beam irradiation. At the same time, the molten solder wets the connection terminals of the ceramic circuit board by pressurizing the holding glass plate to form an intermetallic compound.

JP 05-210107 A Japanese Patent Laid-Open No. 08-148256 JP-A-62-111886

  In the electrode connection method of the liquid crystal display device of Patent Document 1, when electrical insulation is cured and all the insulating adhesives are cured and repairs are performed after the main connection is performed, removal and attachment are performed repeatedly. There is a problem that connection cannot be made.

  In addition, since the pressure head cures or semi-cures the insulating adhesive (thermosetting adhesive) disposed in the insulating portion between the electrode terminals, the liquid crystal panel substrate and the drive circuit substrate are temporarily connected. However, there is a problem that it is necessary to provide a work for providing irregularities on the head for selectively temporarily fixing.

  In Patent Documents 2 and 3, solder that has been plated on the connection terminal portion of the flexible circuit board is melted by heating when irradiated with a laser beam. There is a problem that mismatch of characteristic impedance and occurrence of crosstalk occur.

  Therefore, an object of the present invention is to provide an electrical connection member that can prevent the occurrence of a bridge, the mismatch of transmission characteristic impedance, and the occurrence of crosstalk.

  Moreover, the subject of this invention is providing the electrical connection member which the repair efficiency of the inferior goods by an electrical test | inspection improves.

  Further, the problem of the present invention is to prevent occurrence of short circuit, variation in low melting point metal layer, variation in bonding strength of low melting point metal layer, etc., uniform bonding can be performed, and transmission characteristics can be improved. It is to provide an electrical connection member.

According to one aspect of the present invention, in the electrical connection member that is connected to the connection object, the base material, the pressure-sensitive adhesive layer disposed on one surface of the base material, and a part thereof enter the inside of the pressure-sensitive adhesive layer. A plurality of conductors disposed on the pressure-sensitive adhesive layer so that other parts are exposed to the outside of the pressure-sensitive adhesive layer, and a plurality of conductors having the same interval as the intervals of the plurality of conductors on one surface of the counterpart substrate By applying an overlapping load on the connection object formed by arranging at least a counterpart conductor so that the conductor and the counterpart conductor face each other, the conductor and the counterpart conductor are bonded to each other. In a state of being embedded in the adhesive layer, one surface of the counterpart base material is adhered by the adhesive layer to be temporarily fixed, and the conductor is configured to connect the connection object to the adhesive layer. After the temporary fixing, at least contact with the counterpart conductor of the connection object. A low melting point metal layer for connecting the counterpart conductor and the conductor by melting on the connecting side, and a reinforcing film is disposed between the adhesive layer and the conductor. Thus, an electrical connection member is obtained.

Since the electrical connection member of the present invention can temporarily fix the electrical connection member and the connection object by the adhesive force with the base material by the adhesive layer, the clearance between the electrical connection member and the connection object is brought to zero as much as possible. Te can be temporarily fixed, it is possible to minimum an amount of low melting point metal layers. Thereby, it becomes difficult to generate | occur | produce the short circuit between conductors.

  In addition, since the adhesive layer is mechanically connected to the connection object by adhesion to the conductor, it is difficult for the conductor to be short-circuited. Therefore, the occurrence of bridging, mismatch of transmission characteristic impedance, and crosstalk Occurrence can also be prevented.

The connection method of the electrical connection member and the object to be connected can be temporarily fixed by an adhesive layer rather than by adhesion, and furthermore, since there is no member such as conductive particles in the conductor, there is no problem by electrical inspection after temporary fixation. The repair efficiency of non-defective products is improved.

  Moreover, in the electrical connection test | inspection of a connection target object, a low melting metal layer can be fuse | melted and a metal bond can be performed by heating only the conductor of an electrical connection member. At this time, the laser beam is generally transmitted through the other members and is not directly heated, and the low melting point metal layer can be melt-connected even if the low melting point metal layer is thin because the low melting point metal layer is zero clearance.

  Also, when welding the conductor and terminal with a laser beam with a low melting point metal layer, the low melting point metal layer has a low melting point, or other materials are made difficult to absorb the laser beam. There is an advantage that only the conductor can be selectively connected without partial laser light irradiation.

  Furthermore, in the electrical connection member, when the electric cable is connected to the connection object, the occurrence of a short circuit, the variation in the position of the electric cable, the variation in the low melting point metal layer, the variation in the bonding strength of the low melting point metal layer, etc. are reduced. And uniform bonding is possible. In addition, the low melting point metal layer is less likely to have a three-dimensional welded shape at the joint, improving transmission characteristics and preventing short circuits.

The electrical connection member of the present invention is an electrical connection member connected to an object to be connected. A base material, a pressure-sensitive adhesive layer disposed on one surface of the base material, a part of which enters the pressure-sensitive adhesive layer, and the like portions and a plurality of conductors disposed on the pressure-sensitive adhesive layer to be exposed to the outside of the adhesive layer, a plurality of mating with the same spacing as the spacing of the plurality of conductors on one surface of the mating substrate The connection object formed with at least a conductor is applied to the conductor and the counterpart conductor so that the conductor and the counterpart conductor are opposed to each other, thereby applying the load to the conductor and the counterpart conductor. in a state of being embedded in the layer, the one surface of the mating substrate is configured such that the temporary fixation is adhesive by the pressure-sensitive adhesive layer, the conductor, the said connection object to the pressure-sensitive adhesive layer tentative after fixation, and the mating conductor of at least the connection object contact The connection side of, and achieved by having a low melting point metal layer for connecting the conductor and the mating conductor by melting.

  1 to 4 show a first embodiment of the electrical connecting member of the present invention. With reference to FIGS. 1 to 4, the electrical connection member 10 includes a base material 11, an adhesive layer 13 disposed on one surface 11 a of the base material 11, and a plurality of adhesive layers 13 disposed on the adhesive layer 13. The reinforcing film 15, the plurality of conductors 17 disposed on one surface 15 a of the reinforcing film 15, and the low melting point metal layer 19 disposed on the conductor 17.

  The base material 11 is a rectangular polyimide resin film, and the pressure-sensitive adhesive layer 13 is a silicone-based pressure-sensitive adhesive. The base material 11 is integrated with the base material 11 by being adhered to the entire surface 11 a of the base material 11. . In addition, although the thickness dimension of the layer of the adhesive layer 13 may be substantially the same as the thickness dimension of the base material 11, it may be a thickness sufficient to fill the conductor.

  In the adhesive layer 13, a plurality of reinforcing films 15 are arranged at intervals in a first direction A (arrow A shown in FIG. 2) that is parallel to the longitudinal direction of the base material 11 and the adhesive layer 13. Has been. The reinforcing film 15 is a strip-shaped polyimide resin film having an insulating property, and has a long dimension in a second direction B (arrow B shown in FIG. 2) perpendicular to the first direction A including the one surface 13a of the pressure-sensitive adhesive layer 13. It is arranged by. The dimension of the reinforcing film 15 in the second direction B is substantially the same as the dimension between two sides of the base material 11 and the pressure-sensitive adhesive layer 13 parallel to the first direction A.

  The reinforcing film 15 is positioned so as to be embedded in the pressure-sensitive adhesive layer 13. The thickness dimension of the reinforcing film 15 is thinner than the thickness dimension of the pressure-sensitive adhesive layer 13. The facing surface opposite to the one surface 15 a of the reinforcing film 15 is opposed substantially parallel to the one surface 11 a of the base material 11 through the adhesive layer 13. Further, the reinforcing film 15 is provided with a conductor 17 on a surface 15a that is opposite to the facing surface that is disposed to face the one surface 11a of the substrate 11.

  The conductor 17 is copper (Cu), and almost half of the thickness direction enters the pressure-sensitive adhesive layer 13. That is, the other half of the conductor 17 in the thickness direction and the one surface 17 a opposite to the one surface 15 a of the reinforcing film 15 are exposed to the outside of the adhesive layer 13. A low melting point metal layer 19 is disposed on the entire exposed surface of the conductor 17.

  The low melting point metal layer 19 employs tin (Sn). Specifically, the low melting point metal layer 19 is disposed on the conductor 17 as an Sn plating layer by a plating process having a melting point of 250 ° C. or less on the exposed portion of the conductor 17. The low melting point metal layer 19 has a thickness dimension that is thinner than the thickness dimension of the conductor 17.

  The base material 11 and the reinforcing film 15 may be a polyimide resin sheet, an aramid resin film, or the like. The pressure-sensitive adhesive layer 13 may be an acrylic pressure-sensitive adhesive. The conductor 17 may be a copper alloy, nickel (Ni), or nickel (Ni) alloy. The reinforcing film 15 and the conductor 17 are attached by sputtering, vapor deposition, plating, printing, adhesion, or the like. The low melting point metal layer 19 may be an Sn alloy. Thus, if the low melting point metal layer 19 is a metal having a lower melting point than the conductor 17, the metal type of the conductor 17 and the low melting point metal layer 19 may be determined by the design configuration.

  FIG. 5 shows the electrical connection member 10 shown in FIGS. 1 to 4 and the connection object 40 connected to the electrical connection member 10.

  Referring to FIG. 5, a connection object 40 includes an insulating counterpart base 41 having substantially the same shape as the base 11, and a plurality of counterpart conductors (on the one surface 41 a of the counterpart base 41 ( Terminal portion) 47 and a counterpart low melting point metal layer 49 disposed on the counterpart conductor 17.

  A mating conductor 47 is disposed on one surface 41 a of the mating base material 41 with an interval in the first direction A (the same direction as the arrow A shown in FIG. 2) of the mating base material 41. The mating conductor 47 is arranged in a long dimension in a second direction B (the same direction as the arrow B shown in FIG. 2) orthogonal to the first direction A. A plurality of mating conductors 47 are arranged on the one surface 41 a of the mating base material 41 at the same interval as the intervals of the plurality of conductors 17.

  The counterpart conductor 47 has substantially the same shape as the conductor 17, and employs copper (Cu). The mating conductor 47 may be a copper alloy, nickel (Ni), or nickel (Ni) alloy. A counterpart low melting point metal layer 49 is disposed on the counterpart conductor 47. The counterpart low melting point metal layer 49 has the same shape and the same metal or alloy as the low melting point metal layer 19.

  Below, the method to connect the electrical connection member 10 and the connection target object 40 is demonstrated. The connection object 40 has a surface opposite to the one surface 41a of the counterpart base material 41 installed on an installation table (not shown). As shown in FIG. 5, the electrical connection member 10 and the connection object 40 include the conductor 17 in which the low melting point metal layer 19 is disposed and the counterpart conductor in which the partner low melting point metal layer 49 is disposed. 47 is made to oppose, Then, as shown in FIG.

  When a load is applied to the connection target object 40 toward the connection target object 40, the conductor 17 on which the low melting point metal layer 19 is disposed and the counterpart low melting point metal layer 49 are disposed. The mating conductor 47 is embedded in the pressure-sensitive adhesive layer 13, and as shown in FIG. 6, the one surface 41 a of the counter substrate 41 is adhered to the pressure-sensitive adhesive layer 13.

At this time, the pressure-sensitive adhesive layer 13 is interposed between the reinforcing film 15 and the base material 11. When the mating substrate 41 and the pressure-sensitive adhesive layer 13 are adhered , they are temporarily fixed . At this time, in a state where the electrical connection member 10 and the connection object 40 are temporarily fixed , the one surface 19a of the low melting point metal layer 19 and the one surface 49a of the counterpart low melting point metal layer 49 are pressed by applying a load. Abut each other.

That is, the electrical connection member 10 and the connection object 40 are electrically connected by the elastic force and the adhesive force (attractive force) that the adhesive layer 13 disposed on the electrical connection member 10 has. At this time, the pressure-sensitive adhesive layer 10 comes into contact with the one surface 41a of the connection object 40, and the electrical connection member 10 and the counterpart base material 40 are mechanically connected to be held and temporarily fixed . In the temporarily fixed state, one surface 19a of the low-melting-point metal layer 19 on the conductor 17 and one surface 49a of the partner-low-melting-point metal layer 49 on the counterpart conductor 47 are in surface contact with zero clearance as much as possible. .

In order to connect the electrical connection member 10 and the connection object 40 from the state where the electrical connection member 10 and the connection object 40 are temporarily fixed , the one surface 19a of the low melting point metal layer 19 and the one surface 49a of the counterpart low melting point metal layer 49 6, the low melting point metal layer 19 and the partner low melting point metal layer 49 are irradiated with the laser beam 51 shown in FIG. By melting, the conductor 17 and the counterpart conductor 47 are connected as shown in FIG.

  As a specific method of melting and connecting the electrical connection member 10 and the connection object 40, the connection object 40 is temporarily fixed by the pressure-sensitive adhesive layer 13, and then the low melting point metal layer 19 and the counterpart by the laser beam 51. When the low melting point metal layer 49 is melted by applying heat, the low melting point metal layer 19 and the counterpart low melting point metal layer 49 are metal-bonded to electrically connect the conductor 17 and the counterpart conductive portion 43. It will be.

  As shown in FIG. 6, the laser beam 51 melts a pair of the low melting point metal layer 19 and the counterpart low melting point metal layer 49 that are in contact with each other from the outside of the base material 11 toward the counterpart base material 41. The electric connection member 10 and the connection object 40 are moved in one direction A1 in the first direction A (operation direction) shown in FIG. 6, and the low melting point metal layer 19 and the other low melting point are the next set. The metal layer 49 is melted to electrically connect the conductor 17 and the counterpart conductor 47.

Specifically, the material and thickness of the conductor 17, the base material 11, the adhesive layer 13, and the reinforcing film 15 are set, and the surface of the base material 11 in the region where the wavelength of the laser beam 51 is 800 to 1000 nm. The low melting point metal layer 19 and the partner low melting point metal layer 49 are melted at a transmittance of 60% or more to the interface between the reinforcing film 15 and the conductor 17.

In addition, after the electrical connection member 10 and the counterpart base material 41 are held by mechanical connection and are brought into a temporarily fixed state, the electrical connection inspection of the connection object 40 can be performed. The electrical connection inspection is performed by connecting the one surface 19a of the low melting point metal layer 19 and the one surface 49a of the counterpart low melting point metal layer 49 and applying current and voltage to the conductor 17 and the counterpart conductor 47. . If the inspection result is not satisfactory, the connection object 40 is replaced, and the connection object 40 is replaced with a new connection object 40, temporarily fixed , and the inspection is performed again.

  When a silicone-based pressure-sensitive adhesive is used as the pressure-sensitive adhesive layer 13, it is not necessary to perform adhesion, curing, and semi-curing steps, so that the electrical connection member 10 and the connection object 40 can be easily detached and attached.

  The removal and attachment of the electrical connection member 10 and the connection object 40 can be performed again even when repeated about 20 times or more, and a stable electrical connection is possible.

  When the result of the electrical connection inspection is good, as shown in FIG. 6, for example, the conductor 17 of the electrical connection member 10 is heated (for example, 250 ° C.) by operating the laser beam 51 having a wavelength of 800 to 1000 nm. As a result, the conductor 17 generates heat, melts the low melting point metal layer 19 and welds it to the mating conductive portion 47 of the connection object 40, thereby performing metal bonding. At this time, the laser beam 51 is generally transmitted through the other members and is not directly heated, and the low-melting-point metal is zero clearance between the one surface 19a of the low-melting-point metal layer 19 and the one surface 49a of the low-melting-point metal layer 49. For example, even if the layer 19 is thinned to 10 μm or less, it can be melt-connected.

  Therefore, a short circuit between the conductor 17 and the counterpart conductor 47 hardly occurs. This can be done without the need for jigs and equipment. In order to prevent a short circuit between the conductor 17 and the counterpart conductor 47, the amount of the low melting point metal layer 19 and the counterpart low melting point metal layer 49 is appropriately determined by design, and the distance C ( It is also possible to prevent the occurrence of a bridge between the adjacent conductors 17 and the counterpart conductor 47 with the interval C) shown in FIG. 7, and the mismatch of transmission characteristic impedance and the occurrence of crosstalk.

  When the thickness of the low melting point metal layer 19 is 10 μm or less, the clearance between the conductor 17 and the counterpart conductor 47 is limited by the adhesive force between the base material 11 and the counterpart base material 41 by the adhesive layer 13. Therefore, the amount of the low melting point metal layer 19 can be minimized. This makes it difficult for a short circuit between the conductor 17 and the counterpart conductor 47 to occur.

  Moreover, since the one surface 13a of the adhesive layer 13 is mechanically connected to the connection object 40 by adhesion between the conductor 17 and the counterpart conductor 47, a short circuit between the conductor 17 and the counterpart conductor 47 is caused. Hard to happen.

Connection of the electrical connection member 10 and the connection object 40 are provisionally fixed by the adhesive layer 13, rather than bonding, also, since the one surface 17a of the conductor 17 not through the member such as a conductive particle, the provisional fixation The repair efficiency of defective products by the subsequent electrical inspection is very good.

  When the conductor 17 and the counterpart conductor 47 are welded with the low melting point metal layer 19 and the counterpart low melting point metal layer 49 by the laser beam 51, the low melting point metal layer 19 and the counterpart low melting point metal layer 49 have a low melting point. And by making other materials difficult to absorb the laser beam 51, it is possible to selectively connect only between the conductor 17 and the counterpart conductor 47 without partial laser beam 51 irradiation. Connection can be made.

In addition, as a means to apply the load and temporarily fix the electrical connection member 10 toward the connection object 40, the glass plate 61 or the acrylic plate shown as an example as shown in FIG. 9 is used. When the glass plate 61 is adopted, the low-melting-point metal layer 19 of the electrical connection member 10 and the connection object 40 are irradiated by irradiating the laser beam 51 while applying a load to the electrical connection member 10 and pressing it with the glass plate 61. The other low melting point metal layer 49 is melt welded.

When the low melting point metal layer 19 and the counterpart low melting point metal layer 49 are melted, the laser beam is suppressed by being pressed by the glass plate 61 in order to reduce thermal deformation of the reinforcing film 15, the conductor 17 and the counterpart conductor 47 due to heat. The range of processing conditions by 51 is greatly expanded.

The means for applying a load toward the connection object 40 and temporarily fixing it is not limited to the glass plate 61, and the electrical connection member 10 is connected to the connection object 40 using a material having a high transmittance (a transmittance of 90% or more). Press towards.

  As shown in FIG. 10, the connection object 40 can also connect the conductor 17 and the counterpart conductor 47 in a state where the counterpart low melting point metal layer 49 is not disposed on the counterpart conductor 47. is there. That is, the low-melting-point metal layer 19 is melted by the laser beam 51 only by the low-melting-point metal layer 19 disposed on the conductor 17, thereby directly connecting the counterpart conductor 47 and the low-melting-point metal layer 19. You may do it. At this time, the amount and thickness of the low-melting point metal layer 19 are appropriately determined in design. In addition to the irradiation with the laser beam 51, there is a heating means using a heater.

11 to 13 show Example 2 of the electrical connection member. In the electrical connection member 210 in Example 2, the adhesive layer 13 is left on both side surfaces in the second direction B shown in FIG. A reinforcing film 215 is disposed at the center of the layer 13.

  The reinforcing film 215 is a strip-like film having insulating properties, and enters the inside of the pressure-sensitive adhesive layer 13. The reinforcing film 215 faces the one surface 11 a of the substrate 11 and is thinner than the pressure-sensitive adhesive layer 13. Further, in the reinforcing film 215, a plurality of conductors 17 are disposed at intervals in the first direction A on one surface 215 a opposite to the facing surface disposed facing the one surface 11 a of the base material 11. Has been.

  About half of the conductor 17 in the thickness direction enters the inside of the pressure-sensitive adhesive layer 13. The other half of the conductor 17 in the thickness direction and the one surface 17 a opposite to the one surface 215 a of the reinforcing film 215 are exposed outside the pressure-sensitive adhesive layer 13. A low melting point metal layer 19 is disposed on the entire exposed surface of the conductor 17.

  In addition, the conductor 17, the low melting point metal layer 19, and the like indicated by the same reference numerals in the same portions as those of the electrical connection member 10 shown in FIGS. 1 to 4 have the same structure as the electrical connection member 10 shown in FIGS. It is. Furthermore, the connection method of the electrical connection member 210 and the connection object 40 shown in FIG. The connection object 40 may have a structure in which the counterpart low melting point metal layer 49 disposed on the counterpart conductor 47 is removed.

FIG. 14 shows Example 3 of the electrical connection member 410 and shows a state in which the connection object 440 is connected to the electrical connection member 410. In addition, the same code | symbol is attached | subjected to the part same as the electrical connection member 10 shown in FIG. 1 thru | or FIG.

In the electrical connection member 410 according to the third embodiment, the low melting point metal layer 419 is disposed only on the conductor portion 17 that is the connection portion between the conductor portion 17 and the counterpart conductor 47, and the counterpart that becomes the connection portion with the conductor portion 17. In this structure, the counterpart low melting point metal layer 449 is disposed only on the conductor 47.

The connection method of the electrical connection member 410 and the connection object 440 shown in FIG. 14 is performed by the same connection method as the connection method of the electrical connection member 10 and the connection object 40 shown in FIGS.

The electrical connection inspection is performed by connecting the conductor 17 and the counterpart conductor 647 and applying the current Am and the voltage Vo as shown in FIG. If the inspection result is not satisfactory, the connection object 640 is replaced, replaced with a new connection object 640, temporarily fixed, and the inspection is performed again.

In order to connect the electrical connection member 410 and the connection object 640 from the state where the electrical connection member 410 and the connection object 640 are temporarily fixed after the inspection, one surface 419a of the low melting point metal layer 419 and one surface of the counterpart low melting point metal layer 649 6, the low melting point metal layer 419 and the partner low melting point metal layer 649 are irradiated with the laser beam 51 shown in FIG. 6, and the laser beam 51 is used to irradiate the low melting point metal layer 419 and the partner low melting point metal. The conductor 17 and the counterpart conductor 647 are connected by melting the layer 649.

As shown in FIG. 16, when the conductor 17 and the counterpart conductor 647 are connected, the low melting point metal layer 419 and the counterpart low melting point metal layer 649 are melted by the laser beam 51. Since the three-dimensional fillet 660 is formed on the additional counterpart conductor 647b by melting the melting point metal layer 649, the connection strength between the electrical connection member 410 and the connection target member 640 is greatly increased because of the three-dimensional connection state. Can be increased.

17 and 18 show a fourth embodiment of the electrical connection member. The electrical connection member 710 in Example 4 is disposed so that a part thereof is embedded in the base material 711, the adhesive layer 713 disposed on the entire surface 711a of the base material 711, and the adhesive layer 713. A conductor 717 which is a core wire of the plurality of electric cables 771 and a low melting point metal layer 719 disposed on the outer peripheral surface of the conductor 717.

In the adhesive layer 713, a part of the outer peripheral surface (arc portion) of the conductor 717 and the low melting point metal layer 719 is disposed so as to be embedded in the adhesive layer 713. The electric cable 771 includes an electric conductor 717 and an insulating covering portion 718 covering the electric conductor 717, and the electric conductor 717 is peeled off by stripping off the covering portion 718 at the tip end portion in the axial direction of the electric wire cable 771. A low melting point metal layer 719 is disposed on the exposed portion of the conductor 717 so as to be exposed.

Hereinafter, a method for connecting the electrical connection member 710 and the connection target 40 described with reference to FIG. 5 will be described.

The connection target 40 is installed on an installation table (not shown). After the electrical connection member 710 and the connection target 40 are opposed to the conductor 717 in which the low melting point metal layer 719 is disposed and the counterpart conductor 47 in which the partner low melting point metal layer 49 is disposed, The electrical connection member 710 and the connection object 40 are overlapped.

When a load is applied to the connection target object 40 with the electric connection member 710 directed toward the connection target object 40, the conductor 717 on which the low melting point metal layer 719 is disposed and the counterpart low melting point metal layer 49 are disposed. The counterpart conductor 47 is provided with a conductor 717 in which a part of the arc portion is embedded in the adhesive layer 713 and the low melting point metal layer 719 and the counterpart low melting point metal layer 49 are provided. One surface 41 a of the opposite substrate 41 on both sides in the first direction A of the body 47 is adhered to the adhesive layer 713.

When the one surface 41a of the counterpart base material 41 and the adhesive layer 713 are adhered, the electrical connection member 710 and the connection target 40 are temporarily fixed. When the electrical connection member 710 and the connection object 40 are in a temporarily fixed state, a part of the low melting point metal layer 719 and the one surface 49a of the partner low melting point metal layer 49 are pressed against each other with a load applied thereto. Abut.

That is, the electrical connection member 710 and the connection object 40 are electrically connected by the elastic force and adhesive force (attractive force) of the adhesive layer 713 disposed on the electrical connection member 710. That is, the pressure-sensitive adhesive layer 713 is brought into contact with the one surface 49a of the connection target 40 and the electrical connection member 710 and the mating base material 40 are mechanically connected to be held and temporarily fixed. In the temporarily fixed state, a part of the arc surface of the low melting point metal layer 719 on the conductor 717 and one surface 49a of the partner low melting point metal layer 49 on the counterpart conductor 47 are in contact with each other with zero clearance. Become.

In order to connect the electrical connection member 710 and the connection object 40 from the state where the electrical connection member 710 and the connection object 40 are temporarily fixed, a part of the arc surface of the low melting point metal layer 719 and one surface of the counterpart low melting point metal layer 49 are used. In the state where it is in contact with 49a, the low melting point metal layer 719 and the partner low melting point metal layer 49 are irradiated with the laser beam 51 shown in FIG. By melting 49, the conductor 717 and the counterpart conductor 47 are connected as shown in FIGS.

A specific method for melting and connecting the electrical connection member 710 and the connection object 40 is performed by the method described in the first embodiment, and is wired in the first direction A with a pitch of 0.3 mm or less. The electric conductor 717 of the electric cable 771 is irradiated with the laser beam 51 while being fixed with an adhesive tape made of a member having a transmittance of 60% or more at a wavelength of 800 to 1000 nm of the laser beam 51, and the low melting point metal 719 Only the melting point metal layer 49 is melted and connected to the electrical connection member 710 and the connection object 40.

In order to prevent a short circuit between the conductor 717 and the counterpart conductor 47, the amount of the low-melting-point metal layer 719 and the counterpart low-melting-point metal layer 49 can be determined appropriately in the design, and the distance C ′ in the first direction A can be determined. It is also possible to prevent the occurrence of a bridge between adjacent conductors 717 and counterpart conductors 47 (interval C ′ shown in FIG. 19), mismatch of transmission characteristic impedance, and occurrence of crosstalk.

When the thickness of the low melting point metal layer 719 is 10 μm or less, the clearance between the conductor 17 and the counterpart conductor 47 is limited by the adhesive force between the base material 711 and the counterpart base material 41 by the adhesive layer 713. Therefore, the amount of the low melting point metal layer 719 can be minimized. This makes it difficult for a short circuit between the conductor 717 and the counterpart conductor 47 to occur.

The connection method of the electrical connection member 710 and the connection object 40 is temporary fixation by the adhesive layer 713, and since no member such as conductive particles is interposed on the arc surface of the conductor 717, the electrical connection after temporary fixation is performed. The repair efficiency of defective products by inspection is very good.

Further, when the conductor 717 and the counterpart conductor 47 are welded by the laser beam 51 with the low melting point metal layer 719 and the counterpart low melting point metal layer 49, the low melting point metal layer 719 and the counterpart low melting point metal layer 49 have a low melting point. And by making other materials difficult to absorb the laser beam 51, it is possible to selectively connect only between the conductor 717 and the counterpart conductor 47 without partial laser beam 51 irradiation. Connection can be made.

Note that the connection object 40 does not have to be provided with the counterpart low melting point metal layer 49 on the counterpart conductor 47. That is, the low-melting-point metal layer 719 is melted by the laser beam 51 only by the low-melting-point metal layer 719 disposed on the conductor 717, thereby directly connecting the counterpart conductor 47 and the low-melting-point metal layer 719. You may do it. At this time, the amount and thickness of the low-melting-point metal layer 719 are appropriately determined in design.

The electrical connection member according to the present invention can also be applied to an electrode connection method and apparatus for a liquid crystal display (LCD) device, an electrical connection member used for connection with a printed circuit board, a flexible wiring board (FPC board), and the like.

It is a front view which shows Example 1 of the electrical connection member of this invention. It is a bottom view of the electrical connection member shown in FIG. FIG. 3 is a left side view of the electrical connection member shown in FIG. 2. FIG. 4 is a sectional view of the electrical connection member shown in FIG. 2 taken along the line IV-IV. It is the front view shown in the state before connecting the electrical-connection member shown in FIG. 1, and a connection target object. It is the front view shown in the state which accumulated the electrical connection member and connection target object shown in FIG. It is the front view which showed the state after connecting the electrical-connection member shown in FIG. 6, and a connection target object. It is the VIII-VIII sectional view taken on the line of FIG. It is the front view which expanded and showed the state which added the load with the glass plate in the state which accumulated the electrical connection member and connection target object shown in FIG. It is the front view which expanded and showed the example of a connection of the electrical connection member shown in FIG. 5, and the connection target object which does not have a partner low melting-point metal layer. It is a front view which shows Example 2 of the electrical connection member of this invention. It is a bottom view of the electrical connection member shown in FIG. It is a right view of the electrical connection member shown in FIG. Example 3 of the electrical connection member of the present invention is shown, and is a side sectional view showing a state of being temporarily fixed to a connection object. It is side surface sectional drawing which shows the state which accumulated the electrical connection member and the connection target object, and shows an electrical connection test | inspection. It is side surface sectional drawing which showed the state which connected the electrical-connection member shown in FIG. 15, and a connection target object. Example 4 of the electrical connection member of the present invention is shown, and is a front view showing a state before connecting the electrical connection member and the connection object. It is the XXIII-XXIII sectional view taken on the line of FIG. It is the front view which showed the state in the middle of connecting the electrical connection member shown in FIG. 17, and a connection target object, and showed the other party base material of the connection target object in cross section. It is sectional drawing which showed the state after connecting the electrical connection member shown in FIG. 19, and a connection target object in the same direction as the cross section shown in FIG.

10, 210, 410, 710 Electrical connection member
11,711 base material
11a, 13a, 15a, 17a, 19a, 41a, 215a, 647a
13,713 Adhesive layer
15,215 Reinforcement film
17,717 conductor
19,419,719 Low melting point metal layer
40, 440, 640 Connection object
41,641 Partner base material
47,647 Counter conductor
49,449,649 Counterpart low melting point metal layer
51 Laser light
61 Glass plate
641b side
660 Fillet
771 Electric cable
718 Covering part
A First direction
B Second direction

Claims (1)

In the electrical connection member connected to the connection object,
A base material, a pressure-sensitive adhesive layer disposed on one surface of the base material, and a portion of the pressure-sensitive adhesive layer disposed in the pressure-sensitive adhesive layer so that a part of the base material enters the pressure-sensitive adhesive layer and the other part is exposed to the outside of the pressure-sensitive adhesive layer. A plurality of conductors provided,
The connection object formed by disposing at least a plurality of mating conductors at the same interval as the plurality of conductors on one surface of the mating substrate is overlapped with the conductors facing the mating conductors. By applying a combined load, in a state where the conductor and the counterpart conductor are embedded in the pressure-sensitive adhesive layer, one surface of the counterpart base material is adhered by the pressure-sensitive adhesive layer and temporarily fixed. Configured,
The conductor is temporarily bonded to the pressure-sensitive adhesive layer, and then melted at least on the connection side of the connection object to be connected to the counterpart conductor, thereby the conductor and the conductor. A low melting point metal layer connecting the
An electrical connection member, wherein a reinforcing film is disposed between the pressure-sensitive adhesive layer and the conductor.

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