JP4786624B2 - Semiconductor wafer processing equipment - Google Patents

Description

  The present invention relates to a semiconductor wafer processing apparatus.

  Conventionally, in a manufacturing process and a processing process of a semiconductor wafer, a lapping process, an etching process, a rough polishing process, and a mirror polishing process are performed on a wafer substrate cut out from an ingot, and then a cleaning process is performed. High cleaning is achieved. In such a semiconductor wafer manufacturing process, an example of an apparatus for performing a process from each polishing process to the cleaning process is disclosed in Patent Document 1 below.

  In this patent document 1, a polishing apparatus that performs surface polishing of a semiconductor wafer, a cleaning apparatus that performs final cleaning of a semiconductor wafer after polishing, and a polishing apparatus that is interposed between the polishing apparatus and the cleaning apparatus, are transferred to the cleaning apparatus. A semiconductor wafer processing apparatus including a wafer transfer unit that transfers a polished semiconductor wafer is disclosed. In this semiconductor wafer processing apparatus, each of the semiconductor wafers is polished one by one in the polishing apparatus, and a transfer mechanism linearly reciprocates between the polishing apparatus and the cleaning apparatus in the wafer transfer section, and after polishing. The semiconductor wafers are transferred one by one to the cleaning chamber, and the polished semiconductor wafers are cleaned one by one in the cleaning apparatus.

  Incidentally, in the polishing step in the polishing apparatus, contaminants such as abrasives, polishing debris, and metal impurities adhere to the surface of the semiconductor wafer. Then, when the surface of the semiconductor wafer is dried during the transfer by the wafer transfer unit, the contaminant adheres to the surface of the semiconductor wafer, and even if the semiconductor wafer is later cleaned by the cleaning device, the contaminant is removed. Becomes difficult.

Therefore, in the semiconductor wafer processing apparatus of Patent Document 1, a wafer holding tray that fills with liquid is provided in the transfer mechanism of the wafer transfer unit, and the polished semiconductor wafer is immersed in the liquid and cleaned in the tray. By transporting to the apparatus side, the contaminants are prevented from adhering to the semiconductor wafer due to drying during transport of the semiconductor wafer and becoming difficult to remove in the cleaning process.
JP 2001-313278 A

  The semiconductor wafer processing apparatus disclosed in Patent Document 1 has a problem that it is difficult to improve the processing efficiency of the semiconductor wafer because the semiconductor wafer is polished, transported, and cleaned one by one. .

  In order to solve this problem, a plurality of semiconductor wafers are simultaneously polished by a polishing apparatus, and the simultaneously polished semiconductor wafers are simultaneously transferred to a cleaning apparatus by a wafer transfer unit, and these semiconductors are cleaned by the cleaning apparatus. A configuration is also conceivable in which the processing efficiency of the semiconductor wafer is improved by cleaning the wafer.

  However, in this configuration, when the cleaning apparatus abnormally stops due to a malfunction or the like with the semiconductor wafer remaining on the wafer holding tray of the wafer transfer unit, many defective semiconductor wafers are generated and the yield is reduced. There is a fear. That is, if the cleaning device abnormally stops with the semiconductor wafer remaining in the wafer holding tray of the wafer transfer unit, there is no place for the semiconductor wafer that is about to be polished by the polishing device, and it will be left after polishing, The contaminants adhere to the semiconductor wafer and become defective. In this configuration, since a plurality of semiconductor wafers are simultaneously polished by the polishing apparatus, all the semiconductor wafers may become defective products, and many defective semiconductor wafers are generated. Become.

  The present invention has been made to solve the above-described problems, and the object thereof is to improve the processing efficiency of a semiconductor wafer and suppress a decrease in yield due to an abnormal stop of a cleaning apparatus. A semiconductor wafer processing apparatus is provided.

  In order to achieve the above object, a semiconductor wafer processing apparatus according to the present invention is a semiconductor wafer processing apparatus for polishing a semiconductor wafer and then polishing the semiconductor wafer, and simultaneously polishing a plurality of the semiconductor wafers. A polishing apparatus, a cleaning apparatus for cleaning the semiconductor wafer polished by the polishing apparatus, and the plurality of semiconductor wafers interposed between the polishing apparatus and the cleaning apparatus and polished from the polishing apparatus to the cleaning apparatus And a controller for controlling the operation of the polishing device, the cleaning device, and the transport device, and the transport device stores the liquid therein and polishes the liquid so as to be immersed in the liquid. A pair of transfer tanks for storing the subsequent semiconductor wafer, a receiving position for receiving the polished semiconductor wafer from the polishing apparatus, and the cleaning apparatus; A transfer tank moving mechanism for moving the pair of transfer tanks so that they are interchanged with each other between a transfer position for transferring the semiconductor wafer after polishing, and the polishing in the transfer tank at the receiving position of the pair of transfer tanks A loading device for loading the polished semiconductor wafer received from the apparatus, and the polished semiconductor wafer is taken out of the pair of transfer tanks at the transfer position and transferred to the cleaning apparatus. The pair of transfer tanks has a capacity capable of accommodating a maximum number of the semiconductor wafers to be processed at a time by the polishing apparatus in total, and the control apparatus includes: When the semiconductor wafer is abnormally stopped, the semiconductor wafer being processed by the polishing apparatus is charged and stored in at least one of the pair of transfer tanks by the charging apparatus after polishing.

  In this semiconductor wafer processing apparatus, a plurality of semiconductor wafers are simultaneously polished by a polishing apparatus, and the plurality of polished semiconductor wafers are simultaneously transferred to a cleaning apparatus by a transfer apparatus. The processing efficiency of the semiconductor wafer can be improved as compared with the case of polishing, transporting and cleaning.

  Further, in this semiconductor wafer processing apparatus, since the semiconductor wafer is transferred while the pair of transfer tanks are interchanged between the receiving position and the delivery position in the transfer apparatus, one transfer tank is placed between the receiving position and the transfer position. As compared with the case where the semiconductor wafer is transported by reciprocating, the semiconductor wafer transport efficiency can be improved. Thereby, the processing efficiency of the semiconductor wafer as the whole semiconductor wafer processing apparatus can be further improved.

  Furthermore, in this semiconductor wafer processing apparatus, when the cleaning apparatus stops abnormally, the semiconductor wafer being processed by the polishing apparatus can be stored in the liquid in the transfer tank of the transfer apparatus after polishing, so the cleaning apparatus stops abnormally. Then, it is possible to prevent the plurality of semiconductor wafers being processed by the polishing apparatus from drying afterwards, and to prevent contaminants such as abrasives, polishing debris and metal impurities from adhering to the semiconductor wafers. . As a result, it is possible to prevent many defective semiconductor wafers from being generated due to an abnormal stop of the cleaning apparatus, and to suppress a decrease in yield. Therefore, in this semiconductor wafer processing apparatus, it is possible to suppress a decrease in yield due to an abnormal stop of the cleaning apparatus while improving the processing efficiency of the semiconductor wafer.

  In the semiconductor wafer processing apparatus, each of the transfer tanks has a storage capacity capable of storing the maximum number of the semiconductor wafers processed at one time by the polishing apparatus, and the control apparatus has the cleaning apparatus abnormally stopped. Then, it is preferable that the semiconductor wafer being processed by the polishing apparatus is charged and stored in one of the pair of transfer tanks by the charging apparatus after polishing.

  When a plurality of semiconductor wafers being processed by the polishing device are stored separately in a pair of transfer tanks when the cleaning apparatus stops abnormally, both transfer tanks are received when the operation of the abnormally stopped cleaning apparatus is resumed. It is necessary to perform control for transferring the semiconductor wafers stored in the respective transfer tanks to the cleaning apparatus by moving between the position and the transfer position. On the other hand, in the above configuration, when the operation of the cleaning apparatus that has stopped abnormally is resumed, the semiconductor wafer stored only from one transfer tank has only to be taken out and delivered to the cleaning apparatus. As compared with the case where the semiconductor wafers are stored separately in the respective transfer tanks, it is possible to simplify the control of transferring the stored semiconductor wafers to the cleaning device when the operation of the cleaning device is resumed.

  In the semiconductor wafer processing apparatus, it is preferable that the transfer device includes a positioning device for positioning the transfer tanks at the receiving position and the delivery position.

  If comprised in this way, each conveyance tank can be correctly positioned by the positioning device in the said receiving position and the said delivery position, the insertion mistake of the semiconductor wafer in the conveyance tank resulting from position shift, and the inside of a conveyance tank It is possible to prevent occurrence of mistakes in taking out the semiconductor wafer from the wafer.

  In the semiconductor wafer processing apparatus, the transfer tank moving mechanism includes the swiveling body that supports the pair of transfer tanks, and the receiving position and the transfer position centered on an axis positioned between the receiving position and the transfer position. It is preferable to include a turning mechanism for rotating the turning body so that the pair of transfer tanks are interchanged with each other.

  If comprised in this way, since a pair of conveyance tank can be mutually replaced simultaneously between the said receiving position and the said delivery position only by rotating a turning body, a pair of conveyance tank is each set to a conveyance tank moving mechanism, respectively. The configuration of the transport tank moving mechanism can be simplified as compared with the case where the driving body for moving is individually provided.

  In the semiconductor wafer processing apparatus, the polishing apparatus includes a carry-out device that horizontally carries the polished semiconductor wafer from the polishing device to the transfer device, and the cleaning device is transferred by the transfer device. The semiconductor wafer after polishing is received in the transfer device in the horizontal direction, and then loaded into the cleaning device in the horizontal direction. The loading device uses the unloading device to carry out the polishing. After holding and receiving the polished semiconductor wafer carried out from the apparatus, it has a loading mechanism for loading from the upper side to the lower side into the transfer tank at the receiving position, After the polished semiconductor wafer in the transfer tank at the transfer position is gripped and taken upward, the transfer is transferred from the cleaning device to the carry-in device that has advanced into the transfer device. Preferably has a mechanism.

  If comprised in this way, the structure of the part which a conveyance apparatus receives a semiconductor wafer from a grinding | polishing apparatus and the structure of the part which delivers a semiconductor wafer from a grinding | polishing apparatus to a washing | cleaning apparatus can be comprised.

  In the semiconductor wafer processing apparatus, it is preferable that the transfer device includes a liquid filling device that fills the transfer tank in the receiving position with the liquid.

  The liquid in the transfer tank is contaminated by contaminants adhering to the semiconductor wafers immersed in the transfer tank, and thus needs to be replaced. According to the above configuration, when the transfer tank is placed at the receiving position, Unlike the case where the user replaces the liquid in the transport tank, the liquid in the transport tank can be filled with the liquid in the transport tank without increasing the work burden on the user. It can be kept clean.

  In this case, the liquid filling apparatus introduces the liquid from the vicinity of the bottom into the transfer tank at the receiving position and overflows the liquid from the upper part of the transfer tank to cause the liquid to enter the transfer tank. It is preferable to have an introduction portion that fills.

  If comprised in this way, since the flow of the liquid which is introduce | transduced into a conveyance tank from the bottom part and overflows from the upper part of the conveyance tank is made, the said contaminant which remains in a conveyance tank by the flow of the liquid will be outside the conveyance tank Can be effectively discharged. For this reason, the liquid in a conveyance tank can be kept in a cleaner state.

  In the semiconductor wafer processing apparatus, the transfer device performs a switching operation for discharging the liquid in the transfer tank at the transfer position, and the transfer tank moves in the process of moving from the transfer position to the receive position. It is preferable to include a liquid discharge device for discharging the liquid from the transfer tank.

  If comprised in this way, since a movement of a conveyance tank and discharge | emission of the liquid from a conveyance tank can be performed in parallel, compared with the case where a liquid is discharged after a conveyance tank moves to a receiving position, it is conveyed. Efficiency can be further improved. For this reason, the processing efficiency of the semiconductor wafer in the semiconductor wafer processing apparatus can be further improved.

  In this case, it is preferable that the transfer device includes a drainage receiving unit that receives the liquid discharged from the transfer tank along a path along which the transfer tank moves from the delivery position to the receiving position.

  If comprised in this way, the liquid discharged | emitted in the movement process of a conveyance tank can be received by the drainage receiving part, and it can prevent that the liquid leaks out of the conveying apparatus.

  In the semiconductor wafer processing apparatus, the control device transfers the transfer tank in which the semiconductor wafer is stored by the transfer tank moving mechanism in response to the operation of the cleaning apparatus that has stopped abnormally being restarted. It is preferable that the semiconductor wafers stored in the transfer tank are taken out in the order in which the semiconductor wafers are stored by the take-out device and transferred to the cleaning device.

  If comprised in this way, since the semiconductor wafer stored in the conveyance tank during the abnormal stop of the cleaning device is delivered to the cleaning device after the operation of the cleaning device is resumed in the same order, it is caused by the abnormal stop of the cleaning device. Thus, it is possible to prevent the processing order of the semiconductor wafers from being out of order.

  In the semiconductor wafer processing apparatus, the transfer device includes a contamination prevention mechanism for preventing contamination of the polished semiconductor wafer in the transfer device, and the contamination prevention mechanism includes the pair of transfer tanks and the transfer tank. A clean booth that houses the moving mechanism, the charging device, and the take-out device, a clean filter unit for introducing clean air into the clean booth, and preventing charging of the semiconductor wafer after polishing in the clean booth It is preferable to have a static eliminating device for exhausting air and an exhaust device for discharging air from the clean booth.

  According to this structure, the semiconductor wafer can be transported and stored in clean air in the clean booth, and the semiconductor wafer can be prevented from being charged by the static eliminator, and dust can be prevented from being attracted. Thereby, it is possible to prevent the surface of the semiconductor wafer from being contaminated during the transfer process and the storage process in the transfer apparatus.

  As described above, according to the present invention, it is possible to suppress a decrease in yield due to an abnormal stop of the cleaning device while improving the processing efficiency of the semiconductor wafer.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a diagram schematically showing an overall configuration of a semiconductor wafer processing apparatus according to an embodiment of the present invention. 2 is a view of the inside of the transfer device 6 of the semiconductor wafer processing apparatus shown in FIG. 1 as viewed from above, and FIG. 3 is a view of the inside of the transfer device 6 as viewed from the side. However, in FIG. 2, the charging device 36, the take-out device 38, the support column 49, and the arm portions 49a and 49b are omitted. 4 is an enlarged view of the structure in the vicinity of the transfer tank 32 in FIG. 3, and FIG. 5 is a view showing a state when the transfer tank 32 is filled with pure water by the liquid filling device 44. FIG. 6 is a longitudinal sectional view showing the transport tank 32 and the introduction part 44 b of the liquid filling device 44. First, with reference to FIGS. 1-6, the structure of the semiconductor wafer processing apparatus by one Embodiment of this invention is demonstrated.

  The semiconductor wafer processing apparatus according to the present embodiment cleans the semiconductor wafer 100 after polishing the surface of the semiconductor wafer 100. As shown in FIG. 1, the semiconductor wafer processing apparatus includes a polishing device 2, a cleaning device 4, a transfer device 6, and a control device 8.

  The polishing apparatus 2 is for polishing the surface of the semiconductor wafer 100, and is configured to simultaneously polish the surface of a plurality (four in the present embodiment) of the semiconductor wafers 100.

  Specifically, the polishing apparatus 2 includes a supply robot 12, a stage 14, a primary polishing table 16, a secondary polishing table 18, a tertiary polishing table 20, a plurality of unillustrated rotating drums, And a carry-out robot 22.

  The supply robot 12 takes out the semiconductor wafers 100 one by one from the supply cassette 23 before polishing and places them on the stage 14 so as to form a set of four.

  The primary polishing table 16 is used for rough polishing of the surface of the semiconductor wafer 100 by pressing the semiconductor wafer 100 rotated by a rotary drum (not shown). The primary polishing table 16 has a polishing cloth covering its upper surface, and an abrasive is applied to the polishing cloth. The abrasive is a slurry in which an alkali liquid and abrasive grains are mixed, and surface polishing of the semiconductor wafer 100 is performed by an etching action by the alkali component of the abrasive and mechanical polishing by the abrasive grains.

  The secondary polishing table 18 is for performing intermediate finishing polishing of the surface of the semiconductor wafer 100, and the tertiary polishing table 20 is for performing final finishing polishing of the surface of the semiconductor wafer 100. The secondary polishing table 18 and the tertiary polishing table 20 are configured in substantially the same manner as the primary polishing table 16. However, the abrasive grains in the abrasive used in the secondary polishing table 18 are finer than the abrasive grains in the abrasive used in the primary polishing table 16, and the abrasive grains used in the tertiary polishing table 20 The abrasive grains are finer than the abrasive grains in the abrasive used in the secondary polishing table 18. As a result, the surface of the semiconductor wafer 100 is finished to a mirror surface step by step from the primary polishing table 16 through the secondary polishing table 18 to the tertiary polishing table 20.

  The plurality of unillustrated rotating drums rotate the semiconductor wafer 100 during polishing. An attachment portion for attaching the semiconductor wafer 100 is provided at the bottom of each rotating drum. The rotating drum is configured to affix the semiconductor wafer 100 to the attaching portions by pressing the attaching portions against the upper surfaces of the four semiconductor wafers 100 placed on the stage 14.

  Then, the rotating drum moves onto the primary polishing table 16 with the semiconductor wafer 100 adhered, and presses the lower surface of the semiconductor wafer 100 against the polishing cloth coated with the abrasive of the primary polishing table 16. By rotating, the semiconductor wafer 100 is roughly polished. Thereafter, the rotary drum performs the intermediate finish polishing of the semiconductor wafer 100 on the secondary polishing table 18 in the same manner, and then performs the final finish polishing of the semiconductor wafer 100 on the tertiary polishing table 20 in the same manner. 14 Return to top. On the stage 14, the four semiconductor wafers 100 after polishing are peeled off from the attaching portion of the rotating drum and placed.

  A process in which the semiconductor wafer 100 is affixed on the stage 14, each polishing process in the primary polishing table 16, the secondary polishing table 18, and the tertiary polishing table 20, and the semiconductor wafer 100 is peeled off and placed on the stage 14. The steps to be performed are sequentially performed by each of the plurality of rotating drums, and each of these steps is performed in parallel on each rotating drum.

  That is, in the polishing apparatus 2 according to the present embodiment, the four semiconductor wafers 100 placed on the stage 14 by the supply robot 12, the four semiconductor wafers 100 polished on the primary polishing table 16, and the secondary A total of four semiconductor wafers 100 polished on the polishing table 18, four semiconductor wafers 100 polished on the tertiary polishing table 20, and four semiconductor wafers 100 placed on the stage 14 after polishing. Twenty semiconductor wafers 100 are processed simultaneously.

  The unloading robot 22 unloads the four polished semiconductor wafers 100 peeled off from the rotating drum and placed on the stage 14 to the transfer device 6 one by one. This unloading robot 22 is included in the concept of the unloading apparatus of the present invention. The unloading robot 22 has a gripping portion 22 a that grips the semiconductor wafer 100, grips the peripheral edge of the semiconductor wafer 100 by the gripping portion 22 a, and unloads the semiconductor wafer 100 to the transfer device 6.

  At this time, the unloading robot 22 lifts the semiconductor wafer 100 on the stage 14 by the gripping part 22a, then changes the direction to the transfer device 6 side and rotates the gripping part 22a around its axis to lie horizontally. The held semiconductor wafer 100 is set in a vertical state, and in this state, the gripping portion 22a and the semiconductor wafer 100 are advanced into the transfer device 6 in the horizontal direction, and the semiconductor wafer 100 is unloaded.

  The partition 3 that partitions the polishing device 2 and the transport device 6 is provided with an opening 3b that is opened and closed by a shutter 3a. The opening 3b is opened only when the semiconductor wafer 100 is carried out to the transfer device 6, and the gripping portion 22a and the semiconductor wafer 100 advance into the transfer device 6 through the opening 3b. The opening 3b is closed so that the space in the polishing apparatus 2 and the space in the transfer apparatus 6 are blocked.

  The cleaning device 4 cleans the polished semiconductor wafer 100 that is transferred by the transfer device 6 after being polished by the polishing device 2. The cleaning device 4 has a carry-in robot 24 (see FIG. 3).

  The carry-in robot 24 is included in the concept of the carry-in device of the present invention, and carries the semiconductor wafer 100 transferred by the transfer device 6 into the cleaning device 4. The loading robot 24 has a gripping portion 24 a that grips the semiconductor wafer 100, grips the peripheral edge of the semiconductor wafer 100 by the gripping portion 24 a, and loads the semiconductor wafer 100 into the cleaning device 4.

  At this time, the carry-in robot 24 moves the gripping portion 24a into the transport device 6 in the horizontal direction, and grips the gripper 24a in a posture that is vertically set by a gripping portion 38b of a take-out device 38 (to be described later) of the transport device 6. Received semiconductor wafer 100 is received. Thereafter, the gripper 24 a and the semiconductor wafer 100 are retracted into the cleaning device 4, whereby the semiconductor wafer 100 is carried into the cleaning device 4. In the cleaning apparatus 4, the semiconductor wafer 100 carried in is highly cleaned through various cleaning processes, and then stored in a storage cassette (not shown) according to the processing order.

  The partition wall 5 that partitions the cleaning device 4 and the transport device 6 is provided with an opening 5b that is opened and closed by a shutter 5a. The opening 5b is opened only when the semiconductor wafer 100 is carried into the cleaning apparatus 4, and the gripping portion 44a and the semiconductor wafer 100 are moved forward and backward through the opening 5b. Otherwise, the opening 5b is opened. The part 5b is closed so that the space in the cleaning device 4 and the space in the transport device 6 are blocked.

  The transfer device 6 is interposed between the polishing device 2 and the cleaning device 4 and simultaneously transfers a plurality (four in this embodiment) of semiconductor wafers 100 after polishing from the polishing device 2 to the cleaning device 4. Is. As shown in FIGS. 1 to 3, the transfer device 6 includes a pair of transfer tanks 32, 32, a transfer tank moving mechanism 34, a positioning device 35, a charging device 36, an extraction device 38, and a liquid discharge device. The apparatus 40, the drainage receiving part 42, the liquid filling apparatus 44, and the contamination prevention mechanism 46 are provided.

  The pair of transfer tanks 32, 32 contain pure water inside and contain the polished semiconductor wafer 100 so as to be immersed in the pure water. Pure water is included in the concept of liquid in the present invention. In the transfer device 6 of the present embodiment, the polished semiconductor wafer 100 is transferred to the cleaning device 4 while being accommodated in the transfer tank 32.

  As shown in FIGS. 4 to 6, each transfer tank 32 is formed in a box shape with an upper portion opened, and a semiconductor wafer 100 is inserted through the upper opening, and a plurality of semiconductor wafers 100 are formed therein. It is housed at intervals in a vertical position. Three support members 33 are provided in the transfer tank 32, and each support member 33 is slightly below the center position at the lower end of the peripheral edge of the semiconductor wafer 100 in the upright state and the center positions in the vertical direction on both sides. Each position is supported. As a result, the semiconductor wafer 100 is held in pure water in the transfer tank 32.

  Each transfer tank 32 has a capacity capable of accommodating the maximum number of semiconductor wafers 100 that can be processed at once by the polishing apparatus 2, that is, 20 semiconductor wafers 100 in this embodiment. However, during normal transfer, four semiconductor wafers 100 that are affixed to the same rotating drum by the polishing apparatus 2 and polished at the same time are accommodated in each transfer tank 32 and transferred.

  In the polishing apparatus 2, abrasives, polishing scraps, metal impurities, and the like are attached in the polishing process, and after the semiconductor wafer 100 is polished, the semiconductor wafer 100 is carried to the transfer device with these contaminants attached. . If the abrasive adheres to the semiconductor wafer 100 for a long time, there is a possibility that etching proceeds due to an alkali component in the abrasive. In addition, abrasive grains, polishing debris, metal impurities, and the like in the abrasive may be dried and fixed while the semiconductor wafer 100 is being transported, and may not be removed by subsequent cleaning by the cleaning device 4. Therefore, in this embodiment, the semiconductor wafer 100 is transported in the transport tank 32 as described above while being immersed in pure water, thereby suppressing the progress of etching due to the alkali component and drying of the semiconductor wafer 100. And the sticking of the contaminants is suppressed.

  Further, the transfer tank 32 is made of resin in order to prevent metal contamination of the semiconductor wafer 100 accommodated therein. Moreover, the upper edge 32a of the conveyance tank 32 extends in a substantially horizontal direction and is formed in a sawtooth shape. As a result, the pure water overflows evenly from the entire upper edge 32a of the transport tank 32 when the transport tank 32 is filled with pure water as will be described later by the liquid filling device 44. It is configured so that pure water does not overflow due to a specific location on the upper edge 32a of the tank 32.

  Further, an overflow receiving part 32 b for passing water overflowing from the upper edge 32 a to the drainage receiving part 42 is provided at the upper part of the transfer tank 32. The overflow receiving portion 32b includes a receiving portion 32c that receives water overflowed from the upper edge 32a, and a water guide pipe portion 32d that guides the water received by the receiving portion 32c to the drainage receiving portion 42.

  The receiving part 32c is provided so as to surround the upper part of the transport tank 32, while the water conduit 32d is attached to a hole formed at a predetermined position on the bottom of the receiving part 32c and transported. It extends in the vertical direction along the side surface of the tank 32. The overflowed water is received by the receiving portion 32c and then flows into the drainage receiving portion 42 through the water conduit portion 32d.

  A discharge cock 32 e for discharging pure water in the transfer tank 32 is provided at the bottom of the transfer tank 32. The discharge cock 32e closes the discharge hole 32f at the bottom of the transfer tank 32 when pure water is stored in the transfer tank 32, and opens the discharge hole 32f by being pulled down when draining. Pure water in the transport tank 32 is discharged through the discharge hole 32f.

  In addition, a drainage guiding part 32 g for flowing pure water discharged through the discharge hole 32 f to the drainage receiving part 42 is attached to the lower part of the transport tank 32. The drainage guiding part 32 g is provided so as to surround the lower part of the transport tank 32, and has an inclined part 32 h provided to face the bottom of the transport tank 32. The inclined portion 32h is inclined so as to descend toward the inner side in the radial direction of the revolving body 34a described later, and the pure water discharged through the discharge hole 32f travels along the upper surface of the inclined portion 32h. It flows down to the receiving part 42.

  As shown in FIG. 1, the transfer tank moving mechanism 34 has a receiving position A for receiving the polished semiconductor wafer 100 from the polishing apparatus 2 and a delivery position B for transferring the polished semiconductor wafer 100 to the cleaning apparatus 4. The pair of transfer tanks 32, 32 are moved so as to be interchanged with each other. The transport tank moving mechanism 34 includes a turning body 34a and a turning mechanism 34b.

  The swivel body 34a is a flat plate-like and annular member that supports the pair of transfer tanks 32 and 32 together. The pair of transfer tanks 32, 32 are fixed at positions facing each other on the revolving structure 34a. A gear portion 34c is provided on the outer edge of the swivel body 34a. Further, the revolving body 34a is rotatable around an intermediate position between the receiving position A and the delivery position B, that is, around the center of the revolving body 34a.

  The turning mechanism 34b is a pair of transport tanks between the receiving position A and the delivery position B around the axis located between the receiving position A and the delivery position B, that is, the central axis of the turning body 34a. The revolving body 34a is rotated so that 32 and 32 are interchanged with each other. The turning mechanism 34b includes an LM guide 34d, a bearing 34e (see FIGS. 3 and 4), and a drive unit 34f.

  The LM guide 34d guides the rotation of the revolving body 34a. The LM guide 34d is provided between the lower surface of the revolving body 34a and the upper surface of a mount 48 installed on the floor surface of the clean booth 46a described later, and is provided along the annular revolving body 34a. ing.

  The bearing 34e supports the swivel body 34a in a rotatable manner. The bearing 34e is provided between the lower surface of the swivel body 34a and the upper surface of the gantry 48, and is disposed in an annular shape along the LM guide 34d so as to surround the radially outer side. The revolving body 34a is configured to rotate while being supported by the bearing 34e and the LM guide 34d.

  The drive part 34f gives a driving force for rotation to the revolving structure 34a, and is installed at a predetermined location on the radially outer side of the revolving structure 34a. The drive unit 34f includes a servo motor 34g and an external gear 34h that meshes with the gear unit 34c of the revolving body 34a, and transmits the driving force of the servo motor 34g to the revolving body 34a via the external gear 34h. By doing so, the revolving structure 34a is rotated. And this drive part 34f is drive-controlled by the said control apparatus 8, and rotates the turning body 34a every 180 degrees, and makes the said pair of conveyance tanks 32 and 32 the said receiving position A and the said delivery position B. Move so that they are interchanged with each other.

  The positioning device 35 positions the positions of the transport tanks 32 at the receiving position A and the delivery position B, respectively. Two positioning devices 35 are provided in the conveying device 6, and the two positioning devices 35 are arranged at positions facing each other on the radially outer side of the revolving body 34 a. As shown in FIG. 2, each positioning device 35 has a main body portion 35a, a protruding portion 35b, and a protruding portion receiving portion 35c.

  The main body 35a is fixed on the floor surface of a clean booth 46a, which will be described later, and moves the protrusion 35b forward and backward in the radial direction of the revolving body 34a.

  The protruding portion 35b moves from the main body portion 35a so as to protrude inward in the radial direction of the revolving body 34a, and engages with the protruding portion receiving portion 35c.

  The protrusion receiving part 35c is attached to the revolving body 34a and has a recess 35d into which the tip of the protrusion 35b is fitted.

  The positioning device 35 is controlled by the control device 8, and when the transport tanks 32 are arranged at the receiving position A and the delivery position B, respectively, by the rotation of the revolving body 34a, the projecting portion 35b from the main body portion 35a. The protrusion 35b functions as a stopper by causing the protrusion 35b to engage with the recess 35d of the protrusion receiving portion 35c, and the revolving body 34a and each transport tank 32 are positioned.

  The charging device 36 charges the semiconductor wafers 100 after polishing received from the polishing device 2 into the transfer tank 32 at the receiving position A of the pair of transfer tanks 32, 32 one by one. is there. As shown in FIG. 3, the loading device 36 is provided on one arm portion 49 a of a pair of arm portions 49 a and 49 b extending from a support column 49 installed at the center in the transport device 6, and the receiving position A It is arranged on the top. The charging device 36 holds and receives the polished semiconductor wafer 100 carried out by the carry-out robot 22 from the polishing device 2 into the transfer device 6, and then moves upward into the transfer tank 32 at the receiving position A. It has a charging mechanism 36a for charging from the bottom downward.

  Specifically, the loading mechanism 36a has a gripping portion 36b, and the peripheral portion of the semiconductor wafer 100 that has been transported in the horizontal direction in a vertical posture by the gripping portion 22a of the unloading robot 22. Is held by the holding part 36b from above and below, and the semiconductor wafer 100 is received from the unloading robot 22. Thereafter, the charging mechanism 36a descends to load the semiconductor wafer 100 in the transfer tank 32 while standing. The loading mechanism 36a repeats this operation to sequentially load a plurality of semiconductor wafers 100 into the transfer tank 32. After loading the previous semiconductor wafer 100, the next semiconductor wafer 100 is loaded. In this case, the semiconductor wafer 100 is slightly moved in the horizontal direction orthogonal to the advance direction of the carry-out robot 22 and the subsequent semiconductor wafer 100 is charged into the transfer tank 32 with a gap between the semiconductor wafer 100 and the previous semiconductor wafer 100. .

  The take-out device 38 takes the polished semiconductor wafers 100 one by one from the transfer tank 32 at the transfer position B out of the pair of transfer tanks 32, 32 and transfers them to the cleaning device 4. The take-out device 38 is provided on the other arm portion 49b of the pair of arm portions 49a and 49b, and is disposed on the delivery position B. The take-out device 38 holds the polished semiconductor wafer 100 in the transfer tank 32 at the delivery position B and takes it out upward, and then moves into the transfer device 6 from the cleaning device 4. And a take-out mechanism 38a for delivering the semiconductor wafer 100.

  Specifically, the take-out mechanism 38a has a gripping portion 38b. When the takeout mechanism 38a is lowered at the transfer position B, the gripping portion 38b is inserted into the transporting tub 32 at the position, and the inside of the transporting tub 32 is inserted. The peripheral portion of the semiconductor wafer 100 is gripped by the gripping portion 38b from above and below. Thereafter, the take-out mechanism 38a rises while holding the semiconductor wafer 100 and stops at a predetermined position, and in this state, the holding portion 24a of the loading robot 24 holds the peripheral portion of the semiconductor wafer 100 from both sides in the horizontal direction. As a result, the semiconductor wafer 100 is delivered.

  The liquid discharge device 40 performs a switching operation for discharging water in the transfer tank 32 after all the semiconductor wafers 100 in the transfer tank 32 are taken out at the delivery position B. Water is discharged in the process of moving from the delivery position B to the reception position A. As shown in FIG. 4, the liquid discharge device 40 includes an operation rod 40a, a support portion 40b, an operation rod drive portion 40c, and a lock mechanism 40d.

  The operation rod 40a is used to open and close the discharge hole 32f by the discharge cock 32e of the transport tank 32. One end of the operation rod 40a is connected to the discharge cock 32e.

  The support portion 40 b supports the operation rod 40 a so as to be swingable, and is attached to the bottom surface of the transport tank 32.

  The operation rod drive unit 40c performs the switching operation of the discharge cock 32e by pushing up the other end of the operation rod 40a and swinging the operation rod 40a. Two operation rod drive units 40c are provided, and the two operation rod drive units 40c and 40c are arranged on the inner side of the revolving body 34a corresponding to the delivery position B, as shown in FIG. Each is installed at a location corresponding to the receiving position A. The operation rod drive unit 40c on the delivery position B side abuts on the other end of the operation rod 40a attached to the transport tank 32 disposed at the delivery position B so as to be pushed up, while the operation rod on the reception position A side. The drive unit 40c abuts against the other end portion of the operation rod 40a attached to the transport tank 32 disposed at the receiving position A so as to be pushed up.

  The lock mechanism 40d temporarily fixes the posture of the operation rod 40a. The lock mechanism 40d is attached to the lower side surface of the transport tank 32, and the connection portion 40e connected to the other end side of the operation rod 40a from the support portion 40b, and the connection portion 40e downward. And a spring member 40f for repelling. The locking mechanism 40d temporarily fixes the connecting portion 40e at the position where the connecting portion 40e is pushed up once, and releases the temporary fixing when the connecting portion 40e is pushed up again, and the elastic force of the spring member 40f. The connecting portion 40e is configured to protrude downward.

  When the other end portion of the operation rod 40a is pushed up by the operation rod drive portion 40c on the delivery position B side, the operation rod 40a swings and the connection portion 40e is pushed up and discharged by one end portion of the operation rod 40a. The cock 32e is pulled down, and the connecting portion 40e and the operating rod 40a are temporarily fixed by the lock mechanism 40d in that posture. Thereafter, when the other end portion of the operation rod 40a is pushed up again by the operation rod drive portion 40c on the receiving position A side, the connection portion 40e is also pushed up again to be temporarily fixed and connected by the elastic force of the spring member 40f. The other end side of the portion 40e and the operation rod 40a is pushed down, and the discharge cock 32e is pushed up by one end portion of the operation rod 40a to close the discharge hole 32f of the transport tank 32.

  In the liquid discharge device 40, the operating rod drive units 40c and 40c are controlled by the control device 8, and all the semiconductor wafers 100 in the transfer tank 32 are transferred to the cleaning device 4 at the transfer position B. Thereafter, the discharge cock 32f is pulled down by the above-described operation of the operation rod drive unit 40c, the operation rod 40a, and the lock mechanism 40d on the delivery position B side, and the water in the transport tank 32 is discharged from the discharge hole 32f. Thereafter, the transfer tank 32 discharges water from the delivery position B to the reception position A while moving. When the transport tank 32 reaches the receiving position A, the discharge cock 32f is pushed up by the above-described operation of the operating rod drive unit 40c, the operating rod 40a, and the lock mechanism 40d on the receiving position A side, and the discharge hole of the transport tank 32 is discharged. 32f is blocked.

  The drainage receiving unit 42 receives pure water discharged from the transfer tank 32 by the liquid discharging device 40 in a path along which the transfer tank 32 moves from the delivery position B to the receiving position A. The drainage receiving portion 42 is provided along the inner periphery of the swivel body 34 a and is fixed to the gantry 48. The lower edge portion of the inclined portion 32h of the drainage guiding portion 32g is disposed on the drainage receiving portion 42, and the drainage guiding portion 32g moves from the delivery position B to the receiving position A together with the transport tank 32. Meanwhile, the pure water in the transport tank 32 flows down to the drainage receiving part 42 along the upper surface of the inclined part 32h of the drainage guiding part 32g.

  The liquid filling device 44 fills the transport tank 32 at the receiving position A with pure water. As shown in FIG. 5, the liquid filling apparatus 44 includes a supply unit 44a and an introduction unit 44b.

  The supply part 44a is a part for supplying pure water, and is fixed in a clean booth 46a described later. This supply part 44a has a connection part 44c movable up and down.

  The introduction portion 44b is attached to each transport tank 32. Pure water is introduced into each transport tank 32 from the bottom and overflowed from the top of the transport tank 32, so that pure water is introduced into the transport tank 32. It is filled with water. The introduction part 44b has a vertical pipe 44d, a connected part 44e, and a horizontal pipe 44f.

  The vertical pipe 44d is a pipe extending in the vertical direction on the side of the transfer tank 32. The connected portion 40e is provided at the upper end of the vertical pipe 44d, while the horizontal pipe 44f is connected to the lower end.

  The connected portion 44e is a portion connected to the connecting portion 44c of the supply portion 44a. The connected portion 44e is configured to be connected to the connecting portion 44c when the connecting portion 44c is lowered and pressed.

  As shown in FIG. 6, the horizontal pipe 44 f extends in the horizontal direction from the lower end of the vertical pipe 44 d through the lower side wall of the transfer tank 32 to the space in the transfer tank 32. A portion of the horizontal pipe 44f located in the transfer tank 32 is provided with a plurality of through holes penetrating inside and outside at the upper portion thereof, and the plurality of through holes are provided side by side in the longitudinal direction of the horizontal pipe 44f. It has been. When the connecting portion 44c is connected to the connected portion 44e and pure water is supplied from the supply portion 44a to the horizontal piping 44f through the vertical piping 44d, the pure water is ejected upward through the through hole of the horizontal piping 44f. And introduced into the transfer tank 32.

  The liquid filling device 44 is controlled by the control device 8 and is moved from the transfer position B to the receiving position A by the transfer tank moving mechanism 34 and drained by the liquid discharge apparatus 40 to be emptied. 32, the connecting portion 44c of the supply portion 44a is lowered and connected to the connected portion 44e of the introducing portion 44b attached to the transport tank 32, and the vertical piping 44d and the horizontal pipe 44d of the introducing portion 44b from the supplying portion 44a are connected. Pure water is introduced into the transfer tank 32 through the pipe 44f. The pure water is supplied from the upper part of the transfer tank 32 until it overflows, and when the overflow occurs, the supply of pure water is stopped and the connection between the connecting portion 44c and the connected portion 44e is released, so that the connecting portion 44c It is going to rise.

  The contamination prevention mechanism 46 is for preventing contamination of the semiconductor wafer 100 in the transfer device 6. As shown in FIGS. 1 and 2, the contamination prevention mechanism 46 includes a clean booth 46a, a clean filter unit 46b, a static eliminator 46c, and an exhaust device 46d.

  The clean booth 46a accommodates the devices, mechanisms, and members constituting the above-described transfer device 6 and isolates the internal space from the outside.

  The clean filter unit 46b is for introducing clean air into the clean booth 46a. The clean filter unit 46b is installed on the ceiling portion in the clean booth 46a.

  The neutralization device 46c performs neutralization to prevent the semiconductor wafer 100 from being charged in the clean booth 46a. By this charge removal, the adhesion of dust due to charging of the semiconductor wafer 100 is suppressed. The static eliminator 46c is installed on the ceiling in the clean booth 46a, like the clean filter unit 46b.

  The exhaust device 46d is for exhausting air from the clean booth 46a, and is attached to the lower side surface of the clean booth 46a. The air in the clean booth 46a is exhausted from the lower part by the exhaust device 46d, and clean air is introduced into the clean booth 46a from the upper part by the clean filter unit 46b, whereby the air in the clean booth 46a is clean. It is designed to be maintained in a state.

  The control device 8 controls the operation of each part of the polishing device 2, the cleaning device 4, and the transport device 6. The control device 8 charges the semiconductor wafer 100 being processed by the polishing device 2 into the transfer tank 32 at the receiving position A by the charging device 36 of the transfer device 6 after polishing the polishing device 2 when the cleaning device 4 stops abnormally. And control to store. Further, in response to the restart of the operation of the cleaning device 4 that has stopped abnormally, the control device 8 transfers the transfer tank 32 in which the semiconductor wafer 100 is stored at the receiving position A during the abnormal stop. While moving to a delivery position by the tank moving mechanism, the semiconductor wafers 100 stored in the transfer tank 32 are taken out in the order in which they are stored by the take-out device and transferred to the cleaning device.

  When the cleaning apparatus 4 is abnormally stopped, there is no place for the semiconductor wafers 100 being processed by the polishing apparatus 2, so that the semiconductor wafers 100 may be etched due to the alkali component of the abrasive and the contaminants may be fixed. There is. Therefore, in the present embodiment, when the cleaning device 4 is abnormally stopped, the semiconductor wafer 100 is stored in pure water in the transfer tank 32 of the transfer device 6 to store the progress of the etching or the We try to suppress the sticking of pollutants. When the cleaning device 4 returns, the processing order is prevented from being out of order by transferring the stored semiconductor wafers 100 to the cleaning device 4 in the stored order.

  Next, the operation of the semiconductor wafer processing apparatus according to the present embodiment will be described.

  In the semiconductor wafer processing apparatus according to the present embodiment, first, the surface polishing of the semiconductor wafer 100 is performed in the polishing apparatus 2. At this time, the four semiconductor wafers 100 as a set are attached to the rotating drum, the primary polishing table 16, the secondary polishing table 18, the polishing steps at the tertiary polishing table 20, and the polished semiconductor wafer 100. The peeling process from the rotating drum is performed in parallel, and a total of 20 semiconductor wafers 100 are processed simultaneously. The polished semiconductor wafers 100 are unloaded one by one by the unloading robot 22 to the transfer device 6.

  In the transport device 6, the liquid filling device 44 fills the transport tank 32 in the receiving position A with pure water. At this time, pure water is introduced into the transport tank 32 from the vicinity of the bottom thereof by the introduction part 44b of the liquid filling device 44, and is filled with pure water until it overflows from the upper edge 32a of the transport tank 32. Thereby, the contaminants remaining in the transfer tank 32 are discharged by the flow of water from the bottom to the top in the transfer tank 32.

  Then, the polished semiconductor wafers 100 unloaded from the polishing apparatus 2 are loaded one by one into the transfer tank 32 in a state where the transfer tank 32 is filled with pure water. At this time, the gripping portion 36b of the loading device 36 of the transfer device 6 is sandwiched from above and below the peripheral portion of the semiconductor wafer 100 held in a vertical position by the gripping portion 22a of the unloading robot 22 of the polishing apparatus 2. The semiconductor wafer 100 is received. Thereafter, the charging mechanism 36a of the charging device 36 is lowered to load the semiconductor wafer 100 into the transfer tank 32, and when released, the semiconductor wafer 100 is accommodated in the transfer tank 32 so as to be immersed in pure water. .

  The charging mechanism 36a moves up after charging the semiconductor wafer 100 into the transfer tank 32, and then receives the semiconductor wafer 100 that has been unloaded by the unloading robot 22 from the polishing apparatus 2 and receives the transfer tank in the same manner as described above. 32 is charged. The loading mechanism 36 a repeats this operation and loads the four semiconductor wafers 100 polished simultaneously by the polishing apparatus 2 into the transfer tank 32.

  Next, the revolving body 34a of the transport tank moving mechanism 34 is rotated by 180 °, and the pair of transport tanks 32 and 32 are moved between the receiving position A and the delivery position B so as to be interchanged. As a result, the transfer tank 32 containing the four semiconductor wafers 100 moves from the receiving position A to the transfer position B, while the empty transfer tank 32 moves from the transfer position B to the receiving position A.

  At the transfer position B, the take-out device 38 takes out the semiconductor wafers 100 in the transfer tank 32 one by one. Specifically, the take-out mechanism 38a of the take-out device 38 is lowered so that the gripping part 38b is inserted into the transfer tank 32, and the peripheral part of the semiconductor wafer 100 in the transfer tank 32 is sandwiched from above and below by the gripping part 38b. Grab. Thereafter, the semiconductor wafer 100 is taken out from the transfer tank 32 by raising the take-out mechanism 38a.

  Thereafter, the carry-in robot 24 advances from the cleaning device 4 into the transfer device 6 in the horizontal direction, and the gripping portion 24a of the carry-in robot 24 moves around the peripheral portion of the semiconductor wafer 100 gripped by the gripping portion 38b of the take-out device 38. Grab it from both sides in the horizontal direction. As a result, the semiconductor wafer 100 is delivered. The carry-in robot 24 that has received the semiconductor wafer 100 moves into the cleaning device 4 and sets the semiconductor wafer 100 in a cleaner not shown. At the delivery position B, these operations are repeated, so that the four semiconductor wafers 100 in the transfer tank 32 are delivered to the cleaning device 4 one by one. In the cleaning apparatus 4, various cleaning processes are performed on the semiconductor wafer 100, and then the semiconductor wafer 100 is stored in a storage cassette.

  In parallel with the delivery operation at the delivery position B, at the delivery position A, the semiconductor wafer 100 after polishing is loaded into the empty transport tank 32 that has moved. When the delivery of the four semiconductor wafers 100 at the delivery position B and the loading of the four semiconductor wafers 100 at the delivery position A are completed, the water in the transfer tank 32 at the delivery position B is discharged. The switching operation for this purpose is performed by the liquid discharge device 40. As a result, the discharge cock 32e at the bottom of the transfer tank 32 is pulled down, and the discharge of water in the transfer tank 32 is started from the discharge hole 32f.

  Thereafter, the revolving body 34a rotates again by 180 °, and moves between the delivery position B and the reception position A so that the two transfer tanks 32 and 32 are interchanged with each other. At this time, in the transfer tank 32 that moves from the delivery position B to the reception position A, the water in the inside is discharged while moving. This discharged water flows down on the inclined portion 32 h of the drainage guiding portion 32 g attached to the transport tank 32 and flows down to the drainage receiving portion 42. And it moves to the receiving position A, the discharge cock 32e is pushed up with respect to the conveyance tank 32 after water was discharged | emitted by the liquid discharge apparatus 40, and the discharge hole 32f is obstruct | occluded.

  Thereafter, after the pure water is filled in the transfer tank 32 at the receiving position A by the liquid filling device 44 in the same manner as described above, the four polished semiconductor wafers 100 unloaded from the polishing device 2 are loaded. At the same time, the semiconductor wafer 100 is taken out from the transfer tank 32 at the transfer position B and transferred to the cleaning device 4, and the series of operations described above are repeated.

  In the present embodiment, when the cleaning device 4 is abnormally stopped, the control device 8 detects the abnormal stop, and the 20 semiconductor wafers 100 being processed by the polishing device 2 at that time are loaded after the polishing. Is loaded into the transfer tank 32 at the receiving position A and stored.

  Specifically, the control device 8 detects that the cleaning device 4 has stopped abnormally due to a malfunction or the like, and transfers the 20 semiconductor wafers 100 being processed by the polishing device 2 with the carry-out robot 22 of the polishing device 2. The charging device 36 of the device 6 is caused to perform the same operation as the above-described unloading / charging operation. As a result, the 20 semiconductor wafers 100 are loaded one by one into the transfer tank 32 at the receiving position A and stored in the pure water. Therefore, the contamination of the semiconductor wafer 100 during the abnormal stop of the cleaning device 4 and the progress of etching due to the alkali component in the abrasive are avoided.

  Then, when the operation of the cleaning device 4 that has stopped abnormally is restarted, the control device 8 causes the transfer tank moving mechanism 34 to perform the replacement operation of the transfer tanks 32 and 32 accordingly, and the 20 semiconductors. The transfer tank 32 in which the wafer 100 is stored is moved to the delivery position B. Thereafter, the control device 8 takes out the semiconductor wafer 100 from the transfer tank 32 to the take-in robot 38 and the loading robot 24 of the cleaning device 4, transfers the semiconductor wafer 100, and enters the semiconductor wafer 100 cleaning device 4. The same operation as each operation of carrying in is performed. Thus, the 20 semiconductor wafers 100 in the transfer tank 32 are taken out in the order in which they are stored and transferred to the cleaning device 4.

  When the operation of the cleaning device 4 that has stopped abnormally is resumed between the polishing of the 20 semiconductor wafers 100 and the end of the loading into the transfer tank 32, the control device 8 The operation of temporarily loading the semiconductor wafer 100 into the transfer tank 32 at the receiving position A by the robot 22 and the charging device 36 is temporarily stopped, and the portion of the transfer into the transfer tank 32 at the receiving position A at that time is temporarily stopped. The semiconductor wafer 100 is transferred to the transfer position B by the transfer tank moving mechanism 34, and the semiconductor wafer 100 is transferred to the cleaning device 4 by the take-out device 38 and the carry-in robot 24.

  As described above, each operation in the semiconductor wafer processing apparatus of this embodiment is performed.

  As described above, in this embodiment, a plurality of semiconductor wafers 100 are simultaneously polished by the polishing apparatus 2 and the polished semiconductor wafers 100 are simultaneously transferred to the cleaning apparatus 4 by the transfer apparatus 6. Thus, the processing efficiency of the semiconductor wafer 100 can be improved as compared with the case where polishing, transporting and cleaning are performed for each semiconductor wafer.

  In this embodiment, since the semiconductor wafer 100 is transferred while the pair of transfer tanks 32 and 32 are interchanged between the receiving position A and the transfer position B in the transfer device 6, one transfer tank is transferred to and from the receiving position. Compared with the case where the semiconductor wafer 100 is transferred by reciprocating between the positions, the transfer efficiency of the semiconductor wafer 100 can be improved. Thereby, the processing efficiency of the semiconductor wafer 100 as the entire semiconductor wafer processing apparatus can be further improved.

  Furthermore, in this embodiment, when the cleaning apparatus 4 is abnormally stopped, the semiconductor wafer 100 being processed by the polishing apparatus 2 can be stored in pure water in the transfer tank 32 of the transfer apparatus 6 after polishing. When the apparatus 4 is abnormally stopped, the contamination of the plurality of semiconductor wafers 100 being processed by the polishing apparatus 2 can be prevented from adhering due to drying and the progress of etching due to the alkali component of the abrasive. As a result, it is possible to prevent many defective semiconductor wafers 100 from being generated due to the abnormal stop of the cleaning device 4, and to suppress a decrease in yield. Therefore, in this embodiment, it is possible to suppress a decrease in yield due to the abnormal stop of the cleaning device 4 while improving the processing efficiency of the semiconductor wafer 100.

  In the present embodiment, when the cleaning device 4 is abnormally stopped, all the semiconductor wafers 100 being processed by the polishing device 2 are stored in one transfer tank 32 after being polished. When the cleaning device 4 is restored as in the case of storing the wafers, the two transfer tanks 32, 32 are moved between the receiving position A and the delivery position B, and the semiconductor wafers 100 stored in the transfer tanks 32 are respectively cleaned. There is no need to perform control to be transferred to the device 4. For this reason, it is possible to simplify the control of transferring the stored semiconductor wafer 100 to the cleaning device 4 when the cleaning device 4 is restored.

  In the present embodiment, since the positioning device 35 is provided for positioning each transport tank 32 at the receiving position A and the delivery position B, respectively, the transport tank 32 is received by the positioning device 35 from the receiving position A and the delivery position. B can be accurately positioned, and it is possible to prevent a mistake in loading the semiconductor wafer 100 into the transfer tank 32 and a mistake in taking out the semiconductor wafer 100 from the transfer tank 32 due to the positional deviation.

  Further, in the present embodiment, the pair of transport tanks 32 and 32 are interchanged between the swivel body 34a in which the transport tank moving mechanism 34 supports the pair of transport tanks 32 and 32 and the receiving position A and the delivery position B. Thus, the pair of transport tanks 32 and 32 can be exchanged between the receiving position A and the delivery position B at the same time by simply rotating the turning body 34a. . For this reason, the structure of the conveyance tank moving mechanism 34 can be simplified compared with the case where the drive body for moving each of a pair of conveyance tanks 32 and 32 is provided in the conveyance tank movement mechanism 34 separately.

  Moreover, in this embodiment, since the conveyance apparatus 6 has the liquid filling apparatus 44 which fills the pure water in the conveyance tank 32 in the reception position A, when the conveyance tank 32 is arrange | positioned in the reception position A, the conveyance tank Unlike the case where the user replaces the water in the transport tank 32, the water in the transport tank 32 can be kept clean without increasing the work burden on the user. be able to.

  In the present embodiment, the liquid filling device 44 introduces pure water from the vicinity of the bottom into the transport tank 32 at the receiving position A, and overflows the pure water from the upper edge 32a of the transport tank 32 to transport the liquid. The tank 32 has an introduction portion 44b for filling pure water. Accordingly, since pure water flows from the bottom to the top in the transport tank 32, the contaminants remaining in the transport tank 32 can be effectively discharged to the outside by the pure water flow. For this reason, the water in the conveyance tank 32 can be kept in a cleaner state.

  In the present embodiment, the transfer device 6 performs a switching operation for discharging water in the transfer tank 32 at the transfer position B, and the transfer tank 32 moves from the transfer position B to the receive position A in the process. A liquid discharge device 40 that discharges water from the transfer tank 32 is provided. For this reason, since the movement of the transfer tank 32 and the discharge of the water from the transfer tank 32 can be performed in parallel, the transfer of the semiconductor wafer 100 can be performed as compared with the case where the water is discharged after the transfer tank 32 moves to the receiving position. Efficiency can be further improved. For this reason, the processing efficiency of the semiconductor wafer 100 in the semiconductor wafer processing apparatus can be further improved.

  Further, in the present embodiment, the transport device 6 includes the drainage receiving unit 42 that receives water discharged from the transport tank 32 along a path along which the transport tank 32 moves from the transfer position B to the receive position A. It is possible to prevent water discharged during the transfer process of the transfer tank 32 from leaking out of the transfer device 6.

  In the present embodiment, in response to the restart of the operation of the cleaning apparatus 4 that has stopped abnormally, the transfer tank 32 in which the semiconductor wafer 100 is stored is moved to the delivery position B, and the transfer tank 32 is moved. Since the semiconductor wafers 100 are taken out in the order in which they are stored and transferred to the cleaning device 4, it is possible to prevent the processing order of the semiconductor wafers 100 from being out of order due to the abnormal stop of the cleaning device 4.

  In the present embodiment, since the transfer device 6 includes the contamination prevention mechanism 46 including the clean booth 46a, the clean filter unit 46b, the charge removal device 46c, and the exhaust device 46d, the semiconductor wafer is contained in clean air inside the clean booth 46a. 100 can be transported and stored, and the neutralization device 46c can prevent the semiconductor wafer 100 from being charged and suppress dust from being drawn. Thereby, it is possible to prevent the surface of the semiconductor wafer 100 from being contaminated during the transfer process and the storage process in the transfer device 6.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and further includes meanings equivalent to the scope of claims for patent and all modifications within the scope.

  In the above embodiment, pure water is used as the liquid filling the transport tank 32, but other liquids may be used. For example, various functional waters such as ozone water having an effect of detaching the contaminants from the surface of the semiconductor wafer 100 may be appropriately selected and filled in the transfer tank 32. In this case, if the liquid filling device 44 is provided with a liquid switching mechanism for selecting a desired liquid from a plurality of types of liquids and filling the transport tank 32, the liquid filled in the transport tank 32 can be changed. It can be easily performed, and various liquids can be mixed and adjusted.

  Further, a liquid capable of neutralizing a component having an etching action in the abrasive may be used as the liquid. For example, when a polishing agent containing an alkaline liquid is used in the polishing apparatus 2 as in the above-described embodiment, an acidic liquid is filled in the transfer tank 32 instead of the pure water, and is being transferred in the transfer tank 32. In addition, the alkaline liquid adhering to the semiconductor wafer 100 during storage may be neutralized. Further, unlike the above embodiment, an acidic abrasive may be used in the polishing apparatus 2, and in this case, an alkaline liquid is filled in the transport tank 32, and the semiconductor is being transported and stored in the transport tank 32. The acidic abrasive attached to the wafer 100 may be neutralized.

  Moreover, in the said embodiment, although the case where the conveying apparatus 6 was equipped with only a pair of conveying tanks 32 and 32 was illustrated, the conveying apparatus 6 is equipped with not only a pair of conveying tanks 32 and 32 but many more conveying tanks. Also good. In this case, for example, the respective transport tanks are spaced apart from each other by a predetermined angle on the revolving body 34a of the transport tank moving mechanism 34, and the respective transport tanks are swung by the predetermined transport angle by the transport tank moving mechanism 34. However, the transfer tank may be exchanged between the receiving position A and the delivery position B so that the polished semiconductor wafer 100 is transferred or stored.

  Moreover, in the said embodiment, each conveyance tank 32 has the accommodation capacity which can accommodate the maximum number of semiconductor wafers 100 processed at once by the polishing apparatus 2, and when the cleaning apparatus 4 stops abnormally, the polishing apparatus The semiconductor wafer 100 being processed in 2 is stored only in one transfer tank 32, but the present invention is not limited to this configuration.

  That is, it is sufficient that the pair of transfer tanks have a capacity capable of accommodating the maximum number of semiconductor wafers 100 processed at a time by the polishing apparatus 2 in total, and the polishing is performed when the cleaning apparatus 4 is abnormally stopped. The semiconductor wafer 100 being processed by the apparatus 2 may be stored separately in both transfer tanks. In this case, when one of the transfer tanks is filled with the semiconductor wafers 100, it is preferable to replace both transfer tanks by the transfer tank moving mechanism 34 and store the remaining semiconductor wafers 100 in the other transfer tank. Then, when the operation of the cleaning device 4 is resumed, the semiconductor to the loading robot 24 by the take-out device 38 is moved while moving both transfer tanks so that the semiconductor wafers 100 are delivered to the cleaning device 4 in the order in which they are stored. It is preferable to control the wafer 100 to be delivered.

1 is a diagram schematically showing an overall configuration of a semiconductor wafer processing apparatus according to an embodiment of the present invention. It is the figure which looked at the inside of the conveyance apparatus of the semiconductor wafer processing apparatus shown in FIG. 1 from upper direction. It is the figure which looked at the inside of a conveying apparatus from the side. It is the figure which expanded and showed the structure of the conveyance tank vicinity in FIG. It is the figure which showed the state at the time of filling a liquid in a conveyance tank with a liquid filling apparatus. It is the longitudinal cross-sectional view which showed the introducing | transducing part of the conveyance tank and the liquid filling apparatus.

Explanation of symbols

2 Polishing device 4 Cleaning device 6 Transport device 8 Control device 22 Unloading robot (unloading device)
24 Carry-in robot (carry-in device)
32 Transport tank 34 Transport tank moving mechanism 34a Rotating body 34b Rotating mechanism 35 Positioning device 36 Loading device 36a Loading mechanism 38 Extracting device 38a Extracting mechanism 40 Liquid discharging device 42 Liquid drainage receiving portion 44 Liquid filling device 44b Introducing portion 46 Contamination prevention Mechanism 46a Clean booth 46b Clean filter unit 46c Static eliminator 46d Exhaust device 100 Semiconductor wafer A Reception position B Delivery position

Claims (11)

A semiconductor wafer processing apparatus for cleaning a semiconductor wafer after polishing the semiconductor wafer,
A polishing apparatus for simultaneously polishing a plurality of the semiconductor wafers;
A cleaning device for cleaning the semiconductor wafer polished by the polishing device;
A transfer device that is interposed between the polishing device and the cleaning device and simultaneously transfers the plurality of semiconductor wafers after polishing from the polishing device to the cleaning device;
A controller for controlling operations of the polishing apparatus, the cleaning apparatus, and the transport apparatus;
The transfer device contains a pair of transfer tanks for storing the semiconductor wafer after polishing so as to store the liquid therein and soaked in the liquid; a receiving position for receiving the semiconductor wafer after polishing from the polishing device; A transfer tank moving mechanism that moves the pair of transfer tanks to be exchanged with each other between a delivery position for delivering the polished semiconductor wafer to a cleaning device; and a transfer tank at the receiving position of the pair of transfer tanks A charging device for loading the polished semiconductor wafer received from the polishing device, and the cleaning of the paired transfer tanks from the transfer tank at the transfer position, and removing the polished semiconductor wafer Including a take-out device for delivery to the device,
The pair of transfer tanks has a capacity capable of accommodating a maximum number of the semiconductor wafers processed at a time by the polishing apparatus in total,
The control device is configured to store the semiconductor wafer being processed by the polishing apparatus in at least one of the pair of transfer tanks after polishing by the charging apparatus when the cleaning apparatus is abnormally stopped. Wafer processing equipment. Each of the transfer tanks has a storage capacity capable of storing the maximum number of the semiconductor wafers processed at one time by the polishing apparatus,
The control device stores the semiconductor wafer being processed by the polishing apparatus in one of the pair of transfer tanks after the polishing by polishing the semiconductor wafer being processed by the polishing apparatus when the cleaning apparatus abnormally stops. The semiconductor wafer processing apparatus according to claim 1, wherein   The semiconductor wafer processing apparatus according to claim 1, wherein the transfer device includes a positioning device for positioning the transfer tanks at the receiving position and the delivery position.   The transfer tank moving mechanism includes a revolving body that supports the pair of transfer tanks, and a pair of the pair of transfer tanks between the receiving position and the transfer position around an axis positioned between the receiving position and the transfer position. The semiconductor wafer processing apparatus of any one of Claims 1-3 containing the turning mechanism which rotates the said turning body so that a conveyance tank may mutually be replaced. The polishing apparatus has a carry-out device for carrying out the polished semiconductor wafer from the polishing apparatus to the transfer device in a horizontal direction,
The cleaning device has a carry-in device for horizontally receiving the polished semiconductor wafer transported by the transport device in advance in the transport device, and then carrying the semiconductor wafer into the cleaning device in a horizontal direction.
The charging device grips and receives the polished semiconductor wafer unloaded from the polishing device by the unloading device, and then loads it into the transfer tank at the receiving position from above to below. Has an input mechanism,
The take-out device grips and removes the polished semiconductor wafer in the transfer tank at the transfer position, and then transfers it from the cleaning device to the carry-in device that has advanced into the transfer device. The semiconductor wafer processing apparatus of any one of Claims 1-4 which has a mechanism.   The semiconductor wafer processing apparatus according to claim 1, wherein the transfer device includes a liquid filling device that fills the liquid into the transfer tank at the receiving position.   The liquid filling apparatus introduces the liquid into the transport tank at the receiving position by introducing the liquid from near the bottom and overflowing the liquid from the top of the transport tank. The semiconductor wafer processing apparatus of Claim 6 which has a part.   The transfer device performs a switching operation for discharging the liquid in the transfer tank at the transfer position, and discharges the liquid from the transfer tank in the process of moving the transfer tank from the transfer position to the receive position. The semiconductor wafer processing apparatus of any one of Claims 1-7 containing the liquid discharge apparatus to be made.   The semiconductor wafer processing according to claim 8, wherein the transfer device includes a drainage receiving unit that receives the liquid discharged from the transfer tank along a path along which the transfer tank moves from the delivery position to the receiving position. apparatus.   The control device moves the transfer tank storing the semiconductor wafer to the transfer position by the transfer tank moving mechanism in response to the operation of the cleaning apparatus that has been abnormally stopped being restarted, and 10. The semiconductor wafer processing apparatus according to claim 1, wherein the semiconductor wafers stored in the transfer tank are taken out by the take-out device in the order in which the semiconductor wafers are stored and passed to the cleaning device. The transfer device includes a contamination prevention mechanism for preventing contamination of the polished semiconductor wafer in the transfer device,
The contamination prevention mechanism includes a clean booth that houses the pair of transfer tanks, the transfer tank moving mechanism, the charging device, and the take-out device, and a clean filter unit for introducing clean air into the clean booth, 11. The apparatus according to claim 1, further comprising: a static eliminator for preventing charging of the semiconductor wafer after polishing in the clean booth, and an exhaust device for discharging air from the clean booth. Semiconductor wafer processing equipment.

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