JP4787593B2 - Semiconductor device - Google Patents

Description

  The present invention relates to a semiconductor device and a manufacturing method thereof.

  In recent years, in the field of semiconductor devices, high speed and low power consumption have been advanced by rapid miniaturization. For this reason, improvement in transistor capability is an urgent task, but it is becoming impossible to improve the capability only by miniaturization. Therefore, there are increasing cases of improving the performance with new technologies such as applying stress to the channel region of the MIS transistor.

  FIG. 26 is a cross-sectional view showing a conventional structure in which a film having stress is formed on a MIS transistor. In the structure shown in FIG. 26, the N-channel MIS transistor 201 is covered with an LP-CVD (Low Pressure-Chemical Vapor Deposition) film 203 that generates a tensile stress, and the P-channel MIS transistor 202 is a plasma CVD film that generates a compressive stress. By covering with 204, the capability of each MIS transistor is improved (see, for example, Patent Document 1).

FIG. 27 is a plan view showing a conventional arrangement of transistors constituting the SRAM. As shown in FIG. 27, in the conventional SRAM, the width (channel width) of the active region 303 of the access transistor TrA is formed narrower than the width of the active region 304 of the drive transistor TrD. In such a structure, the malfunction of the SRAM can be suppressed by making the capability of the drive transistor TrD higher than that of the access transistor TrA.
JP 2003-273240 A

  However, as described above, the method of providing a difference between the width of the active region 303 of the access transistor TrA and the width 304 of the active region of the drive transistor TrD has a problem that the layout is limited. In addition, when the layout is shifted in a lithography process or the like at the time of manufacture, there is a problem that the gate length and the channel width cannot be adjusted to desired values, and on the contrary, the transistor characteristics vary greatly. If a large manufacturing margin is taken to prevent this, there arises a problem that the cells cannot be miniaturized.

  Such a problem does not occur only in the transistors constituting the SRAM, but occurs when the capability of any transistor formed on the wafer needs to be adjusted.

  Accordingly, an object of the present invention is to adjust the driving force of each transistor by a film formed on the MIS transistor.

  A semiconductor device according to a first aspect of the present invention is formed on a first gate insulating film formed on a first active region which is a part of a semiconductor layer, and on the first gate insulating film. A first gate electrode formed in the first active region and an N-type first source / drain region formed in a region of the first active region located on a side of the first gate electrode. A MIS transistor; a first insulating film having compressive stress covering the first source / drain region and the first gate electrode; and an interlayer insulating film covering the upper portion of the first insulating film. Prepare.

  According to the semiconductor device of the first aspect of the present invention, the first insulating film having compressive stress can reduce the capability of the N-type first MIS transistor. This makes it possible to adjust the driving power of other transistors.

  In the semiconductor device according to the first aspect of the present invention, a second gate insulating film formed on a second active region which is a part of the semiconductor layer, and on the second gate insulating film A second gate electrode formed and a second source / drain region of N type formed in a region of the second active region located on the side of the second gate electrode. And a second insulating film having a tensile stress covering the second source / drain region and the second gate electrode. In this case, the driving capability of the second MIS transistor can be improved by forming the second insulating film having a tensile stress on the N-type second MIS transistor. That is, since the driving power of the first MIS transistor can be reduced and the driving power of the second MIS transistor can be improved, the driving power of the two transistors can be adjusted.

  In the semiconductor device according to the first aspect of the present invention, a third gate insulating film formed on a third active region which is a part of the semiconductor layer, and on the third gate insulating film A third gate electrode formed in the third active region and a P-type third source / drain region formed in a region located on a side of the third gate electrode in the third active region; The MIS transistor may be further provided.

  In the semiconductor device of the first aspect of the present invention, the third source / drain region and the third gate electrode may be covered with a third insulating film having a compressive stress.

  In the semiconductor device according to the first aspect of the present invention, the first insulating film having a compressive stress and the insulating film having a tensile stress are disposed above the first source / drain region and the first gate electrode. A laminated film is formed, and an insulating film having a compressive stress may not be formed above the second source / drain region and the second gate electrode. Also in this case, the driving force of the first MIS transistor can be made lower than that of the second MIS transistor.

  In the semiconductor device of the first aspect of the present invention, a film having a tensile stress is not formed on the first source / drain region and the first gate electrode, and the second source / drain A stacked film of the second insulating film having tensile stress and the insulating film having compressive stress may be formed on the region and the second gate electrode. Also in this case, the driving force of the first MIS transistor can be made lower than that of the second MIS transistor.

  In the semiconductor device according to the first aspect of the present invention, the first MIS transistor is an SRAM access transistor, the second MIS transistor is an SRAM drive transistor, and the third MIS transistor is an SRAM transistor. It may be a load transistor. In this case, since the drive capability of the access transistor can be made lower than that of the drive transistor, malfunction of the SRAM can be reliably suppressed.

  In the semiconductor device according to the first aspect of the present invention, the first MIS transistor may be a transistor constituting an SRAM, and the second MIS transistor may be a transistor constituting a logic unit.

  In addition, when the first N-type MIS transistor is a transistor constituting an SRAM and the second N-type MIS transistor is a transistor constituting a logic portion, the first N-type MIS transistor is a part of the semiconductor layer. A fourth gate insulating film formed on the fourth active region; a fourth gate electrode formed on the fourth gate insulating film; and the fourth of the fourth active regions. A fourth MIS transistor having a P-type fourth source / drain region formed in a region located on the side of the gate electrode, and a fifth active region which is a part of the semiconductor layer. A fifth gate insulating film formed thereon; a fifth gate electrode formed on the fifth gate insulating film; and a side of the fifth gate electrode in the fifth active region. P type formed in the region located in A fifth MIS transistor having a fifth source / drain region; a fourth insulating film having compressive stress covering the fourth source / drain region and the fourth gate electrode; 5 and a fifth insulating film having a tensile stress covering the source / drain regions and the fifth gate electrode, and the fourth MIS transistor is a transistor constituting a logic unit, The fifth MIS transistor may be a transistor constituting an SRAM.

  A semiconductor device according to a second aspect of the present invention is formed on a first gate insulating film formed on a first active region which is a part of a semiconductor layer, and on the first gate insulating film. And a P-type first source / drain region formed in a region of the first active region located on a side of the first gate electrode. A MIS transistor; a first insulating film having a tensile stress covering the first source / drain region and the first gate electrode; and an interlayer insulating film covering the upper portion of the first insulating film. Prepare.

  According to the semiconductor device of the second aspect of the present invention, the capability of the P-type first MIS transistor can be reduced by the second insulating film having tensile stress. This makes it possible to adjust the driving power of other transistors.

  According to a first aspect of the present invention, there is provided a method of manufacturing a semiconductor device comprising: a first gate insulating film formed on a first active region that is a part of a semiconductor layer; and the first gate insulating film. A first gate electrode formed on the first active region; and an N-type first source / drain region formed in a region of the first active region located on a side of the first gate electrode. A method of manufacturing a semiconductor device including a first MIS transistor, the step (a) of forming a first insulating film having a compressive stress above the first source / drain region and the gate electrode; And (b) forming an interlayer insulating film above the first insulating film.

  In the manufacturing method of the first aspect of the present invention, the ability of the N-type first MIS transistor can be reduced by forming the first insulating film having compressive stress. This makes it possible to adjust the driving power of other transistors.

  In the manufacturing method according to the first aspect of the present invention, the semiconductor device includes a second gate insulating film formed on a second active region which is a part of the semiconductor layer, and the second gate. A second gate electrode formed on the insulating film; and an N-type second source / drain region formed in a region of the second active region located on a side of the second gate electrode. And a second insulating film having a tensile stress above the second source / drain region and the second gate electrode before the step (b). You may further provide the process (c) to form. In this case, the driving capability of the second MIS transistor can be improved by forming the second insulating film having a tensile stress on the N-type second MIS transistor. That is, since the driving power of the first MIS transistor can be reduced and the driving power of the second MIS transistor can be improved, the driving power of the two transistors can be adjusted.

  In the manufacturing method according to the first aspect of the present invention, the semiconductor device includes a third gate insulating film formed on a third active region which is a part of the semiconductor layer, and the third gate. A third gate electrode formed on the insulating film, and a P-type third source / drain region formed in a region of the third active region located on the side of the third gate electrode. A third MIS transistor having the above may be further included.

  The manufacturing method according to the first aspect of the present invention may further include a step of forming a third insulating film having a compressive stress above the third source / drain region and the third gate electrode. .

  In the manufacturing method according to the first aspect of the present invention, in the step (a), the insulating film having tensile stress with the first insulating film above the first source / drain regions and the first gate electrode. In the step (c), only the second insulating film may be formed above the second source / drain regions and the second gate electrode. Also in this case, the driving force of the first MIS transistor can be made lower than that of the second MIS transistor.

  In the manufacturing method of the first aspect of the present invention, in the step (a), only the first insulating film is formed above the first source / drain regions and the first gate electrode, and the step In (c), a laminated film of the second insulating film and an insulating film having compressive stress may be formed above the second source / drain region and the second gate electrode. Also in this case, the driving force of the first MIS transistor can be made lower than that of the second MIS transistor.

  In the manufacturing method of the first aspect of the present invention, the first MIS transistor is an SRAM access transistor, the second MIS transistor is an SRAM drive transistor, and the third MIS transistor is an SRAM transistor. It may be a load transistor.

  In the manufacturing method of the first aspect of the present invention, the first MIS transistor may be a transistor constituting an SRAM, and the second MIS transistor may be a transistor constituting a logic unit.

  In the case where the first MIS transistor is a transistor constituting an SRAM and the second MIS transistor is a transistor constituting a logic part, the semiconductor device is a part of the semiconductor layer. A fourth gate insulating film formed on the fourth active region; a fourth gate electrode formed on the fourth gate insulating film; and the fourth gate electrode of the fourth active region. A fourth MIS transistor forming a logic portion having a P-type fourth source / drain region formed in a region located on a side of the gate electrode; and a first MIS transistor which is a part of the semiconductor layer. A fifth gate insulating film formed on the fifth active region; a fifth gate electrode formed on the fifth gate insulating film; and the fifth gate insulating film formed on the fifth active region. Beside the gate electrode And a fifth MIS transistor constituting an SRAM having a P-type fifth source / drain region formed in the region to be placed, and before the step (b), the fourth source / drain region is provided. A step of forming a fourth insulating film having compressive stress above the drain region and the fourth gate electrode; and before the step (b), the fifth source / drain region and the fifth gate electrode And a step of forming a fifth insulating film having a tensile stress above the gate electrode.

  According to a second aspect of the present invention, there is provided a method for manufacturing a semiconductor device comprising: a first gate insulating film formed on a first active region which is a part of a semiconductor layer; and the first gate insulating film. A first gate electrode formed thereon; and a P-type first source / drain region formed in a region of the first active region located on a side of the first gate electrode. A method of manufacturing a semiconductor device having a first MIS transistor, comprising: forming a first insulating film having a tensile stress above the first source / drain region and the first gate electrode (a And a step (b) of forming an interlayer insulating film covering the upper side of the first insulating film.

  According to the manufacturing method of the second aspect of the present invention, the ability of the P-type first MIS transistor can be reduced by the second insulating film having tensile stress. This makes it possible to adjust the driving power of other transistors.

  According to the semiconductor device and the manufacturing method thereof of the present invention, it becomes possible to adjust the driving force of the MIS transistor.

  Hereinafter, a semiconductor device and a manufacturing method thereof according to the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 1 is a sectional view showing the structure of a semiconductor device according to the first embodiment of the present invention. As shown in FIG. 1, in the semiconductor device of the present embodiment, an SRAM load area SL for forming an SRAM load transistor, an SRAM drive area SD for forming an SRAM drive transistor, and an SRAM access area SA for forming an SRAM access transistor. Is arranged. The regions SL, SD, SA are electrically isolated from each other by the shallow trench element isolation 2.

  In the SRAM load region SL, a gate electrode 12 is formed on the semiconductor substrate 1 with a gate insulating film 11 interposed therebetween. An offset sidewall 13a and a sidewall 13b disposed outside the offset sidewall 13a are formed on the side surface of the gate electrode 12. A P-type extension region 14 is formed in a region of the semiconductor substrate 1 located below the offset sidewall 13a and the sidewall 13b, and an N-type pocket region 15 is formed in a region located under the P-type extension region 14. Is formed. A P-type source / drain region 16 is formed in a region of the semiconductor substrate 1 located outside the sidewall 13b. A silicide layer 17 is formed on the gate electrode 12 and the P-type source / drain region 16.

  In the SRAM drive region SD, a gate electrode 22 is formed on the semiconductor substrate 1 and on the semiconductor substrate 1 with a gate insulating film 21 interposed therebetween. An offset sidewall 23a and a sidewall 23b disposed outside the offset sidewall 23a are formed on the side surface of the gate electrode 22. In the semiconductor substrate 1, an N-type extension region 24 is formed in a region located under the offset sidewall 23 a and the sidewall 23 b, and a P-type pocket region 25 is formed in a region located under the N-type extension region 24. Has been. An N-type source / drain region 26 is formed in a region of the semiconductor substrate 1 located outside the sidewall 23b. A silicide layer 27 is formed on the gate electrode 22 and the N-type source / drain region 26.

  In the SRAM access area SA, a gate electrode 32 is formed on the semiconductor substrate 1 with a gate insulating film 31 interposed therebetween. On the side surface of the gate electrode 32, an offset sidewall 33a and a sidewall 33b disposed outside the offset sidewall 33a are formed. An N-type extension region 34 is formed in a region of the semiconductor substrate 1 located below the sidewall 33b, and a P-type pocket region 35 is formed in a region located under the N-type extension region 34. An N-type source / drain region 36 is formed in a region of the semiconductor substrate 1 located outside the sidewall 33b. A silicide layer 37 is formed on the gate electrode 32 and the N-type source / drain region 36.

  On the shallow trench isolation 2 surrounding the periphery of the SRAM load region SL, a gate wiring 42, a silicide layer 47 provided on the upper surface of the gate wiring 42, and an offset side provided on the side surface of the gate wiring 42 A wall 43a and a side wall 43b provided on the side surface of the offset side wall 43a are formed. The gate wiring 42 is formed by extending a film common to the gate electrode of another adjacent transistor (not shown) in the SRAM to the top of the shallow trench isolation 2.

  Then, the tensile stress formed by the LP-CVD method is applied on the gate electrode 12 and the P-type source / drain region 16 in the SRAM load region SL and on the gate electrode 22 and the N-type source / drain region in the SRAM drive region SD. An insulating film 50 to be generated (an insulating film that generates tensile stress is hereinafter referred to as a “tensile stress-containing insulating film”) 50 is formed. Note that the stress in this specification means a stress applied to the gate length direction of the channel region located under the gate electrode. Therefore, the tensile stress-containing insulating film in this specification means an insulating film that generates a tensile stress in the gate length direction of the channel region located under the gate electrode.

  On the other hand, on the gate electrode 32 and the N-type source / drain region 36 in the SRAM access region SA, a tensile stress-containing insulating film 50 and a compressive stress formed thereon by plasma-CVD are generated. An insulating film 51 (hereinafter referred to as “compressive stress-containing insulating film”) 51 is formed. The compressive stress-containing insulating film in this specification means an insulating film that generates compressive stress in the gate length direction of the channel region located under the gate electrode. In the structure of this embodiment, the tensile stress-containing insulating film 50 and the compressive stress-containing insulating film 51 may be stacked in the reverse order.

  In each region SL, SD, SA, the compressive stress-containing insulating film 51 and the tensile stress-containing insulating film 50 are covered with the interlayer insulating film 3. In each of the regions SL, SD, and SA, a contact 4 that reaches the silicide layers 17, 27, and 37 through the interlayer insulating film 3, the compressive stress-containing insulating film 51, and the tensile stress-containing insulating film 50 is formed. Yes. Further, in the SRAM load region SL and the gate wiring 42 formation region, the silicide layer 17 and the gate wiring 42 on the P-type source / drain region 16 are formed through the interlayer insulating film 3 and the tensile stress-containing insulating film 50. A shared contact 5 is formed so as to contact the upper silicide layer 47.

  Next, the manufacturing method of the semiconductor device in the present embodiment will be described with reference to FIGS. 2 (a) to 5 (b). FIG. 2A to FIG. 5B are cross-sectional views illustrating the manufacturing steps of the semiconductor device according to the first embodiment.

  In the manufacturing method of this embodiment, first, the following steps are performed to obtain the structure shown in FIG. First, the gate insulating films 11, 21 are formed on the active regions including the semiconductor substrate 1 in the SRAM load region SL, the SRAM drive region SD, and the SRAM access region SA partitioned by the shallow trench element isolation 2 formed in the semiconductor substrate 1. 31 and gate electrodes 12, 22, 32 are formed. At the same time, the gate wiring 42 is formed on the shallow trench element isolation 2. Next, offset sidewalls 13a, 23a, 33a, and 43a are formed on the side surfaces of the gate electrodes 12, 22, and 32 and the gate wiring.

Subsequently, for example, arsenic ions, which are N-type impurities, are applied to the SRAM drive region SD and the SRAM access region SA using the gate electrodes 22 and 32 and the offset sidewalls 23a and 33a as masks, an acceleration energy of 3 KeV, and a dose of 1.5. Implantation is performed under the conditions of × 10 ¹⁵ / cm ² and a TILT angle of 0 degree to form N-type extension regions 24 and 34. Next, for example, boron ions which are P-type impurities are implanted four times under the conditions of an acceleration energy of 10 KeV, a dose of 8.0 × 10 ¹² ions / cm ² , and a TILT angle of 25 degrees (implanted from four directions by rotating the wafer). P-type pocket regions 25 and 35 are formed. The P-type pocket regions 25 and 35 are formed so as to cover the bottom surfaces of the N-type extension regions 24 and 34.

Next, in the SRAM load region SL, with the gate electrode 12 and the offset sidewall 13a as a mask, for example, boron ions, which are P-type impurities, are accelerated energy 0.5 KeV, dose amount 3.0 × 10 ¹⁴ ions / cm ^2. Then, implantation is performed under the condition of a TILT angle of 0 degree to form a P-type extension region 14. Next, for example, phosphorus ions which are N-type impurities are implanted four times under the conditions of an acceleration energy of 30 KeV, a dose of 7.0 × 10 ¹² ions / cm ² , and a TILT angle of 25 degrees to form the N-type pocket region 15. The N-type pocket region 15 is formed so as to cover the bottom surface of the P-type extension region 14.

Next, after a silicon nitride film is formed on the entire surface of the substrate, the silicon nitride film is etched by an etch-back method, so that the offset sidewalls 13a, Sidewalls 13b, 23b, 33b, 43b are formed through 23a, 33a, 43a. Thereafter, for example, arsenic ions, which are N-type impurities, are applied to the SRAM drive region SD and the SRAM access region SA by using the gate electrodes 22 and 32, the offset sidewalls 23a and 33a, and the sidewalls 23b and 33b as an acceleration energy of 20 KeV, Implantation is performed under the conditions of a dose of 4.0 × 10 ¹⁵ pieces / cm ² and a TILT angle of 0 degree. Further, for example, phosphorus ions, which are N-type impurities, are implanted under the conditions of an acceleration energy of 10 KeV, a dose amount of 1.0 × 10 ¹⁵ ions / cm ² , and a TILT angle of 7 degrees to form N-type source / drain regions 26, 36. Form.

Next, in the SRAM load region SL, the gate electrode 12, the offset sidewall 13a and the sidewall 13b are used as a mask, for example, boron ions which are P-type impurities are accelerated energy 2 KeV, dose amount 4.0 × 10 ¹⁵ / Implantation is performed under conditions of cm ² and a TILT angle of 7 degrees to form a P-type source / drain region 16.

  Next, the silicide layers 17, 27, 37, 47 are selectively formed on each gate electrode 12, 22, 32, on the gate wiring 42 and on the source / drain regions 16, 26, 36 by using salicide technology. To form. Through the above steps, the structure shown in FIG. 2A is obtained.

  Next, in the step shown in FIG. 2B, a tensile stress-containing insulating film 50 made of a silicon nitride film that generates tensile stress formed by the LP-CVD method is formed on the entire surface of the substrate.

  Next, in the step shown in FIG. 3A, a compressive stress-containing insulating film 51 made of a silicon nitride film that generates compressive stress formed by the plasma CVD method is formed on the entire surface of the substrate.

  Next, in the step shown in FIG. 3B, the SRAM load area SL and the SRAM drive area SD are opened, and a first mask 52 made of resist covering the SRAM access area SA is formed. Thereafter, etching is performed using the first mask 52 as an etching mask to etch off the compressive stress-containing insulating film 51 in the SRAM load region SL and the SRAM drive region SD.

  Next, in the step shown in FIG. 4A, the first mask 52 is removed. At this point, in the SRAM access area SA, the compressive stress-containing insulating film 51 and the tensile stress-containing insulating film 50 are present in a stacked manner. On the other hand, only the tensile stress-containing insulating film 50 exists in the SRAM load area SL and the SRAM drive area SD.

  Next, in the step shown in FIG. 4B, an interlayer insulating film 3 made of an oxide film is formed on the entire substrate.

  Next, in the step shown in FIG. 5A, the silicide layers 17, 27 penetrate the regions SL, SD, SA through the interlayer insulating film 3, the compressive stress-containing insulating film 51 and the tensile stress-containing insulating film 50. , 37 is formed. In addition, the SRAM load region SL and the gate wiring 42 formation region penetrate the interlayer insulating film 3 and the tensile stress-containing insulating film 50 and above the silicide layer 17 on the P-type source / drain region 16 and the gate wiring 42. A shared contact hole 5a reaching the silicide layer 47 is formed.

  Next, in the step shown in FIG. 5B, the buried contact 4 and the shared contact 5 are formed in the contact hole 4a and the shared contact hole 5a. The buried contact 4 and the shared contact 5 are constituted by a barrier film such as TiN and a metal film such as tungsten. The semiconductor device of this embodiment is formed by the above process.

  According to the semiconductor device of this embodiment, the access transistor is covered with the tensile stress-containing insulating film 50 and the compressive stress-containing insulating film 51, and the drive transistor is covered with the tensile stress-containing insulating film 50. Since these transistors are N-type MIS transistors, the driving force is improved when a tensile stress is applied to the channel, and the driving force is reduced when a compressive stress is applied. In the present embodiment, since the SRAM drive region SD is covered with the tensile stress-containing insulating film 50, the drive power of the drive transistor is improved. On the other hand, since the SRAM access area SA is composed of the compressive stress-containing insulating film 51 and the tensile stress-containing insulating film 50 but is covered with a laminated film, the tensile stress of the tensile stress-containing insulating film 50 is reduced by the compressive stress-containing insulating film 51. Therefore, the drive power of the access transistor cannot be improved as compared with the drive transistor. Therefore, the driving power of the access transistor can be made lower than the driving power of the drive transistor. Therefore, malfunction of the SRAM can be suppressed and the noise margin can be improved.

  In the present embodiment, the case where the access transistor and the drive transistor are N-type MIS transistors has been described. However, the access transistor and the drive transistor may be P-type MIS transistors. In this case, the access transistor may be covered with a laminated film of a tensile stress-containing insulating film and a compressive stress-containing insulating film, and the drive transistor may be covered only with the compressive stress-containing insulating film. In the P-type MIS transistor, the driving force is improved when compressive stress is applied to the channel, and the driving force is reduced when tensile stress is applied. Therefore, in this case as well, the drive capability of the access transistor can be made lower than that of the drive transistor.

  In the present embodiment, the compressive stress-containing insulating film 51 is formed on the tensile stress-containing insulating film 50 in the access transistor formation region SA, but the order of stacking these may be reversed.

(Second Embodiment)
FIG. 6 is a cross-sectional view showing the structure of the semiconductor device according to the second embodiment of the present invention. In the semiconductor device of this embodiment, a compressive stress-containing insulating film made of a silicon nitride film that generates compressive stress is formed on the gate electrode 32 and the N-type source / drain region 36 in the SRAM access region SA by the plasma CVD method. Only 61 is formed. Since the other structure is the same as that of the first embodiment, detailed description thereof is omitted.

  Next, a method for manufacturing a semiconductor device according to the present embodiment will be described with reference to FIGS. 7 (a) to 10 (b). FIG. 7A to FIG. 10B are cross-sectional views illustrating the manufacturing steps of the semiconductor device according to the second embodiment of the present invention.

  In the manufacturing method of this embodiment, the structure shown in FIG. 7A is formed using the same method as that described in the first embodiment.

  Next, in a step shown in FIG. 7B, a tensile stress-containing insulating film 60 made of a silicon nitride film that generates tensile stress formed by the LP-CVD method is formed on the entire surface of the substrate.

  Next, in a step shown in FIG. 8A, a first mask 62 made of a resist is formed on the substrate so as to cover the SRAM load area SL and the SRAM drive area SL and open the SRAM access area SA. Thereafter, etching is performed using the first mask 62 as an etching mask to etch off the tensile stress-containing insulating film 60 in the SRAM access region SA.

  Next, in the step shown in FIG. 8B, after the first mask 62 is removed, a compressive stress-containing insulation made of a silicon nitride film that generates compressive stress formed on the entire surface of the substrate by the plasma CVD method. A film 61 is formed.

  Next, in the step shown in FIG. 9A, a second mask 63 made of resist is formed on the substrate to cover the SRAM access area SA and open the SRAM drive area SD and SRAM load area SL. Thereafter, etching is performed using the second mask 63 as an etching mask to etch off the compressive stress-containing insulating film 61 in the SRAM drive region SD and the SRAM load region SL.

  Next, in the step shown in FIG. 9B, the second mask 63 is removed. At this time, the compressive stress-containing insulating film 61 exists in the SRAM access area SA, and the tensile stress-containing insulating film 60 exists in the SRAM load area SL and the SRAM drive area SD.

  Next, in the step shown in FIG. 10A, after an interlayer insulating film 3 made of an oxide film is formed on the entire surface of the substrate, the interlayer insulating film 3 and the tensile stress-containing insulating film are formed using a lithography method and an etching method. 50, the compressive stress-containing insulating film 51 is etched to form contact holes 4a and shared contact holes 5a that reach the silicide layers 17, 27, 37, and 47.

  Next, in the step shown in FIG. 10B, the buried contact 4 and the shared contact 5 are formed in the contact hole 4a and the shared contact hole 5a. The buried contact 4 and the shared contact 5 are constituted by a barrier film such as TiN and a metal film such as tungsten. The semiconductor device of this embodiment is formed by the above process.

  According to the semiconductor device of this embodiment, the access transistor is covered with the compressive stress-containing insulating film 61, and the drive transistor is covered with the tensile stress-containing insulating film 60. Since these transistors are N-type MIS transistors, the driving force is improved when a tensile stress is applied to the channel, and the driving force is reduced when a compressive stress is applied. Therefore, the driving power of the access transistor can be made lower than the driving power of the drive transistor. Therefore, malfunction of the SRAM can be suppressed and the noise margin can be improved.

  In the present embodiment, the case where the access transistor and the drive transistor are N-type MIS transistors has been described. However, the access transistor and the drive transistor may be P-type MIS transistors. In this case, the access transistor may be covered with a tensile stress-containing insulating film, and the drive transistor may be covered with a compressive stress-containing insulating film. In the P-type MIS transistor, the driving force is improved when compressive stress is applied to the channel, and the driving force is reduced when tensile stress is applied. Therefore, in this case as well, the drive capability of the access transistor can be made lower than that of the drive transistor.

(Third embodiment)
FIG. 11 is a cross-sectional view showing the structure of the semiconductor device according to the third embodiment of the present invention. As shown in FIG. 11, in the semiconductor device of this embodiment, on the gate electrode 12 and the source / drain region 16 in the SRAM load region SL and on the gate electrode 32 and the source / drain region 36 in the SRAM access region SA, Only the compressive stress-containing insulating film 70 made of a silicon nitride film that generates compressive stress formed by the plasma CVD method is formed. Further, a compressive stress-containing insulating film 70 made of a silicon nitride film that generates compressive stress formed by the plasma CVD method on the gate electrode 22 and the source / drain region 26 in the SRAM drive region SD, and an LP-CVD method. A laminated film is formed with a tensile stress-containing insulating film 71 made of a silicon nitride film that generates the formed tensile stress. Since the other structure is the same as that of the first embodiment, detailed description thereof is omitted.

  Next, a method for manufacturing a semiconductor device according to the present embodiment will be described with reference to FIGS. 12 (a) to 15 (b). FIG. 12A to FIG. 15B are cross-sectional views illustrating the manufacturing steps of the semiconductor device according to the third embodiment of the present invention.

  In the manufacturing method of the present embodiment, the structure shown in FIG. 12A is formed by using a method similar to the method described in the first embodiment.

  Next, in a step shown in FIG. 12B, a compressive stress-containing insulating film 70 made of a silicon nitride film that generates compressive stress formed by the plasma CVD method is formed on the entire surface of the substrate.

  Next, in a step shown in FIG. 13A, a tensile stress-containing insulating film 71 made of a silicon nitride film that generates tensile stress is formed on the compressive stress-containing insulating film 70 by the LP-CVD method.

  Next, in the step shown in FIG. 13B, a first mask 72 made of resist is formed to cover the SRAM drive area SD and expose the SRAM load area SL and the SRAM access area.

  Next, in the step shown in FIG. 14A, the tensile stress-containing insulating film 71 in the SRAM load region SL and the SRAM access region SA is removed by performing etching using the first mask 72 as an etching mask.

  Next, in the step shown in FIG. 14B, the first mask 72 is removed. At this time, the compressive stress-containing insulating film 70 exists in the SRAM load area SL and the SRAM access area SA, and the compressive stress-containing insulating film 70 and the tensile stress-containing insulating film 71 exist in the SRAM drive area SD. Yes.

  Next, in the step shown in FIG. 15A, after an interlayer insulating film 3 made of an oxide film is formed on the entire surface of the substrate, the interlayer insulating film 3 and the tensile stress-containing insulating film are formed using a lithography method and an etching method. 71, compressive stress-containing insulating film 70 is etched to form contact hole 4a and shared contact hole 5a reaching silicide layers 17, 27, 37, and 47.

  Next, in the step shown in FIG. 15B, the buried contact 4 and the shared contact 5 are formed in the contact hole 4a and the shared contact hole 5a. The buried contact 4 and the shared contact 5 are constituted by a barrier film such as TiN and a metal film such as tungsten. The semiconductor device of this embodiment is formed by the above process.

  According to the semiconductor device of this embodiment, the access transistor is covered with the compressive stress-containing insulating film 70, and the drive transistor is covered with the compressive stress-containing insulating film 70 and the tensile stress-containing insulating film 71. Since these transistors are N-type MIS transistors, the driving force is improved when a tensile stress is applied to the channel, and the driving force is reduced when a compressive stress is applied. In the present embodiment, since the SRAM access region is covered with the compressive stress-containing insulating film 70, the driving power of the access transistor is reduced. On the other hand, the SRAM drive region SD is composed of the compressive stress-containing insulating film 70 and the tensile stress-containing insulating film 71, but is covered with a laminated film, so that the compressive stress of the compressive stress-containing insulating film 70 is pulled by the tensile stress-containing insulating film 71. Since it is canceled out by the stress, a decrease in driving force of the drive transistor is suppressed as compared with the access transistor. Therefore, the driving power of the access transistor can be made lower than the driving power of the drive transistor. Therefore, malfunction of the SRAM can be suppressed and the noise margin can be improved.

  In this embodiment, the load transistor is covered with the compressive stress-containing insulating film 70. Since the load transistor is a P-type MIS transistor, the driving force is reduced when a tensile stress is applied to the channel, and the driving force is improved when a compressive stress is applied. Therefore, in this embodiment, the driving capability of the load transistor can also be improved.

  In the present embodiment, the case where the access transistor and the drive transistor are N-type MIS transistors has been described. However, the access transistor and the drive transistor may be P-type MIS transistors. In this case, the access transistor may be covered with a tensile stress-containing insulating film, and the drive transistor may be covered with a compressive stress-containing insulating film and a tensile stress-containing insulating film. In the P-type MIS transistor, the driving force is improved when compressive stress is applied to the channel, and the driving force is reduced when tensile stress is applied. Therefore, in this case as well, the drive capability of the access transistor can be made lower than that of the drive transistor.

(Fourth embodiment)
FIG. 16 is a cross-sectional view showing the structure of a semiconductor device according to the fourth embodiment of the present invention. In the semiconductor device of this embodiment, the compressive stress-containing insulating film 81 covers the gate electrode 12 and the source / drain region 16 in the SRAM load region SL and the gate electrode 32 and the source / drain region 36 in the SRAM access region SA. The gate electrode 22 and the source / drain region 26 in the SRAM drive region SD are covered with a tensile stress-containing insulating film 80. Since the other structure is the same as that of the first embodiment, detailed description thereof is omitted.

  Next, a method for manufacturing a semiconductor device according to the present embodiment will be described with reference to FIGS. 17 (a) to 20 (b). FIG. 17A to FIG. 20B are cross-sectional views illustrating the manufacturing steps of the semiconductor device according to the fourth embodiment of the present invention.

  In the manufacturing method of this embodiment, the structure shown in FIG. 17A is formed using the same method as that described in the first embodiment.

  Next, in a step shown in FIG. 17B, a compressive stress-containing insulating film 81 made of a silicon nitride film that generates compressive stress formed by plasma CVD is formed on the entire surface of the substrate.

  Next, in the step shown in FIG. 18A, a first mask 82 made of resist is formed which covers the SRAM load area SL and the SRAM access area SA and opens the SRAM drive area SD. Thereafter, etching is performed using the first mask 62 as an etching mask to etch off the compressive stress-containing insulating film 81 in the SRAM drive region SD.

  Next, in the step shown in FIG. 18B, after removing the first mask 62, a tensile stress containing silicon nitride film that generates tensile stress formed on the entire surface of the substrate by the LP-CVD method is contained. An insulating film 80 is formed.

  Next, in the step shown in FIG. 19A, a second mask 83 made of resist is formed on the substrate so as to cover the SRAM drive area SD and open the SRAM load area SL and the SRAM access area SA. . Thereafter, etching is performed using the second mask 83 as an etching mask to etch off the tensile stress-containing insulating film 80 located in the SRAM load region SL and the SRAM access region SA.

  Next, in the step shown in FIG. 19B, the second mask 83 is removed. At this time, the compressive stress-containing insulating film 81 is formed in the SRAM load area SL and the SRAM access area SA, and the tensile stress-containing insulating film 80 is formed in the SRAM drive area SD.

  Next, in the step shown in FIG. 20A, after an interlayer insulating film 3 made of an oxide film is formed on the entire surface of the substrate, the interlayer insulating film 3 and the tensile stress-containing insulating film are formed using a lithography method and an etching method. 80, the compressive stress-containing insulating film 81 is etched to form contact holes 4a and shared contact holes 5a that reach the silicide layers 17, 27, 37, and 47.

  Next, in the step shown in FIG. 20B, the buried contact 4 and the shared contact 5 are formed in the contact hole 4a and the shared contact hole 5a. The buried contact 4 and the shared contact 5 are constituted by a barrier film such as TiN and a metal film such as tungsten. The semiconductor device of this embodiment is formed by the above process.

  According to the semiconductor device of this embodiment, the access transistor is covered with the compressive stress-containing insulating film 81, and the drive transistor is covered with the tensile stress-containing insulating film 80. Since these transistors are N-type MIS transistors, the driving force is improved when a tensile stress is applied to the channel, and the driving force is reduced when a compressive stress is applied. Therefore, the driving power of the access transistor can be made lower than the driving power of the drive transistor. Therefore, malfunction of the SRAM can be suppressed and the noise margin can be improved.

  In this embodiment, the load transistor is covered with the compressive stress-containing insulating film 81. Since the load transistor is a P-type MIS transistor, the driving force is reduced when a tensile stress is applied to the channel, and the driving force is improved when a compressive stress is applied. Therefore, in this embodiment, the driving capability of the load transistor can also be improved.

  In the present embodiment, the case where the access transistor and the drive transistor are N-type MIS transistors has been described. However, the access transistor and the drive transistor may be P-type MIS transistors. In this case, the access transistor may be covered with a laminated film of a tensile stress-containing insulating film and a compressive stress-containing insulating film, and the drive transistor may be covered only with the compressive stress-containing insulating film. In the P-type MIS transistor, the driving force is improved when compressive stress is applied to the channel, and the driving force is reduced when tensile stress is applied. Therefore, in this case as well, the drive capability of the access transistor can be made lower than that of the drive transistor.

(Fifth embodiment)
FIG. 21 is a sectional view showing the structure of a semiconductor device according to the fifth embodiment of the present invention. In the semiconductor device of this embodiment, an N-type logic region LN for forming a logic N-channel MIS transistor, a P-type logic region LP for forming a logic P-channel MIS transistor, and a P-channel MIS transistor for SRAM are formed. An N-type SRAM region SN for forming a P-type SRAM region SP and an SRAM N-channel MIS transistor is arranged. The regions LN, PL, PS, NS are electrically isolated from each other by the shallow trench element isolation 2.

  In the N-type logic region LN, a gate electrode 112 is formed on the semiconductor substrate 101 with a gate insulating film 111 interposed therebetween. An offset sidewall 113a and a sidewall 113b disposed outside the offset sidewall 113a are formed on the side surface of the gate electrode 112. An N-type extension region 114 is formed in a region of the semiconductor substrate 101 located under the offset sidewall 113a and the sidewall 113b, and a P-type pocket region 115 is formed in a region located under the N-type extension region 114. Is formed. An N-type source / drain region 116 is formed in a region of the semiconductor substrate 101 located outside the sidewall 113b. A silicide layer 117 is formed on the gate electrode 112 and the N-type source / drain region 116.

  On the gate electrode 112, offset sidewall 113a, sidewall 113b, and N-type source / drain region 116 in the N-type logic region LN, a tensile stress-containing insulating film 150 made of a silicon nitride film is formed by LP-CVD. ing.

  In the P-type logic region LP, a gate electrode 122 is formed on the semiconductor substrate 101 with a gate insulating film 121 interposed therebetween. On the side surface of the gate electrode 122, an offset sidewall 123a and a sidewall 123b disposed outside the offset sidewall 123a are formed. A P-type extension region 124 is formed in a region of the semiconductor substrate 101 located below the offset sidewall 123a and the sidewall 123b, and an N-type pocket region 125 is formed in a region located below the P-type extension region 124. Is formed. A P-type source / drain region 126 is formed in a region of the semiconductor substrate 101 located outside the sidewall 123b. A silicide layer 127 is formed on the gate electrode 122 and the P-type source / drain region 126.

  On the gate electrode 122, the offset sidewall 123a, the sidewall 123b, and the P-type source / drain region 126 in the P-type logic region LP, a compressive stress-containing insulating film 160 made of a silicon nitride film is formed by plasma CVD. Yes.

  In the P-type SRAM region SP, a gate electrode 132 is formed on the semiconductor substrate 101 with a gate insulating film 131 interposed therebetween. An offset sidewall 133a and a sidewall 133b disposed outside the offset sidewall 133a are formed on the side surface of the gate electrode 132. A P-type extension region 134 is formed in a region of the semiconductor substrate 101 located under the sidewall 133b, and an N-type pocket region 135 is formed in a region located under the P-type extension region 134. . A P-type source / drain region 136 is formed in a region of the semiconductor substrate 101 located outside the sidewall 133b. A silicide layer 137 is formed on the gate electrode 132 and the P-type source / drain region 136.

  On the gate electrode 132, offset sidewall 133a, sidewall 133b, and P-type source / drain region 136 in the P-type SRAM region SP, a compressive stress-containing insulating film 160 made of a silicon nitride film is formed by plasma CVD. Yes.

  In the N-type SRAM region SN, a gate electrode 142 is formed on the semiconductor substrate 101 with a gate insulating film 141 interposed therebetween. An offset sidewall 143a and a sidewall 143b disposed outside the offset sidewall 143a are formed on the side surface of the gate electrode 142. An N-type extension region 144 is formed in a region of the semiconductor substrate 101 located below the offset sidewall 143a and the sidewall 143b, and a P-type pocket region 145 is formed in a region located below the N-type extension region 144. Is formed. An N-type source / drain region 146 is formed in a region of the semiconductor substrate 101 located outside the sidewall 143b. A silicide layer 147 is formed on the gate electrode 142 and the N-type source / drain region 146.

  A tensile stress-containing insulating film 150 is formed on the gate electrode 142, the offset sidewall 143a, the sidewall 143b, and the N-type source / drain region 146 in the N-type SRAM region SN.

  In each region LN, PL, PS, NS, the tensile stress-containing insulating film 150 and the compressive stress-containing insulating film 160 are covered with the interlayer insulating film 3. In each of the regions LN, PL, PS, and NS, the contact 4 that penetrates the tensile stress-containing insulating film 150, the compressive stress-containing insulating film 160, and the interlayer insulating film 3 and reaches the silicide layers 117, 127, 137, and 147. Is formed.

  Next, a method for manufacturing a semiconductor device according to the present embodiment will be described with reference to FIGS. 22 (a) to 26 (b). FIG. 22A to FIG. 26B are cross-sectional views showing the manufacturing steps of the semiconductor device in the fifth embodiment of the present invention.

  In the manufacturing method of the present invention, first, the following steps are performed in order to form the structure shown in FIG. First, each active region comprising the semiconductor substrate 101 of the N-type logic region LN, P-type logic region LP, P-type SRAM region SP, and N-type SRAM region SN partitioned by the shallow trench isolation 102 formed in the semiconductor substrate 101. A gate insulating film 111, 121, 131, 141 and gate electrodes 112, 122, 132, 142 are formed thereon. Next, offset sidewalls 113a, 123a, 133a, 143a are formed on the side surfaces of the gate electrodes 112, 122, 132, 142.

Subsequently, for example, arsenic ions that are N-type impurities are applied to the N-type logic region LN and the N-type SRAM region SN under the conditions of an acceleration energy of 3 KeV, a dose of 1.5 × 10 ¹⁵ ions / cm ² , and a TILT angle of 0 degree. Implantation is performed to form N-type extension regions 114 and 144. Next, for example, boron ions, which are P-type impurities, are implanted four times under the conditions of an acceleration energy of 10 KeV, a dose of 8.0 × 10 ¹² ions / cm ² , and a TILT angle of 25 degrees, and P-type pocket regions 115 and 145 are formed. Form. The P-type pocket regions 115 and 145 are formed so as to cover the bottom surfaces of the N-type extension regions 114 and 144.

Next, P-type impurities such as boron ions are applied to the P-type logic region LP and the P-type SRAM region SP with an acceleration energy of 0.5 KeV, a dose amount of 3.0 × 10 ¹⁴ ions / cm ² , and a TILT angle of 0 degree. Implantation is performed under conditions to form P-type extension regions 124 and 134. Next, N-type impurities such as phosphorus ions are implanted four times under the conditions of an acceleration energy of 30 KeV, a dose of 7.0 × 10 ¹² ions / cm ² , and a TILT angle of 25 degrees to form N-type pocket regions 125 and 135. To do. The N-type pocket regions 125 and 135 are formed so as to cover the bottom surfaces of the P-type extension regions 124 and 134.

Next, a silicon nitride film is formed on the entire surface of the substrate by LP-CVD. Thereafter, the silicon nitride film is etched by an etch back method, and the sidewalls 113b, 123b, 133b, and the sidewalls 113b, 123a, 133a, and 143a are provided on the side surfaces of the gate electrodes 112, 122, 132, and 142, respectively. 143b is formed. Thereafter, for example, arsenic ions as N-type impurities are injected into the N-type logic region LN and the N-type SRAM region SN under the conditions of an acceleration energy of 20 KeV, a dose of 4.0 × 10 ¹⁵ ions / cm ² , and a TILT angle of 0 degree. To do. Further, for example, phosphorus ions which are N-type impurities are implanted under the conditions of an acceleration energy of 10 KeV, a dose of 1.0 × 10 ¹⁵ ions / cm ² , and a TILT angle of 7 degrees. Thereby, N-type source / drain regions 116 and 146 are formed.

Next, P-type impurities such as boron ions are applied to the P-type logic region LP and the P-type SRAM region SP under the conditions of an acceleration energy of 2 KeV, a dose amount of 4.0 × 10 ¹⁵ ions / cm ² , and a TILT angle of 7 degrees. Implantation is performed to form P-type source / drain regions 126 and 136.

  Next, silicide layers 117, 127, 137, 147 are selectively formed on each gate electrode 112, 122, 132, 142 and on the source / drain regions 116, 126, 136, 146 using salicide technology. To do.

  Next, in a step shown in FIG. 22B, a tensile stress-containing insulating film 150 made of a silicon nitride film that generates tensile stress formed by the LP-CVD method is formed on the entire surface of the substrate.

  Next, in the step shown in FIG. 23A, a first resist made of a resist covering the N-type logic region LN and the N-type SRAM region SN and having openings in the P-type SRAM region SP and the P-type logic region LP is formed on the substrate. 1 mask 152 is formed. Thereafter, etching is performed using the first mask 152 as an etching mask, thereby removing the tensile stress-containing insulating film 150 located in the P-type SRAM region SP and the P-type logic region LP.

  Next, in the step shown in FIG. 23B, a compressive stress-containing insulating film 160 made of a silicon nitride film that generates compressive stress formed by plasma CVD is formed on the entire surface of the substrate.

  Next, in the step shown in FIG. 24A, a first resist made of a resist covering the P-type logic region LP and the P-type SRAM region SP and having openings in the N-type logic region LN and the N-type SRAM region SN is formed on the substrate. Second mask 153 is formed.

  Next, in the step shown in FIG. 24B, the second mask 153 is removed. At this time, the compressive stress-containing insulating film 160 is formed in the P-type SRAM region SP and the P-type logic region LP, and the tensile stress-containing insulating film 150 is formed in the N-type logic region LN and the N-type SRAM region SN. Yes.

  Next, in the step shown in FIG. 25A, after an interlayer insulating film 103 made of an oxide film is formed on the entire surface of the substrate, the interlayer insulating film 103, the tensile stress-containing insulating film are formed by using a lithography method and an etching method. 150 and the compressive stress-containing insulating film 160 are etched to form contact holes 104a reaching the silicide layers 117, 127, 137, and 147.

  Next, in the step shown in FIG. 25B, the buried contact 104 is formed in the contact hole 104a. The buried contact 104 is composed of a barrier film such as TiN and a metal film such as tungsten. The semiconductor device of this embodiment is formed by the above process.

  In the present embodiment, the driving capability of the MIS transistor can be improved in the logic region, and the driving capability of the MIS transistor can be decreased in the SRAM region. Thus, the driving force can be adjusted according to the application.

  As described above, the present invention is useful for adjusting the capabilities of the N-channel MIS transistor and the P-channel MIS transistor.

It is sectional drawing which shows the structure of the semiconductor device in the 1st Embodiment of this invention. (A), (b) is sectional drawing which shows the manufacturing process of the semiconductor device in 1st Embodiment. (A), (b) is sectional drawing which shows the manufacturing process of the semiconductor device in 1st Embodiment. (A), (b) is sectional drawing which shows the manufacturing process of the semiconductor device in 1st Embodiment. (A), (b) is sectional drawing which shows the manufacturing process of the semiconductor device in 1st Embodiment. It is sectional drawing which shows the structure of the semiconductor device in the 2nd Embodiment of this invention. (A), (b) is sectional drawing which shows the manufacturing process of the semiconductor device in 2nd Embodiment. (A), (b) is sectional drawing which shows the manufacturing process of the semiconductor device in 2nd Embodiment. (A), (b) is sectional drawing which shows the manufacturing process of the semiconductor device in 2nd Embodiment. (A), (b) is sectional drawing which shows the manufacturing process of the semiconductor device in 2nd Embodiment. It is sectional drawing which shows the structure of the semiconductor device in the 3rd Embodiment of this invention. (A), (b) is sectional drawing which shows the manufacturing process of the semiconductor device in 3rd Embodiment. (A), (b) is sectional drawing which shows the manufacturing process of the semiconductor device in 3rd Embodiment. (A), (b) is sectional drawing which shows the manufacturing process of the semiconductor device in 3rd Embodiment. (A), (b) is sectional drawing which shows the manufacturing process of the semiconductor device in 3rd Embodiment. It is sectional drawing which shows the structure of the semiconductor device in the 4th Embodiment of this invention. (A), (b) is sectional drawing which shows the manufacturing process of the semiconductor device in 4th Embodiment. (A), (b) is sectional drawing which shows the manufacturing process of the semiconductor device in 4th Embodiment. (A), (b) is sectional drawing which shows the manufacturing process of the semiconductor device in 4th Embodiment. (A), (b) is sectional drawing which shows the manufacturing process of the semiconductor device in 4th Embodiment. It is sectional drawing which shows the structure of the semiconductor device in the 5th Embodiment of this invention. (A), (b) is sectional drawing which shows the manufacturing process of the semiconductor device in 5th Embodiment. (A), (b) is sectional drawing which shows the manufacturing process of the semiconductor device in 5th Embodiment. (A), (b) is sectional drawing which shows the manufacturing process of the semiconductor device in 5th Embodiment. (A), (b) is sectional drawing which shows the manufacturing process of the semiconductor device in 5th Embodiment. FIG. 10 is a cross-sectional view showing a conventional structure in which a film having stress is formed on a MIS transistor. It is a top view which shows arrangement | positioning of the transistor which comprises SRAM conventionally.

Explanation of symbols

1 Semiconductor substrate
2 Shallow trench element isolation
3 Interlayer insulation film
4 Contact
4a Contact hole
5 Shared contacts
5a Shared contact hole
11, 21, 31 Gate insulating film
12, 22, 32 Gate electrode
13a, 23a, 33a, 43a Offset sidewall
13b, 23b, 33b, 43b Side wall
14, 24, 34 Extension area
15, 25, 35 Pocket area
16, 26, 36 Source / drain regions
17, 27, 37, 47 Silicide layer
42 Gate wiring
50 Insulating film containing tensile stress
51 Insulating film containing compressive stress
52 First mask
60 Insulating film containing tensile stress
61 Insulating film containing compressive stress
62 First mask
63 Second mask
70 Insulating film containing compressive stress
71 Insulating film containing tensile stress
72 first mask
80 Insulating film containing tensile stress
81 Insulating film containing compressive stress
82 First mask
83 Second mask 101 Semiconductor substrate 102 Shallow trench element isolation 103 Interlayer insulating film 104 Contact 104a Contact hole 105 Shared contact 105a Shared contact hole 111, 121, 131, 141 Gate insulating film 112, 122, 132, 142 Gate electrode 113a, 123a, 133a, 143a Offset sidewalls 114, 124, 134, 144 Extension regions 115, 125, 135, 145 Pocket regions 116, 126, 136, 146 Source / drain regions 116, 146 N-type source / drain regions 117, 127, 137, 147 Silicide layer 123a Offset sidewall 150 Tensile stress-containing insulating film 160 Compressive stress-containing insulating film

Claims (9)

A first gate insulating film formed on the first active region made of the semiconductor layer partitioned by a shallow trench isolation region formed in the semiconductor layer; and formed on the first gate insulating film. A first gate electrode formed in the first active region and an N-type first source / drain region formed in a region of the first active region located on a side of the first gate electrode. A MIS transistor;
A first insulating film having compressive stress covering the first source / drain regions and the first gate electrode;
A second gate insulating film formed on the second active region made of the semiconductor layer partitioned by the shallow trench isolation region formed in the semiconductor layer; and on the second gate insulating film A second gate electrode formed in the first active region, and an N-type second source / drain region formed in a region of the second active region located on the side of the second gate electrode. Two MIS transistors;
A second insulating film having a tensile stress covering the second source / drain region and the second gate electrode;
A third gate insulating film formed on a third active region made of the semiconductor layer partitioned by the shallow trench isolation region formed in the semiconductor layer, and on the third gate insulating film And a P-type third source / drain region formed in a region of the third active region located on the side of the third gate electrode. 3 MIS transistors;
A third insulating film having compressive stress covering the third source / drain region and the third gate electrode;
An interlayer insulating film covering the first insulating film, the second insulating film, and the third insulating film; and
The first active region, the second active region, and the third active region are electrically isolated from each other by the shallow trench isolation region;
The first insulating film and said third insulating film, have a same thickness to each other,
The semiconductor device, wherein the first MIS transistor is an SRAM access transistor, the second MIS transistor is an SRAM drive transistor, and the third MIS transistor is an SRAM load transistor . The semiconductor device according to claim 1 ,
The first insulating film and the third insulating film are made of a silicon nitride film formed by a plasma CVD method,
The second insulating film is a semiconductor device made of a silicon nitride film formed by LP-CVD. The semiconductor device according to claim 1 or 2 ,
A semiconductor device in which the driving force of the first MIS transistor is lower than the driving force of the second MIS transistor. It is a semiconductor device given in any 1 paragraph among Claims 1-3 ,
A first silicide layer formed on the first gate electrode and the first source / drain region;
A second silicide layer formed on the second gate electrode and the second source / drain region;
A semiconductor device further comprising: a third silicide layer formed on the third gate electrode and the third source / drain region. The semiconductor device according to claim 4 ,
A gate wiring formed on the shallow trench isolation region surrounding the third active region;
A fourth silicide layer formed on the gate wiring;
The semiconductor device, wherein the third insulating film is formed so as to cover the gate wiring. The semiconductor device according to claim 5 ,
It penetrates through the interlayer insulating film and the third insulating film so as to come into contact with the third silicide layer on the third source / drain region and the fourth silicide layer on the gate wiring. A semiconductor device further comprising a formed shared contact. The semiconductor device according to claim 6 ,
The shared contact is a semiconductor device including a barrier film and a metal film. A semiconductor device according to any one of claims 5 to 7 ,
The first MIS transistor is formed on the side surface of the first gate electrode, and on the side surface of the first gate electrode via the first offset sidewall. A first sidewall made of
The second MIS transistor is formed on the side surface of the second gate electrode with a second offset sidewall, and on the side surface of the second gate electrode with the second offset sidewall interposed therebetween. A second side wall,
The third MIS transistor is formed on the side surface of the third gate electrode, and on the side surface of the third gate electrode via the third offset sidewall. A third side wall,
A semiconductor comprising: a fourth offset sidewall formed on a side surface of the gate wiring; and a fourth sidewall formed on the side surface of the gate wiring via the fourth offset sidewall. apparatus. The semiconductor device according to claim 8 ,
The first MIS transistor includes an N-type first extension region formed in a region located under the first offset sidewall and the first sidewall in the first active region; A P-type first pocket region formed in a region located below the first extension region in the first active region, and an outside of the first sidewall in the first active region The first source / drain region formed in a region located on the opposite side,
The second MIS transistor includes an N-type second extension region formed in a region located below the second offset sidewall and the second sidewall in the second active region; A P-type second pocket region formed in a region of the second active region located below the second extension region; and an outer side of the second sidewall of the second active region. The second source / drain region formed in a region located on the opposite side,
The third MIS transistor includes a P-type third extension region formed in a region located under the third offset sidewall and the third sidewall in the third active region, An N-type third pocket region formed in a region of the third active region located below the third extension region; and an outer side of the third sidewall of the third active region. And a third source / drain region formed in a region located on the opposite side.

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