JP4797883B2 - Component mounting method - Google Patents

Description

  The present invention provides a component and a base material whose one surface is inferior in flatness to one surface of the component, one surface of the component and one surface of the base material are opposed to each other, and the one surface is bonded via a bonding member. In particular, the present invention relates to a method for arranging a joining member provided between one surface of a component and one surface of a base material.

  Conventionally, as this type of semiconductor device, for example, one surface of a semiconductor chip as a component is opposed to one surface of a package made of ceramic as a base material, and the semiconductor chip and the package are placed between both members. What is joined via a plurality of intervening joining members has been proposed (see, for example, Patent Documents 1 to 4).

Here, as the joining member, a member made of a conductive adhesive or a bump is employed. Conventionally, a plurality of bonding members are arranged on one surface of the package by coating, and then a semiconductor chip is mounted on the package via the bonding members and bonded.
JP-A-8-307043 JP-A-9-181120 Japanese Patent Laid-Open No. 11-8270 JP 2000-208675 A

  However, the conventional method of applying and arranging a plurality of joining members one by one is not preferable because it takes time to arrange the joining members. Here, the present inventor has considered arranging a plurality of joining members collectively by a printing method using a conventional general metal mask.

  FIG. 10 shows the prototype of the present inventor, and is a partial cross-sectional view of a joint portion between the semiconductor chip 10 and the package 20 joined based on a conventional printing method. As shown in FIG. 10, a plurality of package electrodes 22 are provided on one surface 21 of the package 20, and a plurality of chip electrodes 12 are provided on one surface 11 of the semiconductor chip 10.

  The one surface 21 of the package 20 and the one surface 11 of the semiconductor chip 10 are arranged to face each other, and the package electrode 22 and the chip electrode 12 on each surface 11, 21 are aligned. The electrodes 12 and 22 are connected by a joining member J30 made of a conductive adhesive.

  Here, although the one surface 11 of the semiconductor chip 10 is very flat, the package 20 is formed of a ceramic fired body, and therefore, the height variation T of the one surface 21 of the package 20 due to shrinkage variation due to firing is extremely high. It will be big. That is, the flatness of the one surface 21 that is the bonding surface of the package 20 is inferior to the flatness of the one surface 11 of the semiconductor chip 10.

  Specifically, the height variation T on the one surface 21 of the package 20 was 15 μm or more as the difference between the highest portion and the lowest portion of the one surface 21. The height variation T of this degree is a typical size in a normal ceramic package, as examined by the present inventor using a general surface shape measuring method.

  When the bonding member 30 is arranged on the one surface 21 of the package 20 having such a large height variation T by the conventional printing method, as shown in FIG. 10, the package electrode existing at a low position on the one surface 21 of the package 20. Between 22 and the chip electrode 12 opposite to this, there is a possibility that the joining member 30 is not high enough to be contacted and not electrically joined.

  Further, the package takes various shapes such as a box shape, and there is a problem that it is difficult to arrange a hard plate-shaped mask in accordance with the shape on one side of the package by the conventional printing method. For these reasons, conventionally, a joining member is disposed at each location, and the height of each joining member is controlled to a level sufficient for joining.

  The above-described problems are not limited to the mounting method in which the semiconductor chip is flip-chip bonded to the above-described ceramic package, but the base material on which the component is mounted and bonded rather than one side of the component. If the flatness of the joint surface is inferior, it is considered that it occurs in common.

  The present invention has been made in view of the above-described problem. One surface of a component and one surface of a base material having a lower flatness than one surface of the component are opposed to each other, and both the members are interposed between the two members. In a mounting method for components to be joined through a plurality of joining members, even if the height of the joining surface of the base material is large, a plurality of joining members can be appropriately arranged collectively. Objective.

In order to achieve the above object, the present invention provides a mask member (80) having a plurality of openings (81) formed in the same arrangement pattern as the plurality of joining members (30), and the mask member (80). Prepare a squeegee (K) that expands the joining member (30) supplied above,
The mask member (80) has a shape having a recess capable of storing the bonding member (30).
Scan Chigi (K), the rotation axis (K1), has a structure having a plurality of squeegee rotating (K) is fixed to the rotary shaft (K1) together with the rotary shaft (K1),
The plurality of squeegees (K) are rotatably accommodated in the recesses,
A plurality of openings (81) are formed at the bottom of the recess,
The bottom of the concave portion of the mask member (80) is disposed on one surface (21) of the base material (20) so that the opening (81) is positioned at a site where the plurality of joining members (30) are to be disposed. With
The bottom of the concave portion of the mask member (80) is pressed against one surface (21) of the base material (20), and the bottom of the concave portion facing the one surface (21) of the base material (20) of the mask member (80) By deforming so that the undulating shape of one surface (21) is inherited and rotating a plurality of squeegees (K) together with the rotating shaft (K1) in this state, the joining member (30) is bottom of the concave portion of the mask member (80). The bonding member (30) is printed on one surface (21) of the base material (20) through the opening (81).

According to it, since the whole bottom part of the recessed part which opposes the one surface (21) which is a joint surface of a base material (20) among mask members (80) inherits the undulation shape by the height variation of the said one surface (21), Even if the height variation of the one surface (21) that is the bonding surface of the base material (20) is large, the plurality of bonding members (30) can be appropriately arranged collectively by the printing method.
In addition, in the present invention, the joining member is obtained by rotating the plurality of squeegees (K) together with the rotating shaft (K1) in a state where the mask member (80) is deformed so as to inherit the undulating shape of the one surface (21). (30) is spread over the bottom of the recess of the mask member (80).
According to this, even if the area of the mask member (80) is small, the joining member (30) is efficiently placed on the bottom of the concave portion of the mask member (80) while suppressing the movement space of the squeegee (K) as much as possible. The joining member (30) can be efficiently supplied and printed on one surface (21) of the substrate (20).

In the mounting method of the present invention having the above characteristics, the opening of the opening (81) is used as the mask member (80) so that the opening (81) has a target opening area when pressed against the substrate (20). It is preferable to use one having an area larger than the target opening area. According to this, it becomes possible to arrange the joining member (30) with high accuracy.

In the mounting method of the present invention, the height variation existing on the one surface (21) of the substrate (20) is 15 μm or more as the difference between the highest portion and the lowest portion on the one surface (21). Can be adopted. Further, a semiconductor chip (10) can be used as the component, and a package (20) made of ceramic can be used as the base material.

  In addition, the code | symbol in the bracket | parenthesis of each means described in the claim and this column is an example which shows a corresponding relationship with the specific means as described in embodiment mentioned later.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, parts that are the same or equivalent to each other are given the same reference numerals in the drawings in order to simplify the description.

(First embodiment)
FIG. 1 is a diagram showing an overall schematic cross-sectional configuration of a semiconductor device S1 as a component mounting structure according to a first embodiment of the present invention, and FIG. 2 is a schematic top view of the semiconductor device S1 in FIG. In the semiconductor device S1, the lid 26 is removed.

[Mounting structure, etc.]
The semiconductor device S1 is mainly configured by electrically connecting a semiconductor chip 10 as a component and a package 20 as a base material via a bonding member 30 and housing the semiconductor chip 10 in the package 20.

  Here, the semiconductor chip 10 is a plate-shaped member made of a silicon semiconductor chip or the like formed by a normal semiconductor process. Specifically, the semiconductor chip 10 is configured as a circuit chip or a sensor chip for detecting acceleration, angular velocity, or the like. It has been done. A plurality of chip electrodes 12 made of aluminum (Al), gold (Au), or the like are provided on one surface 11 of the semiconductor chip 10.

  The joining member 30 is interposed between the plurality of chip electrodes 12 and the package electrode 22 facing the chip electrodes 12, and electrically connects the electrodes 12 and 22. Details of the package electrode 22 and the bonding member 30 will be described later.

  Here, in FIG. 2, the joining member 30 is indicated by a broken-line circle, and the electrodes 12 and 22 connected thereby are omitted, but in reality, the positions of the electrodes 12 and 22 are as shown in FIG. Corresponds to the position of the joining member 30 shown in FIG.

  The package 20 is formed by firing ceramic. Here, the package 20 is configured as a laminated substrate in which a plurality of ceramic layers such as alumina are laminated, and has an opening 25 serving as a space for housing the semiconductor chip 10. Such a multilayer substrate is manufactured by printing a conductive paste on a ceramic green sheet to form a wiring pattern, and then laminating and baking these.

  As shown in FIGS. 1 and 2, the package 20 includes a bonding surface 21. The bonding surface 21 of the package 20 is a surface on which the semiconductor chip 10 is mounted and is a surface that is electrically bonded to the semiconductor chip 10. Here, a step is provided on the side surface of the opening 25 of the package 20, and the surface 21 of the step portion is configured as the bonding surface 21.

  A plurality of package electrodes 22 are provided on the bonding surface 21. The package electrode 22 is electrically connected to a back surface electrode 24 located on the back surface (lower surface in FIG. 1) side of the package 20 through an inner layer wiring 23 configured as a through hole located inside the package 20. Yes.

  The package electrode 22 and the back electrode 24 are surface layer electrodes in the package 20 and are made of gold or the like. On the other hand, the inner layer wiring 23 is made of, for example, tungsten plated with nickel gold. Each electrode and wirings 22 to 24 in such a package 20 can be formed by a normal method in the manufacturing process of the laminated substrate described above.

  As shown in FIGS. 1 and 2, in the semiconductor device S1 of the present embodiment, one surface 11 of the semiconductor chip 10 and the bonding surface 21 of the package 20 are arranged to face each other, and each chip electrode 12 and the package electrode 22 are aligned so as to coincide with each other. In such a state, the semiconductor chip 10 is mounted in the opening 25 of the package 20.

  As described above, the bonding member 30 is interposed between the chip electrode 12 and the package electrode 22 facing each other, and the electrodes 12 and 22 are electrically connected to each other by the bonding member 30. Has been. In addition, the semiconductor chip 10 is fixed and supported on the bonding surface 21 by the bonding member 30.

  Here, FIG. 3 is an enlarged cross-sectional view of the joint portion between the chip electrode 12 and the package electrode 22 through the joint member 30.

  In this embodiment, since the package 20 is formed by firing ceramic, the package 20 contracts compared to before firing. At this time, variation due to shrinkage occurs, particularly due to a difference in shrinkage caused by the presence of different materials such as the inner layer wiring 23.

  Therefore, also in the present embodiment, the height variation T exists on the bonding surface 21 of the package 20 as described above. In FIG. 3, the package electrode 22a at the highest position among the plurality of package electrodes 22 located on the bonding surface 21 and the package electrode 22b at the lowest position are shown.

  That is, in FIG. 3, the maximum height variation T on the bonding surface 21 is shown as the difference between the highest portion and the lowest portion on the bonding surface 21 of the package 20, and this maximum height variation T is The typical value of this type of ceramic package is usually 15 μm or more.

  On the other hand, the height variation of the one surface 11 of the semiconductor chip 10 is smaller by one digit or more than the bonding surface 21 of the package 20. This height variation can be measured by a general surface shape measurement method. A large height variation is inferior in flatness, and a small height variation is excellent in flatness. That is, the bonding surface 21 of the package 20 is inferior in flatness to the one surface 11 of the semiconductor chip 10 facing the package 20.

  In the present embodiment, the bonding member 30 employs a conductive sheet. Such a sheet is formed into a sheet shape by interposing a conductive filler such as silver or copper in a thermosetting resin such as an epoxy resin, and is cured by heating to be electrically and mechanically joined. Is what you do. The joining member 30 made of such a sheet is preferably softened at 100 ° C. or lower.

  The bonding member 30 absorbs the height variation T present on the bonding surface 21 of the package 20, and the bonding surface 21 of the semiconductor chip 10 and the bonding surface 21 of the package 20 are appropriate in all of the plurality of bonding members 30. It is joined to.

  In other words, in the present embodiment, all the package electrodes 22 including the package electrode 22a at the highest position and the package electrode 22b at the lowest position among the plurality of package electrodes 22 are respectively opposed to the chip electrodes 12 facing each other. Are in contact with each other via a bonding member 30 and are electrically connected.

  As shown in FIG. 1, a lid 26 is attached to the opening 25 of the package 20. The lid 26 is fixed to the package 20 via a joint portion 26a formed by welding or brazing. The lid 26 may be anything such as metal, resin, ceramic, and the inside of the package 20 is sealed by the lid 26, and the semiconductor chip 10 is protected from the outside.

[Mounting method etc.]
Next, a method for mounting the semiconductor chip 10 on the package 20 in the semiconductor device S1 of the present embodiment will be described with reference to FIG. 4A to 4D are process diagrams showing the mounting method of the present embodiment in a cross section corresponding to FIG.

  That is, also in FIG. 4, the package electrode 22a at the highest position among the package electrodes 22 located on the bonding surface 21 of the package 20 and the package electrode 22b at the lowest position are shown, and the maximum height variation T is shown. Values are shown.

  In the mounting method of the present embodiment, first, the semiconductor chip 10 as a component having a plurality of chip electrodes 12 on one surface 11 as shown in FIG. 1 and FIG. A package 20 as a base material having a plurality of package electrodes 22 is prepared.

  As shown in FIG. 4A, a sheet-like sheet member 31 is prepared as a material for the sheet-like joining member 30 of the present embodiment. The sheet member 31 is punched by molds 50 and 60 described later, and the punched portion 30 becomes the joining member 30.

  Therefore, the sheet member 31 is made of a conductive resin sheet similar to the above-described joining member 30. In addition, the thickness of the sheet member 31 is a minimum thickness required by adding the maximum height variation T on the joining surface 21 and the height necessary for ensuring the joining property. .

  Also, as shown in FIGS. 4A and 4B, the first mold 50 having a plurality of openings 51 and each opening 51 penetrates when combined with the first mold 50. A second mold 60 having a plurality of protrusions 61 is prepared.

  Here, in the first mold 50, the openings 51 are through holes formed in the same arrangement pattern as the plurality of joining members 30 on the joining surface 21 of the package 20. Specifically, the arrangement pattern of the openings 51 is the same as the arrangement pattern of the joining member 30 shown in FIG.

As such a 1st type | mold 50 and a 2nd type | mold 60, the 1st type | mold 50 makes the metal plate shape which has the opening part 51, for example, the 2nd type | mold 60 is FIG. As shown in FIGS. b) and (c), a metal plate-like shape in which the protrusions 61 are integrally provided at positions facing the respective openings 51 on one surface can be obtained. And when these both types 50 and 60 are combined, each protrusion part 61 penetrates each opening part 51 corresponding to this.

  In this mounting method using such molds 50 and 60, first, the sheet member 31 is placed on the first mold 50 so as to cover each opening 51 (see FIG. 4A). Then, as shown in FIG. 4B, the second mold 60 is assembled to the first mold 50 from above the sheet member 31, and the protruding portion 61 is passed through the opening 51. Thereby, the sheet member 31 is punched out at the opening 51 (sheet punching step).

  At this time, since the length of the protrusion 61 of the second mold 60 is larger than the depth of the opening 51 of the first mold 50 (the thickness of the first mold 50), it is punched out by the protrusion 61. Thus, the portion 30 of the sheet member 31 attached to the tip of the protruding portion 61 is completely separated from the sheet member 31 remaining on the first mold 50, and is used as the joining member 30. Will be composed.

  Next, the two molds 50 and 60 in a state in which the sheet member 31 shown in FIG. 4C is punched are disposed on the bonding surface 21 of the package 20. Then, the punched portion 30, that is, the joining member 30 is pressed against the package electrode 22 on the joining surface 21 of the package 20 by the tip end portion of the protruding portion 61 (sheet pasting step).

  In addition, it is preferable to perform this sheet | seat sticking process in the state which softened the part 30 by which the sheet | seat member 31 was punched out. Specifically, the punched portion 30 is softened by heating the second mold 60 and / or the package 20, or both of them to the softening temperature or higher by a heater or the like.

  Thereafter, the molds 50 and 60 are peeled off from the punched sheet member 30, that is, the joining member 30, and removed from the package 20. Thereby, as shown in FIG. 4D, a plurality of joining members 30 are arranged on the joining surface 21 of the package 20.

  Next, with one surface of the semiconductor chip 10 opposed to the bonding surface 21 of the package 20, the semiconductor chip is placed on the bonding surface 21 via the sheet member portion 30 attached to the bonding surface 21, that is, the bonding member 30. 10 is mounted (mounting process).

  Thereafter, the bonding member 30 is cured by heating. This heating condition is the same as that in a joining member made of a general thermosetting resin. In this way, the one surface 11 of the semiconductor chip 10 and the bonding surface 21 of the package 20 are bonded via the plurality of bonding members 30, and the mounting structure is completed. Thereafter, the semiconductor device S1 of this embodiment is completed by attaching the lid 26 and the like.

  By the way, according to the mounting method described above, the plurality of bonding members 30, that is, the punched portions 30 of the sheet member 31 are pressed against the bonding surface 21 of the package 20 by the distal end portion of the protruding portion 61 of the second mold 60. I am doing so.

  Therefore, as described above, even when there is a large height variation T on the bonding surface 21 of the package 20, the bonding member 30 is appropriately attached to the entire bonding surface 21. Further, if the degree of deformation of the plurality of joining members 30 is controlled by controlling the degree of pressing (strength), the heights of the joining members 30 can be controlled.

  Further, if the level of the front end surface of all the protrusions 61 of the second mold 60 is substantially close to a horizontal plane, as shown in FIG. The heights of the upper surfaces of can be made substantially the same. Since the upper surface of each bonding member 30 has a relatively small height variation and is a surface bonded to one surface 11 of the flat semiconductor chip 10, it is important to align the height of the upper surface.

  Therefore, according to this embodiment, even if the height variation T of the bonding surface 21 of the package 20 is large, the plurality of bonding members 30 are appropriately arranged on the bonding surface 21 in a lump. Can do.

  In particular, as described above, in the package 20 made of this type of ceramic, the height variation T existing on the joint surface 21 is 15 μm or more as the difference between the highest part and the lowest part on the joint surface 21. Normally, as the height variation T becomes larger than 15 μm, the effectiveness of the present embodiment increases.

  Further, as described above, in the mounting method of the present embodiment, if the sheet attaching step is performed in a state where the punched portion 30 of the sheet member 31 is softened, the punched portion 30 is It becomes easy to be deformed when pressed against the joint surface 21 of the package 20. As a result, the height control of each joining member 30 becomes easy. Further, the softening makes it easy for the bonding member 30 to stick to the bonding surface 21 of the package 20.

  In the mounting method, the sheet member 31 in the state shown in FIG. 4B, that is, the state punched by the molds 50 and 60, is arranged on the bonding surface 21 of the package 20 together with the molds 50 and 60. The sheet pasting process is performed. That is, the sheet punching process and the sheet attaching process are performed at different locations.

  On the other hand, the first mold 50 is placed on the bonding surface 21 of the package 20 in advance so that the openings 51 are located at the portions where the plurality of bonding members 30 are to be disposed on the bonding surface 21 of the package 20. After the arrangement, the above-described sheet punching step and sheet pasting step may be performed continuously.

  That is, in the present embodiment, the first mold 50 on which the sheet member 31 is placed is placed on the package 20 so that the package electrode 22 and the opening 51 of the first mold 50 coincide with each other on the bonding surface 21 of the package 20. It is arranged on the top, and in this state, the punching and the pasting by the second die 60 may be performed.

  According to this, it is possible to continuously perform the punching of the sheet member 31 and the stamped portion 30, that is, the bonding member 30 to the bonding surface 21 of the package 20, and the process can be simplified.

Furthermore, in the present embodiment, in the above mounting method, from the state shown in FIG. 4 (b), together with the joint member 30 punched second type 60, the first mold 50, once removed, the projecting portion 61 Only the second mold 60 in a state where the bonding member 30 is attached to the distal end portion thereof may be disposed on the bonding surface 21 of the package 20, and then the bonding member 30 may be pressed against the bonding surface 21. .

(Second Embodiment)
5A, 5B, and 5C are schematic cross-sectional views showing a method for mounting the semiconductor chip 10 on the base material 20 according to the second embodiment of the present invention. As in the first embodiment, the present embodiment adopts a mounting method using the sheet member 31 and the first and second molds 50 and 60, and a part thereof is modified. Here, the differences will be mainly described.

  In the present embodiment, as shown in FIG. 5C, the semiconductor chip 10 includes a first semiconductor chip 10a and a second semiconductor chip 10b. Moreover, the base material 20 is provided with the 1st joining surface 21a and the 2nd joining surface 21b from which height differs as the joining surface 21. As shown in FIG.

  The first semiconductor chip 10a has its one surface 11 opposed to the relatively high first bonding surface 21a, and the second semiconductor chip 10b has the one surface 11 opposed to the relatively low second bonding surface 21b. Are joined via the joining member 30.

  Here, the base material 20 has a level difference between the part constituting the first joining surface 21a and the part constituting the second joining surface 21b, thereby realizing a height difference between the joining surfaces 21a and 21b. However, the parts constituting the joint surfaces 21a and 21b may be separate parts.

  In this case, the base material 20 of the present embodiment is configured as an assembly of a plurality of parts having different thicknesses and heights. Specifically, an assembly of a package and a circuit board may be configured as the board 20, and in this case, the height of the bonding surface of the package and the bonding surface of the circuit board can be made different from each other.

  Furthermore, for each of the first joining surface 21a and the second joining surface 21b, there is a height variation as shown in the first embodiment in the one surface, As a countermeasure for the height variation with respect to the respective joint surfaces 21a and 21b, the method described in the first embodiment is also adopted in this embodiment.

  Here, in the present embodiment, the height of each bonding surface 21a, 21b is larger than the above-described height variation. Thus, two types of bonding surfaces 21a, 21b having greatly different heights are respectively provided. A mounting method for joining separate semiconductor chips 10a and 10b via a joining member 30 is provided.

  That is, in the mounting method of the present embodiment, as shown in FIG. 5, the plurality of protrusions 61 of the second mold 60 are higher among the joint surfaces 21 a and 21 b of the base material 20 having different heights. The one corresponding to the first joining surface 21a is made shorter, and the one corresponding to the lower second joining surface 21b is made longer.

  And in this mounting method, using the 2nd type | mold 60 which varied the length of such a protrusion part 61, similarly to the said 1st Embodiment, a sheet | seat punching process (refer Fig.5 (a)), A sheet sticking step (see FIG. 5B) is performed.

  Thereafter, the semiconductor chips 10a and 10b are mounted on the bonding surfaces 21a and 21b of the base member 20 via the bonding member 30, respectively, and the bonding member 30 is cured. Thus, the mounting structure of the present embodiment as shown in FIG. 5C is completed.

  According to the mounting method of the present embodiment, even when separate components 10a and 10b are mounted on the two bonding surfaces 21a and 21b of the base material 20 having different heights, the distance between the bonding surfaces 21a and 21b is determined. A plurality of joining members 30 can be arranged at once.

  Moreover, the same effects as those in the first embodiment can be obtained with respect to the mounting when the bonding surfaces 21a and 21b are viewed one by one. This will be further described. When a plurality of joining members 30 are arranged with respect to the higher joining surface 21a, the higher joining surface 21a of the protrusions 61 of the second mold 60 is arranged. The corresponding lengths of the plurality of protrusions 61 are substantially the same as in the first embodiment.

  Further, when a plurality of joining members 30 are arranged with respect to the lower joining surface 21 b, a plurality of projecting portions 61 corresponding to the lower joining surface 21 b among the projecting portions 61 of the second mold 60. The length is substantially the same as in the first embodiment, and is longer than the length of the plurality of protrusions 61 corresponding to the higher joint surface 21a.

  By using the second mold 60 as described above, it is possible to arrange the joining members 30 to cope with the respective height variations in the joining surfaces 21a and 21b, while the joining surfaces 21a and 21b having different heights are arranged. The joining member 30 can be collectively arranged in between.

(Third embodiment)
6A, 6B, and 6C are schematic cross-sectional views illustrating a method of mounting the semiconductor chip 10 on the package 20 according to the third embodiment of the present invention. As in the first embodiment, the present embodiment provides a mounting method in which the semiconductor chip 10 is bonded to the bonding surface 21 of the package 10 having a height variation via the bonding member 30.

In the mounting method of the present embodiment, a semiconductor chip 10 as a component and a package 20 as a base material are prepared as in the first embodiment. Further, as shown in FIG. 6, a mold member 70 having a plurality of projecting portions 71 formed in the same arrangement pattern as the plurality of joining members 30 on the joining surface 21 of the package 20 is prepared. For example, the mold member 70 can be the same as the second mold 60 in the first embodiment. Specifically, the plurality of protrusions 71 are integrally provided on the mold member 70 as shown in FIG.

  Then, as shown in FIG. 6A, the joining member 30 is attached to the tip of each protrusion 71 in the mold member 70. As the joining member 30, a member obtained by cutting out the sheet member 31 described in the first embodiment is used. And what is necessary is just to make it attach the joining member 30 by affixing this on the front-end | tip part of each protrusion part 71. FIG.

  In the present embodiment, instead of using the sheet member 31 cut out as the joining member 30, a heat curable conductive paste such as a conductive adhesive is used, and this is used for printing, dispenser, and dipping. You may attach to the front-end | tip part of each protrusion part 71 of the type | mold member 70 by apply | coating by.

  After attaching the joining member 30 in this way, the joining of the package 20 is performed with the joining surface 21 of the package 20 and one surface of the mold member 70 facing each other, as shown in FIG. The mold member 70 is disposed on the surface 21, and then the joining member 30 is pressed against the joining surface 21 of the package 20 by the tip of the protrusion 71 of the mold member 70 and pasted.

  When the bonding member 30 is attached, the bonding member 30 may be softened as in the first embodiment. Thereafter, the mold member 70 is peeled off from the bonding member 30 and removed from the package 20, whereby a plurality of bonding members 30 are arranged on the bonding surface 21 of the package 20, as shown in FIG. It becomes a state.

  Subsequently, in this mounting method, although not shown in FIG. 6, the semiconductor chip 10 is placed on the bonding surface 21 of the package 20 via the bonding member 30 while the one surface 11 of the semiconductor chip 10 faces the bonding surface 21 of the package 20. 10 is mounted.

  Thereafter, similarly to the first embodiment, the mounting member 30 is cured to complete the mounting structure of the present embodiment. The mounting structure of this embodiment is the same as that shown in FIG. Further, by subsequently attaching the lid 26 and the like, a semiconductor device similar to that shown in FIG. 1 is completed in this embodiment.

  According to the present embodiment, the plurality of joining members 30 are pressed against the joining surface 21 of the package 20 by the tip end portions of the projecting portions 71 of the mold member 70, so that the joint surface 21 has a large height variation T. Even if it exists, the joining member 30 adheres appropriately on the entire joining surface 21.

  Further, the height of each joining member 30 can be controlled by controlling the degree (strength) of this pressing, and the height of the upper surface of each joining member 30 can be controlled by the level of the tip surfaces of all the protrusions 71 of the mold member 70. It is the same as that of the said 1st Embodiment that it can arrange equally. Therefore, even in the present embodiment, a plurality of joining members 30 can be appropriately disposed collectively even on the joining surface 21 having a large height variation T.

  In the mounting method of the present embodiment, in particular, the bonding member 30 is attached by attaching the cut-out sheet member 31 to the tip of each protrusion 71 as the bonding member 30. I am doing so. Therefore, compared to the case where the joining member 30 is applied and attached to each protruding portion 71, the attachment of each joining member 30 to the mold member 70 can be facilitated, the work efficiency can be improved, and each joining member can be improved. 30 shapes can be formed stably.

(Fourth embodiment)
7A, 7B, and 7C are schematic cross-sectional views illustrating a method of mounting the semiconductor chip 10 on the base material 20 according to the fourth embodiment of the present invention. As in the third embodiment, the present embodiment adopts a mounting method using a mold member 70 and is a part of the method. Here, the differences will be mainly described.

  In the present embodiment, as in the second embodiment, the semiconductor chip 10 includes a first semiconductor chip 10a and a second semiconductor chip 10b, and each of the two semiconductor chips 10a and 10b is bonded. The bonding surface 21 of the base material 20 is composed of a first bonding surface 21a and a second bonding surface 21b having different heights. And the mounting method shown by the said 3rd Embodiment is applied on such conditions.

  That is, in the mounting method according to the present embodiment, as shown in FIG. 7, the plurality of protrusions 71 of the mold member 70 are formed with the higher one of the joining surfaces 21 a and 21 b of the base material 20 having different heights. The one corresponding to the first joint surface 21a is shortened, and the one corresponding to the lower second joint surface 21b is lengthened.

  Then, in this mounting method, the mold member 70 having different lengths of the protrusions 71 is used to attach the joining member 30 to the protrusions 71 as in the third embodiment (FIG. 7 ( a), and bonding member 30 is affixed (see FIG. 7B), and a plurality of bonding members 30 are arranged on each bonding surface 21a, 21b.

  Thereafter, the semiconductor chips 10a and 10b are mounted on the bonding surfaces 21a and 21b of the base member 20 via the bonding member 30, respectively, and the bonding member 30 is cured. Thus, the mounting structure of the present embodiment as shown in FIG. 7C is completed.

  According to the mounting method of this embodiment, the separate components 10a and 10b are mounted on the two joint surfaces 21a and 21b of the base material 20 having different heights using the mounting method of the third embodiment described above. Even if it is a case, the some joining member 30 can be arrange | positioned collectively between each joining surface 21a, 21b.

  Moreover, the same effects as those in the first embodiment can be obtained with respect to the mounting when the bonding surfaces 21a and 21b are viewed one by one. The specific method in this case in the present embodiment is the same as the method described in the third embodiment.

(Fifth embodiment)
8A, 8B, 8C, and 8D are schematic cross-sectional views illustrating a method of mounting the semiconductor chip 10 on the package 20 according to the fifth embodiment of the present invention.

  As in the first embodiment, the present embodiment provides a mounting method in which the semiconductor chip 10 is bonded to the bonding surface 21 of the package 10 having a height variation via the bonding member 30. This embodiment is mainly a method of placing the bonding member 30 on the bonding surface 21 of the package 20 by using the mask member 80 shown in FIG.

  As shown in FIG. 8, the prepared mask member 80 has a plurality of openings 81 formed in the same arrangement pattern as the plurality of bonding members 30 on the bonding surface 21 of the package 20. Here, the mask member 80 is made of a material having lower elasticity than the package 20, for example, a material such as silicone resin or rubber.

  Then, the mask member 80 is configured such that, specifically, the package electrode 22 and the opening 81 on the bonding surface 21 are positioned so that the opening 81 is located at a portion where the plurality of bonding members 30 are to be disposed. Are arranged on the joint surface 21 so as to match.

  At this time, as shown in FIG. 8B, the mask member 80 is pressed against the bonding surface 21 of the package 20 so that the mask member 80 is deformed so as to inherit the undulating shape of the bonding surface 21. Specifically, the surface of the mask member 80 that faces the bonding surface 21 is deformed. This is possible by making the mask member 80 made of the low-elasticity material as described above.

  As a result, the entire mask member 80 is brought into close contact with the bonding surface 21 of the package 20, and as shown in FIGS. And printing through the opening 81. This printing can be performed using the squeegee K as in the case of normal screen printing.

  Thus, as shown in FIG. 8D, a plurality of joining members 30 are arranged on the joining surface 21 of the package 20. Subsequently, although not illustrated, the semiconductor chip 10 is mounted on the bonding surface 21 of the package 20 via the bonding member 30 while the one surface 11 of the semiconductor chip 10 is opposed to the bonding surface 21 of the package 20.

  After that, the mounting structure similar to the above is completed by curing the joining member 30 as in the first embodiment. Further, by subsequently attaching the lid 26 and the like, a semiconductor device similar to that shown in FIG. 1 is completed in this embodiment.

  By the way, in the conventional printing method, the mask is a hard plate-like shape, and the mask and the bonding surface are far apart in the lower part of the bonding surface of the package where the height variation exists compared to the high part. Could not be supplied.

  On the other hand, according to the mounting method of the present embodiment, the entire surface of the mask member 80 that faces the bonding surface 21 inherits the undulating shape due to the height variation of the bonding surface 21. Even if it is the joining surface 21, the some joining member 30 can be arrange | positioned collectively appropriately.

  Here, in this mounting method, when the mask member 80 is pressed against the bonding surface 21 of the package 20 and deformed, the opening area of the opening 81 is smaller than that before the deformation. The state of the opening 81 after the deformation is indicated by a broken line in FIG.

  As a countermeasure, in this embodiment, as the mask member 80, the opening area of the opening 81 is made larger than the target opening area so that the opening 81 has a target opening area when pressed against the package 20. It is preferable to use one. Thereby, the arrangement of the joining member 30 with high accuracy becomes possible.

  Here, in the present embodiment, the squeegee K used for printing by the mask member 80 may be the same as that used for normal screen printing or the like. This will be described with reference to a) and (b). In FIG. 9, (a) is a schematic sectional view showing a printing process using the squeegee K, and (b) is a schematic plan view showing the same printing process.

As shown in FIG. 9, the mask member 80 has a shape having a recess, and a plurality of openings (81) are formed at the bottom of the recess. And the bottom part of the recessed part of the mask member 80 is arrange | positioned on the joining surface 21 of the package 20, and the joining member 30 is supplied with a dispenser etc. on the bottom part of the recessed part of the mask member 80 as shown in FIG.9 (b) . Then, the joining member 30 is disposed on the joining surface 21 through the opening 81 of the mask member 80 by spreading the joining member 30 using the squeegee K accommodated in the recess of the mask member 80.

As shown in FIG. 9, a plurality of squeegees K are fixed to a rotation axis K <b> 1 provided at the center of the mask member 80. The rotation axis K1 is rotated around the axis by a motor or the like. At this time, the squeegee K is rotated in the recess of the mask member 80 by the rotation of the rotation shaft K1, and the joining member 30 is spread on the bottom of the recess of the mask member 80 along the rotation direction of the squeegee K. Thus, screen printing by the mask member 80 is performed.

  According to the method shown in FIG. 9, even if the area of the mask member 80 is small, the joining member 30 can be efficiently supplied while suppressing the movement space of the squeegee K as much as possible.

(Other embodiments)
In addition, as a component and a base material, the one surface of a base material should just be inferior in flatness rather than the one surface of a component, and is not limited to the above-mentioned semiconductor chip 10 and the package 20. FIG. For example, a circuit board may be used as a base material, and various surface mount components may be used as parts to perform bonding via a conductive adhesive or a conductive adhesive sheet.

1 is an overall schematic cross-sectional view of a semiconductor device as a component mounting structure according to a first embodiment of the present invention. FIG. 2 is a schematic top view of the semiconductor device in FIG. 1. It is an expanded sectional view of the junction part between both electrodes in the semiconductor device shown in FIG. It is process drawing which shows the mounting method of 1st Embodiment. It is a schematic sectional drawing which shows the mounting method which concerns on 2nd Embodiment of this invention. It is a schematic sectional drawing which shows the mounting method which concerns on 3rd Embodiment of this invention. It is a schematic sectional drawing which shows the mounting method which concerns on 4th Embodiment of this invention. It is a schematic sectional drawing which shows the mounting method which concerns on 5th Embodiment of this invention. It is a figure which shows the example of the printing method which concerns on 5th Embodiment. It is a schematic sectional drawing which shows a prototype of this inventor.

Explanation of symbols

10 ... Semiconductor chip as a part, 10a ... First semiconductor chip,
10b ... second semiconductor chip, 11 ... one side of the semiconductor chip,
20 ... Package as a substrate, 21 ... Bonding surface of substrate, 21a ... First bonding surface,
21b ... second joining surface, 30 ... joining member, punched portion, 31 ... sheet member,
50 ... 1st type | mold, 51 ... Opening part of 1st type | mold, 60 ... 2nd type | mold,
61 ... Projection part of the second mold, 70 ... Mold member, 71 ... Projection part of the mold member,
80: mask member, 81: opening of the mask member.

Claims (4)

The one surface (11) of the component (10) and the one surface (21) of the base material (20) having a lower flatness than the one surface (11) of the component (10) are opposed to each other, and both the members (10, 20). In a component mounting method in which a plurality of joining members (30) interposed between the two members (10, 20) are joined.
A mask member (80) having a plurality of openings (81) formed in the same arrangement pattern as the plurality of joining members (30), and a joining member (30) supplied on the mask member (80). Prepare a squeegee (K)
The mask member (80) has a shape having a recess capable of storing the joining member (30),
The squeegee (K) includes a rotation shaft (K1) and a plurality of squeegees (K) fixed to the rotation shaft (K1) and rotating together with the rotation shaft (K1).
The plurality of squeegees (K) are rotatably accommodated in the recesses,
The plurality of openings (81) are formed at the bottom of the recess,
The concave portion of the mask member (80) on one surface (21) of the base (20) so that the opening (81) is located at a portion where the plurality of joining members (30) are to be disposed. With the bottom of the
The bottom of the concave portion of the mask member (80) is pressed against one surface (21) of the base material (20), and the mask member (80) faces the one surface (21) of the base material (20). The bottom of the concave portion is deformed so as to inherit the undulating shape of the one surface (21), and in this state, the plurality of squeegees (K) are rotated together with the rotating shaft (K1), whereby the joining member (30) is The bonding member (30) is spread on the bottom of the concave portion of the mask member (80) and printed on the one surface (21) of the base material (20) through the opening (81). How to mount the parts. As the mask member (80), the opening area of the opening (81) is made larger than the opening area of the target so that the opening (81) has a target opening area when pressed against the base material (20). 2. The component mounting method according to claim 1 , wherein a larger one is used. The height variation existing on one surface (21) of the base material (20) is 15 μm or more as a difference between the highest portion and the lowest portion on the one surface (21). Or the mounting method of the components of 2 . The component is a semiconductor chip (10), the substrate component mounting method according to any one of claims 1 to 3, characterized in that a package consisting of ceramic (20).

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