JP4799990B2 - Flux application device - Google Patents

Description

  The present invention relates to a flux application apparatus that can apply a flux to an electronic component uniformly with a predetermined thickness by processing in a relatively simple process.

  In the process of transferring paste such as flux (hereinafter simply referred to as “flux”) onto the transfer surface of the transfer object such as an electronic component or a conductive ball, conventionally, a gap is provided by floating on a flat surface where an appropriate amount of flux is accumulated. On the other hand, the squeegee is slid to form a flux film having a constant thickness, and the transfer surface is brought into contact with the flux film for transfer.

  The surface to be transferred has irregularities, and there are convex portions where the flux is transferred and concave portions where the flux is not transferred. In general, in an electronic component, a flux is transferred to a bump on a surface to be transferred, but not transferred to the other, and the bump portion is more convex than others. Therefore, the transferred flux film is not flat because the transferred portion has a concave surface. For the next transfer, the squeegee is slid to form a constant-thickness flux film with a flat surface again. It is necessary to keep.

  Further, in Patent Document 1, while moving a belt-shaped transfer body on which a constant-thickness flux film is formed, an electronic component adsorbed on the head is moved at the same speed as that of the movement, and the object is covered. A technique of transferring a flux by bringing a transfer surface into contact therewith is disclosed. In this technique, the dropped conductive ball is caught by a projecting piece provided at the front of the transfer body during the transfer.

  In the above-described conventional example in which the squeegee is slid, the transfer is performed after the flux film is formed. On the other hand, in the technique of Patent Document 1, the formation is performed sequentially without waiting for the formation to be completed, and the film thickness is constant. By the flux film, the belt is moved and transferred sequentially. For this reason, transfer can be performed while the formation is continuously performed, and time loss can be reduced.

Japanese Patent No. 3341586

  However, in the case of Patent Document 1, in the transfer process, the belt and the transfer object are moved in this way. Further, the contact portion sequentially moves the partial contact where the belt is cylindrical with respect to the contact surface. Accordingly, the contact between the belt and the transfer object is unstable. Since the electronic parts and the like of the object to be transferred are minimized, there is a high possibility that the electronic parts and the like will be dropped at the time of transfer or that they will be excessively immersed in the flux film.

  The present invention has been made to solve the above-mentioned conventional problems, and a flux coating apparatus capable of coating flux on an electronic component uniformly with a predetermined thickness by processing in a relatively simple process. The issue is to provide.

In the present invention, the back-up plate formed on a flat top surface and the surface on which the transfer surface of the electronic component is pressed by forming the flux film are located on the top surface of the back-up plate, and the top surface can be moved. And a belt that circulates and rotates under the backup plate, and a flux chamber that stores flux therein and is pressed against the upper surface of the belt with a predetermined force. The wall in the traveling direction of the belt at the time of film formation is a predetermined height for creating a gap with the belt, and the internal flux is sent out when forming a flux film having a width wider than the surface to be pressed to be pressed. slit for the flux film formation is provided, the wall of said flux chamber, and the traveling direction is located above the belt on the opposite side Is provided with a flux recovery opening having a height and width larger than the flux film forming slit, and the upper surface of the backup plate is larger than the transferred surface pressed against the belt, and the width of the belt is The above problems are solved by the fact that the width of the upper surface is wider than the width of the flux film.

  Further, in the flux application apparatus, an opening amount is set in the slit for forming the flux film based on a signal from the control unit, whereby a gate capable of arbitrarily setting the predetermined height is provided. The film thickness of the flux film can be quickly changed according to the transferred material. Some bumps on the transfer surface of electronic parts have different sizes. When transferring with a film thickness according to the size, change the film thickness of the flux film as described above. It can correspond to.

  Further, in the flux application apparatus, a detection sensor used for detecting the thickness of the flux film fed from the flux film forming slit along with the rotation of the belt is provided on the traveling direction side from the flux chamber, Since the control unit outputs the signal so that the detected thickness matches the target value, the flux film having the required film thickness can be reliably formed.

  The operation of the present invention will be briefly described below.

  In the present invention, the flux is stored inside, and the flux is transferred to the transfer surface on the upper surface of the belt while feeding the flux from the flux chamber pressed against the upper surface of the rotating and rotating belt with a predetermined force. A film is formed.

  In the flux chamber, a slit for forming a flux film is provided on the wall in the direction of travel of the belt when the flux film is formed. The slit for forming the flux film has a predetermined height for forming a gap with the belt, and has a width wider than the outer shape of the transferred surface at the time of transfer.

  Therefore, when the belt rotates, the flux adhering to the belt is drawn by the belt in the gap between the flux film forming slit and the belt, and the cross section of the flux film thus drawn is , And formed by the height and width of the slit for forming the flux film. Therefore, a flux film having a required width can be formed with an appropriate film thickness according to the height of the slit for forming the flux film.

  When transferring with the formed flux film, the transfer surface is pressed against the belt on which the flux film is formed on a backup plate larger than the outer shape of the transfer surface of the electronic component. The pressing is a contact of the surface to be transferred with the flux film so that an appropriate flux is immersed. At the time of the pressing, the movement of the belt is stopped, and the upper surface of the backup plate of the present invention is formed in a flat plane, so that extremely stable transfer of the flux becomes possible.

Furthermore, in the present invention, when the belt is moved again after the transfer as described above, the belt circulates under the back-up plate, and the flux chamber is opposite to the moving direction of the belt. To the wall. The wall is provided with a flux collection opening having a height and width larger than those of the flux film forming slit described above. Therefore, the flux remaining on the belt and adhering to the belt passes through the flux collection opening, reaches the inside of the flux chamber, and is collected inside the flux chamber.

  Therefore, according to the invention of the present application, it is possible to provide a flux application device that can apply a flux to an electronic component with a predetermined thickness without any unevenness by a relatively simple process.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a plan view seen from above showing a configuration of a flux applying apparatus according to a first embodiment to which the present invention is applied. FIG. 2 is a side view of the flux applying device as viewed from the lower side to the upper side in FIG. FIG. 3 is a cross-sectional view showing the operation of the flux applying apparatus, similarly viewed from the lower side to the upper side in FIG. Next, FIG. 4 is a front view of the flux coating apparatus when viewed in the direction of arrow Z in FIG. FIG. 5 is a partially enlarged view of FIG.

  Reference numeral 1 denotes a frame A, reference numeral 2 denotes a frame B, reference numeral 3 denotes a backup plate, and reference numeral 4 denotes a flux belt. Reference numeral 5 denotes a driving roller, reference numeral 6 denotes a driven roller, reference numeral 10 denotes a motor, reference numeral 11 denotes a driving belt, reference numeral 12 denotes a driving pulley, reference numeral 13 denotes a motor pulley, reference numeral 14 denotes a driving roller bearing, reference numeral 15 denotes a driven roller shaft, reference numeral 16 Is a driven roller bearing.

  Reference numeral 17 denotes a tensioner screw, reference numeral 20 denotes a flux chamber, reference numeral 21 denotes an arm, reference numeral 22 denotes an arm spring, reference numeral 23 denotes an arm hinge, reference numeral 24 denotes a flux film forming slit, reference numeral 25 denotes a flux chamber hinge, and reference numeral 26 denotes a bump. The reference numeral 27 denotes a dent after flux transfer, and the reference numeral 28 denotes a flux recovery opening. Reference numeral 31 denotes a suction head, reference numeral 32 denotes a nozzle, reference numeral 33 denotes an electronic component, reference numeral 34 denotes a bump, reference numeral 35 denotes a flux in the flux chamber, reference numeral 36 denotes a flux film formed on the flux belt, and reference numeral 38 denotes a slit. It is a lid.

  A driving roller 5 and a driven roller 6 for rotating the flux belt 4 are provided in front of the frame A1 and the frame B2. The flux belt 4 is stretched at a constant tension by a tensioner screw 17 attached to the driven roller shaft 15. The driving force generated by the motor 10 is transmitted to the driving roller 5 by the motor pulley 13, the driving belt 11 and the driving pulley 12. The driving roller 5 is rotationally driven by the torque of the transmission driving force to rotate the flux belt 4.

  At the time of forward rotation in rotation of the flux belt 4, the flux belt 4 moves in the direction of the arrow A1 shown on the side where the electronic component 33 of the suction head 31 is pressed, that is, on the upper side in the side view of FIG. Further, at the time of the forward rotation, the flux belt 4 moves in the direction of the arrow A2 on the lower side of the backup plate 3, that is, on the lower side in FIG.

  The direction of movement is the traveling direction of the flux belt 4, and the direction perpendicular to the traveling direction is the width direction. The width of the flux belt 4 is W2, and the width of the flux chamber 20 pressed against the flux belt 4 is W1. The upper surface of the backup plate 3 that guides the flux belt 4 from the inside of the rotation of the flux belt 4 is flat, and its width is W4. The width of the flux film 36 adhered to the flux belt 4 and fed out from the flux chamber 20 is W3. In FIG. 1, in the surface (transfer target surface) on which the flux is transferred and applied in the electronic component 33 indicated by the solid line 33 and the alternate long and short dash line 33a, the dimension in the width direction is the width W0, and the dimension in the traveling direction is the length L0. And Further, the dimension in the traveling direction of the flux film 36 is L3, and the dimension in the traveling direction of the surface of the backup plate 3 that keeps the flux belt 4 flat from the back surface during the transfer of the flux is L4.

  The width W2 of the flux belt 4 is equal to or greater than the width W1 of the flux chamber 20. The upper surface of the backup plate 3 is in contact with the flux belt 4 moving above the backup plate 3 from the back side of the flux belt 4, that is, from the inside of the rotating flux belt 4, and guides the rotation of the flux belt 4. The contact surface of the flux belt 4 is kept flat when the electronic component 33 is contacted during the flux transfer, and the width W2 is wider than the width W4 of the backup plate 3, and at the same time, the width W4 and width W3 are wider than width W0.

  In the electronic component 33, the shape of the transfer surface onto which the flux is transferred and applied is not limited to the rectangle or square as shown in FIG. 1, but may be a polygon, a circle or an ellipse. Needless to say. Here, in any shape, if the contour of the shape is an outer shape, the width W0 may be the maximum width of the outer shape in the width direction, and the length L0 is What is necessary is just to set it as the maximum length of the said external shape of the above-mentioned advancing direction.

  Here, in a general expression, when the transfer surface of the electronic component 33 is immersed in the flux film 36 on the flux belt 4 to transfer the flux, the backup plate 3 that contacts the flux belt 4 from the back side. The upper surface of the transfer belt is large with respect to the entire outer shape of the transfer surface that is in contact with the flux belt 4, and at least a part of the surface of the transfer surface needs to coincide with each other. The area of the flux belt 4 is maintained flat. Further, the area where the flux film 36 is formed on the flux belt 4 is also larger than the entire outer shape of the transfer surface, and at least a part of the position on the plane needs to coincide. In this way, the entire surface to be transferred can be immersed in the flux film 36. Here, the term “large” means that the dimension in the width direction, the traveling direction, or any other direction is large with respect to the transfer surface.

  1 to 3 and 5 to 8, the flux belt 4 rotates forward and moves in the direction of arrows A1 and A2 when forming the flux film or collecting the flux. Proceed from right to left. In the flux chamber 20, a flux film forming slit 24 having a width W <b> 3 is provided in a gap S with the flux belt 4 at a lower portion of the wall 20 a in the traveling direction. The flux chamber 20 has walls on the four sides of the upper, right, left, and flux belt 4 travel directions, and the bottom is open, and the surface opposite to the travel direction of the flux belt 4 is wider than the width W3. Thus, the opening 28 for flux recovery is formed.

  The flux chamber 20 is positioned in the flux application device by the flux chamber hinge 25 being hooked on the hook portion 21a of the arm. The arm 21 is pulled by an arm spring 22 and acts to press the flux chamber 20 against the flux belt 4 with the arm hinge 23 as a fulcrum.

  Hereinafter, the operation of the present embodiment will be described.

  When the flux belt 4 rotates, the flux 35 in the flux chamber 20 passes through the slit 24 of the wall 20a while adhering to the flux belt 4. Since the flux 35 is regulated by the gap S and the width W3 of the slit 24, the flux 35 is formed on the flux belt 4 into a flux film 36 having a uniform thickness T and a width of about W3, and is discharged from the flux chamber 20. Thus, it is sent out as the flux belt 4 advances.

  When the length of the feed is commensurate with the size of the electronic component 33 and the flux film 36 having a sufficient area to be applied to the electronic component 33 is formed (shaded portion in FIG. 1), the motor 10 And the flux belt 4 is stopped.

  The electronic component 33 is conveyed to the flux application device of the present embodiment in a state where the electronic component 33 is attracted to the suction head 31 with the bump surface facing downward. Further, as shown by the arrow in FIG. 1, the flux moves to the flux transfer position above the flux film 36 formed as described above. At the flux transfer position, the suction head 31 is stopped (reference F in FIG. 4), and the suction head 31 is lowered until the bump of the electronic component 33 comes into contact with the flux film 36, and the bump of the electronic component 33 is moved to the flux film. Immerse in 36 (FIG. 3). In the present embodiment, in the electronic component 33, the flux is transferred only to the bumps that are more convex than the others.

  On the flux belt 4, a flux film 36 is formed with a uniform thickness T. Accordingly, the flux having the thickness T uniformly adheres to all the bumps on the lower surface of the electronic component 33 promptly by the contact.

  Thereafter, the suction head 31 is raised (FIG. 5), and the electronic component 33 with the flux attached is moved to the substrate mounting process. In the flux film 36, the portion where the flux adheres from the electronic component 33 becomes a dent 27 as shown in FIG. Therefore, the next electronic component 33 cannot perform uniform flux immersion with the thickness T at the same position.

  In the present embodiment, while the flux belt 4 is rotated and sent out, the flux film 36 having a uniform thickness T and an area suitable for transfer to the electronic component 33 is formed one after another to the above-described flux transfer position. Can do. Therefore, in FIG. 4, even if the electronic component 33 is continuously sent as indicated by reference numerals E, F, G, and H, it is possible to perform flux application without waiting time or with little waiting time.

  In this embodiment, the movement operation of the suction head 31, the raising / lowering operation of the suction head 31, the rotation operation of the motor 10 that drives the flux belt 4, the stop of the movement operation, and the stop of the rotation operation are shown in FIG. 6. As shown in the time chart, they are linked to each other.

  Next, FIG. 7 is a cross-sectional view showing an outline of a first modification of the flux chamber 20 that can be used in the first embodiment. FIG. 8 is a cross-sectional view showing an outline of a second modification of the flux chamber 20. These sectional views are when the upper side is viewed from the lower side in FIG.

  In the first modified example, the lid 38 of the slit 24 is provided on the flux chamber 20 shown in FIGS. When the lid is lowered and brought into close contact with the flux belt 4, the opening of the slit 24 is sealed. When the flux belt 4 is rotated in the sealed state, the flux adhering to the flux belt 4 is accommodated in the flux chamber 20 together with the rotation, so that the remaining flux can be easily recovered.

  Next, in the second modification, the flux chamber 50 of FIG. 8 corresponds to the flux chamber 20 shown in FIGS. 1 to 6 and is used instead. In the flux chamber 50, reference numeral 51 is a gate, 52 is a gate adjusting screw, 53 is a gate spring, and 54 is a gate hinge.

  When the gate adjustment screw 52 is in the raised position as shown in FIG. 8, the gate 51 is closed as shown by the solid line in FIG. 8, and the opening of the slit 24 is sealed. When the gate adjusting screw 52 is rotated and lowered, the gate 51 rotates about the gate hinge 54 as the rotation axis, and the opening of the slit 24 is opened, as shown by the two-dot chain line in FIG. . In the state of the two-dot chain line in FIG. 8, the opening is a gap S.

  When the flux belt 4 moves in the direction of the arrow A1, if the opening of the slit 24 is sealed (solid gate 51), the flux film 36 is not formed. On the other hand, if the slit 24 is opened in the gap S as described above (two-dot chain line gate 51), the flux 35 is sent out along with the movement, and the flux film 36 is formed. .

  The flux chamber 20 shown in FIGS. 1 to 6 has a wall structure in which the slit height S is fixed, whereas in the second modification, the gate 51 rotates around the gate hinge 54. Thus, the height S of the slit can be adjusted. The gate spring 53 applies a counterclockwise force to the gate 51 and acts in a direction in which the tip of the gate 51 is pressed against the surface of the flux belt 4 and the gate 51 is closed. However, since the force is weaker than the force of the arm spring 22, the flux chamber 50 does not leave the surface of the flux belt 4.

  In the flux chamber 50, when the gate adjusting screw 52 is rotated and lowered, the gate 51 rotates in the clockwise direction, the tip of the gate 51 is separated from the surface of the flux belt 4, and a gap S is formed and becomes wider. As described above, in the second modification, the gap S can be adjusted in accordance with the descending amount of the gate adjusting screw 52, so that the thickness T of the flux film 36 can be easily changed.

  As described above, according to this embodiment, the present invention can be applied effectively.

  When using a squeegee as in the above-described conventional example, the squeegee is normally reciprocated. In this embodiment, since the flux film 36 can be formed by moving the flux belt 4 only in one direction, the processing time can be shortened.

  Further, during the squeegee operation, physical interference with the squeegee and others occurs at the flux transfer position, and the electronic component 33 cannot approach. On the other hand, in the present embodiment, the operation of forming the flux film 36 is the movement of the flux belt 4, so that the electronic component 33 can approach the flux transfer position even during the formation of the flux film 36. Therefore, most of the conveyance process of the electronic component 33 and the formation process of the flux film 36 can be performed in parallel, so that the processing time can be shortened and the productivity is good.

  Furthermore, in the present embodiment, the flux of the flux film 36 can be easily collected into the flux chamber 20 by closing the slit 24. Therefore, it can suppress that a flux gets dirty or deteriorates.

  Next, FIG. 9 is a plan view seen from above showing the configuration of the flux applying apparatus of the second embodiment to which the present invention is applied. FIG. 10 is a side view of the flux applying apparatus as viewed from the lower side to the upper side in FIG. Next, FIG. 11 is a rear view of the flux applying device as viewed from the right side in FIG. FIG. 12 is a partially enlarged view of FIG. FIG. 13 is a front view of the flux applying device when viewed from the left side in the arrow Z direction in FIG. FIG. 14 is a side view of the flux chamber 20 of the present embodiment.

  The second embodiment is different from the first embodiment in the configuration of a part of the flux chamber 20.

  That is, in this embodiment, in the flux chamber 20, the gate 51 is provided immediately after the slit 24 in the traveling direction of the flux belt 4, and by controlling the opening degree of the gate 51, the flux belt 4 is rotated. The film thickness T of the flux film that is fed from the slit 24 and formed can be controlled. Further, a flux film thickness detection sensor 40 is provided further on the side of the flux belt 4 in the traveling direction than the gate 51 so that the formed film thickness can be detected at any time.

  In this embodiment, reference numeral 41 is a gate lever, reference numeral 42 is a gate motor, reference numeral 43 is a gate adjustment screw, reference numeral 45 is a gate adjustment block, reference numeral 46 is a gate adjustment pin, reference numeral 47 is a gate adjustment pin oblong hole, reference numeral 53 is A gate spring 54 is a gate hinge.

  When the gate adjustment block 45 is moved by the gate adjustment screw 43 driven by the gate motor 42, the gate lever 41 is pushed by the gate adjustment pin 46 provided in the gate adjustment block 45, and the gate hinge 54 is centered. , It rotates in the clockwise direction in FIG. Since the gate 51 rotates in conjunction with the gate lever 41, the height of the gap S of the slit 24 becomes an opening degree at which the gate 51 is operated, and is controlled by the gate motor 42.

  In FIG. 14, the closed state of the gate 51 is indicated by a two-dot chain line, and the open state is indicated by a solid line. Reference numeral 41A shows the gate lever 41 when the gate 51 is closed, and reference numeral 41B shows the gate lever 41 when the gate 51 is open.

  Here, when the gate motor 42 is driven in the direction in which the gate 51 is closed, the gate 51 is returned in the counterclockwise direction by the gate spring 53 to contact the flux belt 4 and the gate 51 is closed.

  In the present embodiment, the film thickness of the flux film 36 sent out from the flux chamber 20 and formed by the flux film thickness detection sensor 40 outside the gate 51 is detected as needed. In addition, feedback control of the film thickness is performed by controlling the opening of the gate 51 according to the difference between the detected film thickness and the target film thickness so that the film thickness becomes the target thickness. The flux film 36 having a uniform target film thickness is formed.

  15 to 17 are side views of the respective operation stages, showing the operation of the present embodiment. FIG. 18 is a flowchart showing the operation of this embodiment.

  In the present embodiment, steps 112 to 120 are transport processing of the electronic component 33 by the suction head 31. Steps 212 to 230 are processes for forming the flux film 36. When an electronic component to be flux-transferred is selected, data of a flux film to be transferred corresponding to the size of the bump of the electronic component is acquired in the control unit of the present embodiment. Note that these transfer processing and formation processing are partially performed in parallel.

  In step 112, the suction head 31 moves to a predetermined suction position, and the electronic component 33 is sucked by the nozzle 32. In step 114, it moves up again so that no contact or interference can occur in the moving operation. After this, it moves to the flux transfer position in the flux application device.

  In parallel with the transport process of step 112 and step 114, the flux film forming process of steps 212 to 2224 is performed. FIG. 15 shows a state in which the suction head 31 sucks the electronic component 33 and the flux film 36 is not yet formed.

  In step 212, the control unit that controls the rotation of the motor 10 and the gate motor 42 in the present embodiment outputs an instruction signal for the motor 10 to rotate forward at a predetermined feed speed to the motor 10, and the motor 10 performs rotational driving. The rotational movement of the flux belt 4 is started. The flux belt 4 moves in the lower part of the flux chamber 20 in the direction from the right side to the left side in FIG. 9, FIG. 12, FIG. 12, and FIG.

  In step 214, detection of the film thickness of the flux film 36 by the flux film thickness detection sensor 40 is started. The detected film thickness is grasped on the basis of a signal input from the flux film thickness detection sensor 40 in the control unit described above. In steps 216 and 218, the control unit performs feedback control related to the film thickness described above.

  In step 216, the control unit outputs a signal for instructing the gate motor 42 to perform normal rotation in accordance with the feedback control. Then, the gate motor 42 opens the closed gate 51.

  In step 218, the control unit obtains a difference between the film thickness of the flux film 36 grasped by a signal from the flux film thickness detection sensor 40 and a preset target film thickness. It is determined whether or not the threshold value is exceeded. If it is determined that the threshold is greater than or equal to the threshold value, the process returns to step 216, and the control unit performs forward rotation if the difference is negative (the detected film thickness is small), and reverse rotation if the difference is positive (the detected film thickness is large). By outputting a rotation instruction signal to the gate motor 42, the opening degree of the gate 51 is adjusted. Alternatively, if it is determined that the value is smaller than the threshold value, the process proceeds to the next step 220.

  Here, the above-mentioned target film thickness is the thickness of the flux film 36 transferred to the electronic component 33, and becomes thicker when the flux transferred to the electronic component 33 is thickened. The thickness of the flux transferred to the electronic component 33 is determined according to, for example, the size of bumps on the transfer surface of the electronic component 33. When the gate motor 42 rotates in the forward direction, the gate 51 is opened, and when it rotates in the reverse direction, the gate 51 is closed.

  In step 220, the control unit measures the length that the flux belt 4 rotates and moves after the difference from the target film thickness is determined to be equal to or less than the threshold value. The measurement of the length of the flux film 36 formed with the specified film thickness T is started. This rotational movement length measurement may be performed by counting pulse signals output from a rotary encoder attached to the motor 10, the motor pulley 13, or the drive pulley 12 and calculating from the counted number.

  In step 222, the control unit determines whether the length of the flux film 36 to be measured as described above is sufficient to transfer to the electronic component 33. If it is determined that it is not sufficient yet, the process returns to the front of step 220. If it is determined that it is sufficient, in step 224, the control unit stops the driving of the motor 10, thereby Stop rotational movement. Subsequently, in step 226, the control unit outputs a reverse rotation signal to the gate motor 42 and closes the gate 51. As the gate motor 42 rotates in the reverse direction, the gate 51 is closed by the tension of the gate spring 53.

  When the suction head 31 reaches the flux transfer position in step 114 and the rotational movement of the flux belt 4 is stopped in step 224, the state shown in FIG. In this state, in step 116, the suction head 31 moves down until the bump on the lower surface of the electronic component 33 that is being sucked is immersed in the flux film 36. After the lowering, the state shown in FIG. After the immersion, the suction head 31 rises in preparation for the next moving operation in Step 118 while the electronic component 33 is sucked by the nozzle 32, and transports the electronic component 33 immersed in Step 120 to the substrate mounting position. To do.

  After the above-described step 226, the flux recovery processing at step 228 and step 230 is performed. In the case where the immersion process in steps 116 to 120 described above is performed, the flux recovery process can be performed in parallel with the immersion process.

  In step 228, under the control of the control unit, the motor 10 is operated while the gate 51 is closed, and the rotational driving of the flux belt 4 is started. In step 230, the portion where the flux film 36 is formed on the flux belt 4 by the rotational drive reaches the flux chamber 20 from the right side in FIGS. 9 and 10, and the flux of the flux film 36 flows into the flux chamber 20. To be recovered.

  As described above, according to the present embodiment, the present invention can be applied effectively.

  In the present embodiment, at least a part of the conveying process of the electronic component 33 and the forming process of the flux film 36 can be performed in parallel. Therefore, in FIG. 13, even if the electronic component 33 is continuously sent as indicated by reference numerals E, F, G, and H, it is possible to perform flux application with no waiting time or less.

  Also, when handling various electronic components together, if an electronic component to be flux-transferred is selected, the size of the bump of the selected electronic component stored as electronic data is read out. Grasping and obtaining the thickness of the flux film to be transferred according to the bump size, or reading out and obtaining the thickness data of the selected electronic component stored as electronic data be able to. Then, the flux film 36 can be formed by changing the film thickness immediately. Furthermore, in the formation, since feedback control can be applied as described above, the control accuracy of the formed film thickness can be increased.

  As described above, according to the present invention, it is possible to provide a flux application device that can apply a flux to an electronic component with a predetermined thickness without any unevenness by processing in a relatively simple process.

The top view seen from the upper part which shows the structure of the flux application | coating apparatus of 1st Embodiment to which this invention was applied. The side view of this flux application | coating apparatus seen from the lower side to the upper side in FIG. Sectional drawing which similarly shows the effect | action of this flux application | coating apparatus seen from the lower side to the upper side in this FIG. The front view of this flux application | coating apparatus at the time of seeing to the arrow Z direction in the said FIG. FIG. 4 is a partially enlarged view of FIG. 3. The time chart which shows the operation | movement of the said 1st Embodiment. Sectional drawing which shows the outline | summary of the 1st modification of the flux chamber which can be used for the said 1st Embodiment. Sectional drawing which shows the outline | summary of the 2nd modification of this flux chamber. The top view seen from the top which shows the structure of the flux application | coating apparatus of 2nd Embodiment to which this invention was applied. The side view of this flux application | coating apparatus seen from the lower side to the upper side in this FIG. The rear view of this flux application | coating apparatus at the time of seeing from the right side in the said FIG. FIG. 11 is a partially enlarged view of FIG. 10. The front view of this flux application | coating apparatus at the time of seeing to the arrow Z direction from the left side in the said FIG. The side view of the flux chamber of the said 2nd Embodiment. The side view of the 1st step which shows operation | movement of the said 2nd Embodiment. The side view of the 2nd step which shows operation | movement of the said 2nd Embodiment. The side view of the 3rd step which shows operation | movement of the said 2nd Embodiment. The time chart which shows operation | movement of the said 2nd Embodiment.

Explanation of symbols

1 ... Frame A
2 ... Frame B
DESCRIPTION OF SYMBOLS 3 ... Backup plate 4 ... Flux belt 5 ... Drive roller 6 ... Drive roller 10 ... Motor 11 ... Drive belt 12 ... Drive pulley 13 ... Motor pulley 14 ... Drive roller bearing 15 ... Drive roller shaft 16 ... Drive roller roller 17 ... Tensioner screw 20 50 ... Flux chamber 21 ... Arm 22 ... Arm spring 23 ... Arm hinge 24 ... Slit for forming flux film 25 ... Flux chamber hinge 26 ... Flux 28 ... Flux recovery opening 28
DESCRIPTION OF SYMBOLS 31 ... Adsorption head 32 ... Nozzle 33 ... Electronic component 34 ... Bump 35 ... Flux 36 ... Flux film 38 ... Slit cover 40 ... Flux film thickness detection sensor 41 ... Gate lever 42 ... Gate motor 43 ... Gate adjustment screw 45 ... Gate adjustment block 46 ... Gate adjustment pin 47 ... Gate adjustment pin oblong hole 51 ... Gate 52 ... Gate adjustment screw 53 ... Gate spring 54 ... Gate hinge

Claims (3)

A backup plate formed on a flat top surface;
A belt on which the transfer surface of the electronic component is pressed and the flux film is formed is positioned on the upper surface of the backup plate, the upper surface is movable, and the belt rotates around and rotates under the backup plate; ,
A flux chamber that stores flux therein and is pressed against the upper surface of the belt with a predetermined force;
In the flux chamber, the wall in the direction of travel of the belt at the time of forming the flux film is a predetermined height for creating a gap between the belt and a width of the flux film wider than the pressed surface to be pressed. A slit for forming a flux film for feeding out the internal flux at the time of formation is provided,
A flux recovery opening having a height and width larger than the flux film forming slit is provided on a wall of the flux chamber opposite to the traveling direction and above the belt .
The flux coating apparatus, wherein the upper surface of the backup plate is larger than the surface to be transferred pressed against the belt, and the width of the belt is wider than the width of the upper surface and the width of the flux film. In the flux application apparatus according to claim 1,
The flux coating apparatus is characterized in that the flux film forming slit is provided with a gate in which an opening amount is set based on a signal from a control unit, whereby the predetermined height can be arbitrarily set. In the flux application apparatus according to claim 2,
A detection sensor used for detecting the thickness of the flux film sent out from the flux film forming slit along with the rotation of the belt is provided on the traveling direction side from the flux chamber,
The flux coating apparatus, wherein the control unit outputs the signal so that the thickness of the detection matches the target value.

Images