JP4801438B2 - Polishing apparatus and polishing processing method - Google Patents

Description

  The present invention includes a polishing liquid supply nozzle for supplying a polishing liquid to a storage section, a polishing liquid supply apparatus that includes the polishing liquid supply nozzle and supplies the polishing liquid to the polishing section, and a supply of the polishing liquid The present invention relates to a polishing apparatus using the apparatus.

  In polishing processing that requires a high degree of finished surface accuracy, such as polishing of a magnetic disk substrate, a planetary gear system that uses a polishing cloth and a polishing liquid in which fine abrasive grains are suspended is used to polish both surfaces of the substrate. (For example, Patent Documents 1 to 5).

  This type of polishing apparatus (2) illustrated in FIG. 4 is mainly composed of a polishing section (10) and a polishing liquid supply section (70) for supplying a polishing liquid to the polishing section (10).

  The polishing section (10) meshes with the sun gear (20), the internal gear (22) arranged concentrically on the outer side, the sun gear (20) and the internal gear (22), and the sun gear (20) and / or a carrier (30) that revolves and rotates according to the rotation of the internal gear (22), and an object to be polished (S) held by the carrier (30) can be clamped from above and below. It has a board (15) and a lower surface plate (11). Abrasive cloths (12b) and (12a) are respectively attached to the holding surfaces of the upper surface plate (15) and the lower surface plate (11). The upper surface plate (15) is provided with a large number of liquid supply holes (18) and peeling fluid supply holes (19).

  The polishing liquid supply section (70) includes a bowl-shaped main body (71) whose overall shape is ring-shaped and whose longitudinal section is substantially U-shaped, and a number of liquid delivery holes are formed at the bottom of the bowl-shaped main body (71). (72) is opened and connected to the liquid supply hole (18) of the upper surface plate (15) by a tube (51). Further, the upper portion of the bowl-shaped body (71) is opened, and a polishing liquid nozzle (42) for introducing polishing liquid from a polishing liquid tank (not shown) and a rinsing liquid for introducing rinsing liquid from a rinsing liquid tank (not shown) A nozzle (43) is arranged. The polishing liquid and the rinsing liquid are supplied to the bowl-shaped main body (71) as needed from the nozzles (42) and (43), and the liquid supply holes of the upper surface plate (15) through the liquid delivery holes (72) and the tubes (51). Supplied between the polishing cloths (12b) and (12a) of the upper and lower surface plates (15) and (11) from (18).

At the time of polishing, the workpiece (S) held by the carrier (30) is sandwiched between the upper surface plate (15) and the lower surface plate (11) and the polishing cloth (12b ) (12a) and the object to be polished (S) while supplying the polishing liquid, the carrier (30) is rotated and rotated according to the rotation of the sun gear (20) and / or the internal gear (22). Let At this time, the upper surface plate (15) and the lower surface plate (11) are also rotated as necessary.
In such a polishing apparatus (2), a donut-shaped region between the sun gear (20) and the internal gear (22) and between the upper surface plate (15) and the lower surface plate (11) is actually This is the polishing region. The polishing liquid is supplied to the doughnut-shaped polishing region through the liquid supply hole (18) formed in the upper surface plate (15).

  When the polishing is completed and the supply of the polishing liquid from the polishing liquid nozzle (42) to the bowl-shaped main body (71) is stopped, the supply of the polishing liquid to the polishing region is also stopped. Next, the rinsing liquid is supplied from the rinsing liquid nozzle (43) to the bowl-shaped main body (71), and the rinsing liquid is supplied to the polishing region via the tube (51) and the liquid supply hole (18) and remains. Wash away the polishing liquid.

In FIG. 4, reference numeral (53) denotes a fluid introduction tube connected in communication with the peeling fluid supply hole (19). When the upper surface plate (15) is raised and the object to be polished (S) is taken out, the object to be polished (S) is attached to the polishing cloth (12b) of the upper surface plate (15) by the polishing liquid and lifted. In order to prevent this, air and water are alternately supplied from the tube (53) and ejected from the peeling fluid supply hole (19), and the object to be polished (S) is peeled off from the upper surface plate (15). deep.
JP 2004-243503 A JP 2004-249444 A JP 2004-255530 A JP 2004-255532 A JP 2002-217138 A

  In the polishing liquid supply apparatus (70) described above, the bowl-shaped main body (71) is commonly used as a storage part for the polishing liquid and the rinsing liquid. For this reason, the supply of the polishing liquid to the bowl-shaped main body (71) is stopped while the rinsing liquid is supplied to the polishing region. When the supply of the polishing liquid from the nozzle (42) is stopped, the slurry-like polishing liquid easily collects at the tip of the nozzle (42), and when the collected polishing liquid dries, it becomes a coarse lump of abrasive grains. Then, when this abrasive grain lump falls into the bowl-shaped main body (71) and is sent together with the rinsing liquid or polishing liquid from the liquid delivery hole (72) to the polishing area, scratches (scratches) are caused on the object to be polished (S). May occur. Thus, the polishing liquid dried at the tip of the nozzle (42) contributes to the generation of polishing scratches.

  In view of the background art described above, the present invention aims to provide a polishing liquid supply nozzle capable of preventing the polishing liquid from being dried and cleaning the tip of the nozzle, and further supplying the polishing liquid using the polishing liquid supply nozzle. An object is to provide an apparatus, a polishing apparatus, and a polishing method.

  That is, the polishing liquid supply nozzle of the present invention has each configuration described in the following [1] to [3].

  [1] A polishing liquid supply nozzle, wherein the polishing liquid supply pipe for supplying the polishing liquid is a double pipe disposed in a pipe of the rinsing liquid supply pipe for supplying the rinsing liquid.

[2] The polishing liquid supply nozzle according to item 1, wherein the tip of the polishing liquid supply tube protrudes from the rinse liquid supply tube. [3] The protrusion amount of the polishing liquid supply tube is 30 mm or less. Nozzle for supplying polishing liquid.

  The polishing liquid supply apparatus of the present invention has the configurations described in [4] to [5] below.

[4] A storage part in which a delivery hole for sending the polishing liquid and the rinse liquid is formed at the bottom;
Polishing comprising: the polishing liquid supply nozzle described in any one of the preceding items 1 to 3, which is disposed above the storage part and supplies the polishing liquid and the rinse liquid to the storage part. Liquid supply device.

  [5] The supply device of the polishing liquid according to the item 4, wherein the storage unit is formed with a ring-shaped body having a U-shaped longitudinal section.

  The polishing apparatus of the present invention has the configuration described in [6] below.

[6] An upper surface plate in which a liquid supply hole opens on the lower surface;
A lower surface plate facing the upper surface plate,
The apparatus for supplying polishing liquid according to item 4 or 5, wherein the polishing liquid is supplied between the upper surface plate and the lower surface plate from the liquid supply hole of the upper surface plate,
A carrier for holding an object to be polished;
Sliding means for holding the object to be polished held by the carrier between the upper surface plate and the lower surface plate and relatively sliding the object to be polished and at least one of the upper surface plate and the lower surface plate And a polishing apparatus characterized in that at least one surface of the object to be polished is polished.

  Furthermore, the polishing method of the present invention has the configuration described in [7] below.

[7] A polishing method using the polishing apparatus according to item 6 above,
The polishing liquid supplied from the polishing liquid supply pipe of the polishing liquid supply nozzle is supplied to the upper surface plate and the lower surface plate via the storage portion of the polishing liquid supply device, the liquid delivery hole, and the liquid supply hole of the upper surface plate. Supply between them, polish the object to be polished held by the carrier by sandwiching between the upper surface plate and the lower surface plate,
After the polishing, the supply of the polishing liquid is stopped at the polishing liquid supply nozzle, and the rinsing liquid supplied from the rinsing liquid supply pipe passes through the storage part of the polishing liquid supply device, the liquid delivery hole, and the liquid supply hole of the upper surface plate. Then, the polishing method is provided between the upper surface plate and the lower surface plate.

  Furthermore, the magnetic disk substrate and the method for manufacturing the magnetic disk substrate of the present invention have the configurations described in [8] and [9] below.

  [8] A method for manufacturing a magnetic disk substrate, comprising the polishing method according to item 7 in the process.

  [9] A magnetic disk substrate manufactured by the method for manufacturing a magnetic disk substrate according to [8].

  According to the polishing liquid supply nozzle according to the invention of [1], since the entire circumference of the tip of the polishing liquid supply pipe is washed away by the rinsing liquid when the rinsing liquid is supplied, generation of abrasive lump due to drying of the polishing liquid is prevented. it can. As a result, generation | occurrence | production of the abrasion scratch by an abrasive grain lump can be prevented.

  [2] According to the polishing liquid supply nozzle according to the invention of [3], the washing-out effect by the rinse liquid is particularly great.

  According to the polishing liquid supply apparatus according to the invention [4], it is possible to prevent the generation of abrasive grains due to the drying of the polishing liquid, and hence the generation of polishing scratches due to the abrasive grains.

  The polishing liquid supply apparatus according to the invention [5] is suitable as a polishing liquid supply apparatus for a disk-shaped polishing section.

  According to the polishing apparatus according to the invention of [6], since the generation of abrasive grains due to drying of the polishing liquid is prevented, the abrasive grains do not scratch the object to be polished, and there is no high quality scratching. Abrasive products can be provided.

  According to the polishing method according to the invention of [7], the generation of abrasive grains due to drying of the polishing liquid is prevented, so that the abrasive grains do not scratch the object to be polished, and there is no polishing scratch. Can be provided.

  According to the method for manufacturing a magnetic disk substrate according to the invention of [8], a high-quality magnetic disk substrate without polishing scratches can be manufactured.

  The magnetic disk substrate according to the invention of [9] is a high-quality substrate without polishing scratches.

  FIG. 1 shows a polishing liquid supply nozzle (60) of the present invention and a polishing liquid supply apparatus (40) using the polishing liquid supply nozzle (60). 2 and 3 show a polishing apparatus (1) incorporating the polishing liquid supply apparatus (40).

  As shown in FIG. 1, the polishing liquid supply nozzle (60) is a double pipe in which a polishing liquid supply pipe (62) is concentrically arranged inside a rinse liquid supply pipe (61). The tip of the tube (62) protrudes from the tip surface of the rinse liquid supply tube (61). The polishing liquid supply pipe (62) is connected to the polishing liquid tank (63) through a pipe line (64), and the polishing liquid is introduced by a pump (65) installed on the pipe line (64). It has been. Further, the rinsing liquid supply pipe (61) has a branch pipe (66) provided on a side surface thereof connected to the rinsing liquid tank (67) through a pipe line (68), and is connected to the pipe line (68). The rinse liquid is introduced by the installed pump (69). That is, the introduction of the polishing liquid and the rinsing liquid into the nozzle (60) is controlled independently.

  The polishing liquid supply device (40) mainly includes a bowl-shaped main body (41) and the polishing liquid supply nozzle (60) disposed above the bowl-shaped main body (41).

  The bowl-shaped main body (41) has a ring shape as a whole, and a vertical cross section is formed in a substantially U shape by two vertical side walls (45) (46) and a bottom portion (47). The bottom (47) is formed in a wide-angle V-shape, and a liquid delivery hole (49) is formed at the lowest position of the inclined bottom plate (47a). For this reason, the polishing liquid is prevented from staying in the bottom portion (47), and the polishing liquid is smoothly delivered. In addition, a hollow plug (50) is fitted in the delivery hole (49) in a state of projecting to the outside of the bowl-shaped main body (41), and a tube (51) fitted outside the hollow plug (50) will be described later. Connected to the polishing apparatus (1).

  The polishing apparatus (1) mainly comprises a polishing section (10) and a polishing liquid supply section (40) for supplying a polishing liquid to the polishing section (10). The polishing liquid supply unit (40) corresponds to the polishing liquid supply apparatus of the present invention described above.

  The polishing unit (10) is a planetary gear type polishing unit composed of a lower surface plate (11), an upper surface plate (15), a sun gear (20), an internal gear (22), a carrier (30) and the like. is there.

  The lower surface plate (11) is a disk member having an annular horizontal upper surface, and a polishing cloth (12a) is attached to the upper surface. The lower surface of the lower surface plate (11) is fixed to a lower support member (13) rotatable about a vertical axis (Q), and the lower support member (13) is linked to the lower surface plate rotation drive unit (14). The lower surface plate (11) and the lower support member (13) are configured to rotate.

  The upper surface plate (15) is also a disk member having an annular horizontal lower surface, and a polishing cloth (12b) is bonded to the lower surface facing the lower surface plate (11). The upper surface of the upper surface plate (15) is fixed to an upper support member (16) that is rotatable about a vertical axis (Q), and the upper support member (16) is attached to the upper surface plate rotation drive unit (17). The upper surface plate (15) and the upper support member (16) are rotated in association with each other. The upper surface plate (15) and the upper support member (16) are supported so as to be movable up and down along the vertical axis (Q) and are moved up and down by driving an upper surface plate lifting and lowering drive unit (not shown). ing. The upper surface plate (15) is provided with a large number of liquid supply holes (18) and peeling fluid supply holes (19) penetrating the polishing pad (12b).

  Above the upper surface plate (15), a bowl-shaped main body (41) of the polishing liquid supply unit (40) is installed by a column member (48), and a liquid delivery hole (49) of the bowl-shaped main body (41). Is connected to the liquid supply hole (18) of the upper surface plate (15) through a tube (51).

  The sun gear (20) is rotatably provided at the center position of the polishing section (10), and is rotated about the vertical axis (Q) by driving the sun gear rotation driving section (21). Yes. However, when rotating the internal gear (22), the sun gear (20) may be fixed so as not to rotate. As the sun gear (20), a spur gear, a pin gear, or the like in which a tooth row is integrally formed on a side surface portion is used.

  The internal gear (22) is a ring-shaped gear having a tooth row on the inner peripheral side, and is arranged concentrically on the outer side of the sun gear (20). The internal gear (22) of the present embodiment is fixed so as not to rotate, but an internal gear rotation drive unit may be additionally installed to be rotatable about the vertical axis (Q). Also, in the internal gear (22), a pin gear or the like may be used in addition to the spur gear.

  The carrier (30) is a thin plate-like disk member having a tooth row on the outer peripheral portion, and a plurality of holding holes (31) for holding the workpiece (S) are formed. In the polishing section (10), a plurality of carriers (30) are arranged. These carriers (30) mesh with the sun gear (20) and the internal gear (22), and the sun gear (20) and / or According to the rotation of the internal gear (22), it rotates while revolving around the sun gear (20).

  In the polishing section (10), the workpiece (S) held by the carrier (30) is sandwiched between the upper surface plate (15) and the lower surface plate (11), and the carrier (30) is rotated and rotated in this state. By doing so, the upper and lower surfaces of the workpiece (S) are polished. In this polishing section (10), a donut-shaped region sandwiched between the sun gear (20) and the internal gear (22) and between the upper surface plate (15) and the lower surface plate (11) is an actual polishing region. It becomes. Further, during the polishing process, the polishing liquid is introduced into the bowl-shaped main body (41) from the polishing liquid supply pipe (62) of the polishing liquid supply nozzle (60), and the polishing liquid is supplied to the bowl-shaped main body (41). It is supplied to the polishing region through the hole (49), the tube (51), and the liquid supply hole (18) of the upper surface plate (15). Note that the used polishing liquid is collected by a route not shown in the figure, and is subjected to an appropriate treatment and discarded.

  When the polishing process is finished, the introduction of the polishing liquid is stopped in the polishing liquid supply nozzle (60), and the rinsing liquid is introduced from the rinsing liquid supply pipe (61) and supplied to the bowl-shaped main body (41). The rinsing liquid is supplied to the polishing region through the liquid supply hole (49) of the bowl-shaped main body (41), the tube (51), and the liquid supply hole (18) of the upper surface plate (15) in the same manner as the polishing liquid. . While the rinsing liquid is being supplied from the rinsing liquid supply pipe (61) of the polishing liquid supply nozzle (60), the rinsing liquid is washed away from the protruding portion on the front end side of the polishing liquid supply pipe (62) and adheres thereto. The polishing liquid is washed away without drying. Moreover, the nozzle (60) has a double-pipe structure, and since the rinse liquid is poured over the entire circumference of the polishing liquid supply pipe (62), there is no unwashed residue. For this reason, the abrasive grains in the polishing liquid are not dried to form a coarse lump, and the object to be polished (S) is not wrinkled. Therefore, it is suitable for polishing processing such as a magnetic disk substrate that requires high finished surface accuracy.

  When cleaning with the rinsing liquid is completed, supply of the rinsing liquid and rotation of the carrier (30) are stopped, air and water are alternately supplied through the tube (53), and the peeling fluid supply hole (19) is supplied to the polishing region. Air and water are ejected to peel the object to be polished (S) from the polishing cloth (12b) of the upper surface plate (15), and the upper surface plate (15) is raised.

  The configuration of the polishing liquid supply nozzle of the present invention is not limited at all except that the polishing liquid supply pipe is a double pipe disposed in the pipe of the rinse liquid supply pipe. For example, the tip surfaces of the two pipes may be arranged on the same surface without the tip of the polishing liquid supply pipe projecting from the rinse liquid supply pipe, or the polishing liquid supply pipe may supply the rinse liquid contrary to the illustrated example. You may arrange | position from the front end surface of a pipe | tube. By projecting the polishing liquid supply pipe (62) as in the above embodiment, the outer peripheral surface of the polishing liquid supply pipe (61) can be washed away with the rinse liquid, and more on the tip end surface serving as the polishing liquid outlet. The rinse liquid can be poured, and the effect of washing away the adhering polishing liquid is great. Further, as shown in FIG. 1, the protrusion amount (L) of the polishing liquid supply pipe (62) from the rinse liquid supply pipe (61) is preferably 30 mm or less, and the particularly preferable protrusion amount (L) is 5 to 15 mm. It is. Further, the diameters of the polishing liquid supply pipe and the rinse liquid supply pipe are not limited. Further, the means for introducing the liquid into the polishing liquid supply pipe and the rinse liquid supply pipe is not limited.

  Further, the configuration of the polishing liquid supply apparatus is not limited to the illustrated example. For example, the overall shape of the bowl-shaped body is not limited to a ring shape. The ring-shaped bowl-shaped body (41) in the illustrated example is suitable for a disk-shaped polishing part, but the polishing part is not limited to the disk-shaped, and the bowl-shaped body is adapted to the shape and configuration of the polishing part. Any shape can be used. Further, the number of the polishing liquid nozzles (60) is not limited, and one or any plural number of nozzles may be installed depending on the nozzle diameter, the volume of the bowl-shaped body, and the like.

  The polishing apparatus of the present invention includes a polishing section and a polishing liquid supply apparatus of the present invention. The polishing section includes an upper surface plate having a liquid supply hole opened on a lower surface, a lower surface plate facing the upper surface plate, a carrier holding an object to be polished, and an object to be polished held by the carrier. Sliding means is provided between the surface plate and the lower surface plate to relatively slide the object to be polished and at least one of the upper surface plate and the lower surface plate. Then, using the polishing liquid supply device, the polishing liquid is supplied between the polishing surface of the upper surface plate and the polishing surface of the lower surface plate from the liquid supply hole of the upper surface plate, and is held by the carrier. The object to be polished is polished by relatively sliding the polishing object and at least one of the upper surface plate and the lower surface plate. In this invention, a grinding | polishing part is not limited to what a carrier revolves and autorotates by a planetary gear system like the said embodiment, or what grind | polishes both surfaces simultaneously. The present invention includes those in which the carrier rotates and rotates only in one of revolution and rotation, those in which the carrier is fixed and the surface plate rotates to polish, and those in which only one surface of the object to be polished is polished. Further, the sliding for polishing is not limited to that by a rotating operation, and polishing may be performed by a linear reciprocating operation, and the sliding means is not limited. Further, the shape and material of the object to be polished (S) and the composition of the polishing liquid are not limited.

  The polishing method of the present invention is a polishing method using the above polishing apparatus, and as described above, the tip of the polishing liquid supply tube is washed away when the rinsing liquid is supplied in the polishing liquid supply nozzle. However, it does not dry and become an abrasive lump, and it is possible to prevent the occurrence of polishing scratches on the object to be polished and polish it to a highly finished surface.

  In addition, a method of manufacturing a magnetic disk substrate according to the present invention includes the above-described polishing method in a process. Therefore, the magnetic disk substrate manufactured by this method has a highly finished surface without polishing scratches.

  1-3. A polishing apparatus (1) incorporating a polishing liquid supply apparatus (40) using the polishing liquid supply nozzle (60) of the present invention of FIGS. 1 to 3, and a polishing liquid supply nozzle (42) and a rinse as a comparative example. A polishing test was performed using a polishing apparatus (2) incorporating a conventional polishing liquid supply apparatus (70) in which the liquid supply nozzle (43) was an independent pipe, and the occurrence of polishing scratches was compared. The polishing unit uses the same planetary gear type polishing unit (10) in any of the polishing apparatuses, and both surfaces of the object to be polished are polished simultaneously. In addition, as a test object (S), an aluminum plate having a diameter of 95 mm having Ni-P plating films on both sides was used. This aluminum plated plate is used as a magnetic disk substrate.

In the polishing apparatus (1) of the present invention, the dimensions of the polishing liquid supply nozzle (60) are as follows.
Rinse solution supply pipe (61): Inner diameter 12 mm
Polishing liquid supply pipe (62): inner diameter 5 mm, outer diameter 8 mm
Projection amount (L) of polishing liquid supply pipe (62): 10 mm
In the polishing apparatus (2) of the comparative example, a polishing liquid supply nozzle (42) having an inner diameter of 5 mm and a rinsing liquid supply nozzle (43) having an inner diameter of 7.5 mm were used.

  Further, a suspension in which colloidal was dispersed in water was used as the polishing liquid, and pure water was used as the rinse liquid.

  Then, in both polishing liquid supply apparatuses (40) and (70), after polishing on both surfaces of the aluminum plating plate with the same amount of the polishing liquid, it was rinsed off with the same amount of the rinsing liquid. Polishing and washing were set to one cycle, and this cycle was repeated to polish a total of 50 aluminum plating plates.

  When the polished scratches were visually inspected on the polished aluminum plated plate under halogen light irradiation, the average number of polishing scratches per side was 0.172 when the polishing liquid supply device (40) of the present invention was used. In addition, when the polishing liquid supply apparatus (70) of the comparative example was used, the average number of polishing scratches per one side was 0.269.

  Since the nozzle for supplying the polishing liquid of the present invention can prevent the generation of abrasive agglomerates due to drying of the polishing liquid, a polishing product without polishing flaws can be obtained in a polishing process such as a magnetic disk substrate that requires a high finished surface accuracy. Can be provided.

It is sectional drawing of the nozzle for polishing liquid supply of this invention, and the supply apparatus of polishing liquid. It is sectional drawing of the grinding | polishing apparatus of this invention. FIG. 5 is an internal perspective view in which a part of the polishing unit of the polishing apparatus of FIGS. 2 and 4 is omitted. It is sectional drawing of the conventional grinding | polishing apparatus.

Explanation of symbols

1, 2, ... Polishing equipment
10 ... Polishing part
11 ... Lower surface plate
15… Upper surface plate
18 ... Liquid supply hole
30 ... Career
40 ... Polishing liquid supply unit (polishing liquid supply device)
41… Shape-shaped body (storage part)
47… Bottom
49 ... Liquid delivery hole
60 ... Nozzle for polishing liquid supply
61 ... Rinse solution supply pipe
62 ... Polishing liquid supply pipe S ... Polishing object L ... Amount of protrusion of polishing liquid supply pipe

Claims (5)

An upper surface plate in which a liquid supply hole opens on the lower surface;
A lower surface plate facing the upper surface plate,
From the liquid supply hole of the upper surface plate, a supply device that Ken Migakueki to supply a polishing liquid between the upper surface plate and lower surface plate,
A carrier for holding an object to be polished;
Sliding means for holding the object to be polished held by the carrier between the upper surface plate and the lower surface plate and relatively sliding the object to be polished and at least one of the upper surface plate and the lower surface plate A polishing apparatus for polishing at least one surface of the object to be polished ,
The polishing liquid supply device is a polishing part that is disposed above the storage part and has a storage part in which a delivery hole for sending the polishing liquid and the rinsing liquid is formed at the bottom, and supplies the polishing liquid and the rinsing liquid to the storage part. A liquid supply nozzle,
The polishing liquid supply nozzle is a double pipe disposed in a rinse liquid supply pipe in which a polishing liquid supply pipe for supplying a polishing liquid supplies a rinse liquid,
The tip of the polishing liquid supply pipe protrudes beyond the rinse liquid supply pipe, and the entire circumference of the tip of the polishing liquid supply pipe is washed away by the rinse liquid when the rinse liquid is supplied from the rinse liquid supply pipe. A polishing apparatus characterized by having a structure in which all the rinsing liquid that has been washed away is supplied to the polishing region through the storage section in the same manner as the polishing liquid . The polishing apparatus according to claim 1, wherein an amount of protrusion of the polishing liquid supply pipe is 30 mm or less. The polishing apparatus according to claim 1, wherein the storage unit is formed by forming a bowl-shaped body having a U-shaped longitudinal section in a ring shape. A polishing method using the polishing apparatus according to any one of claims 1 to 3 ,
The polishing liquid supplied from the polishing liquid supply pipe of the polishing liquid supply nozzle is supplied to the upper surface plate and the lower surface plate via the storage portion of the polishing liquid supply device, the liquid delivery hole, and the liquid supply hole of the upper surface plate. Supply between them, polish the object to be polished held by the carrier by sandwiching between the upper surface plate and the lower surface plate,
After the polishing, the supply of the polishing liquid is stopped at the polishing liquid supply nozzle, the entire circumference of the tip of the polishing liquid supply pipe is washed with the rinse liquid supplied from the rinse liquid supply pipe, and all the rinsed liquids washed off A polishing method comprising: supplying between the upper surface plate and the lower surface plate via a storage portion of the supply device, a liquid delivery hole, and a liquid supply hole of the upper surface plate. A method for manufacturing a magnetic disk substrate, comprising the polishing method according to claim 4 in a process.

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