JP4809385B2 - Printed board - Google Patents

Description

  The present invention relates to a printed circuit board to which a semiconductor element is attached.

As shown in Patent Document 1 or FIG. 8, conventionally, the semiconductor element 1 has three linear lead terminals 5 arranged in parallel at the same pitch P below the element body 3 made of synthetic resin. The semiconductor element 3 is attached to the printed circuit board (wiring board) 7 by providing through holes (mounting holes) 9 in the printed circuit board 7 in accordance with the pitch P of the lead terminals 5. The lead terminals 5 were soldered from the back side of the printed circuit board 7 respectively.
JP-A-8-46106

  Conventionally, in this type of semiconductor element, the position of the lead terminal is different in the front-rear direction (the direction orthogonal to the parallel arrangement direction of the lead terminals 5), while keeping the same pitch width according to the specifications.

  For this reason, when the semiconductor element being used is changed to a semiconductor element with a different lead terminal position, only the changed amount is adjusted based on the position of the original lead terminal, and the version number is changed each time. The printed circuit board is managed.

  However, the printed circuit board is a molded product, and the actual situation is that reworking the printed circuit board requires a lot of costs and man-hours such as redesign costs, pattern change costs, and negative costs.

  In view of such circumstances, conventionally, a method of bending a lead terminal of a new semiconductor element to be changed in accordance with a through-hole of a conventional printed circuit board has also been adopted. A (bending) jig has to be manufactured and prepared separately, and further, it has been pointed out that the bending work using such a jig is necessary and time-consuming.

  However, if the lead terminal is bent as described above, there is a disadvantage that stress is applied to the lead terminal.

  The present invention has been devised in view of such circumstances, and it is not necessary to change the through-hole according to the position of the lead terminal to recreate the printed circuit board, and the total pitch is different with the same pitch width. An object of the present invention is to provide a printed circuit board to which all semiconductor elements can be attached.

  In order to achieve such an object, the invention according to claim 1 is a semiconductor in which a through hole is formed in accordance with a plurality of lead terminals arranged in parallel in an element body, and the semiconductor device is attached by inserting the lead terminal into the through hole. In the printed circuit board for element mounting, the through hole is formed in a long hole shape in accordance with the pitch of the lead terminal, and a through hole round is attached to the peripheral portion of the through hole, and on each through hole round. A spring member formed by alternately bending a single metal wire and deforming in the longitudinal direction of the through hole is mounted.

  According to a second aspect of the present invention, in the printed circuit board according to the first aspect, the bending interval of the spring member is a width in which the lead terminal can be inserted and soldered up. The invention according to No. 3 is characterized in that, in the printed circuit board according to claim 1 or 2, the spring member is weaker than the lead terminal.

  According to a fourth aspect of the present invention, in the printed circuit board according to any one of the first to third aspects, a locking hole is formed in the vicinity of both ends in the longitudinal direction of the through hole. The invention according to claim 5 is characterized in that the latching claw is formed at both ends of the spring member, and the latching claw is latched in the latching hole. The locking claw is bent in a substantially C shape and elastically pressed against the inner periphery of the locking hole, and the front end side of the locking claw is bent in a substantially C shape in the opposite direction, It is characterized in that it is elastically locked to the peripheral portion on the back side of the hole.

  Furthermore, the invention according to claim 6 is the printed circuit board according to any one of claims 1 to 5, wherein the spring member is mounted on the through-hole round by applying tension in a pulling direction. According to a seventh aspect of the present invention, in the printed circuit board according to any one of the first to sixth aspects, the outer shape of the spring member is more than the outer shape of a through hole round. It is large.

  According to the first aspect of the present invention, even if the position of the lead terminal of the semiconductor element differs according to the specifications, the through hole formed in the shape of a long hole and the spring member attached to the through hole have a dimensional difference in the position of the lead terminal. Because it absorbs, it is not necessary to recreate the printed circuit board according to the specifications of the semiconductor element, and it is possible to mount all semiconductor elements with different lead terminal mounting positions while maintaining the same pitch width and rough accuracy. Can be used to design printed circuit boards.

  Further, since there is no need to bend the lead terminal so as to match the through hole as in the prior art, the reliability of the semiconductor element is improved, and there is an advantage that the workability is improved because the bending process is unnecessary.

  According to the invention of claim 2, the through hole round is attached to the peripheral portion of the through hole by setting the bending interval of the spring member to such a width that can be soldered up by capillarity when the lead terminal is soldered. As a result, the solder rises over the entire spring member, and the lead terminal can be securely soldered to the printed circuit board.

  According to the invention of claim 3, when the lead terminal contacts the spring member when the lead terminal is inserted into the through hole, the entire spring member is deformed in the longitudinal direction of the through hole. There will be no hindrance.

  Further, according to the inventions according to claim 4 and claim 5, since the spring member can be freely attached to and detached from the through hole, the semiconductor element exchanging workability is excellent, and the inventions according to claim 6 and claim 7 are provided. Accordingly, since the spring member does not hang down from the through hole, it is easy to insert the lead terminal into the through hole (spring member), the workability is excellent, and the appearance of the printed circuit board is also good.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  1A shows a semiconductor element 15 in which three linear lead terminals 13 are arranged in parallel at the same pitch on the lower side of an element body 11 made of synthetic resin, like the semiconductor element 1 of FIG. 1 (b) shows a semiconductor element 21 in which three linear lead terminals 19 are arranged in parallel at the same pitch on the lower side of the element body 17 which is also made of a synthetic resin. With the same pitch width as that of the lead terminal 13 of the element 15, the lead terminal 19 is positioned rearwardly (in the direction of arrow A in the figure) by an L dimension.

  And the radiation fin 23 is attached to the back side of both the semiconductor elements 15 and 21, and both the semiconductor elements 15 and 21 are mounted on the printed circuit board 25 which concerns on one Embodiment of Claims 1 thru | or 7.

  2 is a plan view of the principal part of the printed circuit board 25. FIG. 3 is a sectional view taken along the line III-III of FIG. 2. Like the conventional printed circuit board, the printed circuit board 25 according to the present embodiment also includes the semiconductor elements 15 and 21. The through holes 27 to be attached are provided. The through holes 27 are formed in the shape of three long holes arranged in parallel according to the pitch of the lead terminals 13 and 19 formed at the same pitch. A well-known through-hole round 29 is attached to the peripheral portion of each through-hole 27, and a locking hole 31 having a circular shape in plan view is provided in the vicinity of both ends in the longitudinal direction of each through-hole 27. The shaft and the central axis are made to coincide. A spring member 33 is mounted on the through hole round 29.

  4 to 6 show the details of the spring member 33. The spring member 33 is formed by alternately bending a single metal wire (for example, a wire) 35 into a V shape in plan view at the same pitch. 2 to 4, the outer shape L1 of the spring member 33 is formed to be the same as or slightly larger than the outer shape L2 of the through-hole round 29, as shown in FIGS. 29.

  Alternatively, the spring member 31 may be formed by alternately bending a single metal wire 35 at the same pitch into a substantially U shape in plan view.

  Thus, as shown in FIG. 4, the bending interval (pitch width) T of the spring member 33 is such that the lead terminals 13 and 19 can be inserted between the semiconductor elements 15 and 21 when the semiconductor elements 15 and 21 are attached. The width is set such that the solder can be lifted by capillary action during soldering. The wire member 35 of the spring member 33 is weaker than the lead terminals 13 and 19. When the lead terminals 13 and 19 come into contact with the wire member 35 when the lead terminals 13 and 19 are inserted into the spring member 33, the wire member 35 is The entire spring member 33 can easily move (deform) in the longitudinal direction of the through hole 27 (in the directions of arrows B and C in FIG. 4) without hindering the insertion of the lead terminals 13 and 19.

  As shown in FIGS. 3, 5, and 6, locking claws 37 are formed at both ends of the spring member 33. As shown in the figure, the latching claw 37 is bent downward in a substantially C shape so as to be elastically press-contactable to the inner periphery of the latching hole 31, and the tip 37a of the latching claw 37 is in the opposite direction. The spring member 33 is bent in a substantially C shape and is elastically locked to the peripheral edge on the back surface side of the locking hole 31, and the spring member 33 applies tension in the pulling direction (longitudinal direction of the through hole 27). The hooking claw 37 is elastically locked to the front and rear locking holes 31 from the surface side of the printed circuit board 25 in a state of being hooked, and is mounted on the through hole round 29 of each through hole 27.

  Since the printed circuit board 25 according to the present embodiment is configured as described above, in order to attach the semiconductor element 15 to the printed circuit board 25, the lead terminals 13 are inserted into the through holes 27 as shown in FIG. The lead terminals 13 may be soldered from the back side of the printed circuit board 25, respectively.

  Thus, as described above, the spring member 33 is formed to be the same as or slightly larger than the outer shape L2 of the through-hole round 29, and the spring member 33 is tensioned in the pulling direction (longitudinal direction of the through-hole 27). Since it is mounted on the through hole round 29 in a hooked state, the spring member 33 does not hang down from the through hole 27 and is excellent in workability and appearance. Since the wire 35 is weaker than the lead terminal 13, even if the lead terminal 13 abuts against the wire 35 when the lead terminal 13 is inserted into the through hole 27, the entire spring member 33 remains in the longitudinal direction of the through hole 27 ( In FIG. 4, the wire 35 is easily deformed in the directions of arrows B and C), and the wire 35 does not interfere with the insertion of the lead terminal 13.

  The bending interval (pitch width) T of the spring member 33 is set to a width that allows solder to rise by capillary action when the lead terminal 13 is soldered, and the through-hole round 29 is formed at the periphery of the through-hole 27. Since the lead terminal 13 is soldered from the back side of the printed circuit board 25 because of the mounting, the solder rises over the entire spring member 33 due to capillary action, and the lead terminal 13 is soldered to the printed circuit board 25 as in the conventional case.

  On the other hand, when the semiconductor element 21 is attached to the printed board 25 from the beginning instead of the semiconductor element 15, the lead terminals 19 are inserted into the through holes 27 as shown in FIG. 19 may be soldered respectively.

  Thus, even when the lead terminal 19 contacts the wire 35 when the lead terminal 19 is inserted into the through hole 27, the entire spring member 33 moves in the longitudinal direction of the through hole 27, and the wire 35 is inserted into the lead terminal 19. Thus, the solder rises over the entire spring member 33 by the capillary phenomenon, and the lead terminal 19 is soldered to the printed circuit board 25.

  In addition, when the component replacement to the semiconductor element 21 occurs when the lead terminal 13 is soldered to the printed circuit board 25 and the semiconductor element 15 is attached, the solder of the spring member 33 fixing the lead terminal 13 is soldered. Just melt it with a soldering iron. Since the through hole round is not attached to the locking hole 31, solder does not go up to the locking hole 31, and the locking claw 37 is not soldered to the locking hole 31.

  Therefore, as described above, the solder of the spring member 33 is melted with a soldering iron or the like, the locking claw 37 elastically locked to the locking hole 31 is removed, and the spring member 31 is moved from each through hole 27 to the semiconductor element 15. Then, a new spring member 31 is attached to the through hole 27 and the semiconductor element 21 is attached to the through hole 27.

  As described above, according to the present invention, even if the mounting positions of the lead terminals 13 and 19 of the semiconductor elements 15 and 21 are different, the through hole 27 formed in the shape of a long hole and the spring member 31 attached thereto are provided as lead terminals. In order to absorb the dimensional difference between the mounting positions 13 and 19, there is no need to remake the printed circuit board according to the specifications of the semiconductor elements 15 and 21, and all the mounting positions of the lead terminals are different with the same pitch width. A semiconductor element can be attached and the printed circuit board 25 can be designed with rough accuracy.

  The spring member 33 is formed to be the same as or slightly larger than the outer shape L2 of the through-hole round 29, and the spring member 33 is mounted on the through-hole round 29 in a tensioned state in the pulling direction. The spring member 33 does not hang down from the through hole 27, the strength of the wire 35 is weaker than that of the lead terminal 13, and the lead terminals 13, 19 are inserted into the through hole 27 when the lead terminals 13, 19 are inserted. When contacted with 35, the spring member 33 as a whole is easily deformed in the longitudinal direction of the through hole 27, and the wire 35 does not interfere with the insertion of the lead terminal 13. The lead terminals 13 and 19 can be easily inserted, the workability is excellent, and the appearance of the printed board 25 is also good.

  The bending interval T of the spring member 33 is set to a width that allows solder to rise by capillary action when the lead terminal 13 is soldered, and the through hole round 29 is attached to the peripheral portion of the through hole 27. It is possible to solder the entire spring member 33 and securely solder the lead terminals 13 and 19 to the printed circuit board 25.

  Furthermore, according to the present embodiment, since the spring member 33 can be freely attached to and detached from the through hole 27, the semiconductor element exchanging workability is excellent, and the lead terminal is bent so as to match the through hole as in the prior art. Therefore, there is an advantage that the reliability of the semiconductor element is improved and the workability is improved because the bending process is unnecessary.

It is a side view of two semiconductor elements which are attached to a printed circuit board and have different attachment positions of lead terminals. It is a principal part top view of a printed circuit board. It is the III-III sectional view taken on the line of FIG. It is a top view of a spring member. FIG. 5 is a view in the direction of the arrow X in FIG. 4. It is a Y direction arrow line view of FIG. It is explanatory drawing of the attachment method of a semiconductor element. It is explanatory drawing of the attachment method of the conventional semiconductor element.

Explanation of symbols

11, 17 Element body 13, 19 Lead terminal 15, 21 Semiconductor element 23 Radiation fin 25 Printed circuit board 27 Through hole 29 Through hole round 31 Locking hole 33 Spring member 35 Wire rod 37 Locking claw 37a Tip of locking claw

Claims (7)

In a printed circuit board for mounting a semiconductor element, a through hole is formed in accordance with a plurality of lead terminals arranged in parallel to the element body, and the lead terminal is inserted into the through hole to attach a semiconductor element.
The through hole is formed in a long hole shape according to the pitch of the lead terminal,
While attaching a through hole round to the periphery of the through hole,
A printed board comprising: a spring member formed by alternately bending a single metal wire on each through hole round so as to be deformable in the longitudinal direction of the mounting hole.   The printed circuit board according to claim 1, wherein the bending interval of the spring member is a width in which a lead terminal can be inserted and soldered up.   The printed circuit board according to claim 1, wherein the spring member is weaker than the lead terminal.   A locking hole is formed in the vicinity of both ends in the longitudinal direction of the through hole, a locking claw is formed at both ends of the spring member, and the locking claw is locked to the locking hole. The printed circuit board according to any one of claims 1 to 3.   The locking claw is bent in a substantially C shape and is elastically pressed to the inner periphery of the locking hole, and the distal end side of the locking claw is bent in a substantially C shape in the opposite direction. The printed circuit board according to claim 4, wherein the printed circuit board is elastically locked to a peripheral portion on the back side of the printed circuit board.   6. The printed circuit board according to claim 1, wherein the spring member is mounted on a through-hole round while applying tension in a pulling direction. 7. The printed circuit board according to claim 1, wherein an outer shape of the spring member is larger than an outer shape of a through-hole round.

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