JP4810097B2 - 3D circuit board, electrical circuit structure, and 3D circuit board manufacturing method - Google Patents

Description

  The present invention relates to a three-dimensional circuit board, an electric circuit structure including the three-dimensional circuit board, and a method for manufacturing the three-dimensional circuit board.

In electronic device mounting technology, there is a case in which a three-dimensional circuit board in which wiring is formed on a resin molded body is used without using a printed board or a flexible wiring board with the aim of reducing the size and simplifying the mounting structure by reducing the number of components. is increasing.
In order to mount an IC on this three-dimensional circuit board, wire bonding or flip chip mounting is performed. However, the resin-molded three-dimensional circuit board has low thermal conductivity, and the temperature required for connection at the connection portion is low. In order to ensure, it was necessary to raise the temperature of the whole substrate.
In addition, there is also a problem that heat radiation cannot be performed sufficiently because the thermal conductivity is poor even after the heat generating element is mounted at the same time.
On the other hand, the technique disclosed in Patent Document 1 is proposed. This is aimed at increasing the heat conduction from the back surface side by reducing the thickness of the mounting portion of the IC of the three-dimensional circuit board.
Moreover, a general printed circuit board has a multilayer substrate structure containing glass cloth, and has a structure in which the linear expansion coefficient in the surface direction is kept small.
On the other hand, the three-dimensional circuit board is based on a resin molded body and contains a filler or the like, but greatly depends on the characteristics of the resin material itself, so that the linear expansion coefficient becomes large.
Patent Document 2 proposes a technique related to an optical head that is bare-chip mounted on a three-dimensional circuit board.
JP-A-6-244302 JP 2002-109781 A

However, in the structure shown in Patent Document 1, there is a problem that it becomes impossible to mount components on the back surface side, which is a great restriction on the mounting structure design.
Further, in the structure shown in Patent Document 2, there is a problem that the optical axis is shifted because the three-dimensional circuit board itself expands and contracts due to a change in ambient temperature and the light emitting and receiving elements move. A device with severe optical axis accuracy has a problem that the operating temperature range is largely limited.
Furthermore, in terms of connection reliability of flip chip mounting parts, the difference in expansion between the IC and the three-dimensional circuit board is large, and the thermal strain is concentrated on the connection part, so that reliability is ensured only for small ICs. It was done. That is, there is a problem that connection reliability in flip chip mounting of a large IC chip that increases thermal strain cannot be secured.
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to improve connection reliability against thermal strain and suppress deformation of a board in a three-dimensional circuit board by suppressing expansion and contraction with respect to the temperature of the board.
Another object of the present invention is to improve bare chip mountability and heat dissipation by increasing the thermal conductivity of the mounting portion of the electronic element in the three-dimensional circuit board.

The invention according to claim 1 is a three-dimensional circuit board in which a conductor wiring is formed on a surface of a resin molded body, and an electronic element is mounted on the surface of the resin molded body, and at least of the resin molded body The insert member is provided at a lower part or a side part of the mounting portion of the electronic element, and includes an insert member made of a material having a smaller linear expansion coefficient than the resin molded body or a material having a higher thermal conductivity than the resin molded body. The resin molded body is formed on the surface on which the uneven shape is formed .
The invention according to claim 2 is a three-dimensional circuit board in which conductor wiring is formed on a surface of a resin molded body, and an electronic element is mounted on the surface of the resin molded body, and at least of the resin molded body wherein provided on the bottom or sides of the mounting portion of the electronic element, an insert member composed of the material coefficient of linear expansion than the resin molding is small or the thermal conductivity is higher than the resin molding material, the insert member Has magnetism, and the resin molded body is formed on the surface of the insert member.
The invention described in claim 3 is the invention described in claim 1 or 2, wherein the insert member is an inorganic material .
The invention according to claim 4 is the invention according to any one of claims 1 to 3 , wherein a part of the insert member is exposed.
The invention according to claim 5 is the invention according to claim 4 , characterized in that a reference for positioning the member is formed in the exposed portion of the insert member .

The invention of claim 6 is the invention according to any one of claims 1 to 5 and a surface of the resin molded body, and a mounting portion in which the electronic element is mounted in a concave shape It is characterized by that.
The invention according to claim 7 is the invention according to any one of claims 1 to 6 , wherein the resin molded body is a thermosetting resin.
The invention according to claim 8 is an electric circuit structure in which an electronic element is flip-chip mounted on the three-dimensional circuit board according to any one of claims 1 to 7 .
The invention according to claim 9 is an electric circuit structure in which the electronic element is die-bonded in the concave shape of the three-dimensional circuit board according to claim 6 , and the electronic element is connected to the conductor wiring by wire bonding. It is a body.
A tenth aspect of the present invention is the electric circuit structure according to the ninth aspect, wherein the insert member is exposed at the concave portion.
That of the invention according to claim 11, in the invention described in any one of claims 8 to 10, an electric circuit structure in which at least one is mounted in the light emitting element and a light receiving element as the electronic element Features.
The invention described in claim 12 is an electrical circuit structure in which a movable functional device is mounted on the exposed part of the insert member of the molded circuit board according to claim 5 and connected to the wiring on the molded circuit board. It is characterized by that.

According to a thirteenth aspect of the present invention, there is provided a method of manufacturing a three-dimensional circuit board in which a conductor wiring is formed on a resin molded body and an electronic element is mounted on the surface of the resin molded body. A first step of supplying a catalyst colloid solution to a molding die in which a hydrophobic region is formed in part and a hydrophilic pattern is formed outside the hydrophobic region, and a catalyst base wiring is formed by volatilizing the solvent of the catalyst colloid solution A second step of performing, a third step of positioning an insert member for forming a resin on the surface in the molding die, and supplying a fluid resin to be the resin molding into the molding die to be cured. A fourth step of transferring the catalyst base wiring to the surface of the member and a fifth step of forming the conductor wiring on the catalyst base wiring by electroless plating. expansion Wherein the number is less material or the thermal conductivity is formed by a high material.
The invention of claim 14 is the invention according to claim 13, wherein the catalyst colloidal solution is a colloidal solution containing metal nanoparticles having a particle size of 100 nm.
The invention according to claim 15 is the invention according to claim 13 or 14 , wherein the first step uses the metal nanoparticle colloid solution as the catalyst colloid solution, and the fourth step uses a fluid resin as a fluid. It is characterized by a certain plastic.

According to the first aspect of the present invention, the expansion and contraction of the resin molded body with respect to the temperature change can be suppressed, and the thermal strain due to the expansion difference is difficult to reach at the connection portion between the electronic element and the three-dimensional circuit board, and the reliability of the product. Can be improved.
According to the second aspect of the present invention, it is possible to efficiently dissipate heat generated during operation of the electronic element.
According to invention of Claim 3, the insert member which forms a resin molding with inorganic materials, such as a metal and ceramics, can be created.
According to invention of Claim 4, while being able to improve the adhesive force of a resin molding and an insert member, the restraint force with respect to expansion / contraction of a resin molding can be heightened.
According to the invention described in claim 5, by heating the exposed portion of the insert member, the connection portion of the electronic element can be efficiently heated, and the bare chip mounting of the electronic element on the thick three-dimensional circuit board, etc. It is possible to ensure stable connection quality.
According to the sixth aspect of the present invention, positioning of the member when forming the resin molding on the insert member is facilitated.
According to the seventh aspect of the present invention, the fixed circuit board can be fixed with an electromagnet or the like, the handling property when mounting an electronic element is improved, and the fixed to the molded circuit board for clamping or the like. There is no need to provide a stand.
According to invention of Claim 8, even if an electronic element is mounted, it can be prevented that an electronic element makes a business trip.
According to the ninth aspect of the present invention, the heat resistance of the three-dimensional circuit board is improved and gold / tin eutectic bonding or the like can be performed at the time of flip chip mounting of the electronic element.
According to the invention described in claim 10, the electronic element can be flip-chip mounted on the three-dimensional circuit board.

According to invention of Claim 11, an electronic element can be mounted by die bonding and wire bonding.
According to the invention described in claim 12, by heating the exposed part of the member, the connection part of the electronic element can be efficiently heated, and in the bare chip mounting of the electronic element on the thick three-dimensional circuit board, etc. , Will be able to ensure a stable connection quality.
According to invention of Claim 13, a light emitting element and a light receiving element can be mounted in a three-dimensional circuit board.
According to invention of Claim 14, functional devices, such as a piezoelectric element, can be mounted in a three-dimensional circuit board.
According to the fifteenth aspect of the present invention, it is possible to manufacture the three-dimensional circuit board according to the first and second aspects, which does not require patterning for individual products and does not require removal processing such as etching.
According to the sixteenth aspect of the present invention, when heated after drying, the metal nanoparticles are fused, and the base wiring of the conductor wiring can be formed.
According to invention of Claim 17, the fine wiring pattern with high adhesive force can be formed in the surface of the resin molding of thermosetting resin.

Hereinafter, multiple examples of the best mode for carrying out the present invention will be described.
[First Embodiment]
FIG. 1 is a longitudinal sectional view of a three-dimensional circuit board as a first embodiment of the present invention.
In the molded circuit board 1 of the present embodiment, a layer of the resin molded body 2 is formed on the surface of the insert member 3. The insert member 3 is made of a material having a smaller linear expansion coefficient than that of the molded resin or a material having a high thermal conductivity. For example, an inorganic material such as a metal or ceramic is used. The insert member 3 is provided at least below or on the side of the IC 5 mounting portion of the resin molded body 2. An IC 5 is flip-chip mounted on the surface of the resin molded body 2 of the three-dimensional circuit board 1 to constitute an electronic component.
That is, the three-dimensional circuit board 1 of the present embodiment includes a resin molded body 2, and a conductor pattern 4 serving as a conductor wiring is formed on the surface of the resin molded body 2, and an electron is formed on the surface of the resin molded body 2. It is a board | substrate with which IC5 which is an element is mounted.
By the way, the linear expansion coefficient of the molding resin is generally large, and in the conventional flip-chip mounting of the IC, the thermal strain due to the expansion difference is directly applied to the connection portion between the IC and the three-dimensional circuit board 1, so that the product reliability is improved. Was low.
On the other hand, the molded circuit board 1 of this embodiment can suppress the expansion and contraction with respect to the temperature change of the resin molded body 2 by configuring the insert member 3 with a material having a small linear expansion coefficient. The thermal strain due to the expansion difference hardly reaches the connection part with the three-dimensional circuit board 1, and the reliability of the product can be improved.
In addition, it is desirable to form irregularities on the surface of the insert member 3. With such a configuration, it is possible to improve the adhesion to the resin molded body 2 and to increase the restraining force against the expansion and contraction of the resin.
In addition, the conventional product has a low thermal conductivity of the molding resin, and cannot generate heat when the IC 5 is operated, and it is necessary to add a heat radiating member.
On the other hand, since the three-dimensional circuit board 1 of the present embodiment is composed of the insert member 3 made of a material having high thermal conductivity, the heat generated during the operation of the IC 5 can be efficiently radiated.

Further, the insert member 3 is made of an inorganic material such as metal or ceramic as described above, and a part thereof is exposed to the outside from the resin molded body 2 (portion 11). According to this configuration, the IC5 connection portion can be efficiently heated by heating the exposed portion 11 of the insert member 3, and stable connection can be achieved in bare chip mounting of the IC 5 to the thick three-dimensional circuit board 1. Quality can be ensured.
Further, the insert member 3 is formed with a mark for positioning the insert member 3, for example, a positioning reference 12 such as a pin hole by machining or the like. Thereby, the positioning (described later) of the three-dimensional circuit board 1 can be performed with high accuracy without strictly managing the molding shape accuracy of the resin molding 2 with respect to shrinkage or the like during resin molding.
Further, when the insert member 3 is made of an inorganic material having magnetism, the three-dimensional circuit board 1 of the present embodiment can be fixed by an electric magnet or the like, and the handling property when the IC 5 is mounted is improved. There is no need to provide a fixing base for clamping or the like on the circuit board 1. In this case, fixing and heating can be performed efficiently by providing a heating means in the magnet fixing portion.
It is conceivable to use a thermosetting resin such as an epoxy resin as the resin molded body 2. Thereby, the heat resistance of the three-dimensional circuit board 1 is improved, and gold / tin eutectic bonding or the like can be performed at the time of flip chip mounting.
In addition, about the resin molding method in the case of forming the resin molding 2, various methods, such as injection molding, extrusion molding, casting, and coating the resin on the surface of the insert member 3, are possible. By these methods, The surface of the insert member 3 is coated with a resin to form the resin molded body 2, and the conductor pattern 4 serving as a conductor wiring is formed on the surface of the resin molded body 2 to manufacture the three-dimensional circuit board 1.

[Second Embodiment]
FIG. 2 is a longitudinal sectional view of a three-dimensional circuit board as a second embodiment of the present invention.
In FIG. 2, members having the same reference numerals as those in FIG. 1 are the same members as in the first embodiment, and detailed description thereof is omitted.
2 (a), (b), and (c) are different from the three-dimensional circuit board 1 shown in FIG. 1 in that, in the case of FIG. That is, the concave shape 21 is formed.
In the example of FIG. 2A, the conductor pattern 4 serving as the conductor wiring is also formed in the concave shape 21, and the IC 5 is flip-chip mounted. By making the depth of the concave shape 21 deeper than the thickness of the IC 5, it is possible to prevent the IC 5 from traveling on business even if the IC 5 is mounted.
Here, the insert member 3 is also formed with a concave shape in accordance with the concave shape 21 so that the insert member 3 is greatly exposed on the other surface of the resin molded body 4 on which the IC 5 is not mounted, and its function is effectively utilized. can do.
In the example of FIG. 2B, the IC 5 is fixed to the concave shape 21 by the die bonding 22 and is connected to the conductor pattern 4 on the three-dimensional circuit board 1 by the wire bonding 23.
In the present embodiment, the conductor pattern 4 is formed up to the concave shape 21 and wire bonding is performed in the concave shape 21. However, the conductor pattern 4 can be formed in the same plane, Forming can simplify the wiring pattern forming process.

In the example of FIG. 2C, in the configuration of FIG. 2B, the insert member 3 is exposed outside the three-dimensional circuit board 1 within the concave shape 21, and the IC 5 is directly fixed to the exposed portion by the die bonding 22. Has been.
Thus, since IC5 is directly die-bonded to the insert member 3, in the example of FIG.2 (c), the heat dissipation from IC5 can further be improved.
In the above example, the IC 5 is mounted as an electronic element. However, a light emitting element, a light receiving element, or the like may be mounted.
Here, in a circuit board formed on a general resin molded body, expansion, contraction, twisting, etc. of the substrate occur due to temperature change, and the optical axis is shifted when a light emitting element or a light receiving element is mounted. For this reason, it has been difficult to apply to devices that require accuracy.
On the other hand, in the molded circuit board 1 of the present embodiment, the insert member 3 is insert-molded, so that the optical axis shift due to expansion and contraction of the molded circuit board 1 itself can be suppressed. It is possible to form an electronic component on which a light receiving / emitting element with high accuracy such as a light receiving element is not displaced.
As shown in FIG. 3A, a functional device that is an electronic element accompanied by the operation of the piezoelectric element 41 or the like may be mounted on the exposed surface of the insert member 3. In this case, the insert member 3 is preferably formed of a material that can sufficiently exhibit the characteristics of the functional device.

[Third Embodiment]
A method of manufacturing the three-dimensional circuit board having the above-described configuration as the third embodiment of the present invention will be described.
This manufacturing method is carried out by sequentially executing the following first to fifth steps.
(1) 1st process The mold for shaping | molding the resin molding 2 is prepared. This molding die has a hydrophobic region formed on a part of its inner surface, thereby forming a hydrophilic pattern outside the hydrophobic region. When the catalyst colloid solution is supplied to the mold, the catalyst colloid solution is collected only in the hydrophilic pattern.
(2) Second Step Thereafter, by drying the inside of the molding die, the catalyst colloid solution is volatilized, the catalyst remains on the hydrophilic pattern, and the underlying wiring of the wiring pattern 4 can be formed.
When metal nanoparticles having a particle size of 100 nm or less are used as the catalyst, the metal nanoparticles are fused when heated after drying, and the underlying wiring of the wiring pattern 4 can be formed.
In the enlarged longitudinal sectional view of FIG. 5A, reference numeral 51 indicates fused metal nanoparticles (note that reference numeral 52 indicates a molding die).
(3) Third step The above-mentioned insert member 3 is positioned in the molding die after volatilization of the catalyst colloid solution. The positioning reference 12 described above can be used for this positioning.
(4) Fourth Step Next, by supplying a fluid resin into the molding die by a process such as injection molding or casting, and curing and releasing, a catalyst base wiring (of the wiring pattern 4) ( The resin molded body 2) can be transferred to the surface of the insert member 3.
(5) Fifth Step Thereafter, the wiring pattern 4 is formed by electroless plating on the transferred catalyst base wiring.
Thereby, the patterning with respect to an individual product is unnecessary, and the three-dimensional circuit board 1 without a removal process such as etching can be manufactured.
In addition, a conductor that does not act as a catalyst for electroless plating is formed as a base wiring in a conductive state, transferred to the resin surface to be the resin molded body 2, and then formed into a wiring pattern 4 by electrolytic plating. The three-dimensional circuit board 1 can be manufactured.
According to this manufacturing method, the fine wiring pattern 4 with high adhesive force can be formed on the surface of the resin molding 2 of the thermosetting resin.

Examples of the present invention will be described below.
[Example 1]
Example 1 corresponds to the first embodiment.
A sample in which the IC 5 was solder flip-chip mounted on the three-dimensional circuit board 1 having the conductor pattern 4 formed on the surface of the resin molded body 4 was prepared. Here, the thermal strain reliability at the connection part of the IC 5 when the insert molding is performed as the insert member 3 in the resin molded body 2 with and without the ceramic block having a high thermal conductivity is compared and evaluated.
Resin molding was performed so that the shape of the three-dimensional circuit board 1 was 30 × 10 × 6 mm, and the conductor pattern 4 was formed with a copper pattern on the surface.
Here, the ceramic to be inserted was 20 × 10 × 5.4 mm. Thereby, the resin thickness on ceramics of the flip chip mounting surface of IC5 in the sample in which ceramics is inserted is about 0.3 mm.
Polyphthalamide (PPA) was used as the material of the resin molded body 4.
The size of IC5 was 10 × 3 × 0.5 mm, and solder flip chip mounting was performed at a pitch of 0.2 mm.
After flip chip mounting, 500 cycles of a temperature cycle test (−25 to 125 ° C.) were performed, and the results shown in Table 1 below were obtained.
As can be seen from Table 1, in the three-dimensional circuit board 1 of this embodiment using ceramics as the insert member 3, high connection reliability against thermal strain can be secured.

[Example 2]
Example 2 corresponds to the first and second embodiments.
Here, as an example of a functional device which is an electronic element, a piezoelectric element 41 serving as an ink jet head was mounted on the three-dimensional circuit board 1 to evaluate the characteristics.
Stainless steel was used as the insert member 3 so as not to absorb the vibration of the piezoelectric element 41. The ink jet characteristics with respect to the three-dimensional circuit board 1 when the stainless steel is insert-molded (FIG. 3A) and when it is not (FIG. 3B) are compared and evaluated as the vibration characteristics of the piezoelectric element 41.
The resin molded body 4 is resin-molded so that the size of the three-dimensional circuit board 1 is 30 × 10 × 6 mm, the wiring pattern 4 of the copper pattern is formed on the surface, and further the IC 5 is mounted by the wire bonding 23 Nickel and gold plating were applied.
Polyphthalamide (PPA) was used as the material of the resin molded body 4.
After mounting the IC 5 for driving the piezoelectric element 41 on the three-dimensional circuit board 1 by the wire bonding 23, the piezoelectric element 41 subjected to the groove processing was bonded. Here, for the sample inserted with stainless steel (FIG. 3A), the piezoelectric element 41 is mounted on the stainless steel, and for the sample not inserted with stainless steel (FIG. 3B), on the resin molded body 4 A piezoelectric element 41 was mounted on the substrate.
The terminals of the piezoelectric element 41 and the wiring pattern 4 on the three-dimensional circuit board 1 were connected by wire bonding 23, and the vibration characteristics of the piezoelectric element 41 were measured with a laser displacement system.
As a result, in the sample in which stainless steel was insert-molded and the piezoelectric element 41 was mounted (FIG. 3 (a)), a good amplitude characteristic was shown, but in the sample adhered on the resin molded body 4 without insert molding. (FIG. 3B), it was confirmed that the vibration of the piezoelectric element 41 was absorbed and the amplitude was attenuated.
Here, by using the three-dimensional circuit board 1 in which the concave shape 21 is formed in the mounting portion of the IC 5 (FIG. 4), the protrusion of the mounting portion of the IC 5 is made while fully utilizing the characteristics of the functional device such as the piezoelectric element 41. Therefore, the module can be miniaturized.

[Example 3]
Example 3 corresponds to the third embodiment.
(1) 1st process The fluorine coating agent (Fluorosurf FG-5010) was coated on the shaping | molding die, and the hydrophobic film | membrane was formed. A hydrophilic pattern was formed by removing the hydrophobic film in a pattern with an excimer laser.
A silver colloid aqueous solution of less than 100 nm (Fine Sphere SVW102 (manufactured by Nippon Paint)) was supplied onto the mold on which the hydrophilic / hydrophobic pattern was formed and air blown to attach the silver colloid aqueous solution only to the hydrophilic pattern portion.
(2) 2nd process Then, the silver nanoparticle was deposited only in the hydrophilic pattern part by volatilizing a solvent.
(3) 3rd process The above-mentioned insert member 3 was positioned in the shaping | molding die.
(4) Fourth Step Thereafter, the mold is heated under the condition of 200 ° C., and the silver nanoparticles are fused, and a thermosetting liquid epoxy resin (CEL-C-7700) is placed in the mold. ) And cured at a temperature of 200 ° C. for 30 minutes.
After curing, the epoxy resin was peeled off from the mold, so that the silver nanoparticles were fused to form a porous film and transferred onto the pattern on the epoxy resin side. In the enlarged longitudinal sectional view of FIG. 5B, reference numeral 53 denotes a porous film (resin molded body 2) in which silver nanoparticles are fused.
(5) Fifth Step Thereafter, by immersing in an electroless copper plating bath having a liquid temperature of 40 ° C., copper was grown on the catalyst transferred as the underlying wiring, and the conductor pattern 4 could be formed.

[Example 4]
This example also corresponds to the third embodiment.
(1) 1st process The fluorine coating agent (Fluorosurf FG-5010) was coated on the mold for forming, and a hydrophobic film was formed. A hydrophilic pattern was formed by removing the hydrophobic film in a pattern with an excimer laser.
A silver colloid aqueous solution of less than 100 nm (Fine Sphere SVW102 (manufactured by Nippon Paint)) was supplied onto the mold on which the hydrophilic / hydrophobic pattern was formed, and air blown to attach the silver colloid aqueous solution only to the hydrophilic pattern portion.
(2) 2nd process Then, the silver nanoparticle was deposited only in the hydrophilic pattern part by volatilizing a solvent. The deposition thickness was increased to about 1 μm.
Thereafter, the silver nanoparticle was fused by heating the mold at 200 ° C., and a conductive pattern 4 of a porous film in which silver was fused on the mold could be formed.
(3) 3rd process The above-mentioned insert member 3 was positioned in the shaping | molding die.
(4) Fourth Step A thermosetting liquid epoxy resin (CEL-C-7700) was supplied into the molding die and cured at a temperature of 200 ° C. for 30 minutes.
After curing, the epoxy resin was peeled from the molding die, whereby the conductor pattern 4 could be transferred to the epoxy resin side in a state where the silver nanoparticles were fused to form a porous film.
(5) Fifth Step Thereafter, a wiring pattern 4 was formed by copper pyrophosphate bath plating so that the current density was 4 A / dm ² and the theoretical thickness was 10 μm at 20 ° C.

1 is a longitudinal sectional view of a three-dimensional circuit board and an electronic component as a first embodiment of the present invention. The longitudinal cross-sectional view of the three-dimensional circuit board and electronic component as the 2nd Embodiment of this invention. The longitudinal cross-sectional view of the three-dimensional circuit board (electronic component) which mounted the piezoelectric element. The longitudinal cross-sectional view of the three-dimensional circuit board (electronic component) which mounted the piezoelectric element. FIG. 3 is an enlarged longitudinal sectional view illustrating an embodiment of the present invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 3D circuit board, 2 resin molding, 3 insert member, 4 conductor wiring, 5 electronic element, 12 mark, 22 die bonding, 23 wire bonding, 41 functional device, 51 metal nanoparticle, 52 mold for molding

Claims (15)

Conductor wiring is formed on the surface of the resin molded body, and a three-dimensional circuit board on which electronic elements are mounted on the surface of the resin molded body,
An insert member that is provided in at least a lower portion or a side portion of the mounting portion of the electronic element of the resin molded body and is made of a material having a smaller linear expansion coefficient than the resin molded body or a material having higher thermal conductivity than the resin molded body The molded circuit board is characterized in that the resin molded body is formed on the surface of the insert member where the irregular shape is formed . Conductor wiring is formed on the surface of the resin molded body, and a three-dimensional circuit board on which electronic elements are mounted on the surface of the resin molded body,
An insert member that is provided in at least a lower portion or a side portion of the mounting portion of the electronic element of the resin molded body and is made of a material having a smaller linear expansion coefficient than the resin molded body or a material having higher thermal conductivity than the resin molded body The insert member has magnetism,
A molded circuit board, wherein the resin molded body is formed on a surface of the insert member.   The three-dimensional circuit board according to claim 1, wherein the insert member is an inorganic material. The part of said insert member is exposed, The three-dimensional circuit board as described in any one of Claims 1-3 characterized by the above-mentioned . The three-dimensional circuit board according to claim 4, wherein a reference for positioning the member is formed in the exposed portion of the insert member. The three-dimensional circuit board according to any one of claims 1 to 5, wherein a mounting portion on which the electronic element is mounted is formed in a concave shape on the surface of the resin molded body. The three-dimensional circuit board according to any one of claims 1 to 6, wherein the resin molded body is a thermosetting resin. An electric circuit structure, wherein an electronic element is flip-chip mounted on the three-dimensional circuit board according to any one of claims 1 to 7 . 7. The electric circuit structure according to claim 6, wherein the electronic element is die-bonded in the concave shape of the three-dimensional circuit board according to claim 6, and the electronic element is connected to the conductor wiring by wire bonding. The electric circuit structure according to claim 9, wherein the insert member is exposed at the concave portion. The electric circuit structure according to any one of claims 8 to 10, wherein at least one of a light emitting element and a light receiving element is mounted as the electronic element. 6. An electric circuit structure comprising a movable functional device mounted on the insert member exposed portion of the molded circuit board according to claim 5 and connected to wiring on the molded circuit board. In a method for manufacturing a three-dimensional circuit board, in which a conductor wiring is formed on a resin molded body, and a three-dimensional circuit board on which electronic elements are mounted on the surface of the resin molded body,
  A first step of supplying a catalyst colloid solution to a molding die in which a hydrophobic region is formed on a part of the inner surface and a hydrophilic pattern is formed outside the hydrophobic region;
  A second step of forming a catalyst base wiring by volatilizing the solvent of the catalyst colloid solution;
  A third step of positioning an insert member for forming a resin on the surface in the molding die;
  A fourth step of transferring the catalyst base wiring to the surface of the member by supplying and curing a fluid resin to be the resin molded body in the molding die;
  A fifth step of forming the conductor wiring on the catalyst base wiring by electroless plating;
With
  The method of manufacturing a three-dimensional circuit board, wherein the insert member is made of a material having a smaller linear expansion coefficient or a higher thermal conductivity than the resin. The method of manufacturing a three-dimensional circuit board according to claim 13, wherein the catalyst colloid solution is a colloid solution containing metal nanoparticles having a particle size of 100 nm or less. The first step uses a metal nanoparticle colloid solution as the catalyst colloid solution,
  The method of manufacturing a three-dimensional circuit board according to claim 13 or 14, wherein the fourth step uses a fluid resin as a fluid plastic.

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