JP4811208B2 - Surface modification method and surface modification apparatus - Google Patents

Description

  The present invention relates to a surface modification method and a surface modification apparatus.

  A technique of forming a liquid-repellent film on the surface of a workpiece is widely used in order to give the surface of a workpiece made of metal or the like liquid repellency like a nozzle plate of an inkjet head. For example, in the method disclosed in Patent Document 1, first, plasma polymerization is performed on the surface of a workpiece using silicon to form a polymerized film. Subsequently, annealing is performed to promote the crosslinking reaction. Next, ultraviolet rays (hereinafter also referred to as UV light) are irradiated to cut the methyl group at the end of the polymerized film. And it exposes to the gas containing oxygen and hydrogen, and OH group (hydroxyl group) is combined. Subsequently, the workpiece is immersed in a solution containing an alkoxysilane having a long-chain RF group (perfluoroalkyl group) and dehydrated to form a molecular film having a long-chain RF group on the surface of the workpiece. To do. A liquid repellent film is formed by the above method.

  In the above process, for example, Patent Document 2 discloses a method of irradiating excimer UV light using xenon gas as a method of irradiating ultraviolet rays. According to this, it is possible to irradiate ultraviolet rays having a wavelength of 172 nm using a dielectric barrier lamp enclosing xenon gas. Since excimer UV light has a short wavelength, it has high photon energy and is suitable for cutting the methyl group at the end of the polymerized film.

JP 2004-351923 A JP-A-8-124540

  When the excimer UV light is irradiated to the workpiece, the excimer UV light is also irradiated to the gas existing on the surface of the workpiece. When the gas contains moisture, the moisture absorbs excimer UV light, and the excimer UV light that reaches the workpiece is attenuated. On the other hand, since an OH group is formed on the workpiece, hydrogen and oxygen are required, and it is necessary to irradiate the workpiece with ultraviolet rays in a gas atmosphere in which water molecules are likely to exist. Therefore, in order to irradiate the workpiece with ultraviolet rays having a predetermined light intensity, there has been a problem that light having a high light intensity must be irradiated in consideration of ultraviolet rays absorbed by moisture.

  The present invention has been made paying attention to such conventional problems, and an object of the present invention is to provide a surface modification method and a surface modification apparatus capable of surface modification with weak ultraviolet light. It is in.

  In order to solve the above-mentioned problems, the surface modification method of the present invention is a surface modification method for modifying the surface by irradiating the surface of the workpiece with ultraviolet rays, and is humidified by the workpiece. A first spraying step of spraying a humidified gas, a second spraying step of spraying a dry gas that is dried on the workpiece, and an irradiation step of irradiating the surface of the workpiece with ultraviolet rays emitted by the light emitting device; The second spraying step and the irradiation step are performed simultaneously.

  According to this surface modification method, the workpiece is sprayed with humidified humidified gas in the first spraying step. And moisture adheres to the surface of the workpiece. In the second spraying step and the irradiation step, the workpiece is irradiated with ultraviolet rays while being sprayed with a dry gas. The surface of the workpiece and moisture adhering to the surface of the workpiece are activated by being irradiated with ultraviolet rays. Then, the moisture is decomposed, and the generated hydroxyl group and oxygen are bonded to the surface of the workpiece.

  When water molecules contain water molecules, the ultraviolet rays are absorbed by the water molecules and the intensity of the ultraviolet rays that irradiate the surface of the workpiece is weakened. In the surface modification method of the present invention, when irradiating the workpiece with ultraviolet rays, the ultraviolet rays are absorbed by water molecules in the gas because the dried dry gas is irradiated with the ultraviolet rays while spraying. Absent. Therefore, the energy of the irradiated ultraviolet rays is utilized for the reaction in which the hydroxyl group and oxygen are bonded to the workpiece. As a result, the surface of the workpiece can be modified even with ultraviolet rays having low light intensity.

  The surface modification method of the present invention is characterized in that, in the first spraying step, when the humidified gas is sprayed, the gas is sprayed toward the workpiece.

  According to this surface modification method, the humidified gas is sprayed toward the workpiece. At this time, since the humidified gas flows along the surface of the workpiece, moisture can be attached to the surface of the workpiece.

  The surface modification method of the present invention is characterized in that, in the second spraying step, the dry gas is mainly composed of nitrogen gas or nitrogen gas.

  According to this surface modification method, the dry gas is mainly composed of nitrogen gas or nitrogen gas. Since nitrogen gas does not pollute the atmosphere even if it is released to the atmosphere, it can be a surface modification method that is harmless to the natural environment.

  The surface modification method of the present invention is characterized in that, in the irradiation step, the light emitting device and the workpiece are relatively moved to irradiate the workpiece with ultraviolet rays.

  According to this surface modification method, ultraviolet rays are irradiated by relatively moving the ultraviolet light emitting device and the workpiece. That is, when the ultraviolet light emitting part is cylindrical in the light emitting device, the ultraviolet light can be irradiated to an area corresponding to the product of the length of the ultraviolet light emitting part and the length of relative movement of the ultraviolet light emitting part and the workpiece. Therefore, an ultraviolet light emitting device corresponding to the area covering the workpiece is not required, and a large area can be irradiated with a small number of ultraviolet light emitting units. That is, since a wide workpiece can be irradiated with a small number of ultraviolet light emitting portions, the power supplied to the ultraviolet light emitting portion can be reduced. As a result, an energy-saving surface modification method can be obtained.

  In the surface modification method of the present invention, the light emitting device emits ultraviolet rays by discharging a dielectric barrier discharge excimer lamp filled with xenon forming excimer or a discharge gas mainly containing xenon. And

  According to this surface modification method, the light emitting device uses a dielectric barrier discharge excimer lamp filled with xenon for forming excimer or a discharge gas mainly composed of xenon. Thereby, the light whose ultraviolet wavelength is shorter than 180 nm can be irradiated. Therefore, ultraviolet rays have strong photon energy, and can break the molecular bonds of substances on the surface of the workpiece and activate the surface of the workpiece.

  In order to solve the above problems, a surface modification apparatus of the present invention is a surface modification apparatus that irradiates the surface of a workpiece with ultraviolet rays to modify the surface, and humidifies the first gas. A humidifying device that generates a humidified gas; a drying device that generates a dry gas by drying the second gas; a first spraying device that sprays the humidified gas onto the workpiece; and a light-emitting device that emits ultraviolet light; A second spraying device that sprays dry gas between the workpiece and the light emitting device, and is dried from the second spraying device to the workpiece sprayed with the humidified gas by the first spraying device. It is characterized by irradiating ultraviolet rays from a light emitting device while blowing gas.

  According to this surface modification device, the humidifier humidifies the first gas and generates the humidified gas. And a 1st spraying apparatus sprays the humidified gas which is humidified to a workpiece. Accordingly, moisture adheres to the surface of the workpiece.

  A drying device dries the second gas and generates a dry gas. Then, the issuing device irradiates the workpiece with ultraviolet rays while the second spraying device sprays the dry gas dried on the workpiece. The surface of the workpiece and moisture adhering to the surface of the workpiece are activated by being irradiated with ultraviolet rays. Then, the moisture is decomposed, and the generated hydroxyl group and oxygen are bonded to the surface of the workpiece.

  When water molecules contain water molecules, the ultraviolet rays are absorbed by the water molecules and the intensity of the ultraviolet rays that irradiate the surface of the workpiece is weakened. In the surface modification apparatus of the present invention, when irradiating the workpiece with ultraviolet rays, the ultraviolet rays are absorbed by water molecules in the gas because the dried dry gas is irradiated with the ultraviolet rays while spraying. Absent. Therefore, the energy of the irradiated ultraviolet rays is utilized for the reaction in which the hydroxyl group and oxygen are bonded to the workpiece. As a result, the surface of the workpiece can be modified even with ultraviolet rays having low light intensity.

  In the surface reforming apparatus of the present invention, the first spraying device sprays the gas toward the workpiece when the humidified gas is sprayed.

  According to this surface modification device, the humidified gas is sprayed toward the workpiece. At this time, since the humidified gas flows along the surface of the workpiece, moisture can be attached to the surface of the workpiece.

  In the surface reforming apparatus of the present invention, the second gas is characterized by containing nitrogen gas or nitrogen gas as a main component.

  According to this surface modifying apparatus, the dry gas is mainly composed of nitrogen gas or nitrogen gas. Since nitrogen gas does not pollute the atmosphere even if it is released into the atmosphere, it can be a surface modification device that is harmless to the natural environment.

  The surface modification device of the present invention includes a moving table, and the moving table is characterized in that the light emitting device and the workpiece are relatively moved to irradiate the workpiece with ultraviolet rays.

  According to this surface modification apparatus, the ultraviolet light emitting device and the workpiece are relatively moved to irradiate the ultraviolet light. That is, when the ultraviolet light emitting part is cylindrical in the light emitting device, the ultraviolet light can be irradiated to an area corresponding to the product of the length of the ultraviolet light emitting part and the length of relative movement of the ultraviolet light emitting part and the workpiece. Therefore, an ultraviolet light emitting device corresponding to the area covering the workpiece is not required, and a large area can be irradiated with a small number of ultraviolet light emitting units. That is, since a wide workpiece can be irradiated with a small number of ultraviolet light emitting portions, the power supplied to the ultraviolet light emitting portion can be reduced. As a result, an energy-saving surface modification device can be obtained.

  In the surface modification apparatus of the present invention, the moving table has an exhaust hole, the workpiece is placed between the second spraying device and the exhaust hole in the moving table, and the second spraying device blows. The dry gas to be applied passes through the workpiece and is exhausted from the exhaust hole.

  According to this surface modification apparatus, the moving table has the exhaust holes. The gas blown by the blowing device is exhausted from the exhaust hole. Since the workpiece is placed on the moving table, the gas blown by the spraying device passes through the workpiece and is exhausted. Accordingly, even when moisture is decomposed and ozone gas is formed at the place of the workpiece, the ozone gas is exhausted together with the dry gas when the dry gas passes through. Therefore, it can be set as the surface modification apparatus in which a workpiece is not oxidized too much by ozone gas.

  In the surface reforming apparatus of the present invention, the second spraying device is disposed between the first spraying device and the light emitting device, and the second spraying device is a place where the humidified gas is emitted and the light emitting device emits ultraviolet rays. It is characterized by spraying dry gas so as not to flow into the water.

  According to this surface modification device, the second spraying device is disposed between the first spraying device and the light emitting device. Humidified gas is sprayed from the first spraying device. The humidified gas to be sprayed spreads around, but flows away from the light emitting device by the flow of the dry gas sprayed from the second spraying device. Therefore, since the humidified gas does not reach the light emitting device due to the dry gas blown out by the second spraying device, the ultraviolet light emitted by the light emitting device is hardly absorbed by the moisture contained in the humidified gas. As a result, the surface of the workpiece can be modified even with ultraviolet rays having low light intensity.

  In the surface reforming apparatus of the present invention, the first gas is air or a gas mainly composed of air.

  According to this surface modification apparatus, the first gas is mainly composed of air or air. Even if air is released into the atmosphere, it does not pollute the atmosphere, and even if a humidified gas that has humidified air is released into the atmosphere, it does not pollute the atmosphere, so the surface is harmless to the natural environment. It can be a device.

  In the surface modification device of the present invention, the light emitting device includes a lamp and a reflecting mirror, and is arranged in a lamp house filled with an inert gas.

  According to this surface modification device, the light emitting device includes a lamp house filled with an inert gas, and a lamp and a reflecting mirror are arranged in the lamp house. Therefore, the light emitting device is not easily affected by the outside air, and can emit ultraviolet light with a stable output even if the components of the outside air are changed.

(First embodiment)
In the present embodiment, a characteristic surface modification device of the present invention and an example in the case of performing surface modification using this surface modification device will be described with reference to FIGS.

(Surface modification device)
First, the surface modification apparatus will be described. FIG. 1 is a schematic perspective view showing the configuration of the surface modification apparatus. The surface modifying apparatus 1 irradiates ultraviolet rays to modify the work surface.
As shown in FIG. 1, the surface modifying apparatus 1 includes a base 2 formed in a rectangular parallelepiped shape. In the present embodiment, the longitudinal direction of the base 2 is the Y direction, and the direction orthogonal to the Y direction is the X direction.

  On the upper surface 2a of the base 2, a pair of guide rails 3a and 3b extending in the Y direction are provided so as to protrude over the entire width in the Y direction. On the upper side of the base 2, a table 4 as a moving table provided with a linear motion mechanism corresponding to the pair of guide rails 3a and 3b is attached. The linear motion mechanism of the table 4 is, for example, a screw-type linear motion mechanism including a screw shaft (drive shaft) extending in the Y direction along the guide rails 3a and 3b and a ball nut screwed to the screw shaft. The drive shaft is connected to a Y-axis motor (not shown) that receives a predetermined pulse signal and rotates forward and backward in units of steps. When a drive signal corresponding to a predetermined number of steps is input to the Y-axis motor, the Y-axis motor rotates normally or reversely, and the table 4 corresponds to the same number of steps along the Y-axis direction. The robot moves forward or backward at a predetermined speed.

  Further, a table position detector 5 is arranged on the upper surface 2a of the base 2 in parallel with the guide rails 3a and 3b so that the position of the table 4 can be measured.

  A mounting surface 6 is formed on the upper surface of the table 4, and a suction type substrate chuck mechanism (not shown) is provided on the mounting surface 6. When the substrates 7 and 8 as workpieces are placed on the placement surface 6, the substrates 7 and 8 are positioned and fixed at predetermined positions on the placement surface 6 by the substrate chuck mechanism.

  On both sides of the table 4 in the X direction, second spraying devices 9 and 10 are arranged. The second blowing devices 9, 10 are formed with blowing ports 9 a, 10 a toward the mounting surface 6, and blow dry gas from the blowing ports 9 a, 10 a to the mounting surface 6.

  In the mounting surface 6, an exhaust hole 11 is formed between the substrates 7 and 8, so that gas blown from the outlets 9 a and 10 a passes through the exhaust hole 11 and is discharged from the mounting surface 6. It has become.

  A pair of support bases 12a and 12b are erected on both sides of the base 2 in the X direction, and support members 13 extending in the X direction are installed on the pair of support bases 12a and 12b. A light emitting device 14 is arranged on the table 4 side of the support member 13.

  The light emitting device 14 is a sealed rectangular lamp house 14h shown in FIG. 4A, and the dielectric barrier lamp 14a shown in FIG. 4A in which xenon gas is sealed inside the lamp house. The apparatus and the reflecting plate 14b are provided. The dielectric barrier lamp 14a and the reflecting plate 14b can irradiate the table 4 with ultraviolet rays having a wavelength of 172 nm. In the light emitting device 14, the inside of the lamp house 14h is filled with an inert gas 14c shown in FIG. 4A, so that ultraviolet rays are hardly absorbed. In addition, the cooling device has a configuration in which piping through which the coolant flows is disposed on the dielectric barrier lamp 14a and the reflection plate 14b. The cooling device prevents the lifetime of the dielectric barrier lamp 14a from being excessively increased and shortening the service life. Further, the cooling device cools the reflecting plate 14b to suppress the temperature rise of the entire cooling device so that the operator is not burned.

  Returning to FIG. 1, second spraying devices 15 and 16 are arranged on both sides of the light emitting device 14 in the Y direction. The second blowing devices 15 and 16 are formed with blowing ports 15a and 16a toward the surface 14d on the table 4 side of the light emitting device 14, so that dry gas is blown from the blowing ports 15a and 16a to the surface 14d. It has become. When the table 4 moves to a location facing the light emitting device 14, the dry gas blown from the blowout ports 15 a and 16 a is exhausted through the exhaust hole 11.

  First spraying devices 17 and 18 are arranged on both sides of the second spraying devices 15 and 16 in the Y direction so as to sandwich the second spraying devices 15 and 16. The first blowing devices 17, 18 are formed with blowing ports 17 a, 18 a toward the mounting surface 6 of the table 4, and the humidified gas is blown out from the blowing ports 17 a, 18 a to the mounting surface 6. ing.

The surface modification device 1 includes a UV light source control device 19, a spray control device 20, a drying device 21, and a humidification device 22 on the side opposite to the X direction of the base 2, and on the X direction side of the base 2. A control device 23 for controlling the surface modification device 1 is provided.
The UV light source control device 19 is a device that controls the temperature by supplying power to the light-emitting device 14 to control the emission and stoppage of ultraviolet rays and cooling the dielectric barrier lamp 14a.

  The spray control device 20 includes a compression pump and a tank, and supplies the gas blown by the first spray devices 17 and 18 and the second spray devices 9, 10, 15 and 16, and starts and stops blowing. It is a device that controls the amount of blowout. The drying device 21 is a device that dehumidifies the gas to be blown out. That is, the drying device 21 dehumidifies the second gas 21a, removes moisture in the second gas 21a, and the spraying control device 20 sprays the dehumidified dry gas to the second spraying devices 9, 10, 15. , 16. The second spraying devices 9, 10, 15, 16 spray the dehumidified dry gas onto the substrates 7, 8. The dry gas sprayed by the second spraying device 9, 10, 15, 16 is preferably a gas that is not activated by ultraviolet rays. In the present embodiment, for example, nitrogen gas is employed as the second gas 21a.

The humidifier 22 is a device that humidifies by dispersing water molecules in the first gas 22a. The humidifier 22 humidifies the first gas 22a, and the spray control device 20 supplies the humidified gas to the first spray devices 17 and 18. The first spraying devices 17 and 18 spray the humidified gas onto the substrates 7 and 8. The first gas 22a sprayed by the first spraying devices 17 and 18 may be any gas that can transport water molecules to the substrates 7 and 8, and in this embodiment, for example, air is used as the first gas 22a. is doing.
When there is a possibility that oil or dust may be contained in the dry gas and humidified gas, it is preferable to clean the gas by passing it through a filter before humidification and dehumidification.

  The entire surface reforming apparatus 1 is surrounded by a cover 24, and the gas in the cover 24 is exhausted through an exhaust duct (not shown). An opening / closing cover 25 is arranged in the direction opposite to the Y direction in the figure of the cover 24. The open / close cover 25 includes a hinge (not shown) and can be opened and closed. When the substrates 7 and 8 are taken out from the surface modification apparatus 1 and when the substrates 7 and 8 are installed from the surface modification apparatus 1, the opening / closing cover 25 is opened, and the substrates 7 and 8 are taken out and installed. Thereafter, the cover 24 can be sealed by closing the open / close cover 25.

  The control device 23 is a device that controls the surface modification device 1 and will be described with reference to FIG. FIG. 2 is an electric control block diagram of the surface modification apparatus. In FIG. 2, the surface modification apparatus 1 includes a CPU (arithmetic processing apparatus) 30 that performs various arithmetic processes as a processor, and a memory 31 that stores various kinds of information.

  The monitor 32, input device 33, table control device 34, chuck control device 35, spray control device 20, and UV light source control device 19 are connected to the CPU 30 via an input / output interface 36 and a data bus 37.

  The memory 31 is a concept including a semiconductor memory such as a RAM and a ROM, and an external storage device such as a hard disk and a CD-ROM. Functionally, a storage area for storing a program 38 in which a control procedure of the operation of the surface modification apparatus 1 is described, a storage area for storing conditions for supplying power when emitting ultraviolet light, and a table 4 A storage area for storing the amount of movement, a work area for the CPU 30, a storage area that functions as a temporary file, and other various storage areas are set.

  The CPU 30 performs control for irradiating the surfaces of the substrates 7 and 8 with ultraviolet rays in accordance with a program 38 stored in the memory 31. If the program 38 is divided in detail, the table 4 is moved to the initial position, and has a table calculation unit for scanning the table 4 when irradiating ultraviolet rays. In addition, the program 38 includes a spray calculation unit that controls the operation timing of the first spraying devices 17 and 18 and the second spraying devices 9, 10, 15, and 16, and UV light that controls the timing of irradiating ultraviolet rays. It has various functional calculation units such as a calculation unit.

  The input device 33 is a device for inputting data of ultraviolet irradiation conditions used in the ultraviolet irradiation, and the monitor 32 is a device for displaying various information at the time of measurement. The CPU 30 performs ultraviolet irradiation according to the input UV irradiation conditions and the program 38 and displays the ultraviolet irradiation state on the monitor 32. The operator looks at various types of information displayed on the monitor 32 and confirms the ultraviolet irradiation state for operation.

  The table control device 34 is a device that controls the acquisition, movement, and stop of the position information of the table 4. The table 4 incorporates a table position detector 5 shown in FIG. 1 that can detect the movement distance, and the table control device 34 recognizes the position of the table 4 based on the output of the table position detector 5. The table control device 34 can transmit a pulse signal to the table 4 and move the table 4 to a desired position.

  The substrate chuck 39 is a chuck that receives the electric signal and sucks and fixes the substrates 7 and 8. The substrate chuck 39 is connected to the chuck controller 35 and controlled by the chuck controller 35. The chuck control device 35 is connected to the CPU 30 via an input / output interface 36 and a data data bus 37.

  The first spraying devices 17 and 18 are devices that spray humidified gas onto the substrates 7 and 8, and the second spraying devices 9, 10, 15, and 16 are devices that spray dry gas onto the substrates 7 and 8. is there. The first spraying devices 17, 18 and the second spraying devices 9, 10, 15, 16 are connected to the spray control device 20, and the start and stop of gas spraying, the gas flow rate, etc. are controlled by the spraying control device. 20 is controlled. The spray control device 20 is connected to the CPU 30 via the input / output interface 36 and the data data bus 37.

  The light emitting device 14 is a device that irradiates the substrates 7 and 8 with ultraviolet rays, and is connected to the UV light source control device 19. The UV light source controller 19 controls the start and stop of ultraviolet irradiation, the intensity of ultraviolet light, and the like. The UV light source control device 19 is connected to the CPU 30 via the input / output interface 36 and the data data bus 37.

(Surface modification method)
Next, the surface modification method of the present invention will be described with reference to FIGS. FIG. 3 is a flowchart of the surface modification method, and FIGS. 4 to 6 are diagrams illustrating the surface modification method.

  In the flowchart of FIG. 3, step S <b> 1 corresponds to a material supply process and is a process of mounting the substrates 7 and 8 on the surface modification apparatus 1. Next, the process proceeds to step S2. Step S <b> 2 corresponds to a first spraying process, and is a process of spraying humidified gas on the substrates 7 and 8. Next, the process proceeds to step S3. Step S3 corresponds to the second spraying process, and is a process of spraying dry gas onto the substrates 7 and 8. Steps S2 and S3 are performed at the same time, and the humidified gas and the dry gas are sprayed onto the substrates 7 and 8 at the same time. Next, the process proceeds to step S4. Step S4 corresponds to an irradiation process, and is a process of irradiating the substrates 7 and 8 with ultraviolet rays. In step S4, step S2 and step S3 are continuously performed. That is, ultraviolet rays are irradiated while spraying humidified gas and dry gas on the substrates 7 and 8. Next, the process proceeds to step S5. Step S <b> 5 corresponds to a material removal process, and is a process of taking out the substrates 7 and 8 from the surface modification apparatus 1. With the above process, the surface modification process for the substrates 7 and 8 is completed.

  Next, the surface modification method will be described in detail with reference to FIGS. 4 to 6 in association with the steps shown in FIG.

  FIG. 4A is a diagram corresponding to step S1. As shown in FIG. 4A, the substrates 7 and 8 are mounted on the table 4. A silicon polymer film is formed on the surfaces of the substrates 7 and 8 as workpieces using a plasma polymerization technique, and a methyl group is formed on the surface of the silicon polymer film. The substrates 7 and 8 are fixed to the table 4 by the substrate chuck 39 shown in FIG.

  FIGS. 4B and 4C are diagrams corresponding to step S2 and step S3. FIG.4 (c) is the figure seen from another side surface (A direction in a figure) in FIG.4 (b). As shown in FIGS. 4B and 4C, the first spraying device 18 sprays the humidified humidified gas 42 onto the substrates 7 and 8. Similarly, the second spraying devices 9, 10, 15, 16 inject the dry gas 43.

The 2nd spraying devices 15 and 16 are arrange | positioned adjacent to the 1st spraying devices 17 and 18, and the humidified gas 42 which blows off from the 1st spraying devices 17 and 18 is the 2nd spraying device 15, Under the influence of the flow of the dry gas 43 that 16 blows out, it does not flow into the light emitting device 14.
While the humidified gas 42 is sprayed from the first spraying device 18 onto the substrates 7 and 8, the table 4 is moved in the direction facing the light emitting device 14 (direction B in the figure). Then, water molecules are attached to the surfaces of the substrates 7 and 8.

  FIG. 4D to FIG. 6A are diagrams corresponding to step S4. As shown in FIG. 4D, the light emitting device 14 irradiates ultraviolet rays 44. The ultraviolet ray 44 is not limited as long as it can cut the methyl group formed on the surfaces of the substrates 7 and 8. In this embodiment, for example, an excimer having a wavelength of 172 nm is used by using a dielectric barrier lamp enclosing xenon gas. Irradiating with ultraviolet rays. At this time, since step S3 and step S4 are continuously performed, the table 4 emits light while blowing the humidified gas 42 and the dry gas 43 and irradiating the ultraviolet ray 44 to the substrates 7 and 8. It moves in the direction of the location facing the device 14 (direction B in the figure). At this time, the moving speed of the table 4 is constant, and the time for which the substrate 7 and the substrate 8 are irradiated with the ultraviolet rays 44 is made equal.

  FIG. 5A is a diagram when the table 4 passes through a place facing the light emitting device 14. As shown in FIG. 5A, the substrates 7 and 8 are irradiated with ultraviolet rays 44. The dry gas 43 supplied from the second spraying device 9, 10, 15, 16 flows into the exhaust hole 11 and is exhausted. Since the dry gas 43 does not contain water molecules, the ultraviolet light 44 irradiates the substrates 7 and 8 without being absorbed by the dry gas 43. Since the humidified gas 42 is blown onto the surfaces of the substrates 7 and 8, water molecules are attached. The ultraviolet ray 44 cuts the bond between the methyl group and the water molecule of the silicon polymer film formed on the surfaces of the substrates 7 and 8 and promotes the bond between the silicon polymer film and the OH group or oxygen.

  FIG.5 (b) is the figure which looked at the light-emitting device 14 and the table 4 in Fig.5 (a) from another side surface (A direction in the figure). As shown in FIG. 5B, the dry gas 43 is exhausted from the exhaust hole 11 by being pressed against the substrates 7 and 8 so as to surround the substrates 7 and 8 from four directions. Therefore, the humidified gas 42 does not enter between the light emitting device 14 and the substrates 7 and 8.

  FIG. 5C is a diagram in which the table 4 is moving in a different direction. The table 4 passes through the place facing the light emitting device 14, changes direction, and moves in the direction of the place facing the light emitting device 14 (direction C in the figure). At this time, the substrates 7 and 8 are not irradiated with the ultraviolet ray 44 and the humidified gas 42 is blown. While adhering water molecules to the substrates 7 and 8, the table 4 is moved in a direction facing the light emitting device 14 (direction C in the figure).

FIG. 5D is a diagram when the table 4 passes through a place facing the light emitting device 14. As shown in FIG. 5 (d), the substrates 7 and 8 are irradiated with ultraviolet rays 44, and OH groups are formed in the silicon polymer film formed on the surfaces of the substrates 7 and 8.
FIG. 6A is a diagram when the table 4 has finished passing through the place facing the light emitting device 14. The table 4 is moved from a place where the substrates 7 and 8 are irradiated with the ultraviolet ray 44 and is blown with the dry gas 43 until the table 4 is moved to a place where the ultraviolet ray 44 is not irradiated.

  FIG. 6B is a diagram corresponding to step S5. As shown in FIG. 6B, the irradiation of the ultraviolet ray 44 is stopped, and the spraying of the humidified gas 42 and the dry gas 43 is also stopped. The table 4 moves to a place where the substrates 7 and 8 can be easily taken out, and the substrates 7 and 8 are removed from the surface modification apparatus 1. On the surfaces of the substrates 7 and 8, the methyl group is cut and oxygen or a hydroxyl group is bonded, and the surface modification is completed.

As described above, this embodiment has the following effects.
(1) According to the present embodiment, in the second spraying step and the irradiation step, the substrates 7 and 8 are irradiated with the ultraviolet rays 44 while being sprayed with the dry gas 43. When water molecules contain water molecules, the ultraviolet rays 44 are absorbed by the water molecules, and the light intensity of the ultraviolet rays 44 that irradiate the substrates 7 and 8 becomes weak. In the method of the present invention, when the ultraviolet ray 44 is irradiated onto the substrates 7 and 8, the dried dry gas 43 is irradiated onto the ultraviolet ray 44 while being sprayed, so that the ultraviolet ray 44 is absorbed by water molecules in the gas. There is nothing. Therefore, the energy of the irradiated ultraviolet ray 44 is utilized for the reaction in which hydroxyl groups and oxygen are bonded to the substrates 7 and 8. As a result, the surfaces of the substrates 7 and 8 can be modified even with ultraviolet light having a weak light intensity.

  (2) According to this embodiment, the dry gas 43 is sprayed toward the substrates 7 and 8. At this time, since the humidified gas 42 flows along the surfaces of the substrates 7 and 8, moisture can adhere to the surfaces of the substrates 7 and 8.

  (3) According to this embodiment, the dry gas 43 is mainly composed of nitrogen gas or nitrogen gas. Since nitrogen gas does not pollute the atmosphere even if it is released to the atmosphere, it can be a surface modification method that is harmless to the natural environment.

  (4) According to this embodiment, the ultraviolet ray 44 is irradiated by relatively moving the light emitting device 14 of the ultraviolet ray 44 and the substrates 7 and 8. That is, when the dielectric barrier lamp 14a is cylindrical in the light emitting device 14, the ultraviolet ray is irradiated onto an area corresponding to the product of the length of the ultraviolet light emitting part and the length of the relative movement of the ultraviolet light emitting part and the workpiece. Can do. Therefore, the ultraviolet light emitting device 14 corresponding to the area covering the substrates 7 and 8 is not necessary, and a large area can be irradiated with a small number of ultraviolet light emitting units. That is, since a wide workpiece can be irradiated with a small number of ultraviolet light emitting portions, the power supplied to the ultraviolet light emitting portion can be reduced. As a result, an energy-saving surface modification method can be obtained.

  (5) According to the present embodiment, the light emitting device 14 uses a dielectric barrier discharge excimer lamp filled with xenon for forming an excimer or a discharge gas mainly containing xenon. Thereby, the light whose wavelength of the ultraviolet rays 44 is shorter than 180 nm can be irradiated. Therefore, the ultraviolet ray 44 has strong photon energy, and can break the molecular bond of the substance on the surfaces of the substrates 7 and 8 to activate the surface of the workpiece.

  (6) According to the present embodiment, the table 4 has the exhaust holes 11. The dry gas 43 sprayed by the second spraying device 9, 10, 15, 16 is exhausted from the exhaust hole 11. Since the substrates 7 and 8 are placed on the table 4, the dry gas 43 sprayed by the second spraying devices 9, 10, 15 and 16 passes through the substrates 7 and 8 and is exhausted. Accordingly, even when moisture is decomposed and ozone gas is formed at the locations of the substrates 7 and 8, the ozone gas is exhausted together with the dry gas 43 when the dry gas 43 passes through. Therefore, the surface modification apparatus 1 in which the substrates 7 and 8 are not excessively oxidized by the ozone gas can be obtained.

  (7) According to the present embodiment, the second spraying devices 15 and 16 are disposed between the first spraying devices 17 and 18 and the light emitting device 14. A humidified gas 42 is sprayed from the first spraying devices 17 and 18. The humidified gas 42 to be sprayed spreads around, but is affected by the flow of the dry gas 43 sprayed from the second spraying devices 15 and 16, so that the humidified gas 42 does not reach the light emitting device 14. . Accordingly, since the humidified gas 42 does not reach the light emitting device 14, the ultraviolet light 44 irradiated by the light emitting device 14 is hardly absorbed by the moisture contained in the humidified gas 42. As a result, the surfaces of the substrates 7 and 8 can be modified even with ultraviolet light having a weak light intensity.

  (8) According to the present embodiment, the humidified gas 42 is used by humidifying air. Even if air is released into the atmosphere, it does not pollute the atmosphere, and even if the humidified gas 42 humidified with air is released into the atmosphere, it does not pollute the atmosphere. Quality device 1.

  (9) According to the present embodiment, the light emitting device 14 includes a lamp house filled with an inert gas, and a lamp and a reflecting mirror are arranged in the lamp house. Therefore, the light emitting device 14 is not easily affected by the outside air, and can emit the ultraviolet light 44 having a stable output even if the component of the outside air changes.

(Second Embodiment)
Next, an embodiment of a surface modification apparatus embodying the present invention will be described with reference to the schematic perspective view of the surface modification apparatus of FIG.
This embodiment is different from the first embodiment in that the arrangement of the second spraying devices 9 and 10 shown in FIG. 1 is different.

  That is, in the present embodiment, as shown in FIG. 7, the surface modification device 50 includes the second blowing devices 15 and 16 provided around the light emitting device 14 and the second blowing devices on both sides in the X direction in the drawing. Attachment devices 51 and 52 are provided. That is, the second spraying devices 15, 16, 51, 52 are arranged so as to surround the light emitting device 14. On the other hand, the second spraying devices 9 and 10 shown in FIG.

As described above, according to the present embodiment, in addition to the effects (1) to (9) of the first embodiment, the following effects are obtained.
(1) According to the present embodiment, since the second spraying devices 9 and 10 shown in FIG. 1 in the first embodiment are eliminated, piping for supplying gas to the second spraying devices 9 and 10 Is no longer necessary. Since the table 4 moves, the pipes arranged on the table 4 are required to be flexible and easily become painful. On the other hand, since the light-emitting device 14 is fixed, the pipes arranged in the light-emitting device 14 are fixed and are not easily painful. Accordingly, the surface modification device 50 having a long life of the pipe can be obtained.

(Third embodiment)
Next, an embodiment of a surface modification apparatus embodying the present invention will be described with reference to the schematic perspective view of the surface modification apparatus of FIG.
This embodiment is different from the first embodiment in that the table 4 shown in FIG. 1 is fixed and the light emitting device 14 is movable.

  That is, in this embodiment, as shown in FIG. 8, the surface modification device 60 includes the base 2, and the table 61 is fixed and disposed on the upper surface 2 a of the base 2. On both sides of the table 61 in the X direction, second spraying devices 9 and 10 are arranged. Substrates 7 and 8 are disposed on the upper surface 61 a of the table 61. Further, an exhaust hole 11 is formed in the upper surface 61a of the table 61, and the gas blown from the second spraying devices 9 and 10 is exhausted from the exhaust hole 11 through the upper surfaces of the substrates 7 and 8. It has become.

  On the upper surface 2a of the base 2, guide rails 3a and 3b extending at the full width in the Y direction are formed at both ends in the X direction. Moving tables 62a and 62b are arranged on the guide rails 3a and 3b, and the moving tables 62a and 62b are movable along the guide rails 3a and 3b. Further, the moving tables 62a and 62b are provided with a linear motion mechanism (not shown), and are moved forward or backward along the Y-axis direction at a predetermined speed.

  On the moving tables 62a and 62b, a pair of support bases 12a and 12b are erected, and a support member 13 extending in the X direction is installed on the pair of support bases 12a and 12b. A light emitting device 14 is disposed on the base 2 side of the support member 13.

  Second spraying devices 15 and 16 are disposed on both sides in the Y direction of the light emitting device 14. The second spraying devices 15 and 16 have blowout ports 15a and 16a formed toward the base 2, and blow dry gas from the blowout ports 15a and 16a to the base 2. When the moving tables 62a and 62b move and the table 61 is located at a location facing the light emitting device 14, the dry gas blown from the blowout ports 15a and 16a is exhausted through the exhaust hole 11. ing.

  The first spraying devices 17 and 18 are arranged on both sides of the second spraying devices 15 and 16 in the Y direction so as to sandwich the second spraying devices 15 and 16. The first spraying devices 17 and 18 have blowout ports 17a and 18a formed toward the substrates 7 and 8 on the table 61 so that the humidified gas is blown from the blowout ports 17a and 18a to the substrates 7 and 8. It has become.

As described above, according to the present embodiment, in addition to the effects (1) to (9) of the first embodiment, the following effects are obtained.
(1) According to this embodiment, the table 61 on which the substrates 7 and 8 are placed is fixed, and the light emitting device 14 is moved. When the weight of the substrates 7 and 8 is large, a large amount of energy is required to move the table 61. However, in this embodiment, since the light emitting device 14 is moved, the weight of the substrates 7 and 8 is large. When it is larger, the surface modification can be performed with less energy compared to the method of moving the table 61. Therefore, the energy-saving surface modification device 60 can be obtained.

  In addition, this invention is not limited to embodiment mentioned above, A various change and improvement can also be added. A modification will be described below.

(Modification 1)
In the first embodiment, the light-emitting device 14 employs a dielectric barrier lamp enclosing xenon gas and irradiates ultraviolet light having a wavelength of 172 nm, but uses a dielectric barrier lamp enclosing krypton gas and argon gas. Also good. Similar effects can be obtained.

(Modification 2)
In the first embodiment, the program 38 in accordance with the operation procedure is stored in the memory 31 of the control device 23, and the surface modification device 1 is controlled by the program 38. However, the present invention is not limited to this. You may control by the control apparatus comprised by these. Peripheral devices may be controlled according to the procedure.

(Modification 3)
In the first embodiment, the humidified gas 42 is used by humidifying air, but may be used by humidifying an inert gas. It is only necessary to transport water molecules and adhere to the substrates 7 and 8.

(Modification 4)
In the first embodiment, in the surface modification apparatus 1, the first spraying process of attaching moisture to the substrates 7 and 8 and the irradiation process of irradiating the substrates 7 and 8 with the ultraviolet ray 44 are performed. You may carry out with the apparatus of. A device for spraying humidified air and a device for irradiating ultraviolet rays 44 are prepared. A first spraying process for attaching moisture to the substrates 7 and 8 is performed using a device that sprays humidified air. Subsequently, the ultraviolet ray 44 is irradiated before the substrates 7 and 8 are dried using an apparatus that irradiates the ultraviolet ray 44. The same effect as in the first embodiment can be obtained.

(Modification 5)
In the first embodiment, the dry gas sprayed by the second spraying device 9, 10, 15, 16 is preferably a gas that is not activated by ultraviolet rays, and employs nitrogen gas, but employs other gas. Also good. For example, argon gas or helium gas may be used.

(Modification 6)
In the first embodiment, the ultraviolet ray 44 is irradiated while moving the table 4. The light emitting device 14 may be sized so that the substrates 7 and 8 can be irradiated with ultraviolet rays once. After the humidified gas 42 is sprayed on the substrates 7 and 8, the substrates 7 and 8 may be moved to a location facing the light emitting device 14, and the ultraviolet light 44 may be irradiated while the dry gas 43 is sprayed. Since the time required for irradiation with the ultraviolet ray 44 can be shortened, surface modification can be performed with high productivity.

The schematic perspective view which shows the structure of the shape measuring apparatus which concerns on 1st Embodiment. The electric control block diagram of a surface modification apparatus. The flowchart of the surface modification method. The figure explaining the surface modification method. The figure explaining the surface modification method. The figure explaining the surface modification method. The model perspective view which shows the structure of the shape measuring apparatus which concerns on 2nd Embodiment. The model perspective view which shows the structure of the shape measuring apparatus which concerns on 3rd Embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1,50,60 ... Surface modification apparatus, 4 ... Table as movement table, 7,8 ... Substrate as workpiece, 9a, 10a ... Outlet, 9, 10, 15, 16, 51, 52 ... No. 2 spraying devices, 11 ... exhaust hole, 14 ... light emitting device, 14b ... reflector, 14c ... inert gas as a lamp, 14d ... surface, 14h ... lamp house, 17, 18 ... first spraying device, 21 ... Drying device, 21a ... second gas, 22 ... humidifying device, 22a ... first gas, 42 ... humidified gas, 43 ... drying gas, 44 ... ultraviolet light, 62a, 62b ... moving table.

Claims (13)

A surface modification method for modifying the surface by irradiating the surface of a workpiece with ultraviolet rays,
A first spraying step of spraying a humidified gas that is humidified on the workpiece;
A second spraying step of spraying a dry gas to the workpiece;
An irradiation step of irradiating the surface of the workpiece with ultraviolet light emitted by a light emitting device;
A surface modification method comprising performing the second spraying step and the irradiation step simultaneously. The surface modification method according to claim 1,
In the first spraying step, when the humidified gas is sprayed, the gas is sprayed toward the workpiece. The surface modification method according to claim 1 or 2,
In the second spraying step, the dry gas contains nitrogen gas or nitrogen gas as a main component. A surface modification method according to any one of claims 1 to 3,
In the irradiation step, the light emitting device and the workpiece are relatively moved, and the workpiece is irradiated with ultraviolet rays. A surface modification method according to any one of claims 1 to 4,
The light emitting device emits the ultraviolet light by discharging a dielectric barrier discharge excimer lamp filled with xenon forming excimer or a discharge gas mainly composed of xenon. A surface modification device for modifying the surface by irradiating the surface of the workpiece with ultraviolet rays,
A humidifier that humidifies the first gas to generate a humidified gas;
A drying device for drying the second gas to generate a dry gas;
A first spraying device for spraying the humidified gas onto the workpiece;
A light emitting device that emits the ultraviolet light;
A second spraying device for spraying the dry gas between the workpiece and the light emitting device;
The ultraviolet light is emitted from the light emitting device while spraying the dry gas from the second spraying device onto the workpiece to which the humidified gas is sprayed by the first spraying device. Surface modification equipment. The surface modification apparatus according to claim 6,
The first spraying device sprays the gas toward the workpiece when spraying the humidified gas. The surface modification apparatus according to claim 6 or 7,
The second gas is nitrogen gas or a surface reforming apparatus having nitrogen gas as a main component. It is the surface modification device according to any one of claims 6 to 8,
A surface modification device comprising a moving table, wherein the moving table irradiates the workpiece with ultraviolet rays by relatively moving the light emitting device and the workpiece. The surface modification apparatus according to claim 9,
The moving table has an exhaust hole,
The workpiece is placed between the second spraying device and the exhaust hole in the moving table, and the dry gas blown by the second spraying device passes through the workpiece. The surface reforming apparatus is characterized in that it is exhausted from the exhaust hole. The surface modification apparatus according to claim 10,
The second spraying device is disposed between the first spraying device and the light emitting device;
The second spraying device sprays the dry gas so that the humidified gas does not flow into a place where the light emitting device emits ultraviolet rays. It is a surface modification device according to any one of claims 6 to 11,
The surface reforming apparatus according to claim 1, wherein the first gas is air or a gas containing air as a main component. The surface modification apparatus according to any one of claims 6 to 12,
The light emitting device includes a lamp and a reflecting mirror, and is disposed in a lamp house filled with an inert gas.

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