JP4812801B2 - Functional film manufacturing method and functional film manufacturing apparatus - Google Patents

Description

The present invention relates to a manufacturing method and manufacturing equipment of the functional film to be produced by applying the functional film is a thin film having a function such as a light emitting layer in the display device.

  As seen in Patent Document 1 and the like, in recent years, a method of manufacturing a functional film of an electronic device using a coating technique such as inkjet or die coating has attracted attention. The manufacturing method using the coating technique has an advantage that the equipment configuration is simple and can be enlarged as compared with the vapor deposition technique. For example, with respect to electronic devices for display, market demand for large screens is increasing, and accordingly, expectations for manufacturing technology of electronic devices by coating are increasing.

In response to this, Patent Documents 1 to 3 disclose film manufacturing techniques using ink jet, die coating, or roll printing.
In these production methods, when a line-shaped functional film is formed, coating by die coating is particularly advantageous. In other words, in the case of using the ink jet method, the mechanism and control mechanism of the nozzle for ejecting ink become complicated. As a result, the cost of the manufacturing equipment becomes high, and the reliability of the equipment is low. There are disadvantages that are required. In addition, there is a disadvantage that ink with high viscosity cannot be applied by inkjet.

  The ink is a solution dissolved in a solvent so that a functional film component (functional film material) can be applied. The applied ink becomes a functional film by drying. To shorten the drying time in order to improve productivity, it is necessary to increase the viscosity of the ink. However, the ink jet method has a limit of ejection force and cannot eject high viscosity ink. In addition, the roll printing method has a problem that the plate material contaminates the functional film or the durability of the plate material is not sufficient.

  On the other hand, when the die coat is used, the manufacturing equipment cost is relatively low and the maintenance is relatively easy, and there is an advantage that high viscosity ink can be applied without any trouble. Further, when the die coat is used, there is no problem that the plate material contaminates the functional film as in the roll printing method or the durability of the plate material is not sufficient.

Below, the manufacturing apparatus and manufacturing method of the conventional functional film apply | coated using die coating are demonstrated.
6A to 6C show the configuration of a conventional die coating apparatus. The die coating apparatus includes, as its constituent elements, a substrate transport stage 2 that transports a substrate 1 as a coating object, a nozzle head 6 that actually ejects and applies ink, a fixed plate 7, a nozzle head mounting column 8, an ink delivery pipe. 3, an ink tank 4, an ink pump 5, a nozzle head lifting mechanism (not shown), a control unit (not shown), and the like. In FIGS. 6A to 6C, arrow A is the transport direction of the substrate 1 (moving direction of the substrate transport stage 2), and I is the ink applied on the substrate 1.

Next, the operation of each component will be described.
The ink tank 4 stores ink in which a functional film material is dissolved in a solvent. Ink is sent from the ink tank 4 to the nozzle head 6 through the ink delivery pipe 3 by the ink pump 5. As shown in FIGS. 7A and 7B, the nozzle head 6 includes an ink introduction port 13 to which the ink delivery pipe 3 is connected to a nozzle head part 18 as a nozzle head member, and each of the introduced inks. A manifold portion 12 that distributes to the nozzle holes 11 and a plurality of nozzle holes 11 are formed. A plurality of nozzle holes 11 are opened in the nozzle head 6, and ink is ejected from the nozzle hole openings 11 a by the pressure applied by the ink pump 5.

  The substrate 1 and the nozzle hole opening 11a of the nozzle head 6 are adjusted to a position having a gap of 20 to 100 μm by the nozzle lifting mechanism, and the ink ejected from the nozzle hole opening 11a is shown in FIGS. It is applied to the substrate 1 transported by the movement of the substrate transport stage 2 shown in b). As a result, a line pattern is formed on the substrate 1 with ink. The applied ink I is dried in the application process and the next process to form a functional film pattern.

With the recent miniaturization and high definition of electronic devices, the pattern of the functional film is fine. Taking the light emitting layer of an organic EL device as an example of an electronic device as an example, the line width is 30 to 150 μm and the thickness is 30 to 300 nm. When this functional film is formed, the discharge amount from one of the nozzle holes is as small as 1 to 1000 nl / s. In addition, with the recent increase in size of electronic devices, this small amount of discharge must be applied to a large-area substrate 1 without variation.
Japanese Patent No. 3982502 Japanese Patent No. 3728109 JP 2003-093944 A

However, conventionally, it has been difficult to apply a large area substrate without variation by die coating.
As a method for solving this problem, for example, as seen in Patent Document 2, a method of controlling the discharge amount in a nozzle using a piezo element has been proposed, but it is used for forming an organic EL light emitting layer. In the case of ink whose viscosity changes due to the heat of the piezo element, such as ink, the discharge amount varies. A method of adjusting the flow rate by providing a pump and an ink delivery pipe for each nozzle hole is also conceivable. However, since the number of nozzle holes is 1000 to 10,000, it is necessary to ensure the reliability of manufacturing equipment in a good state. Is difficult. In addition, there is a problem that the length of ink delivery piping in each delivery line becomes long, and the amount of discarded ink becomes large during maintenance. Ink such as a light emitting layer in an organic EL device is very expensive, and it is necessary to minimize the amount of ink discarded in order to reduce the cost of the product.

  The present invention has been made in view of the problems of the above-described conventional example, and reduces the influence of nozzle-to-nozzle variation in a minute amount of coating, and can stabilize a fine pattern without variation even on an application target such as a large-area substrate. It is an object of the present invention to provide a functional film manufacturing method and a functional film manufacturing apparatus that can be applied in this manner.

In order to solve the above-mentioned problems, the method for producing a functional film of the present invention is such that a solution in which a functional film material is dissolved is discharged from a plurality of nozzle holes communicating with the manifold part to an application object via the manifold part. a step of applying a method of manufacturing a functional film and a step of drying the solution applied to the object to be coated, said manifold portion and the nozzle holes disposed partition wall having elasticity, one of the partition wall plane, so as to face the manifold portion and the nozzle hole is disposed, so as to face the opposition side surface of the partition wall, and disposed between the tip opening of the nozzle hole and the manifold portion By applying a fluid into the pressure chamber and applying pressure to cause elastic deformation, the liquid is applied while adjusting the discharge amount from the nozzle hole.

In the method for producing a functional membrane of the present invention, the fluid introduced into the pressure chamber is an inert gas.
In addition, the functional film manufacturing method of the present invention is characterized in that the inert gas is N ₂ .

  Further, the method for producing a functional film of the present invention measures a coating amount of a solution applied to a dummy coating object, a coating amount observation region of the coating object, or a coating object, and depends on the measured coating amount. And adjusting the pressure in the pressure chamber.

Also, apparatus for producing a functional film of the present invention is used, the number and the manifold section, a plurality of nozzle holes communicating with the manifold portion, and the ink introduction port for introducing ink to the manifold portion, in the nozzle head constituted In addition, an elastic partition wall is disposed in the manifold portion and each nozzle hole, the partition wall is provided with one surface facing the manifold portion and the nozzle hole, and a pressure chamber on the other surface. arranged for each of a plurality of nozzle holes, and characterized by Rukoto, disposed between the distal end opening of the manifold and the nozzle hole.

  According to the functional film manufacturing method and the functional film manufacturing apparatus of the present invention, since the minute discharge amount from each nozzle hole can be controlled by the deformation of the partition wall provided facing the nozzle hole, the functional film can be formed over a large area without variation. Can be formed.

  At that time, by using the pressure by the fluid, that is, gas or liquid, as the control method of the partition wall, the viscosity change of the solution in which the functional film is dissolved is generated unlike the case of using the control means with heat generation such as a piezo element. There is no.

  Further, it is not necessary to provide a mechanism for adjusting the ink flow rate in each nozzle hole, and it is not necessary to lengthen the piping dimensions, so that the amount of expensive ink discarded during maintenance can be reduced.

  In addition, since it is not necessary to use complicated mechanisms and controls as in the case of inkjet, the reliability of equipment is high, and an electronic device can be manufactured at low cost.

  As described above, according to the present invention, since a minute discharge amount from each nozzle hole can be precisely controlled by deformation of the partition wall provided facing the nozzle hole, a functional film can be formed in a large area without variation. .

  At that time, by using the pressure by the fluid (gas or liquid) as the control method of the partition wall, unlike the case of using the control means accompanied by heat generation such as a piezo element, the viscosity change of the solution in which the functional film is dissolved occurs. The amount of minute discharge can be accurately controlled.

  In addition, with the miniaturization, thinning, and high functionality of electronic devices in the future, it is necessary to take measures against contamination as described above, and surface treatment of coating apparatuses becomes important. Since the functional film can be formed in a large area, the conventional problem that the subtle variation in the surface treatment state becomes the variation in the minute amount application can be solved.

  Further, it is not necessary to provide a mechanism for adjusting the ink flow rate in each nozzle hole, and it is not necessary to lengthen the pipe dimensions, so that the amount of expensive ink discarded during maintenance can be reduced. Moreover, since it is not necessary to use complicated mechanisms and controls as in the case of inkjet, the equipment has high reliability, and electronic devices such as organic EL devices can be manufactured at low cost.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(Embodiment 1)
1A to 1C show the configuration of a nozzle head as a functional film manufacturing apparatus according to Embodiment 1 of the present invention. In addition, the same code | symbol is attached | subjected to the component which has a function similar to the nozzle head 6 of the conventional die coating apparatus. FIG. 1A is a simplified front cross-sectional view of a nozzle head according to an embodiment of the present invention, and FIG. 1B is a cut at a location where a pressure chamber is provided (AA ′ line in FIG. 1). FIG. 1C is a side sectional view of the nozzle head 10 cut at a location where a partition wall is provided (a line BB ′ in FIG. 1).

  As shown in FIGS. 1A to 1C, the nozzle head 10 according to the embodiment of the present invention is introduced from a nozzle hole (nozzle hole channel) 11 for ejecting ink and an ink introduction port 13. In addition, a manifold portion 12 for collecting and distributing the ink to each nozzle hole 11 is provided, and in addition, a partition wall 15, a pressure chamber 16, and a pressure introduction port 17 are provided. The partition wall 15 is provided in common for each nozzle hole 11 (the partition wall 15 may be provided individually for each nozzle hole 11), but the pressure chamber 16 and the pressure introduction port 17 are provided. Are individually installed for each nozzle hole 11. In this embodiment, the partition wall 15 is disposed so that one surface thereof faces the manifold portion 12 and the nozzle hole 11 (specifically, with respect to the nozzle hole 11 so as to follow the ink flow direction in the nozzle hole 11). The other surface of the partition wall 15 (the surface opposite to the surface facing the manifold portion 12 and the nozzle hole 11) faces the pressure chamber 16. Further, the pressure chamber 16 is provided at a location corresponding to the nozzle hole 11 via the partition wall 15.

  Here, the cross-sectional dimension of the nozzle hole 11 is □ (rectangular and one side dimension) is 10 to 100 μm, the distance from the tip opening portion 11a of the nozzle hole 11 to the manifold portion 12 is 50 to 200 μm, and the pitch of the nozzle holes Is 300-600 μm. The number of nozzle holes 11 is actually about 1000 to 10000, but is simplified in FIG. 1B so as to be easy to understand, and shows the case of eight.

  In order to realize a high-definition electronic device, the nozzle hole 11 is formed on the nozzle head part 18 as a nozzle head part as a raw material part with high accuracy using grinding, electric discharge machining, laser machining, plasma machining, or the like. . The material of the nozzle head part 18 is selected from materials that are resistant to the solvent used in the ink, such as stainless steel and glass. The nozzle head part 18 is made of a material that does not cause contamination of the electronic device.

A surface treatment may be applied to the surface of the nozzle head part 18 in order to give resistance to a solvent or to prevent generation of contamination. Moreover, the material used for an electronic device is good for the material of surface treatment. For example, when the electronic device is an organic EL device, it may be formed by coating SiO ₂ or the like using CVD or PVD. As electronic devices become finer, thinner, and more functional in the future, it is necessary to take measures against contamination as described above, and surface treatment for coating apparatuses becomes important. At this time, since the fine variation in the surface treatment state becomes the variation in the minute amount application, it is important to reduce the variation by the nozzle head 10 according to the embodiment of the present invention.

  In the nozzle head 10, the partition wall 15 is arranged along the surface of the nozzle head part 18 that faces the manifold portion 12 and the nozzle hole 11. The material of the partition 15 is selected from materials such as stainless steel and polytetrafluoroethylene (PTFE) that have elasticity of Young's modulus of 0.3 to 300 GPa and resistance to ink solvent, and do not cause contamination to electronic devices. The The partition wall 15 may be subjected to the same surface treatment as the nozzle head part 18. In the present embodiment, the partition wall 15 has a thin plate shape and a thickness of 50 to 500 μm.

  As described above, the pressure chamber 16 is provided in a portion corresponding to the flow path of the nozzle hole 11 in the partition wall 15. The size of the pressure chamber 16 is about 150 × 200 × 200 μm. The pressure chamber 16 is for controlling the cross-sectional area of the nozzle hole 11 by applying pressure to the partition wall 15 and deforming the partition wall 15. Since no special high-precision machining is required at the time of creation, the pressure chamber 16 can be manufactured at low cost. . The pressure chamber 16 is filled with a fluid, that is, a liquid or a gas, and a liquid or a gas is introduced from the pressure introduction port 17 to apply pressure. Reference numeral 19 denotes a pressure chamber forming member in which the pressure chamber 16 and the pressure introduction port 17 are formed.

  FIG. 2 shows a system for applying pressure to the pressure chamber 16. As shown in FIG. 2, the pressure introduction port 17 provided corresponding to each nozzle hole 11 is connected to a valve 20 whose opening and closing is controlled by a control device (not shown). The flow path opened and closed by each valve 20 is connected to a pressure application pump 21 that applies pressure to the pressure chamber 16. A regulator 22 for adjusting the pressure is installed between the pressure application pump 21 and the valve 20. These valves 20, the pressure application pump 21, the regulator 22 and the like constitute a pressure adjusting means.

  3A to 3C show a die coating apparatus according to an embodiment of the present invention, and the same components as those in the conventional die coating apparatus are denoted by the same reference numerals. Note that this die coating apparatus also includes a nozzle head lifting mechanism and a control device (not shown).

  The die coating apparatus according to the embodiment of the present invention is applied as a coating amount measuring means for measuring the amount of trial coating applied to the dummy substrate 1 ′ or the dummy area (a coating amount measuring dummy region) of the substrate 1 before coating. The point from which the quantity measuring device 30 is installed differs from the conventional die coating apparatus.

Hereafter, the manufacturing method of the functional film of this invention which uses the said die coat apparatus is demonstrated.
First, the operation until ink is ejected from the nozzle head 10 will be described with reference to FIG. 3C and FIG. The ink tank 4 stores ink in which a functional film material is dissolved in a solvent. Ink is sent from the ink tank 4 to the nozzle head 10 by the ink pump 5 through the ink delivery pipe 3. In the nozzle head 10, ink is introduced into the manifold portion 12 from the ink introduction port 13 to which the ink delivery pipe 3 is connected, and is distributed to each nozzle hole 11 by the manifold portion 12. The distributed ink is ejected by the pressure applied by the ink pump 5.

Next, an operation for coating without variation by the method for producing a functional film of the present invention will be described.
First, ink is applied onto the dummy substrate 1 ′ while the dummy substrate 1 ′ is being transferred by the substrate transfer stage 2. The application amount of the trial-applied ink is measured by the application amount measuring device 30, and the discharge amount from each nozzle hole 11 is calculated. The measurement of the coating amount by the coating amount measuring device 30 and the calculation of the discharge amount (coating amount) are performed, for example, by measuring the sectional shape of the coating film with a confocal laser displacement meter and multiplying the sectional area by the stage speed. The

Next, based on the measurement result of the application amount, for the nozzle hole 11 whose discharge amount is larger than the target amount, the valve 20 is opened and control is performed to increase the pressure in the gas or liquid in the pressure chamber 16. Control by part etc. Further, when the ejection amount does not reach the target amount, the pressure in the pressure chamber 16 is lowered below the pressure applied to the ink by the ink pump 5, thereby lowering the ejection resistance of the ink flow path and supplementing the necessary ink amount. . Here, the pressure is generated by the pressure application pump 21, and the pressure value is controlled manually or electronically by the regulator 22. The liquid or gas to which pressure is applied is preferably a material that does not damage the ink. If a gas inert gas and N ₂ is desirable for the ink to be used in an organic EL since N ₂ can be used, a low N ₂ cost is desirable.

  If the target application amount has not yet been adjusted, the application operation to the dummy substrate 1 'is performed again, and the application amount at this time is measured and applied to the pressure chamber 16 until the target application amount is reached. Adjust the pressure level. In addition, after applying a pressure to the pressure chamber 16, the valve | bulb 20 is closed and the pressure state is maintained. This step is repeated for each nozzle hole 11, and after confirming that the coating amount from each nozzle hole 11 has reached the target coating amount, coating is performed on the substrate 1 of the product. By adopting such a method, a high-definition pattern can be formed on the large-area substrate 1 without variation.

  In the case of using the conventional method, the processing accuracy of the nozzle hole 11 varies, the surface condition of the nozzle hole 11 varies, the variation due to the water repellent treatment near the opening 11 a of the nozzle hole 11, the surface height of the substrate 1. The variation in the discharge amount (application amount) was about ± 10 to 20% due to the variation in the surface area and the variation in the surface state of the substrate 1. On the other hand, according to the method of the present invention, the variation in the discharge amount (application amount) caused by the nozzle holes 11 can be reduced to ± 5 to 10%.

  In the above embodiment, the discharge amount from each nozzle hole 11 is obtained using the dummy substrate 1 ′. However, the present invention is not limited to this, and a dummy region for application amount measurement provided on the substrate 1 as a product. You may calculate from the application quantity of the ink apply | coated to. In this way, if the discharge amount is adjusted by using the dummy area on the substrate 1 as a product, the time for transporting the dummy substrate can be saved and the operating rate of the die coater can be increased. Alternatively, the amount applied to the substrate 1 as a product may be measured to adjust the pressure applied to each nozzle hole 11 before the next substrate 1 is applied. Stable production can be realized by suppressing the change in the discharge amount generated in the process.

  In the above embodiment, the case where one pressure chamber 16 is provided for each nozzle hole 11 is described. However, the present invention is not limited to this, and a plurality of pressure chambers 16 are provided for each nozzle hole 11. The chamber 16 may be provided, and the pressure may be controlled independently for each pressure chamber 16. According to this method, the manufacturing cost of the nozzle head 10 increases, but more precise control can be performed.

  In the above embodiment, one pressure chamber 16 is provided for one nozzle hole 11, but one pressure chamber 16 may be provided for a plurality of nozzles 11. Further, when the uniformity required for the electronic device is not so severe, the nozzle may be divided into several parts and controlled partially according to the nozzle characteristics such as the central part and the edge part. In this case, since the pipes and valves can be shared by the plurality of nozzle holes 11, the cost of the nozzle head 10 can be suppressed.

  In the above embodiment, the nozzle head part 18 and the partition wall 15 are formed separately, but may be integrated. For example, it is good also as the partition 15 by advancing grinding from the one side of the nozzle head part 18 which opened the nozzle hole 11, and making the part which faces a part of nozzle hole 11 thin.

In the case where the partition wall 15 is formed separately, disassembly and cleaning can be performed when dust enters the nozzle hole 11, the surface treatment of the nozzle hole 11 is easy, and the manufacturing cost of the nozzle head 10 can be suppressed. There are advantages. On the other hand, when the partition wall 15 is formed as an integrated type, there is an advantage in that contamination from the gas or liquid filling the pressure chamber 16 to the ink can be prevented.
(Embodiment 2)
A second embodiment of the present invention will be described with reference to FIG. Here, FIG. 4A shows a cross-sectional view corresponding to an intermediate portion of the nozzle hole 11 of the nozzle head 10 in the first embodiment. However, unlike the case shown in FIG. 1, the case where there are four nozzle holes 11 is expressed. As described above, in the first embodiment, the nozzle holes 11 and the pressure chambers 16 are provided at predetermined intervals so as to correspond to one partition wall 15.

FIG. 4B is a cross-sectional view at an intermediate portion of the nozzle hole 11 in the nozzle head 10 of the second embodiment.
In the first embodiment, the nozzle holes 11 are arranged in one row, but in the second embodiment, two partition walls 15 are provided so that the nozzle holes 11 are alternately arranged in a plurality of rows in plan view. They are arranged in a so-called zigzag pattern.

With this arrangement, even when the pitch of the nozzle holes 11 is reduced, a piping space connected to the pressure chamber 16 can be secured without any trouble. Here, as another method corresponding to a small nozzle pitch, a plurality of nozzle heads are used to form a coating line from the nozzle holes of the second nozzle head between the coating lines from the nozzle holes of the first nozzle head. As described above, there is a method of arranging the nozzle head. However, as the number of nozzle heads increases, the equipment cost increases and the reliability decreases. Therefore, such a method is not preferable, and a plurality of nozzles are arranged in one nozzle head 10 as in the embodiment of the present invention. It is desirable to provide the holes 11.
(Embodiment 3)
A third embodiment of the present invention will be described with reference to FIGS.

  In the first and second embodiments, the partition wall 15 has a plate shape. On the other hand, as shown in FIG. 5A, in the nozzle head according to the third embodiment, the partition wall 15 has a shape along the shape of the nozzle hole 11.

The partition wall 15 is manufactured as follows.
As shown in FIG. 5B, first, the nozzle head part 18 is coated with polytetrafluoroethylene (PTFE) 15 ′ as a material for the partition wall 15. In the coating process, a coating means such as coating or CVD is selected according to the size of the nozzle hole 11 and the thickness of the partition wall 15. Next, as shown in FIG. 5C, the coated PTFE (partition wall material) 15 ′ is peeled from the nozzle head part 18.

  Next, as shown in FIG. 5D, the nozzle hole side portion of PTFE (partition wall material) 15 ′ peeled off from the nozzle head part 18 is etched. For the etching, means according to the required accuracy such as wet etching or dry etching is selected.

In this way, the partition wall 15 matching the shape of the nozzle hole 11 can be created.
When the partition wall 15 is used, the partition wall 15 has a shape corresponding to the nozzle hole 11, so that the discharge amount can be controlled with high accuracy by deformation of the partition wall 15 due to pressure.

  In the manufacture of electronic devices by coating, it is necessary to optimize the shape of the nozzle holes 11 according to the structure of the device, particularly the shape of the water repellent bank that assists the ink patterning. If the method of the present embodiment is used, a minute amount can be applied in various shapes of the nozzle holes 11 without variation.

  The embodiment of the present invention is suitable for forming a functional film on an electronic device, and particularly in an organic EL device in which a light emitting layer is sandwiched between a cathode and an anode, at least one between the cathode and the anode. When manufacturing two layers (such as the light-emitting layer and a part of the light-emitting layer), it is preferable to use the method for manufacturing a functional film according to the above-described embodiment. It is possible to provide an organic EL device as an electronic device that has no characteristic variation, is high definition, and is inexpensive.

  The method and apparatus for producing a functional film of the present invention can be suitably applied to the production of electronic devices such as organic EL display panels.

(A) is simplified front sectional drawing of the nozzle head which concerns on Embodiment 1 of this invention, (b) is cut | disconnected by the location (AA 'line in Fig.1 (a)) where the pressure chamber is provided. Side surface sectional drawing of the nozzle head which performed, (c) is side surface sectional drawing of the nozzle head 10 cut | disconnected by the location (BB 'line in Fig.1 (a)) in which the partition was provided. The figure which showed the system which applies a pressure to the pressure chamber of the nozzle head which concerns on Embodiment 1 of this invention. 1 shows a die coating apparatus according to an embodiment of the present invention, wherein (a) is a plan view of the die coating apparatus in a state before coating, (b) is a plan view of the die coating apparatus in a state after coating, and (c) is a die coating apparatus. Front view (A) is plane sectional drawing of the nozzle head of the die coating apparatus which concerns on Embodiment 1 of this invention, (b) is plane sectional drawing of the nozzle head of the die coating apparatus which concerns on Embodiment 2 of this invention. (A) is a plane sectional view of the partition wall of the nozzle head according to the third embodiment of the present invention and the vicinity thereof, and (b) to (d) are each a method for manufacturing a nozzle head according to the third embodiment of the present invention. Sectional view showing the process A conventional die coating apparatus is shown, (a) is a plan view of the die coating apparatus in a state before application, (b) is a plan view of the die coating apparatus in a state after application, and (c) is a front view of the die coating apparatus. (A) is a simplified front sectional view of a conventional nozzle head, (b) is a side sectional view of a nozzle head cut at a location where nozzle holes are provided.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate 1 'Dummy board | substrate 2 Board | substrate conveyance stage 3 Ink delivery piping 4 Ink tank 5 Ink pump 10 Nozzle head 11 Nozzle hole 15 Partition 16 Pressure chamber 21 Pressure application pump 22 Regulator

Claims (5)

A step of applying a solution in which a functional film material is dissolved by discharging the solution to a coating object from a plurality of nozzle holes communicating with the manifold portion through the manifold portion ;
A method for producing a functional film comprising a step of drying a solution applied to a coating object,
Wherein placing the partition wall having elasticity for the manifold portion and the nozzle holes, one surface of the partition wall, so as to face the manifold portion and the nozzle hole is disposed, extraordinary in opposition side surface of the partition wall In addition, a fluid is introduced into a pressure chamber disposed between the manifold portion and the tip opening of the nozzle hole, and pressure is applied to cause elastic deformation, thereby adjusting the discharge amount from the nozzle hole. A method for producing a functional film, characterized in that the coating is performed while applying.   The method for producing a functional film according to claim 1, wherein the fluid introduced into the pressure chamber is an inert gas. The method for producing a functional film according to claim ₂ , wherein the inert gas is N ₂ .   It is characterized by measuring the application amount of the solution applied to the dummy application object, the application amount observation area of the application object, or the application object, and adjusting the pressure in the pressure chamber according to the measured application amount. The method for producing a functional film according to any one of claims 1 to 3. A nozzle head including a manifold portion, a plurality of nozzle holes communicating with the manifold portion, and an ink introduction port for introducing ink into the manifold portion;
The manifold part and each nozzle hole are provided with elastic partition walls, and one surface of the partition wall is provided facing the manifold part and the nozzle holes, and a pressure chamber is provided on the other surface. is provided for each nozzle hole, and Rukoto disposed between the distal end opening of said manifold portion the nozzle hole,
Functional film manufacturing apparatus characterized by

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