JP4824229B2 - Thermoelectric element and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a structure and manufacturing method of a thermoelectric element used for temperature difference power generation and cooling, and more particularly to a structure and manufacturing method of a connection electrode for connecting the thermoelectric element to an external circuit.
[0002]
[Prior art]
A thermocouple has a property that generates a voltage between electrodes by giving a temperature difference between both ends of the thermocouple, and conversely generates a temperature difference when an electric current is passed from the electrode. It is a thermoelectric element.
[0003]
For example, a thermoelectric element is applied to a power generation element as a method that can convert heat into electric energy, or is applied to a cooling element that cools an object with electric energy.
[0004]
By the way, because the thermoelectric element is simple in structure and operation, it is advantageous for downsizing compared to other thermal / electrical conversion systems. As a power generation element, it is applied to power generation inside portable electronic devices such as watches, Furthermore, as a cooling element, application to local cooling of a semiconductor integrated circuit (IC) or the like is spreading.
[0005]
The most common semiconductor material used for power generation or cooling as a thermoelectric element is a so-called BiTe alloy containing bismuth (Bi) and tellurium (Te) as main components.
Although this material has the best performance at around room temperature at present, it is frequently used in various places. However, a major drawback is that it is a weak material with weak mechanical strength.
[0006]
For this reason, some studies have been made to produce a small thermoelectric element. For example, Japanese Patent Application Laid-Open No. 63-20880 describes one production method.
In the manufacturing method described in this publication, p-type thermoelectric material and n-type thermoelectric material processed into a thin plate shape are alternately laminated while sandwiching a heat insulating material, and grooves are formed at regular intervals in a direction perpendicular to the lamination surface. , P-type rod-shaped element and n-type rod-shaped element.
[0007]
The p-type rod-shaped element and the n-type rod-shaped element are connected in series by electrode materials at both end faces. The electrode material can be formed by forming a metal film using a vacuum technique such as vapor deposition and patterning the metal film using a photolithography technique.
[0008]
[Problems to be solved by the invention]
By the way, the thermoelectric element, when it is used for power generation or as a cooling element, naturally cannot perform its function unless it is connected to an external circuit.
At the same time, it must also have good thermal contact with the external heat source and the object to be cooled at the hot and cold junctions of the thermocouple.
[0009]
Certainly, if the structure of the above publication is adopted, a small thermoelectric element structure can be realized even if a brittle thermoelectric semiconductor is used.
However, what is disclosed in the above publication is only up to wiring of thermoelectric semiconductors, and no specific means for connection to the outside and thermal contact are shown. For example, when an electrode portion forming a hot junction or a cold junction of the thermoelectric element is brought into contact with an object to be cooled, there arises a problem that the electrode itself is hidden and cannot be electrically contacted to the outside.
[0010]
As described above, in the conventional example, an effective method is not disclosed for external connection of a small thermoelectric element in which a heat insulating material is filled and the end face is wired with a metal film.
[0011]
In view of this, as a simple method of external contact, a method of connecting a lead wire to an electrode using solder, a method of connecting a gold wire or the like directly to an electrode by wire bonding, or the like can be considered.
However, if either method is used to pull out the lead wire directly from the wiring surface, it is difficult to make good thermal contact with the outside.
[0012]
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a thermoelectric element having a stable electrical connection while solving the above-mentioned problems and having good thermal contact with the outside, and a method for manufacturing the thermoelectric element.
[0013]
[Means for Solving the Problems]
In order to achieve the above object, the following means are employed in the structure and manufacturing method of the thermoelectric element of the present invention.
[0014]
The thermoelectric element of the present invention has a structure in which a plurality of n-type rod-shaped elements made of n-type thermoelectric semiconductors and a plurality of p-type rod-shaped elements made of p-type thermoelectric semiconductors are arranged and fixed via an insulating layer, A thermoelectric element block having a wiring surface in which both end faces of each of the p-type rod-shaped elements and the p-type rod-shaped elements are exposed, and the n-type rod-shaped element and the p-type rod-shaped element are provided on the wiring surface of the thermoelectric element block. A thermoelectric element having a wiring conductor to be connected, wherein at least a part of the n-type rod-shaped element or the p-type rod-shaped element on the outer peripheral portion of the thermoelectric element block is another n-type rod-shaped element or p-type rod-shaped element. A shorter connecting rod The connecting rod-shaped element has one end face connected to the wiring conductor and the other end face covered with a metal film as a lead-out end for external connection. It is characterized by that.
[0015]
The connecting rod-like element is located only on one side surface of the thermoelectric element block. Alternatively, the connecting rod-like element is located on two side surfaces of the thermoelectric element block. Ruko And features.
[0016]
Alternatively, the connecting rod-shaped element is characterized in that a plurality of rod-shaped elements are arranged in parallel. Alternatively, the plurality of n-type rod-shaped elements are plate-shaped n-type plate-shaped elements that are continuous from one side surface to the other side surface, and the plurality of p-type rod-shaped elements are plates that are continuous from one side surface to the other side surface. It is a p-type plate-shaped element.
[0017]
Furthermore, the structure of the thermoelectric element according to the present invention includes a plurality of n-type rod-like elements made of n-type thermoelectric semiconductors and a plurality of p-type rod-like elements made of p-type thermoelectric semiconductors arranged and fixed via an insulating layer, A thermoelectric element block having a wiring surface in which both end faces of the n-type rod-shaped element and each p-type rod-shaped element are exposed, and provided on each wiring surface of the thermoelectric element block, the n-type rod-shaped element and the p-type rod-shaped element are provided. A thermoelectric element having a wiring conductor to be connected, wherein at least a part of the n-type rod-shaped element or the p-type rod-shaped element on an outer peripheral portion of the thermoelectric element block is removed to expose the wiring conductor. , Lead end for external connection of exposed wiring conductor It is characterized by that.
[0018]
The thermoelectric element manufacturing method of the present invention forms a thermoelectric element block by fixing a plurality of n-type rod-shaped elements made of n-type thermoelectric semiconductors and a plurality of p-type rod-shaped elements made of p-type thermoelectric semiconductors via an insulating layer. A step of removing the upper and lower surfaces of the thermoelectric element block to form a wiring surface, and a step of forming a wiring conductor on the wiring surface to connect the n-type rod-shaped element and the p-type rod-shaped element. And forming at least a part of the n-type bar-shaped element or the p-type bar-shaped element on the outer periphery of the thermoelectric element block lower than the wiring surface to form a connecting bar-shaped element; And a step of forming an extraction end for external connection by coating a metal film on an end surface of the connecting rod-like element to which the wiring conductor is not connected It is characterized by having.
[0019]
Alternatively, the order of the step of forming the wiring conductor on the wiring surface and the step of forming the connecting rod-like element are reversed. Alternatively, after the step of forming the connecting rod-shaped element, a step of coating a metal film on an end surface of the connecting rod-shaped element to which the wiring conductor is not connected is performed. Alternatively, after the step of forming the wiring conductor on the wiring surface, a step of coating a metal film on the end surface of the connecting rod-like element to which the wiring conductor is not connected is performed. Or it is a plate-shaped n-type plate-shaped element in which the plurality of n-type rod-shaped elements are continuous, and is a plate-shaped p-type plate-shaped element in which the plurality of p-type rod-shaped elements are continuous.
[0021]
[Action]
The thermoelectric element of the present invention is provided with a connecting rod-like element lower than a plurality of arranged rod-like elements, and is electrically connected to the outside at a drawing end which is an end face of the connecting rod-like element.
Because of this, there is a step between the lead-out end and the wiring surface, so that the electrical connection with the external circuit is made well by the connecting rod-like element while maintaining the thermal contact with the outside on the wiring surface. Is possible.
[0022]
DETAILED DESCRIPTION OF THE INVENTION
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a thermoelectric element structure and manufacturing method according to the present invention will be described below with reference to the drawings.
[0023]
[First Example of Structure: FIGS. 1 and 2]
First, a first example of the structure of the thermoelectric element of the present invention will be described.
As shown in FIG. 1, the structure of the thermoelectric element of the present invention mainly comprises a thermoelectric element block 10 and a wiring conductor 20 disposed on the surface of the thermoelectric element block 10.
[0024]
The thermoelectric element block 10 is formed by regularly arranging an n-type rod-shaped element 11 processed into a column shape by processing an n-type thermoelectric semiconductor and a p-type rod-shaped element 12 processed into a column shape from a p-type thermoelectric semiconductor. The arrangement has a structure in which even-numbered rows of n-type rod-shaped elements 11 and even-numbered rows of p-type rod-shaped elements 12 are alternately repeated.
The reason why the even number of rod-shaped elements are arranged is that a connecting rod-shaped element described later can be formed on one side surface 50a.
[0025]
Insulating in order to insulate the n-type rod-shaped element 11 and the p-type rod-shaped element 12, or between the n-type rod-shaped elements 11 or between the p-type rod-shaped elements 12 and to fix the n-type rod-shaped element 11 and the p-type rod-shaped element 12 An insulating layer 30 made of resin is provided.
[0026]
Although only one side is visible in FIG. 1, the thermoelectric element block 10 has two wiring surfaces 40a and 40b facing each other, and the wiring conductors 20 are arranged on the wiring surfaces 40a and 40b, respectively.
The wiring conductor 20 connects adjacent n-type rod-shaped elements 11 and p-type rod-shaped elements 12 at the end surfaces of the columns, and the n-type rod-shaped elements 11 and the p-type rod-shaped elements 12 are connected to the two wiring surfaces 40a and 40b. Each of the pillars is displaced by one column, so that a large number of n-type rod-shaped elements 11 and p-type rod-shaped elements 12 are alternately connected in series.
However, as shown in FIG. 1, in the portion where the wiring conductor 20 is folded, the n-type rod elements 11 or the p-type rod elements 12 are arranged side by side. The conductor 20 is arranged.
[0027]
At the beginning and end of the n-type rod-shaped element 11 and the p-type rod-shaped element 12 connected in series, a connecting rod-shaped element 13 lower than the n-type rod-shaped element 11 and the p-type rod-shaped element 12 is provided.
As described above, in this structure, an even number of n-type rod-shaped elements 11 and p-type rod-shaped elements 12 are arranged and a folded wiring form as shown in FIG. This is a rod-like element on the outer periphery as viewed from the ten wiring surfaces 40a and 40b, and is located at both ends of one side surface 50a.
Here, in the present embodiment, the side surface 50 a is a surface other than the wiring surfaces 40 a and 40 b located on each side of the polygonal plane as viewed from the wiring surfaces 40 a and 40 b of the thermoelectric element block 10. The same applies to the side surface 50b described later.
[0028]
Since the connecting rod-shaped element 13 is the first and last rod-shaped elements serialized, the connecting conductor 20 is connected to one end face of the connecting rod-shaped element 13, but the connecting conductor is connected to the other end face. 20 is not connected.
The connecting rod-like element 13 is connected to the n-type rod-like element 11 or the p-type rod-like element 12 so that a step is formed between the wiring conductor 40a or the wiring face 40b on the side where the connecting conductor 20 is not connected. Compared to low.
[0029]
The connecting rod-like element 13 is used to connect the thermoelectric element block 10 and an external circuit. In other words, the end face on the side where there is a step between the wiring faces 40a and 40b becomes the lead-out end 14 to connect a lead wire or the like.
Therefore, in order to reliably perform soldering and wire bonding, it is preferable to apply a single layer or a plurality of layers of a metal film such as nickel, copper, or gold to the extraction end 14.
[0030]
Further, FIG. 2 shows a side view showing a mounting form when the thermoelectric element of the present invention is actually used.
For example, when a thermoelectric element is used as a power generation element, the low temperature member 61 and the wiring surface 40a are brought into contact with each other, and the high temperature member 62 and the wiring surface 40b are brought into contact with each other to give a temperature difference above and below the thermoelectric element. A voltage is generated in the thermoelectric element due to this temperature difference, and a terminal for taking out the voltage to the outside is the lead-out end 14.
[0031]
Although not shown, when the low temperature member 61 and the high temperature member 62 are brought into contact with the wiring surfaces 40a and 40b, if the surfaces of the low temperature member 61 and the high temperature member 62 are electrically insulated, heat containing particles such as alumina is included. Conductive epoxy resin or thermally conductive silicone resin is provided and fixed at the interface.
Further, in order to bring the low temperature member 61 or the high temperature member 62 made of metal into contact with the wiring surfaces 40a and 40b, the wiring surfaces 40a and 40b must be covered with an insulating resin in advance. In this case, since the above-described thermally conductive epoxy resin or silicone resin has an insulating property, it can also serve as an insulating film.
[0032]
A lead wire 80 such as a copper wire is connected to the lead-out end 14 as shown in FIG. 2, and is connected to an external circuit. Since the lead end 14 is made of gold or the like, the lead wire 80 can be connected using a solder material 70 such as a lead-tin alloy.
[0033]
Thus, in the thermoelectric element of the present invention, the connecting rod-shaped element 13 formed lower than the n-type rod-shaped element 11 and the p-type rod-shaped element 12 forms a step between the wiring surfaces 40a and 40b. For this reason, in the thermoelectric element of the present invention, the lead wires 80 for wiring can be connected via the solder material 70 with the connecting rod-shaped element 13, good electrical connection with the outside, and the wiring surfaces 40 a and 40 b. And good thermal contact with the external low-temperature member 61 and the high-temperature member 62 can be achieved at the same time.
Further, when the thermoelectric element of the present invention is used as a cooling element, the low temperature member 61 as a cooling object and the high temperature member 62 as a heat radiating member are in thermal contact with the wiring surfaces 40a and 40b.
[0034]
[Second Example of Structure: FIGS. 3 and 4]
FIG. 3 shows the structure of the thermoelectric element in the second example.
The structure of the thermoelectric element in the second example is basically the same as that of the first example in that it is composed of the thermoelectric element block 10 and the wiring conductor 20. Further, the arrangement of the n-type rod-shaped element 11, the p-type rod-shaped element 12 and the insulating layer 30 included in the thermoelectric element block 10 is also the same.
[0035]
Here, in the structure of the second example, all the n-type rod-shaped elements 11 in one row on the outer periphery of the thermoelectric element block 10 included in one side surface 50a are lowered to form a step with the wiring surface 40a. is doing. The plurality of low n-type rod-like elements 11 constitute a connecting rod-like element 13 in parallel.
Since the electrical connection of the wiring conductor 20 is difficult to understand, FIG. 4 shows the configuration of the other wiring surface 40b. The wiring conductors 20 at the beginning and end of the n-type rod element 11 and the p-type rod element 12 serialized as shown in FIG. 4 are L-shaped, and a plurality of connecting rod-like elements 13 are lowered. Are connected in parallel.
As shown in FIG. 3, a metal film such as nickel, copper, or gold is provided on the lead end 14 forming a step with the wiring surface 40a of the plurality of connecting rod-shaped elements 13, as shown in FIG.
[0036]
The thermoelectric element shown in FIG. 3 and FIG. 4 from the above configuration is also good between the external heat source and the coolant and the wiring surface 40a because the extraction end 14 is lower than the wiring surface 40a as in the first example. In this configuration, electrical connection can be made by using a lead wire or the like while making good thermal contact.
In addition, since the plurality of connecting rod-shaped elements 13 are provided, the lead-out end 14 having a large area is provided, and connection to the outside is facilitated. Furthermore, since any of the plurality of connecting rod-like elements 13 may be used for external connection, the degree of freedom of lead wire connection is increased. Further, since all the leading ends 14 are on the same surface side as the one wiring surface 40a, mounting is facilitated. Moreover, although demonstrated by a manufacturing method later, since one column is processed simultaneously and a pillar is shortened, manufacture becomes easy.
[0037]
[Third example of structure: FIG. 5]
FIG. 5 shows thermoelectric elements having different structures.
Basically, the thermoelectric element block 10 and the wiring conductor 20 are the same as the structure of the first example. Further, the arrangement of the n-type rod-shaped element 11, the p-type rod-shaped element 12 and the insulating layer 30 included in the thermoelectric element block 10 is also the same.
[0038]
Further, in the structure of the third example, all of the n-type rod-shaped elements 11 in one row are lowered as in the structure of the second example. The structure of the third example is different from the structure of the second example in the shape of a part of the wiring conductor 20.
In the structure of the third example, one of the final ends of the wiring conductor 20 that serializes the n-type rod-shaped element 11 and the p-type rod-shaped element 12 extends over the p-type rod-shaped element 12 and the connecting rod-shaped element 13. It is.
[0039]
Also in the structure of the third example, the plurality of low connecting rod-shaped elements 13 are electrically connected in parallel using the wiring conductor 20 and are arranged in parallel. At this time, parallelization is not seen in FIG. 5, but is performed on the other wiring surface 40b.
Further, a metal film such as nickel, copper, gold or the like is provided on the lead-out end 14 of the connecting rod-shaped element 13 for each rod-shaped element.
[0040]
From the above, the thermoelectric element of the third example, as well as the thermoelectric elements of the first and second examples, leads to good heat contact between the external heat source and cooling member and the wiring surfaces 40a and 40b. It is configured to be able to make electrical connections using wires. Moreover, it has the drawer | drawing-out end 14 of the large area like a 2nd example, and the connection to the outside becomes easy.
Further, the p-type rod-like element connected to the wiring conductor 20 formed in the lower step portion is not used in the second example, but this structure can be used without wasting.
[0041]
[Fourth Example of Structure: FIGS. 6 and 7]
FIG. 6 shows still another structure of the thermoelectric element.
The structure of the thermoelectric element in the fourth example is basically the same as that of the first example in that it is composed of the thermoelectric element block 10 and the wiring conductor 20. Further, the arrangement of the n-type rod-shaped element 11, the p-type rod-shaped element 12 and the insulating layer 30 included in the thermoelectric element block 10 is also the same.
[0042]
In this fourth example, the height of the n-type rod-shaped elements 11 in one row on one side surface 50a of the thermoelectric element block 10 is lowered except for one at the right end in FIG. The connecting rod-shaped element 13 is formed.
For easy understanding of the wiring configuration, FIG. 7 shows the configuration viewed from the other wiring surface 40b. In this way, the structure is basically the same as that of the second example, but one of the n-type rod-shaped elements 11 in one row is used so as to function as an original thermocouple instead of the connecting rod-shaped element 13. . Also in this configuration, the connecting rod-like elements 13 are electrically connected in parallel by the wiring conductor 20 at the final end.
Further, a metal film such as nickel, copper, or gold is provided on the lead-out end 14 of the connecting rod-shaped element 13 for each rod-shaped element.
[0043]
From the above configuration, the thermoelectric element of the fourth example is also in good thermal contact between the external heat source or the cooling object and the wiring surfaces 40a and 40b, similarly to the thermoelectric elements of the first to third examples described so far. In this configuration, electrical connection using a lead wire or the like can be performed. Moreover, it has the drawer | drawing-out end 14 of a large area, and the connection to the exterior becomes easy.
Furthermore, since one n-type rod-shaped element 11 on one side surface 50a can also be used as a thermocouple, more rod-shaped elements than the second example and the third example can be used as a thermocouple, so the outer shape is the second example or Although it is the same as that of the third example, the output as a thermoelectric element is increased.
[0044]
[Fifth example of structure: FIG. 8]
As shown in FIG. 8, the structure of the fifth example also mainly includes a thermoelectric element block 10 and a wiring conductor 20 disposed on the surface of the thermoelectric element block 10.
[0045]
The thermoelectric element block 10 is regularly arranged with an n-type rod-shaped element 11 processed into a column shape by processing an n-type thermoelectric semiconductor and a p-type rod-shaped element 12 processed into a column shape by processing a p-type thermoelectric semiconductor.
The arrangement of the rod-shaped elements has a structure in which an odd number of rows of n-type rod-shaped elements 11 and an odd number of rows of p-type rod-shaped elements 12 are alternately repeated.
[0046]
Insulating in order to insulate the n-type rod-shaped element 11 and the p-type rod-shaped element 12, or between the n-type rod-shaped elements 11 or between the p-type rod-shaped elements 12 and to fix the n-type rod-shaped element 11 and the p-type rod-shaped element 12 It has the insulating layer 30 which consists of resin.
[0047]
Also in the structure of the fifth example, the wiring conductor 20 connects the adjacent n-type rod-shaped element 11 and p-type rod-shaped element 12 at the end of the columnar rod-shaped element, and the two wiring surfaces 40a and 40b Each column is displaced by one column, so that a large number of n-type rod-shaped elements 11 and p-type rod-shaped elements 12 are alternately connected in series.
Further, the wiring is folded using the L-shaped wiring conductor 20 and the odd-numbered n-type bar-shaped element 11 and p-type bar-shaped element 12 are used, so that the beginning and end of the serialized bar-shaped elements are the same as those of the thermoelectric element block 10. The connecting bar elements 13 appear at the diagonal positions, and are also present at the diagonal positions, that is, the two side surfaces 50a and 50b facing each other.
[0048]
The connecting rod element 13 is connected to the wiring conductor 20 at the final end on the wiring surface 40b on the side not visible in FIG. 8, and forms a step with the wiring surface 40a visible in FIG. As you can see, the height of the pillars is low.
A metal film is applied to the lead-out end 14 on the side where the step of the connecting rod element 13 is formed.
[0049]
As described above, in the structure of the fifth example, as in the structures of the first to fourth examples, the electrical heat generated by the lead wire or the like is obtained while maintaining good thermal contact between the external heat source or the cooling member and the wiring surfaces 40a and 40b. It is a structure that can also be connected. Similarly to the structure of the first example, the connecting rod-shaped element 13 is only two of the rod-shaped elements in the thermoelectric element block 10, so that the area ratio of the thermocouple in the element area is high, and the output efficiency of the element Becomes higher.
Furthermore, in this structure, since both the two lead-out ends 14 are on the same side as the one wiring surface 40a, external connection can be easily performed, and the thermoelectric element block 10 can be easily mounted.
[0050]
[Sixth Example of Structure: FIGS. 9 and 10]
FIG. 9 shows the structure of different thermoelectric elements. The structure of the thermoelectric element block 10 and the wiring conductor 20 is basically the same as the structure of the fifth example. Further, the arrangement of the n-type rod-shaped element 11, the p-type rod-shaped element 12 and the insulating layer 30 included in the thermoelectric element block 10 is also the same.
[0051]
In the structure of the sixth example, the connecting rod elements 13 located at the beginning and end of the electrically connected n-type rod element 11 and p-type rod element 12 are located on one side surface 50 a of the thermoelectric element block 10. It consists of a plurality of n-type rod-shaped elements 11 and a plurality of p-type rod-shaped elements 12 located on the other side surface 50b. Then, on both side surfaces 50a and 50b, all the n-type rod-shaped elements 11 or p-type rod-shaped elements 12 in one row are made low so as to form a step with the wiring surface 40a.
A metal film is applied to the lead-out end 14 on the side where the step of the connecting rod element 13 is formed.
[0052]
FIG. 10 shows a structure viewed from another wiring surface 40b so that the configuration can be easily understood. A wiring conductor 20 connected to the beginning and end of a plurality of n-type rod-shaped elements 11 and p-type rod-shaped elements 12 connected in series as shown in FIG. 10 has an L-shaped structure, and a plurality of n-type rod-shaped elements 11 are connected. Alternatively, the p-type rod-shaped elements 12 are electrically connected in parallel.
Thereby, the lead-out end 14 of the wiring conductor 20 forming the step is composed of a plurality of columns.
[0053]
As described above, in the structure of the sixth example, as in the structures of the first to fifth examples, a lead wire or the like can be obtained while maintaining good thermal contact between the external heat source or the cooling member and the wiring surfaces 40a and 40b. The electrical connection by can also be configured. Moreover, it has the drawer | drawing-out end 14 of a large area, and the connection to the exterior becomes easy.
Further, since the leading end 14 is separated into the opposite side surface 50a and side surface 50b, when the plurality of thermoelectric element blocks 10 are connected in series, the thermoelectric element block 10 and the thermoelectric element block 10 are easily connected. It becomes.
[0054]
[Seventh Example of Structure: FIGS. 11 and 12]
FIG. 11 shows still another structure of the thermoelectric element. This structure is basically the same as the structure of the fourth example, and includes a thermoelectric element block 10 and a wiring conductor 20.
Further, the arrangement of the n-type rod-shaped element 11, the p-type rod-shaped element 12 and the insulating layer 30 included in the thermoelectric element block 10 is also the same.
[0055]
Here, only one end of the row of n-type rod-shaped elements 11 included in one side surface 50a of the thermoelectric element block 10, that is, the right end in FIG. 11 remains, and the other pillars are eliminated. This is achieved by removing all the connecting rod-like elements 13 having a low structure in the fourth example, and the wiring conductor 20 is exposed.
In the structure of the seventh example, the exposed wiring conductor 20 also serves as an extraction electrode to the outside, and serves as the external connection wiring conductors 20a and 20b. Then, the lead wires and the like are connected to the exposed surface on the side where the external connection wiring conductors 20a and 20b are connected to the wiring surface 40b.
[0056]
FIG. 12 is a side view showing a mounting form of the thermoelectric element of the seventh example. For example, when a thermoelectric element is used as a power generation element, the low temperature member 61 and the wiring surface 40a are brought into contact with each other, and the high temperature member 62 and the wiring surface 40b are brought into contact with each other, thereby giving a temperature difference between the upper and lower sides of the thermoelectric element.
Although the voltage is generated in the thermoelectric element due to this temperature difference, the wiring conductor 20 has an exposed terminal for taking out the voltage to the outside.
[0057]
Although not shown, when the low temperature member 61 and the high temperature member 62 are brought into contact with the wiring surfaces 40a and 40b, if the surfaces of the low temperature member 61 and the high temperature member 62 are electrically insulated, heat containing particles such as alumina is included. Conductive epoxy resin, heat conductive silicone resin, etc. are fixed on both interfaces.
Further, in order to bring the low temperature member 61 or the high temperature member 62 made of metal into contact with the wiring surfaces 40a and 40b, the wiring surfaces 40a and 40b must be covered with an insulating resin in advance. In this case, since the above-described thermally conductive epoxy resin or silicone resin has an insulating property, it can also serve as an insulating film.
[0058]
A lead wire 80 such as a copper wire is connected to the exposed wiring conductor 20 as shown in FIG. 12, and is connected to an external circuit.
Since the exposed wiring conductor 20 is a coating of a metal material, the lead wire 80 is connected using a solder material 70 such as a lead-tin alloy.
[0059]
As described above, even in the thermoelectric element structure of the seventh example, it is possible to make an electrical connection using a lead wire or the like while making good thermal contact between an external heat source or cooling member and the wiring surfaces 40a and 40b. It has become.
In addition, since there is no connecting rod-like element at the connection location by the lead wire 80, the heat leak between the wiring surfaces 40a and 40b flowing along the connecting rod-like element is reduced, so that the temperature difference is reduced. Large and advantageous in terms of characteristics.
[0060]
[Eighth Example of Structure: FIG. 13]
FIG. 13 shows the structure of different thermoelectric elements. This structure is basically the same as the fifth structure, and is composed of a thermoelectric element block 10 and a wiring conductor 20. The arrangement of the n-type rod-shaped element 11, the p-type rod-shaped element 12 and the insulating layer 30 included in the thermoelectric element block 10 is also the same, and an odd-numbered n-type rod-shaped element 11 row and p-type rod-shaped element 12 row are used. ing.
As described in the fifth example above, the odd number of arrangements are intended to increase the efficiency per area by taking the electrodes for external connection at diagonal positions and using all the rod-shaped elements constituting as thermocouples. .
[0061]
Also in this structure, like the seventh structure, the wiring conductors 20 at both ends are exposed to form the external connection wiring conductors 20a and 20b. This also consists of removing all the connecting rod-like elements 13 having the structure of the fifth example.
[0062]
As described above, the thermoelectric element structure of the eighth example has a configuration in which an electrical connection using a lead wire or the like can be performed while maintaining good thermal contact between an external heat source or a cooling member and the wiring surfaces 40a and 40b. ing.
In addition, since there is no connecting rod-like element in the connection portion with the outside by a lead wire or the like, the heat leak between the wiring surfaces 40a, 40b flowing through the connecting rod-like element is reduced, A large temperature difference is advantageous in terms of characteristics.
[0063]
As described above, the structure in which the surface side of the wiring conductor 20 connected to the rod-shaped element is exposed to form the external connection wiring conductors 20a and 20b is shown by two examples. If the basic idea of removing the element 13 is used, the same configuration as that of the first example, the second example, the third example, and the sixth example can be applied.
[0064]
Further, in all the structural examples of the first to eighth examples, the arrangement of the n-type rod-shaped elements 11 and the p-type rod-shaped elements 12 has been described for convenience. There is no change.
[0065]
[Ninth example of structure: FIG. 14]
FIG. 14 shows the structure of a thermoelectric element of still another embodiment. It mainly comprises a thermoelectric element block 10 and a wiring conductor 20 disposed on the surface of the thermoelectric element block 10.
[0066]
The thermoelectric element block 10 includes an n-type plate-like element 110 processed into a plate shape by processing an n-type thermoelectric semiconductor, and a p-type plate-like element 120 processed into a plate shape by processing a p-type thermoelectric semiconductor alternately and linearly. Arrange and configure.
An insulating layer 30 made of an insulating resin is interposed between the n-type plate element 110 and the p-type plate element 120 in order to insulate and fix them.
[0067]
Although only one end surface is visible in FIG. 14, the thermoelectric element block 10 has two wiring surfaces 40a and 40b facing each other, and the wiring conductor 20 is disposed on the wiring surfaces 40a and 40b.
The wiring conductor 20 connects the n-type plate element 110 and the p-type plate element 120 adjacent to each other at the end face, and the two wiring faces 40a and 40b are arranged so as to be shifted one by one. As a result, a large number of n-type plate elements 110 and p-type plate elements 120 are alternately connected in series.
[0068]
Connection plate elements 130 are provided at both ends of the n-type plate element 110 and the p-type plate element 120 that are serialized. In this structure, the connecting plate elements 130 exist at both ends of the n-type plate element 110 and the p-type plate element 120 that are linearly arranged. Since the connecting plate-like element 130 is located at the beginning and end of the serialized plate-like elements, it is connected to the wiring conductor 20 only on one wiring surface 40b and not connected on the other wiring surface 40a.
The side that is not in contact with the wiring conductor 20 is configured lower than the n-type plate element 110 and the p-type plate element 120 so that a step can be formed between the wiring surface 40a and the connection plate element 130. It is said.
[0069]
The connecting plate element 130 is used to connect the thermoelectric element block 10 to an external circuit.
Although not shown in FIG. 14, a lead wire such as a copper wire is bonded to the lead-out end 14 on the side where a step is formed between the wiring surface 40a and bonding using solder or wire bonding using a gold wire is performed. . In order to reliably perform soldering and wire bonding, it is preferable to apply a metal film such as gold or copper to the leading end 14.
[0070]
As described above, the thermoelectric element of the ninth example is also electrically connected by a lead wire or the like while taking good thermal contact between an external heat source or cooling member and the wiring surfaces 40a and 40b, similarly to the thermoelectric element. It can also be configured.
Moreover, it has the drawer | drawing-out end 14 of a large area, and the connection to the exterior becomes easy. Furthermore, since the configuration of the pillar is linear and simple, and the configuration of the wiring conductor 20 is also simple, the configuration will be described later in the manufacturing method.
[0071]
[First Example of Manufacturing Method: FIGS. 15 to 19]
First, as shown in FIG. 15, the vertical grooves 1 are formed in the n-type thermoelectric semiconductor and the p-type thermoelectric semiconductor, and the n-type comb element 3 and the p-type comb element 4 are manufactured leaving the vertical partition 2. At this time, the n-type comb-tooth element 3 and the p-type comb-tooth element 4 have the same pitch of the vertical grooves 1 and the width of the vertical groove 1 of one block is larger than the width of the vertical partition wall 2 of the other block. Like that.
In this example, a BiSeTe alloy sintered body was used as the n-type thermoelectric semiconductor, and a BiSbTe alloy sintered body was used as the p-type thermoelectric semiconductor.
[0072]
The restriction on the width dimension of the vertical groove 1 is set in order to fit the n-type comb element 3 and the p-type comb element 4 between the grooves in the process described later.
Since the difference between the width of the vertical groove 1 and the width of the vertical partition wall 2 determines the width of the insulating resin layer in a later process, the width of the vertical groove 1 is considered in view of ensuring insulation and workability in the fitting process. And the median width of the mediastinum 2 is preferably 10 μm or more.
[0073]
The longitudinal groove 1 is processed by polishing with a wire saw or grinding with a dicing saw.
[0074]
Subsequently, the n-type comb-teeth element 3 and the p-type comb-teeth element 4 are combined and integrated by inserting the mating vertical partition wall 2 into the vertical groove 1. FIG. 16 shows a state in which the n-type comb element 3 and the p-type comb element 4 are combined.
The combined two comb-tooth elements 3 and 4 are integrated by providing an insulating layer 30 at the fitting portion and fixing them. If the comb-tooth element combined in a highly fluid insulating adhesive is partially immersed and the adhesive is filled in the gap between the vertical groove 1 and the vertical partition wall 2 by capillary action, the insulating layer 30 maintains the insulation. Can be fixed. Here, an epoxy adhesive having a low viscosity is used as the adhesive used for the insulating layer 30.
[0075]
As shown in FIG. 17, the comb-tooth elements thus combined are then subjected to grooving again to form an integrated comb-tooth element 5. The lateral grooves 6 do not need to be combined thereafter, and the remaining lateral partition walls 7 are used as elements, so it is desirable that the lateral grooves 6 be as narrow as possible. That is, the lateral groove 6 is formed by polishing with a wire saw.
Note that the horizontal groove 6 in this step is formed in a direction intersecting the vertical groove 1, and generally, it is optimal to make it perpendicular to the vertical groove 1 as shown in FIG.
[0076]
The lateral groove 6 may be formed from the surface of the n-type comb element 3 as shown in FIG. 17, or conversely, from the surface of the p-type comb element 4 side. At this time, it is preferable to perform the groove processing after removing the base portion where the groove of the n-type comb element 3 or the p-type comb element 4 on the cut side is not formed.
The reason why the base portion is removed is that the vertical grooves 1 that have been processed first can be observed, so that the orthogonality with the horizontal grooves 6 can be easily obtained. Moreover, since the processing depth is smaller when the base portion is not provided, there is an effect that column bending in the depth direction can be reduced.
[0077]
Subsequently, the insulating grooves 30 are formed by filling the lateral grooves 6 with an epoxy insulating resin and curing. It is desirable to use the same resin as that used when the comb elements are combined and fixed.
[0078]
The integrated comb-tooth element 5 solidified by the insulating layer 30 has its upper surface 51 and lower surface 52 removed by grinding, and the vertical groove 1 and the vertical partition wall 2 of the n-type comb-tooth element 3 and p-type comb-tooth element 4 are fitted. Then, the thermoelectric element block 10 shown in FIG. 18 is formed.
In the thermoelectric element block 10 in this state, n-type thermoelectric semiconductors and p-type thermoelectric semiconductors are regularly arranged in a columnar shape, and each column of the n-type thermoelectric semiconductor is an n-type rod-like element 11. Each column is a p-type rod-shaped element 12.
[0079]
Wiring is performed between the n-type rod-shaped element 11 and the p-type rod-shaped element 12 on the upper and lower wiring surfaces 40a, 40b of the thermoelectric element block 10 shown in FIG.
An opening is provided in a metal plate made of nickel, alignment is performed so that the opening and the n-type rod-shaped element 11 and the p-type rod-shaped element 12 on the wiring surfaces 40a and 40b overlap, and the metal plate and the thermoelectric element block 10 are aligned. Fix closely.
[0080]
The thermoelectric element block 10 to which the metal plate is fixed is placed in a vacuum vapor deposition apparatus, and nickel or palladium is vapor-deposited with a film thickness of 100 nm. This method is generally called a mask vapor deposition method, and the pattern of the wiring conductor 20 shown in FIGS. 1 to 13 can be formed.
Although this vapor deposition is performed on the two wiring surfaces 40a and 40b, the wiring conductor 20 formed by the mask vapor deposition method has a pattern in which one pillar is shifted by two wiring surfaces 40a and 40b. The n-type rod-shaped element 11 and the p-type rod-shaped element 12 are arranged so as to be electrically serialized.
Further, the vapor deposition process of the two surfaces may be performed twice for each surface or simultaneously for both surfaces.
[0081]
The rod-shaped elements at the beginning and end of the n-type rod-shaped element 11 and the p-type rod-shaped element 12 serialized following the vapor deposition step are processed so as to be lower than the wiring surface 40a, and the connecting rod-shaped element 13 is formed.
For example, as shown in FIGS. 1, 6, and 8, the n-type rod-shaped element 11 or the p-type rod-shaped side surface portion is formed so as to form a step with the wiring surface 40 a on the side where the wiring conductor 20 is not connected. The element 12 is cut by a predetermined amount. For this processing, cutting using an end mill or the like is preferable.
In this case, since the end mill cannot perform processing perpendicular to all directions, for example, as shown in FIG. FIG. 19 is a view of the thermoelectric element of FIG. 1 as viewed from one side.
[0082]
Also, when taking another wiring shape, for example, as shown in FIGS. 3, 5, and 9, all the rows of the n-type rod-shaped elements 11 or the p-type rod-shaped elements 12 are processed low, and the connecting rod-shaped elements 13 are formed. Form.
Although the above-described end milling can be used for this processing, grinding using a dicing saw is easier.
[0083]
Further, as another processing method, processing by etching is also possible. A protective film is formed on the thermoelectric element block 10, leaving only the end face where the pillar wiring conductor 20 to be the connecting rod element 13 is not connected. The protective film is preferably a resin such as a photoresist that can be removed with a solvent such as acetone.
After coating the resin so that only the connecting rod-shaped element 13 region is opened, the n-type rod-shaped element 11 or the p-type rod-shaped element 12 is etched and processed low by immersing the thermoelectric element block 10 in hydrochloric acid + nitric acid aqueous solution. Thus, the connecting rod element 13 can be obtained.
[0084]
However, in order to achieve the structure shown in FIG. 5, the processing steps of the connecting rod element 13 described here are performed by grinding the upper surface 51 and the lower surface 52 of the integrated comb element 5 described above. Next to the process of forming the thermoelectric element block 10, the vapor deposition process must be performed following the process of processing the connecting rod-shaped element 13.
In addition, the order may be changed in the same manner in the case of the configurations shown in FIGS. 1, 3, 6, 8, and 9.
[0085]
Following the processing step of the connecting rod-shaped element 13, the thermoelectric element block 10 is immersed in an electroless nickel plating solution to form a nickel coating. Since the nickel film grows using a nickel film or a palladium film formed by vapor deposition as a reaction nucleus, it is first formed on the vapor deposition film. Further, since the vapor deposition film is also formed on the n-type rod-shaped element 11 and the p-type rod-shaped element 12, a nickel coating is also formed on the exposed end face of the rod-shaped element.
At the same time, a nickel film is also formed on the processed surface of the connecting rod-shaped element 13 processed at a low level, that is, a metal film is formed at the end. The thickness of the nickel plating is several μm to several tens of μm.
[0086]
Further, following the nickel plating, a gold plating process is also performed by an electroless plating process, and a gold film is further formed on the nickel film.
Since gold plating cannot be applied very thick because of substitution plating, the film thickness is at most about 50 nm.
[0087]
These plating steps are performed to reduce the resistance of the deposited film and increase the oxidation resistance and corrosion resistance.
At the same time, it is also for forming a metal film so that soldering or wire bonding connection can be performed from the end face of the connecting rod-like element 13 to the outside.
[0088]
Here, since the specific resistance is somewhat large in nickel plating, when further lowering the wiring resistance, copper plating is performed following electroless nickel plating. At this time, the nickel plating does not need to be formed as thick as about several μm. Since electroless plating is difficult for copper plating, electrolytic plating is used. Electrolytic plating is performed by connecting an external electrode to the connecting rod elements 13 at both ends and applying a current. Copper plating is also formed with a thickness of several μm to several tens of μm as necessary.
Then, following the copper plating, gold is formed to a thickness of about 0.1 μm using the electrolytic plating method to ensure corrosion resistance and the like.
[0089]
Further, as shown in FIGS. 11 and 13, there is a method of processing and removing all of the connecting rod-like elements 13 so that the wiring conductor 20 is exposed.
As a result, a part of the wiring surface side of the wiring conductor 20 is exposed to form the external connection wiring conductors 20a and 20b, which can be used as external connection electrodes.
In this case, since the thin film is difficult to process with only the vapor deposition film, it is preferable to carry out the plating step described above following the vapor deposition step, and to thicken the wiring conductor 20 before processing the connecting rod-like element 13. In order to process and remove the connecting rod-shaped element 13 so that the wiring conductor 20 is exposed, it is desirable that the plating thickness is at least 20 μm or more.
[0090]
Although the thermoelectric element of the present invention is completed by the above steps, the final plating step may be omitted depending on circumstances. In that case, copper is vapor-deposited following nickel vapor-deposition so that resistance can be lowered sufficiently in the previous vapor deposition step.
Further, when there is no plating film, the end surface treatment of the connecting rod-shaped element 13 is not performed, so low melting point solder is used for external connection, or a metal plate or nickel plate is locally applied to the lead-out end 14 of the connecting rod-shaped element. It is better to use a pressure bonding method in which diffusion bonding is performed by applying pressure while heating.
[0091]
[Second Example of Manufacturing Method: FIGS. 15, 16, and 20]
Basically, it is the same as the manufacturing method of the first example. First, an n-type comb element 3 and a p-type comb element 4 are prepared as shown in FIG. 15, and both are combined as shown in FIG. Fix using resin.
In the manufacturing method of the first example, further grooving was performed thereafter, but in the method of the second example, the base part where the vertical grooves 1 on the upper and lower surfaces were not formed was removed without grooving. The thermoelectric element block 10 is formed. The structure is shown in FIG.
[0092]
As shown in FIG. 20, the thermoelectric element block 10 is an emergency in which n-type plate elements 110 made of n-type thermoelectric semiconductors and p-type plate elements 120 made of p-type thermoelectric semiconductors are arranged alternately and linearly via insulating layers 30. It has a simple structure.
[0093]
The subsequent steps are the same as the manufacturing method of the first example, and a nickel or palladium film is vapor-deposited in a pattern on the wiring surface 40 of the thermoelectric element block 10 using a mask vapor deposition method. Form body 20.
After that, the plate-like elements on the side surfaces of the n-type plate-like element 110 and the p-type plate-like element 120 that are serialized are cut using a dicing saw to form a step between the wiring surface 40a and connected. The plate-like element 130 is used.
Also in this manufacturing method, it is possible to use an end mill other than the dicing saw, or use etching.
[0094]
Then, the thermoelectric element block 10 is subjected to nickel plating and gold plating in an electroless plating solution to increase the thickness of the wiring conductor 20, and the processed surface of the connecting plate element 130 is subjected to metal treatment. Further, an electrolytic plating method may be used for plating.
[0095]
Although the two manufacturing methods have been described above, the drawings show that one device is produced by either method. However, in this manufacturing method, a large number of thermoelectric element blocks can be manufactured at once by using a large comb-like element.
[0096]
That is, the thermoelectric element block 10 several times larger than the thermoelectric element can be formed by combining the n-type comb-like element 3 and the p-type comb-like element 4 which are several times larger than the target thermoelectric element. After passing through the wiring process, the thermoelectric element block 10 is divided so that a large number of thermoelectric element blocks can be manufactured at the same time.
In this case, the step processing for forming the connecting rod-shaped element 13 or the connecting plate-shaped element 130 can also be processed in a lump if the processing is performed before the division, so that it is not necessary to align each element. Is.
[0097]
By using the method as described above, the lead-out end 14 to the external circuit can be manufactured at a position lower than the wiring surface in the thermoelectric element having the thermoelectric semiconductor and the insulating layer.
Accordingly, it is possible to manufacture a thermoelectric element that can be electrically connected by a lead wire or the like while making good thermal contact between the external heat source or cooling member and the wiring surfaces 40a and 40b. Further, by using a plating process, the processed drawing end 14 can be coated with a metal material, and the reliability of the external wiring can be improved.
[0098]
【The invention's effect】
As is clear from the above description, the thermoelectric element of the present invention forms a connecting rod-like element lower than the wiring surface on which the wiring conductor pattern is formed, and has a lead-out end on the end surface where the wiring surface and the step are formed. ing.
Thus, when using the thermoelectric element for power generation, when contacting the low temperature member or the high temperature member, or when using the thermoelectric element as a cooling element, when contacting the cooling target member, the wiring surface that is the end of the thermocouple is in close contact with the target member, It can be connected to the external circuit from the drawer end without disturbing the close contact. At this time, the lead wire can be pulled out by soldering or wire bonding.
[0099]
Further, by constituting the connecting rod-like element with a plurality of pillars, the area of the lead-out end can be increased and further external connection can be facilitated. This is very advantageous for small elements.
[0100]
As described above, in the present invention, a small thermoelectric element in which a thermoelectric material is fixed with an insulator and directly provided with a wiring film, electrical connection of drawing out to an external circuit, which has been difficult to achieve in the past, and connection to a heat source or a cooling member. It enables good thermal contact at the same time.
The small thermoelectric element obtained by the present invention can be used for temperature difference power generation inside a portable electronic device or local cooling of a semiconductor element.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a structure of a thermoelectric element in an embodiment of the present invention.
FIG. 2 is a side view showing a structure of a thermoelectric element in the embodiment of the present invention.
FIG. 3 is a perspective view showing a structure of a thermoelectric element in the embodiment of the present invention.
FIG. 4 is a perspective view showing a structure of a thermoelectric element in the embodiment of the present invention.
FIG. 5 is a perspective view showing a structure of a thermoelectric element in the embodiment of the present invention.
FIG. 6 is a perspective view showing a structure of a thermoelectric element in the embodiment of the present invention.
FIG. 7 is a perspective view showing a structure of a thermoelectric element in the embodiment of the present invention.
FIG. 8 is a perspective view showing a structure of a thermoelectric element in the embodiment of the present invention.
FIG. 9 is a perspective view showing a structure of a thermoelectric element in the embodiment of the present invention.
FIG. 10 is a perspective view showing a structure of a thermoelectric element in the embodiment of the present invention.
FIG. 11 is a perspective view showing a structure of a thermoelectric element in the embodiment of the present invention.
FIG. 12 is a side view showing the structure of the thermoelectric element in the embodiment of the present invention.
FIG. 13 is a perspective view showing a structure of a thermoelectric element in the embodiment of the present invention.
FIG. 14 is a perspective view showing a structure of a thermoelectric element in the embodiment of the present invention.
FIG. 15 is a perspective view showing a method for manufacturing a thermoelectric element in the embodiment of the present invention.
FIG. 16 is a perspective view showing a method for manufacturing a thermoelectric element in the embodiment of the present invention.
FIG. 17 is a perspective view showing a method for manufacturing a thermoelectric element in an embodiment of the present invention.
FIG. 18 is a perspective view showing a method for manufacturing a thermoelectric element in the embodiment of the present invention.
FIG. 19 is a side view showing the method for manufacturing the thermoelectric element in the embodiment of the present invention.
FIG. 20 is a perspective view showing a method for manufacturing the thermoelectric element in the embodiment of the present invention.
[Explanation of symbols]
1: Vertical groove 2: Vertical partition 3: n-type comb element
4: p-type comb-tooth element 5: integrated comb-tooth element 6: lateral groove
7: Horizontal partition wall 10: Thermoelectric element block
11: n-type rod-shaped element 12: p-type rod-shaped element
13: Rod-shaped element for connection 14: Lead end
20: Conductor for wiring 30: Insulating layer
40a: Wiring surface 40b: Wiring surface 50a: Side surface
50b: Side surface 51: Upper surface 52: Lower surface
61: Low temperature member (object to be cooled) 62: High temperature member (heat dissipation member)
70: Solder material 80: Lead wire 110: N-type plate element
120: p-type plate element 130: connection plate element

Claims (9)

A plurality of n-type rod-shaped elements made of n-type thermoelectric semiconductor and a plurality of p-type rod-shaped elements made of p-type thermoelectric semiconductor are arranged and fixed via an insulating layer, and each n-type rod-shaped element and each p-type rod-shaped element are fixed. A thermoelectric element block having a wiring surface in which both end faces of the element are exposed, and a wiring conductor provided on the wiring surface of the thermoelectric element block and connecting the n-type rod-shaped element and the p-type rod-shaped element. A thermoelectric element, wherein at least a part of the n-type rod-shaped element or the p-type rod-shaped element on the outer periphery of the thermoelectric element block is a connecting rod-shaped element shorter than other n-type rod-shaped elements or p-type rod-shaped elements , The connecting rod-like element is a thermoelectric element characterized in that one end face is connected to a wiring conductor and the other end face is covered with a metal film to be a lead-out end for external connection . The thermoelectric element according to claim 1 , wherein the connecting rod-like element is located only on one side surface of the thermoelectric element block. The thermoelectric element according to claim 1 , wherein the connecting rod-like element is located on two side surfaces of the thermoelectric element block. The thermoelectric element according to any one of claims 1 to 3 , wherein the connecting rod-shaped element includes a plurality of rod-shaped elements arranged in parallel. The plurality of n-type rod-shaped elements are plate-shaped n-type plate-shaped elements that are continuous from one side surface to the other side surface, and the plurality of p-type rod-shaped elements are plates that are continuous from one side surface to the other side surface. The thermoelectric element according to claim 1, wherein the thermoelectric element is a p-type plate-shaped element. fixing a plurality of n-type rod-shaped elements made of n-type thermoelectric semiconductor and a plurality of p-type rod-shaped elements made of p-type thermoelectric semiconductor via an insulating layer to form a thermoelectric element block; Removing the lower surface to form a wiring surface; forming a wiring conductor on the wiring surface to connect the n-type rod element and the p-type rod element; and the outer periphery of the thermoelectric element block a step of forming at least a part of the n-type bar-shaped element or the p-type bar-shaped element lower than the wiring surface to form a connecting bar-shaped element; and an end surface of the connecting bar-shaped element to which the wiring conductor is not connected And a step of forming a lead end for external connection by coating a metal film on the thermoelectric element. The wiring conductor is formed on the wiring surface after the step of forming the connecting rod-like element by reversing the order of the step of forming the wiring conductor on the wiring surface and the step of forming the connecting rod-like element. The method of manufacturing a thermoelectric element according to claim 6 , wherein a step of forming the substrate is performed. After the step of forming the wiring conductor on the wiring surface, to claim 6, characterized in that a step of coating the metal film on the end surface of the wiring conductor of the connecting rod-element is not connected The manufacturing method of the thermoelectric element of description. The plurality of n-type rod-shaped elements are plate-shaped n-type plate-shaped elements that are continuous from one side surface to the other side surface, and the plurality of p-type rod-shaped elements are plates that are continuous from one side surface to the other side surface. The method of manufacturing a thermoelectric element according to claim 6, wherein the element is a p-type plate-like element.

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