JP4825637B2 - Semiconductor chip pickup device - Google Patents

Description

  The present invention relates to a pickup device that picks up a semiconductor chip attached to an adhesive sheet.

  The semiconductor chips formed by cutting the semiconductor wafer into dice are pasted on the adhesive sheet, and when the semiconductor chips are bonded to the substrate, they are picked up one by one from the adhesive sheet by the suction nozzle. .

When picking up a semiconductor chip from an adhesive sheet, conventionally, as shown in Patent Document 1, the periphery of the semiconductor chip of the adhesive sheet to which the semiconductor chip picked up by the suction nozzle is attached is covered by the upper surface of the backup body. While adsorbing and holding, the semiconductor chip is pushed up from the lower surface side by a push-up pin having a sharp tip. Accordingly, the semiconductor chip is separated from the pressure-sensitive adhesive sheet and picked up by the suction nozzle.
Japanese Patent Application Laid-Open No. 2002-1000064

  By the way, recently, the thickness of a semiconductor chip may be as thin as 50 μm or less. When such a thin semiconductor chip is pushed up by a sharp tip of a push pin, stress is concentrated at a location where the tip hits. For this reason, the semiconductor chip may be damaged by the stress received from the push-up pin.

  In order to prevent damage to the semiconductor chip due to stress concentration, it is conceivable to slow down the semiconductor chip push-up speed by the push-up pin. However, if the push-up speed of the push-up pin is slowed down, the pick-up speed is also slowed, which may lead to a decrease in productivity, and even if the push-up speed is slowed down, damage to the semiconductor chip is surely prevented. It was difficult.

  An object of the present invention is to provide a pickup device that can reliably pick up from an adhesive sheet without damaging a semiconductor chip.

This invention is a semiconductor chip pick-up device for picking up a semiconductor chip attached to the upper surface of an adhesive sheet,
A backup body formed on an adsorption surface that adsorbs and holds a portion corresponding to the peripheral portion of the semiconductor chip to be picked up on the lower surface of the adhesive sheet;
A push-up body that is provided in the backup body so as to be driven in the vertical direction and presses the lower surface of the portion to which the semiconductor chip to be picked up of the adhesive sheet is stuck to push up the semiconductor chip from the upper surface of the backup body;
Pickup means for picking up the semiconductor chip picked up by the push-up body from the adhesive sheet by sucking and holding the upper surface of the semiconductor chip to be picked up,
The push-up body is formed of a soft elastic material whose peripheral portion is elastically deformed downward by a tension generated in the pressure-sensitive adhesive sheet when the semiconductor chip is pushed up through the pressure-sensitive adhesive sheet. A semiconductor chip pickup device.

  The upper surface of the push-up body is formed with a recess surrounded by an annular wall smaller than the outer shape of the semiconductor chip, and when the semiconductor chip is pushed up by the push-up body in the recess, It is preferable that a holding plate that restricts elastic deformation of a portion other than the peripheral portion of the push-up body due to the tension of the pressure-sensitive adhesive sheet is provided.

  The thickness dimension of the holding plate is preferably equal to or less than the depth dimension of the recess.

  The holding plate is preferably circular or elliptical, and the upper edge thereof is preferably chamfered.

  It is preferable that an outer portion of the annular wall on the upper surface of the push-up body is formed as an inclined surface inclined downward.

  It is preferable that at least the upper end surface of the annular wall and the inclined surface on the upper surface of the push-up body are formed as a low friction surface.

  There is a push-up shaft that is driven up and down in the axial direction, and the push-up body is attached to the upper surface of the push-up shaft, and the peripheral portion of the lower end surface of the push-up body is protruded outward. It is preferable that a board is provided.

  It is preferable that the semiconductor chip has a rectangular shape, and the annular wall provided on the upper surface of the push-up body has a rectangular shape smaller than the semiconductor chip.

  According to this invention, when the semiconductor chip is picked up from the adhesive sheet, the portion of the adhesive sheet located on the periphery of the semiconductor chip is sucked and held, and the semiconductor chip is elastically deformed by the tension generated in the adhesive sheet. It was pushed up by the pusher.

  Therefore, it is possible not only to prevent the semiconductor chip from being damaged due to local stress, but also because the push-up body is elastically deformed by the tension of the pressure-sensitive adhesive sheet, the pressure-sensitive adhesive sheet is easily peeled off from the semiconductor chip by the elastic deformation. Therefore, the semiconductor chip can be reliably picked up.

Embodiments of the present invention will be described below with reference to the drawings.
The pickup apparatus shown in FIG. 1 includes a backup unit 10. The backup unit 10 includes a backup body 1. The backup body 1 is provided opposite to the lower surface side of an adhesive sheet 2 stretched on a wafer ring (not shown), and the upper surface of the backup body 1 is adhesive sheet 2 as described later in the Z direction by a Z drive source (not shown). It is driven between a position in contact with the lower surface of the sheet and a position away from the adhesive sheet 2.

  A plurality of rectangular semiconductor chips 3 obtained by dividing a semiconductor wafer into dice-like shapes are attached to the upper surface of the pressure-sensitive adhesive sheet 2. The wafer ring is driven in the horizontal direction by an X and Y drive source (not shown).

  Thereby, the semiconductor chip 3 attached to the adhesive sheet 2 can be positioned in the X and Y directions with respect to the backup unit 10. Instead of the backup unit 10, the wafer ring may be driven in the Z direction. In short, the wafer ring and the backup unit 10 are relatively driven in the X, Y, and Z directions. That's fine.

  On the upper surface side of the pressure-sensitive adhesive sheet 2, a suction nozzle body 4 constituting pickup means is provided above the backup unit 10. The suction nozzle body 4 has a pickup shaft 5 that is driven in the X, Y, and Z directions by an X, Y, and Z drive source (not shown). A convex portion 6 is provided on the lower end surface of the pickup shaft 5.

  The pickup shaft 5 is formed with a suction hole 7 whose tip is opened at the end face of the convex portion 6 along the axial direction. The suction hole 7 is connected to a suction pump (not shown). An upper suction nozzle 8 made of an elastic material such as rubber or soft synthetic resin is detachably attached to the convex portion 6. The upper suction nozzle 8 is formed with a nozzle hole 9 having one end communicating with the suction hole 7 and the other end opened to the tip surface, and further having a lower surface formed on a flat surface 8a.

  In addition, it is preferable to use a voice coil motor or the like as a Z drive source for driving the pickup shaft 5 in the Z direction so that the pressing load by the suction nozzle body 4 can be controlled to be constant.

  As shown in FIGS. 2 and 4, the backup body 1 has a cylindrical shape in which a lower end surface is opened and a rectangular opening 12 is formed on the upper surface. Here, the opening 12 is formed in a rectangular shape slightly smaller than the rectangular semiconductor chip 3 to be picked up, which is indicated by a chain line in FIG. That is, the opening 12 is formed in a similar shape to the semiconductor chip 3.

  Three annular grooves 14 a to 14 c surrounding the opening 12 are concentrically formed on the upper surface of the backup body 1. The three annular grooves 14 a to 14 c are communicated with each other by two communication grooves 15 formed along the radial direction of the backup body 1. The communication groove 15 is formed so as to be parallel to and opposite to the two opposite sides (end portions) of the semiconductor chip 3 to be picked up.

  Although not shown, the communication groove 15 may be further formed on the upper surface of the backup body 1 so as to be parallel to and opposite to the other two opposite sides of the semiconductor chip 3.

  Four suction holes 16a are formed in the innermost annular groove 14a at intervals of 90 degrees in the circumferential direction so as to penetrate the upper wall of the backup body 1 in the thickness direction. Further, the diameter of the annular groove 14a is set larger than the diagonal length of the semiconductor chip 3 to be picked up.

  Two suction holes 16b are formed in the second annular groove 14b at intervals of 180 degrees in the circumferential direction. A suction force acts on each of the annular grooves 14a to 14c and the communication groove 15 through the suction holes 16a and 16b as described later. The annular grooves 14a to 14c and the suction holes 16a and 16b are shown only in FIG. 4 and omitted in other drawings.

  As shown in FIG. 2, a cylindrical closing member 21 is provided at the lower end opening of the backup body 1 with one end thereof being airtightly fitted. An insertion hole 22 penetrating in the axial direction is formed in the central portion of the closing member 21. A push-up shaft 23 constituting a push-up means is slidably held in the insertion hole 22 and is airtightly held by an O-ring 24 provided at the lower end portion of the insertion hole 22.

  A rectangular mounting board 25 is provided on the upper end of the push-up shaft 23 protruding from the upper end surface of the closing member 21. A columnar convex portion 26 is provided at the center of the upper surface of the mounting plate 25. A push-up body 27 made of a soft elastic material such as rubber or synthetic resin is detachably attached to the convex portion 26. The degree of softness of the push-up body 27 will be described later.

  A suction hole 28 is formed in the push-up shaft 23 along the axial direction. The upper end of the suction hole 28 opens on the upper surface of the convex portion 26 provided on the mounting board 25, and the lower end opens on the side surface of the push-up shaft 23.

  A nozzle hole 29 is formed in the push-up body 27 so as to penetrate in the vertical direction. The nozzle hole 29 communicates with the suction hole 28 of the protrusion 26 at the lower end when the push-up body 27 is attached to the protrusion 26.

  As shown in FIG. 3A, the planar shape of the push-up body 27 is rectangular, and a concave portion 32 surrounded by a rectangular annular wall 31 smaller than the planar shape of the push-up body 27 is formed on the upper surface. Has been. The rectangle formed by the annular wall 31 is smaller than the semiconductor chip 3.

  The outer surface of the annular wall 31 on the upper surface of the push-up body 27 is formed as an inclined surface 33 inclined downward. Note that the surfaces of the inclined surface 33, the concave portion 32, and the annular wall 31, which are the upper surface of the push-up body 27, are formed on a low friction surface by coating a resin having a low friction coefficient or forming a skin layer during molding. ing.

  An elliptical or circular support plate 35 in this embodiment is held and fixed in the recess 32. The support plate 35 is formed on the push-up body 27 by an elastic material harder than the push-up body 27 such as a fluororesin, for example, with a thickness equal to or less than the depth dimension of the recess 32. A communication hole 36 penetrating in the thickness direction is formed in a portion corresponding to the nozzle hole 29. Further, the upper edge of the support plate 35 is chamfered to form a tapered surface 35a as shown in FIGS.

  As shown in FIG. 2, a suction hole 41 is formed in the closing member 21 that closes the lower opening of the backup body 1. One end of the suction hole 41 is opened at the upper end surface of the closing member 21, that is, the internal space of the backup body 1, and the other end is opened at the outer peripheral surface of the closing member 21.

  As shown in FIG. 1, the suction hole 41 formed in the closing member 21 and the suction hole 28 formed in the push-up shaft 23 are connected to a suction pump 42 via a pipe 43. When the suction pump 42 is operated, suction forces are generated in the annular grooves 14a to 14c through the suction holes 16a and 16b and the communication groove 15 opened on the upper surface of the backup body 1, and suction holes formed in the push-up shaft 23 are formed. A suction force is also generated in the nozzle hole 29 of the push-up body 27 through 28.

  When the suction force of the suction pump 42 acts on the annular grooves 14a to 14c, the upper surface of the backup body 1 becomes an adsorption surface that adsorbs and holds the lower surface of the adhesive sheet 2 to which the semiconductor chip 3 is adhered. That is, the upper surface of the backup body 1 sucks and holds the portion of the pressure-sensitive adhesive sheet 2 that is positioned around the opening 12, which is the portion of the pressure-sensitive adhesive sheet 2 that is positioned around the semiconductor chip 3 to be picked up.

  Further, when a suction force acts on the nozzle hole 29 of the push-up body 27, the inside of the concave portion 32 surrounded by the annular wall 31 becomes negative pressure, so that the push-up body 27 has the opening 12 of the backup body 1 of the adhesive sheet 2. The lower surface of the portion facing the surface is sucked and held. That is, the pressure-sensitive adhesive sheet 2 is configured such that a portion corresponding to the lower surface of the semiconductor chip 3 to be picked up and a portion positioned around the opening 12 are adsorbed and held.

  As shown in FIG. 1, a cam follower 45 is rotatably provided at a lower end portion of the push-up shaft 23 protruding from the lower end surface of the closing member 21. The cam follower 45 is in contact with the outer peripheral surface of a cam 46 that is rotationally driven in the direction of the arrow by a drive source (not shown). Therefore, if the cam 46 is driven to rotate, the push-up shaft 23 is driven in the vertical direction, and the push-up body 27 is interlocked with the movement in the vertical direction.

  When the cam follower 45 hits the bottom dead center of the cam 46 and the push-up shaft 23 is in the lowered position, the push-up body 27 is the upper end surface. The upper end surface of the annular wall 31 is higher than the suction surface on the upper surface of the backup body 1. Located slightly below.

When the cam 46 rotates and the cam follower 45 hits the top dead center and the push-up shaft 23 is in the raised position, the push-up body 27 has a predetermined dimension in which the upper end surface of the annular wall 31 is upward from the suction surface of the backup body 1. For example, it is set to protrude about 0.5 mm.
The drive control of the suction nozzle body 4 and the backup unit 10 is controlled by a control device (not shown) as described later.

Next, the operation of the pickup device having the above configuration will be described with reference to FIGS. 5 (a) to 5 (d) and FIG.
As shown in FIG. 1, when the backup body 1 is raised to a position where the upper surface thereof contacts the lower surface of the pressure-sensitive adhesive sheet 2, the pressure-sensitive adhesive sheet 2 is driven in the X and Y directions by a wafer ring (not shown) and picked up. The chip 3 is positioned above the opening 12 of the backup body 1. That is, positioning is performed so that the center of the semiconductor chip 3 coincides with the center of the opening 12.

  When the semiconductor chip 3 to be picked up is positioned, the suction nozzle body 4 is lowered as shown in FIG. 5A and picked up by the flat surface 8a at the lower end of the upper suction nozzle 8 provided at the lower end thereof. 3 is adsorbed. At this time, the suction nozzle body 4 presses the semiconductor chip 3 with a predetermined load. Further, the upper surface of the push-up body 27 is positioned slightly below the lower surface of the adhesive sheet 2.

  The upper suction nozzle 8 is lowered to suck and hold the upper surface of the semiconductor chip 3 and at the same time, the suction pump 42 is operated. As a result, the internal space of the backup body 1 is depressurized, and suction force is generated in the annular grooves 14a to 14c and the communication groove 15 on the upper surface thereof, so that the suction sheet is positioned around the semiconductor chip 3 picked up by the adhesive sheet 2 The part to be sucked is held by suction on the suction surface (upper surface) of the backup body 1.

  At this time, a suction force is also generated in the opening 12 of the backup body 1, and the semiconductor chip 3 positioned opposite to the opening 12 is sucked into the backup body 1 through the adhesive sheet 2.

  However, the semiconductor chip 3 has a rectangular shape slightly larger than the opening 12. Therefore, even if a suction force is generated in the opening 12 of the backup body 1 before the lower surface of the semiconductor chip 3 is sucked and held by the push-up body 27, the periphery of the semiconductor chip 3 facing the opening 12 is backed up. The body 1 is held in engagement with the peripheral portion of the opening 12 on the upper surface of the body 1. Therefore, the semiconductor chip 3 is prevented from being deformed by being sucked into the opening 12 together with the adhesive sheet 2 by the suction force generated in the backup body 1.

  Next, the push-up shaft 23 is raised as shown in FIG. Thereby, the lower surface of the semiconductor chip 3 to be picked up is adsorbed and held via the adhesive sheet 2 by the recess 32 of the push-up body 27 provided at the upper end of the push-up shaft 23 and applied with the suction force of the suction pump 42. That is, the upper and lower surfaces of the semiconductor chip 3 to be picked up are sandwiched between the upper suction nozzle 8 and the push-up body 27 that are each formed of an elastic material via the adhesive sheet 2.

  Note that the timing at which the lower surface of the pressure-sensitive adhesive sheet 2 is sucked and held by the push-up body 27 may be sucked and held when the semiconductor chip 3 picked up by the upper suction nozzle 8 is lifted, and the order is limited. Not.

  If the upper and lower surfaces of the semiconductor chip 3 to be picked up are held while being sandwiched between the upper suction nozzle 8 and the push-up body 27, the push-up shaft 23 is raised as shown in FIG. When the push-up shaft 23 is raised, the push-up body 27 provided at the upper end of the push-up shaft 27 stretches the adhesive sheet 2 and deforms it into a trapezoidal mountain shape as shown in FIG. Push up from the adsorption surface. At this time, the suction nozzle body 4 rises in conjunction with the rise of the push-up shaft 23.

  When the semiconductor chip 3 is pushed up and the adhesive sheet 2 is stretched in a mountain shape, the tension generated by the deformation of the adhesive sheet 2 acts on the peripheral portion of the push-up body 27. The push-up body 27 is made of a soft elastic material.

  Therefore, when the tension of the pressure-sensitive adhesive sheet 2 is applied to the peripheral portion of the push-up body 27, the peripheral portion of the push-up body 27 is elastically deformed downward by the tension. Thus, the pressure-sensitive adhesive sheet 2 starts to peel from the corner portion of the peripheral portion of the semiconductor chip 3, and the peeling proceeds toward the center portion.

  That is, the pressure-sensitive adhesive sheet 2 is smoothly and reliably peeled from the lower surface of the semiconductor chip 3 by the tension generated in the pressure-sensitive adhesive sheet 2 and the elastic deformation of the push-up body 27 due to the tension.

  When the push-up body 27 is raised by the push-up shaft 23 and the tension is generated in the pressure-sensitive adhesive sheet 2, the peripheral portion of the push-up body 27 is elastically deformed with a predetermined time delay from the generation of the tension. That is, the push-up body 27 is gently elastically deformed while pushing up the semiconductor chip 3.

  Therefore, when the semiconductor chip 3 is pushed up, the adhesive sheet 2 is not peeled off suddenly from the peripheral part of the semiconductor chip 3 but is gently peeled off. It is possible to prevent the peripheral portion from being damaged by giving an impact to the surface.

  The annular wall 31 provided on the upper surface of the push-up body 27 has a rectangular shape smaller than the semiconductor chip 3. Therefore, the pressure-sensitive adhesive sheet 2 is peeled almost uniformly over the entire length of the peripheral portion of the semiconductor chip 3.

  A support plate 35 made of an elastic material that is harder than that of the push-up body 27 is provided in the recess 32 of the push-up body 27. Therefore, the peeling of the pressure-sensitive adhesive sheet 2 ends when it reaches the periphery of the support plate 35 from the periphery of the lower surface of the semiconductor chip 3.

  That is, the elastic deformation of the push-up body 27 due to the tension of the pressure-sensitive adhesive sheet 2 occurs relatively easily in the peripheral portion of the support plate 35, but is blocked by the hardness of the support plate 35 in the portion where the support plate 35 is provided. The

  Therefore, since the central portion of the lower surface of the semiconductor chip 3 is supported by the support plate 35 without being deformed, even if the push-up body 27 is formed of a soft elastic material that is compressed and deformed by the tension of the adhesive sheet 2, the semiconductor It is possible to prevent the chip 3 from being greatly curved and damaged as a whole.

  The mounting plate 25 having the push-up body 27 attached to the upper end of the push-up shaft 23 is arranged from the lower end surface of the push-up body 27 so that the peripheral portion of the lower surface of the push-up body 27 protrudes outward from the peripheral portion of the mounting plate 25. Is also formed in a small area.

  Therefore, when the peripheral portion of the push-up body 27 receives the tension of the adhesive sheet 2, the portion of the peripheral portion of the push-up body 27 that protrudes outward from the mounting plate 25 is transferred to the mounting plate 25 as shown by 27a in FIG. Easily elastically deforms downward without being restricted.

  That is, when the push-up body 27 receives the tension of the pressure-sensitive adhesive sheet 2, the mounting plate 25 hardly prevents the peripheral portion of the push-up body 27 from being elastically deformed. The pressure-sensitive adhesive sheet 2 is peeled off from the lower surface of 3 reliably and smoothly.

  The upper surface of the push-up body 27 is formed as a low friction surface. Therefore, when the peripheral portion of the push-up body 27 is elastically deformed by the tension of the pressure-sensitive adhesive sheet 2, the pressure-sensitive adhesive sheet 2 smoothly slides with respect to the inclined surface 33 of the push-up body 27 and the upper end surface of the annular wall 31. As a result, the peripheral portion of the push-up body 27 is smoothly and reliably elastically deformed by the pressure-sensitive adhesive sheet 2, so that the pressure-sensitive adhesive sheet 2 can be smoothly peeled from the semiconductor chip 3.

  The support plate 35 has a thickness dimension equal to or less than the depth dimension of the concave portion 32 formed in the push-up body 27 and is formed in an elliptical shape, and the upper end edge of the support plate 35 is chamfered and tapered. It becomes the surface 35a.

  For this reason, when the semiconductor chip 3 is pushed up by the push-up body 27, the support plate 35 does not strongly press the lower surface of the semiconductor chip 3 with a sharp portion via the adhesive sheet 2. Even if 35 is made of an elastic material harder than the push-up body 27, the support plate 35 can prevent the semiconductor chip 3 from being damaged.

  In addition, since the semiconductor chip 3 is elastically sandwiched between the upper suction nozzle 8 formed of an elastic material and the push-up body 27, stress applied to the pushed-up semiconductor chip 3 is relieved, so that the semiconductor chip 3 is damaged. Sometimes it is difficult.

  If the semiconductor chip 3 is pushed upward from the upper surface of the backup body 1 by the push-up body 27, the upper suction nozzle 8 is raised as shown in FIG. At this time, the push-up body 27 sucks and holds a portion corresponding to the lower surface of the semiconductor chip 3 picked up by the adhesive sheet 2 by the suction force acting on the nozzle hole 29.

  Therefore, the suction force of the upper suction nozzle 8 that rises and the suction force of the push-up body 27 act as forces for peeling the adhesive sheet 2 from the semiconductor chip 3 that is picked up.

  Therefore, compared to the conventional case where the semiconductor chip 3 is simply picked up by being picked up by the upper suction nozzle 8, about twice as much force can be applied for peeling, so that the semiconductor chip 3 can be easily formed. In addition, it is possible to reliably pick up.

  That is, the upper suction nozzle 8 lifts the semiconductor chip 3 upward, and the push-up body 27 pulls the adhesive sheet 2 downward. Therefore, the portion corresponding to the support plate 35, which is the remaining portion of the adhesive sheet 2 adhered to the semiconductor chip 3, is peeled off from the semiconductor chip 3, so that the semiconductor chip 3 is attached to the upper suction nozzle 8. Is picked up from the adhesive sheet 2.

  In the above-described embodiment, the push-up shaft is moved up and down using the cam. However, other drive sources such as a cylinder may be used. Further, the planar shape of the upper suction nozzle and the push-up body is not limited to a rectangular shape, but may be a circular shape, and the point is not limited.

  Further, although the opening of the backup body has a rectangular shape slightly smaller than the semiconductor chip, it may be formed larger than the semiconductor chip, and the point is not limited.

  Also, when picking up a semiconductor chip by forming a nozzle hole in the push-up member, a communication hole in the support plate, and a suction hole in the push-up shaft, the lower surface of the part of the adhesive sheet to which the semiconductor chip is attached is sucked However, when the semiconductor chip is pushed up by the push-up member, the pressure-sensitive adhesive sheet has a tension that does not separate from the upper surface of the push-up member, and the push-up member does not move on the upper surface of the push-up body. It is not necessary to suck the adhesive sheet. That is, it is not necessary to form a nozzle hole in the push-up member, a communication hole in the support plate, and a suction hole in the push-up shaft.

1 is a schematic configuration diagram of a pickup device showing an embodiment of the present invention. The longitudinal cross-sectional view of a backup body. (A) is a perspective view of a push-up body, (b) is a longitudinal sectional view. The top view which shows the adsorption | suction surface of a backup body. (A)-(d) is explanatory drawing which showed sequentially the operation | movement when picking up a semiconductor chip. Sectional drawing which expanded and showed the state which pushed up the semiconductor chip picked up by the lower suction nozzle.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Backup body, 2 ... Adhesive sheet, 3 ... Semiconductor chip, 4 ... Adsorption nozzle body (pickup means), 8 ... Upper adsorption nozzle, 12 ... Opening part, 16a, 16b ... Suction hole, 23 ... Push-up shaft, 27 ... Push-up body, 31 ... annular groove, 32 ... recess, 33 ... inclined surface, 35 ... support plate.

Claims (8)

A semiconductor chip pickup device for picking up a semiconductor chip attached to the upper surface of an adhesive sheet,
A backup body formed on an adsorption surface that adsorbs and holds a portion corresponding to the peripheral portion of the semiconductor chip to be picked up on the lower surface of the adhesive sheet;
A push-up body that is provided in the backup body so as to be driven in the vertical direction and presses the lower surface of the portion to which the semiconductor chip to be picked up of the adhesive sheet is stuck to push up the semiconductor chip from the upper surface of the backup body;
Pickup means for picking up the semiconductor chip picked up by the push-up body from the adhesive sheet by sucking and holding the upper surface of the semiconductor chip to be picked up,
The push-up body is formed of a soft elastic material whose peripheral portion is elastically deformed downward by a tension generated in the pressure-sensitive adhesive sheet when the semiconductor chip is pushed up through the pressure-sensitive adhesive sheet. Semiconductor chip pickup device.   The upper surface of the push-up body is formed with a recess surrounded by an annular wall smaller than the outer shape of the semiconductor chip, and when the semiconductor chip is pushed up by the push-up body in the recess, 2. The pick-up device for a semiconductor chip according to claim 1, further comprising a holding plate for restricting elastic deformation of a portion other than the peripheral portion of the push-up body due to the tension of the adhesive sheet.   3. The semiconductor chip pickup device according to claim 2, wherein a thickness dimension of the holding plate is equal to or less than a depth dimension of the concave portion.   3. The pick-up device for a semiconductor chip according to claim 2, wherein the holding plate is circular or elliptical, and an upper end edge thereof is chamfered.   3. The semiconductor chip pick-up device according to claim 2, wherein an outer portion of the annular wall on the upper surface of the push-up body is formed as an inclined surface inclined downward.   5. The semiconductor chip pick-up device according to claim 4, wherein at least an upper end surface and an inclined surface of the annular wall on the upper surface of the push-up body are formed as a low friction surface.   There is a push-up shaft that is driven up and down in the axial direction, and the push-up body is attached to the upper surface of the push-up shaft, and the peripheral portion of the lower end surface of the push-up body is protruded outward. 2. The semiconductor chip pickup device according to claim 1, further comprising a board.   3. The semiconductor chip pick-up device according to claim 2, wherein the semiconductor chip has a rectangular shape, and the annular wall provided on the upper surface of the push-up body has a rectangular shape smaller than the semiconductor chip.

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